Exposure method and exposure control device

Abstract

The embodiment of the invention provides an exposure method and an exposure control device. The exposure method comprises the following steps: acquiring a boundary of a central production area and an edge area; executing a first scanning mode in the central production area according to the boundary, and executing a second scanning mode in the edge area; the first scanning mode is forward scanning, and the second scanning mode is forward scanning and reverse scanning. According to the technical scheme provided by the embodiment of the invention, the processing time of exposing the photoresist by the LDI exposure machine is shortened, and the exposure efficiency is improved.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the field of photolithography, and in particular to an exposure method and an exposure control device. BACKGROUND

[0002] With the development of display technology, people have higher and higher requirements for displays. Flat panel displays (FPD) generally use glass substrates as substrates, and circuit patterns are transferred to the substrates by exposing photoresist. Generally, exposure is performed by mask exposure. However, mask exposure requires a mask plate, which is costly and has poor flexibility. LDI exposure machines (Laser Direct Imaging Exposure Machine) expose by laser direct writing, do not require a mask plate, are less costly, and have greater flexibility.

[0003] The existing method of exposing photoresist using an LDI exposure machine has the problems of long processing time and low exposure efficiency. SUMMARY

[0004] Embodiments of the present application provide an exposure method and an exposure control device to solve the problems of long processing time and low exposure efficiency of the existing method of exposing photoresist using an LDI exposure machine.

[0005] To achieve the above technical problems, the present application adopts the following technical solutions:

[0006] Embodiments of the present application provide an exposure method, comprising:

[0007] obtaining a dividing line between a central production area and an edge area;

[0008] executing a first scanning mode in the central production area and a second scanning mode in the edge area according to the dividing line; the first scanning mode is forward scanning, and the second scanning mode is forward scanning and reverse scanning.

[0009] Optionally, the obtaining of the dividing line between the central production area and the edge area comprises:

[0010] obtaining whole-plate thickness data of a photoresist-coated process plate;

[0011] determining the dividing line between the central production area and the edge area according to the differences between the thickness data.

[0012] Optionally, the execution of the first scanning mode in the central production area and the second scanning mode in the edge area according to the dividing line comprises:

[0013] determine a first scanning mode for the central production area and a second scanning mode for the edge area according to the relationship between the thickness data and the exposure energy;

[0014] scan the central production area and the edge area according to the first scanning mode and the second scanning mode.

[0015] Optionally, the determining of the boundary between the central production area and the edge area according to the difference between the thickness data comprises:

[0016] determining a boundary frame according to the preset size of the central production area and the edge area;

[0017] determining a boundary point between the central production area and the edge area according to the difference between the thickness data of at least three points on a straight line perpendicular to the boundary frame;

[0018] connecting at least two boundary points and determining the boundary between the central production area and the edge area by least square fitting; or, determining a preset boundary point according to the size of the boundary frame and the edge area, determining a new boundary point according to the midpoint between the boundary point and the preset boundary point on the same straight line, connecting at least two new boundary points to determine the boundary between the central production area and the edge area.

[0019] Optionally, the performing of the first scanning mode in the central production area and the second scanning mode in the edge area according to the boundary comprises:

[0020] determining a first scanning energy and a first scanning speed of a laser direct imaging exposure machine according to the relationship between the thickness data of the central production area and the exposure energy, and determining the first scanning mode as forward scanning at the first scanning energy and the first scanning speed according to the accuracy of the laser direct imaging exposure machine;

[0021] determining a second scanning energy and a second scanning speed of the laser direct imaging exposure machine according to the relationship between the thickness data of the edge area and the exposure energy, and determining the second scanning mode as forward scanning and reverse scanning at the second scanning energy and the second scanning speed.

[0022] Optionally, the performing of the first scanning mode in the central production area and the second scanning mode in the edge area according to the boundary comprises:

[0023] time-division scanning the central production area based on the first scanning mode and the edge area based on the second scanning mode; or,

[0024] Interleaving scanning of the central production area based on the first scanning mode and the edge area based on the second scanning mode.

