Integrated thermal management system and vehicle
By integrating the thermal management system, the thermal management controller and refrigerant channels are integrated onto the substrate, solving the problems of large space occupation, heavy weight and low energy efficiency caused by the distributed layout. This achieves compactness, lightweight and efficient heat dissipation, improving overall performance and reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ZHEJIANG LEAPMOTOR TECH CO LTD
- Filing Date
- 2025-12-29
- Publication Date
- 2026-04-28
AI Technical Summary
The current distributed layout of thermal management system components in the front compartment of new energy vehicles results in a large number of parts, many connection points, large space occupation, complex assembly, heavy weight, low energy efficiency, high risk of leakage, and limited heat dissipation efficiency, which affects the overall performance and reliability.
An integrated thermal management system is adopted, which integrates the thermal management controller, compressor, refrigerant passage, water-side flow channel plate, etc. on the base plate, reducing connection points and external piping, and adopting active heat dissipation to improve heat dissipation efficiency, simplifying the structure and reducing weight and cost.
This achieves a compact and lightweight thermal management system, reducing space occupation, lowering leakage risk, improving energy efficiency and reliability, simplifying assembly processes, and enhancing overall performance.
Smart Images

Figure CN121448094B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of vehicle technology, and more particularly to an integrated thermal management system and vehicle. Background Technology
[0002] With the development of new energy vehicles, the front compartment space is becoming increasingly limited. Components of the thermal management system, such as radiators, condensers, thermal management controller housings, air conditioning compressors, refrigerant valves, sensors, plate heat exchangers, liquid-cooled condensers, water pumps, water valves, water tanks, air conditioning refrigerant pipes, and coolant pipes, are arranged in a distributed layout. This distributed layout requires a large number of parts, and connection points are prone to stress concentration due to vibration. Furthermore, it occupies a large space and involves complex assembly processes, making it difficult to meet the current automotive industry's requirements for lightweight, compact, and low-cost manufacturing. Summary of the Invention
[0003] This application provides an integrated thermal management system and vehicle that can reduce the number of parts and the space occupied by the thermal management system.
[0004] To achieve the above objectives, the main technical solutions adopted in this application include:
[0005] In a first aspect, embodiments of this application provide an integrated thermal management system, including a substrate, a compressor, and a thermal management controller. The substrate includes a first plate portion and a second plate portion connected together. The first plate portion is provided with a first refrigerant channel. The compressor is connected to the first refrigerant channel, and the thermal management controller is located on the second plate portion.
[0006] The integrated thermal management system proposed in this application embodiment has a thermal management controller located in the second plate and a first refrigerant channel in the first plate. This integrates the thermal management controller and the first refrigerant channel, which simplifies the structure of the thermal management system, improves the integration of the thermal management system, makes the thermal management system structure more compact, and reduces the space occupancy rate.
[0007] Optionally, the compressor is fixed to the first plate portion and the second plate portion.
[0008] In the above embodiment, the first plate and the second plate are provided with mounting positions for installing the compressor, thereby integrating the compressor, the thermal management controller and the first refrigerant passage into a compact unit, reducing the space occupied by the thermal management system.
[0009] Optionally, the first plate has a first mounting hole, and the second plate has a plurality of second mounting holes, the first mounting hole and the second mounting holes being used to mount the compressor.
[0010] In the above embodiments, the first mounting hole of the first plate and the second mounting hole of the second plate form a mounting position for the compressor to fix the compressor to the base plate, thereby realizing the integration of the compressor with the thermal management controller and the first refrigerant channel, reducing the space occupied by the thermal management system. Furthermore, integrating the compressor with the first refrigerant channel and the thermal management controller reduces the number of discrete components, thereby reducing the number of connection points, reducing the transmission of compressor vibration and stress concentration, and thus reducing the impact of compressor vibration on the overall stability of the thermal management system.
[0011] Optionally, a groove is provided on one side of the second plate portion along the thickness direction, the groove being used to accommodate the thermal management controller.
[0012] In the above embodiment, the groove on the second plate serves as a mounting groove for the thermal management controller and can be constructed as the lower housing of the thermal management controller to improve the integration of the thermal management controller.
[0013] Optionally, the integrated thermal management system further includes a water-side flow channel plate, which is disposed on one side of the first plate portion along the thickness direction of the first plate portion, and the water-side flow channel plate has a water-side flow channel.
[0014] In the above embodiment, the water-side flow channel plate is fixed to the first plate portion, thereby integrating the water-side flow channel plate with the first refrigerant channel on the refrigerant side, further improving the integration of the thermal management system.
[0015] Optionally, the integrated thermal management system also includes a kettle, which is disposed on the upper side of the water-side flow channel plate and is connected to the water-side flow channel.
