Vertical spatial multiplexing packaged array high-frequency optoelectronic device

Abstract

The invention provides a vertical spatial multiplexing packaged array high-frequency optoelectronic device, and relates to the technical field of photoelectrons. The array high-frequency optoelectronic device comprises a packaging tube shell, wherein a plurality of platforms for mounting chips are arranged in the packaging tube shell; the plurality of high-frequency photoelectron chips are mounted on the plurality of platforms; the plurality of high-frequency packaging structures are in one-to-one correspondence with and are connected with the plurality of high-frequency photoelectron chips; the plurality of low-frequency packaging structures are in one-to-one correspondence with and are connected with the plurality of high-frequency photoelectron chips; the plurality of optical packaging structures are in one-to-one correspondence with the plurality of high-frequency optoelectronic chips and are connected with the high-frequency optoelectronic chips; wherein the high-frequency packaging structure and the low-frequency packaging structure are located at different vertical heights in the vertical space. According to the array high-frequency optoelectronic device, the high-frequency circuit and the low-frequency circuit are arranged in a layered mode, the high-frequency circuit and the low-frequency circuit are placed at different vertical positions, spatial multiplexing is achieved, and the problem of spatial interference of the high-frequency circuit, the low-frequency circuit and an optical path of the array high-frequency optoelectronic device can be solved.

Description

Technical Field

[0001] This disclosure relates to the field of optoelectronic technology, and in particular to an array high-frequency optoelectronic device with vertical spatial multiplexing packaging. Background Technology

[0002] With the development of optoelectronic technology driven by current information technology advancements, optoelectronic devices are evolving towards higher bandwidth, array-based designs, and miniaturization. To enable optoelectronic chips to perform better and be applied in real-world scenarios, they require electrical, optical, thermal, and mechanical structural support to encapsulate them into stable devices. This necessitates further development of optoelectronic device packaging technology.

[0003] For high-frequency optoelectronic devices such as electro-optic modulators and photodetectors, high-frequency packaging structures, low-frequency packaging structures, and optical packaging structures are required. When array packaging is involved, the high-frequency, low-frequency, and optical packaging structures of each channel will interfere with each other in spatial position, making it difficult to achieve effective packaging. Summary of the Invention

[0004] In view of the above problems, embodiments of this disclosure provide an array of high-frequency optoelectronic devices with vertical spatial multiplexing packaging.

[0005] One aspect of this disclosure provides a vertically spaced multiplexed array of high-frequency optoelectronic devices, comprising: a package housing with multiple platforms for mounting chips disposed within the package housing; multiple high-frequency optoelectronic chips mounted on the multiple platforms; multiple high-frequency package structures corresponding one-to-one with and connected to the multiple high-frequency optoelectronic chips for input or output connection of high-frequency microwave signals; multiple low-frequency package structures corresponding one-to-one with and connected to the multiple high-frequency optoelectronic chips for input or output connection of low-frequency microwave signals; and multiple optical package structures corresponding one-to-one with and connected to the multiple high-frequency optoelectronic chips for input or output of optical signals; wherein the high-frequency package structures and the low-frequency package structures are located at different vertical heights in vertical space.

[0006] According to embodiments of this disclosure, multiple high-frequency optoelectronic chips form an array structure.

[0007] According to embodiments of this disclosure, slots are provided between multiple platforms, and multiple low-frequency packaging structures are installed in the slots.

[0008] According to embodiments of this disclosure, each of the plurality of platforms is provided with a recess, and a plurality of low-frequency packaging structures are mounted on the recess.

[0009] According to embodiments of this disclosure, multiple low-frequency packaging structures are located above or below the plane containing multiple high-frequency optoelectronic chips.

[0010] According to embodiments of this disclosure, multiple high-frequency optoelectronic chips and multiple low-frequency package structures are interconnected across layers via gold wires, gold strips, or solder.

[0011] According to embodiments of this disclosure, multiple high-frequency optoelectronic chips are connected to multiple high-frequency package structures via gold wires, gold ribbons, or solder.