[0025] Optionally, the time-sharing scanning of the central production area based on the first scanning mode and the edge area based on the second scanning mode comprises:

[0026] scanning the central production area in a forward direction using the first scanning mode, and after the scanning of the central production area is completed, scanning the edge area in a bidirectional manner using the second scanning mode; or

[0027] scanning the edge area in a bidirectional manner using the second scanning mode, and after the scanning of the edge area is completed, scanning the central production area using the first scanning mode.

[0028] Optionally, the edge area comprises a first sub-edge area and a second sub-edge area extending in a first direction and oppositely arranged, and a third sub-edge area and a fourth sub-edge area extending in a second direction and oppositely arranged; the first sub-edge area is adjacent to the third sub-edge area and the fourth sub-edge area, and the second sub-edge area is adjacent to the third sub-edge area and the fourth sub-edge area; the first direction and the second direction intersect each other.

[0029] The bidirectional scanning of the edge area using the second scanning mode comprises:

[0030] scanning the fourth sub-edge area in the second direction in a bidirectional manner, after the scanning of the fourth sub-edge area is completed, scanning the first sub-edge area in a bidirectional manner, after the scanning of the first sub-edge area is completed, scanning the third sub-edge area in a bidirectional manner, and after the scanning of the third sub-edge area is completed, scanning the second sub-edge area in a bidirectional manner.

[0031] Optionally, the forward scanning of the central production area using the first scanning mode comprises:

[0032] scanning the central production area in a forward direction row by row in a second direction;

[0033] controlling the laser direct imaging exposure machine to remain in a closed state in a reverse direction of the second direction.

[0034] Optionally, the edge region comprises a first sub-edge region and a second sub-edge region extending along the first direction and oppositely arranged, and a third sub-edge region and a fourth sub-edge region extending along the second direction and oppositely arranged; the first sub-edge region is adjacent to the third sub-edge region and the fourth sub-edge region, and the second sub-edge region is adjacent to the third sub-edge region and the fourth sub-edge region.

[0035] The interleaved scanning of the central production region based on the first scanning mode and the edge region based on the second scanning mode comprises:

[0036] When scanning along the second direction, the second scanning mode is performed in the fourth sub-edge region for bidirectional scanning;

[0037] When scanning along the second direction, the second scanning mode is performed in the first sub-edge region for forward scanning, the first scanning mode is performed in the central production region for forward scanning, and the second scanning mode is performed in the second sub-edge region for forward scanning; when scanning along the reverse direction of the second direction, the second scanning mode is performed in the second sub-edge region for reverse scanning, the laser direct imaging exposure machine is controlled to be closed in the central production region, and the second scanning mode is performed in the first sub-edge region for reverse scanning;

[0038] When scanning along the second direction, the second scanning mode is performed in the third sub-edge region for bidirectional scanning.

[0039] Optionally, when the glue thickness of the edge region is greater than the glue thickness of the central production region, the scanning energy of the edge region is greater than the scanning energy of the central production region, and the scanning speed of the edge region is equal to the scanning speed of the central production region;

[0040] When the glue thickness of the edge region is less than or equal to the glue thickness of the central production region, the scanning energy of the edge region is greater than the scanning energy of the central production region, and the scanning speed of the edge region is greater than the scanning speed of the central production region.

[0041] In a second aspect, the embodiment provides an exposure control device, comprising:

[0042] An acquisition module is configured to acquire the whole-board glue thickness data of the gluing process board;

[0043] A first determination module is configured to determine the demarcation line between the central production region and the edge region according to the difference between the glue thickness data.

[0044] a second determination module configured to determine a first scanning mode for the central production area and a second scanning mode for the edge area according to the relationship between the glue thickness data and the exposure energy;

[0045] a laser direct imaging exposure machine configured to scan the central production area and the edge area using the first scanning mode and the second scanning mode.

[0046] The exposure method provided by the embodiment of the present application acquires the boundary line of the central production area and the edge area. The first scanning mode is performed in the central production area according to the boundary line, and the second scanning mode is performed in the edge area. The first scanning mode is forward scanning, and the second scanning mode is forward scanning and reverse scanning. The scanning precision of the forward scanning is higher than that of the reverse scanning by performing the forward scanning in the central production area, so that the scanning precision of the central production area is ensured. The second scanning mode is performed in the edge area, so that the scanning efficiency of the edge area with low precision requirement is improved, the exposure scanning time of the edge area is shortened, the exposure efficiency of the glue-coated process plate is improved, and the photolithography process cost is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0047] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the description of the embodiments of the present application will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of the contents of the embodiments of the present application and the drawings.