[0016] In the above embodiment, the kettle is placed on the upper side of the water-side flow channel plate and connected to its inner flow channel, which facilitates the entry of liquid in the kettle into the water-side flow channel plate, shortens the connection path between the kettle and the water-side flow channel plate, and allows the kettle and the water-side flow channel plate to be directly connected through a short interface or integrated pipeline, reducing the length of the external pipeline and the number of connection joints, thereby improving the integration of the thermal management system and reducing the space occupied by the thermal management system.
[0017] Optionally, the integrated thermal management system further includes at least one first heat exchanger and at least one second heat exchanger, wherein the first heat exchanger is disposed on the first plate and communicates with the first refrigerant channel, and the second heat exchanger is disposed on the first plate and communicates with the water-side flow channel.
[0018] Optionally, the first plate portion and the second plate portion are connected along the first direction, and the first plate portion is provided with a plurality of first interfaces on the side away from the second plate portion for connecting air conditioning refrigerant pipes, and the first direction is perpendicular to the thickness direction of the first plate portion.
[0019] In the above embodiment, the first plate and the second plate are arranged side by side along the first direction. An interface is provided on the side of the first plate away from the second plate. This interface is used for the air conditioning refrigerant pipe to be directly connected to the first refrigerant channel, thereby reducing the number of connecting pipes and thus reducing the space occupied by the thermal management system.
[0020] Optionally, the first plate portion is provided with a plurality of first hollow portions, and the first hollow portions penetrate the first plate portion along the thickness direction of the first plate portion.
[0021] In the above embodiments, the multiple first hollow portions can reduce the weight of the first plate portion, thereby achieving the purpose of weight reduction in the thermal management system.
[0022] Optionally, the second plate is provided with a second refrigerant passage, which connects the first refrigerant passage and the compressor.
[0023] In the above embodiments, refrigerant flows through the second refrigerant channel. As the refrigerant flows through the second refrigerant channel, it absorbs the heat generated by the thermal management controller, achieving active heat dissipation and thus improving the heat dissipation efficiency of the thermal management controller. Furthermore, the second refrigerant channel and the first refrigerant channel are integrated into the second and first plates, respectively, with the compressor located in the second plate and connected to the second refrigerant channel, reducing the need for external piping.
[0024] Secondly, embodiments of this application provide a vehicle including the integrated thermal management system described in any of the above embodiments. The vehicle in this application, having the integrated thermal management system described in any of the above embodiments, possesses the beneficial effects described in any of the above embodiments. Attached Figure Description
[0025] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0026] Figure 1 This is a partial structural diagram of an integrated thermal management system in one embodiment of this application;
[0027] Figure 2 This is a partial structural diagram of an integrated thermal management system in one embodiment of this application;
[0028] Figure 3 This is a schematic diagram of the integrated thermal management system in one embodiment of this application;
[0029] Figure 4This is a schematic diagram of the integrated thermal management system in one embodiment of this application;
[0030] Figure 5 This is a schematic diagram of the structure of an integrated thermal management system in one embodiment of this application.
[0031] [Explanation of Labels in the Attached Image]
[0032] 1. First plate section; 11. First refrigerant channel; 12. First mounting hole; 13. First interface; 14. First cutout section; 15. Second cutout section; 16. High-pressure flow channel;
[0033] 2. Second plate section; 21. Second mounting hole; 22. Groove; 23. Reinforcing rib; 24. Second refrigerant channel;
[0034] 3. Compressor;
[0035] 4. Water-side flow channel plate;
[0036] 51. Pump body; 52. Multi-way valve; 53. Kettle; 54. First heat exchanger; 55. Second heat exchanger;
[0037] 61. First installation section; 62. Second installation section;
[0038] 7. Gas-liquid separator.
[0039] X, the first direction; Y, the second direction. Detailed Implementation
[0040] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0041] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used in the description of this application is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms "comprising" and "having," and any variations thereof, in the description, claims, and accompanying drawings of this application are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the description, claims, or accompanying drawings of this application are used to distinguish different objects, not to describe a specific order or hierarchy.
[0042] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.
[0043] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "attachment" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0044] In this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, in this application, the character " / " generally indicates that the preceding and following related objects have an "or" relationship.
[0045] In this application, "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).
