Temperature sensor and manufacturing method thereof

Abstract

The invention provides a temperature sensor and a manufacturing method thereof. The manufacturing method of the temperature sensor comprises the steps that first hot melting sleeves are arranged on the surfaces of wire skins of a plurality of wires in a sleeving mode respectively, and the first hot melting sleeves are slidably connected with the corresponding wires in a sleeving mode; lapping the plurality of pins of the thermistor with the wire cores of the plurality of wires in a one-to-one correspondence manner, and welding the other part of lapping areas of the wire cores and the pins to form a welding area; the first hot melting sleeve is slid, so that the first hot melting sleeve sleeves the welding area, and the thermistor is sleeved with a second hot melting sleeve; and sleeving a heat-shrinkable sleeve outside the second hot melting sleeve and the first hot melting sleeves, carrying out first heat treatment, enabling the second hot melting sleeve and the plurality of first hot melting sleeves to be integrated into a hot melting layer, enabling the heat-shrinkable sleeve to shrink, and enabling the inner surface of the heat-shrinkable sleeve and the hot melting layer to be integrated into a whole to form the temperature sensor. The sealing performance of the joint between the lead and the thermistor can be improved, and the reliability and the service life of the temperature sensor are improved.

Description

Technical Field

[0001] This invention relates to the field of sensor technology, and more specifically, to a temperature sensor and its manufacturing method. Background Technology

[0002] In recent years, temperature sensors have been widely used in the field of new energy vehicles, such as in charging systems and thermal management circuits, serving as core components of intelligent sensing terminals. New energy vehicles are located in regions ranging from the low-temperature, low-humidity, and low-salt areas of Northwest China to the high-temperature, high-humidity, and high-salt areas of the coast. The connection between the thermistor and the wires has poor sealing, making it easy for moisture and salt to penetrate the temperature sensor in areas with high humidity or salinity, causing abnormal temperature readings. This reduces the reliability and lifespan of the temperature sensor, leading to charging system malfunctions or even failure to charge, or failure of the thermal management circuit.

[0003] Generally, a temperature sensor includes a thermistor and wires connected to it. There are usually at least two wires, each connected to at least two pins of the thermistor. When packaging a temperature sensor, a heat-shrink tubing is often used to encase the thermistor and the connections between the thermistor and the wires. The heat-shrink tubing is then heated to completely cover the thermistor and the connections. However, gaps can easily exist between the wires, and the adhesion between the heat-shrink tubing and the wires is often poor, resulting in poor sealing at the joints between the wires and the thermistor.

[0004] In related technologies, a double-layered heat-shrinkable tubing is used to cover the thermistor and the connection between the thermistor and multiple wires, so that the heat-shrinkable tubing can bond the wire insulation to the heat-shrinkable tubing. However, it is still difficult to completely seal the gaps between multiple wires. Summary of the Invention

[0005] This application addresses the shortcomings of existing methods by proposing a temperature sensor and its manufacturing method to solve technical problems such as poor sealing at the connection between the thermistor and the wire, and difficulty in completely sealing gaps between multiple wires.

[0006] In a first aspect, embodiments of this application provide a method for manufacturing a temperature sensor, comprising: A first heat-fusion sleeve is respectively fitted onto the surface of the sheath of multiple conductors. The first heat-fusion sleeve is configured to be slidably fitted onto the corresponding conductor, with the conductor core at the first end exposed outside the sheath.

[0007] The thermistor's multiple pins are connected one-to-one with the cores of multiple wires, and a portion of the overlap area between the core and the pin is located inside the corresponding first hot melt sleeve. The other portion of the overlap area exposed by the core and the pin in the first hot melt sleeve is welded to form a welded area.

[0008] The first hot melt sleeve is slid so that it covers the welding area, and the second hot melt sleeve is placed over the thermistor. The ends of the second hot melt sleeve and the first hot melt sleeve that are close to each other are in contact or overlap.

[0009] A heat-shrinkable sleeve is placed over the second heat-fusion sleeve and the first heat-fusion sleeve, and a first heat treatment is performed to make the second heat-fusion sleeve and multiple first heat-fusion sleeves into a heat-fusion layer. The heat-shrinkable sleeve shrinks, and the inner surface of the heat-shrinkable sleeve fuses with the heat-fusion layer to form a temperature sensor.

[0010] In some embodiments, a first heat-fusion sleeve is respectively fitted onto the surface of the insulation of multiple conductors, including: A parallel bushing is fitted over multiple conductors that are in contact with each other and whose first ends are flush. The parallel bushing and the first ends of the conductors are at a first designed distance. A second heat treatment is performed to shrink the parallel bushing and fix the multiple conductors.

[0011] Multiple first heat-fusion sleeves are respectively fitted over the first ends of multiple conductors. The first end of the first heat-fusion sleeve is close to the first end of the conductor, and the second end of the first heat-fusion sleeve is close to the parallel sleeve. When the second end of the first heat-fusion sleeve contacts the parallel sleeve, at least part of the conductor core is exposed in the first heat-fusion sleeve.

[0012] In some embodiments, multiple pins of the thermistor are overlapped one-to-one with the cores of multiple wires, and a portion of the overlap area between the core and the pin is located within the corresponding first thermoplastic sleeve, including: The wire core includes a stranded multi-core wire. The ends of multiple pins of the thermistor are inserted one by one into the wire cores of multiple conductors, so that the pins and the wire cores are twisted together. A portion of the twisted area between the wire core and the pins is fixed in the corresponding first thermoplastic sleeve, while the other portion is exposed in the first thermoplastic sleeve.

