A method and system for repairing mapping of a DRAM grain using a two-dimensional code

Abstract

This invention relates to the field of semiconductor memory repair technology, specifically a QR code encoding method and system for DRAM chip repair mapping. It includes: determining the total number of blocks and the allowable number of damaged blocks; setting encoding rules containing block status information and verification information; testing the chip under test to identify the location of damaged blocks; generating repair data according to the encoding rules and calculating the check byte using extended Hamming code; converting the encoded information into a QR code and laser-printing it on the chip surface; scanning and reading the code on the production line for verification and error correction, automatically correcting single-bit errors, prompting rescanning for double-bit errors, and writing the data to the storage area; and reading the repair data from the storage area during application, performing verification and error correction again, and executing block mapping. This invention ensures reliable transmission of repair data through a two-stage error correction protection mechanism, significantly improving chip utilization.

Description

Technical Field

[0001] This invention relates to the field of semiconductor memory repair technology, specifically to a QR code encoding method and system for DRAM chip repair mapping. Background Technology

[0002] Chip marking technology uses methods such as lasers to create permanent markings on product surfaces. Its core objective is to achieve high precision, high durability, and markings containing critical information. This technology is widely used in the semiconductor industry and is of great significance for chip traceability management and functional repair.

[0003] As chip areas shrink, the surface area of ​​packaged DRAM chips also decreases, limiting the area available for laser printing. More detailed and larger the repair data, the higher the repair rate; however, large data volumes lead to excessively small individual code elements in QR codes. Since the chip surface is typically black, small code elements result in unclear images and difficulty in recognition. Furthermore, during scanning and data transmission, photoelectric conversion errors and electromagnetic interference can easily cause data errors, affecting the accuracy of the repair information. In existing technologies, the chip surface is typically only printed with basic information such as serial numbers, lacking repair data content. This results in a large number of chips with partial failures being unusable and scrapped. Summary of the Invention

[0004] This invention provides a QR code encoding method and system for DRAM chip repair mapping, which solves the problems of limited chip surface space and easy data transmission errors, and improves chip utilization.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] This invention provides a QR code encoding method for DRAM chip repair mapping, comprising:

[0007] S100: Determine the total number of DRAM chips, the number of allowed damaged blocks, and set encoding rules that include block status information and verification information;

[0008] S200: Tests the DRAM chip under test and identifies the location of damaged blocks;

[0009] S300: Based on the encoding rules and the identified damaged block locations, generate repair data and use extended Hamming code to calculate the check byte for the repair data;

[0010] S400: Convert the encoded information containing repair data and verification bytes into a QR code, and print the QR code on the surface of the DRAM chip using a laser;

[0011] S500: On the production line, a barcode scanner reads the QR code on the surface of the DRAM chip, verifies and corrects the read data. When a single-bit error is detected, it automatically corrects the error and writes it to the storage area. When a double-bit error is detected, it prompts the user to scan the barcode again until the correct data is obtained and written to the storage area.

[0012] S600: When applying the application, read the repair data from the storage area, verify and correct the repair data, and perform block mapping based on the corrected repair data.

[0013] As a preferred embodiment of the present invention, the encoding rules include:

[0014] The first byte indicates the total number of blocks;

[0015] The second byte indicates the number of allowed corrupted blocks;

[0016] The third byte to the Nth byte constitute the block status byte group, and each bit in the block status byte group corresponds to the status of a block;

[0017] The (N+1)th byte is the check byte.

[0018] As a preferred embodiment of the present invention, each bit in the block status byte group uses a binary representation to indicate the pass or fail status of the corresponding block.

[0019] As a preferred embodiment of the present invention, the extended Hamming code is SECDED encoding.

[0020] As a preferred embodiment of the present invention, the step of calculating the check byte for the repair data using extended Hamming code includes:

[0021] Extended Hamming code encoding is performed on the first byte to the Nth byte to generate the check byte.

