Chip thickness gauge and chip thickness measuring method

Abstract

The invention discloses a chip thickness gauge and a chip thickness measuring method, and relates to the field of semiconductors, the chip thickness gauge comprises a support frame and a chip bearing platform which are fixedly installed on a base, the chip bearing platform and the base are overlapped in central projection and are both provided with through holes with the same radius, and the chip bearing platform is provided with a chip; the first laser distance measuring sensor fixedly installed on the supporting frame is used for collecting the distance between the upper surface of the chip and the first laser distance measuring sensor receiving probe, and the second laser distance measuring sensor fixedly installed on the lower surface of the base is used for collecting the distance between the lower surface of the chip and the second laser distance measuring sensor receiving probe. The controller is electrically connected with the first laser distance measuring sensor and the second laser distance measuring sensor. Based on the distance collected by the first laser distance measuring sensor and the second laser distance measuring sensor and the fixed distance between the first laser distance measuring sensor and the second laser distance measuring sensor, accurate detection of the chip thickness under the condition that the chip is not contacted is achieved.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a chip thickness gauge and a chip thickness measurement method. Background Technology

[0002] In the chip mounting process, diced and ground chips are placed onto a substrate or substrate material. This process has extremely strict tolerances for chip thickness (typically less than ±2μm). If the chip thickness exceeds these tolerances, it will affect the uniformity of heat conduction in the finished product and the accuracy of subsequent soldering and packaging. To improve product quality, chip thickness needs to be inspected before the mounting process. Current thickness inspection methods primarily involve manual sampling of chips on the production line using measuring equipment.

[0003] However, when measuring manually using instruments such as micrometers or thickness gauges, errors can easily cause scratches on the chip surface due to misoperation. This leads to inconsistencies between the measured thickness and the actual chip thickness during the mounting process, reducing measurement accuracy. Therefore, achieving accurate chip thickness detection without contact with the chip has become an urgent problem to be solved. Summary of the Invention

[0004] In view of the above problems, this application provides a chip thickness gauge and a chip thickness measurement method to achieve accurate detection of chip thickness without contacting the chip. The specific solution is as follows:

[0005] The first aspect of this application provides a chip thickness gauge, comprising:

[0006] Support frame, first laser rangefinder, chip carrier platform, base, second laser rangefinder and controller,

[0007] The support frame is fixedly connected to the base, and the chip carrier is fixedly installed on the upper surface of the base relative to the mounting plane of the base;

[0008] The projections of the first center of the chip carrier stage and the second center of the base on the mounting plane coincide, and the first center and the second center are provided with through holes of the same radius;

[0009] The first laser ranging sensor is mounted on the support frame. The light irradiation direction of the first laser ranging sensor is perpendicular to the chip carrier platform and points to the first center. The first laser ranging sensor is used to collect the distance between the upper surface of the chip relative to the mounting plane and the receiving probe of the first laser ranging sensor.

[0010] The second laser ranging sensor is mounted on the lower surface of the base relative to the mounting plane. The light irradiation direction of the second laser ranging sensor is perpendicular to the chip carrier and points to the first center through the through hole. The second laser ranging sensor is used to collect the distance between the lower surface of the chip relative to the mounting plane and the receiving probe of the second laser ranging sensor.

[0011] The controller is electrically connected to the first laser rangefinder and the second laser rangefinder, respectively.

[0012] In one possible implementation, the chip thickness gauge further includes:

[0013] A first XY-axis moving platform is used to move the first laser ranging sensor on the support frame. The first XY-axis moving platform is electrically connected to the controller. The first XY-axis moving platform is used to drive the first laser ranging sensor to move in a plane parallel to the mounting plane.

[0014] In one possible implementation, the chip thickness gauge further includes:

[0015] The second XY-axis moving platform is used to mount the second laser ranging sensor on the lower surface of the base relative to the mounting plane. The second XY-axis moving platform is electrically connected to the controller and is used to drive the second laser ranging sensor to move in a plane parallel to the mounting plane.

