Fiber composite flocculus and preparation process thereof

Abstract

The invention discloses a fiber composite flocculus and a preparation process thereof, belongs to the technical field of textiles, and solves the problem that an existing fiber composite flocculus is poor in uniformity, washability and thermal insulation performance. Comprising superfine polyimide staple fibers, hollow spiral polyester staple fibers, superfine polyester staple fibers, low-melting-point staple fibers and a binder. The weight ratio of the superfine polyimide staple fiber to the hollow spiral polyester staple fiber to the superfine polyester staple fiber to the low-melting-point staple fiber is 20: 50: 20: 10 or 20: 40: 30: 10. The prepared flocculus is good in hand feeling comfort, good in warm keeping performance, washable and good in uniformity, has antibacterial and far infrared performance, meets wearing requirements of multiple scenes such as outdoor, sports and commuting, and provides high-quality wearing experience for a user.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of textiles, and particularly relates to a fiber composite flake and a preparation process thereof. BACKGROUND

[0002] Spray glue cotton is a non-woven material made by spraying glue, which is soft and fluffy, has good warmth retention and air permeability, and is commonly used for clothing lining, bedding, toy filling, etc., and has the characteristics of lightness and practicality.

[0003] The current spray glue cotton mainly uses polyester fiber raw materials. In the production process of the spray glue cotton, the following steps need to be processed: fiber pretreatment, glue spraying and curing process, and quality control indicators. In the fiber pretreatment, multiple automatic weighing feeding devices are used to accurately control the fiber ratio, and fluffy fiber layers are prepared through steps such as loosening and carding to control the uniformity of the fiber web to reduce weight deviation. In the glue spraying and curing process, the pressure spraying and vacuum liquid suction technology are combined to optimize the distribution of the adhesive. In the quality control indicators, data such as weight deviation, width stability, and compression elastic recovery rate need to be strictly detected to ensure the durability and washing stability of the product. However, the current conventional spray glue cotton does not have a standardized operation in the fiber pretreatment process, and the yarn thickness and ratio are random, resulting in poor uniformity of the final spray glue cotton. In addition, since it completely uses polyester fiber raw materials, the warmth retention performance of polyester fiber is general, and the non-standard operation in the fiber pretreatment process leads to poor fiber uniformity, resulting in poor warmth retention of the spray glue cotton obtained after spraying glue. Finally, since the current conventional spray glue is completed by a spray glue machine, the connection strength of the fibers in the spray glue cotton is not high, the fibers are displaced during washing, the glue points are detached, the cotton sheet becomes thin and sparse, and finally the washability of the spray glue cotton is poor.

[0004] Therefore, a fiber composite flake and a preparation process thereof are proposed to solve or alleviate the above problems. SUMMARY

[0005] The present application relates to the technical field of textiles, and particularly relates to a fiber composite flake and a preparation process thereof.

[0006] To achieve the above-mentioned purpose, the present application adopts the following technical solutions: A fiber composite wadding includes ultrafine polyimide staple fiber, hollow spiral polyester staple fiber, ultrafine polyester staple fiber, low melting point staple fiber, and binder, wherein the ratio of ultrafine polyimide staple fiber, hollow spiral polyester staple fiber, ultrafine polyester staple fiber, and low melting point staple fiber is 20:50:20:10 or 20:40:30:10 by weight.

[0007] Preferably, the ultrafine polyimide staple fiber has a fineness of 1.5D and a length of 51mm, the hollow spiral polyester staple fiber has a fineness of 3D and a length of 64mm, the ultrafine polyester staple fiber has a fineness of 1.5D and a length of 51mm, and the low melting point staple fiber has a fineness of 3D and a length of 64mm.

[0008] Preferably, the adhesive is a self-crosslinking acrylate or a vinyl acetate-N-acrylate binary emulsion.

[0009] The present invention also provides a process for preparing fiber composite wadding, which includes the following steps: Raw materials are unpacked using an electronic weighing unpacking machine to prepare various fibers; Initial opening: The fibers are initially opened and mixed by a coarse opener and a fine opener, and then conveyed to the next process by a cotton conveying fan. Mixing and storage: The initially opened fibers are thoroughly mixed and stored in the large warehouse cotton blending machine; Fine opening: The raw materials, which are placed in proportion, are fed into the opening machine, where the fibers are broken up and then conveyed to the next process after being removed by a strong magnet through the airflow of the cotton conveying fan. The vibrating cotton box forms a uniform cotton slurry from the finely opened and mixed fibers and continuously feeds it to the next process. Combing, using a combing machine to comb the fibers; In the process of laying the net, the cotton net is evenly laid onto the bottom curtain in the net laying machine; Spraying involves using a spraying device to spray the adhesive into the fiber layer under high pressure. A non-contact detection device is then used to check the sprayed fiber composite wadding for adhesive migration. If no problem is detected, the spraying device continues to operate under high pressure. If a problem is detected, the spraying device is controlled to spray in small amounts and multiple times using a low-pressure, large-droplet method. Drying and shaping: The product is heated evenly by the high temperature of the oven. If the previous spraying process is found to be without problems, the product is kept in its original state. If the previous spraying process is found to be with problems, the oven inlet temperature is increased to 140 degrees Celsius, the middle section temperature is decreased to 130 degrees Celsius, and the rear section temperature is decreased to 120 degrees Celsius. Edge trimming and winding: The product is cut and wound using an edge trimming and winding machine.

[0010] Preferably, the spraying device includes a frame, side frames fixedly connected to the frame, a plurality of rollers rotatably connected to the side frames via bearing seats, a housing fixedly connected to the frame, a drive motor disposed within the housing, and a suction pump. The rotor shaft of the drive motor passes through the housing to the outside and is fixedly connected to a drive sprocket. One end of each of the rollers passes through the side frames and is fixedly connected to a co-moving sprocket. The co-moving sprockets are connected by a transmission chain. One end of one of the rollers, away from the co-moving sprocket, passes through the side frames and is fixedly connected to a driven sprocket. The driven sprocket and the drive sprocket are connected by a chain drive. A mounting frame is fixedly connected to the side frames, and a spray pipe is fixedly connected to the mounting frame. A plurality of atomizing nozzles are connected to the spray pipe in an array. The spray pipe is connected to the suction pump via a water pipe passing through the housing. The suction pump is connected to a feed pipe for guiding the adhesive in. A base plate located below the rollers is fixedly connected between the two side frames.