[0022] As a preferred embodiment of the present invention, the step of performing block mapping based on the corrected repair data includes:

[0023] Parse the block status byte group in the corrected and repaired data to determine the status of each block;

[0024] Identify the location of the failed block based on the block status;

[0025] Access to invalid blocks will be blocked or redirected during address access.

[0026] The present invention also includes a QR code encoding system for DRAM chip repair mapping, comprising:

[0027] The rule definition module is used to determine the total number of DRAM chips, the number of allowed corrupted blocks, and to set encoding rules that include block status information and verification information;

[0028] The defect detection module is used to test the DRAM chip under test and identify the location of damaged blocks;

[0029] The data encoding module is used to generate repair data according to the encoding rules and the identified damaged block locations, and to calculate the check bytes for the repair data using extended Hamming code.

[0030] A laser marking module is used to convert encoded information containing repair data and verification bytes into a QR code, and to print the QR code on the surface of DRAM particles using a laser.

[0031] The barcode scanning and writing module is used to read the QR code on the surface of DRAM chips through barcode scanning equipment on the production line, and to verify and correct the read data. When a single-bit error is detected, it automatically corrects the error and writes it to the storage area. When a double-bit error is detected, it prompts the user to scan the barcode again until the correct data is obtained and written to the storage area.

[0032] The mapping and repair module is used to read repair data from the storage area during application, verify and correct the repair data, and perform block mapping based on the corrected repair data.

[0033] The present invention also includes a computer device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor, when executing the computer program, implements the above-described QR code encoding method for DRAM chip repair mapping.

[0034] The present invention also includes a readable storage medium storing a computer program, which, when executed by a processor, implements the above-described QR code encoding method for DRAM chip repair mapping.

[0035] The beneficial effects of this invention are:

[0036] 1. This invention effectively controls the amount of repair data by designing a compact encoding structure that includes block state byte groups and check bytes, enabling QR codes to be clearly printed and recognized on limited particle surfaces, thus resolving the contradiction between limited surface space and the integrity of repair information.

[0037] 2. This invention employs SECDED extended Hamming code to perform verification and error correction in both the scanning and writing and running / reading stages, constructing a dual error protection mechanism to specifically address photoelectric conversion errors and electromagnetic interference errors, ensuring reliable transmission of repaired data throughout the entire process.

[0038] 3. This invention records the repair data on the particle surface in the form of a QR code and combines it with two-stage error correction protection, so that DRAM particles that were originally scrapped due to partial block failure can be put back into use through block mapping technology, which significantly improves particle utilization and economic value. Attached Figure Description

[0039] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0040] Figure 1 This is a flowchart illustrating a QR code encoding method for DRAM chip repair mapping according to the present invention.

[0041] Figure 2 This is a schematic diagram of the structure of a DRAM chip repair mapping QR code encoding system according to the present invention;

[0042] Figure 3 This is a schematic diagram of the DRAM chip test results of the present invention;

[0043] Figure 4 This is the data encoding table for repair in this invention;

[0044] Figure 5 This is a QR code identification image on the surface of the particles of this invention;

[0045] Figure 6 This is a physical image of the PCBA board of this invention. Detailed Implementation

[0046] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0047] Example 1: As Figure 1 As shown, the present invention provides a QR code encoding method for DRAM chip repair mapping, comprising:

[0048] S100: Determine the total number of DRAM chips, the number of allowed damaged blocks, and set encoding rules that include block status information and verification information;

[0049] Furthermore, the encoding rules include:

[0050] The first byte indicates the total number of blocks;

[0051] The second byte indicates the number of allowed corrupted blocks;

[0052] The third byte to the Nth byte constitute the block status byte group, and each bit in the block status byte group corresponds to the status of a block;

[0053] The (N+1)th byte is the check byte.

[0054] Furthermore, each bit in the block status byte group uses a binary value to represent the pass or fail status of the corresponding block.