[0016] In one possible implementation, the first XY-axis moving platform and the second XY-axis moving platform are linked together.

[0017] In one possible implementation, the chip thickness gauge is independently located on one side of the chip production line.

[0018] In one possible implementation, the chip thickness gauge further includes:

[0019] A robotic arm, electrically connected to the controller, is used to transfer the chip between the chip production line and the chip carrier.

[0020] In one possible implementation, the chip carrier has a slot, the shape of which is adapted to the chip.

[0021] In one possible implementation, the robotic arm includes a flexible gripping device.

[0022] A second aspect of this application provides a chip thickness measurement method, applied to the controller of a chip thickness gauge as described in the first aspect and its implementation, the chip thickness measurement method comprising:

[0023] In the measurement state, the first laser ranging sensor installed on the support frame is controlled to collect the distance between the upper surface of the chip on the chip carrier platform relative to the mounting plane and the receiving probe of the first laser ranging sensor. The second laser ranging sensor installed on the lower surface of the base relative to the mounting plane is controlled to collect the distance between the lower surface of the chip relative to the mounting plane and the receiving probe of the second laser ranging sensor. The mounting plane is the mounting plane of the base.

[0024] The thickness of the chip is calculated based on the distances collected by the first laser rangefinder and the second laser rangefinder, respectively, and the fixed distance between the first laser rangefinder and the second laser rangefinder.

[0025] In one possible implementation, the chip thickness gauge further includes:

[0026] A robotic arm, electrically connected to the controller, is used to transfer the chip between the chip production line and the chip carrier.

[0027] The chip thickness measurement method further includes:

[0028] Upon detecting a placement signal where the robotic arm places the chip on the chip carrier, the current state is output as the measurement state;

[0029] If a gripping signal is detected that the robotic arm is transferring the chip out of the chip carrier, the current state is output as non-measurement state.

[0030] By employing the above technical solution, this application provides a chip thickness gauge and a chip thickness measurement method. A support frame is fixedly connected to a base, and a chip carrier platform is fixedly mounted on the upper surface of the base relative to its mounting plane. A first laser rangefinder is mounted on the support frame, and a second laser rangefinder is mounted on the lower surface of the base relative to its mounting plane, thereby fixing the distance between the first and second laser rangefinders. Subsequently, by aligning the projections of the first center of the chip carrier platform and the second center of the base onto the mounting plane, and by providing through holes of the same radius at both centers, the light irradiation direction of the first laser rangefinder is configured to be perpendicular to the chip carrier platform and pointing towards the first center. Similarly, the light irradiation direction of the second laser rangefinder is perpendicular to the chip carrier platform and points towards the first center through the through holes. This ensures that the two laser rangefinders coincide at the irradiation positions on the chip, improving the accuracy of chip thickness measurement. Finally, by configuring a first laser rangefinder to acquire the distance between the upper surface of the chip relative to the mounting plane and the receiving probe of the first laser rangefinder, and configuring a second laser rangefinder to acquire the distance between the lower surface of the chip relative to the mounting plane and the receiving probe of the second laser rangefinder, and configuring a controller to be electrically connected to both the first and second laser rangefinders, accurate chip thickness detection can be achieved without contacting the chip, utilizing the fixed distance between the first and second laser rangefinders and the respective distances to the chip acquired by the first and second laser rangefinders. Therefore, this application achieves accurate chip thickness detection without contacting the chip. Attached Figure Description

[0031] The above and other features, advantages, and aspects of the embodiments of this disclosure will become more apparent from the accompanying drawings and the following detailed description. Throughout the drawings, the same or similar reference numerals denote the same or similar elements. It should be understood that the drawings are schematic, and the originals and elements are not necessarily drawn to scale.

