Chip buckle locking installation device

Abstract

The invention provides a chip buckle locking and attaching installation device, and relates to the technical field of mainboard machining, the chip buckle locking and attaching installation device comprises a rack, a positioning assembly, a material taking module, a mainboard conveying mechanism and a locking and attaching assembly assembly, the rack is provided with a feeding station, and the feeding station is used for arranging a material disc, a supply back plate, a pressing rod and a pressing cover. The feeding station is arranged on the rack, materials are taken from the feeding station through the material taking module and then placed into the positioning assembly to be positioned, meanwhile, the main board conveying mechanism conveys the main boards, and in the conveying process, the positioned materials are picked up through the locking and attaching assembly assembly at all positions to be assembled and fixed; and finally, the mainboard conveying mechanism sends out the mainboard with the buckle well installed, automatic buckle assembling operation is formed, meanwhile, the mainboard conveying mechanism can be connected to the whole mainboard production line to be in butt joint with follow-up packaging equipment and the like, and full-automatic production operation of the mainboard is achieved.

Description

Technical Field

[0001] This invention relates to the field of motherboard processing technology, and in particular to a chip fastener mounting device. Background Technology

[0002] The CPU mounting bracket on a computer motherboard is a crucial component, its core function being to ensure a tight, stable, and secure connection between the CPU and the motherboard socket. The CPU mounting bracket primarily consists of a metal base frame and a separate or integrated pressure lever. During assembly, after the CPU is correctly placed in the socket, the metal pressure lever is pressed down, utilizing leverage to generate significant downward force, seamlessly connecting the CPU's hundreds of pins (or contacts) to their corresponding contacts within the motherboard socket. This tight contact is the physical foundation for ensuring stable signal transmission and unimpeded data flow.

[0003] Before the motherboard leaves the factory, the corresponding fasteners need to be fixed to the motherboard. Currently, the fastener assembly of the motherboard is usually done manually or semi-automatically. Manual fastening requires manually placing the motherboard on the fixture and using a manual electric screwdriver to fasten the screws. This is labor-intensive and has limited production capacity. Semi-automatic fastening, on the other hand, involves manually feeding the material and using a regular electric screwdriver to position and fasten the screws. This has low assembly efficiency, the output cannot meet production needs, and the automation utilization rate on site is low. Summary of the Invention

[0004] In view of this, the present invention proposes a chip fastener locking and mounting device. By setting up a feeding station on the table, the chip is picked up from the feeding station by a material picking module and then placed into a positioning component for positioning. At the same time, the motherboard conveying mechanism transports the motherboard. During the transport process, the locking and assembly component picks up the positioned material at various positions for assembly and fixation. Finally, the motherboard conveying mechanism delivers the motherboard with the fastener installed, forming an automated fastener assembly operation. The motherboard conveying mechanism can also be connected to the entire motherboard production line and connected to subsequent packaging and other equipment to realize fully automated production of motherboards.

[0005] The technical solution of this invention is implemented as follows: This invention provides a chip fastener mounting device, including a stand, a positioning component, a material handling module, a motherboard conveying mechanism, and a fastening assembly component, wherein, The frame is equipped with a feeding station, which is used to set up a material tray to supply the back plate, pressure rod and pressure cover; The positioning assembly is mounted on the frame, and the positioning assembly includes a back plate positioning mechanism, a pressure rod positioning mechanism, and a pressure cover positioning mechanism; The material picking module is set on the frame and located above the loading station. The material picking module is used to pick up the material on the material tray and put it into the back plate positioning mechanism, the pressure rod positioning mechanism and the pressure cover positioning mechanism respectively. The motherboard conveying mechanism is mounted on a frame, with its two ends serving as the motherboard loading end and the motherboard unloading end, respectively. The motherboard conveying mechanism is provided with a first locking position and a second locking position. The locking assembly is mounted on a stand and located above the positioning assembly and the motherboard conveying mechanism. The locking assembly includes a first locking mechanism and a second locking mechanism. The first locking mechanism is used to pick up the back plate and the pressure bar on the positioning assembly and assemble the back plate and the pressure bar onto the motherboard at the first locking position. The second locking mechanism is used to pick up the pressure cap on the positioning assembly and assemble the pressure cap onto the motherboard at the second locking position.

[0006] Based on the above technical solutions, preferably, it also includes a material tray loading and unloading mechanism. The material tray loading and unloading mechanism is set on the loading station of the frame. The material tray loading and unloading mechanism includes a lifting frame and a pushing part. Material trays with materials are stacked on the lifting frame. The lifting frame can move vertically so that the uppermost material tray is at a fixed horizontal height. The pushing part can move in a straight line and push the uppermost empty material tray down.