[0046] In automotive thermal management component design, key components such as thermal management controllers, compressors, refrigerant valves, plate heat exchangers, liquid-cooled condensers, water pumps, water valves, and water tanks are typically arranged in a distributed layout. The compressor is usually fixed to the vehicle body via an independent metal bracket. This "distributed structure" design inevitably leads to a large number of parts and redundant connectors, increasing not only overall weight and material costs but also resulting in a cramped front compartment layout and low space utilization due to each component occupying its own installation space. This results in a larger front compartment size, reducing the passenger compartment space within the same vehicle body size standard. The distributed layout also adds piping and numerous joints, increasing the potential risk of refrigerant leakage. Furthermore, the flow of refrigerant between individual components generates unnecessary flow resistance and pressure drops, requiring the compressor to consume more power to overcome these losses, thus reducing the overall system energy efficiency.
[0047] Meanwhile, the heat dissipation of thermal management controllers often relies on additional cooling circuits or air cooling. This passive thermal management method has limited efficiency. Under high temperature or high load conditions, insufficient heat dissipation can easily lead to thermal derating or even failure of the thermal management controller, directly restricting the continuous output capability of the thermal management system.
[0048] Furthermore, the components are connected by multiple bolts, each of which is a weak point in rigidity. Under the excitation of compressor vibration, stress concentration easily occurs, leading to insufficient overall structural rigidity, causing abnormal noises or even fatigue damage, affecting long-term reliability. Moreover, the vibration of the compressor during operation is directly transmitted to the chassis and other precision components through rigid supports, threatening the reliable service life of the thermal management controller. At the same time, the decentralized structure means that assembly processes must be carried out in stages, resulting in complex and inefficient operations.
[0049] To reduce the space in the front compartment and increase the space in the passenger compartment, so that passengers have enough space to rest inside the vehicle, the thermal management system in the front compartment needs to be highly integrated. This will fully release the space in the front compartment, achieve miniaturization of the front compartment, meet the vehicle's lightweight requirements, and increase the space in the passenger compartment.
[0050] In view of this, this application provides an integrated thermal management system that can improve the integration of the thermal management system, reduce the space occupied by the thermal management system, reduce leakage risk and pressure drop loss, and at the same time achieve the purpose of weight reduction and cost reduction.
[0051] Firstly, reference Figure 1 and Figure 2 This application provides an integrated thermal management system, which includes a base plate, a compressor 3 and a thermal management controller (not shown in the figure). The base plate includes a first plate portion 1 and a second plate portion 2 connected together. The first plate portion 1 is provided with a first refrigerant channel 11. The compressor 3 is connected to the first refrigerant channel 11, and the thermal management controller is located on the second plate portion 2.
[0052] Specifically, the first plate portion 1 integrates a first refrigerant channel 11 for refrigerant flow. The first plate portion 1 is constructed as a refrigerant-side flow channel plate, thereby reducing the number of exposed refrigerant pipes arranged in a staggered manner. The compressor 3 is connected to the first refrigerant channel 11 and is used to compress the low-temperature, low-pressure refrigerant in the first refrigerant channel 11 into a high-temperature, high-pressure state. The thermal management controller is located in the second plate portion 2. For example, at least a portion of the second plate portion 2 can serve as the housing of the thermal management controller. Connecting the first plate portion 1 and the second plate portion 2 together to form a whole can reduce the space occupied by the thermal management system.
[0053] It should be understood that the first plate 1 is provided with an interface communicating with the first refrigerant passage 11, for communicating the refrigerant in the first refrigerant passage 11 with external devices. For example, the compressor 3 is connected to the first refrigerant passage 11 through the interface on the first plate 1.
[0054] The integrated thermal management system proposed in this application embodiment has a thermal management controller located in the second plate 2 and a first refrigerant channel 11 in the first plate 1. This means that the thermal management controller and the first refrigerant channel 11 are integrated, which simplifies the structure of the thermal management system, improves the integration of the thermal management system, makes the thermal management system structure more compact, reduces the space occupancy rate, and thus frees up more front compartment space.
[0055] For example, the first plate 1 and the second plate 2 can be integrally formed. The second plate 2 can serve as the housing of the thermal management controller. The first plate 1 is provided with a mounting position communicating with the first refrigerant channel 11. This mounting position can be used to install heat exchangers, refrigerant valves, sensors, etc. In other words, based on the first plate 1 and the second plate 2, the thermal management controller, the refrigerant-side flow channel plate, the heat exchanger communicating with the first refrigerant channel 11 in the refrigerant-side flow channel plate, the refrigerant valves, sensors, etc. are integrated, reducing the setting of external pipelines, thereby reducing energy loss in the first refrigerant channel 11, improving the overall energy efficiency of the thermal management system, reducing the space occupied by the thermal management system, reducing the number of parts used during the installation of the thermal management system, thereby reducing the weight of the thermal management system and improving the reliability of the thermal management system.