[0011] Preferably, the non-contact detection device includes a near-field sensor array probe, a multi-channel multi-frequency vector measurement module, and a main control and real-time processing module mounted on a mounting bracket in the spraying device. Multiple radio frequency signal output terminals of the near-field sensor array probe are connected to the corresponding radio frequency signal input terminals of the multi-channel multi-frequency vector measurement module via multiple coaxial cables. The digital control bus and high-speed data bus terminals of the multi-channel multi-frequency vector measurement module are connected to the corresponding digital control bus and high-speed data bus terminals of the main control and real-time processing module. The multiple digital control signal output terminals of the main control and real-time processing module are connected to the digital control signal input terminals of the near-field sensor array probe. The main control and real-time processing module is electrically connected to the suction pump and drying oven in the spraying device.

[0012] Preferably, the near-field sensor array probe includes several sets of open-loop resonators, several single-pole quad-throw (SPQT) RF switch chips, multiple RF connectors, and pin header connectors. Each set of open-loop resonators contains four units. Each set of open-loop resonators is electromagnetically coupled via a microstrip transmission line and connected to the four RF ports of each SPQT RF switch chip. The common terminal of each SPQT RF switch chip is connected to the center signal pin of an RF connector. The RF connector is connected to the Vector Network Analyzer (VNA) chip in the multi-channel multi-frequency vector measurement module. Two digital control pins of each SPQT RF switch chip are connected to the corresponding pins of the pin header connector. The pin header connector is connected to the general-purpose input / output pins of the field-programmable gate array in the main control and real-time processing module.

[0013] Preferably, the multi-channel multi-frequency vector measurement module includes a voltage-controlled temperature-compensated crystal oscillator, a 1:4 power divider, a vector network analyzer (VNA) chip, and a high-speed connector. The signal output pin of the voltage-controlled temperature-compensated crystal oscillator is connected to the input port of the 1:4 power divider via a microstrip line. The four output ports of the 1:4 power divider are respectively connected to the reference clock input pins of the four VNA chips via four delay-matched microstrip lines. The RF input pin of each VNA chip is connected to the RF connector in the near-field sensor array probe. The serial clock pin, serial data input / output pin, serial data output pin, and chip select pin of each VNA chip are connected to the first set of control pins of the high-speed connector. The parallel low-voltage differential signal data output pin of each VNA chip is connected to the second set of data pins of the high-speed connector. The high-speed connector is connected to the field-programmable gate array in the main control and real-time processing module.

[0014] Preferably, the main control and real-time processing module includes a field-programmable gate array (FPGA), an embedded central processing unit (CPU), DDR4 memory, and an Ethernet physical layer chip. Multiple serial peripheral interface pins of the FPGA are connected to the serial peripheral interface control pins of the vector network analyzer (VNA) chip in the multi-channel multi-frequency vector measurement module via high-speed connectors. Multiple low-voltage differential signal data receiving pins of the FPGA are connected to the low-voltage differential signal data output pins of the VNA chip in the multi-channel multi-frequency vector measurement module via high-speed connectors. The FPGA is connected to the embedded CPU via an advanced scalable interface bus. The embedded CPU is connected to the DDR4 memory and the Ethernet physical layer chip. The first general-purpose input / output pin and the second general-purpose input / output pin of the twelfth memory area of ​​the FPGA are connected to the single-pole four-throw (SPFT) RF switch chip in the near-field sensor array probe via pin header connectors. The first digital control pin and the second digital control pin, the master output slave input pin of the serial peripheral interface master controller of the field-programmable gate array (FPGA) are connected to the serial data input / output pin of the first vector network analyzer (VNA) chip, the master input slave output pin of the serial peripheral interface master controller zero of the FPGA is connected to the serial data output pin of the first vector network analyzer (VNA) chip, the serial clock pin of the serial peripheral interface master controller zero of the FPGA is connected to the serial clock pin of the first vector network analyzer (VNA) chip, the chip select zero pin of the serial peripheral interface master controller zero of the FPGA is connected to the chip select pin of the first vector network analyzer (VNA) chip, the positive input terminal and the negative input terminal of the first low-voltage differential signal receiving pin pair of the thirty-third memory area of ​​the FPGA are respectively connected to the positive output terminal and the negative output terminal of the first low-voltage differential signal data output pin of the first vector network analyzer (VNA) chip, and the FPGA is connected to the frequency converter of the suction pump in the spraying device and the frequency converter of the drying oven through a digital-to-analog converter.

[0015] Preferably, the main control and real-time processing module further includes a power management integrated chip. The multiple power output pins of the power management integrated chip provide the required operating voltages for the field-programmable gate array (FPGA), the embedded central processing unit (CPU), the DDR4 memory, and the Ethernet physical layer chip, respectively. The voltage input pin of the power management integrated chip is connected to an external +12V power supply. The first enable pin, the second enable pin, and the third enable pin of the power management integrated chip are respectively connected to their voltage input pins through pull-up resistors. The first voltage output pin of the power management integrated chip outputs +3.3V after passing through a first filter capacitor to power the memory area power pin of the FPGA chip. The second voltage output pin of the power management integrated chip outputs +1.8V after passing through a second filter capacitor to power the memory area power pin of the FPGA chip and the digital power pin of the vector network analyzer (VNA) chip. The third voltage output pin of the power management integrated chip outputs +1V after passing through a third filter capacitor to power the core voltage pin of the FPGA chip.

[0016] The present invention has the following beneficial effects: The wadding produced by this invention has a comfortable feel, good warmth retention, is washable, has good uniformity, and possesses antibacterial and far-infrared properties, meeting the needs of various scenarios such as outdoor activities, sports, and commuting, and providing users with a high-quality wearing experience. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the fiber composite wadding in this invention; Figure 2 This is a flowchart of the fiber composite flocculant preparation process in this invention; Figure 3 This is a schematic diagram of the spraying device in this invention; Figure 4 This is a structural block diagram of the non-contact detection device in this invention; Figure 5 This is a comparison chart of the product preliminary testing in this invention; Figure 6 The structural proportions of the optimal product are referenced in this invention; Figure 7 This is a comparison chart of the developed sample tests in this invention; Figure 8This is a comparison chart of the cold storage results for sample garments in this invention.

[0019] In the diagram: 1. Frame; 2. Base plate; 3. Side frame; 4. Bearing housing; 5. Roller; 6. Drive chain; 7. Protective cover; 8. Housing; 9. Mounting bracket; 10. Water pipe; 11. Spray pipe; 12. Near-field sensor array probe; 1201. Open-loop ring resonator; 1202. Single-pole quad-throw RF switch chip; 1203. RF connector; 1204. Pin header connector; 13. Multi-channel multi-frequency vector measurement module; 1301. Voltage-controlled temperature-compensated crystal oscillator; 1302. 1:4 power divider; 1303. Vector network analyzer (VNA) chip; 1304. High-speed connector; 14. Main control and real-time processing module; 1401. Field-programmable gate array (FPGA); 1402. Embedded central processing unit (CPU); 1403. DDR4 memory; 1404. Ethernet physical layer chip; 1405. Power management integrated chip. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0022] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0023] In the description of this invention, it should be understood that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are only used to facilitate the description of this invention and to simplify the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0024] Furthermore, the terms "first," "second," and "third" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0025] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0026] A fiber composite wadding, Figure 1 For ease of understanding of this embodiment, the schematic diagram is as follows: Figure 1 As shown, it includes ultrafine polyimide staple fiber, hollow spiral polyester staple fiber, ultrafine polyester staple fiber, low melting point staple fiber, and binder. Specifically, the ratio of ultrafine polyimide staple fiber, hollow spiral polyester staple fiber, ultrafine polyester staple fiber, and low melting point staple fiber by weight is 20:50:20:10 or 20:40:30:10.