[0055] Specifically, in order to rationally plan the data structure of the mapping table and balance the amount of data written with the effective repair rate, the encoding rules set by this invention adopt the following byte structure:

[0056] Byte0 (first byte): The total number of blocks, i.e., the total number of blocks in the DRAM chip.

[0057] Byte1 (second byte): How many blocks are allowed to be corrupted, i.e., records the number of allowed corrupted blocks.

[0058] Bytes 2 to Byte N (3rd byte to Nth byte): These constitute the block status byte group, totaling N-1 bytes, recording the pass / fail status of each block. Each bit in the block status byte group represents the status of a block, using a binary representation: 0 = pass, 1 = fail. In the block status mapping, block numbering starts from 1. Bit 0 in the block status byte group corresponds to Block 1, bit 1 corresponds to Block 2, bit 2 corresponds to Block 3, and so on.

[0059] ByteN+1 (N+1th byte): This is a check byte, generated by performing SECDED (Extended Hamming Code) encoding on Byte0 to ByteN. This check byte can correct any 1-bit error and detect any 2-bit error.

[0060] The entire encoded data structure contains a total of N+1 bytes.

[0061] The above encoding rules allow for a flexible definition of the supported number of repairable codes, enabling the mapped QR codes to be clearly and easily read by barcode scanners and written to the storage area. This data structure design ensures the integrity of the repair information while controlling the data volume, avoiding problems such as unclear images and difficulty in recognition due to excessively small individual QR code elements.

[0062] S200: Tests the DRAM chip under test and identifies the location of damaged blocks;

[0063] Specifically, the DRAM chip under test is placed on an FT (Final Test) machine for testing. The test program performs functional tests on each block of the chip to identify the location of defective blocks. During the test, each block is read and write verified, and blocks that fail the test are marked as damaged blocks, and their location information is recorded.

[0064] Through FT testing, complete block status information of the particle under test can be obtained, including which blocks are passed and which blocks are failed, providing a basis for the generation of subsequent repair data.

[0065] S300: Based on the encoding rules and the identified damaged block locations, generate repair data and use extended Hamming code to calculate the check byte for the repair data;

[0066] Furthermore, the extended Hamming code is SECDED encoding.

[0067] Furthermore, the step of calculating the check byte for the repair data using extended Hamming code includes:

[0068] Extended Hamming code encoding is performed on the first byte to the Nth byte to generate the check byte.

[0069] Specifically, based on the encoding rules set in step S100 and combined with the damaged block location information identified in step S200, repair data is generated in the following manner:

[0070] First, fill the total number of blocks into the first byte (Byte0), and fill the allowed number of corrupted blocks into the second byte (Byte1).

[0071] Then, based on the identified locations of damaged blocks, a block status byte group (Byte2 to ByteN) is constructed. In the block status byte group, each bit corresponds to the status of a block. The bit corresponding to the block that passed the test is set to 0, and the bit corresponding to the damaged block is set to 1.

[0072] Next, extended Hamming code is used to calculate the check byte for the repaired data. Specifically, the extended Hamming code is SECDED (single error correction, double error detection) encoding. The steps for calculating the check byte include: taking the first byte to the Nth byte (Byte0 to ByteN) as data bits, performing SECDED encoding on these data bits to generate the check byte, and filling the check byte into the (N+1)th byte (ByteN+1).

[0073] SECDED encoding achieves single-bit error correction and double-bit error detection by calculating multiple parity bits. For data bits containing multiple bytes, they are expanded bit by bit, with position numbers starting from 1 and increasing sequentially. The parity bit calculation is based on the Hamming code principle, with each parity bit covering a specific data bit position:

[0074] The check bit P1 covers all data bits whose bitwise AND operation with 0x01 results in true.

[0075] The check bit P2 covers all data bits whose bitwise AND operation with 0x02 results in true.

[0076] The check bit P4 covers all data bits whose bitwise AND operation with 0x04 results in true.

[0077] The check bit P8 covers all data bits whose bitwise AND operation with 0x08 results in true.