[0056] In addition, by integrating the thermal management controller, the first refrigerant channel 11, and the sensors and refrigerant valves connected to the first refrigerant channel 11 together, the connection length of pipelines and wiring harnesses between the sensors and refrigerant valves connected to the first refrigerant channel 11 and the thermal management controller is reduced, thereby improving the control accuracy of the thermal management controller and reducing the energy loss of the thermal management system.
[0057] Optionally, refer to Figure 1 and Figure 2 The compressor 3 is fixed to the first plate 1 and the second plate 2.
[0058] The first plate 1 and the second plate 2 are provided with mounting positions for installing the compressor 3, so that the compressor 3, the thermal management controller and the first refrigerant passage 11 are integrated into a compact unit, and the compressor 3 can be directly connected to the first refrigerant passage 11 through the interface on the first plate 1, thereby reducing the space occupied by the thermal management system.
[0059] For example, since the substrate includes a first plate portion 1 and a second plate portion 2, the shapes of the first plate portion 1 and the second plate portion 2 can be determined according to specific circumstances, and the installation position of the compressor 3 can also be determined according to specific circumstances, as long as the compressor 3 is fixed to the substrate.
[0060] Optionally, refer to Figures 1 to 4The first plate 1 is provided with a first mounting hole 12, and the second plate 2 is provided with a plurality of second mounting holes 21. The first mounting hole 12 and the second mounting hole 21 are used to install the compressor 3.
[0061] The first mounting hole 12 of the first plate 1 and the second mounting hole 21 of the second plate 2 form the mounting position for the compressor 3, allowing the compressor 3 to be directly fixed to the base plate. This integrates the compressor 3 with the thermal management controller and the first refrigerant channel 11, reducing the space occupied by the thermal management system. Furthermore, integrating the compressor 3 with the first refrigerant channel 11 and the thermal management controller reduces the number of discrete components, thereby reducing the number of connection points, reducing the transmission of compressor 3 vibration and stress concentration, and thus reducing the impact of compressor 3 vibration on the overall stability of the thermal management system. In other words, directly fixing the compressor 3 to the first mounting hole 12 and the second mounting hole 21 reduces the use of compressor brackets, thereby reducing the fixing between the mounting bracket and the compressor, and reducing the fixing between the mounting bracket and the first plate 1 and the second plate 2, thus reducing the number of connection points and the use of fasteners, achieving a high degree of integration and weight reduction in the thermal management system.
[0062] In other words, due to the current discrete installation design of the thermal management system, the compressor 3 needs to rely on the compressor metal bracket, as well as a large number of connectors, housings, etc. The thermal management system has a large number of parts, high material costs, and large overall weight. The thermal management system in this application adopts an integrated molding design, which integrates the compressor bracket with the lower housing of the controller, the first refrigerant channel 11, etc., reducing the metal parts and redundant fasteners used to fix the compressor 3, thereby achieving vehicle lightweighting and manufacturing cost reduction.
[0063] The compressor 3 is secured by fasteners passing through the compressor 3, the first mounting hole 12, and the second mounting hole 21, respectively. For example, the fasteners can be bolts. When the compressor 3 is secured to the first plate 1 and the second plate 2, rubber pads can be provided inside the mounting holes on the compressor 3 to reduce the transmission of vibration from the compressor 3 to the first plate 1 and the second plate 2, thereby improving the overall stability of the thermal management system.
[0064] In one specific embodiment, the second plate portion 2 is disposed on one side of the first plate portion 1 along the first direction X. The dimension of the second plate portion 2 along the second direction Y is smaller than the dimension of the first plate portion 1 along the second direction Y. The first direction X, the second direction Y, and the thickness direction of the second plate portion 2 are perpendicular to each other. Along the first direction X, the first plate portion 1 has a protrusion extending toward the second plate portion 2. The protrusion has a first mounting hole 12, and the protrusion is spaced apart from the second plate portion 2 along the second direction Y. Along the first direction X, a plurality of second mounting holes 21 are spaced apart. The plurality of first mounting holes 12 and second mounting holes 21 enclose the mounting position of the compressor 3, improving the stability of the compressor 3. When the compressor 3 is installed in the first mounting hole 12 and the second mounting hole 21, the edge of the first plate portion 1 along the second direction Y is approximately flush with the edge of the compressor 3, thereby reducing the problem of the compressor occupying a large space due to protruding from the substrate, and thus reducing the space occupied by the thermal management system.
[0065] In one specific embodiment, the side of the second plate portion 2 facing away from the thermal management controller is provided with reinforcing ribs 23 to enhance the strength of the second plate portion 2, thereby improving the stability of the compressor 3.
