Packaging method for quickly boxing silicon wafers

Abstract

A packaging method for fast boxing of silicon wafers comprises the steps that corrugated boards with the arrow direction matched with the silicon wafer containing direction are placed at the bottom of a cavity, pearl wool and silicon wafer bundles with the head ends and the tail ends being padded with parchment paper are alternately laid, after the silicon wafers are placed, the tops of the silicon wafers are covered with the corrugated boards, then the long-strip parchment paper is used for anticlockwise wrapping a silicon wafer combination in the cavity, and the silicon wafer combination is packaged into a box. After the four chambers complete the operation in sequence, the top cover of the packaging box is closed, and the whole box packaging can be completed. A traditional POF bag bagging process is replaced by a protection structure of corrugated board supporting, pearl wool buffering and parchment paper isolation wrapping, silicon wafer oxidation and scraping damage caused by moisture retention and vibration collision are effectively avoided, the steps of bagging, punching and the like are omitted, and the packaging efficiency is improved.

Description

Technical Field

[0001] This invention belongs to the field of photovoltaic module manufacturing technology and relates to a packaging method for quick boxing of silicon wafers. Background Technology

[0002] As the core functional component of photovoltaic modules, photovoltaic silicon wafers are characterized by high brittleness, stringent surface precision requirements, and susceptibility to environmental factors. The scientific and efficient packaging process directly affects product transportation and storage loss rates, production efficiency, and overall costs. Currently, the mainstream silicon wafer packaging in the photovoltaic industry adopts a four-in-one box structure. This four-in-one packaging requires inspectors to first place two sheets of tracing paper at each end of each bundle of qualified silicon wafers. Then, each bundle is individually wrapped in a POF bag. The POF bag is manually folded, ensuring even folding, before the bagged silicon wafers are placed into the box with the head down and the bottom up. Simultaneously, holes are manually punched at both ends of the bottom of the POF bag for ventilation. Once the box is full, the top lid is closed to complete the packaging. Although the process achieves the initial protection and boxed storage of silicon wafers, there are many unavoidable technical problems; (1) Each bundle of silicon wafers needs to be bagged, folded and punched separately. The steps are complicated and repetitive, and the amount of manual operation is large, resulting in low packaging efficiency and becoming an efficiency bottleneck in the production process. At the same time, the long-term repetitive bagging, folding and punching actions can easily cause finger and wrist strain of operators, causing occupational injuries and further limiting the improvement of work efficiency. (2) As a disposable packaging material, POF bags consume a lot of consumables, which increases the cost of packaging materials. Moreover, the complicated manual operation process requires high proficiency of operators, which indirectly increases labor costs and management costs. (3) The consistency of manual bagging and folding operations is poor. Some POF bags are not folded evenly, which can easily cause the silicon wafers to be stacked crookedly, increasing the risk of silicon wafer collision and scratch during transportation. The hole diameter and position of manual punching lack uniform standards, and the exhaust effect is unstable. If the exhaust is not sufficient, the moisture in the chamber is easy to condense into water, causing oxidation and contamination on the surface of the silicon wafers, affecting product quality. Summary of the Invention

[0003] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is: a packaging method for quick boxing of silicon wafers, including a packaging box, wherein the packaging box includes four independent chambers A, B, C and D, the size of the chambers is adapted to the size of the silicon wafers, and the four chambers have the same structure and the same size; Includes the following steps: S1, a corrugated board is placed against one side wall of chamber A, with the arrow of the corrugated board pointing upwards; S2, Place the first piece of pearl cotton on the inner wall of the corrugated board, with the size of the pearl cotton matching that of the corrugated board; S3, place a piece of tracing paper of the same size as the silicon wafer on the front and back sides of the first bundle of silicon wafers respectively. Then put the silicon wafers together with the tracing paper on both sides into the cavity, so that one side of the silicon wafer is in contact with the side wall of the pearl cotton, and the placement direction is kept uniform. S4, place a second piece of pearl cotton of the same size on the other side wall of the first bundle of silicon wafers, then place a piece of sulfuric acid paper that matches the size of the silicon wafer on each side of the front and back of the second bundle of silicon wafers, and put it into the chamber in the same direction as the first bundle of silicon wafers, and attach the second piece of pearl cotton. S5. Repeat step S4 alternately until the placement of the silicon wafers in chamber A is completed, and place a corrugated plate against the outer wall of the last bundle of silicon wafers, keeping the arrow of the corrugated plate facing upwards. S6. Then, use another piece of tracing paper to wrap the silicon wafer assembly consisting of corrugated board, pearl cotton, silicon wafer and tracing paper in chamber A counterclockwise. After completing the above operations in chamber S7 and A, repeat steps S1 to S6 to complete the silicon wafer packaging in chambers B, C, and D in sequence. After all chambers have been operated, close the top cover of the packaging box to complete the whole box packaging.