[0032] Figure 1 A side view of a chip thickness gauge provided in this application;

[0033] Figure 2 A side view of a chip thickness gauge provided in this application;

[0034] Figure 3 A top view of a second XY-axis moving platform provided in this application;

[0035] Figure 4 A flowchart of a chip thickness measurement method provided in this application;

[0036] Figure 5 This is a schematic diagram of the structure of a controller provided in this application. Detailed Implementation

[0037] The embodiments of this application are described below with reference to the accompanying drawings. The terminology used in the implementation section of this application is for explaining specific embodiments only and is not intended to limit the scope of this application.

[0038] The embodiments of this application will now be described with reference to the accompanying drawings. Those skilled in the art will recognize that, with technological advancements and the emergence of new scenarios, the technical solutions provided in the embodiments of this application are equally applicable to similar technical problems.

[0039] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms are interchangeable where appropriate; this is merely a way of distinguishing objects with the same attributes in the embodiments of this application. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion, so that a process, method, system, product, or apparatus that comprises a series of elements is not necessarily limited to those elements, but may include other elements not explicitly listed or inherent to those processes, methods, products, or apparatuses.

[0040] The first aspect of this application provides a chip thickness gauge, such as... Figure 1 As shown, the chip thickness gauge includes:

[0041] Support frame 101, first laser rangefinder 102, chip carrier platform 103, base 104, second laser rangefinder 105, and controller 106.

[0042] The support frame 101 is fixedly connected to the base 104, and the chip carrier stage 103 is fixedly installed on the upper surface of the base 104 relative to the mounting plane 107 of the base 104.

[0043] The first center of the chip carrier stage 103 and the second center of the base 104 coincide on the projection of the mounting plane 107, and the first center and the second center are provided with through holes 108 of the same radius;

[0044] The first laser range sensor 102 is mounted on the support frame 101. The light irradiation direction of the first laser range sensor 102 is perpendicular to the chip carrier platform 103 and points to the first center. The first laser range sensor 102 is used to collect the distance between the chip relative to the upper surface of the mounting plane 107 and the receiving probe of the first laser range sensor 102.

[0045] The second laser range sensor 105 is mounted on the lower surface of the base 104 relative to the mounting plane 107. The light irradiation direction of the second laser range sensor 105 is perpendicular to the chip carrier stage 103 and points to the first center through the through hole 108. The second laser range sensor 105 is used to collect the distance between the lower surface of the chip relative to the mounting plane 107 and the receiving probe of the second laser range sensor 105.

[0046] The controller 106 is electrically connected to the first laser rangefinder 102 and the second laser rangefinder 105, respectively.

[0047] In one possible implementation, the aforementioned reference stage employs a highly flat ceramic base to avoid the impact of thermal expansion on the accuracy of thickness measurement.

[0048] In one possible implementation, the first laser ranging sensor 102 and the second laser ranging sensor 105 described above can be 650nm infrared laser emitters with a measurement range of 0-1mm and an accuracy of 0.1μm.

[0049] In one possible implementation, the controller described above can also communicate with the main control system of the chip production line via Ethernet to achieve automated control.

[0050] It should be noted that, in practical applications, the controller 106 described above can be a control device configured with a gate circuit (GC) and an arithmetic and logic unit (ALU). The gate circuit is used to trigger the first laser rangefinder 102 and the second laser rangefinder 105 to start or stop in response to a trigger signal (such as external manual pressing of the thickness measurement start button). The arithmetic and logic unit is used to calculate the thickness of the chip 109 based on the first laser rangefinder 102 and the second laser rangefinder 105. Specifically, by... Figure 2 (exist Figure 1As shown in the side view (based on the previous view), since the support frame 101 is fixedly connected to the base 104, the first laser rangefinder 102 is mounted on the support frame 101, and the second laser rangefinder 105 is mounted on the lower surface of the base 104 relative to the mounting plane 107. Therefore, the distance between the first laser rangefinder 102 and the second laser rangefinder 105 is a fixed value, which can be pre-stored in the controller 106. Subsequently, this application configures the first laser rangefinder 102 to acquire the distance L2 between the chip relative to the upper surface of the mounting plane 107 and the receiving probe of the first laser rangefinder 102, and configures the second laser rangefinder 105 to acquire the distance L3 between the chip relative to the lower surface of the mounting plane 107 and the receiving probe of the second laser rangefinder 105. The controller 106 is electrically connected to the first laser rangefinder 102 and the second laser rangefinder 105 respectively, so that the controller performs logical operations based on the distance L2, the distance L3 and the fixed value L1, and outputs the thickness of the chip 109.