[0013] In some embodiments, along the extension direction of the pin, the end of the pin is located inside the exposed core of the wire sheath.

[0014] In some embodiments, multiple pins of the thermistor are overlapped one-to-one with the cores of multiple wires, and a portion of the overlap area between the core and the pin is located within the corresponding first thermoplastic sleeve, including: The wire core includes a single-core wire, and the multiple pins of the thermistor are connected one by one to the surface of the wire core of the multiple conductors, so that part of the connection area between the wire core and the pin is located inside the corresponding first thermoplastic sleeve, and the other part is exposed outside the first thermoplastic sleeve.

[0015] In some embodiments, a first hot-melt sleeve is slidable such that it covers the welding area, and a second hot-melt sleeve is placed over the thermistor, wherein the ends of the second hot-melt sleeve and the first hot-melt sleeve that are close to each other contact or overlap, including: Slide the first heat-fusion sleeve so that the first heat-fusion sleeves outside the multiple conductors are flush, and part of the first heat-fusion sleeve is fitted outside the wire sheath of the conductor, and the other part is fitted outside the welding area.

[0016] A second thermoplastic sleeve, with its first end closed and its second end open, is fitted over the thermistor.

[0017] The second heat-fusion sleeve contacts the end of the first heat-fusion sleeve that is close to each other, or the second end of the second heat-fusion sleeve accommodates the first ends of a plurality of first heat-fusion sleeves.

[0018] In some embodiments, a heat-shrinkable sleeve is fitted over the second heat-fusion sleeve and the first heat-fusion sleeve for a first heat treatment, including: A heat-shrinkable sleeve is installed over the second heat-fusion sleeve and the first heat-fusion sleeve; both the first and second ends of the heat-shrinkable sleeve are open, and the second end of the heat-shrinkable sleeve extends beyond the second end of the first heat-fusion sleeve.

[0019] The first heat treatment is performed to fuse the second heat-fusion sleeve with multiple first heat-fusion sleeves into a heat-fusion layer, and the heat-shrink sleeve shrinks to cover the heat-fusion layer inside.

[0020] In some embodiments, during the first heat treatment process, the first heat-melting sleeve is at least partially located in the direction of gravity of the second heat-melting sleeve.

[0021] In some embodiments, the length of the exposed core is less than the length of the sheath covered by the heat-fused layer.

[0022] The length of the first heat-fusion sleeve is less than the length of the wire insulation between the first end of the conductor and the parallel sleeve.

[0023] Secondly, embodiments of this application provide a temperature sensor manufactured by any of the manufacturing methods provided in the first aspect above, comprising: a thermistor, a heat-fusion layer, a heat-shrink tubing, and a plurality of wires; The multiple pins of the thermistor are soldered one-to-one with the cores of the multiple wires.

[0024] The hot melt layer covers the thermistor, the welding area of ​​the multiple pins of the thermistor and the multiple wires, and the partial insulation of each of the multiple wires.

[0025] The heat shrink tubing covers the outside of the heat-fused layer.

[0026] The beneficial effects of the technical solutions provided in this application include: In this embodiment, a first hot-melt sleeve is installed outside each conductor, and a second hot-melt sleeve is installed outside the thermistor and at the welding point between the pin and the conductor core. After a first heat treatment, the hot-melt layer formed by the fusion of the first and second hot-melt sleeves can fill the gaps between multiple conductors and completely cover the joint between the conductor and the thermistor, thereby improving the sealing performance of the joint between the conductor and the thermistor, thus improving the reliability and service life of the temperature sensor and ensuring the reliability of the charging system, thermal management circuit and other systems.

[0027] Additional aspects and advantages of this application will be set forth in part in the description which follows, and will become apparent from the description or may be learned by practice of this application. Attached Figure Description

[0028] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments of the present invention will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 A schematic flowchart illustrating a method for manufacturing a temperature sensor according to an embodiment of this application; Figure 2 A schematic diagram of the structure after the parallel bushing is sleeved over multiple wires that are in contact with each other and whose first ends are flush, in the manufacturing method provided in the embodiments of this application; Figure 3 A schematic diagram of the structure after first heat-fusion sleeves are respectively fitted onto the surface of the wire sheaths of multiple wires in the manufacturing method provided in the embodiments of this application; Figure 4 One of the structural schematic diagrams of the manufacturing method provided in the embodiments of this application, in which the ends of multiple pins of a thermistor are inserted one by one into the cores of multiple wires; Figure 5 The second schematic diagram of the structure after the ends of multiple pins of the thermistor are inserted one by one into the core of multiple wires in the manufacturing method provided in the embodiments of this application; Figure 6 A schematic diagram of the structure after a second hot melt sleeve is fitted over the thermistor and the welding area between the pin and the wire core in the manufacturing method provided in the embodiments of this application; Figure 7 A schematic diagram of the structure after a heat-shrinkable sleeve is fitted over the second heat-fusion sleeve and the first heat-fusion sleeve in the manufacturing method provided in the embodiments of this application; Figure 8A schematic diagram of the structure after the first heat treatment in the manufacturing method provided in the embodiments of this application; Figure 9 This is a schematic diagram of the structure after the outer shell is installed in the manufacturing method provided in the embodiments of this application; Figure 10 This is a schematic diagram of the structure after one end of the pin is inserted into the first thermoplastic sleeve in the manufacturing method provided in the embodiments of this application.