[0027] Among them, the specifications of ultrafine polyimide staple fiber are 1.5D fineness and 51mm length, the specifications of hollow spiral polyester staple fiber are 3D fineness and 64mm length, the specifications of ultrafine polyester staple fiber are 1.5D fineness and 51mm length, the specifications of low melting point staple fiber are 3D fineness and 64mm length, and the binder is self-crosslinking acrylate or vinyl acetate-N-acrylate binary emulsion.

[0028] Among them, ultrafine polyimide staple fiber is fluffy before washing due to its fiber density. In addition, its material properties have good high temperature resistance, good stability, and electrical insulation. Polyimide fiber has a low thermal conductivity, close to that of air, and has good thermal insulation properties, providing good warmth retention. It also has antibacterial properties, making it convenient for daily wear and storage. Compared with polyester, it has low thermal conductivity and far-infrared function, which improves its heat retention performance. Hollow spiral polyester staple fiber has a hollow ratio of 30-35%, which brings lightweight heat-locking performance and good support and resilience, thus improving its heat preservation. It does not affect the structure of other yarns while having good warmth preservation performance. In addition, it has good elasticity, moderate moisture absorption and good light resistance. Hollow spiral polyester staple fiber has characteristics such as lightweight, heat-locking, support and resilience, which meet the requirements of warmth preservation and compression resilience, similar to the down shaft of down feathers. On the other hand, ultrafine polyester staple fiber has a delicate feel, is wear-resistant, and is easy to dye. At the same time, ultrafine polyester staple fiber forms a tight network structure, similar to the downy feathers. This network structure forms evenly dispersed pores, which brings a heat-locking effect. The low melting point staple fiber has a heat-melting core-sheath structure, which has good heat-melting adhesion, is soft and comfortable. After heating, the outer layer melts, which makes it act as an adhesive, fixes the shape of the wadding, and does not easily cause fiber slippage. It enhances support, resilience, and washability, making the overall structure of the wadding stable.

[0029] The above materials are mixed and layered in a certain proportion to achieve the functional requirements of overall uniformity and heat retention.

[0030] This invention also provides a process for preparing fiber composite flocculants, such as... Figure 2 As shown, the preparation of the above-mentioned fiber composite wadding includes the following steps: Raw material unpacking is done using an electronic weighing unpacking machine to prepare various fibers. Specifically, the electronic weighing unpacking machine is used for material preparation, and then multiple automatic weighing and feeding devices are used to achieve the accuracy of fiber mixing ratio, thereby cooperating with the carding machine in the subsequent process to improve the uniformity of the fiber web. The initial opening process involves using a coarse opener and a fine opener to initially open and mix the fibers, which are then conveyed to the next process by a cotton conveying fan. This process ensures that the fibers are mixed evenly and reduces fiber damage. Mixing and storage: The initially opened fibers are fully mixed and stored in the large warehouse cotton blender. The mixing time of the large warehouse cotton blender is 130 seconds / 20kg of material. The large warehouse cotton blender achieves large-scale one-time mixing, making the fiber mixing more uniform. The storage time is controlled to prevent the fibers from being squeezed into clumps. Fine opening: The raw materials, which are placed in proportion, are fed into the opening machine to break up the fibers. The fibers are then transported to the next process after being cleaned by a strong magnet through the airflow of the cotton conveying fan, thus completing the pretreatment of the fibers with organosilicon. The vibrating cotton box forms a uniform cotton slurry from the finely opened and mixed fibers and continuously feeds it to the next process. This operation ensures that the processed fibers maintain a low weight deviation when real-time weight deviation detection is performed, resulting in high width stability and ensuring product consistency. Combing involves using a combing machine to comb the fibers. The combing machine rotates at 1100 r / min. The high-speed rotation of the combing machine is to cooperate with the previous process to make the fiber combing more uniform. In the web-laying machine, the cotton web is evenly laid onto the bottom curtain. The bottom curtain and the ring curtain are made of wood, while the slanted curtain, the flat curtain, and the large flat curtain are made of high-grade, high-quality leather. The web-laying speed of the machine is 72 m / min, and the weight of each layer of cotton web is 12 g ± 2 m. 2 The binder ratio is 1:6. By effectively controlling the web laying speed of the web laying machine, the final output product maintains good uniformity. Spraying involves using a spraying device to spray the adhesive into the fiber layer under high pressure. A non-contact detection device is then used to check the sprayed fiber composite wadding for adhesive migration. If no problem is detected, the spraying device continues to operate under high pressure. If a problem is detected, the spraying device is controlled to spray in small amounts and multiple times using a low-pressure, large-droplet method. The drying and shaping process involves using a high-temperature oven to ensure even heating of the product. If the previous spraying process detects no problems, the product remains in its original state. If a problem is detected in the previous spraying process, the oven inlet temperature is increased to 140 degrees Celsius, the middle section temperature is decreased to 130 degrees Celsius, and the rear section temperature is decreased to 120 degrees Celsius. The oven's airflow is 35 Hz. By controlling the temperatures of the top, middle, and bottom meshes within the oven, overheating damage to the fibers is prevented, ensuring product quality. Furthermore, the oven treats the sprayed fiber layer with drying and high-temperature curing, extending the drying time, fixing fiber connection points, and preserving porosity to prevent material hardening. This ensures the final product has excellent heat retention and washability. Edge trimming and winding: Use an edge trimming and winding machine to cut and wind the product, reasonably control the tension and speed, avoid excessive stretching, and prevent deformation of the final product.