[0078] The check bit P16 covers all data bits whose bitwise AND operation with 0x10 results in true.

[0079] The check bit P32 covers all data bits whose bitwise AND operation with 0x20 results in true.

[0080] The parity bit P0 is the total parity bit, and an XOR operation is performed on all data bits and the above 6 parity bits P1, P2, P4, P8, P16, and P32.

[0081] The value of each parity bit is the result of an XOR operation on all the data bits it covers. The calculated parity bits are then assembled into a parity byte.

[0082] During the error correction phase, the six Hamming parity bits P1, P2, P4, P8, P16, and P32 are recalculated on the received data. The calculated result is XORed with the corresponding parity bit received to obtain the syndrome. The error type is determined by combining the syndrome with the total parity bit: if the syndrome is 0 and the total parity check passes, there is no error; if the syndrome is not 0 and the total parity check fails, it is a single-bit error, and the value of the syndrome indicates the position of the error bit, which can be corrected by flipping the bit; if the syndrome is not 0 but the total parity check passes, it is a double-bit error, which can only be detected but not corrected.

[0083] The generated check byte can correct any 1-bit error and detect any 2-bit error during subsequent data transmission and reading, providing reliable error protection for data repair.

[0084] At this point, the complete repair data encoding has been generated, containing a total of N+1 bytes.

[0085] S400: Convert the encoded information containing repair data and verification bytes into a QR code, and print the QR code on the surface of the DRAM chip using a laser;

[0086] Specifically, the complete repair data encoding generated in step S300 (including the first byte to the N+1th byte, i.e., Byte0 to ByteN+1) is converted into a QR code format. The QR code encoding uses a standard QR code generation algorithm to convert the repair data encoding into a visual QR code pattern.

[0087] Then, the QR code is printed on the surface of the DRAM chip using laser marking technology. Laser marking utilizes a high-energy-density laser beam to perform micron-level engraving or annealing on the chip surface, forming recessed or color-changing marks. This technology features non-contact processing, no consumables, and high contrast, enabling the formation of permanent, clearly identifiable markings on the chip surface.

[0088] During the laser marking process, parameters such as laser energy density and average power are adjusted to ensure a clear QR code pattern is formed on the surface of the DRAM chip. Because the encoding rules used in this invention effectively control the amount of data, the individual code element size of the QR code is moderate. Even when the chip surface is black, the laser-printed QR code image maintains sufficient clarity, facilitating subsequent recognition and reading by scanning devices.

[0089] By printing repair data QR codes on the particle surface using lasers, the unused area of ​​the particle surface is fully utilized to record repair information, providing a reliable repair data carrier for subsequent production and application stages.

[0090] S500: On the production line, a barcode scanner reads the QR code on the surface of the DRAM chip, verifies and corrects the read data. When a single-bit error is detected, it automatically corrects the error and writes it to the storage area. When a double-bit error is detected, it prompts the user to scan the barcode again until the correct data is obtained and written to the storage area.

[0091] Specifically, after the DRAM chips are mounted onto the PCB to form a PCBA, a barcode scanning station is set up on the production line to use a barcode scanning device (such as a barcode scanner) to read the repair data QR code on the surface of the DRAM chips.

[0092] The scanning device reads QR code information through photoelectric conversion, obtaining complete encoded data containing repair data and verification bytes. Since the scanning process is done remotely, errors may occur during photoelectric conversion; therefore, the read data needs to be verified and corrected.

[0093] Specifically, the check byte (ByteN+1) is used to perform a SECDED check on the read bytes from the first byte to the Nth byte (Byte0 to ByteN). The check process is as follows:

[0094] When a single-bit error is detected, the error correction function of SECDED locates the position of the erroneous bit based on the check byte, flips the bit (from 0 to 1 or 1 to 0), and automatically corrects the error. The corrected data is then written to the storage area. The entire error correction process is imperceptible to the user.