[0007] More preferably, the material tray loading and unloading mechanism further includes a temporary storage rack and an empty tray lifting section, wherein, The temporary storage rack is set on the platform and located on the side of the loading station. The bottom of the temporary storage rack is open and the side is provided with an insertion port facing the loading station. The temporary storage rack is used to stack and store empty material trays. The empty tray lifting part is located at the bottom opening of the temporary storage rack and can move vertically to push the stacked empty trays upward. The pushing part pushes the empty trays from the loading station into the temporary storage rack through the insertion port. The empty tray lifting section is mounted on a platform and has a vertical movable end connected to a support plate to push it to move vertically.

[0008] Based on the above technical solutions, preferably, the material handling module includes a first three-axis module, a rotary seat, a capping suction head, a first gripper, and a back plate suction head, wherein... The first three-axis module is mounted on the test bench, and the first three-axis module includes a moving end; The rotating base is mounted on the moving end and can rotate on a horizontal plane; The capping suction head is mounted on the moving end and can move vertically relative to the moving end. The capping suction head is used to pick up caps from the loading station and place them into the cap positioning mechanism. The first gripper is mounted on the moving end and can move vertically relative to the moving end. The first gripper is used to grip the pressure bar from the loading station and place it into the pressure bar positioning mechanism. The backplate suction head is located on the moving end and is used to pick up the backplate from the loading station and place it into the backplate positioning mechanism.

[0009] Based on the above technical solutions, preferably, the backplate positioning mechanism includes a transfer guide rail, a connecting frame, a push cylinder, and a positioning seat, wherein... The transfer guide rail is mounted on the platform, with one end extending to the bottom of the mainboard conveying mechanism; The connecting frame is slidably mounted on the transfer guide rail; The push cylinder is mounted on the connecting frame; The positioning seat is movably mounted on the connecting frame and is drivenly connected to the output end of the push cylinder. The positioning seat is used to position the back plate, and after it moves to the motherboard conveying mechanism, the push cylinder pushes the back plate to fit against the bottom of the motherboard.

[0010] Based on the above technical solutions, preferably, the first locking mechanism includes a second three-axis module, a camera assembly, a second gripper, a first beak, and a first electric screwdriver. The second three-axis module is mounted on a stand, and the camera assembly, the second gripper, the first beak, and the first electric screwdriver are all mounted on the second three-axis module. The second gripper is used to pick up the pressure bar from the pressure bar positioning mechanism and place it on the motherboard. The camera assembly is used to photograph the motherboard. The output end of the first electric screwdriver extends into the first beak, and the first beak is used to pick up the screw and limit its movement.

[0011] Based on the above technical solutions, preferably, the second locking mechanism includes a third three-axis module, a feeding suction head, a second beak, and a second electric screwdriver. The third three-axis module is mounted on a frame, and the feeding suction head, the second beak, and the second electric screwdriver are all mounted on the third three-axis module. The feeding suction head is used to pick up the cap from the cap positioning mechanism and place it on the main board. The output end of the second electric screwdriver extends into the second beak, and the second beak is used to pick up the screw and limit its movement.

[0012] Based on the above technical solutions, preferably, the motherboard conveying mechanism includes a fixed rail, an adjusting rail, a blocking part, a drive cylinder, and a support base, wherein, The fixed rail is fixedly mounted on the platform; The adjusting rail is set on the platform and is parallel to the fixed rail. The adjusting rail can be slid on the platform to change the distance between the adjusting rail and the fixed rail. There are two blocking parts, which are respectively located on the first locking position and the second locking position; The number of driving cylinders is the same as that of the blocking parts, and they correspond one-to-one. The driving cylinders are connected to the blocking parts in a transmission manner to push the blocking parts to obstruct the flow of the motherboard and to position the motherboard. The support base is located between the fixed rail and the adjusting rail, and is situated on the second locking position. It serves to support the main board at the second locking position and abut against the backplate on the main board.

[0013] Based on the above technical solutions, preferably, it also includes an NG transport component and an NG cache component, wherein... The NG handling assembly is mounted on a frame and has a barcode scanning section and an NG material handling section. The barcode scanning section is used to scan the motherboard, and the NG material handling section is used to handle the motherboard. The NG cache component is mounted on a stand, and the motherboard conveying mechanism is also equipped with a barcode scanning position. The NG transport component is used to send the defective products on the barcode scanning position into the NG cache component.