[0031] To further demonstrate that, in this embodiment, modifying parameters during the processing will affect the uniformity of the fiber composite wadding, the following experiment was designed in this embodiment: To ensure the comparability and reproducibility of test data, the tested fiber composite wadding must first undergo a complete pre-recovery process of "semi-vacuuming, compression, and static setting." That is, after the factory compression packaging is unsealed, it should be placed in a room at normal temperature and pressure for at least 24 hours to allow the fibers to fully rebound and the thickness to stabilize. Then, it should be moved into a standard laboratory atmospheric environment with a temperature of 20 degrees Celsius and a relative humidity of 65% for at least 4 hours to allow the absorption and release of moisture to reach a dynamic balance. This eliminates the structural stress and moisture content deviation caused by transportation compression and environmental fluctuations, ensuring that each batch of samples enters the subsequent key indicator tests such as heat retention, bulkiness, and compression elasticity in a uniform physical state, thereby improving the accuracy and comparability of the results.

[0032] To eliminate potential weight differences between the edges and the center of a 1.5-meter-wide wadding cotton, a 20cm x 20cm square sample should be cut from each of the following three sampling points: approximately 10cm from the edge, 10cm from the center of the width, and 10cm from the corresponding right side. The sample should then be weighed immediately using an electronic balance with an accuracy of 0.01g and the weight recorded. The average of the three points should be used as the representative value of the weight per unit area of ​​the material, thus ensuring the accuracy and representativeness of subsequent quantitative testing and comparative analysis.

[0033] The following weighing records were obtained, as shown in the table below.

[0034] Furthermore, by calculating the uniformity index of this embodiment and the conventional process based on the weighing record, it is only necessary to calculate the standard deviation and average value of several to determine their uniformity. It is also clear that in this embodiment, modifying the parameters during the processing will affect the uniformity of the fiber composite wadding and will have a positive effect on the fiber composite wadding, making its uniformity better.

[0035] In summary,

[0036] In the preparation of fiber composite wadding, the rotation speed setting of the carding process, the weight control of a single layer of wadding, and the wadding speed together constitute the core variables of the process window, and their upper and lower limits directly determine the final structural uniformity and heat insulation performance of the product.

[0037] When the carding machine speed is increased, the blending time and the carding speed are increased simultaneously, the fiber bundles are more fully loosened, the degree of single fiberization is significantly improved, and the fiber arrangement inside the cotton web tends to be isotropic. This not only achieves a finer carding effect, but also creates conditions for reducing the weight per unit layer in the future.

[0038] If the rotation speed is too low, the fibers will not be separated sufficiently, and coarse fiber bundles will easily remain, resulting in a dispersed basis weight distribution and disordered pore structure.

[0039] When the basis weight of a single layer is lowered to the lower limit, more layers need to be stacked to produce a finished product with the same total basis weight. This creates a large number of static air microcavities between the layers, which increases the overall porosity and significantly extends the heat conduction path, thus improving the heat retention value. However, if the basis weight is too low, the interlayer bonding force weakens, making it easy for delamination and blistering defects to occur.

[0040] Regarding the web laying speed, for every 0.1 m / min reduction, the transverse weight CV value can decrease. The slower the speed, the longer the cotton web accumulates on the fabric, and the fibers can self-level under the action of gravity and electrostatics, thereby obtaining higher areal density uniformity.

[0041] Conversely, while high-speed web laying increases production capacity, it can cause cloudiness due to fiber inertial drift, ultimately affecting the appearance and warmth consistency of the finished product.

[0042] Therefore, in this embodiment, by making reasonable changes to the parameters in the processing technology, the uniformity and warmth retention of the fiber composite wadding can be significantly improved.

[0043] Meanwhile, in order to verify the improved thermal insulation performance of the concentrated fiber composite wadding in this embodiment, a cold-room test was conducted on sample garments, and the optimal ratio in this embodiment was compared with other ratios and products from four companies in the prior art.

[0044] Specifically as follows: Figure 5 As shown, products from four companies, A, B, C, and D, were selected for preliminary testing. A 100g sample of one model from each of the four companies was compared: 100% polyester, 100% polyester, 100% polyester, and 80% polyester + 20% PI. The pre-wash warm weight ratio, pre-wash clo value, and post-wash warm weight ratio and post-wash clo value were compared. Ultimately, it was found that company B-1 performed best.

[0045] Therefore, Company B's B-1 is compared with the optimal ratio in this embodiment and other ratios, and Scheme B with a ratio of 20:40:20:10 in this embodiment is defined, and Scheme A with a ratio of 20:50:20:10 in this embodiment is defined.

[0046] Specifically, such as Figure 6 As shown, both Scheme A and Scheme B are composed of 80% polyester + 20% PI, while Scheme B-1 is 100% polyester.

[0047] Furthermore, 100g samples of the above three models were taken for cleaning tests. Before and after the tests, the Clo value and warm weight ratio of the three models were tested, and the final test results are as follows: Figure 7 As shown, it can be seen that so far, Solution B has shown little change before and after cleaning, and the product is more stable.

[0048] Afterwards, a cold storage test was conducted on the sample garment, and two testers were required to conduct the test. The test involved splicing the left and right halves of the cotton-padded garment together and comparing the results. Temperature data of the body surface before and after the cold storage test were collected, and the temperature drop value was calculated.

[0049] Post-test results are as follows Figure 8 As shown, after comparing the cold storage results of the sample garments from several different schemes, it can be seen that the overall results of scheme B, which is the ratio of 20:40:20:10 in this embodiment, are optimal. Therefore, it can be seen that the optimal ratio and the improvement of the processing parameters in this embodiment can significantly enhance the heat retention performance of the fiber composite wadding.

[0050] like Figure 3As shown, the spraying device includes a frame 1, a side frame 3 fixedly connected to the frame 1, several rollers 5 rotatably connected to the side frame 3 via bearing seats 4, a housing 8 fixedly connected to the frame 1, a drive motor installed in the housing 8, and a suction pump. The rotor shaft of the drive motor passes through the housing 8 to the outside and is fixedly connected to a drive sprocket. One end of each roller 5 passes through the side frame 3 and is fixedly connected to a co-moving sprocket. The co-moving sprockets are connected by a transmission chain 6, and one end of one roller 5 away from the co-moving sprocket passes through the side frame 3 and is fixedly connected. A driven sprocket is connected to the drive sprocket via a chain drive. A protective cover 7, which can be fitted onto the outside of the drive chain 6, is hinged to one side of the side frame 3. A mounting frame 9 is fixedly connected to the side frame 3, and a spray pipe 11 is fixedly connected to the mounting frame 9. Several arrayed atomizing nozzles are connected to the spray pipe 11. The spray pipe 11 is connected to a suction pump through a water pipe 10 that penetrates the casing 8. The suction pump is connected to a feed pipe, which is used to guide the adhesive in. A base plate 2 located below several rollers 5 is fixedly connected between the two side frames 3.

