Heat-conducting cooling device for epoxy curing agent production

Abstract

This invention relates to the field of epoxy curing agent production technology, and discloses a heat-conducting and cooling device for epoxy curing agent production, including a reaction vessel and a temperature control device. The reaction vessel has a top cover with an openable / closable inlet, and a bottom outlet that can be opened / closed. The temperature control device includes a temperature control chamber and a heat-conducting pipe. The heat-conducting pipe is disposed inside the reaction vessel to achieve direct contact with the material, and both ends of the heat-conducting pipe penetrate the side wall of the reaction vessel and are connected to the temperature control chamber. The temperature control chamber is used to control the temperature of the heat-conducting pipe. This invention addresses the technical problem in related technologies where heat transfer through multiple layers is inefficient, and excessive cooling affects the reaction effect during epoxy curing agent production.

Description

Technical Field

[0001] This invention relates to the field of epoxy curing agent production technology, and in particular to a heat-conducting and cooling device for epoxy curing agent production. Background Technology

[0002] In the current production of epoxy curing agents, the reaction releases a large amount of heat. Traditional jacketed or coil-type external cooling devices have problems such as low thermal conductivity, slow response speed and poor temperature control accuracy because heat needs to be transferred through multiple layers of the container wall. This makes it difficult to dissipate the reaction heat in time, which can easily cause local overheating or uncontrolled reaction. At the same time, if excessive cooling is carried out in pursuit of cooling effect, it will affect the optimal process temperature required for the reaction, which will restrict product quality and production efficiency. Summary of the Invention

[0003] This application discloses a heat-conducting and cooling device for epoxy curing agent production, in order to solve the technical problem in the related art that during the production of epoxy curing agents, the heat transfer efficiency is low due to multiple layers, and excessive cooling affects the reaction effect.

[0004] To solve the above problems, the present invention adopts the following technical solution:

[0005] A heat-conducting cooling device for epoxy curing agent production, comprising:

[0006] The reaction vessel has a top cover with an openable and closable inlet and an openable and closable outlet at the bottom.

[0007] The temperature control device includes a temperature control chamber and a heat conduction pipe. The heat conduction pipe is installed inside the reaction vessel to achieve direct contact with the material. Both ends of the heat conduction pipe penetrate the side wall of the reaction vessel and are connected to the temperature control chamber.

[0008] The temperature control box is used to control the temperature of the heat pipe.

[0009] Optionally, the heat pipe has a serpentine structure that winds around the inner wall of the reaction vessel, with gaps reserved between adjacent vertical sections of the heat pipe.

[0010] Optionally, the reaction vessel is also equipped with a stirring device, which includes a motor, a rotating shaft, and a stirring section; the motor is fixed to the top cover; one end of the rotating shaft is connected to the drive shaft of the motor, and the other end passes through the top cover and extends into the interior of the reaction vessel to be connected to the stirring section; the stirring section can rotate with the rotating shaft to drive the material to fully contact the heat-conducting pipe.

[0011] Optionally, the stirring section includes a retainer and several rotating plates; the retainer includes several support rods arranged around the rotating shaft, and a rotating shaft vertically fixed to one end of the support rods away from the rotating shaft; the rotating plates are circumferentially sleeved on the rotating shaft and can rotate around the axis of the rotating shaft, and the rotating plates are adapted to be embedded in the gap between adjacent vertical pipe sections of the heat-conducting pipe.

[0012] Optionally, the temperature control chamber is also equipped with a drive unit, and a heat-conducting medium is provided inside the temperature control chamber; the drive unit is used to drive the heat-conducting medium to move along the heat-conducting pipe.

[0013] The heat transfer medium is driven by the drive unit to enter from one end of the heat transfer pipe. The heat generated by the material reaction is absorbed by the heat transfer medium, which then flows back to the temperature control box from the other end of the heat transfer pipe.

[0014] Optionally, the temperature control box is equipped with a refrigeration device, including a refrigeration unit and refrigeration pipes. The refrigeration pipes are immersed in the heat-conducting medium inside the temperature control box, and both ends of the refrigeration pipes are connected to the refrigeration unit to realize refrigerant circulation.