[0004] The packaging box includes a box body and a cover, and the box body has four chambers.

[0005] The packaging box is made of foam material, and the surface of the foam box is free of burrs, chips, cracks and dirt. The box body and lid fit well and there is no crumbs or lint.

[0006] The packaging operations for the four chambers are performed sequentially, and the silicon wafers in each chamber are placed in the same orientation.

[0007] A corrugated board is placed at the bottom of the chamber, and pearl cotton is placed between the silicon wafer bundles and between the silicon wafer bundles and the corrugated board. A corrugated board is then placed on top of the last bundle of silicon wafers at the top of the chamber.

[0008] Each bundle of silicon wafers to be placed into the chamber has sulfuric acid paper of the same size as the silicon wafer placed at both ends, and the silicon wafers are placed into the chamber in a preset direction, with the placement direction of each bundle of silicon wafers in the same chamber being consistent.

[0009] The pearl cotton is used for buffering and isolation between bundles of silicon wafers, and its density meets the requirements for scratch and collision prevention during the transportation of photovoltaic silicon wafers.

[0010] The corrugated board is a single-corrugated structure made of high-strength corrugated paper, used to enhance the support strength of the bottom and top of the chamber, and the arrow direction of the corrugated board matches the silicon wafer placement direction.

[0011] The sulfuric acid paper is adapted to the size of the silicon wafer, and the wrapping area of ​​the sulfuric acid paper covers the upper and lower surfaces and sides of the silicon wafer assembly.

[0012] The packaging operations of the four chambers A, B, C, and D are completed sequentially. That is, after all the steps in chamber A are completed, the operation in chamber B is started, and so on until chamber D.

[0013] The main beneficial effects of this invention are as follows: The silicon wafers are placed in separate chambers to avoid collisions and friction between them. High-strength corrugated boards provide stable support to prevent chamber collapse and wafer deformation caused by packaging stacking or transportation stress. Pearl cotton acts as a buffer layer to effectively absorb vibration and impact during transportation, preventing chipping caused by collisions between wafer bundles. By packaging and placing the wafers in order in each chamber, steps that might be missed due to cross-chamber operations are avoided. The positioning of the wafers with arrows on the corrugated boards and silicon wafers reduces operational errors, shortens the boxing speed, and improves overall packaging efficiency. Attached Figure Description

[0014] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0015] Figure 1 This is a schematic diagram of the internal cross-sectional structure of the present invention; Figure 2 This is a schematic diagram of the internal structure of the present invention; Figure 3 This is a top view of the internal structure of the present invention; Figure 4 This is a schematic diagram of the box chamber structure of the present invention; Figure 5 This is a schematic diagram of the structure of the present invention.

[0016] In the diagram: 1. Packaging box; 11. Box body; 12. Cover plate; 2. Corrugated board; 3. Pearl cotton; 4. Silicon wafer; 5. Sulphuric acid paper. Detailed Implementation

[0017] like Figures 1-5 In the present invention, a method for quick boxing of silicon wafers includes a packaging box 1, wherein the packaging box 1 includes four independent chambers A, B, C and D, the size of which is adapted to the size of the silicon wafer 4, and the four chambers have the same structure and the same size. Includes the following steps: S1, corrugated plate 2 is placed against one side wall of chamber A, with the arrow of corrugated plate 2 pointing upwards; S2, the first piece of pearl cotton 3 is placed on the inner wall of the corrugated board 2, and the size of the pearl cotton 3 is the same as that of the corrugated board 2. S3, place a piece of tracing paper 5 of the same size as the silicon wafer 4 on the front and back sides of the first bundle of silicon wafer 4 respectively. Then put the silicon wafer 4 together with the tracing paper 5 on both sides into the cavity, so that one side of the silicon wafer 4 is attached to the side wall of the pearl cotton 3, and the placement direction is kept uniform. S4, place a second piece of pearl cotton 3 of the same specification against the other side wall of the first bundle of silicon wafers 4, then place a piece of sulfuric acid paper 5 that matches the size of the silicon wafer 4 on each of the front and back sides of the second bundle of silicon wafers 4, and put it into the chamber in the same direction as the first bundle of silicon wafers 4, and set it against the second piece of pearl cotton 3. S5. Repeat step S4 alternately until the placement of silicon wafer 4 in chamber A is completed, and place a corrugated plate 2 against the outer wall of the last bundle of silicon wafers 4, keeping the arrow of the corrugated plate 2 facing upward. S6, then use another piece of tracing paper 5 to wrap the silicon wafer 4 assembly, which consists of corrugated board 2, pearl cotton 3, silicon wafer 4 and tracing paper 5, in chamber A counterclockwise. After completing the above operations in chamber S7, repeat steps S1 to S6 to sequentially complete the packaging of silicon wafers 4 in chambers B, C, and D. After all chambers have been processed, close the lid of the packaging box 1 to complete the packaging of the entire box. Each bundle of silicon wafers 4 contains 175 wafers. Through the independent chambers and the layered arrangement of corrugated board 2, pearl cotton 3, silicon wafers 4, and tracing paper 5, the cumbersome operation of individually bagging each bundle of silicon wafers 4 is eliminated, simplifying the packaging process and ensuring the consistency of packaging in each chamber. At the same time, the tracing paper 5 replaces plastic bags, increases the ventilation effect, and avoids damage to the silicon wafers 4 from condensation during storage and transportation.