[0012] According to embodiments of this disclosure, the high-frequency optoelectronic chip is fixed to the low-frequency packaging structure via a mechanical support structure.

[0013] According to embodiments of this disclosure, the array high-frequency optoelectronic device with vertical space multiplexing packaging further includes: a metal carrier for supporting at least one of a plurality of high-frequency optoelectronic chips, a plurality of high-frequency packaging structures, a plurality of low-frequency packaging structures, and a plurality of optical packaging structures.

[0014] According to embodiments of this disclosure, the package housing, multiple high-frequency optoelectronic chips, multiple high-frequency package structures, multiple low-frequency package structures, and multiple optical package structures are fixed together by adhesive or solder.

[0015] This disclosure achieves spatial multiplexing by arranging high-frequency and low-frequency circuits in layers and placing them at different vertical positions, thereby solving the problem of spatial interference between high-frequency circuits, low-frequency circuits, and optical paths in array high-frequency optoelectronic devices. Attached Figure Description

[0016] The foregoing contents, as well as other objects, features, and advantages of this disclosure, will become clearer from the following description of embodiments with reference to the accompanying drawings, in which:

[0017] Figure 1 A schematic diagram illustrates the structure of an array of high-frequency optoelectronic devices in a vertically spaced multiplexed package according to a first embodiment of the present disclosure;

[0018] Figure 2 A schematic diagram of the platform according to a first embodiment of the present disclosure is shown.

[0019] Figure 3 A schematic diagram illustrates the structure of an array of high-frequency optoelectronic devices in a vertically spaced multiplexed package according to a second embodiment of the present disclosure;

[0020] Figure 4 A schematic diagram of the platform according to a second embodiment of the present disclosure is shown.

[0021] [Explanation of Labels in the Attached Image]

[0022] 1-Package housing; 11-Platform; 12-Gap; 13-Boss. 2-High-frequency optoelectronic chip; 3-High-frequency packaging structure; 4-Low-frequency packaging structure; 5-Optical packaging structure. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this disclosure clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0024] It should be noted that similar or identical parts are referred to by the same reference numerals in the accompanying drawings or description. The technical features of the various embodiments exemplified in the specification can be freely combined to form new solutions without conflict. Furthermore, each claim can stand alone as an embodiment, or the technical features in the various claims can be combined to form new embodiments. In the drawings, the shape or thickness of the embodiments may be enlarged and indicated in a simplified or convenient manner. Moreover, elements or implementations not shown or described in the drawings are those known to those skilled in the art. Additionally, although this document provides examples of parameters containing specific values, it should be understood that the parameters need not be exactly equal to the corresponding values, but can approximate the corresponding values ​​within acceptable error tolerances or design constraints.

[0025] Unless there are technical obstacles or contradictions, the various embodiments described above in this disclosure can be freely combined to form other embodiments, all of which are within the protection scope of this disclosure.

[0026] Although this disclosure has been described in conjunction with the accompanying drawings, the embodiments disclosed in the drawings are intended to illustrate preferred embodiments of this disclosure and should not be construed as limiting the disclosure. The dimensions in the drawings are merely illustrative and should not be construed as limiting the disclosure.

[0027] While some embodiments of the general concept of this disclosure have been shown and described, those skilled in the art will understand that changes may be made to these embodiments without departing from the principles and spirit of the general concept of this disclosure, the scope of which is defined by the claims and their equivalents.

[0028] Figure 1 The diagram schematically illustrates the structure of an array of high-frequency optoelectronic devices in a vertically spaced multiplexed package according to a first embodiment of the present disclosure. Figure 2 A schematic diagram of the platform according to a first embodiment of the present disclosure is shown.