[0051] When the fiber composite wadding needs to be bonded with an adhesive, the fiber composite wadding can be placed on rollers 5. The drive motor drives several rollers 5 to rotate in the same phase through the drive sprocket, chain, and driven sprocket. In this way, the fiber composite wadding can move forward with the rollers 5. During this process, the suction pump can draw the adhesive from the outside. The adhesive enters the spray pipe 11 through the feed pipe, suction pump, and water pipe 10. The atomizing nozzle connected to the spray pipe 11 can spray the adhesive onto the fiber composite wadding. When high-pressure spraying is required, the power of the suction pump is increased to increase its flow rate to ensure that the sprayed adhesive leaves in a high-pressure spray manner. If multiple small-volume slow sprays are required, the power of the suction pump is reduced to reduce the flow rate.

[0052] Due to the formulation of the fiber composite wadding, during the spraying, vacuum absorption, and drying processes, the significant surface energy difference between the hydrophilic ultrafine polyester and polyimide fibers and the hydrophobic hollow spiral polyester fibers treated with silicone oil causes the water-based binder to preferentially wet the hydrophilic fibers during high-pressure spraying. Furthermore, during the initial moisture evaporation process in vacuum absorption and drying, the binder migrates secondary from the hydrophobic to the hydrophilic region via capillary action. This dynamic, microscopic phase separation process is difficult to detect because it shows no apparent abnormalities in the wet state. Ultimately, this results in the binder becoming excessively concentrated in the hydrophilic fiber region, forming rigid "adhesion islands," while creating fragile "seas" in the hydrophobic fiber region. This leads to uneven softness and hardness in the wadding, reduced air permeability, damaged overall structural integrity, and a tendency to delamination or breakage during washing. Although this problem occurs only with a certain probability, it will significantly reduce the yield of this batch of fiber composite wadding products.

[0053] Therefore, it is necessary to perform a non-contact detection device after spraying to determine if there are any problems. If there are problems, the spraying method and drying temperature should be changed; otherwise, the original state should be maintained. However, if the spraying method and drying temperature are completely changed to the state when there are problems, the overall processing speed of spraying and drying will decrease, resulting in a significant decrease in the overall processing efficiency of fiber composite wadding. Therefore, it is necessary to detect and determine if there are any problems, and then adjust the spraying method and drying temperature accordingly.

[0054] like Figure 4 As shown, the non-contact detection device includes a near-field sensor array probe 12, a multi-channel multi-frequency vector measurement module 13, and a main control and real-time processing module 14, all mounted on a mounting bracket 9 in the spraying device. Multiple radio frequency signal outputs of the near-field sensor array probe 12 are connected to the corresponding radio frequency signal inputs of the multi-channel multi-frequency vector measurement module 13 via multiple coaxial cables. The digital control bus and high-speed data bus of the multi-channel multi-frequency vector measurement module 13 are connected to the corresponding digital control bus and high-speed data bus of the main control and real-time processing module 14. The multiple digital control signal outputs of the main control and real-time processing module 14 are connected to the digital control signal inputs of the near-field sensor array probe 12. The main control and real-time processing module 14 is electrically connected to the suction pump and drying oven in the spraying device.

[0055] The near-field sensor array probe 12 includes several sets of open-loop resonators 1201, several single-pole quad-throw RF switch chips 1202, multiple RF connectors 1203, and pin header connectors 1204. Each set of open-loop resonators has four components. Each set of open-loop resonators 1201 is electromagnetically coupled through a microstrip transmission line and connected to the four RF ports of each single-pole quad-throw RF switch chip 1202. The common terminal of each single-pole quad-throw RF switch chip 1202 is connected to the center signal pin of an RF connector 1203. The RF connector 1203 is connected to the vector network analyzer VNA chip 1303 in the multi-channel multi-frequency vector measurement module 13. Two digital control pins of each single-pole quad-throw RF switch chip 1202 are connected to the corresponding pins of the pin header connector 1204. The pin header connector 1204 is connected to the general-purpose input / output pins of the field-programmable gate array 1401 in the main control and real-time processing module 14. The single-pole quad-throw RF switch chip 1202 is model QM25008.

[0056] The multi-channel, multi-frequency vector measurement module 13 includes a voltage-controlled temperature-compensated crystal oscillator 1301, a 1:4 power divider 1302, a vector network analyzer (VNA) chip 1303, and a high-speed connector 1304. The signal output pin of the voltage-controlled temperature-compensated crystal oscillator 1301 is connected to the input port of the 1:4 power divider 1302 via microstrip lines. The four output ports of the 1:4 power divider 1302 are respectively connected to the reference clock input pins of the four VNA chips 1303 via four delay-matched microstrip lines. The RF input pin of each VNA chip 1303 is connected to the RF connector 1203 in the near-field sensor array probe 12. The serial clock pin, serial data input / output pin, serial data output pin, and chip select pin of each VNA chip 1303 are connected to the first set of control pins of the high-speed connector 1304. The parallel low-voltage differential signal data output pin of each VNA chip 1303 is connected to the second set of data pins of the high-speed connector 1304. The high-speed connector 1304 is connected to the field-programmable gate array 1401 in the main control and real-time processing module. The voltage-controlled temperature-compensated crystal oscillator 1301 is model SIT5356, and the VNA chip 1303 is model Analog Devices ADL5960.

[0057] The main control and real-time processing module 14 includes a field-programmable gate array (FPGA) 1401, an embedded central processing unit (CPU) 1402, a DDR4 memory 1403, and an Ethernet physical layer chip 1404. Multiple serial peripheral interface pins of the FPGA 1401 are connected to the serial peripheral interface control pins of the vector network analyzer (VNA) chip 1303 in the multi-channel multi-frequency vector measurement module 13 via a high-speed connector 1304. Multiple low-voltage differential signal data receiving pins of the FPGA 1401 are connected to the low-voltage differential signal data receiving pins of the VNA chip 1303 in the multi-channel multi-frequency vector measurement module 13 via the high-speed connector 1304. The differential signal data output pins are connected. The Field Programmable Gate Array (FPGA) 1401 is connected to the embedded CPU 1402 via an Advanced Scalable Interface (AMI) bus. The embedded CPU 1402 is connected to the DDR4 memory 1403 and the Ethernet physical layer chip 1404. The first and second general-purpose input / output pins of the twelfth memory area of ​​the FPGA 1401 are connected to the first and second digital control pins of the single-pole four-throw (SPFT) RF switch chip 1202 in the near-field sensor array probe 12 via pin header connectors 1204. The serial peripheral connection of the FPGA 1401 is also connected. The main output slave input pin of the main controller is connected to the serial data input / output pin of the first vector network analyzer (VNA) chip 1303. The main input slave output pin of the serial peripheral interface main controller zero of the field-programmable gate array (FPGA) 1401 is connected to the serial data output pin of the first VNA chip 1303. The serial clock pin of the serial peripheral interface main controller zero of the FPGA 1401 is connected to the serial clock pin of the first VNA chip 1303. The chip select pin of the serial peripheral interface main controller zero of the FPGA 1401 is connected to the chip select pin of the first VNA chip 1303. The positive and negative input terminals of the first low-voltage differential signal receiving pin pair of the thirty-third storage area are respectively connected to the positive and negative output terminals of the first low-voltage differential signal data output pin of the first vector network analyzer VNA chip 1303. The field programmable gate array 1401 is connected to the frequency converter of the suction pump in the spraying device and the frequency converter of the oven through the digital-to-analog converter. The model of the field programmable gate array 1401 is Xilinx Kintex-7XC7K325T, the model of the embedded central processing unit 1402 is Xilinx Zynq UltraScale+MPSoC, and the model of the Ethernet physical layer chip 1404 is Marvell 88E1111.