[0018] Furthermore, the packaging box 1 includes a box body 11 and a cover plate 12, and the box body 11 has four chambers. The four chambers and the cover plate 12 form a closed protective space, ensuring the neat placement of the silicon wafers 4 during packaging, and preventing the intrusion of external impurities during storage and transportation, thus preventing the deformation of the chambers from damaging the silicon wafers 4.

[0019] Furthermore, the packaging box 1 is made of foam material, and the surface of the foam box is free of burrs, chips, cracks, and dirt. The box body 11 and the lid fit well, with no flaking or shedding. The foam packaging box 1 provides cushioning and shock absorption, reduces the overall weight of the packaging, facilitates handling and circulation, and reduces the shaking of the silicon wafer 4 caused by a loose lid during transportation.

[0020] Furthermore, the packaging operations for the four chambers are performed sequentially, with the silicon wafers 4 placed in the same orientation in each chamber. This uniform orientation ensures the entire box of silicon wafers 4 is neat and orderly, facilitating even stress during subsequent storage and stacking, and reducing time-consuming wafer retrieval and accidental damage caused by disordered orientation.

[0021] Furthermore, a corrugated plate 2 is first placed at the bottom of the chamber, and pearl cotton 3 is placed between the bundles of silicon wafers 4 and between the bundles of silicon wafers 4 and the corrugated plate 2. Another corrugated plate 2 is placed on top of the last bundle of silicon wafers 4 at the top of the chamber. The corrugated plate 2 enhances the support strength of the upper and lower parts of the chamber, preventing the silicon wafers 4 from being deformed under pressure. The pearl cotton 3 forms a buffer between the bundles of silicon wafers 4, absorbing the vibration and impact during transportation, preventing damage caused by friction and collision between the bundles of silicon wafers 4, and ensuring the safe transportation of the silicon wafers 4.

[0022] Furthermore, each bundle of silicon wafers 4 to be placed into the chamber has tracing paper 5 of the same size as the silicon wafer 4 placed at both ends, and the silicon wafers 4 are placed into the chamber in a preset direction, with all bundles of silicon wafers 4 in the same chamber maintaining the same placement direction. The tracing paper 5 at both ends of the silicon wafers 4 directly isolates them from direct contact with other components, preventing edge scratches and dust contamination. The uniform placement direction within the same chamber ensures that the silicon wafers 4 are stacked neatly, reducing frictional damage caused by displacement during transportation.

[0023] Furthermore, the pearl cotton 3 is used for buffering and isolation between the bundles of silicon wafers 4, and its density meets the requirements for scratch and collision prevention during the transportation of photovoltaic silicon wafers 4. The pearl cotton 3 effectively absorbs vibration energy, preventing damage to the bundles of silicon wafers 4 due to collisions, while maintaining dimensional stability.

[0024] Furthermore, the corrugated plate 2 is a single-corrugated structure made of high-strength corrugated paper, used to enhance the support strength of the bottom and top of the chamber, and the arrow direction of the corrugated plate 2 matches the placement direction of the silicon wafer 4. The single-corrugated structure made of high-strength corrugated paper increases the support strength of the upper and lower parts of the chamber, preventing the chamber from collapsing due to stress during packaging stacking or transportation, and protecting the silicon wafer 4 from compression.

[0025] Furthermore, the tracing paper 5 is size-compatible with the silicon wafer 4, and the tracing paper 5 covers the upper, lower, and side surfaces of the silicon wafer 4 assembly. The tracing paper 5 prevents impurities from contaminating the silicon wafer 4 and causing scratches, while also increasing air permeability.

[0026] Furthermore, the packaging operations in the four chambers A, B, C, and D are completed sequentially. That is, after all the steps in chamber A are completed, the operation in chamber B is started, and so on until chamber D. By packaging and placing the items one by one, omissions caused by overlapping operations in multiple chambers are avoided, the standardization of the packaging operation is improved, and the packaging is more convenient for operators, thereby improving the overall packaging efficiency.