[0030] Figure label: 10 - Thermistor; 11 - Pin; 20 - Conductor; 21 - Sheath; 22 - Core; 30 - First heat fusion sleeve; 40 - Second heat fusion sleeve; 50 - Heat shrink tubing; 60 - Parallel tubing; 70 - Hot melt layer; 80 - Adhesive layer; 90 - Outer shell. Detailed Implementation

[0031] The embodiments of this application are described below with reference to the accompanying drawings. It should be understood that the embodiments described below with reference to the accompanying drawings are exemplary descriptions for explaining the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions of the embodiments of this application.

[0032] Those skilled in the art will understand that, unless specifically stated otherwise, the terms "described" and "the" as used herein may also include plural forms. It should be further understood that the term "comprising" as used in this application's specification means the presence of the stated features, integers, steps, operations, elements, and / or components, but does not exclude other features, information, data, steps, operations, elements, components, and / or combinations thereof supported by this art. It should be understood that when we say an element is "connected" to another element, the element may be directly connected to the other element, or it may mean that the element and the other element are connected through an intermediate element. The term "and / or" as used herein refers to at least one of the items defined by the term; for example, "A and / or B" can be implemented as "A," or as "B," or as "A and B."

[0033] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0034] The temperature sensor and its manufacturing method provided in this application are intended to solve the above-mentioned technical problems in related technologies.

[0035] This application provides a method for manufacturing a temperature sensor, the flowchart of which is shown below. Figure 1 As shown, the method includes steps S101-S104: S101: First heat-fusion sleeves 30 are respectively fitted on the surface of the sheath 21 of multiple conductors 20. The first heat-fusion sleeves 30 are configured to be slidably fitted with the corresponding conductors 20, and the core 22 of the first end of the conductor 20 is exposed on the sheath 21.

[0036] Optionally, the first end of the wire 20 is for soldering to the pins of the thermistor 10.

[0037] Optionally, the structural diagram after step S101 is as follows: Figure 3 As shown.

[0038] S102: The multiple pins 11 of the thermistor 10 are connected one-to-one with the cores 22 of the multiple conductors 20, with a portion of the overlap area between the core 22 and the pin 11 located within the corresponding first heat-fusion sleeve 30. The remaining overlap area exposed above the first heat-fusion sleeve 30 is then welded to form a welded area. Here, "a portion of the overlap area between the core 22 and the pin 11 located within the corresponding first heat-fusion sleeve 30" means that a portion of the overlap area between the core 22 and the pin 11 is located within the first heat-fusion sleeve 30 fitted onto the conductor 20 containing the core 22.

[0039] Optionally, the structural diagram after step S102 is as follows: Figure 4 , Figure 5 As shown, the solder joints are not shown.

[0040] S103: Slide the first hot melt sleeve 30 so that the first hot melt sleeve 30 covers the welding area, and a second hot melt sleeve 40 is placed on the thermistor 10. The ends of the second hot melt sleeve 40 and the first hot melt sleeve 30 that are close to each other are in contact or overlap.

[0041] Optionally, the structural diagram after step S103 is as follows: Figure 6 As shown.

[0042] S104: A heat shrinkable sleeve 50 is installed over the second heat fusion sleeve 40 and the first heat fusion sleeve 30, and a first heat treatment is performed so that the second heat fusion sleeve 40 and the multiple first heat fusion sleeves 30 are fused together into a heat fusion layer 70. The heat shrinkable sleeve 50 shrinks, and the inner surface of the heat shrinkable sleeve 50 is fused with the heat fusion layer 70 to form a temperature sensor.

[0043] Optionally, the structural diagram after step S104 is as follows: Figure 8 As shown.

[0044] Considering that substances such as water vapor and salt generally seep into the temperature sensor along the wires 20, in this embodiment, a first hot-melt sleeve 30 is installed outside each wire 20, covering the welding area between the pin 11 and the wire core 22. A second hot-melt sleeve 40 is installed outside the thermistor 10. After the first heat treatment, the multiple first hot-melt sleeves 30 and the second hot-melt sleeves 40 are fused together to form a hot-melt layer 70, which can fill the gaps between the multiple wires 20 and completely cover the welding joint between the wires 20 and the thermistor 10. This improves the sealing of the joint between the wires 20 and the thermistor 10, preventing substances such as water vapor and salt from seeping into the temperature sensor through the wires 20, thereby improving the reliability and service life of the temperature sensor and ensuring the reliability of the charging system, thermal management circuit, and other systems.

[0045] Specifically, the first heat-fusion sleeve 30 partially covers the insulation 21 of the conductor 20, exposing the conductor core 22. Therefore, the space between adjacent conductors 20 is filled with the first heat-fusion sleeve 30. The first heat-fusion sleeve 30 melts and flows after the first heat treatment, filling the gaps between adjacent conductors 20. Furthermore, considering that there are also gaps between different conductor cores 22, and that these gaps are closer to the insulation 21 of the conductor 20, they are at greater risk of being infiltrated by moisture or other substances, affecting the welding area between the conductor core 22 and the pin 11, and consequently impacting the reliability of the electrical connection between the conductor core 22 and the pin 11. Therefore, in this embodiment, the first heat-fusion sleeve 30 also partially covers the welding area between the pin 11 and the conductor core 22, completely enclosing the welding area and filling the space between the conductor cores 22 of multiple conductors 20, further improving sealing and ensuring the reliability of the electrical connection.