[0029] like Figure 1 and Figure 2As shown, the first embodiment of this disclosure provides a vertically spaced multiplexed array high-frequency optoelectronic device, comprising: a package shell 1, wherein multiple platforms 11 for mounting chips are disposed within the package shell 1; multiple high-frequency optoelectronic chips 2, mounted on the multiple platforms 11; multiple high-frequency package structures 3, corresponding one-to-one with and connected to the multiple high-frequency optoelectronic chips 2, for realizing input or output connection of high-frequency microwave signals; multiple low-frequency package structures 4, corresponding one-to-one with and connected to the multiple high-frequency optoelectronic chips 2, for realizing input or output connection of low-frequency microwave signals; and multiple optical package structures 5, corresponding one-to-one with and connected to the multiple high-frequency optoelectronic chips 2, for realizing input or output of optical signals; wherein the high-frequency package structures 3 and the low-frequency package structures 4 are located at different vertical heights in vertical space.

[0030] In this embodiment, multiple high-frequency optoelectronic chips 2 form an array structure.

[0031] By integrating multiple high-frequency optoelectronic chips 2 into an array within a package 1, this device can simultaneously process multiple optical and electrical signals, thereby significantly improving the system's total data throughput and transmission capacity. This arrayed structure is the core supporting modern high-speed optical communication (such as data center interconnection and coherent transmission) and parallel sensing applications, highlighting the necessity and superiority of vertical spatial multiplexing packaging technology. It effectively solves the problems of high-frequency, low-frequency, and optical path layout congestion and mutual interference that are drastically aggravated by chip arraying, ensuring that the performance of each channel in the array can approach the optimal level of a single channel, and avoiding performance degradation caused by integration.

[0032] In this embodiment, a slot 12 is provided between multiple platforms 11, and multiple low-frequency packaging structures 4 are installed in the slot 12.

[0033] This embodiment achieves an efficient and reliable space reuse scheme by setting up slots 12 between the high-frequency optoelectronic chip mounting platforms 11 and using them to mount the low-frequency packaging structure 4. Its technical effects are mainly reflected in two aspects: First, it creates a physically "sunken" space, naturally placing low-frequency circuits (such as DC bias lines and control lines) below the main plane where the high-frequency circuits and optical paths are located, achieving true vertical layering. This provides a clean, unobstructed layout space for high-frequency transmission lines and optical coupling components on the main plane, effectively reducing the parallel trace length between high-frequency and low-frequency signals, thereby reducing electromagnetic coupling and crosstalk. Second, integrating low-frequency components using the slot structure helps maintain the compactness and mechanical strength of the overall package shell 1. Simultaneously, this integrated design facilitates better thermal management, as the slot area can serve as part of the heat dissipation path, improving the overall reliability of the package.

[0034] In this embodiment, multiple low-frequency packaging structures 4 are located below the plane containing multiple high-frequency optoelectronic chips 2.

[0035] In this embodiment, there is a one-to-one correspondence between multiple high-frequency optoelectronic chips 2 and multiple low-frequency packaging structures 4, and the multiple high-frequency optoelectronic chips 2 and multiple low-frequency packaging structures 4 are connected across layers by gold wires, gold strips or solder.

[0036] In this embodiment, there is a one-to-one correspondence between multiple high-frequency optoelectronic chips 2 and multiple high-frequency packaging structures 3, and the multiple high-frequency optoelectronic chips 2 and multiple high-frequency packaging structures 3 are connected by gold wires, gold strips or solder.

[0037] Using gold wire, gold strip, or solder for connections ensures good conductivity and mechanical stability. By carefully designing the paths and geometries of these vertical interconnects, it is possible to ensure that low-frequency signals can be transmitted to the chip stably and with low loss, while avoiding unnecessary electromagnetic interference from these interconnect structures to nearby high-frequency transmission lines.

[0038] In this embodiment, the high-frequency optoelectronic chip 2 is fixed to the low-frequency packaging structure 4 by a mechanical support structure.

[0039] In this embodiment, the array high-frequency optoelectronic device with vertical space multiplexing packaging further includes: a metal carrier for supporting at least one of multiple high-frequency optoelectronic chips 2, multiple high-frequency packaging structures 3, multiple low-frequency packaging structures 4, and multiple optical packaging structures 5.

[0040] In this embodiment, the encapsulation shell 1, multiple high-frequency optoelectronic chips 2, multiple high-frequency encapsulation structures 3, multiple low-frequency encapsulation structures 4, and multiple optical encapsulation structures 5 are fixed together by adhesive or solder.