[0095] When a double-bit error is detected, the error detection function of SECDED identifies that there is an error in the data being read but it cannot be automatically corrected. At this time, the scanning interface will display a message such as "scanning error" or a similar error message, prompting the user to scan the code a second time. The above verification and error correction process is repeated until the correct data is read and successfully written to the storage area.

[0096] Through the above verification and error correction mechanisms, data errors caused by factors such as photoelectric conversion, insufficient laser printing, or incorrect scanning light during the scanning process are effectively addressed, ensuring that the repaired data written to the storage area is accurate.

[0097] S600: When applying the application, read the repair data from the storage area, verify and correct the repair data, and perform block mapping based on the corrected repair data.

[0098] Furthermore, the step of performing block mapping based on the corrected repair data includes:

[0099] Parse the block status byte group in the corrected and repaired data to determine the status of each block;

[0100] Identify the location of the failed block based on the block status;

[0101] Access to invalid blocks will be blocked or redirected during address access.

[0102] Specifically, after the motherboard is powered on normally, the SOC (System on Chip) reads the repair data from the storage area. Due to the potential impact of electromagnetic interference or voltage fluctuations during the reading process, the read data may contain errors, so the repair data needs to be verified and corrected again.

[0103] Specifically, the check byte (ByteN+1) is used to perform a SECDED check on the read bytes from the first byte to the Nth byte (Byte0 to ByteN). The check process is similar to step S500.

[0104] When a single-bit error is detected, the error correction function of SECDED locates the position of the erroneous bit based on the check byte, flips the bit, and automatically corrects the error, turning the data into correct data without the user's awareness.

[0105] When a double-bit error is detected, SECDED's error detection function identifies that the data being read contains an error that cannot be automatically corrected. At this point, a message such as "data read error" or similar error message is displayed via serial port or other means, prompting the user to rescan the code and write the correct data to the storage area.

[0106] After verification and error correction are completed, block mapping is performed based on the corrected and repaired data. The block mapping steps include:

[0107] First, the block status byte group (Byte2 to ByteN) in the corrected repair data is parsed to determine the status of each block. By reading each bit in the block status byte group, it is identified which blocks are passed (bit=0) and which blocks are invalid (bit=1).

[0108] Then, the location of the failed block is identified based on the block status. Blocks with a bit set to 1 in the block status byte group are marked as failed blocks, and their location information is recorded.

[0109] Finally, during address access, access to failed blocks will be masked or redirected. When a system access address is mapped to a failed block, the access will be masked through the block mapping mechanism, or the access will be redirected to other available blocks, thereby avoiding the use of failed blocks and achieving the repair of DRAM chips.

[0110] Through the above verification, error correction, and block mapping process, the bit error problems caused by electromagnetic interference or voltage fluctuations during operation are effectively addressed, ensuring the accurate execution of the repair mapping and enabling DRAM chips with faulty blocks to be used normally.

[0111] Example 2:

[0112] During DRAM chip manufacturing, due to process defects or material issues, some chips may experience individual block failures. These chips are typically deemed scrap and discarded, resulting in significant economic losses. As chip areas shrink, the surface area of ​​packaged chips also decreases. Therefore, how to record and repair data within this limited surface space while ensuring data reliability during transmission and retrieval has become a key technical challenge for improving chip utilization.

[0113] This embodiment addresses the aforementioned problems by employing a QR code encoding method and system for DRAM chip repair mapping according to the present invention. For example... Figure 2As shown, the system includes a rule definition module, a defect detection module, a data encoding module, a laser marking module, a barcode scanning and writing module, and a mapping and repair module. The technical solution of this invention is illustrated below through specific examples.

[0114] Part 1: Testing and Coding Process Demonstration

[0115] A 4GB DRAM chip uses an 8-block partitioning pattern, allowing a maximum of 2 blocks to fail.

