Intelligent management equipment for high-precision wear-resistant wafer cutting dicing blade

Abstract

The invention discloses intelligent management equipment for a high-precision wear-resistant wafer cutting dicing blade. The intelligent management equipment comprises a cabinet body, a transfer device, a feeding assembly, a discharging assembly and a material frame. The transfer device is arranged in the center of the interior of the cabinet body and can rotate forwards and backwards; the feeding assembly is movably arranged on the first side of the cabinet body in a drawable mode. The discharging assembly is arranged on the second side, adjacent to the feeding assembly, of the cabinet body. The material frames are arranged on the other side, opposite to the feeding and discharging assembly, in the cabinet body and arranged in a circumferential array mode. Through optimized space layout and automatic control, high-density storage, rapid and accurate access, whole-process information tracing and unqualified product zoning management of precise materials such as scribing knives are achieved, and the warehouse management efficiency and reliability are effectively improved.

Description

Technical Field

[0001] This invention relates to the field of intelligent warehousing technology, and more specifically to an intelligent warehousing system for precision tool management, particularly suitable for storing and automating the access to dicing blades. Background Technology

[0002] Dividing blades, as high-precision, high-value consumable tools, are widely used in industries such as semiconductors and optics. Their storage and management require dustproofing, impact resistance, accurate traceability, and efficient circulation. Traditional manual management or simple container storage methods have the following drawbacks: low retrieval efficiency, easy damage or contamination of blades due to human error; untimely inventory updates, easily leading to inventory backlog or shortages; and lack of effective material traceability, which is detrimental to quality management and production process control.

[0003] Therefore, it is necessary to provide a new technical solution. Summary of the Invention

[0004] The present invention aims to address the shortcomings of the prior art and provide a high-precision, wear-resistant wafer dicing blade intelligent management device with a compact spatial layout, high access efficiency, and full traceability capability.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A high-precision, wear-resistant wafer dicing blade intelligent management device, characterized in that it includes a cabinet;

[0007] A transfer device is located in the center of the cabinet and is configured to rotate in both forward and reverse directions.

[0008] The feeding assembly is movably mounted on the first side of the cabinet in a pull-out manner;

[0009] A discharge assembly, located on the second side of the cabinet adjacent to the feed assembly; and

[0010] The material rack is located inside the cabinet on the other side opposite to the feeding assembly and the discharging assembly, and is arranged in a circular array.

[0011] Furthermore, multiple feeding assemblies are provided and arranged vertically along the first side of the cabinet.

[0012] The feeding assembly includes a feeding port, a first fixed frame, and a movable frame.

[0013] The first end of the first fixing frame is fixed to the lower inner side of the feed inlet. The first fixing frame includes a first base plate and first side plates respectively disposed on both sides of the first base plate.

[0014] The movable frame includes a second base plate, second side plates disposed on both sides of the second base plate, and a first baffle disposed at a first end of the second base plate. The first baffle is provided with a pull handle. The movable frame extends into the first fixed frame through the feed port. The second side plates and the first side plates are slidably connected by guide rails or guide grooves.

[0015] A second baffle extending outward is provided at the upper and lower ends of the inner side of the feed inlet. After the first baffle enters from the outside of the feed inlet, it is blocked by the second baffle to restrict its further inward movement.

[0016] Furthermore, the second base plate is provided with a first base, the end of the first base near the transfer device is set with an arc-shaped surface, and multiple material troughs matching the shape of the material are arranged on the first base in the same arc direction.

[0017] The material trough is provided with a fork slot below it that matches the fork on the transfer device, and the fork slot extends from the arc surface to a position beyond the material trough;

[0018] At the other end of the material trough relative to the arc-shaped surface, a first groove is provided extending along the direction of the fork groove. The first groove is an arc-shaped groove with a depth greater than the material trough and communicating with the fork groove. The width of the first groove is adapted to the width of one to two fingers, which facilitates manual placement of materials.

[0019] At the bottom of the first base plate, a laser sensor is installed for each material trough to detect whether there is material in the corresponding material trough;

[0020] Both the first base plate located above the laser sensor and the fork groove are provided with through holes to allow the detection beam of the laser sensor to pass through.

[0021] Furthermore, the feeding assembly also includes an electromagnetic attraction structure, which includes a start button, a stop button, a first magnet, and a second magnet.

[0022] The first fixed frame is provided with a third baffle at its second end opposite to the first end, which is fixedly connected to the first base plate, and the first magnet is fixed to the third baffle.

[0023] The second magnet is fixed to the edge of the second base plate, and its position corresponds to that of the first magnet, so as to achieve contact or proximity;

[0024] The start button and the stop button are located on the outside of the cabinet below the feed inlet and are electrically connected to the first magnet. The start button is configured to control the first magnet to be energized to generate magnetic force, thereby attracting the second magnet. The stop button is configured to control the first magnet to be de-energized and demagnetized, thereby allowing the first magnet and the second magnet to separate.