[0048] Figure 1 is a flowchart of an exposure method provided by the embodiment of the present application;

[0049] Figure 2 is a flowchart of another exposure method provided by the embodiment of the present application;

[0050] Figure 3 is a schematic diagram of an exposure path of time-sharing scanning provided by the embodiment of the present application;

[0051] Figure 4 is a schematic diagram of another exposure path of time-sharing scanning provided by the embodiment of the present application;

[0052] Figure 5 is a schematic diagram of an exposure path of interleaved scanning provided by the embodiment of the present application;

[0053] Figure 6 is a schematic diagram of another exposure path of interleaved scanning provided by the embodiment of the present application. DETAILED DESCRIPTION

[0054] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0055] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0056] Based on the above-mentioned technical problems, this embodiment proposes the following solutions:

[0057] Figure 1 This is a flowchart of an exposure method provided in an embodiment of the present invention. See also... Figure 1 The exposure method provided in this embodiment of the invention includes:

[0058] S001. Obtain the boundary line between the central production area and the peripheral area.

[0059] Specifically, the central production area of ​​the photoresist coating board is used for exposure processing to form patterned photoresist, which is then used to transfer the circuit pattern onto the substrate to form the required circuit. However, in actual production, the central production area and the edge areas are not distinguished when coating the process board with photoresist. But in the final product, the photoresist in the edge areas also needs to be removed to facilitate the bonding of multilayer boards using the edge areas.

[0060] Since the exposure accuracy requirements of the edge area and the central production area are different, by obtaining the boundary line between the central production area and the edge area, it is convenient to configure different scanning modes for the central production area and the edge area respectively, thereby improving exposure efficiency and shortening the exposure scanning time.

[0061] S002. A first scanning mode is performed in the central production area according to the dividing line, and a second scanning mode is performed in the edge area; the first scanning mode is a forward scan, and the second scanning mode is a combination of forward and reverse scans.

[0062] Specifically, the first scanning mode includes scanning energy, scanning speed, scanning accuracy, etc. corresponding to the central production area. The second scanning mode includes scanning energy, scanning speed, scanning accuracy, etc. corresponding to the edge area.

[0063] The central production area is scanned by using the first scanning mode, and the edge area is scanned by using the second scanning mode. By using different scanning modes to scan the central production area and the edge area respectively, the exposure accuracy of the central production area meets the requirements, and the exposure speed of the edge area can be higher, thereby better shortening the time length of exposure scanning, improving the exposure efficiency of the glue-coated process plate, and reducing the photolithography process cost.

[0064] Since the error of the workpiece table moving in the reverse direction is greater than that of moving in the forward direction during reverse scanning, the reverse movement will form an "idling" phenomenon due to the existence of the gap, causing additional error. Moreover, for the central production area, the exposure pattern needs to be reversed during reverse scanning, resulting in a longer pattern processing time for reverse scanning than for forward processing. The more complex the pattern, the longer the reverse pattern processing time. By using forward scanning in the central production area, the exposure accuracy of the central production area is ensured.

[0065] Since the edge area has no complex exposure pattern, the pattern processing time is short, and bidirectional scanning is used in the edge area, which effectively utilizes the stroke scanning function and scanning time of reverse scanning, avoids waste of stroke, and shortens the exposure processing time of the edge area.

[0066] The exposure method provided in the embodiment acquires the boundary line of the central production area and the edge area. According to the boundary line, a first scanning mode is executed in the central production area, and a second scanning mode is executed in the edge area; the first scanning mode is forward scanning, and the second scanning mode is forward scanning and reverse scanning. Forward scanning is performed on the central production area, and the accuracy of forward scanning is higher than that of reverse scanning, thereby ensuring the scanning accuracy of the central production area. By implementing the second scanning mode on the edge area, the scanning efficiency of the edge area with low accuracy requirement is improved, the exposure scanning time of the edge area is shortened, the exposure efficiency of the glue-coated process plate is improved, and the photolithography process cost is reduced.