[0116] The rule definition module determines that the total number of blocks for this particle is 8, and the allowed number of damaged blocks is 2. The encoding rules are set as follows: Byte0 = 0x08 (total number of blocks); Byte1 = 0x02 (allowed number of damaged blocks); Byte2: 8 bits corresponding to the status of 8 blocks; Byte3: check byte (SECDED encoding).

[0117] like Figure 3 As shown, the defect detection module tests multiple particles in the FT test. For particle #1, Block 2 was found to be faulty (marked in red), while the remaining blocks passed; for particle #2, Block 7 was found to be faulty (marked in red), while the remaining blocks passed. The data encoding module generates repair data based on the test results.

[0118] like Figure 4 As shown, for particle #1, the failed block is Block 2, the Total Block Fail is 1, and the generated complete repair data code is: 08 02 02 00 38. For particle #2, the failed block is Block 7, the Total Block Fail is 1, and the generated complete repair data code is: 08 02 40 00 32.

[0119] like Figure 5 As shown, the laser marking module converts the aforementioned repair data into a QR code and prints it on the surface of the DRAM chip. Due to the reasonable control of the encoded data volume and the appropriate QR code size, it can be clearly identified even on a black package surface.

[0120] like Figure 6 As shown, DRAM chips are mounted onto a PCB to form a PCBA. On the production line, a barcode scanning module reads the QR code on the surface of the chip using a barcode scanning device.

[0121] To further illustrate the two-stage error correction protection mechanism of the present invention, the following demonstration is conducted using a hypothetical scenario.

[0122] Suppose the repair data encoding for a certain particle is 0802020038. During the scanning process, due to photoelectric conversion error, a single-bit error occurs in Byte 0, and the actual read data becomes: 1802020038 (erroneous data). The scanning and writing module uses the check byte 0x38 for SECDED verification, detects the single-bit error, locates the error position, automatically flips the bit to correct it, restoring the correct data: 0802020038, and then writes it to the storage area. The entire error correction process is imperceptible to the user.

[0123] Assuming the repair data encoding for another particle is 0802400032, during scanning, due to insufficient laser printing or incorrect scanning light, the actual data read is 1812400032 (Byte0 and Byte1 each have a 1-bit error, for a total of 2 bits of error). The scanning and writing module detects the double-bit error via SECDED and displays "Scanning error" on the scanning interface, requiring the operator to rescan until the correct data is read and written to the storage area.

[0124] After the motherboard powers on, the mapping and repair module reads the repair data from the storage area. Suppose that when reading repair data encoded as 0802020038, due to electromagnetic interference, a single-bit error occurs in Byte 0, and the read data becomes: 1802020038. The mapping and repair module uses the check byte 0x38 to perform a SECDED check again, detects the single-bit error, and automatically corrects it, restoring the correct data: 0802020038, without the user noticing.

[0125] Then, the mapping repair module parses the repair data: the total number of blocks is 8, and the allowed number of damaged blocks is 2. Taking the code 0802020038 as an example, byte2 is parsed as 0x02, which is 00000010 in binary, with bit 1 being 1, indicating that Block 2 is faulty. Since the actual number of damaged blocks (1) does not exceed the allowed value (2), the DRAM chip can be repaired and used. When accessing addresses, the mapping repair module will block or redirect access to Block 2, thereby avoiding the faulty block and enabling the DRAM chip to work normally.

[0126] As demonstrated in this embodiment, the present invention utilizes the unused surface area of ​​particles to record repair information by laser-printing repair data QR codes on the particle surface, thus restoring previously unusable particles to usable state. SECDED encoding is used to generate verification bytes, and verification and error correction are performed in both the scanning and mapping repair stages. This effectively addresses data error issues caused by factors such as photoelectric conversion, laser printing clarity, electromagnetic interference, and voltage fluctuations, ensuring reliable transmission and accurate execution of repair data. This encoding structure features small data volume and strong fault tolerance, making the QR codes easy to print clearly and identify on the particle surface. Single-bit errors are automatically corrected without the user's awareness, while double-bit errors are detected promptly and prompt for reoperation, significantly improving particle utilization and generating considerable economic value.