[0014] More preferably, the NG cache component includes a lifting module, a cache rack, and a width adjustment mechanism, wherein, The lifting module is mounted on a platform and has a lifting end. The buffer rack is installed on the lifting end of the lifting module, and the buffer rack is provided with vertically stacked buffer positions; The width adjustment mechanism is installed on the lifting end of the lifting module and is connected to the buffer frame via a transmission. The width adjustment mechanism is used to adjust the width of the buffer position.

[0015] The chip fastener mounting device of the present invention has the following advantages over the prior art: (1) By setting up a loading station on the bench and picking up materials from the loading station through the picking module, and then placing them into the positioning component to achieve positioning, the main board conveying mechanism will transport the main board. During the transport process, the locking assembly component will pick up the positioned materials at each position for assembly and fixation. Finally, the main board conveying mechanism will send out the main board with the fastener installed, forming an automated fastener assembly operation. At the same time, the main board conveying mechanism can be connected to the entire main board production line and connected to subsequent packaging and other equipment to achieve fully automated production operation of the main board. (2) The material tray loading and unloading mechanism can be set up with several stacked material trays on the lifting frame. Each material tray can load multiple sets of materials, thereby realizing the storage and preparation of materials. Correspondingly, when the materials in the uppermost material tray are used up, the pushing part can push the empty material tray laterally to be unloaded from the uppermost layer. Correspondingly, the lifting frame rises a corresponding distance to ensure that the uppermost material tray is always in a fixed horizontal position, which makes it easier for the material picking module to pick up materials, so that the material picking time is consistent and the stability is better. (3) The material picking module integrates the rotating seat, the capping suction head, the first gripper and the back plate suction head on the moving end of the first three-axis module to pick up a group of materials at once and place the group of materials on the positioning component. This can effectively improve mechanical efficiency, eliminate the need to use separate modules for picking, facilitate space layout and reduce equipment costs. (4) The back panel positioning mechanism can directly send the back panel to the bottom of the conveying mechanism through the transfer guide rail, and push it up through the push cylinder to directly contact the bottom of the main board and support the main board at the first locking position, so that the first locking position mechanism can perform stable screw locking action. At the same time, there is no need for a separate mechanism to perform back panel conveying and alignment, which further reduces the complexity of the equipment and the operating efficiency of the equipment. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a perspective view of the chip fastener mounting device of the present invention; Figure 2 This is a perspective view of the positioning component of the chip fastener locking and mounting device of the present invention; Figure 3 This is a perspective view of the chip fastener mounting device material handling assembly of the present invention; Figure 4 for Figure 3 Enlarged schematic diagram of the structure at point A in the middle; Figure 5 This is a perspective view of the motherboard conveying mechanism of the chip fastener mounting device of the present invention; Figure 6 This is a perspective view of the first locking mechanism of the chip fastener locking and mounting device of the present invention; Figure 7 for Figure 6 Enlarged schematic diagram of the structure at point B; Figure 8 This is a perspective view of the second locking mechanism of the chip fastener locking and mounting device of the present invention; Figure 9 This is a perspective view of the chip fastener locking and mounting device tray loading and unloading mechanism of the present invention; Figure 10 This is a perspective view of the NG transport assembly of the chip fastener locking and mounting device of the present invention; Figure 11 This is a perspective view of the NG buffer component of the chip fastener locking and mounting device of the present invention. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0019] In the description of the embodiments of the present invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present invention based on the specific circumstances.

[0020] In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of the present invention.

[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0022] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0023] The following disclosure provides numerous different embodiments or examples for implementing various structures of the invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the invention. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention; however, those skilled in the art will recognize the applicability of other processes and / or the use of other materials.

[0024] like Figure 1-8 As shown, the chip fastener mounting device of the present invention includes a stand 1, a positioning component 2, a material picking module 3, a motherboard conveying mechanism 4, and a fastening assembly component 5.

[0025] The frame 1 is equipped with a loading station, which is used to set up a material tray and supply back plate, pressure bar and pressure cover. In some embodiments, the frame 1 includes a lower frame and an upper cover. The lower frame adopts a square tube base frame and a sheet metal upper cover. The whole is painted. The upper cover has an observation window and a maintenance door. The loading part is equipped with loading and unloading buttons, and there are operation interfaces at the front and back, which facilitate loading and unloading, maintenance and repair.

[0026] In addition, the platform 1 is divided into a loading area and an assembly area.

[0027] like Figure 2 As shown, the positioning component 2 is set on the platform 1. The positioning component 2 includes a back plate positioning mechanism 21, a pressure rod positioning mechanism 22, and a pressure cover positioning mechanism 23. It should be noted that during the feeding process, the material tray has several material slots arranged in an array. Each material slot has a double-layer structure, with a back plate placed on the upper layer and a pressure cover placed on the lower layer. A side slot is also set on the outside of the material slot, and an L-shaped pressure rod is placed in the side slot. The back plate positioning mechanism 21, the pressure rod positioning mechanism 22, and the pressure cover positioning mechanism 23 are separately set in the feeding area of ​​the platform 1.