[0067] Figure 2 is a flowchart of another exposure method provided by the embodiment of the present application. Based on the above embodiments, referring to Figure 2 , the exposure method provided by the embodiment of the present application comprises:

[0068] S101, acquiring the whole-plate glue thickness data of the glue-coated process plate.

[0069] Specifically, the thickness of the photoresist is one of the indicators affecting the exposure accuracy. The difference in the thickness of the photoresist affects the difference in the exposure energy required. However, when the photoresist is applied, only the thickness of the central production area is controlled, and the thickness of the edge area is not controlled. This leads to the inconsistency of the thickness of the edge area and the central production area, and further leads to the inconsistency of the exposure energy required for the edge area and the central production area. If the thickness of the edge area is less than that of the central production area, energy will be wasted during exposure. If the thickness of the edge area is greater than that of the central production area, photoresist will be left around the central production area after development.

[0070] Before exposure, the substrate needs to be coated with photoresist, generally the entire surface is coated, but when the photoresist is applied, the central production area and the edge area are not distinguished. The edge area and the central production area are both coated by the coating equipment. The thickness data of the entire plate of the same batch of coating process plates can be measured using a thickness detection device. Obtaining the thickness data of the entire plate of the coating process plate facilitates subsequent analysis of the thickness data of the entire plate.

[0071] S102, according to the difference between the thickness data, determine the dividing line between the central production area and the edge area.

[0072] Specifically, the central production area is used for transferring the circuit pattern of the photoresist by exposure. The edge area is used for the bonding of the multi-layer board. The edge area is located around the central production area.

[0073] Since the thickness of the central production area is controlled when the photoresist is applied, the thickness of the central production area is relatively uniform. The thickness of the edge area is not controlled when the photoresist is applied, and the thickness of the edge area is different from that of the central production area. According to the difference between the thickness data, the dividing line between the central production area and the edge area can be found, which facilitates the division of the central production area and the edge area according to the dividing line.

[0074] S103, according to the relationship between the thickness data and the exposure energy, determine the first scanning mode of the central production area and the second scanning mode of the edge area.

[0075] Specifically, due to the different thickness of the photoresist, the exposure energy required is different. According to the thickness data of the central production area, the first scanning mode of the central production area is determined. The first scanning mode includes scanning energy, scanning speed, scanning accuracy, etc. corresponding to the central production area. According to the thickness data of the edge area, the second scanning mode of the edge area is determined. The second scanning mode includes scanning energy, scanning speed, scanning accuracy, etc. corresponding to the edge area.

[0076] S104, using the first scanning mode and the second scanning mode, scanning the central production area and the edge area.

[0077] Specifically, the central production area is scanned by using the first scanning mode, and the edge area is scanned by using the second scanning mode. Since the glue thicknesses of the central production area and the edge area are different, the central production area and the edge area are scanned by using different scanning modes respectively, so that the exposure accuracy of the central production area meets the requirements, and the exposure speed of the edge area can be higher, thereby better shortening the time length of exposure scanning, improving the exposure efficiency of the glue-coated process plate, and reducing the photolithography process cost.

[0078] The exposure method provided in the embodiment acquires the whole-plate glue thickness data of the glue-coated process plate. According to the differences between the glue thickness data, the dividing line between the central production area and the edge area is determined. According to the relationship between the glue thickness data and the exposure energy, the first scanning mode of the central production area and the second scanning mode of the edge area are determined. The central production area and the edge area are scanned by using the first scanning mode and the second scanning mode. The exposure method provided in the embodiment shortens the exposure scanning time of the edge area, improves the exposure efficiency of the glue-coated process plate, and reduces the photolithography process cost.

[0079] Optionally, Figure 3 is a schematic diagram of a time-sharing scanning exposure path provided in the embodiment of the present application. On the basis of the above-mentioned embodiments, in combination with Figure 2 and Figure 3 The embodiment further includes that the step S102 of determining the dividing line between the central production area and the edge area according to the differences between the glue thickness data can include:

[0080] Step one, according to the preset sizes of the central production area and the edge area, the boundary frame L1 is determined.