[0015] Optionally, the temperature control chamber is also equipped with a temperature sensor, the sensing end of which is in contact with the heat transfer medium to monitor the temperature of the heat transfer medium in real time.

[0016] Optionally, the drive unit includes a liquid storage cylinder, a liquid transfer device, and a conduit. The liquid storage cylinder is connected to the temperature control box and the heat transfer pipe through the conduit. The liquid transfer device is used to transfer the heat transfer medium between the liquid storage cylinder, the temperature control box, and the heat transfer pipe.

[0017] Optionally, the pipetting device includes a third support frame, a hydraulic telescopic rod, and a push plate; the third support frame is fixed to the top of the liquid storage cylinder, the hydraulic telescopic rod is installed on the third support frame, the push plate is fixed to the movable end of the hydraulic telescopic rod and slides against the inner wall of the liquid storage cylinder; a sealing device is provided at the contact point between the edge of the push plate and the inner wall of the liquid storage cylinder.

[0018] Optionally, a control valve is installed on the conduit to control the flow direction and flow rate of the heat transfer medium.

[0019] The technical solution adopted in this invention can achieve the following beneficial effects:

[0020] 1. The present invention provides a heat-conducting and cooling device for epoxy curing agent production. By directly placing a serpentine heat-conducting pipe into the interior of the reaction vessel to contact the material, the huge thermal resistance caused by the container wall in the traditional external cooling method is eliminated, and an efficient direct heat exchange channel is established, so that heat can be carried away quickly and directly, significantly improving cooling efficiency and response speed.

[0021] 2. The stirring device, especially its unique design in which the rotating plate is embedded in the gap of the serpentine heat-conducting pipe, can further enhance the flowability of materials at different locations while achieving uniform mixing of the materials. This allows materials in all parts to flow over the surface of the heat-conducting pipe, greatly enhancing the heat transfer process, ensuring uniform temperature of the reaction system, and preventing the generation of local hot spots.

[0022] 3. The circulating heat transfer medium is precisely cooled and monitored by an independent temperature control box equipped with a refrigeration unit and a temperature sensor, achieving closed-loop precise control of the reaction system temperature. The system can adjust the cooling power according to real-time temperature feedback to ensure that the reaction takes place within the optimal process temperature window, avoiding heat accumulation and preventing the adverse effects of excessive cooling on reaction kinetics.

[0023] 4. A special drive unit consisting of a storage tank and a hydraulically driven pipetting device is used to temporarily store the hot medium that has absorbed heat from the reactor in the storage tank, while simultaneously pumping the cooled medium from the temperature control box into the reactor. This design achieves physical separation and synchronous continuous operation of the heat absorption and cooling processes, avoiding direct mixing of hot and cold media, resulting in more stable system operation, lower energy consumption, and higher reliability. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the overall structure disclosed in some embodiments of this application;

[0026] Figure 2 It is attached Figure 1 Sectional view at point aa;

[0027] Figure 3 It is attached Figure 2 Enlarged view of point A in the middle;

[0028] Figure 4 It is attached Figure 2 Enlarged view at point B in the middle;

[0029] Figure 5 It is attached Figure 1 Sectional view at point bb;

[0030] Figure 6 It is attached Figure 5 Enlarged view at point C;

[0031] Figure 7 This is a schematic diagram of the internal structure of the reaction vessel after the top cover has been removed.