[0028] Specifically, in addition to the positioning component 2, the feeding area is also equipped with a material picking module 3, and the assembly area is equipped with a main board conveying mechanism 4 and a locking assembly component 5. This arrangement can avoid the overlap of the moving path between the locking assembly component 5 and the material picking module 3. Correspondingly, in order to enable the material on the positioning component 2 to be moved into the assembly area, the positioning mechanism 21, the pressure rod positioning mechanism 22 and the pressure cover positioning mechanism 23 can all be made movable, so that they can move back and forth between the feeding area and the assembly area, thereby realizing material supply.

[0029] like Figure 3-4As shown, the material picking module 3 is set on the frame 1 and located above the loading station. The material picking module 3 is used to pick up the material on the tray and place it into the back plate positioning mechanism 21, the pressure rod positioning mechanism 22 and the pressure cover positioning mechanism 23 respectively. The material picking module 3 moves back and forth between the loading station and the positioning component 2 to continuously send the back plate, pressure rod and pressure cover to the positioning component 2 to perform material supply operation. It should be noted that the material is positioned once when it is in the tray. Therefore, the material picking module 3 only needs to pick up the material at an approximate position. However, due to the large error in the tray, the positioning component 2 is set to perform secondary positioning of the material, thereby performing precise positioning of each component. This allows the subsequent locking assembly component 5 to accurately pick up the material and assemble it onto the main board.

[0030] like Figure 5 As shown, the motherboard conveying mechanism 4 is set on the frame 1, and its two ends serve as the motherboard loading end and the motherboard unloading end, respectively. The motherboard conveying mechanism 4 is provided with a first locking position and a second locking position. The motherboard conveying mechanism 4 runs through the entire frame 1, and both ends can be connected to external conveying lines, thereby connecting to the motherboard production line to achieve fully automated operation of motherboard production.

[0031] like Figure 6-8 As shown, the locking assembly 5 is mounted on the stand 1 and located above the positioning assembly 2 and the main board conveying mechanism 4. The locking assembly 5 includes a first locking mechanism 51 and a second locking mechanism 52. The first locking mechanism 51 is used to pick up the back plate and the pressure bar on the positioning assembly 2 and assemble the back plate and the pressure bar onto the main board at the first locking position. The second locking mechanism 52 is used to pick up the pressure cap on the positioning assembly 2 and assemble the pressure cap onto the main board at the second locking position.

[0032] In some embodiments, a tray loading and unloading mechanism 6 is also provided. The tray loading and unloading mechanism 6 is set on the loading station of the frame 1. The tray loading and unloading mechanism 6 includes a lifting frame 61 and a pushing part 62. Trays with materials are stacked on the lifting frame 61. The lifting frame 61 can move vertically so that the uppermost tray is at a fixed horizontal height. The pushing part 62 can move in a straight line and push the uppermost empty tray down.

[0033] The material tray loading and unloading mechanism 6 can be configured by setting several stacked material trays on the lifting frame 61, with each material tray loading multiple sets of materials, thereby realizing the storage and preparation of materials. Correspondingly, when the materials in the uppermost material tray are used up, the pushing unit 62 can push the empty material tray laterally to be unloaded from the uppermost layer. Correspondingly, the lifting frame 61 rises a corresponding distance, so that the uppermost material tray is always in a fixed horizontal position, which makes it easier for the material picking module 3 to pick up materials, making the material picking time consistent and the stability better.

[0034] In addition, the material tray loading and unloading mechanism 6 also includes a linear module. The output end of the linear module is connected to the lifting frame 61, thereby continuously pushing it upward. After the stacked material trays are used up, the linear module can drive the lifting frame 61 to move downward and stack the stacked material trays back onto the lifting frame 61. The pushing part 62 can be directly driven by a reciprocating cylinder, linear module, etc.

[0035] In some specific embodiments, the linear module is equipped with springs to balance the weight on the lifting frame 61, and a laser sensor is used to detect whether the bottom tray exists. If it does not exist, the tray can be re-stacked for operation.

[0036] like Figure 9 As shown, in order to temporarily store empty material trays, the material tray loading and unloading mechanism 6 also includes a temporary storage rack 63 and an empty tray lifting part 64. The temporary storage rack 63 is set on the frame 1 and located on the side of the loading station. The temporary storage rack 63 has an opening at the bottom and an insertion port on the side facing the loading station. The temporary storage rack 63 is used to stack and store empty material trays. The empty tray lifting part 65 is set at the bottom opening of the temporary storage rack 63 and can move vertically to push the stacked empty material trays upward. The pushing part 62 pushes the empty material tray from the loading station into the temporary storage rack through the insertion port.

