Clamp for board-level electroplating

Abstract

The invention discloses a clamp for board-level electroplating, and relates to the technical field of chip manufacturing, the clamp comprises clamping pieces and golden fingers, each group of clamping pieces comprises two clamping plates, the opposite side surfaces of the two clamping plates are clamping surfaces, annular rubber coatings are fixed on the clamping surfaces, the golden fingers are located in the annular rubber coatings, located on the same side surface of the chip plate, of the two groups of clamping pieces, and the golden fingers are fixed on the clamping plates. The annular rubber coating and the clamping piece metal framework are integrally formed, the annular rubber coating is in extrusion contact with a PR rubber layer of the chip board or a substrate of the chip board, the golden fingers are communicated with a positive electrode and a negative electrode of electroplating equipment respectively, and the distance between contact pins of the golden fingers and the annular rubber coating is larger than zero; the overall width of the annular rubber coating is widened, so that the annular rubber coating can be pressed in a PR rubber layer and an internal golden finger contact area to form a closed space, electroplating liquid medicine can be prevented from permeating, and copper nodules are prevented from being generated; the two sides of the contact pin of the golden finger are hollowed out, so that the flexibility is better than that of whole-surface rubber coating, and virtual connection between the contact pin of the golden finger and a seed layer when a thick PR rubber layer is coped is avoided.

Description

Technical Field

[0001] This invention relates to the field of chip manufacturing technology, and more particularly to a fixture for board-level electroplating. Background Technology

[0002] In the electronic chip industry, to achieve higher connection reliability for circuit connectors, it is necessary to plate the contact surfaces of the connectors with metals such as gold or silver to reduce contact resistance and improve conductivity. Chip electroplating is a process that utilizes electrochemical principles to form a metal film on the chip surface. Specifically, it involves applying an external potential to reduce metal ions in an electrolyte solution at the cathode, thereby depositing them on the chip surface to form a metal film. Existing fixture-based electroplating processes have the following drawbacks: sealing cannot be achieved on both sides of the seed layer of the chip, leading to the formation of copper nodules on both sides of the seed layer, such as... Figure 1 , Figure 5 As shown, the contact pin and the fixture skeleton of the electroplating device are integrated, which has poor elasticity and high hardness. It has high requirements for the flatness of the contact pin and the seed layer, which can easily cause the contact pin to make poor contact with the seed layer or puncture the seed layer. Summary of the Invention

[0003] The purpose of this invention is to design a fixture for plate-level electroplating in order to solve the above-mentioned problems.

[0004] The present invention achieves the above objectives through the following technical solutions: Fixtures for plate-level electroplating include: Two sets of clamping components; the two sets of clamping components are used to clamp the two ends of the chip board respectively. Each set of clamping components includes two clamping plates. The opposite sides of the two clamping plates are clamping surfaces, and annular rubber coatings are fixed on the clamping surfaces. Two sets of gold fingers; the gold fingers are located in the annular coating on the same side of the chip board in the two sets of clamping components, and are integrally formed with the metal skeleton of the clamping components. The annular coating is in contact with the PR adhesive layer of the chip board or the substrate of the chip board by compression. The two sets of gold fingers are connected to the positive and negative electrodes of the electroplating equipment, respectively. The distance between the contact pin of the gold finger and the annular coating is greater than zero.

[0005] The beneficial effects of this invention are as follows: widening the overall width of the annular coating creates a sealed space between the annular coating and the PR adhesive layer, preventing the electroplating solution from seeping in and avoiding the formation of copper nodules; the hollowed-out design on both sides of the contact pin of the gold finger provides better flexibility compared to the entire coating, preventing the contact pin of the gold finger from making poor contact with the seed layer when dealing with a thicker PR adhesive layer. Attached Figure Description

[0006] Figure 1 This is a schematic diagram of copper nodules formed by existing electroplating processes; Figure 2This is a schematic diagram of the first embodiment of the fixture for plate-level electroplating of the present invention; Figure 3 This is a schematic diagram of the second embodiment of the fixture for plate-level electroplating of the present invention; Figure 4 This is a schematic diagram of the third embodiment of the fixture for plate-level electroplating of the present invention; Figure 5 This is a schematic diagram of a chip board after electroplating using existing technology fixtures; Figure 6 This is a schematic diagram of a chip board after electroplating using the fixture of this invention; The corresponding figure labels are: 1-Clamping plate, 2-Gold finger, 3-PR adhesive layer, 4-Seed layer, 5-Copper nodule, 6-Glass substrate, 7-Annular coating, 8-Contact pin, 9-First elastic element, 10-Second elastic element. Detailed Implementation