[0032] In the diagram: 101-Reaction vessel, 102-Top cover, 103-Inlet, 104-First mounting bracket, 105-Motor, 106-First support bracket, 107-Outlet, 108-Discharge valve, 109-Rotating shaft, 110-Retainer, 111-Rotating plate, 112-Heat pipe, 113-Fixed bracket, 201-Temperature control box, 202-Refrigerator, 203-Refrigeration pipe, 204-Second support bracket, 205-Conduit, 206-Control valve, 301-Liquid storage tank, 302-Second mounting bracket, 303-Hydraulic telescopic rod, 304-Push plate, 305-Third support bracket. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be described in detail below. Obviously, the described embodiments are merely some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0034] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0035] Because heat transfer through multiple layers during epoxy curing agent production is inefficient and excessive cooling can affect the reaction, this application provides a heat pipe 112 with an internally circulating heat transfer medium. By placing the heat pipe 112 inside the reaction vessel 101, the material can directly contact the heat pipe 112, avoiding multiple layers of heat transfer and enhancing heat transfer efficiency. Furthermore, an external temperature control box 201 is provided to regulate the temperature of the heat transfer medium and prevent excessive cooling from affecting the reaction.

[0036] The following is in conjunction with the appendix Figures 1 to 4 The present application provides a detailed description of a heat-conducting and cooling device for epoxy curing agent production through specific embodiments and application scenarios.

[0037] like Figure 1As shown, a heat-conducting and cooling device for epoxy curing agent production includes a reaction container 101 and a temperature control device. The reaction container 101 is a sealed cavity with a top cover 102 fixedly installed on its top. The top cover 102 has an openable or closable feed port 103 for feeding in the raw materials for epoxy curing agent production. The bottom of the reaction container 101 has an openable or closable discharge port 107 for discharging the finished product after production, thereby realizing the feeding and discharging of the production process.

[0038] The temperature control device includes a temperature control chamber 201 and a heat pipe 112. The heat pipe 112 is directly installed inside the reaction vessel 101, allowing it to directly contact the production materials inside the vessel and avoid multi-layer heat transfer. Both ends of the heat pipe 112 penetrate the side wall of the reaction vessel 101 and are connected to the internal cavity of the temperature control chamber 201. The temperature control chamber 201 can achieve precise control of the temperature of the heat pipe 112 by adjusting the state of the internal heat transfer medium.

[0039] During the epoxy curing agent production stage, the raw materials are fed into the reaction vessel 101 through the feed inlet 103 and undergo a chemical reaction. The large amount of heat generated during the reaction can be directly transferred to the heat conduction pipe 112 in contact with it. The temperature control box 201 adjusts the temperature of the heat conduction medium in the heat conduction pipe 112 through internal components, so that the heat conduction pipe 112 continuously absorbs the heat of the material and transfers it into the temperature control box 201, thereby achieving effective control of the temperature inside the reaction vessel 101. This solves the core problems of low heat conduction efficiency and inaccurate temperature control of traditional external cooling devices, and ensures a stable reaction environment for the epoxy curing agent.

[0040] like Figure 1 and 2 As shown, in one embodiment, the reaction vessel 101 is preferably a reaction kettle. The bottom of the reaction vessel 101 is provided with a first support frame 106, which is fixed to the ground. The top cover 102 of the reaction vessel 101 is sealed to the reaction vessel 101 by means of a flange connection. Preferably, a sealing gasket is installed at the connection between the top cover 102 and the reaction vessel 101 to ensure airtightness. The feed inlet 103 on the top cover 102 is equipped with a sealing cover plate. A rubber sealing layer is provided at the contact part between the cover plate and the feed inlet 103, and it is sealed to the feed inlet 103 by means of a flange connection. The discharge port 107 at the bottom of the reaction vessel 101 is equipped with a discharge valve 108, which can be controlled to open and close manually or electrically.

[0041] The reaction vessel 101 provides a stable chemical reaction space for the epoxy curing agent, preventing material leakage or intrusion of external impurities during the reaction process; the sealed connection of the top cover 102 ensures the airtightness of the reaction environment, preventing the escape of gaseous raw materials from affecting the reaction process; the openable and closable inlet 103 and outlet 107 realize the quantitative feeding of raw materials and the orderly collection of finished products, respectively, which are suitable for the operation requirements of industrial mass production.