[0066] Optionally, refer to Figure 1 and Figure 3 Along the thickness direction of the second plate portion 2, a groove 22 is provided on one side of the second plate portion 2, and the groove 22 is used to accommodate the thermal management controller.
[0067] The groove 22 on the second plate 2 serves as a mounting slot for the thermal management controller and can also be configured as the lower housing of the thermal management controller to improve the integration of the thermal management controller. During installation, simply fix the thermal management controller board and the upper housing of the thermal management controller to the second plate 2.
[0068] For example, the groove 22 is provided with a mounting hole for fastening fasteners through the mounting hole in the groove 22 to fix the thermal management controller board and the upper housing of the thermal management controller.
[0069] In this application, the thermal management controller, compressor 3, and first refrigerant passage 11, as well as sensors and refrigerant valves connected to the first refrigerant passage 11, are integrated together. This reduces the connection length of pipelines and wiring harnesses between the compressor 3, sensors and refrigerant valves connected to the first refrigerant passage 11, and the thermal management controller, thereby improving the control accuracy of the thermal management controller and reducing the energy loss of the thermal management system.
[0070] Optionally, refer to Figure 3 The integrated thermal management system also includes a water-side flow channel plate 4. Along the thickness direction of the first plate portion 1, the water-side flow channel plate 4 is disposed on one side of the first plate portion 1, and the water-side flow channel plate 4 has a water-side flow channel.
[0071] The water-side flow channel plate 4 integrates water-side flow channels for coolant flow, reducing the complex and intersecting arrangement of water-side flow channels. The first plate portion 1 has mounting positions for fixing the water-side flow channel plate 4 to the first plate portion 1, thereby integrating the water-side flow channel plate 4 with the first refrigerant channel 11 on the refrigerant side, further improving the integration of the thermal management system. Fixing the water-side flow channel plate 4 to the first plate portion 1 enhances the strength of the thermal management system.
[0072] In one specific embodiment, along the thickness direction of the first plate portion 1, the projection of the water-side flow channel plate 4 falls within the projection of the first plate portion 1, thereby reducing the space occupied by the thermal management system.
[0073] Optionally, refer to Figure 3 The integrated thermal management system also includes a pump body 51 and a multi-way valve 52. The pump body 51 and the multi-way valve 52 are located on the side of the water-side flow channel plate 4 away from the first plate 1. The pump body 51 and the multi-way valve 52 are respectively connected to the corresponding flow channels inside the water-side flow channel plate 4, thereby controlling the flow and cut-off of the medium in the corresponding circuit. Arranging the pump body 51 and the multi-way valve 52 on the side of the water-side flow channel plate 4 away from the first plate 1 along the thickness direction of the first plate 1 can reduce the space waste caused by the dispersed arrangement of components such as the pump body 51 and the multi-way valve 52, and improve the structural compactness.
[0074] Optionally, refer to Figure 3 and Figure 4 The integrated thermal management system also includes a kettle 53, which is located on the upper side of the water-side flow channel plate 4 and is connected to the water-side flow channel.
[0075] The water tank 53 can be used for venting, replenishing fluid and stabilizing pressure in the circuit. When installed close to the water-side flow channel plate 4, it can quickly expel air bubbles in the flow channel, avoid air resistance affecting the operation of the pump body 51, thereby improving heat exchange efficiency. It can also replenish fluid in time when fluid is lost, balance the circuit pressure and ensure stable operation of the water-side circuit.
[0076] By placing the water jug 53 on the upper side of the water-side flow channel plate 4 and connecting it with the water-side flow channel inside, the space occupied by the water jug 53 in the first direction X of the substrate can be reduced, making the overall structure more compact. At the same time, it facilitates the entry of liquid in the water jug 53 into the water-side flow channel plate 4, shortens the connection path between the water jug 53 and the water-side flow channel plate 4, and allows the water jug 53 and the water-side flow channel plate 4 to be directly connected through a short interface or integrated pipeline, reducing the length of external pipelines and the number of connection joints, thereby improving the integration of the thermal management system and reducing the space occupied by the thermal management system.
[0077] Optionally, refer to Figure 4The integrated thermal management system further includes at least one first heat exchanger 54 and at least one second heat exchanger 55. The first heat exchanger 54 is disposed on the first plate portion 1 and communicates with the first refrigerant channel 11, and the second heat exchanger 55 is disposed on the first plate portion 1 and communicates with the water-side flow channel. The first heat exchanger 54 is used for heat exchange of the refrigerant, and the second heat exchanger 55 is used for heat exchange of the coolant. Installing the first heat exchanger 54 on the first plate portion 1 reduces the piping connection between the first heat exchanger 54 and the first refrigerant channel 11. Only the interface on the first plate portion 1 that communicates with the first refrigerant channel 11 needs to be connected, which reduces the number of refrigerant-side connection pipes and the space occupied. Similarly, installing the second heat exchanger 55 on the first plate portion 1 reduces the piping connection between the second heat exchanger 55 and the water-side flow channel. Only the interface that communicates with the water-side flow channel needs to be connected, which reduces the number of water-side connection pipes and the space occupied.