[0007] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0008] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0009] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0010] In the description of this invention, it should be understood that the terms "upper," "lower," "inner," "outer," "left," "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are only used to facilitate the description of this invention and to simplify the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0011] Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0012] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, terms such as "set" and "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0013] The specific embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0014] Example 1, as Figure 2 As shown, the fixture for plate-level electroplating includes: Two sets of clamping components; the two sets of clamping components are used to clamp the two ends of the chip board respectively. Each set of clamping components includes two clamping plates 1. The opposite sides of the two clamping plates 1 are clamping surfaces. An annular coating 7 is fixed on the clamping surfaces. The clamping components also include a force-applying component, which is used to apply force to the two clamping plates so that the two clamping surfaces are brought closer together during electroplating. The force-applying component can be a spring. At this time, the two ends of the spring are fixedly connected to the ends of the two clamping plates away from the annular coating, or the force-applying component and the two clamping plates are combined to form a clamp-like structure. Two sets of gold fingers 2; the gold fingers 2 are located in the annular coating 7 on the same side of the chip board. The annular coating 7 is in contact with the PR adhesive layer 3 of the chip board or the substrate of the chip board by compression. The two sets of gold fingers 2 are connected to the positive and negative electrodes of the electroplating equipment, respectively. The distance between the contact pin 8 of the gold fingers 2 and the annular coating 7 is greater than zero.

[0015] The width of the annular coating 7 is widened so that a sealed space is formed between the annular coating 7 and the PR adhesive layer 3 in the middle, which can prevent the electroplating solution from seeping in and avoid the formation of copper nodules 5; the contact pins 8 of the gold fingers 2 are hollowed out on both sides, which is more flexible than the whole coating and avoids the contact pins 8 of the gold fingers 2 from making poor contact with the seed layer 4 when dealing with a thicker PR adhesive layer 3.

[0016] Example 2, as Figure 2 , Figure 3 As shown, the fixture for plate-level electroplating includes: Two sets of clamping components; the two sets of clamping components are used to clamp the two ends of the chip board respectively. Each set of clamping components includes two clamping plates 1. The opposite sides of the two clamping plates 1 are clamping surfaces. An annular coating 7 is fixed on the clamping surfaces. The clamping components also include a force-applying component, which is used to apply force to the two clamping plates so that the two clamping surfaces are brought closer together during electroplating. The force-applying component can be a spring. At this time, the two ends of the spring are fixedly connected to the ends of the two clamping plates away from the annular coating, or the force-applying component and the two clamping plates are combined to form a clamp-like structure. Two sets of gold fingers 2; the gold fingers 2 are located in the annular coating 7 on the same side of the chip board. The annular coating 7 is in contact with the PR adhesive layer 3 of the chip board or the substrate of the chip board by compression. The two sets of gold fingers 2 are respectively connected to the positive and negative electrodes of the electroplating equipment. The distance between the contact pins 8 of the gold fingers 2 and the annular coating 7 is greater than zero.

[0017] The fixture also includes two sets of first elastic components, which are respectively mounted on two sets of gold fingers 2. Each set of first elastic components includes multiple first elastic elements 9. The contact pins 8 of the gold fingers 2 are divided into multiple groups. The first end of one set of first elastic elements 9 is fixedly connected to one set of contact pins 8, and the second end of the first elastic element 9 is fixedly connected to the skeleton of the gold fingers 2. During electroplating, the contact pins 8 of the gold fingers 2 are pressed into contact with the seed layer 4 of the chip board. The elastic force direction of the second end of the first elastic element 9 is towards the direction of the chip board, and the first elastic element 9 is conductive.

[0018] The first elastic element 9 is a leaf spring or a compression spring.

[0019] The width of the annular coating 7 is widened, creating a sealed space between the annular coating 7 and the PR adhesive layer 3, preventing the electroplating solution from seeping in and avoiding the formation of copper nodules 5. The first elastic element 9 is used as the intermediate elastic medium, allowing the contact pin 8 to contact the seed layer 4 of the chip board. This ensures that the contact pin 8 can contact the seed layer 4 even with PR adhesive layers of different thicknesses, preventing the contact pin 8 from making poor contact with the seed layer 4 or puncturing the seed layer 4. Furthermore, the grouped contact pins 8 can reduce the fixture production cost and process difficulty. In addition, the clamping plates 1 at both ends of the chip board are used in conjunction with each other. When not in use, the elastic force of the first elastic element 9 is fully released, improving its service life. Figure 3 The first elastic element 9 is illustrated using a leaf spring.