[0042] like Figure 2 , 3 As shown in Figure 7, in one embodiment, the heat pipe 112 is arranged in a serpentine manner to fit the inner wall of the reaction vessel 101, and has a continuous bending shape. It includes multiple parallel vertical pipe segments and horizontal pipe segments connecting the vertical pipe segments, and a uniform gap is reserved between adjacent vertical pipe segments. The wall of the heat pipe 112 is connected to the inner wall of the reaction vessel 101 by several fixed supports 113 to prevent the heat pipe 112 from shifting position due to medium flow or material stirring. The portions of the heat pipe 112 that penetrate the side wall of the reaction vessel 101 at both ends are fitted with sealing sleeves. The sealing sleeves are tightly fitted to the side wall of the vessel and the wall of the heat pipe 112 to prevent material leakage.

[0043] The serpentine arrangement of the heat pipe 112 significantly increases the contact area between the heat pipe 112 and the material, improving heat transfer efficiency. The gap between adjacent vertical pipe sections provides space for the installation and movement of subsequent stirring components, avoiding mechanical interference between the stirring structure and the heat pipe 112. The sealing sleeve ensures the connectivity between the heat pipe 112 and the temperature control box 201, and prevents the material in the reaction vessel 101 from leaking through the penetration, maintaining the airtightness of the vessel.

[0044] like Figure 2 , 3 As shown in Figure 7, in one embodiment, a stirring device is provided inside the reaction vessel 101, including a first mounting frame 104, a motor 105, a rotating shaft 109, and a stirring section. The first mounting frame 104 is fixed at the center of the top cover 102, providing a mounting and support position for the motor 105. The motor 105 is fixed at the center of the top cover 102 via a mounting base, and its drive shaft is vertically downward. One end of the rotating shaft 109 is connected to the drive shaft of the motor 105 via a coupling, and the other end passes through the top cover 102 and extends into the interior of the reaction vessel 101. A sealed bearing is installed at the penetration point between the rotating shaft 109 and the top cover 102, balancing the flexibility of rotation with the sealing of the vessel. The stirring section is used to stir the materials, accelerate their mixing and reaction efficiency, and ensure that the materials at each position can contact the heat-conducting pipe 112 for heat conduction.

[0045] Specifically, the stirring section includes a retainer 110 and several rotating plates 111. The retainer 110 consists of multiple support rods evenly arranged around the rotating shaft 109, and a rotating shaft vertically fixed to one end of the support rods away from the rotating shaft 109. The rotating plates 111 are circumferentially sleeved on the rotating shaft, and the size of the rotating plates 111 is adapted to the gap between adjacent vertical pipe sections of the heat-conducting pipe 112, so that they can be embedded in the gap.

[0046] When the motor 105 drives the rotating shaft 109 to rotate, it can drive the cage 110 to make a synchronous circular motion, which in turn drives the rotating plate 111 to revolve around the rotating shaft 109. At the same time, the rotating plate 111 is embedded in the gap of the adjacent vertical pipe section. When the rotating plate 111 revolves, it contacts the vertical pipe section of the heat conduction pipe 112. Under its action, it will rotate around its own rotation axis, forming a compound motion mode of revolution and rotation. This can not only promote the material to form convection and ensure that the material in all areas of the container can fully contact the heat conduction pipe 112, but also break the material stagnation layer at the gap of the heat conduction pipe 112, improve the overall fluidity of the material, and ensure the uniformity of cooling throughout the entire area.

[0047] like Figure 4 As shown, in one embodiment, the temperature control box 201 is a sealed box structure. The top opening in the figure is for internal schematic purposes. A second support frame 204 is provided at the bottom of the temperature control box 201, and the box is fixed to the ground by means of the second support frame 204. The temperature control box 201 contains a heat-conducting medium, which is a medium with high thermal conductivity, preferably heat-conducting oil. Two medium interfaces are respectively opened on both sides of the bottom of the temperature control box 201, which are connected to the two ends of the heat-conducting pipe 112 through a driving part. The driving part is used to drive the heat-conducting medium to flow through the heat-conducting pipe 112 to realize heat export. After the temperature control box 201 cools down the heat-conducting medium, it continues to be introduced into the heat-conducting pipe 112 for circulation.

[0048] Specifically, a sealing joint is installed at the interface, and a sealing element is provided at the contact parts between the joint and the interface of the heat pipe 112 and the temperature control box 201.