[0046] Furthermore, a heat-shrinkable sleeve 50 is provided over the first heat-fusion sleeve 30 and the second heat-fusion sleeve 40. During the first heat treatment, the heat-shrinkable sleeve 50 shrinks and covers the molten first heat-fusion sleeve 30 and the second heat-fusion sleeve 40, which serves to limit and solidify the shape. This prevents the first heat-fusion sleeve 30 and the second heat-fusion sleeve 40 from flowing away in the flow state, and ensures that the molten first heat-fusion sleeve 30 and the second heat-fusion sleeve 40 completely seal the gaps between the wires 20 and the welding joints between the wires 20 and the pins 11, so that the formed temperature sensor has good sealing performance.

[0047] Optionally, in this embodiment, the thermistor 10 has two pins 11, and the number of wires 20 is correspondingly two. In some other embodiments, the number of pins 11 may be more than two, such as three or four, and the corresponding number of wires 20 may also be three or four, etc.

[0048] Optionally, in this embodiment of the application, for a structure with two ends, the first end is defined as the end closer to the thermistor 10, and the second end is the end farther away from the thermistor 10. Specifically, the wire 20 has two ends. In this embodiment of the application, the first end of the wire 20 is the end where the wire 20 is soldered to the pin 11 of the thermistor 10, and the second end of the wire 20 is the end farther away from the thermistor 10. Similarly, the first heat-fused sleeve 30 also has two ends, with the first end closer to the thermistor 10 and the second end farther away from the thermistor 10. The second heat-fused sleeve 40 also has two ends, with the first end closer to the thermistor 10 and the second end farther away from the thermistor 10. The heat-shrinkable sleeve 50 also has two ends, with the first end closer to the thermistor 10 and the second end farther away from the thermistor 10.

[0049] Considering that the conductors 20 are generally very long, the operations of applying the first heat-fusion sleeve 30 and soldering the wire core 22 to the pin 11 are quite difficult. Therefore, in some embodiments, the step S101 above, in which the first heat-fusion sleeve 30 is applied to the surface of the sheath 21 of the multiple conductors 20, includes the following steps: A parallel bushing 60 is fitted over a plurality of wires 20 that are in contact with each other and whose first ends are flush. The parallel bushing 60 and the first ends of the wires 20 are at a first designed distance. A second heat treatment is performed to shrink the parallel bushing 60 and fix the plurality of wires 20. Optionally, a schematic diagram of the structure after fitting the parallel bushing 60 over the plurality of wires 20 that are in contact with each other and whose first ends are flush is shown below. Figure 2 As shown.

[0050] Multiple first heat-fusion sleeves 30 are respectively fitted over the first ends of multiple conductors 20. The first end of the first heat-fusion sleeve 30 is close to the first end of the conductor 20, and the second end of the first heat-fusion sleeve 30 is close to the parallel sleeve 60. When the second end of the first heat-fusion sleeve 30 contacts the parallel sleeve 60, the wire core 22 is at least partially exposed in the first heat-fusion sleeve 30.

[0051] In this embodiment, multiple wires 20 are first bundled together. Specifically, the multiple wires 20 are bundled together through a bundling sleeve 60, with the first ends of the multiple wires 20 exposed beyond a first designed distance from the bundling sleeve 60. Sufficient length is reserved for the first heat-fusion sleeve 30 and the welding pins 11 of the wires 20. Since the position of the first heat-fusion sleeve 30 is adjustable, it can be slid during welding until its end contacts the bundling sleeve 60, thus preventing the first heat-fusion sleeve 30 from affecting the welding between the pins 11 and the wire core 22. After welding is completed, the first hot melt sleeve 30 is slid so that the welding area of ​​the pin 11 and the wire core 22 is covered by the first hot melt sleeve 30. However, the first hot melt sleeve 30 is at least partially covered on the wire sheath 21, so that the first hot melt sleeve 30 is always present between adjacent wires 20. This ensures that after the first heat treatment, the first hot melt sleeve 30 melts and can fill the gap between the wire sheath 21 of the wire 20, as well as the gap between the wire core 22, further ensuring that there are no gaps between the wires 20 and ensuring that the joint between the wire 20 and the pin 11 has good sealing performance.

[0052] Therefore, the parallel bushing 60 can serve to bundle and fix multiple conductors 20, and can also limit the sliding area of ​​the first heat-fusion bushing 30, without the need for additional limiting of the first heat-fusion bushing 30.

[0053] Optionally, the parallel bushing 60 also has heat-shrink properties. One parallel bushing 60 is fitted over multiple conductors 20. Heating the parallel bushing 60 causes it to shrink, thus fixing the multiple conductors 20 together.

[0054] This application provides several different embodiments for step S102, which involves correspondingly connecting the multiple pins 11 of the thermistor 10 to the wire cores 22 of the multiple wires 20, such that a portion of the overlapping area between the wire core 22 and the pin 11 is located within the corresponding first thermoplastic sleeve 30. These embodiments are detailed below: In the first embodiment, step S102 above, which involves connecting the plurality of pins 11 of the thermistor 10 to the cores 22 of the plurality of wires 20 one by one, such that a portion of the overlapping area between the core 22 and the pin 11 is located within the corresponding first thermoplastic sleeve 30, includes the following steps: The wire core 22 includes a stranded multi-core wire. The ends of the multiple pins 11 of the thermistor 10 are inserted one by one into the wire core 22 of the multiple conductors 20, so that the pins 11 and the wire core 22 are twisted together. A portion of the twisted area of ​​the wire core 22 and the pins 11 is fixed in the corresponding first heat-fusion sleeve 30, and the other portion is exposed in the first heat-fusion sleeve 30.