[0025] Furthermore, it also includes an NG component, which is removably disposed directly below the feeding component in a pull-out manner, and the NG component includes an NG container for storing non-conforming materials.

[0026] Furthermore, the discharge assembly includes a discharge port, a second fixed frame, and a first barcode scanner.

[0027] A grating is provided at the discharge port.

[0028] The second fixed frame is located below the inner side of the discharge port. The second fixed frame is provided with multiple discharge stations. A first barcode scanner is provided above each discharge station. The first barcode scanner is used to scan the barcode attached to the material to be discharged.

[0029] Furthermore, it also includes a material changing component, which is located below the discharge component.

[0030] The material changing assembly includes a material changing inlet, a second barcode scanner, a material changing pipe, and a material changing box.

[0031] The second barcode scanner is located above the material replacement inlet and is used to scan the barcode on the material to be replaced.

[0032] The material changing box is located inside the cabinet and below the material changing inlet.

[0033] The upper end of the material changing pipe is connected to the material changing inlet, and the lower end extends to the top of the material changing box.

[0034] When changing materials, the material to be replaced is first scanned at the second barcode scanner, and then falls into the material replacement box through the material replacement inlet and the material replacement pipe; then, the new material is transported to the discharge component by the transfer device, and finally taken out from the discharge port.

[0035] Furthermore, the transfer device is configured to have no displacement in the horizontal direction and can only rotate in the horizontal plane; the fork provided on the transfer device can perform lifting and extending actions to complete the picking and placing of materials.

[0036] Furthermore, the material rack, the material trough disposed on the feeding assembly, and the discharge station disposed on the discharge assembly are located on the same circumference and are all distributed with the transfer device as the center.

[0037] The present invention has the following beneficial effects:

[0038] 1. The intelligent warehousing provided by the present invention, through the cooperation of a central transfer device with a circular array of racks, feeding components and discharging components, achieves efficient use of space and rapid material flow, significantly improving storage and retrieval efficiency.

[0039] 2. By setting up a material feeding component and a material changing component equipped with a barcode scanner, this invention achieves accurate identification and full traceability of each material, effectively improving the level of quality management and inventory management.

[0040] 3. This invention, through the pull-out design of the feeding component, the cooperation of a dedicated material trough and fork slot, and the application of a laser sensor, ensures the reliability of automated operation while taking into account the convenience and safety of manual operation, and can monitor the material status in real time.

[0041] 4. This invention uses independent NG (Not From Good) components and material replacement components to manage qualified products, unqualified products, and materials awaiting replacement in separate zones. The process is clear, avoiding the risk of material mixing and making warehouse management more standardized and efficient.

[0042] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0043] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0044] Figure 1 This is a three-dimensional structural diagram of an intelligent warehouse provided in one embodiment;

[0045] Figure 2 This is a schematic diagram of the internal three-dimensional structure of an intelligent warehouse provided in one embodiment;

[0046] Figure 3 This is a schematic diagram of the inner structure of the first side provided in one embodiment;

[0047] Figure 4 This is a schematic diagram of the feeding assembly provided in one embodiment;

[0048] Figure 5 This is a schematic diagram of the structure of a mobile frame provided in one embodiment;

[0049] Figure 6 This is a schematic diagram of the structure of a first fixed frame provided in one embodiment;

[0050] Figure 7 This is a schematic diagram of the outer structure of the second side provided in one embodiment;

[0051] Figure 8 This is a schematic diagram of the inner structure of the second side provided in one embodiment.

[0052] Among them, 1-cabinet, 2-transfer device, 3-feeding component, 31-feeding port, 32-first fixed frame, 321-first base plate, 33-moving frame, 331-second base plate, 332-first baffle, 333-pull handle, 34-second baffle, 35-first base, 351-material trough, 352-fork handle groove, 353-first groove, 36-laser sensor, 37-electromagnetic suction structure, 371-first magnet, 372-second magnet, 373-start button, 374-stop button, 4-discharge component, 41-discharge port, 42-grating, 43-second fixed frame, 44-first barcode scanner, 5-material rack, 6-NG component, 7-material changing component, 71-material changing inlet, 72-second barcode scanner, 73-material changing pipe, 74-material changing box. Detailed Implementation

[0053] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0054] like Figures 1 to 8 As shown in the figure, the high-precision wear-resistant wafer dicing blade intelligent management device provided by this embodiment of the invention has a core of a closed cabinet 1, with a transfer device 2 installed in the center inside. The transfer device 2 can rotate in both directions on a horizontal plane, but its overall horizontal displacement is zero. The transfer device 2 is equipped with lifting and retractable forks (not shown separately in the figure) for gripping and placing materials.