[0049] The heat transfer medium circulates between the temperature control chamber 201 and the heat transfer pipe 112. It absorbs the heat generated by the reaction of the material in the heat transfer pipe 112 and flows back to the temperature control chamber 201 to complete the cooling process, thereby achieving the transfer and dissipation of heat. The sealed structure of the temperature control chamber 201 can prevent the heat transfer medium from evaporating, leaking, or being affected by external pollutants, ensuring the stability of the heat transfer medium's performance and maintaining the continuous cooling capacity of the device.

[0050] Specifically, the temperature control box 201 is also equipped with a refrigeration device, which is preferably composed of a refrigeration unit 202 and a refrigeration pipe 203. The refrigeration pipe 203 is in a serpentine shape with multiple bends and is completely immersed in the heat-conducting medium inside the temperature control box 201. Both ends of the refrigeration pipe 203 pass through the temperature control box 201 and are connected to the external refrigeration unit 202 to form a complete refrigerant circulation loop.

[0051] The refrigerator 202 can drive the refrigerant to circulate continuously in the refrigeration pipe 203. By utilizing the phase change heat absorption characteristics of the refrigerant, the heat transfer medium in the temperature control box 201 is rapidly cooled down, ensuring that the heat-absorbing medium returning from the heat transfer pipe 112 can be restored to a low temperature state in time, thus ensuring the continuous cooling capability of the heat transfer pipe 112 on the materials in the reaction vessel 101.

[0052] Specifically, a temperature sensor is installed on the inner wall of the temperature control chamber 201. Its detection probe extends directly into the heat transfer medium, and the data output terminal can be connected to an external display instrument or electronic control system to realize real-time transmission of temperature data. The temperature sensor can monitor the temperature of the heat transfer medium in real time, providing accurate data support for the power adjustment of the refrigeration device, avoiding excessive cooling of the heat transfer medium that would cause the temperature inside the reaction vessel 101 to be too low, thereby destroying the reaction conditions of the epoxy curing agent and realizing closed-loop precise temperature control.

[0053] like Figure 5 and 6 As shown, specifically, the drive unit includes a liquid storage cylinder 301, a pipetting device, and conduits 205. The liquid storage cylinder 301 is a vertical cylindrical structure, and a third support frame 305 is provided at the bottom of the liquid storage cylinder 301 for fixing the liquid storage cylinder 301 to the ground. The liquid storage cylinder 301 is connected to the temperature control box 201 and the heat transfer pipe 112 through two conduits 205 respectively. The pipetting device consists of a second mounting frame 302, a hydraulic telescopic rod 303, and a push plate 304. The second mounting frame 302 is fixed to the top of the liquid storage cylinder 301, the hydraulic telescopic rod 303 is vertically installed on the second mounting frame 302, and the push plate 304 is fixed to the movable end of the hydraulic telescopic rod 303. The edge of the push plate 304 slides against the inner wall of the liquid storage cylinder 301, and sealing devices such as sealing rings and sealing gaskets are installed at the contact point. All conduits 205 are equipped with control valves 206 for adjusting the flow of the heat transfer medium and controlling its flow direction.

[0054] The hydraulic telescopic rod 303 can drive the push plate 304 to move up and down inside the liquid storage tank 301, realizing the directional transfer of the heat transfer medium between the liquid storage tank 301, the temperature control box 201, and the heat transfer pipe 112. This allows the heat absorption process of the heat transfer medium in the heat transfer pipe 112 to be synchronized with the cooling process in the temperature control box 201, thereby improving the overall cooling efficiency. The sealing device can prevent the heat transfer medium from leaking through the gap between the push plate 304 and the liquid storage tank 301, reducing medium loss. The control valve 206 can precisely regulate the flow direction and flow rate of the heat transfer medium, adapting to the cooling requirements of different reaction stages of the epoxy curing agent.