[0127] Example 3

[0128] In the third embodiment of the present invention, based on the same inventive concept, the present invention proposes a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the steps of a QR code encoding method for DRAM chip repair mapping as described in the above embodiment.

[0129] Example 4

[0130] In the fourth embodiment of the present invention, based on the same inventive concept, a computer device is proposed, comprising: a processor and a memory; the processor and the memory communicate with each other; the memory is used to store instructions; the processor is used to execute the instructions in the memory to execute a QR code encoding method for DRAM chip repair mapping according to the above embodiment.

[0131] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A QR code encoding method for DRAM chip repair mapping, characterized in that, include: S100: Determine the total number of DRAM chips, the number of allowed damaged blocks, and set encoding rules that include block status information and verification information; S200: Tests the DRAM chip under test and identifies the location of damaged blocks; S300: Based on the encoding rules and the identified damaged block locations, generate repair data and use extended Hamming code to calculate the check byte for the repair data; S400: Convert the encoded information containing repair data and verification bytes into a QR code, and print the QR code on the surface of the DRAM chip using a laser; S500: On the production line, a barcode scanner reads the QR code on the surface of the DRAM chip, verifies and corrects the read data. When a single-bit error is detected, it automatically corrects the error and writes it to the storage area. When a double-bit error is detected, it prompts the user to scan the barcode again until the correct data is obtained and written to the storage area. S600: When applying the application, read the repair data from the storage area, verify and correct the repair data, and perform block mapping based on the corrected repair data; The encoding rules include: The first byte indicates the total number of blocks; The second byte indicates the number of allowed corrupted blocks; The third byte to the Nth byte constitute the block status byte group, and each bit in the block status byte group corresponds to the status of a block; The (N+1)th byte is the check byte; The extended Hamming code is SECDED encoding; The step of calculating the check byte for the repaired data using extended Hamming code includes: Extended Hamming code encoding is performed on the first byte to the Nth byte to generate the check byte.

2. The QR code encoding method for DRAM chip repair mapping according to claim 1, characterized in that, Each bit in the block status byte group uses a binary value to represent the pass or fail status of the corresponding block.

3. The QR code encoding method for DRAM chip repair mapping according to claim 1, characterized in that, The step of performing block mapping based on the corrected repair data includes: Parse the block status byte group in the corrected and repaired data to determine the status of each block; Identify the location of the failed block based on the block status; Access to invalid blocks will be blocked or redirected during address access.

4. A QR code encoding system for DRAM chip repair mapping, characterized in that, The system is used to execute a QR code encoding method for DRAM chip repair mapping according to any one of claims 1-3, the system comprising: The rule definition module is used to determine the total number of DRAM chips, the number of allowed corrupted blocks, and to set encoding rules that include block status information and verification information; The defect detection module is used to test the DRAM chip under test and identify the location of damaged blocks; The data encoding module is used to generate repair data according to the encoding rules and the identified damaged block locations, and to calculate the check bytes for the repair data using extended Hamming code. A laser marking module is used to convert encoded information containing repair data and verification bytes into a QR code, and to print the QR code on the surface of DRAM particles using a laser. The barcode scanning and writing module is used to read the QR code on the surface of DRAM chips through barcode scanning equipment on the production line, and to verify and correct the read data. When a single-bit error is detected, it automatically corrects the error and writes it to the storage area. When a double-bit error is detected, it prompts the user to scan the barcode again until the correct data is obtained and written to the storage area. The mapping and repair module is used to read repair data from the storage area during application, verify and correct the repair data, and perform block mapping based on the corrected repair data.

5. A computer device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements a QR code encoding method for DRAM chip repair mapping as described in any one of claims 1 to 3.

6. A readable storage medium, characterized in that, The readable storage medium stores a computer program, which, when executed by a processor, implements a QR code encoding method for DRAM chip repair mapping as described in any one of claims 1 to 3.

Images