[0055] like Figures 1 to 3 As shown, multiple feeding components 3 are arranged vertically on one side of the cabinet 1 (defined as the first side). On the second side adjacent to the first side, a discharging component 4 is provided. Inside the cabinet 1, on the opposite side from the feeding and discharging components, a material rack 5 arranged in a circular array is installed for storing a large number of dicing blades. Preferably, the storage positions on the material rack 5, the material troughs 351 on the feeding components 3, and the discharging positions on the discharging components 4 are all located on the same circumference with the rotation center of the transfer device 2 as the center, which minimizes the transfer path and maximizes efficiency.

[0056] like Figures 3 to 6As shown, the feeding assembly 3 is the channel for material entry. It includes a first fixed frame 32 fixed inside the feed inlet 31 and a pull-out movable frame 33. The movable frame 33 slides through guide rails / slots with the first side plates on the first fixed frame 32 via second side plates on both sides. A pull-out handle 333 is installed on the first baffle 332 at the front end of the movable frame 33. When the movable frame 33 is pushed inward, the first baffle 332 is blocked by the second baffles 34 on the upper and lower inner sides of the feed inlet 31 to prevent excessive insertion. A first base 35 is installed on the second base plate 331 of the movable frame 33. The end of the base near the transfer device 2 is arc-shaped, and multiple material grooves 351 matching the shape of the dicing blade are opened on it. A fork slot 352 is provided below the material groove 351 for the fork of the transfer device 2 to reach in and pick up the material. At the other end of the material groove 351, a deeper first groove 353 is provided to facilitate picking up the material with fingers. At the bottom of the first base plate 321, a laser sensor 36 is installed for each material trough 351. The first base plate and the fork slot 352 above it have through holes for detecting whether there is material in the material trough 351.

[0057] The feeding assembly 3 also integrates an electromagnetic attraction structure 37 for locking the moving frame 33. It includes a first magnet 371 mounted on the third baffle 321 at the end of the first fixed frame 32, and a second magnet 372 mounted on the edge of the second base plate 331 of the moving frame 33. The first magnet 371 is powered on and off via the start button 373 and the stop button 374 on the outside of the cabinet 1, thus achieving the attraction and locking of the moving frame 33 and its release upon power failure.

[0058] Directly below the feeding assembly 3, there is a pull-out NG assembly 6, whose internal NG box is specifically used to store materials that fail the inspection (NG).

[0059] like Figure 7 and Figure 8 As shown, the discharge assembly 4 is the channel for qualified materials to leave the warehouse. Its discharge port 41 is equipped with a grating 42 for safety detection. The internal second fixed frame 43 has multiple discharge stations, and each station is equipped with a first barcode scanner 44 to scan the barcode of the material again before it leaves the warehouse to confirm the information.

[0060] Below the discharging assembly 4, a material replacement assembly 7 is integrated. A second barcode scanner 72 is located above its material replacement inlet 71, used to scan the barcode of the old material to be replaced. After scanning, the old material falls through the material replacement pipe 73 into the material replacement box 74 below for temporary storage. Simultaneously, the system instructs the transfer device 2 to retrieve a new material from the material rack 5 and deliver it to the discharging assembly 4. The operator can then retrieve the new material from the discharging port 41, completing the old-for-new process.

[0061] The workflow of this invention is briefly described as follows:

[0062] Storage: The operator pulls out the movable frame 33 of the feeding assembly 3 and places the dicing blade into the material trough 351. After pushing the movable frame 33 in, the start button is pressed to lock it. The laser sensor 36 detects the material, the system records the information, and then the transfer device 2 removes the material and stores it in the designated position on the material rack 5.

[0063] Outbound: After receiving the outbound instruction, the transfer device 2 takes the designated material from the rack 5 and transports it to the discharge station of the discharge assembly 4. After the first barcode scanner 44 scans the barcode and confirms that it is correct, the operator can take the material from the discharge port 41.

[0064] Material replacement: The operator scans the old material at the second barcode scanner 72 of the material replacement component 7, and then puts it into the material replacement inlet 71. The old material falls into the material replacement box 74. The system then triggers the new material outbound process, and the operator retrieves the new material from the outlet 41.

[0065] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A high-precision, wear-resistant wafer dicing blade intelligent management device, characterized in that, Including the cabinet; A transfer device is located in the center of the cabinet and is configured to rotate in both forward and reverse directions. The feeding assembly is movably mounted on the first side of the cabinet in a pull-out manner; A discharge assembly is located on the second side of the cabinet adjacent to the infeed assembly; as well as The material rack is located inside the cabinet on the other side opposite to the feeding assembly and the discharging assembly, and is arranged in a circular array.