[0058] The main control and real-time processing module 14 also includes a power management integrated chip 1405, model TPS65086. The multiple power output pins of the power management integrated chip 1405 provide the required operating voltages to the field-programmable gate array 1401, the embedded central processing unit 1402, the DDR4 memory 1403, and the Ethernet physical layer chip 1404. The voltage input pin of the power management integrated chip 1405 is connected to a +12V external power supply. The first enable pin, second enable pin, and third enable pin of the power management integrated chip 1405 are respectively connected to their voltage input pins via pull-up resistors. The first voltage output pin of the power management integrated chip 1405 outputs +3.3V after passing through the first filter capacitor, which powers the memory area power pin of the field-programmable gate array 1401 chip. The second voltage output pin of the power management integrated chip 1405 outputs +1.8V after passing through the second filter capacitor, which powers the memory area power pin of the field-programmable gate array 1401 chip and the digital power pin of the vector network analyzer VNA chip 1303. The third voltage output pin of the power management integrated chip 1405 outputs +1V after passing through the third filter capacitor, which powers the core voltage pin of the field-programmable gate array 1401 chip.

[0059] In actual work, The reference complex reflection coefficient dataset of the reference sample is obtained through the near-field sensor array probe 12 and the multi-channel multi-frequency vector measurement module 13. The radio frequency switch chip in the near-field sensor array probe 12 is controlled to sequentially select each sensing unit. The vector network analyzer (VNA) chip 1303 in the multi-channel multi-frequency vector measurement module 13 is controlled to perform scanning measurements at multiple preset frequency points. The reference complex reflection coefficient of each sensing unit at each frequency point is recorded and stored. The coefficient is represented in complex form and includes amplitude and phase information. The reference complex reflection coefficient is represented as the complex measurement value of each sensing unit corresponding to each frequency point in two-dimensional spatial coordinates. The measurement complex reflection coefficient dataset of the sample under test is acquired in real time through the near-field sensor array probe 12 and the multi-channel multi-frequency vector measurement module 13. When the sample under test passes under the near-field sensor array probe 12, the same timing and control logic as the acquisition of the reference data is used to measure and acquire the measurement complex reflection coefficient of each sensing unit at each frequency point in real time. The main control and real-time processing module 14 calculates the difference data between the measured complex reflection coefficient dataset and the reference complex reflection coefficient dataset, calculates the complex difference between the measured complex reflection coefficient and the reference complex reflection coefficient, and calculates the amplitude difference and phase difference of the complex reflection coefficient respectively. The main control and real-time processing module 14 extracts the resonant frequency offset and quality factor change of each sensing unit in multiple frequency bands from the differential data as characteristic parameters. For each sensing unit, the frequency corresponding to the minimum reflection amplitude in its working frequency band is found, i.e., the resonant frequency. The difference between the measured resonant frequency and the reference resonant frequency is calculated to obtain the resonant frequency offset. The difference between the measured quality factor and the reference quality factor is calculated to obtain the quality factor change. The quality factor is calculated by dividing the resonant frequency by half the power bandwidth. The main control and real-time processing module 14 maps the feature parameters into a two-dimensional dielectric constant variation distribution image. The extracted resonant frequency offset and quality factor variation feature parameters are normalized respectively. The normalized feature parameters are weighted and fused according to preset weight coefficients to generate a two-dimensional dielectric constant variation distribution image. The main control and real-time processing module 14 performs image processing on the dielectric constant variation distribution image, identifies and segments the defective region enriched with adhesive, sets a threshold for the dielectric constant variation distribution image, performs image binarization processing to generate a binary image, performs mathematical morphological operations on the binary image to remove noise and smooth the boundary of the defective region, performs connected component analysis on the morphologically processed image, calculates the area, position and shape features of each connected region, and finally determines the real defective region according to the preset area threshold rule. The main control and real-time processing module 14 outputs the defect identification results and a test report containing the defect distribution map, the number of defects, the total defect area, and the coordinates of the defect location. Based on the preset quality standards, it automatically determines whether there are any problems with the currently tested flocculent sheet.

[0060] More specifically, in the near-field sensor array probe 12 of the non-contact detection device, several open-loop resonators 1201 form a highly localized near-field sensing area. Each resonator is electromagnetically coupled through a microstrip transmission line. When the reference sample is placed below the probe, the field-programmable gate array 1401 in the main control and real-time processing module 14 sends gating signals to the digital control pins V1 and V2 of the single-pole four-throw RF switch chip 1202 through the pin header connector 1204, activating each sensing unit in sequence. At the same time, the voltage-controlled temperature-compensated crystal oscillator 1301 in the multi-channel multi-frequency vector measurement module 13 generates a 10MHz reference clock signal, which is distributed to four delay-matched microstrip lines through a 1:4 power divider 1302. The step drives four vector network analyzer (VNA) chips 1303 to perform scanning measurements in the 2.4-3.0 GHz frequency band. Each VNA chip 1303 receives the RF signal transmitted from the common terminal of the corresponding single-pole quad-throw RF switch chip 1202 through the RF input pin and measures the amplitude and phase data of its complex reflection coefficient S11 in real time. This raw data is transmitted in differential signal form through the chip's LVDS data output pin to the receiving pin pair of the field programmable gate array 1401. The field programmable gate array 1401 stores the acquired reference dataset in the DDR4 memory 1403 to establish a full-band spatial coordinate reference model containing amplitude and phase information.