[0051] It should be noted that, in practical applications, the chip thickness gauge provided by the first aspect and any implementation thereof of this application can be integrated into a chip production line. Some existing technologies, in order to avoid the problems of insufficient measurement accuracy and low efficiency caused by manual measurement, propose integrating an optical interferometer into the chip production line for chip thickness detection. However, the problem of insufficient accuracy still exists. Specifically, since the optical interferometer relies on the interference fringes of two reflected beams, vibration directly changes the optical path difference, leading to fringe shift, blurring, or even the inability to form a stable interference signal. Furthermore, slight vibrations during the operation of the chip production line can cause a sharp decrease in the measurement accuracy of the optical interferometer. Laser rangefinders, on the other hand, mostly use the time-of-flight method to measure the round-trip propagation time of light, and have a higher tolerance to instantaneous vibrations; only large vibrations will affect the alignment accuracy. Therefore, this application improves the adaptability and measurement accuracy in chip manufacturing scenarios by configuring the aforementioned first laser rangefinder 102 and second laser rangefinder 105.

[0052] It should be noted that, in practical applications, this application configures a first laser rangefinder 102 mounted on a support frame 101, with the light irradiation direction of the first laser rangefinder 102 perpendicular to the chip carrier 103 and pointing towards the first center. A second laser rangefinder 105 is mounted on the lower surface of the base 104 relative to the mounting plane 107, with the light irradiation direction of the second laser rangefinder 105 perpendicular to the chip carrier 103 and pointing towards the first center through a through-hole 108. The projections of the first center of the chip carrier 103 and the second center of the base 104 onto the mounting plane 107 coincide, and the first and second centers have through-holes 108 of the same radius. This ensures that the first laser rangefinder 102 and the second laser rangefinder 105 accurately acquire the thickness of the chip 109 at the same location, further improving the measurement accuracy of the chip 109 thickness.

[0053] It should be noted that, in actual application scenarios, the upper and lower surfaces of the chip 109 and the upper surface of the base 104 are all based on the mounting plane 107 of the base 104. The plane closer to the mounting plane 107 is the lower surface, and the plane farther from the mounting plane 107 is the lower surface. Furthermore, the upper and lower surfaces are opposite to each other.

[0054] This application uses a support frame fixedly connected to a base. The chip carrier is fixedly mounted on the upper surface of the base relative to its mounting plane. A first laser rangefinder is mounted on the support frame, and a second laser rangefinder is mounted on the lower surface of the base relative to its mounting plane, thus fixing the distance between the first and second laser rangefinders. Subsequently, by aligning the projections of the first center of the chip carrier and the second center of the base onto the mounting plane, and by providing through holes of the same radius for both centers, the application ensures that the light from the first laser rangefinder is perpendicular to the chip carrier and points towards the first center. Similarly, the light from the second laser rangefinder is perpendicular to the chip carrier and points towards the first center through the through holes. This arrangement ensures that the two laser rangefinders coincide at their respective chip illumination positions, improving the accuracy of chip thickness measurement. Finally, by configuring a first laser rangefinder to acquire the distance between the upper surface of the chip relative to the mounting plane and the receiving probe of the first laser rangefinder, and configuring a second laser rangefinder to acquire the distance between the lower surface of the chip relative to the mounting plane and the receiving probe of the second laser rangefinder, and configuring a controller to be electrically connected to both the first and second laser rangefinders, accurate chip thickness detection can be achieved without contacting the chip, utilizing the fixed distance between the first and second laser rangefinders and the respective distances to the chip acquired by the first and second laser rangefinders. Therefore, this application achieves accurate chip thickness detection without contacting the chip.