[0078] In one specific embodiment, the first heat exchanger 54 and the second heat exchanger 55 are located on the same side of the first plate portion 1 along its thickness direction. Specifically, along the thickness direction of the first plate portion 1, the first plate portion 1 has a first side and a second side. The water-side flow channel plate 4 is located on the first side, and the multi-way valve 52 and the pump body 51, which are connected to and communicate with the coolant within the water-side flow channel plate 4, are located on the side of the water-side flow channel plate 4 away from the first side. The first heat exchanger 54 is located on the second side and communicates with the first refrigerant passage 11, and the second heat exchanger 55 is located on the second side and communicates with the water-side flow channel. The water-side flow channel plate 4 is provided with an interface for communicating with external devices to allow coolant flow. Exemplarily, a portion of the interface on the water-side flow channel plate 4 passes through the first plate portion 1 along its thickness direction, thereby communicating with external devices. That is, the second heat exchanger 55 is connected to the interface on the water-side flow channel plate 4 that passes through the first plate portion 1 along its thickness direction, thereby reducing the space occupied by the thermal management system.
[0079] It should be understood that since multiple pump bodies 51 and multiple multi-way valves 52 are provided on the side of the water-side flow channel plate 4 away from the first plate 1, the space on the side of the water-side flow channel plate 4 away from the first plate 1 is occupied. If the second heat exchanger 55 is located on the side of the water-side flow channel plate 4 away from the first plate 1, it will increase the size of the thermal management system along the thickness direction of the first plate 1, which is not conducive to the release of the front compartment space.
[0080] Optionally, refer to Figure 1 and Figure 3 Along the first direction X, the first plate 1 and the second plate 2 are connected. The first plate 1 is provided with a plurality of first interfaces 13 on the side away from the second plate 2 for connecting the air conditioning refrigerant pipe. The first direction X is perpendicular to the thickness direction of the first plate 1.
[0081] Along the first direction X, the first plate portion 1 and the second plate portion 2 are arranged side by side. The interface provided on the side of the first plate portion 1 away from the second plate portion 2 is used for the refrigerant pipes of the air conditioner's evaporator and indoor condenser to be directly connected to the first refrigerant channel 11, thereby reducing the number of connecting pipes and thus reducing the space occupied by the thermal management system.
[0082] In this application, the thickness direction of the first plate portion 1 is parallel to the thickness direction of the second plate portion 2.
[0083] Optionally, refer to Figure 1 and Figure 2 The first plate portion 1 is provided with a plurality of first hollow portions 14, and the first hollow portions 14 penetrate the first plate portion 1 along the thickness direction of the first plate portion 1.
[0084] Multiple first hollow portions 14 can reduce the weight of the first plate portion 1, achieving the purpose of weight reduction of the thermal management system; and can also allow the interface provided on the water-side flow channel plate 4 to pass through the first hollow portions 14 to connect with other components, reducing the space occupied by the thermal management system in the thickness direction of the first plate portion 1.
[0085] In one specific embodiment, the first plate portion 1 is provided with a first refrigerant channel 11 and a refrigerant interface communicating with the first refrigerant channel 11. Second hollow portions 15 are provided between each first refrigerant channel 11 and between each refrigerant interface, thereby reducing the heat transfer between each first refrigerant channel 11 and between each refrigerant interface.
[0086] In one specific embodiment, along the first direction X, a first mounting portion 61 is provided on the side of the first plate portion 1 away from the second plate portion 2, and a second mounting portion 62 is provided on the side of the second plate portion 2 away from the first plate portion 1. The first mounting portion 61 and the second mounting portion 62 are used to fix the integrated thermal management system to the vehicle body.
[0087] refer to Figure 4 The integrated thermal management system also includes a gas-liquid separator 7, which is disposed on the first plate portion 1 and communicates with the first refrigerant channel 11. The gas-liquid separator 7 is located on one side of the first plate portion 1 along its thickness direction and can separate gaseous refrigerant from liquid refrigerant. Exemplarily, the edge of the first plate portion 1 along the second direction Y is approximately flush with the edge of the gas-liquid separator 7, thereby reducing the problem of the gas-liquid separator 7 occupying a large space due to protruding from the substrate, and thus reducing the space occupied by the thermal management system.