[0037] The empty tray lifting unit 64 consists of a cylinder and a top plate. When it is necessary to unload the empty tray on the lifting frame 61, the pushing unit 62 pushes the tray into the insertion port. Before it enters, the lifting unit 64 pushes the tray on the temporary storage rack 63 upward. Once the tray needs to be inserted, it can enter the bottom layer. At this time, the lifting unit 64 resets downward, and the pushing unit 62 can completely push the empty tray into the temporary storage rack 63.

[0038] In addition, to prevent the material tray from shifting, an alignment component is provided on the material tray loading and unloading mechanism 6. This component includes a limit frame and two mating cylinders on both sides. The mating cylinders on both sides are used to push the upper left material tray to fit tightly against the limit frame to prevent it from shifting and causing the material picking module 3 to fail to pick up the material.

[0039] In some embodiments, the material handling module 3 includes a first three-axis module 31, a rotating seat 32, a capping suction head 33, a first gripper 34, and a back plate suction head 35. The first three-axis module 31 is mounted on the frame 1 and includes a moving end. The rotating seat 32 is mounted on the moving end and can rotate on a horizontal plane. The capping suction head 33 is mounted on the moving end and can move vertically relative to the moving end. The capping suction head 33 is used to pick up caps from the loading station and place them into the cap positioning mechanism 23. The first gripper 34 is mounted on the moving end and can move vertically relative to the moving end. The first gripper 34 is used to pick up pressure rods from the loading station and place them into the pressure rod positioning mechanism 22. The back plate suction head 35 is mounted on the moving end and is used to pick up back plates from the loading station and place them into the back plate positioning mechanism 21.

[0040] The material handling module 3 integrates the rotating seat 32, the capping suction head 33, the first gripper 34 and the back plate suction head 35 on the moving end of the first three-axis module 31, so as to grasp a group of materials at one time and place the group of materials on the positioning component 2. This can effectively improve mechanical efficiency, eliminate the need to use separate modules for grasping, facilitate space layout, and reduce equipment costs.

[0041] Specifically, the moving end of the first three-axis module 31 can only move in the loading area. The set rotating seat 32 can drive the picked-up back plate and pressure bar to rotate, adjust their orientation, align them with the positioning component 2 and match the subsequent assembly position. The reason for this is that in order to maximize the placement of multiple sets of materials, the material tray arranges the back plate and pressure bar in a rotating manner in the partitioning plan.

[0042] Since the material picking component 3 can only pick up materials through coarse positioning, both the cover and the back plate are picked up by negative pressure suction, while the pressure bar is gripped by the first gripper 34. It should be noted that the back plate suction head 35 and the first gripper 34 are each controlled by a separate cylinder for lifting and lowering, so that they do not interfere with each other when picking up and putting down materials, and the material picking component 3 can pick up a group of materials at one time.

[0043] In some embodiments, the backplate positioning mechanism 21 includes a transfer guide rail 211, a connecting frame 212, a push cylinder 213, and a positioning seat 214. The transfer guide rail 211 is mounted on the frame 1 and one end extends to the bottom of the motherboard conveying mechanism 4. The connecting frame 212 is slidably mounted on the transfer guide rail 211. The push cylinder 213 is mounted on the connecting frame 212. The positioning seat 214 is movably mounted on the connecting frame 212 and is connected to the output end of the push cylinder 213. The positioning seat 214 is used to position the backplate, and after it moves to the motherboard conveying mechanism 4, the push cylinder 213 pushes the backplate to fit against the bottom of the motherboard.

[0044] The backplate positioning mechanism 21 can directly send the backplate to the bottom of the conveying mechanism 4 via the transfer guide rail 211, and push it upwards via the push cylinder 213 to directly contact the bottom of the main board and provide support for the main board at the first locking position. This allows the first locking position mechanism 51 to perform stable screw-locking actions. At the same time, there is no need for a separate mechanism for backplate conveying and alignment, which further reduces the complexity of the equipment and improves its operating efficiency.

[0045] In addition, the movement of the connecting frame 212 can be achieved by a motor driving a lead screw to move the connecting frame 212 in a reciprocating linear motion. Furthermore, a positioning pin can be installed in the positioning seat 214 to further improve the matching accuracy between the back plate and the main board.