[0055] In one possible implementation, the chip thickness gauge provided in the first aspect of this application further includes:

[0056] The first XY-axis moving platform is used to move the first laser rangefinder 102 on the support frame 101. The first XY-axis moving platform is electrically connected to the controller 106. The first XY-axis moving platform is used to drive the first laser rangefinder 102 to move in a plane parallel to the mounting plane.

[0057] It should be noted that in practical applications, due to the influence of processing precision, the upper surface of chip 109 may exhibit undulations invisible to the naked eye, resulting in inconsistent thickness across different parts of the chip. Therefore, this application configures a first XY-axis moving platform to move the first laser rangefinder 102 in a plane parallel to the mounting plane, thereby enabling the acquisition of distances between multiple points on the upper surface of chip 109 and the first laser rangefinder 102, thus improving the accuracy of subsequent calculations of chip 109 thickness.

[0058] In one possible implementation, the chip thickness gauge also includes:

[0059] The second XY-axis moving platform is used to move the second laser range sensor 105 on the lower surface of the base 104 relative to the mounting plane. The second XY-axis moving platform is electrically connected to the controller 106. The second XY-axis moving platform is used to drive the second laser range sensor 105 to move in a plane parallel to the mounting plane.

[0060] It should be noted that, in practical applications, similar to the first XY-axis moving platform described above, the lower surface of the chip 109 may exhibit imperceptible undulations due to the influence of processing precision, resulting in inconsistent thickness across different parts of the chip. Therefore, this application configures a second XY-axis moving platform to move the second laser rangefinder 105 within a plane parallel to the mounting plane, thereby enabling the acquisition of distances between multiple points on the lower surface of the chip 109 and the second laser rangefinder 105, thus improving the accuracy of subsequent calculations of the chip 109's thickness.

[0061] In one possible implementation, the first XY-axis moving platform and the second XY-axis moving platform work together.

[0062] It should be noted that, in practical applications, the aforementioned linkage between the first XY-axis moving platform and the second XY-axis moving platform means that the moving direction and moving distance must be completely consistent when the first XY-axis moving platform and the second XY-axis moving platform are moving. Since the distances collected by the first laser rangefinder 102 and the second laser rangefinder 105 need to be at the same position to be used for subsequent calculations of the chip 109 thickness, this application improves the accuracy of subsequent calculations of the chip 109 thickness by configuring the first XY-axis moving platform and the second XY-axis moving platform to move in tandem.

[0063] It should be noted that, in practical applications, the top view of the aforementioned second XY-axis moving platform can be as follows: Figure 3 As shown, the second laser rangefinder 105 is mounted on the drive end of the second XY-axis moving platform 110. The second XY-axis moving platform 110 drives the second laser rangefinder 105 to move in the plane containing the coordinate system constructed by the X-axis and Y-axis. This plane is parallel to the mounting plane 107. The dashed circle in the figure indicates the moving position of the second laser rangefinder 105. The first XY-axis moving platform described above is the same as the second XY-axis moving platform described above, and this application will not make further limitations or elaborations.

[0064] In one possible implementation, the aforementioned chip thickness gauge is independently located on one side of the chip production line.

[0065] It should be noted that in practical applications, due to the installation method of integrating the chip thickness gauge, the vibration of the chip production line still affects the measurement accuracy of the chip thickness gauge. Therefore, this application avoids the impact of vibration transmission between the chip thickness gauge and the chip production line on the acquisition accuracy of the first laser ranging sensor 102 and the second laser ranging sensor 105 by configuring the chip thickness gauge to be independently set on one side of the chip production line, thereby improving the detection accuracy of chip thickness.

[0066] In one possible implementation, the chip thickness gauge provided in the first aspect of this application further includes:

[0067] The robotic arm is electrically connected to the controller 106 and is used to transfer chips between the chip production line and the chip carrier.