[0055] Optionally, a schematic diagram showing the structure after inserting the ends of the multiple pins 11 of the thermistor 10 one by one into the cores 22 of the multiple wires 20 is shown below. Figures 4-5 As shown, Figure 5 for Figure 4 A partial cross-sectional schematic diagram.

[0056] In this embodiment, the wire core 22 is a stranded multi-core wire, and the thermistor 10 includes a resistor and a pin 11. During soldering, the end of the pin 11 away from the thermistor 10 is inserted into the multi-core wire. The multi-core wire can fix the pin 11. The insertion of the pin 11 causes the multi-core wire to expand. The first hot melt sleeve 30 wraps the multi-core wire inside and plays a fixing role.

[0057] Then, the area where pin 11 and wire core 22 are twisted together is soldered, which can improve the reliability of the soldering process and eliminate the need for additional fixtures to fix pin 11 and wire core 22, thus saving costs.

[0058] In some embodiments, based on the core 22 being a stranded multi-core wire, along the extension direction of the pin 11, the end of the pin 11 is located inside the core 22 exposed by the wire sheath 21.

[0059] In this embodiment, the pin 11 is relatively short and is inserted into the wire core 22, but not into the wire sheath 21. The wire sheath 21 wraps around the wire core 22, which limits the expansion size of the wire core 22. The short pin 11 prevents the wire sheath 21 from being damaged due to insertion, thus improving the feasibility of soldering.

[0060] In the second embodiment, step S102 above, which involves connecting the plurality of pins 11 of the thermistor 10 to the cores 22 of the plurality of wires 20 one by one, such that a portion of the overlapping area between the core 22 and the pin 11 is located within the corresponding first thermoplastic sleeve 30, includes the following steps: like Figure 10 As shown, the wire core 22 includes a single-core wire, and the multiple pins 11 of the thermistor 10 are connected one-to-one to the surface of the wire core 22 of the multiple conductors 20, so that part of the connection area between the wire core 22 and the pin 11 is located inside the corresponding first heat-fusion sleeve 30, and the other part is exposed outside the first heat-fusion sleeve 30.

[0061] Optionally, a schematic diagram of the structure after inserting one end of pin 11 into the first thermoplastic sleeve 30 is shown below. Figure 10 As shown.

[0062] In this embodiment, the wire core 22 is a single-core wire, and the pin 11 overlaps with the single-core wire. The first heat-fusion sleeve 30 wraps around part of the overlap area between the pin 11 and the single-core wire. The first heat-fusion sleeve 30 serves to fill the gap and also to fix the pin 11. This embodiment also eliminates the need for other fixtures to fix the pin 11 and the wire core 22, thus saving costs.

[0063] Optionally, pin 11 is only connected to the wire core 22 to avoid the pin 11 being too long and connecting to the wire sheath 21, which would cause gaps between pin 11 and wire core 22 and affect the subsequent soldering effect.

[0064] In some embodiments, the welding of the wire core 22 and the lead 11 exposed in another overlapping area of ​​the first hot melt sleeve 30 in step S102 above includes the following steps: The positions of pin 11 and wire core 22 are fixed by high-temperature electric welding, and then the solder joint between pin 11 and wire core 22 is reinforced by laser welding to form a welding area.

[0065] Optionally, a schematic diagram of the structure after the second thermoplastic sleeve 40 is applied to the thermistor 10 and the welding area between the pin 11 and the wire core 22 is shown below. Figure 6 As shown.

[0066] In some embodiments, the sliding of the first hot melt sleeve 30 in step S103 above, such that the first hot melt sleeve 30 covers the welding area, and a second hot melt sleeve 40 is placed over the thermistor 10, with the ends of the second hot melt sleeve 40 contacting or overlapping with those of the first hot melt sleeve 30, includes the following steps: Slide the first heat-fusion sleeve 30 so that the first heat-fusion sleeve 30 outside the multiple wires 20 is flush, and part of the first heat-fusion sleeve 30 is sleeved outside the wire sheath 21 of the wire 20, and the other part is sleeved outside the welding area.

[0067] A second thermoplastic sleeve 40, with its first end closed and its second end open, is fitted over the thermistor 10.

[0068] The second heat-fusion sleeve 40 contacts the end of the first heat-fusion sleeve 30 that is close to each other, or the second end of the second heat-fusion sleeve 40 accommodates the first ends of a plurality of first heat-fusion sleeves 30.

[0069] In this embodiment, after soldering the pin 11 and the corresponding wire core 22 of the wire 20, the first heat-fusion sleeve 30 is slid so that the first end of the first heat-fusion sleeve 30 on each wire 20 is flush and covers the soldering area. Then, a second heat-fusion sleeve 40 is fitted onto the thermistor 10 so that the second end of the second heat-fusion sleeve 40 contacts or overlaps with the first end of the first heat-fusion sleeve 30. The second end of the second heat-fusion sleeve 40 accommodates the first ends of multiple first heat-fusion sleeves 30, meaning that the second end of the second heat-fusion sleeve 40 partially overlaps with the first ends of multiple first heat-fusion sleeves 30. This allows for a tighter fusion between the first heat-fusion sleeves 30 and the second heat-fusion sleeve 40 during the subsequent first heat treatment.