[0055] Specifically, when the heat transfer medium in the heat pipe 112 is discharged into the temperature control box 201, the control valve 206 on the conduit 205 connecting the liquid storage cylinder 301 and the heat pipe 112 opens towards the liquid storage cylinder 301, and the hydraulic telescopic rod 303 drives the push plate 304 to move upward; thus drawing the heat transfer medium in the heat pipe 112 into the liquid storage cylinder 301; subsequently, the control valve 206 on the conduit 205 connecting the liquid storage cylinder 301 and the temperature control box 201 opens towards the temperature control box 201, and the hydraulic telescopic rod 303 drives the push plate 304 to move downward, discharging the heat transfer medium in the liquid storage cylinder 301 into the temperature control box 201; conversely, the heat transfer medium in the temperature control box 201 is discharged into the heat pipe 112.

[0056] Specifically, the drive unit is preferably two sets, respectively located on both sides of the temperature control box 201, such as... Figure 1 As shown, the liquid storage cylinder 301 at the front is the first liquid storage cylinder 301, which is used to discharge the heat-conducting medium after absorbing heat in the heat-conducting pipe 112; the liquid storage cylinder 301 at the rear is the second liquid storage cylinder 301, which is used to introduce the heat-conducting medium cooled by the refrigeration device into the heat-conducting pipe 112.

[0057] Specifically, a control valve a, which is a one-way valve, is provided on the conduit 205 connecting the first liquid storage tank 301 and the temperature control box 201, and is positioned towards the temperature control box 201; a control valve b, which is a one-way valve, is provided on the conduit 205 connecting the first liquid storage tank 301 and the heat conduction pipe 112, and is positioned towards the first liquid storage tank 301; a control valve c, which is a one-way valve, is provided on the conduit 205 connecting the second liquid storage tank 301 and the temperature control box 201, and is positioned towards the second liquid storage tank 301; and a control valve d, which is a one-way valve, is provided on the conduit 205 connecting the second liquid storage tank 301 and the heat conduction pipe 112, and is positioned towards the heat conduction pipe 112.

[0058] The working principle of the heat-conducting cooling device for epoxy curing agent production disclosed in this application is as follows:

[0059] First, open the feed port 103 on the top cover 102 and quantitatively add the epoxy curing agent production raw materials into the reaction container 101. After closing the feed port 103, the raw materials undergo a chemical reaction in the container and generate a large amount of heat.

[0060] Since the heat pipe 112 is in direct contact with the material, the heat generated by the material is directly transferred to the heat transfer medium inside the heat pipe 112. At the same time, the motor 105 drives the stirring device to run, and the rotating plate 111 stirs the material in a revolution plus rotation mode, so that the material is fully mixed and reacted, and can fully contact the heat pipe 112 to improve the uniformity of heat absorption.

[0061] The refrigeration unit inside the temperature control box 201 is started, and the refrigeration unit 202 drives the refrigerant to circulate in the refrigeration pipe 203 to quickly cool down the heat transfer medium. The temperature sensor monitors the temperature of the heat transfer medium in real time and adjusts the power of the refrigeration unit 202 according to the temperature data to avoid excessive cooling.

[0062] The heat transfer medium is introduced into the heat transfer pipe 112. Control valve c opens, and hydraulic telescopic rod 303 drives push plate 304 to move upward, drawing the cooled heat transfer medium in temperature control box 201 into the second storage tank 301. After completion, control valve c closes. Subsequently, control valves d and b open simultaneously, and push plate 304 in the second storage tank 301 moves downward, pushing the cooled heat transfer medium into the heat transfer pipe 112. At the same time, push plate 304 in the first storage tank 301 moves upward, drawing the heat-absorbing heat transfer medium into the first storage tank 301. After completion, control valves d and b close simultaneously. Control valve a opens, and push plate 304 in the first storage tank 301 moves downward, exporting the heat-absorbing heat transfer medium into temperature control box 201 for cooling. This completes one heat transfer cycle. The above steps are repeated to complete the heat transfer and cooling process.

[0063] After the reaction is complete and the temperature drops to a suitable range, open the discharge port 107 at the bottom of the reaction vessel 101 to discharge the finished epoxy curing agent, thus completing the production process.