[0068] It should be noted that in practical applications, since the chip production line and the chip thickness gauge are located in different areas, this application improves the level of automation by configuring the aforementioned robotic arm to transfer chips instead of manually transferring them.

[0069] In one possible implementation, the chip carrier stage 103 has a slot, the shape of which is adapted to the chip.

[0070] It should be noted that, in practical application scenarios, this application configures the chip carrier stage 103 to have a slot, and configures the shape of the slot to match the chip, thereby restricting the position and shape of the chip on the chip carrier stage 103, so that the first laser ranging sensor 102 and the second laser ranging sensor 105 can accurately collect the distance to the target position, thereby improving the thickness detection accuracy.

[0071] In one possible implementation, the robotic arm includes a flexible gripping device.

[0072] It should be noted that in practical applications, any scratches on the chip surface can affect the reliability of subsequent chip operation. Therefore, this application uses a robotic arm, including a flexible gripping device, to avoid the risk of damage to the chip caused by a hard gripping device, thereby improving the chip yield. The aforementioned flexible gripping device includes, but is not limited to, suction cups, airbag grippers, and magnetic flexible clamps.

[0073] The second aspect of this application provides a chip thickness measurement method, applied to the controller of the chip thickness gauge as described in the first aspect and its implementation, such as... Figure 4 As shown, the chip thickness measurement method includes:

[0074] S401. In the measurement state, control the first laser ranging sensor installed on the support frame to collect the distance between the upper surface of the chip on the chip carrier platform relative to the mounting plane and the receiving probe of the first laser ranging sensor. Control the second laser ranging sensor installed on the lower surface of the base relative to the mounting plane to collect the distance between the lower surface of the chip relative to the mounting plane and the receiving probe of the second laser ranging sensor. The mounting plane is the mounting plane of the base.

[0075] S402. Based on the distances collected by the first laser rangefinder and the second laser rangefinder respectively, and the fixed distance between the first laser rangefinder and the second laser rangefinder, the thickness of the output chip is determined.

[0076] In one possible implementation, the chip thickness gauge provided in the first aspect of this application further includes:

[0077] A robotic arm, electrically connected to a controller, is used to transfer chips between a chip production line and a chip carrier.

[0078] The chip thickness measurement method provided in the second aspect of this application also includes:

[0079] Upon detecting a placement signal where the robotic arm places the chip on the chip carrier, the current state is output as the measurement state.

[0080] If a gripping signal is detected that the robotic arm is transferring the chip out of the chip carrier, the current state is output as non-measurement state.

[0081] In one possible implementation, when a gripping signal is detected that the robotic arm is transferring the chip out of the chip carrier, and the current output state is non-measurement state, the first laser ranging sensor and the second laser ranging sensor can be controlled to be in standby state to reduce energy consumption.

[0082] It should be noted that, in practical application scenarios, this application configures the chip thickness gauge to output the current state as the measurement state when the placement signal of the robotic arm placing the chip on the chip carrier is detected, and configures the controller to control the chip thickness gauge provided in the first aspect of this application to execute the chip thickness measurement method provided in the second aspect of this application, thereby improving the automation level and detection efficiency of the chip thickness gauge.

[0083] If a gripping signal is detected that the robotic arm is transferring the chip out of the chip carrier, the current state is output as non-measurement state.

[0084] In one possible implementation, the chip thickness gauge provided in the first aspect of this application further includes:

[0085] The first XY-axis moving platform is used to move the first laser range sensor 102 on the support frame 101. The first XY-axis moving platform is electrically connected to the controller 106. The first XY-axis moving platform is used to drive the first laser range sensor 102 to move in a plane parallel to the mounting plane.

[0086] The second XY-axis moving platform is used to move the second laser range sensor 105 on the lower surface of the base 104 relative to the mounting plane. The second XY-axis moving platform is electrically connected to the controller 106. The second XY-axis moving platform is used to drive the second laser range sensor 105 to move in a plane parallel to the mounting plane.