[0046] The pressure bar positioning mechanism 22 is mounted on a reciprocating cylinder. It only needs to move a short distance from the loading area to the assembly area. The pressure cap positioning mechanism 22 is equipped with two positioning cylinders that squeeze the iron parts on the pressure bar from two directions to make them reach the required position. The bent part of the pressure bar is lifted upward at an angle by a small stand to avoid interfering with the picking process.

[0047] Correspondingly, the cap positioning mechanism 23 and the pressure rod positioning mechanism 22 have similar structures and are both set on the reciprocating cylinder. The difference is that the hinged flip-top part of the cap is provided with a bracket for tilt support. It should be noted that laser sensors are set on both the cap positioning mechanism 23 and the pressure rod positioning mechanism 22 for positioning detection.

[0048] In some embodiments, four screws are required to fix the back plate, the cover, and the pressure rod. Two screws are installed at the first locking position to connect the back plate, the main board, and the pressure rod, and two screws are installed at the second locking position to connect the back plate, the main board, and the cover.

[0049] To achieve the connection between the backplate, mainboard, and pressure bar at the first locking position, the first locking mechanism 51 includes a second three-axis module 511, a camera assembly 512, a second gripper 513, a first beak 514, and a first electric screwdriver 515. The second three-axis module 511 is mounted on the stand 1, and the camera assembly 512, the second gripper 513, the first beak 514, and the first electric screwdriver 515 are all mounted on the second three-axis module 511. The second gripper 513 is used to pick up the pressure bar from the pressure bar positioning mechanism 22 and place it on the mainboard. The camera assembly 512 is used to photograph the mainboard. The output end of the first electric screwdriver 515 extends into the first beak 514, and the first beak 514 is used to pick up screws and limit their movement.

[0050] The camera assembly 512 includes a CCD camera, which is used to photograph the motherboard and determine the mounting position on the motherboard using a vision system. In this embodiment, a vibratory feeder module is provided for feeding screws. The screws are fed into the first beak 514 by pneumatic or other means, and then contacted by the vertical movement of the first electric screwdriver 515, which twists the screws to fix them to the motherboard.

[0051] Correspondingly, the second locking mechanism 52 includes a third three-axis module 521, a feeding head 522, a second beak 523, and a second electric screwdriver 524. The third three-axis module 521 is mounted on the frame 1, and the feeding head 522, the second beak 523, and the second electric screwdriver 524 are all mounted on the third three-axis module 521. The feeding head 522 is used to pick up the cap from the cap positioning mechanism 23 and place it on the main board. The output end of the second electric screwdriver 524 extends into the second beak 523, and the second beak 523 is used to pick up the screw and limit its movement.

[0052] The difference between the second locking mechanism 52 and the first locking mechanism 51 is that the second locking mechanism 52 does not require a camera assembly 512. It can directly use the image data collected by the first locking mechanism 51 to deduce the locking position on the motherboard and locate it. In addition, the second locking mechanism 52 is used to fix the pressure cap, so it can directly use vacuum adsorption to pick up the material. Furthermore, in the assembly area, the first locking mechanism 51 and the second locking mechanism 52 are located on the left and right sides respectively, and the corresponding pressure rod positioning mechanism 22 and pressure cap positioning mechanism 23 are located outside the first locking mechanism 51 and the second locking mechanism 52 respectively, to facilitate the picking action.

[0053] In some embodiments, the motherboard conveying mechanism 4 includes a fixed rail 41, an adjusting rail 42, a blocking part 43, a driving cylinder 44, and a support base 45. The fixed rail 41 is fixedly mounted on the frame 1, and the adjusting rail 42 is mounted on the frame 1 and parallel to the fixed rail 41. The adjusting rail 42 can slide on the frame 1 to change the distance between the fixed rail 41 and the adjusting rail 42. There are two blocking parts 43, which are respectively mounted on the first locking position and the second locking position. The number of driving cylinders 44 is the same as the number of blocking parts 43, and they correspond one-to-one. The driving cylinders 44 are connected to the blocking parts 43 to push the blocking parts 43 to obstruct the flow of the motherboard and to position the motherboard. The support base 45 is mounted between the fixed rail 41 and the adjusting rail 42 and is located on the second locking position. It is used to support the motherboard at the second locking position and to abut against the back plate on the motherboard.

[0054] like Figure 10-11As shown, in some embodiments, an NG transport component 7 and an NG buffer component 8 are also provided. The NG transport component 7 is mounted on the stand 1 and has a barcode scanning unit 71 and an NG material picking unit 72. The barcode scanning unit 71 is used to scan the motherboard, and the NG material picking unit 72 is used to transport the motherboard. The NG buffer component 8 is mounted on the stand 1, and the motherboard conveying mechanism 4 is also provided with a barcode scanning position. The NG transport component 7 is used to send the defective products on the barcode scanning position into the NG buffer component 8.