[0064] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0065] Furthermore, it should be noted that the scope of the methods and apparatus in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. In addition, features described with reference to certain examples may be combined in other examples.

[0066] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.

Claims

1. A heat conduction cooling device for epoxy curing agent production, characterized by, include: A reaction vessel, wherein a top cover is provided on the top of the reaction vessel, and an inlet that can be opened or closed is provided on the top cover, and an outlet that can be opened or closed is provided at the bottom of the reaction vessel; A temperature control device, comprising a temperature control chamber and a heat-conducting pipe, wherein the heat-conducting pipe is disposed inside the reaction vessel to achieve direct contact with the material, and both ends of the heat-conducting pipe penetrate the side wall of the reaction vessel and are connected to the temperature control chamber. The temperature control box is used to control the temperature of the heat pipe; The heat pipe has a serpentine structure that winds around the inner wall of the reaction vessel, and a gap is reserved between adjacent vertical sections of the heat pipe. The reaction vessel is also equipped with a stirring device, which includes a motor, a rotating shaft, and a stirring section. The motor is fixed to the top cover. One end of the rotating shaft is connected to the drive shaft of the motor, and the other end passes through the top cover and extends into the interior of the reaction vessel to be connected to the stirring section. The stirring section can rotate with the rotating shaft to drive the material to fully contact the heat-conducting pipe. The stirring section includes a retainer and several rotating plates; the retainer includes several support rods arranged around the rotating shaft, and a rotating shaft vertically fixed to one end of the support rods away from the rotating shaft; the rotating plates are circumferentially sleeved on the rotating shaft and can rotate around the axis of the rotating shaft, and the rotating plates are adapted to be embedded in the gap between adjacent vertical pipe sections of the heat-conducting pipe.

2. The heat conduction cooling device for epoxy curing agent production according to claim 1, characterized in that, The temperature control box is also equipped with a drive unit, and a heat-conducting medium is provided inside the temperature control box; the drive unit is used to drive the heat-conducting medium to move along the heat-conducting pipe; The heat-conducting medium is driven by the driving unit to enter from one end of the heat-conducting pipe. The heat generated by the material reaction is absorbed by the heat-conducting medium, and the heat-conducting medium flows back to the temperature control box from the other end of the heat-conducting pipe.

3. The heat-conducting and cooling device for epoxy curing agent production according to claim 2, characterized in that, The temperature control box is equipped with a refrigeration device, including a refrigeration unit and refrigeration pipes. The refrigeration pipes are immersed in the heat-conducting medium inside the temperature control box, and both ends of the refrigeration pipes are connected to the refrigeration unit to realize refrigerant circulation.

4. The thermally conductive cooling device for epoxy curing agent production according to claim 3, characterized in that, The temperature control box is also equipped with a temperature sensor, the detection end of which is in contact with the heat-conducting medium to monitor the temperature of the heat-conducting medium in real time.

5. The thermally conductive cooling device for epoxy curing agent production according to claim 2, characterized in that, The drive unit includes a liquid storage cylinder, a liquid transfer device, and a conduit. The liquid storage cylinder is connected to the temperature control box and the heat transfer pipe through the conduit. The liquid transfer device is used to transfer the heat transfer medium between the liquid storage cylinder, the temperature control box, and the heat transfer pipe.

6. The thermally conductive cooling device for epoxy curing agent production according to claim 5, characterized in that, The pipetting device includes a third support frame, a hydraulic telescopic rod, and a push plate; the third support frame is fixed to the top of the liquid storage cylinder, the hydraulic telescopic rod is installed on the third support frame, the push plate is fixed to the movable end of the hydraulic telescopic rod and slides against the inner wall of the liquid storage cylinder; a sealing device is provided at the contact point between the edge of the push plate and the inner wall of the liquid storage cylinder.

7. The thermally conductive cooling device for epoxy curing agent production according to claim 6, characterized in that, The conduit is equipped with a control valve, which is used to control the flow direction and flow rate of the heat transfer medium.

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