[0087] The thickness of the output chip, based on the distances collected by the first and second laser rangefinders respectively, and the fixed distance between the first and second laser rangefinders, includes:

[0088] Based on the distances collected by the first and second laser rangefinders at various locations on the chip, as well as a fixed distance, the thickness at each location is calculated, and the average of each thickness is output as the chip thickness.

[0089] In one possible implementation, prior to the thickness of the output chip, the following is also included:

[0090] The calculated thickness is compared with the thickness threshold range. If the thickness is outside the thickness threshold range, a prompt message indicating that the current chip thickness is unqualified is output, and the robotic arm is controlled to move the chip to the recycling area.

[0091] The thickness of the output chip when the thickness is within the thickness threshold range.

[0092] In one possible implementation, the chip thickness gauge provided by the first aspect of this application and any implementation thereof may also be configured with an image acquisition module and a data storage module electrically connected to the controller. The image acquisition device is used to identify the code of each chip, and the controller stores the code acquired by the image acquisition device and the chip thickness output to the data storage module for subsequent process traceability.

[0093] This application also provides a controller in its embodiments. (See reference...) Figure 5 The diagram illustrates a structural schematic suitable for implementing the controller in the embodiments of this application. The controller in the embodiments of this application may include, but is not limited to, fixed terminals such as mobile phones, laptops, PDAs (personal digital assistants), PADs (tablet computers), chip pipeline controllers, etc. Figure 5 The controller shown is merely an example and should not impose any limitation on the functionality and scope of use of the embodiments of this application.

[0094] like Figure 5 As shown, the controller may include a processing device (e.g., a central processing unit, a graphics processing unit, etc.) 501, which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 502 or a program loaded from a storage device 508 into a random access memory (RAM) 503. When the controller is powered on, the RAM 503 also stores various programs and data required for controller operation. The processing device 501, ROM 502, and RAM 503 are interconnected via a bus 504. An input / output (I / O) interface 505 is also connected to the bus 504.

[0095] Typically, the following devices can be connected to I / O interface 505: input devices 506 including, for example, a touchscreen, touchpad, keyboard, mouse, camera, microphone, accelerometer, gyroscope, etc.; output devices 507 including, for example, a liquid crystal display (LCD), speaker, vibrator, etc.; storage devices 508 including, for example, memory card, hard disk, etc.; and communication devices 509. Communication device 509 allows the controller to communicate wirelessly or wiredly with other devices to exchange data. Although Figure 5 A controller with various devices is shown; however, it should be understood that implementation or possession of all the devices shown is not required. More or fewer devices may be implemented alternatively.

[0096] It should also be noted that the device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. In addition, in the device embodiment drawings provided in this application, the connection relationship between modules indicates that they have a communication connection, which can be implemented as one or more communication buses or signal lines.

[0097] Through the above description of the embodiments, those skilled in the art can clearly understand that this application can be implemented by means of software plus necessary general-purpose hardware, or it can be implemented by special-purpose hardware including application-specific integrated circuits, special-purpose CPUs, special-purpose memory, special-purpose components, etc. Generally, any function performed by a computer program can be easily implemented by corresponding hardware, and the specific hardware structure used to implement the same function can also be diverse, such as analog circuits, digital circuits, or special-purpose circuits. However, for this application, software program implementation is more often the preferred implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a readable storage medium, such as a computer floppy disk, USB flash drive, mobile hard disk, ROM, RAM, magnetic disk, or optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, training equipment, or network device, etc.) to execute the methods described in the various embodiments of this application.

[0098] In the above embodiments, implementation can be achieved, in whole or in part, through software, hardware, firmware, or any combination thereof. When implemented in software, it can be implemented, in whole or in part, as a computer program product.

[0099] The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of this application are generated. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions may be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions may be transmitted from one website, computer, training device, or data center to another website, computer, training device, or data center via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium may be any available medium that a computer can store or a data storage device such as a training device or data center that integrates one or more available media. The available media may be magnetic media (e.g., floppy disks, hard disks, magnetic tapes), optical media (e.g., DVDs), or semiconductor media (e.g., solid-state drives (SSDs)).