[0041] Figure 3 A schematic diagram of an array of high-frequency optoelectronic devices in a vertically spaced multiplexed package according to a second embodiment of the present disclosure is shown. Figure 4 A schematic diagram of the platform according to a second embodiment of the present disclosure is shown.

[0042] like Figure 3 and Figure 4As shown, the second embodiment of this disclosure provides a vertically spaced multiplexed array high-frequency optoelectronic device, comprising: a package shell 1, wherein multiple platforms 11 for mounting chips are disposed within the package shell 1; multiple high-frequency optoelectronic chips 2, mounted on the multiple platforms 11; multiple high-frequency package structures 3, connected to the multiple high-frequency optoelectronic chips 2, for realizing input or output connection of high-frequency microwave signals; multiple low-frequency package structures 4, connected to the multiple high-frequency optoelectronic chips 2, for realizing input or output connection of low-frequency microwave signals; and multiple optical package structures 5, corresponding one-to-one with the multiple high-frequency optoelectronic chips 2, for realizing input or output of optical signals; wherein the high-frequency package structures 3 and the low-frequency package structures 4 are located at different vertical heights in vertical space.

[0043] In this embodiment, each of the multiple platforms 11 is provided with a recess 13, and multiple low-frequency packaging structures 4 are mounted on the recess 13.

[0044] This embodiment provides a refined local space management solution by mounting the low-frequency packaging structure 4 on each platform 11 using recessed platforms 13. Its technical advantage lies in achieving close-range, modular, co-located integration of low-frequency circuits and high-frequency optoelectronic chips. By placing the low-frequency structure within the recessed platforms 13, its top surface can be flush with or slightly lower than the chip mounting surface, thus freeing up valuable space in the vertical direction for high-frequency or optical components, avoiding structural conflicts, and improving the consistency of packaging manufacturing.

[0045] In this embodiment, multiple low-frequency packaging structures 4 are located above the plane containing multiple high-frequency optoelectronic chips 2.

[0046] It should be noted that the details not covered in the second embodiment are similar to those in the first embodiment. Please refer to the first embodiment for further details, which will not be repeated here.

[0047] The core technical achievement of this disclosure lies in fundamentally solving the multi-physics space competition problem in the packaging of arrayed high-frequency optoelectronic devices through a "vertical space reuse" architecture. Specifically, by layering the high-frequency packaging structure 3 and the low-frequency packaging structure 4 vertically, the limitations of side-by-side arrangement in traditional planar packaging are broken, greatly freeing up space resources on the two-dimensional plane. This allows for the planning of dedicated physical spaces that do not interfere with each other for the high-frequency signal path, low-frequency signal path, and optical signal path of each channel within the limited volume of the package 1, providing a feasible technical path for achieving higher channel counts, smaller size, and higher performance.

[0048] It should be understood that the specific order or hierarchy of steps in the disclosed process is an example of an exemplary method. Based on design preferences, it should be understood that the specific order or hierarchy of steps in the process may be rearranged without departing from the scope of this disclosure. The appended method claims provide elements of various steps in an exemplary order and are not intended to limit the scope to a specific order or hierarchy.

[0049] It should also be noted that the directional terms mentioned in the embodiments, such as "up," "down," "front," "back," "left," and "right," are only for reference to the directions in the accompanying drawings and are not intended to limit the scope of protection of this disclosure. Throughout the drawings, the same elements are represented by the same or similar reference numerals. Conventional structures or constructions will be omitted when they may cause confusion in understanding this disclosure. Furthermore, the shapes, sizes, and positional relationships of the components in the drawings do not reflect their actual size, scale, or actual positional relationships.

[0050] In the detailed description above, various features are combined together in a single embodiment to simplify this disclosure. This approach to disclosure should not be construed as reflecting an intention that embodiments of the claimed subject matter require more features than are explicitly stated in each claim. Rather, as reflected in the appended claims, this disclosure is in a state of having fewer features than all of the features of the single disclosed embodiment. Therefore, the appended claims are hereby explicitly incorporated into the detailed description, with each claim representing a separate preferred embodiment of this disclosure.