[0088] Optionally, refer to Figure 5The second plate portion 2 is provided with a second refrigerant channel 24, which connects to the first refrigerant channel 11 and the compressor 3. The second refrigerant channel 24 is integrated within the second plate portion 2, and refrigerant flows through it. As the refrigerant flows through the second refrigerant channel 24, it absorbs the heat generated by the thermal management controller, achieving active heat dissipation and improving the heat dissipation efficiency of the thermal management controller. Furthermore, the second refrigerant channel 24 and the first refrigerant channel 11 are respectively integrated within the second plate portion 2 and the first plate portion 1, and the compressor 3 is located in the second plate portion 2 and connected to the second refrigerant channel 24, reducing the need for external piping. In one embodiment, the second plate portion 2, at least directly opposite the recess 22, is provided with the second refrigerant channel 24. When the refrigerant flows through the second refrigerant channel 24, it can directly and efficiently absorb the heat generated during the operation of the thermal management controller, achieving active heat dissipation, improving the operational stability of the thermal management controller, and converting the absorbed waste heat from the thermal management controller into additional superheat of the refrigerant, reducing the compression work of the compressor 3, thereby improving the heat dissipation efficiency of the thermal management controller and the overall operational energy efficiency of the thermal management system. In other words, compared with traditional air cooling or indirect cooling, the above cooling method significantly improves heat dissipation efficiency, ensuring the stable operation of the thermal management controller under harsh operating conditions.
[0089] In one specific embodiment, the first refrigerant passage 11 is directly connected to the second refrigerant passage 24, and the compressor 3 is directly mounted on the first plate 1. The compressor 3 is directly connected to the first refrigerant passage 11 and the second refrigerant passage 24, reducing the need for external piping. The compressor bracket, controller housing, and refrigerant-side flow channel plate are integrated into one unit, eliminating independent connecting parts and external connecting pipes, achieving an extremely compact and simplified mechanical structure, thereby reducing space occupancy and leakage risk.
[0090] In one specific embodiment, the second refrigerant channel 24 is connected to the gas-liquid separator 7. The second plate portion 2, which is directly opposite the groove 22, is provided with the second refrigerant channel 24. The low-temperature, low-pressure refrigerant after passing through the gas-liquid separator 7 is introduced into the second refrigerant channel 24. The refrigerant first cools the thermal management controller, and then the refrigerant is directly introduced into the compressor 3. The compressor 3 compresses the refrigerant into a high-temperature, high-pressure refrigerant, which is then introduced into the first refrigerant channel 11 to participate in the refrigerant system cycle again. This design eliminates the lengthy suction pipe in the traditional system, reducing cooling loss and pressure drop. Furthermore, the high-temperature, high-pressure refrigerant formed by the compressor 3 is not discharged through an external metal pipe, but is directly and shortly transported back to the first refrigerant channel 11 of the first plate portion 1 through a high-pressure flow channel 16 integrally formed with the outlet of the compressor 3 inside the first plate portion 1, completing a highly integrated cycle. The aforementioned refrigerant passage configuration deeply integrates the heat dissipation of the thermal management controller with the refrigerant system circulation, achieving efficient heat dissipation and energy recovery. It also eliminates pipe connections, reducing the risk of leakage at management connection points, while simultaneously lowering flow resistance and pressure loss, thus improving system energy efficiency. In other words, this refrigerant passage configuration achieves synergistic optimization in space utilization, thermal management efficiency, and system reliability.
[0091] Secondly, embodiments of this application provide a vehicle including the integrated thermal management system described in any of the above embodiments. The vehicle in this application, having the integrated thermal management system described in any of the above embodiments, possesses the beneficial effects described in any of the above embodiments.
[0092] The integrated thermal management system in this application is based on a first plate 1 with a first refrigerant passage 11. A second plate 2 is integrally formed with the first plate 1, and the second plate 2 serves as the lower housing of the thermal management controller. The first plate 1 integrates a valve assembly mounting seat communicating with the first refrigerant passage 11 and a valve assembly mounting interface, etc., to realize the direct installation and connection between the first refrigerant passage 11 and the valve assembly. The first plate 1 and the second plate 2 are respectively provided with a first mounting hole 12 and a second mounting hole 21 to directly fix the compressor 3 to the first plate 1 and the second plate 2, reducing the independent brackets and redundant fasteners for fixing the compressor 3, thereby achieving the purpose of weight reduction, cost reduction and space optimization. Furthermore, by integrating the compressor 3 with the first plate 1 and the second plate 2, the connection rigidity and vibration reliability of the compressor 3 can be improved, the structural reliability of the whole vehicle can be improved, and the NVH performance of the whole vehicle can be improved. In other words, this application integrates the compressor bracket, controller housing, and agent-side flow channel plate into one unit, eliminating the compressor bracket, connecting pipes, and fasteners between the thermal management controller and the compressor. This achieves a high degree of integration of the mechanical structure, significantly reducing the number of parts, weight, and potential leakage points. In other words, by integrating the compressor bracket, controller housing, and agent-side flow channel plate into one unit, this application reduces metal parts and redundant fasteners from the source, achieving vehicle lightweighting and low manufacturing costs. At the same time, it simplifies the assembly process, improves product mechanical performance, and enhances production efficiency.