[0070] Alternatively, please refer to Figures 2-10In this embodiment, all steps are performed in a vertical position. For example, the wire 20 is first fixed so that its first end is vertical. Then, a first heat-fusion sleeve 30 is fitted onto the wire 20, and the pin 11 and the wire core 22 of the wire 20 are soldered together. A second heat-fusion sleeve 40 is then fitted onto the thermistor 10. Therefore, under the action of gravity, the second heat-fusion sleeve 40 contacts the first heat-fusion sleeve 30, and its first end abuts against the head of the thermistor 10.

[0071] Optionally, a schematic diagram of the structure after heat shrink tubing 50 is installed over the second heat fusion sleeve 40 and the first heat fusion sleeve 30 is shown below. Figure 7 As shown in the diagram, the structure after the first heat treatment is as follows: Figure 8 As shown.

[0072] In some embodiments, a heat-shrinkable sleeve 50 is fitted over the second heat-fusion sleeve 40 and the first heat-fusion sleeve 30 for a first heat treatment, including: A heat shrinkable sleeve 50 is provided over the second heat fusion sleeve 40 and the first heat fusion sleeve 30; both the first and second ends of the heat shrinkable sleeve 50 are open, and the second end of the heat shrinkable sleeve 50 extends beyond the second end of the first heat fusion sleeve 30.

[0073] A first heat treatment is performed to fuse the second heat-fusion sleeve 40 with the multiple first heat-fusion sleeves 30 into a heat-fusion layer 70, and the heat-shrink sleeve 50 shrinks to cover the heat-fusion layer 70 inside.

[0074] In this embodiment, the second heat-melt sleeve 40 and the first heat-melt sleeve 30 melt to form a fluid hot melt adhesive. The second end of the heat-shrink sleeve 50 extends beyond the second end of the first heat-melt sleeve 30, causing part of the melted hot melt adhesive to overflow downwards, approaching the second end of the heat-shrink sleeve 50. This makes the second end of the heat-shrink sleeve 50 flush with the hot melt adhesive, eliminating the need for trimming. Furthermore, both the first and second ends of the heat-shrink sleeve 50 are open, facilitating the escape of air bubbles within the heat-shrink sleeve 50, reducing the presence of air bubbles, and further improving the sealing performance.

[0075] Considering that the opening section of the first end of the first heat-fusion sleeve 30 may not be neat enough and may have an uneven surface, when the second end of the second heat-fusion sleeve 40 contacts the first ends of the plurality of first heat-fusion sleeves 30, there may be incomplete contact, resulting in gaps between the second end of the second heat-fusion sleeve 40 and the first ends of the plurality of first heat-fusion sleeves 30. Therefore, in some embodiments, during the first heat treatment process, the first heat-fusion sleeve 30 is at least partially located in the direction of gravity of the second heat-fusion sleeve 40.

[0076] In this embodiment, the first heat-fusion sleeve 30 is at least partially located in the direction of gravity of the second heat-fusion sleeve 40. During the first heat treatment, the second heat-fusion sleeve 40 melts and flows downward, so that the gap between the second end of the second heat-fusion sleeve 40 and the first ends of the plurality of first heat-fusion sleeves 30 is filled, thereby further improving the contact reliability between the first heat-fusion sleeve 30 and the second heat-fusion sleeve 40.

[0077] In some embodiments, the length of the exposed core 22 of the wire sheath 21 is less than the length of the wire sheath 21 covered by the heat-fused layer 70.

[0078] The length of the first heat-fusion sleeve 30 is less than the length of the wire sheath 21 between the first end of the conductor 20 and the parallel sleeve 60.

[0079] In this embodiment, the length of the core 22 is shorter than the length of the sheath 21 covered by the heat-fusion layer 70. That is, between the first end of the conductor 20 and the parallel sleeve 60, the exposed core 22 is shorter, while the sheath 21 is longer. This results in a larger contact area between the heat-fusion layer 70 and the sheath 21, improving the reliability of the heat-fusion layer 70 in sealing the gap between the sheaths 21. Furthermore, the length of the first heat-fusion sleeve 30 is less than the length of the sheath 21 between the first end of the conductor 20 and the parallel sleeve 60. This allows the first heat-fusion sleeve 30 to slide on the sheath 21 before the first heat treatment. For example, when welding the pin 11 and the core 22, the first heat-fusion sleeve 30 can be slid to the parallel sleeve 60, providing adequate space for overlapping the pin 11 and the core 22 and preventing the first heat-fusion sleeve 30 from affecting the overlapping process. For example, after welding, multiple first hot melt sleeves 30 are slid flat to make it easier for the second hot melt sleeve 40 to be installed later to contact multiple first hot melt sleeves 30, ensuring that the joint between the first hot melt sleeve 30 and the second hot melt sleeve 40 is seamless after the first heat treatment, forming a complete integrated hot melt layer 70.

[0080] Considering that the sheath 21 of the conductor 20 is generally made of Teflon, gaps can easily exist when Teflon is bonded to other materials. Therefore, this application also provides an embodiment: the first heat-fusion sleeve 30, the second heat-fusion sleeve 40, and the heat-shrink sleeve 50 are all made of Teflon. The Teflon conductor and the first and second Teflon heat-fusion sleeves 30 and 40, as well as the first and second Teflon heat-fusion sleeves 30 and 40 and the heat-shrink sleeve 50, can be fused together at the interface, resulting in a tight bond.

[0081] In some embodiments, the first heat-fusion sleeve 30, the second heat-fusion sleeve 40, and the heat-shrink sleeve 50 have different melting points. During the first heat treatment, the first heat-fusion sleeve 30 and the second heat-fusion sleeve 40 can be melted, but not enough to melt the heat-shrink sleeve 50. Instead, the heat-shrink sleeve 50 will only shrink.