2. The intelligent management equipment for high-precision wear-resistant wafer dicing blades according to claim 1, characterized in that, Multiple feeding assemblies are provided and arranged vertically along the first side of the cabinet. The feeding assembly includes a feeding port, a first fixed frame, and a movable frame. The first end of the first fixing frame is fixed to the lower inner side of the feed inlet. The first fixing frame includes a first base plate and first side plates respectively disposed on both sides of the first base plate. The movable frame includes a second base plate, second side plates disposed on both sides of the second base plate, and a first baffle disposed at a first end of the second base plate. The first baffle is provided with a pull handle. The movable frame extends into the first fixed frame through the feed port. The second side plates and the first side plates are slidably connected by guide rails or guide grooves. A second baffle extending outward is provided at the upper and lower ends of the inner side of the feed inlet. After the first baffle enters from the outside of the feed inlet, it is blocked by the second baffle to restrict its further inward movement.

3. The intelligent management equipment for high-precision wear-resistant wafer dicing blades according to claim 2, characterized in that, The second base plate is provided with a first base, the end of the first base near the transfer device is set with an arc-shaped surface, and multiple material troughs matching the shape of the material are arranged on the first base in the same arc direction. The material trough is provided with a fork slot below it that matches the fork on the transfer device, and the fork slot extends from the arc surface to a position beyond the material trough; At the other end of the material trough relative to the arc-shaped surface, a first groove is provided extending along the direction of the fork groove. The first groove is an arc-shaped groove with a depth greater than the material trough and communicating with the fork groove. The width of the first groove is adapted to the width of one to two fingers, which facilitates manual placement of materials. At the bottom of the first base plate, a laser sensor is installed for each material trough to detect whether there is material in the corresponding material trough; Both the first base plate located above the laser sensor and the fork groove are provided with through holes to allow the detection beam of the laser sensor to pass through.

4. The intelligent management equipment for high-precision wear-resistant wafer dicing blades according to claim 2, characterized in that, The feeding assembly also includes an electromagnetic attraction structure, which includes a start button, a stop button, a first magnet, and a second magnet. The first fixed frame is provided with a third baffle at its second end opposite to the first end, which is fixedly connected to the first base plate, and the first magnet is fixed to the third baffle. The second magnet is fixed to the edge of the second base plate, and its position corresponds to that of the first magnet, so as to achieve contact or proximity; The start button and the stop button are located on the outside of the cabinet below the feed inlet and are electrically connected to the first magnet. The start button is configured to control the first magnet to be energized to generate magnetic force, thereby attracting the second magnet. The stop button is configured to control the first magnet to be de-energized and demagnetized, thereby allowing the first magnet and the second magnet to separate.

5. The intelligent management device for high-precision wear-resistant wafer dicing blades according to claim 1, characterized in that, It also includes an NG component, which is movably disposed directly below the feeding component in a pull-out manner, and the NG component includes an NG container for storing non-conforming materials.

6. The intelligent management device for high-precision wear-resistant wafer dicing blades according to claim 3, characterized in that, The discharge assembly includes a discharge port, a second fixed frame, and a first barcode scanner. A grating is provided at the discharge port. The second fixed frame is located below the inner side of the discharge port. The second fixed frame is provided with multiple discharge stations. A first barcode scanner is provided above each discharge station. The first barcode scanner is used to scan the barcode attached to the material to be discharged.

7. The intelligent management device for high-precision wear-resistant wafer dicing blades according to claim 1, characterized in that, It also includes a material changing component, which is located below the discharge component. The material changing assembly includes a material changing inlet, a second barcode scanner, a material changing pipe, and a material changing box. The second barcode scanner is located above the material replacement inlet and is used to scan the barcode on the material to be replaced. The material changing box is located inside the cabinet and below the material changing inlet. The upper end of the material changing pipe is connected to the material changing inlet, and the lower end extends to the top of the material changing box. When changing materials, the material to be replaced is first scanned at the second barcode scanner, and then falls into the material replacement box through the material replacement inlet and the material replacement pipe; then, the new material is transported to the discharge component by the transfer device, and finally taken out from the discharge port.

8. The intelligent management device for high-precision wear-resistant wafer dicing blades according to claim 1, characterized in that, The transfer device is configured to have no displacement in the horizontal direction and can only rotate in the horizontal plane; the forks on the transfer device can perform lifting and extending actions to complete the picking and placing of materials.

9. The intelligent management device for high-precision wear-resistant wafer dicing blades according to claim 1, characterized in that, The material rack, the material trough set on the feeding assembly, and the discharge station set on the discharge assembly are located on the same circumference and are all distributed with the transfer device as the center.

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