[0051] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this disclosure, "a plurality of" means at least two, such as two, three, etc., unless otherwise expressly specified. The term "comprising" as used in the specification or claims is interpreted in a manner similar to the term "including," as "including" is used as a conjunction in the claims. The use of any term "or" in the specification or claims is intended to mean "non-exclusive or."

[0052] The specific embodiments described above further illustrate the purpose, technical solutions, and beneficial effects of this disclosure. It should be understood that the above descriptions are merely specific embodiments of this disclosure and are not intended to limit this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the protection scope of this disclosure.

Claims

1. A vertically spaced multiplexed array high-frequency optoelectronic device, characterized in that, include: A package (1) is provided inside the package (1) for mounting chips. Multiple high-frequency optoelectronic chips (2) are mounted on the multiple platforms (11); Multiple high-frequency packaging structures (3) correspond one-to-one with the multiple high-frequency optoelectronic chips (2) and are connected to realize the input or output connection of high-frequency microwave signals; Multiple low-frequency packaging structures (4) correspond one-to-one with and are connected to the multiple high-frequency optoelectronic chips (2) to realize the input or output connection of low-frequency microwave signals; Multiple optical packaging structures (5) correspond one-to-one with and are connected to the multiple high-frequency optoelectronic chips (2) to realize the input or output of optical signals; The high-frequency packaging structure (3) and the low-frequency packaging structure (4) are located at different vertical heights in the vertical space.

2. The array high-frequency optoelectronic device with vertical spatial multiplexing packaging according to claim 1, characterized in that, The multiple high-frequency optoelectronic chips (2) form an array structure.

3. The array high-frequency optoelectronic device with vertical spatial multiplexing packaging according to claim 1, characterized in that, A slot (12) is provided between the multiple platforms (11), and the multiple low-frequency packaging structures (4) are installed in the slot (12).

4. The array high-frequency optoelectronic device with vertical spatial multiplexing packaging according to claim 1, characterized in that, Each of the plurality of platforms (11) is provided with a recess (13), and the plurality of low-frequency packaging structures (4) are mounted on the recess (13).

5. The array high-frequency optoelectronic device with vertical spatial multiplexing packaging according to claim 1, characterized in that, The plurality of low-frequency packaging structures (4) are located above or below the plane on which the plurality of high-frequency optoelectronic chips (2) are located.

6. The array high-frequency optoelectronic device with vertical spatial multiplexing packaging according to claim 1, characterized in that, The multiple high-frequency optoelectronic chips (2) and the multiple low-frequency packaging structures (4) are connected across layers by gold wires, gold strips or solder.

7. The array high-frequency optoelectronic device with vertical spatial multiplexing packaging according to claim 1, characterized in that, The plurality of high-frequency optoelectronic chips (2) are connected to the plurality of high-frequency packaging structures (3) by gold wire, gold strip or solder.

8. The array high-frequency optoelectronic device with vertical spatial multiplexing packaging according to claim 1, characterized in that, The high-frequency optoelectronic chip (2) is fixed to the low-frequency packaging structure by a mechanical support structure.

9. The array high-frequency optoelectronic device with vertical spatial multiplexing packaging according to claim 1, characterized in that, The vertically spaced multiplexed array high-frequency optoelectronic device also includes: A metal carrier is used to support at least one of the plurality of high-frequency optoelectronic chips (2), the plurality of high-frequency packaging structures (3), the plurality of low-frequency packaging structures (4), and the plurality of optical packaging structures (5).

10. The array high-frequency optoelectronic device with vertical spatial multiplexing packaging according to claim 1, characterized in that, The encapsulation shell (1), the plurality of high-frequency optoelectronic chips (2), the plurality of high-frequency encapsulation structures (3), the plurality of low-frequency encapsulation structures (4), and the plurality of optical encapsulation structures (5) are fixed together by adhesive or solder.

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