Claims

1. A chip thickness gauge, characterized in that, include: Support frame, first laser rangefinder, chip carrier platform, base, second laser rangefinder and controller, The support frame is fixedly connected to the base, and the chip carrier is fixedly installed on the upper surface of the base relative to the mounting plane of the base; The projections of the first center of the chip carrier stage and the second center of the base on the mounting plane coincide, and the first center and the second center are provided with through holes of the same radius; The first laser ranging sensor is mounted on the support frame. The light irradiation direction of the first laser ranging sensor is perpendicular to the chip carrier platform and points to the first center. The first laser ranging sensor is used to collect the distance between the upper surface of the chip relative to the mounting plane and the receiving probe of the first laser ranging sensor. The second laser ranging sensor is mounted on the lower surface of the base relative to the mounting plane. The light irradiation direction of the second laser ranging sensor is perpendicular to the chip carrier and points to the first center through the through hole. The second laser ranging sensor is used to collect the distance between the lower surface of the chip relative to the mounting plane and the receiving probe of the second laser ranging sensor. The controller is electrically connected to the first laser rangefinder and the second laser rangefinder, respectively.

2. The chip thickness gauge according to claim 1, characterized in that, The chip thickness gauge also includes: A first XY-axis moving platform is used to move the first laser ranging sensor on the support frame. The first XY-axis moving platform is electrically connected to the controller. The first XY-axis moving platform is used to drive the first laser ranging sensor to move in a plane parallel to the mounting plane.

3. The chip thickness gauge according to claim 2, characterized in that, The chip thickness gauge also includes: The second XY-axis moving platform is used to mount the second laser ranging sensor on the lower surface of the base relative to the mounting plane. The second XY-axis moving platform is electrically connected to the controller and is used to drive the second laser ranging sensor to move in a plane parallel to the mounting plane.

4. The chip thickness gauge according to claim 3, characterized in that, The first XY-axis moving platform and the second XY-axis moving platform are linked together.

5. The chip thickness gauge according to claim 1, characterized in that, The chip thickness gauge is independently installed on one side of the chip production line.

6. The chip thickness gauge according to claim 5, characterized in that, The chip thickness gauge also includes: A robotic arm, electrically connected to the controller, is used to transfer the chip between the chip production line and the chip carrier.

7. The chip thickness gauge according to claim 1, characterized in that, The chip carrier platform has a slot, the shape of which is adapted to the chip.

8. The chip thickness gauge according to claim 6, characterized in that, The robotic arm includes a flexible gripping device.

9. A method for measuring chip thickness, characterized in that, The chip thickness measurement method, applied to the controller of the chip thickness gauge as described in claims 1 to 8, includes: In the measurement state, the first laser ranging sensor installed on the support frame is controlled to collect the distance between the upper surface of the chip on the chip carrier platform relative to the mounting plane and the receiving probe of the first laser ranging sensor. The second laser ranging sensor installed on the lower surface of the base relative to the mounting plane is controlled to collect the distance between the lower surface of the chip relative to the mounting plane and the receiving probe of the second laser ranging sensor. The mounting plane is the mounting plane of the base. The thickness of the chip is calculated based on the distances collected by the first laser rangefinder and the second laser rangefinder, respectively, and the fixed distance between the first laser rangefinder and the second laser rangefinder.

10. The chip thickness measurement method according to claim 9, characterized in that, The chip thickness gauge also includes: A robotic arm, electrically connected to the controller, is used to transfer the chip between the chip production line and the chip carrier. The chip thickness measurement method further includes: Upon detecting a placement signal where the robotic arm places the chip on the chip carrier, the current state is output as the measurement state; If a gripping signal is detected that the robotic arm is transferring the chip out of the chip carrier, the current state is output as non-measurement state.

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