[0081] Specifically, according to the preset size of the central production area and the preset size of the edge area, the boundary frame of the glue-coated process plate is determined.

[0082] Step two, according to the differences between the glue thickness data of at least three points on a straight line perpendicular to the boundary frame, the boundary point between the central production area and the edge area is determined.

[0083] Specifically, the glue thickness data of multiple points on a line perpendicular to the boundary box is collected. When a point adjacent to the compared point has a glue thickness difference less than a first threshold value with the compared point, and the compared point has a glue thickness difference greater than a second threshold value with other adjacent points, the compared point is determined as a boundary point. For example, there are three points A, B and C. A and B are compared, where B is the compared point and A is the comparison point. The glue thickness difference between A and B is greater than the second threshold value. B and C are compared, where B is the compared point and C is the comparison point. The glue thickness difference between B and C is less than the first threshold value. At this time, B as the compared point is a boundary point.

[0084] Step three, connecting at least two boundary points, fitting to determine the boundary line between the central production area and the edge area by the least square method; or, according to the size of the boundary box and the edge area, determining a preset boundary point, determining a new boundary point according to the midpoint between the boundary point and the preset boundary point on the same straight line, connecting at least two new boundary points to determine the boundary line L2 between the central production area and the edge area.

[0085] Specifically, a plurality of boundary points are determined by the above step two. The plurality of boundary points are connected, and the least square method is used for fitting to determine the boundary line between the central production area and the edge area.

[0086] Alternatively, at least one preset boundary point is determined according to the size of the boundary box and the edge area. The midpoint between the boundary point determined in step two and the preset boundary point on the same straight line is determined as a new boundary point. At least two new boundary points are connected and fitted to determine the boundary line between the central production area and the edge area.

[0087] The length of the line segment perpendicular to the boundary box can be determined according to the size of the boundary box and the size of the glue-coated process plate. The selection density of the boundary point can be determined according to the size of the central production area of the glue-coated process plate.

[0088] Optionally, on the basis of the above embodiments, the embodiment further comprises: the step S103 can comprise:

[0089] Step one, determining the first scanning energy and the first scanning speed of the laser direct imaging exposure machine according to the relationship between the glue thickness data of the central production area and the exposure energy, and determining the first scanning mode as forward scanning at the first scanning energy and the first scanning speed according to the accuracy of the laser direct imaging exposure machine.

[0090] Step two, according to the relationship between the glue thickness data of the edge area and the exposure energy, determine the second scanning energy and the second scanning speed of the laser direct imaging exposure machine, and determine the second scanning mode as forward scanning and reverse scanning at the second scanning energy and the second scanning speed.

[0091] Specifically, due to the different glue thickness of the central production area and the edge area, the first scanning energy corresponding to the first scanning mode and the second scanning energy corresponding to the second scanning mode can be different. The first scanning speed of the first scanning mode and the second scanning speed corresponding to the second scanning mode can be different. Since the error of the worktable moving in reverse is greater than that of moving forward during reverse scanning, the reverse movement will form an "idling" phenomenon due to the existence of the gap, causing additional error. Moreover, for the central production area, the exposure pattern needs to be reversed during reverse scanning, resulting in a longer pattern processing time for reverse scanning than for forward scanning. The more complex the pattern, the longer the reverse pattern processing time. By using forward scanning in the central production area, the exposure accuracy is guaranteed. Since there is no complex exposure pattern in the edge area, the pattern processing time is short, and bidirectional scanning using forward scanning and reverse scanning in the edge area effectively utilizes reverse scanning, avoids travel waste, and shortens the processing time.

[0092] According to the difference in glue thickness between the central production area and the edge area, different exposure energy and exposure speed are used for exposure in the central production area and the edge area, meeting the different exposure requirements caused by the difference in glue thickness between the edge area and the central production area, and avoiding the situation that the first scanning mode of the central production area cannot be fully exposed due to excessive glue thickness in the edge area. At the same time, higher exposure energy and scanning speed are used in the edge area, which shortens the overall exposure time of the glue-coated process plate.