[0082] In some embodiments, in the method for manufacturing the temperature sensor of this application, in step S104, a heat-shrinkable sleeve 50 is fitted over the second heat-fusion sleeve 40 and the first heat-fusion sleeve 30, and a first heat treatment is performed to fuse the second heat-fusion sleeve 40 and the plurality of first heat-fusion sleeves 30 into a heat-fusion layer 70. The heat-shrinkable sleeve 50 shrinks, and the inner surface of the heat-shrinkable sleeve 50 fuses with the heat-fusion layer 70 to form a temperature sensor, including the following steps: A heat-shrinkable sleeve 50 is placed over the second heat-fusion sleeve 40 and the first heat-fusion sleeve 30, and a first heat treatment is performed to make the second heat-fusion sleeve 40 and the multiple first heat-fusion sleeves 30 fuse into a heat-fusion layer 70. The heat-shrinkable sleeve 50 shrinks, and the inner surface of the heat-shrinkable sleeve 50 fuses with the heat-fusion layer 70. Then, an outer shell 90 is placed over the heat-shrinkable sleeve 50, and an adhesive layer 80 is injected between the heat-shrinkable sleeve 50 and the outer shell 90 to obtain a temperature sensor.

[0083] Optionally, a structural diagram of the 90s generation with an outer shell is shown below. Figure 9 As shown.

[0084] Based on the same inventive concept, this application provides a temperature sensor manufactured by a method for manufacturing a temperature sensor as provided in any of the foregoing embodiments, comprising: a thermistor 10, a heat-fusion layer 70, a heat-shrinkable sleeve 50, and a plurality of wires 20.

[0085] The multiple pins 11 of the thermistor 10 are soldered one-to-one with the wire cores 22 of the multiple wires 20.

[0086] The hot melt layer 70 covers the thermistor 10, the welding area of ​​the multiple pins 11 of the thermistor 10 and the multiple wires 20, and the partial wire sheath 21 of each of the multiple wires 20.

[0087] The heat shrink tubing 50 covers the outside of the heat fusion layer 70.

[0088] In this embodiment, the temperature sensor is manufactured using the same manufacturing method as described in any of the preceding embodiments. Its technical principles and effects are similar to those described above and will not be repeated here. In this embodiment, the heat-fused layer 70 is encased within the heat-shrinkable sleeve 50. The heat-fused layer 70 and the inner surface of the heat-shrinkable sleeve 50 are fused together, adhering tightly to each other and providing excellent sealing. Furthermore, the heat-fused layer 70 fills the gaps between the multiple wires 20, the gaps between the multiple wire cores 22, the space between the thermistor 10 and the heat-shrinkable sleeve 50, and the space between the multiple wires 20 and the heat-shrinkable sleeve 50. This ensures the temperature sensor has excellent sealing properties, resisting the corrosion of moisture and salt, thereby improving the reliability and lifespan of the temperature sensor and ensuring the reliability of the charging system, thermal management circuit, and other systems.

[0089] By applying the embodiments of this application, at least the following beneficial effects can be achieved: (1) In this embodiment of the application, a first hot melt sleeve 30 is provided outside each wire 20, and a second hot melt sleeve 40 is provided outside the thermistor 10 and at the welding point between the pin 11 and the wire core 22. After the first heat treatment, the hot melt layer 70 formed by the first hot melt sleeve 30 and the second hot melt sleeve 40 can fill the gap between multiple wires 20 and can also completely cover the joint between the wire 20 and the thermistor 10. This can improve the sealing of the joint between the wire 20 and the thermistor 10, and prevent moisture, salt and other substances from entering the temperature sensor through the wire 20. This can improve the reliability and service life of the temperature sensor and ensure the reliability of the charging system, thermal management circuit and other systems.

[0090] (2) Considering that there are gaps between different wire cores 22, and that the gaps are closer to the wire sheath 21 of the conductor 20, the risk of moisture and other substances penetrating is relatively high, which affects the welding area between the wire core 22 and the pin 11, and thus affects the reliability of the electrical connection between the wire core 22 and the pin 11. Therefore, in this embodiment, the first heat-fusion sleeve 30 is partially sleeved outside the welding area between the pin 11 and the wire core 22, which can completely cover the welding area and fill the gaps between the wire cores 22 of the multiple conductors 20, further improving the sealing performance and ensuring the reliability of the electrical connection.

[0091] (3) In the embodiments of this application, the parallel sleeve 60 can play the role of binding and fixing multiple wires 20, and can also limit the sliding area of ​​the first heat-fusion sleeve 30, without the need to limit the first heat-fusion sleeve 30.

[0092] (4) The core 22 is a stranded multi-core wire. The thermistor 10 includes a resistor and a pin 11. When soldering, the end of the pin 11 away from the thermistor 10 is inserted into the multi-core wire. The multi-core wire can fix the pin 11. The insertion of the pin 11 causes the multi-core wire to expand. The first hot melt sleeve 30 wraps the multi-core wire inside and plays a fixing role.

[0093] (5) The second end of the second heat-melting sleeve 40 accommodates the first ends of the multiple first heat-melting sleeves 30, that is, the second end of the second heat-melting sleeve 40 partially overlaps with the first ends of the multiple first heat-melting sleeves 30. During the subsequent first heat treatment, the fusion between the first heat-melting sleeves 30 and the second heat-melting sleeve 40 can be made tighter.