[0093] The water-side flow channel plate 4 is then placed on the first plate section 1, and the pump body 51, multi-way valve 52, water tank 53, water-side flow channel plate 4, etc. are integrated into the first plate section 1. All of the above components can be uniformly controlled by the thermal management controller, so that the discrete components such as the thermal management controller, compressor 3, refrigerant valve, first heat exchanger 54 (plate heat exchanger), second heat exchanger 55 (liquid-cooled condenser), pump body 51, multi-way valve 52, water tank 53, air conditioning refrigerant pipe, water-side flow channel plate 4, etc. are integrated into a compact whole, reducing the redundant gaps between the components, freeing up the front compartment space, providing flexibility for the overall vehicle layout, thereby achieving a better overall vehicle space design. Furthermore, since the components are directly connected through integration, energy loss in the flow channel is reduced, thereby improving the overall energy efficiency of the thermal management system.
[0094] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0095] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to interchangeably. Each embodiment focuses on describing the differences from other embodiments. In particular, the system embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions in the method embodiments.
[0096] The above description is merely an embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of this application should be included within the scope of the claims of this application.
[0097] Although embodiments of this application have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of this application, and such modifications and variations all fall within the scope defined by the appended claims.
Claims
1. An integrated thermal management system, characterized in that, include: The substrate includes a first plate portion (1) and a second plate portion (2) connected together. The first plate portion (1) is provided with a first refrigerant channel (11), and the second plate portion (3) is provided on one side of the first plate portion (1) along a first direction (X). The first direction (X) is perpendicular to the thickness direction of the first plate portion (1). The compressor (3) and the thermal management controller are provided. The compressor (3) is connected to the first refrigerant channel (11). The thermal management controller is located on the second plate (2). The second plate (2) is provided with a second refrigerant channel (24). The second refrigerant channel (24) is connected to the first refrigerant channel (11) and the compressor (3). Along the thickness direction of the second plate (2), a groove (22) is provided on one side of the second plate (2). The groove (22) is used to accommodate the thermal management controller. The groove (22) is constructed as the lower housing of the thermal management controller. A water-side flow channel plate (4), at least one first heat exchanger (54) and at least one second heat exchanger (55) are provided along the thickness direction of the first plate portion (1), the first plate portion (1) having a first side and a second side, the water-side flow channel plate (4) being disposed on the first side, the water-side flow channel plate (4) having a water-side flow channel and an interface communicating with external devices, the first heat exchanger being disposed on the second side and communicating with the first refrigerant channel (11), the second heat exchanger (55) being disposed on the second side and connected to the interface on the water-side flow channel plate (4) that passes through the first plate portion (1) along the thickness direction of the first plate portion (1).
2. The integrated thermal management system according to claim 1, characterized in that, The compressor (3) is fixed to the first plate (1) and the second plate (2).
3. The integrated thermal management system according to claim 2, characterized in that, The first plate (1) is provided with a first mounting hole (12), and the second plate (2) is provided with a plurality of second mounting holes (21). The first mounting hole (12) and the second mounting hole (21) are used to install the compressor (3).
4. The integrated thermal management system according to claim 1, characterized in that, It also includes a water jug (53), which is disposed on the upper side of the water-side flow channel plate (4) and is connected to the water-side flow channel.
5. The integrated thermal management system according to claim 1, characterized in that, Along the first direction (X), the first plate portion (1) and the second plate portion (2) are connected. The first plate portion (1) is provided with a plurality of first interfaces (13) on the side away from the second plate portion (2) for connecting the air conditioning refrigerant pipe.
6. The integrated thermal management system according to claim 1, characterized in that, The first plate (1) is provided with a plurality of first hollow portions (14), and the first hollow portions (14) penetrate the first plate (1) along the thickness direction of the first plate (1).
7. A vehicle, characterized in that, The integrated thermal management system includes any one of claims 1 to 6.
Citation Information
Patent Citations
Thermal management integration module, thermal management integration system and vehicle
CN118046710A
Thermal management integrated component, thermal management system and vehicle
WO2025113228A1