[0027] The above embodiments are merely preferred technical solutions of the present invention and should not be considered as limitations on the present invention. The embodiments and features described in these embodiments can be arbitrarily combined without conflict. The scope of protection of the present invention should be limited to the technical solutions described in the claims, including equivalent substitutions of the technical features described in the claims. That is, equivalent substitutions and improvements within this scope are also within the scope of protection of the present invention.

Claims

1. A method for rapid boxing of silicon wafers, characterized in that: Includes a packaging box (1), which includes four independent chambers A, B, C and D. The size of the chambers is adapted to the size of the silicon wafer (4). The four chambers have the same structure and the same size. Includes the following steps: S1, a corrugated plate (2) is placed against one side wall of chamber A, with the arrow of the corrugated plate (2) pointing upwards; S2, the first piece of pearl cotton (3) is attached to the inner wall of the corrugated board (2), and the size of the pearl cotton (3) is the same as that of the corrugated board (2); S3, place a piece of sulfuric acid paper (5) of the same size as the silicon wafer (4) on the front and back sides of the first bundle of silicon wafers (4), and then put the silicon wafer (4) together with the sulfuric acid paper (5) on both sides into the cavity, so that one side of the silicon wafer (4) is attached to the side wall of the pearl cotton (3) and the placement direction is kept uniform. S4, place a second piece of pearl cotton (3) of the same specification on the other side wall of the first bundle of silicon wafers (4), then place a piece of sulfuric acid paper (5) that matches the size of the silicon wafer (4) on each side of the front and back of the second bundle of silicon wafers (4), put it into the chamber in the same direction as the first bundle of silicon wafers (4), and attach the second piece of pearl cotton (3). S5, repeat step S4 alternately until the placement of silicon wafer (4) in chamber A is completed, and a corrugated plate (2) is attached to the outer wall of the last bundle of silicon wafers (4), keeping the arrow of the corrugated plate (2) facing upward; S6, then use another piece of tracing paper (5) to wrap the silicon wafer (4) assembly consisting of corrugated board (2), pearl cotton (3), silicon wafer (4) and tracing paper (5) in chamber A counterclockwise; After completing the above operations in chamber S7, repeat steps S1 to S6 to complete the packaging of silicon wafers (4) in chambers B, C, and D in sequence. After all chambers have been operated, close the top cover of the packaging box (1) to complete the whole box packaging.

2. The packaging method for rapid boxing of silicon wafers according to claim 1, characterized in that: The packaging box (1) includes a box body (11) and a cover plate (12), and the box body (11) has four chambers.

3. The packaging method for rapid boxing of silicon wafers according to claim 2, characterized in that: The packaging box (1) is made of foam material, and the surface of the foam box is free of burrs, chips, cracks and dirt. The box body (11) and the box lid fit well and there is no flaking or shedding.

4. The packaging method for rapid boxing of silicon wafers according to claim 2, characterized in that: The packaging operation of the four chambers is carried out sequentially, and the silicon wafers (4) in each chamber are placed in the same orientation.

5. The packaging method for rapid boxing of silicon wafers according to claim 2, characterized in that: A corrugated plate (2) is placed at the bottom of the chamber, and pearl cotton (3) is placed between the bundles of silicon wafers (4) and between the bundles of silicon wafers (4) and the corrugated plate (2). A corrugated plate (2) is placed on top of the last bundle of silicon wafers (4) at the top of the chamber.

6. The packaging method for rapid boxing of silicon wafers according to claim 1, characterized in that: Each bundle of silicon wafers (4) to be placed into the chamber has sulfuric acid paper (5) of the same size as the silicon wafer (4) placed at both ends, and the silicon wafers (4) are placed into the chamber in a preset direction, and the placement direction of each bundle of silicon wafers (4) in the same chamber is consistent.

7. The packaging method for rapid boxing of silicon wafers according to claim 1, characterized in that: The pearl cotton (3) is used for buffering and isolation between bundles of silicon wafers (4), and its density meets the requirements for anti-scratch and anti-collision during the transportation of photovoltaic silicon wafers (4).

8. The packaging method for rapid boxing of silicon wafers according to claim 1, characterized in that: The corrugated board (2) is a single corrugated structure made of high-strength corrugated paper, used to enhance the support strength of the bottom and top of the chamber, and the arrow direction of the corrugated board (2) matches the placement direction of the silicon wafer (4).

9. The packaging method for rapid boxing of silicon wafers according to claim 1, characterized in that: The sulfuric acid paper (5) is size-matched to the silicon wafer (4), and the wrapping range of the sulfuric acid paper (5) covers the upper and lower surfaces and sides of the silicon wafer (4) assembly.

10. The packaging method for rapid boxing of silicon wafers according to claim 1, characterized in that: The packaging operations of the four chambers A, B, C, and D are completed sequentially. That is, after all the steps in chamber A are completed, the operation in chamber B is started, and so on until chamber D.

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