[0055] Since a barcode scanning position is set up, a blocking part 43 needs to be added to the barcode scanning position. When the motherboard barcode scanning is abnormal or the locking is abnormal, it needs to be sent to the NG cache component 8 through the NG transport component 7.

[0056] In addition, the NG material handling unit 72 consists of a motherboard gripping mechanism and a linear module, and the barcode scanning unit 71 consists of a barcode scanner and a flip-top assembly. The barcode scanner, flip-top assembly, and motherboard gripping mechanism are all mounted on the linear module. During operation, the cover is opened by the flip-top assembly to allow the barcode scanner to perform barcode scanning. If there is an abnormality, the motherboard is transferred to the NG buffer assembly 8 by the motherboard gripping mechanism through negative pressure.

[0057] In some embodiments, the NG buffer assembly 8 includes a lifting module 81, a buffer rack 82, and a width adjustment mechanism 83. The lifting module 81 is mounted on the platform 1 and has a lifting end. The buffer rack 82 is mounted on the lifting end of the lifting module 81 and has vertically stacked buffer positions. The width adjustment mechanism 83 is mounted on the lifting end of the lifting module 81 and is connected to the buffer rack 82 in a transmission manner. The width adjustment mechanism 83 is used to adjust the width of the buffer positions.

[0058] The cache rack 82 contains two independent uprights, and each upright has multiple vertically arranged shelves on opposite sides. Each pair of shelves on the same horizontal plane can store a faulty motherboard.

[0059] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A chip fastener locking and mounting device, characterized in that: It includes a frame (1), a positioning component (2), a material handling module (3), a main board conveying mechanism (4), and a locking assembly component (5), wherein, The frame (1) is provided with a feeding station, which is used to set up a material tray and supply back plate, pressure bar and pressure cover; The positioning component (2) is mounted on the stand (1). The positioning component (2) includes a back plate positioning mechanism (21), a pressure rod positioning mechanism (22), and a pressure cover positioning mechanism (23). The material picking module (3) is set on the frame (1) and located above the loading station. The material picking module (3) is used to pick up the material on the material tray and put it into the back plate positioning mechanism (21), the pressure rod positioning mechanism (22) and the pressure cover positioning mechanism (23). The motherboard conveying mechanism (4) is set on the frame (1), and its two ends are respectively the motherboard loading end and the motherboard unloading end. The motherboard conveying mechanism (4) is provided with a first locking position and a second locking position. The locking assembly assembly (5) is set on the stand (1) and located above the positioning assembly (2) and the main board conveying mechanism (4). The locking assembly assembly (5) includes a first locking mechanism (51) and a second locking mechanism (52). The first locking mechanism (51) is used to pick up the back plate and the pressure bar on the positioning assembly (2) and assemble the back plate and the pressure bar onto the main board at the first locking position. The second locking mechanism (52) is used to pick up the pressure cap on the positioning assembly (2) and assemble the pressure cap onto the main board at the second locking position.

2. The chip fastener locking and mounting device as described in claim 1, characterized in that: It also includes a material tray loading and unloading mechanism (6), which is set on the loading station of the frame (1). The material tray loading and unloading mechanism (6) includes a lifting frame (61) and a pushing part (62). Material trays with materials are stacked on the lifting frame (61). The lifting frame (61) can move vertically so that the uppermost material tray is at a fixed horizontal height. The pushing part (62) can move in a straight line and push down the uppermost empty material tray.

3. The chip fastener locking and mounting device as described in claim 2, characterized in that: The material tray loading and unloading mechanism (6) also includes a temporary storage rack (63) and an empty tray lifting part (64), wherein, The temporary storage rack (63) is set on the frame (1) and located on the side of the loading station. The temporary storage rack (63) has an opening at the bottom and an insertion port facing the loading station on the side. The temporary storage rack (63) is used to stack empty material trays. The empty tray lifting part (64) is located at the bottom opening of the temporary storage rack (63) and can move vertically to push the stacked empty trays upward. The pushing part (62) pushes the empty trays from the loading station into the temporary storage rack (63) through the insertion port.