[0020] Example 3, as Figure 2 , Figure 4 As shown, the fixture for plate-level electroplating includes: Two sets of clamping components; the two sets of clamping components are used to clamp the two ends of the chip board respectively. Each set of clamping components includes two clamping plates 1. The opposite sides of the two clamping plates 1 are clamping surfaces. An annular coating 7 is fixed on the clamping surfaces. The clamping components also include a force-applying component, which is used to apply force to the two clamping plates so that the two clamping surfaces are brought closer together during electroplating. The force-applying component can be a spring. At this time, the two ends of the spring are fixedly connected to the ends of the two clamping plates away from the annular coating, or the force-applying component and the two clamping plates are combined to form a clamp-like structure. Two sets of gold fingers 2; the gold fingers 2 are located in the annular coating 7 on the same side of the chip board. The annular coating 7 is in contact with the PR adhesive layer 3 of the chip board or the substrate of the chip board by compression. The two sets of gold fingers 2 are respectively connected to the positive and negative electrodes of the electroplating equipment. The distance between the contact pins 8 of the gold fingers 2 and the annular coating 7 is greater than zero.

[0021] The fixture also includes two sets of second elastic components, which are respectively mounted on two sets of gold fingers 2. Each set of first elastic components includes multiple second elastic elements 10. The first end of one second elastic element 10 is fixedly connected to a contact pin 8 of the gold finger 2, and the second end of the second elastic element 10 is fixedly connected to the skeleton of the gold finger 2. During electroplating, the contact pin 8 of the gold finger 2 makes contact with the seed layer 4 of the chip board. The elastic force direction of the second end of the second elastic element 10 is towards the chip board, and the second elastic element 10 is conductive. The second elastic element 10 is a leaf spring or a compression spring. Figure 4 The second elastic element 10 is illustrated using a compression spring.

[0022] like Figure 6 As shown, the thickness of the annular coating 7 is widened, so that a sealed space is formed between the annular coating 7 and the PR adhesive layer 3 in the middle, which can prevent the electroplating solution from seeping in and avoid the formation of copper nodules 5; the first elastic element 9 is used as the intermediate elastic medium, so that the contact pin 8 can contact the seed layer 4 of the chip board. This can ensure that each contact pin 8 can contact the seed layer 4 when the PR adhesive layer 3 is of different thicknesses, avoiding the contact pin 8 from making a poor connection with the seed layer 4 or puncturing the seed layer 4; and the clamping plates 1 at both ends of the chip board are used in conjunction with each other. When not in use, the elastic force of the first elastic element 9 is fully released, improving the service life.

[0023] The technical solutions of the present invention are not limited to the specific embodiments described above. Any technical modifications made in accordance with the technical solutions of the present invention fall within the protection scope of the present invention.

Claims

1. A fixture for plate-level electroplating, characterized in that, include: Two sets of clamping components; the two sets of clamping components are used to clamp the two ends of the chip board respectively. Each set of clamping components includes two clamping plates. The opposite sides of the two clamping plates are clamping surfaces, and annular rubber coatings are fixed on the clamping surfaces. Two sets of gold fingers; the gold fingers are located in the annular coating on the same side of the chip board in the two sets of clamping components, and are integrally formed with the metal skeleton of the clamping components. The annular coating is in contact with the PR adhesive layer of the chip board or the substrate of the chip board by compression. The two sets of gold fingers are connected to the positive and negative electrodes of the electroplating equipment, respectively. The distance between the contact pin of the gold finger and the annular coating is greater than zero.

2. The fixture for plate-level electroplating according to claim 1, characterized in that, The fixture also includes two sets of first elastic components, which are respectively mounted on two sets of gold fingers. Each set of first elastic components includes multiple first elastic elements. The contact pins of the gold fingers are divided into multiple groups. The first end of one set of first elastic elements is fixedly connected to one set of contact pins, and the second end of the first elastic element is fixedly connected to the skeleton of the gold fingers. During electroplating, the contact pins of the gold fingers are pressed into contact with the seed layer of the chip board. The elastic force direction of the second end of the first elastic element is towards the direction of the chip board, and the first elastic element is conductive.

3. The fixture for plate-level electroplating according to claim 2, characterized in that, The first elastic element is a leaf spring or a compression spring.

4. The fixture for plate-level electroplating according to claim 1, characterized in that, The fixture also includes two sets of second elastic components, which are respectively mounted on two sets of gold fingers. Each set of first elastic components includes multiple second elastic elements. The first end of one second elastic element is fixedly connected to a contact pin of the gold finger, and the second end of the second elastic element is fixedly connected to the skeleton of the gold finger. During electroplating, the contact pin of the gold finger is pressed into contact with the seed layer of the chip board. The elastic force direction of the second end of the second elastic element is towards the chip board, and the second elastic element is conductive.

5. The fixture for plate-level electroplating according to claim 4, characterized in that, The second elastic element is a leaf spring or a compression spring.

6. The fixture for plate-level electroplating according to claim 1, characterized in that, The thickness of the rubber coating is 2mm.

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