[0093] Optionally, based on the above embodiments, the present embodiment can further include: the step S104, using the first scanning mode and the second scanning mode to scan the central production area and the edge area, comprising:

[0094] Time-sharing scanning based on the first scanning mode for the central production area and based on the second scanning mode for the edge area; or interleaved scanning based on the first scanning mode for the central production area and based on the second scanning mode for the edge area.

[0095] Specifically, time-sharing scanning can scan the central production area and the edge area at different times, so that the edge area and the central production area are exposed at different times. Interleaved scanning means that the edge area and the central production area are scanned alternately. Both of these two scanning methods can realize bidirectional scanning of the edge area.

[0096] Compared with the exposure mode of time-sharing scanning, the exposure mode of interleaved scanning only moves to the exposure starting point once, without twice moving to the exposure starting point, and has fewer path moving steps and shorter exposure time.

[0097] An optional embodiment, on the basis of the above-mentioned embodiments, the embodiment can further include that the time-sharing scanning of the central production area based on the first scanning mode and the edge area based on the second scanning mode can include:

[0098] The central production area is scanned in the first scanning mode, and after the scanning of the central production area is completed, the edge area is scanned in the second scanning mode; or, the edge area is scanned in the second scanning mode, and after the scanning of the edge area is completed, the central production area is scanned in the first scanning mode.

[0099] Specifically, the scanning sequence corresponding to the time-sharing scanning is not limited. For example, the edge area can be scanned in the second scanning mode first, and after the edge area is completely scanned, the central production area is scanned in the first scanning mode again. For example, the central production area can be scanned in the first scanning mode first, and after the central production area is completely scanned, the edge area is scanned in the second scanning mode again.

[0100] Optionally, Figure 4 is another schematic diagram of an exposure path of time-sharing scanning provided by the embodiment of the application. In combination with Figures 1 to 4 On the basis of the above-mentioned embodiments, the edge area includes a first sub-edge area S1 and a second sub-edge area S2 extending along a first direction N1 and oppositely arranged, and a third sub-edge area S3 and a fourth sub-edge area S4 extending along a second direction N2 and oppositely arranged; the first sub-edge area S1 is adjacent to the third sub-edge area S3 and the fourth sub-edge area S4, and the second sub-edge area S2 is adjacent to the third sub-edge area S3 and the fourth sub-edge area S4.

[0101] On the basis of the above-mentioned embodiments, the scanning of the edge area in the second scanning mode can include: scanning the fourth sub-edge area S4 in the second direction N2, after the scanning of the fourth sub-edge area S4 is completed, scanning the first sub-edge area S1, after the scanning of the first sub-edge area S1 is completed, scanning the third sub-edge area S3, and after the scanning of the third sub-edge area S3 is completed, scanning the second sub-edge area S2.

[0102] Specifically, the exposure lens moves to an exposure starting point of the edge region, and scanning is performed using a second scanning mode. The second scanning mode is to generate a new GDS pattern according to the frame boundary, including bidirectional scanning of forward scanning and reverse scanning, and the scanning energy and scanning speed are based on the glue thickness of the edge region. In this way, when the edge region is scanned, only one exposure starting point needs to be selected, which reduces the process difficulty and improves the exposure efficiency.

[0103] Optionally, on the basis of the above-mentioned embodiments, the first scanning mode is used to perform forward scanning on the central production region, which can include:

[0104] In the second direction N2, the central production region is scanned row by row in the forward direction, and the laser direct imaging exposure machine is controlled to remain in the closed state in the reverse direction of the second direction N2.

[0105] Specifically, according to the GDS pattern of the central production region, the edge region and the boundary line L2 of the central production region, the first scanning mode is used for central production region exposure, and the exposure lens moves to the exposure starting point of the central production region. In the second direction N2, the central production region is scanned in the forward direction, and according to the GDS pattern, the scanning energy and scanning speed corresponding to the glue thickness data of the central production region are used for exposure. In the reverse direction of the second direction N2, the laser direct imaging exposure machine is controlled to remain in the closed state. In this way, the exposure accuracy of the central production region is higher.