[0094] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for manufacturing a temperature sensor, characterized in that, include: A first heat-fusion sleeve is respectively fitted onto the surface of the sheath of multiple conductors. The first heat-fusion sleeve is configured to be slidably fitted onto the corresponding conductor, and the core of the first end of the conductor is exposed outside the sheath. Multiple pins of the thermistor are connected to the cores of multiple wires one by one, and a portion of the overlap area between the core and the pin is located inside the corresponding first hot melt sleeve. The other part of the overlap area between the core and the pin exposed in the first hot melt sleeve is welded to form a welded area. Slide the first hot melt sleeve so that the first hot melt sleeve covers the welding area, and place the second hot melt sleeve on the thermistor, with the ends of the second hot melt sleeve and the first hot melt sleeve close to each other in contact or overlap. A heat-shrinkable sleeve is applied over the second heat-fusion sleeve and the first heat-fusion sleeve, and a first heat treatment is performed to fuse the second heat-fusion sleeve and multiple first heat-fusion sleeves into a single heat-fusion layer. The heat-shrinkable sleeve shrinks, and the inner surface of the heat-shrinkable sleeve fuses with the heat-fusion layer to form the temperature sensor.

2. The manufacturing method according to claim 1, characterized in that, A first heat-fusion sleeve is respectively fitted onto the surface of the insulation of multiple conductors, including: A parallel bushing is fitted over a plurality of wires that are in contact with each other and whose first ends are flush. The parallel bushing has a first design distance from the first end of the wires. A second heat treatment is performed to shrink the parallel bushing and fix the plurality of wires. Multiple first heat-fusion sleeves are respectively fitted over the first ends of the multiple conductors, with the first end of the first heat-fusion sleeve close to the first end of the conductor and the second end of the first heat-fusion sleeve close to the parallel sleeve. When the second end of the first heat-fusion sleeve contacts the parallel sleeve, the conductor core is at least partially exposed in the first heat-fusion sleeve.

3. The manufacturing method according to claim 1, characterized in that, The thermistor's multiple pins are connected one-to-one with the cores of the multiple wires, such that a portion of the connection area between the core and the pin is located within the corresponding first thermoplastic sleeve, including: The wire core includes a stranded multi-core wire. The ends of multiple pins of the thermistor are inserted one by one into the wire cores of multiple wires, so that the pins are stranded with the wire cores, and a portion of the stranded area of ​​the wire cores and the pins is fixed in the corresponding first heat-fusion sleeve, while the other portion is exposed in the first heat-fusion sleeve.

4. The manufacturing method according to claim 3, characterized in that, Along the extension direction of the pin, the end of the pin is located inside the exposed core of the wire sheath.

5. The manufacturing method according to claim 1, characterized in that, The thermistor's multiple pins are connected one-to-one with the cores of the multiple wires, such that a portion of the connection area between the core and the pin is located within the corresponding first thermoplastic sleeve, including: The wire core includes a single-core wire, and the multiple pins of the thermistor are connected one-to-one to the surface of the wire core of the multiple wires, such that part of the connection area between the wire core and the pin is located inside the corresponding first heat-fusion sleeve, and the other part is exposed outside the first heat-fusion sleeve.

6. The manufacturing method according to claim 1, characterized in that, Sliding the first hot-melt sleeve so that it covers the welding area, and then placing a second hot-melt sleeve over the thermistor, wherein the ends of the second hot-melt sleeve and the first hot-melt sleeve that are close to each other contact or overlap, including: Slide the first hot melt sleeve so that the first hot melt sleeves outside the plurality of wires are flush, and a part of the first hot melt sleeve is sleeved outside the wire sheath of the wire, and another part is sleeved outside the welding area. The second heat-fusion sleeve, which is closed at the first end and open at the second end, is fitted over the thermistor. The second heat-fusion sleeve contacts the ends of the first heat-fusion sleeve that are close to each other, or the second end of the second heat-fusion sleeve accommodates the first ends of a plurality of the first heat-fusion sleeves.

7. The manufacturing method according to claim 1, characterized in that, A heat-shrinkable sleeve is fitted over the second heat-fusion sleeve and the first heat-fusion sleeve, and a first heat treatment is performed, including: A heat shrinkable sleeve is provided over the second heat fusion sleeve and the first heat fusion sleeve; both the first and second ends of the heat shrinkable sleeve are open, and the second end of the heat shrinkable sleeve extends beyond the second end of the first heat fusion sleeve. A first heat treatment is performed to fuse the second heat-fusion sleeve with a plurality of first heat-fusion sleeves into a heat-fusion layer, and the heat-shrinkable sleeve shrinks to cover the heat-fusion layer inside.

8. The manufacturing method according to claim 1, characterized in that, During the first heat treatment process, the first heat-melting sleeve is at least partially located in the direction of gravity of the second heat-melting sleeve.

9. The manufacturing method according to claim 2, characterized in that, The length of the exposed core of the wire is less than the length of the wire sheath covered by the hot melt layer; The length of the first heat-fusion sleeve is less than the length of the wire insulation between the first end of the conductor and the parallel sleeve.

10. A temperature sensor manufactured by a method for manufacturing a temperature sensor as described in any one of claims 1-9, characterized in that, include: Thermistor, heat-fusion layer, heat-shrink tubing, and multiple wires; The multiple pins of the thermistor are soldered one-to-one with the cores of the multiple wires; The hot melt layer covers the thermistor, the welding area of ​​the multiple pins of the thermistor and the multiple wires, and a portion of the insulation of each of the multiple wires; The heat shrink tubing covers the outside of the heat-fused layer.

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