[0061] During the real-time detection phase, the fiber under test passes beneath the sensor array at a constant speed. Due to the significant difference in dielectric constant between the binder-rich region (island) and the fiber body region (sea) in the "island structure," when the binder-rich region is directly below a certain SRR (Sensitive Resonant Array), it changes the equivalent capacitance parameter of the resonator, causing a shift in its resonant frequency. This change is transmitted to the QM25008 RF switch chip via a microstrip transmission line. The Vector Network Analyzer (VNA) chip 1303 continuously measures the S11 parameters of each sensing unit at a sampling rate of thousands of times per second. The measurement data is transmitted in real time to the current... The field programmable gate array 1401 processes the data. First, the field programmable gate array 1401 calculates the complex difference between the current measured value and the reference value. Then, it extracts two key feature parameters through built-in algorithms: one is to calculate the resonant frequency offset by finding the valley position of the resonant curve, and the other is to obtain the quality factor change by calculating the half-power bandwidth change. These feature parameters accurately reflect the local change of dielectric constant, because the adhesive-rich region (high dielectric constant) will cause a significant negative shift in the resonant frequency offset and a decrease in the quality factor change, while the fiber region (low dielectric constant) will show a slight change.

[0062] Subsequently, the embedded central processing unit 1402 receives these feature parameters, performs normalization processing and weighted fusion, and generates a two-dimensional dielectric constant variation distribution image. In the generated grayscale image, high-brightness areas correspond to "islands" enriched with binder, and low-brightness areas correspond to "seas" dominated by fibers. The embedded central processing unit 1402 then performs threshold segmentation processing on the image, sets a critical value for binarization processing, and then removes noise points and smooths boundaries through mathematical morphology operations. Finally, it performs connected component analysis, calculates the area, shape factor and other features of each region, and accurately identifies the real "island structure" defects according to preset rules (such as area threshold, roundness, etc.). Throughout the process, the power management integrated chip 1405 provides a stable voltage supply to each chip, and the Ethernet physical layer chip 1404 transmits the final defect distribution map, quantity, area, location coordinates and other results to the host computer for display, realizing the quantitative and visual detection of the micro-uniformity caused by the migration of binder on the entire flake surface, providing a reliable basis for product quality control.

[0063] The final product is achieved by controlling the spraying device to spray small amounts of large droplets multiple times at low pressure. This reduces the initial liquid binder content and fluidity, allowing it to adhere precisely to the fiber cross-sections like "dispensing," rather than soaking the fibers over a large area. This reduces the amount of migratable liquid at the source. Simultaneously, the oven is controlled to regulate its inlet, middle, and end stages. In the initial stage, a burst of high temperature is used to rapidly evaporate the binder moisture on the fiber surface, quickly forming a curing film to block migration channels. In the middle stage, the temperature is appropriately lowered to ensure heat penetrates into the wadding and allows internal moisture to evaporate slowly, preventing excessive internal steam pressure from damaging the structure. Later, the final cross-linking is completed. Furthermore, the horizontal airflow in the oven is changed to a vertical penetrating airflow, allowing hot air to penetrate the wadding evenly, reducing the temperature difference between the surface and core layers. This prevents unfavorable migration of moisture and binder from the inside out due to temperature differences, thus ensuring a steady increase in the final product yield.

[0064] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A fibrous composite batt characterized by, It includes ultrafine polyimide staple fiber, hollow spiral polyester staple fiber, ultrafine polyester staple fiber, low melting point staple fiber, and binder, wherein the ratio of ultrafine polyimide staple fiber, hollow spiral polyester staple fiber, ultrafine polyester staple fiber, and low melting point staple fiber is 20:50:20:10 or 20:40:30:10 by weight.

2. A fibrous composite sheet according to claim 1, wherein The ultrafine polyimide staple fiber has a fineness of 1.5D and a length of 51mm; the hollow spiral polyester staple fiber has a fineness of 3D and a length of 64mm; the ultrafine polyester staple fiber has a fineness of 1.5D and a length of 51mm; and the low melting point staple fiber has a fineness of 3D and a length of 64mm.

3. A fibrous composite sheet according to claim 1, wherein The adhesive is a self-crosslinking acrylate or a vinyl acetate-N-acrylate binary emulsion.

4. A process for the production of a fibrous composite batt according to any one of claims 1 to 3, c h a r a c t e r i s e d in that Includes the following steps: Raw materials are unpacked using an electronic weighing unpacking machine to prepare various fibers; Initial opening: The fibers are initially opened and mixed by a coarse opener and a fine opener, and then conveyed to the next process by a cotton conveying fan. Mixing and storage: The initially opened fibers are thoroughly mixed and stored in the large warehouse cotton blending machine; Fine opening: The raw materials, which are placed in proportion, are fed into the opening machine, where the fibers are broken up and then conveyed to the next process after being removed by a strong magnet through the airflow of the cotton conveying fan. The vibrating cotton box forms a uniform cotton slurry from the finely opened and mixed fibers and continuously feeds it to the next process. Combing, using a combing machine to comb the fibers; In the process of laying the net, the cotton net is evenly laid onto the bottom curtain in the net laying machine; Spraying involves using a spraying device to spray the adhesive into the fiber layer under high pressure. A non-contact detection device is then used to check the sprayed fiber composite wadding for adhesive migration. If no problem is detected, the spraying device continues to operate under high pressure. If a problem is detected, the spraying device is controlled to spray in small amounts and multiple times using a low-pressure, large-droplet method. Drying and shaping: The product is heated evenly by the high temperature of the oven. If the previous spraying process is found to be without problems, the product is kept in its original state. If the previous spraying process is found to be with problems, the oven inlet temperature is increased to 140 degrees Celsius, the middle section temperature is decreased to 130 degrees Celsius, and the rear section temperature is decreased to 120 degrees Celsius. Edge trimming and winding: The product is cut and wound using an edge trimming and winding machine.

5. A process for making fibrous composite flake according to claim 4, wherein, The spraying device comprises a rack (1), a side frame (3) fixedly connected to the rack (1), a plurality of rollers (5) rotatably connected in the side frame (3) through bearing seats (4), a machine shell (8) fixedly connected in the rack (1), a driving motor arranged in the machine shell (8), and a suction pump, a rotor shaft of the driving motor penetrates through the machine shell (8) to the outside and is fixedly connected with a driving sprocket, one end of each of the plurality of rollers (5) penetrates through the side frame (3) and is fixedly connected with a driven sprocket, the plurality of driven sprockets are drivingly connected through a transmission chain (6), and one end of one of the rollers (5) away from the driven sprocket penetrates through the side frame (3) and is fixedly connected with a driven sprocket, the driven sprocket and the driving sprocket are drivingly connected through the chain, the side frame (3) is fixedly connected with a mounting frame (9), the mounting frame (9) is fixedly connected with a spraying pipe (11), the spraying pipe (11) is communicated with a plurality of array-distributed atomizing nozzles, the spraying pipe (11) is communicated with the suction pump through a water pipe (10) penetrating through the machine shell (8), the suction pump is communicated with a feeding pipe, the feeding pipe is used for guiding the adhesive to enter, and the bottom plate (2) located below the plurality of rollers (5) is fixedly connected between the two side frames (3).