4. The chip fastener locking and mounting device as described in claim 1, characterized in that: The material handling module (3) includes a first three-axis module (31), a rotating seat (32), a capping suction head (33), a first gripper (34), and a back plate suction head (35), wherein, The first three-axis module (31) is mounted on the stand (1), and the first three-axis module (31) includes a moving end; The rotating seat (32) is mounted on the moving end and can rotate on the horizontal plane; The capping suction head (33) is set on the moving end and can move vertically relative to the moving end. The capping suction head (33) is used to pick up the caps from the loading station and put them into the cap positioning mechanism (23). The first gripper (34) is set on the moving end and can move vertically relative to the moving end. The first gripper (34) is used to grip the pressure bar from the loading station and put it into the pressure bar positioning mechanism (22). The backplate suction head (35) is set on the moving end and is used to pick up the backplate from the loading station and put it into the backplate positioning mechanism (21).

5. The chip fastener locking and mounting device as described in claim 1, characterized in that: The backplate positioning mechanism (21) includes a transfer guide rail (211), a connecting frame (212), a push cylinder (213), and a positioning seat (214), wherein, The transfer guide (211) is mounted on the stand (1) and one end extends to the bottom of the main board conveying mechanism (4); The connecting frame (212) is slidably mounted on the transfer guide rail (211); The push cylinder (213) is mounted on the connecting frame (212); The positioning seat (214) is movably mounted on the connecting frame (212) and is connected to the output end of the push cylinder (213). The positioning seat (214) is used to position the back plate, and after it moves to the main board conveying mechanism (4), the push cylinder (213) pushes the back plate to fit against the bottom of the main board.

6. The chip fastener locking and mounting device as described in claim 1, characterized in that: The first locking mechanism (51) includes a second three-axis module (511), a camera assembly (512), a second gripper (513), a first beak (514), and a first electric screwdriver (515). The second three-axis module (511) is mounted on a stand (1), and the camera assembly (512), the second gripper (513), the first beak (514), and the first electric screwdriver (515) are all mounted on the second three-axis module (511). The second gripper (513) is used to pick up the pressure bar from the pressure bar positioning mechanism (22) and place it on the motherboard. The camera assembly (512) is used to photograph the motherboard. The output end of the first electric screwdriver (515) extends into the first beak (514), and the first beak (514) is used to pick up the screw and limit its position.

7. The chip fastener locking and mounting device as described in claim 1, characterized in that: The second locking mechanism (52) includes a third three-axis module (521), a feeding head (522), a second beak (523), and a second electric screwdriver (524). The third three-axis module (521) is mounted on the frame (1), and the feeding head (522), the second beak (523), and the second electric screwdriver (524) are all mounted on the third three-axis module (521). The feeding head (522) is used to pick up the cap from the cap positioning mechanism (23) and place it on the main board. The output end of the second electric screwdriver (524) extends into the second beak (523). The second beak (523) is used to pick up the screw and limit its movement.

8. The chip fastener mounting device as described in claim 1, characterized in that: The motherboard conveying mechanism (4) includes a fixed rail (41), an adjusting rail (42), a blocking part (43), a drive cylinder (44), and a support base (45), wherein, The fixed rail (41) is fixedly mounted on the platform (1); The adjustment rail (42) is set on the platform (1) and parallel to the fixed rail (41). The adjustment rail (42) can be slid on the platform (1) to change the distance between the adjustment rail (42); There are two blocking parts (43), which are respectively provided on the first locking position and the second locking position; The number of drive cylinders (44) is the same as that of the blocking parts (43), and they correspond one-to-one. The drive cylinders (44) are connected to the blocking parts (43) in a transmission manner to push the blocking parts (43) to obstruct the flow of the main board and position the main board. The support base (45) is located between the fixed rail (41) and the adjusting rail (42) and is located on the second locking position. It is used to support the main board of the second locking position and abut against the back plate on the main board.

9. The chip fastener locking and mounting device as described in claim 1, characterized in that: It also includes the NG transport component (7) and the NG cache component (8), wherein, The NG handling assembly (7) is mounted on the stand (1) and has a barcode scanning unit (71) and an NG material handling unit (72). The barcode scanning unit (71) is used to scan the motherboard, and the NG material handling unit (72) is used to handle the motherboard. The NG cache component (8) is set on the stand (1), and the motherboard conveying mechanism (4) is also provided with a barcode scanning position. The NG transport component (7) is used to send the defective products on the barcode scanning position into the NG cache component (8).

10. The chip fastener locking and mounting device as described in claim 9, characterized in that: The NG cache component (8) includes a lifting module (81), a cache rack (82), and a width adjustment mechanism (83), wherein, The lifting module (81) is mounted on the platform (1), and the lifting module (81) has a lifting end; The buffer rack (82) is set on the lifting end of the lifting module (81), and the buffer rack (82) is provided with vertically stacked buffer positions; The width adjustment mechanism (83) is set on the lifting end of the lifting module (81) and is connected to the buffer frame (82) via transmission. The width adjustment mechanism (83) is used to adjust the width of the buffer position.

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