6. A process for making fibrous composite flake according to claim 4 wherein, The non-contact detection device comprises a near-field sensor array probe (12) arranged on the mounting frame (9) of the spraying device, a multi-channel multi-frequency vector measurement module (13), and a main control and real-time processing module (14), a plurality of radio frequency signal output ends of the near-field sensor array probe (12) are connected with corresponding radio frequency signal input ends of the multi-channel multi-frequency vector measurement module (13) through a plurality of coaxial cables, a digital control bus end and a high-speed data bus end of the multi-channel multi-frequency vector measurement module (13) are connected with corresponding digital control bus ends and high-speed data bus ends of the main control and real-time processing module (14), a plurality of digital control signal output ends of the main control and real-time processing module (14) are connected with digital control signal input ends of the near-field sensor array probe (12), and the main control and real-time processing module (14) is electrically connected with the suction pump and the oven in the spraying device.

7. A process for making fibrous composite flake according to claim 6 wherein, The near-field sensor array probe (12) includes several groups of open ring resonators (1201), several single-pole four-throw radio frequency switch chips (1202), multiple radio frequency connectors (1203), and a row pin connector (1204). Each group of the open ring resonators (1201) includes four open ring resonators. Each group of the open ring resonators (1201) is electromagnetically coupled through a microstrip transmission line and connected to four radio frequency ports of each single-pole four-throw radio frequency switch chip (1202). The common terminal of each single-pole four-throw radio frequency switch chip (1202) is connected to the center signal pin of one radio frequency connector (1203). The radio frequency connector (1203) is connected to a vector network analyzer VNA chip (1303) in a multi-channel multi-frequency vector measurement module (13). Two digital control pins of each single-pole four-throw radio frequency switch chip (1202) are connected to corresponding pins of the row pin connector (1204). The row pin connector (1204) is connected to general input and output pins of a field programmable gate array (1401) in a master control and real-time processing module (14).

8. A process for making fibrous composite flake according to claim 6 wherein, The multi-channel multi-frequency vector measurement module (13) includes a voltage-controlled temperature-compensated crystal oscillator (1301), a 1:4 power divider (13021:4), a vector network analyzer VNA chip (1303), and a high-speed connector (1304). The signal output pin of the voltage-controlled temperature-compensated crystal oscillator (1301) is connected to the input port of the 1:4 power divider (13021:4) through a microstrip line. Four output ports of the 1:4 power divider (13021:4) are respectively connected to reference clock input pins of four vector network analyzer VNA chips (1303) through four segments of delay matching microstrip lines. The radio frequency input pin of each vector network analyzer VNA chip (1303) is connected to the radio frequency connector (1203) in the near-field sensor array probe (12). The serial clock pin, the serial data input and output pin, the serial data output pin, and the chip select pin of each vector network analyzer VNA chip (1303) are connected to the first group of control pins of the high-speed connector (1304). The parallel low-voltage differential signal data output pin of each vector network analyzer VNA chip (1303) is connected to the second group of data pins of the high-speed connector (1304). The high-speed connector (1304) is connected to the field programmable gate array (1401) in the master control and real-time processing module.

9. A process for making fibrous composite flake according to claim 6 wherein, The master and real-time processing module (14) includes a field programmable gate array (1401), an embedded central processing unit (1402), a DDR4 memory (1403), an Ethernet physical layer chip (1404), a plurality of serial peripheral interface pins of the field programmable gate array (1401) are connected with serial peripheral interface control pins of a vector network analyzer VNA chip (1303) in the multi-channel multi-frequency vector measurement module (13) through a high-speed connector (1304) in the multi-channel multi-frequency vector measurement module (13), a plurality of low-voltage differential signal data receiving pins of the field programmable gate array (1401) are connected with low-voltage differential signal data output pins of the vector network analyzer VNA chip (1303) in the multi-channel multi-frequency vector measurement module (13) through the high-speed connector (1304) in the multi-channel multi-frequency vector measurement module (13), the field programmable gate array (1401) is connected with the embedded central processing unit (1402) through an advanced extensible interface bus, the embedded central processing unit (1402) is connected with the DDR4 memory (1403), the embedded central processing unit (1402) is connected with the Ethernet physical layer chip (1404), a first general input and output pin and a second general input and output pin of a twelfth storage area of the field programmable gate array (1401) are respectively connected to a first digital control pin and a second digital control pin of a single-pole four-throw radio frequency switch chip (1202) in the near-field sensor array probe (12) through a row pin connector (1204) in the near-field sensor array probe (12), a master output slave input pin of a serial peripheral interface master controller of the field programmable gate array (1401) is connected to a serial data input and output pin of the first vector network analyzer VNA chip (1303), a master input slave output pin of the serial peripheral interface master controller zero of the field programmable gate array (1401) is connected to a serial data output pin of the first vector network analyzer VNA chip (1303), a serial clock pin of the serial peripheral interface master controller zero of the field programmable gate array (1401) is connected to a serial clock pin of the first vector network analyzer VNA chip (1303), a chip select zero pin of the serial peripheral interface master controller zero of the field programmable gate array (1401) is connected to a chip select pin of the first vector network analyzer VNA chip (1303), positive and negative input ends of a first low-voltage differential signal receiving pin pair of a thirty-third storage area of the field programmable gate array (1401) are respectively connected to positive and negative output ends of a first low-voltage differential signal data output pin of the first vector network analyzer VNA chip (1303), the field programmable gate array (1401) is respectively connected with a frequency converter of a suction pump in a spraying device and a frequency converter of an oven through a digital-to-analog converter.

10. A process for making fibrous composite flake according to claim 9, wherein, The master control and real-time processing module (14) further comprises a power management integrated chip (1405), a plurality of power output pins of the power management integrated chip (1405) provide required working voltages for a field programmable gate array (1401), an embedded central processing unit (1402), a DDR4 memory (1403) and an Ethernet physical layer chip (1404) respectively, a voltage input pin of the power management integrated chip (1405) is connected with a +12V external input power supply; a first enable pin, a second enable pin and a third enable pin of the power management integrated chip (1405) are connected with the voltage input pin through pull-up resistors respectively, a first voltage output pin of the power management integrated chip (1405) outputs +3.3V after a first filtering capacitor, and the +3.3V is used as a storage area power supply pin of the field programmable gate array chip (1401), a second voltage output pin of the power management integrated chip (1405) outputs +1.8V after a second filtering capacitor, and the +1.8V is used as a storage area power supply pin of the field programmable gate array chip (1401) and a digital power supply pin of a vector network analyzer VNA chip (1303), and a third voltage output pin of the power management integrated chip (1405) outputs +1V after a third filtering capacitor, and the +1V is used as a core voltage pin of the field programmable gate array chip (1401).

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