[0106] It should be noted that the first direction N1 and the second direction N2 intersect, Figures 2 to 3 The first direction N1 and the second direction N2 are perpendicular to each other in the example, which is not limited here. The first direction N1 can be Figure 2 The direction shown in the figure, or Figure 3 The direction shown in the figure, which is not limited here.

[0107] Optionally, Figure 5 is a schematic diagram of an exposure path provided by an embodiment of the present application. Figure 6 is another schematic diagram of an exposure path provided by an embodiment of the present application. On the basis of the above-mentioned embodiments, in combination with Figure 2 , Figure 5 and Figure 6The edge region includes a first sub-edge region S1 and a second sub-edge region S2 extending along a first direction N1 and oppositely arranged, and a third sub-edge region S3 and a fourth sub-edge region S4 extending along a second direction N2 and oppositely arranged; the first sub-edge region S1 is adjacent to the third sub-edge region S3 and the fourth sub-edge region S4, and the second sub-edge region S2 is adjacent to the third sub-edge region S3 and the fourth sub-edge region S4.

[0108] On the basis of the above-mentioned embodiments, the interleaved scanning of the central production region based on the first scanning mode and the edge region based on the second scanning mode can include:

[0109] First, when scanning along the second direction N2, the second scanning mode is performed in the fourth sub-edge region S4 for bidirectional scanning.

[0110] Second, when scanning along the second direction N2, the second scanning mode is performed in the first sub-edge region S1 for forward scanning, the first scanning mode is performed in the central production region for forward scanning, and the second scanning mode is performed in the second sub-edge region S2 for forward scanning; when scanning along the reverse direction of the second direction N2, the second scanning mode is performed in the second sub-edge region S2 for reverse scanning, the laser direct imaging exposure machine is controlled to be closed in the central production region, and the second scanning mode is performed in the first sub-edge region S1 for reverse scanning.

[0111] Third, when scanning along the second direction N2, the second scanning mode is performed in the third sub-edge region S3 for bidirectional scanning.

[0112] Specifically, the first scanning mode and the second scanning mode are switched in the corresponding regions. When scanning the edge region, the second scanning mode is performed. When scanning the central production region, the first scanning mode is performed. Since the edge region and the central production region alternately perform scanning, the exposure lens only needs to be moved to the exposure starting point of the edge region once, which reduces the process difficulty of exposure, shortens the process time of exposure, and improves the exposure efficiency.

[0113] It should be noted that the first direction N1 and the second direction N2 intersect, Figure 5 and Figure 6 The first direction N1 and the second direction N2 are perpendicular to each other as exemplarily shown in the above-mentioned embodiments, which are not limited herein. The first direction N1 can be the direction shown in the above-mentioned embodiments, or the direction shown in the above-mentioned embodiments, which are not limited herein. Figure 5 Figure 6 The first direction N1 can be the direction shown in the above-mentioned embodiments, or the direction shown in the above-mentioned embodiments, which are not limited herein.

[0114] ​Optionally, based on the above embodiments, when the glue thickness of the edge region is greater than the glue thickness of the central production region, the scanning energy of the edge region is greater than the scanning energy of the central production region, and the scanning speed of the edge region is equal to the scanning speed of the central production region. When the glue thickness of the edge region is less than or equal to the glue thickness of the central production region, the scanning energy of the edge region is greater than the scanning energy of the central production region, and the scanning speed of the edge region is greater than the scanning speed of the central production region.

[0115] Specifically, when the glue thickness of the edge region is greater than the glue thickness of the central production region, the scanning energy of the second scanning mode of the edge region is much greater than the scanning energy of the first scanning mode of the central production region. The scanning speed of the second scanning mode of the edge region is equal to the scanning speed of the first scanning mode of the central production region. When the glue thickness of the edge region is equal to or less than the glue thickness of the central production region, the scanning energy of the second scanning mode of the edge region is slightly greater than the scanning energy of the first scanning mode of the central production region, and the scanning speed of the second scanning mode of the edge region is much greater than the scanning speed of the first scanning mode of the central production region. In this way, the situation that the exposure mode adopted by the edge region cannot be fully exposed due to excessive glue thickness is avoided. At the same time, higher exposure energy and scanning speed are adopted in the edge region, and the overall exposure time is shortened.

[0116] It should be noted that, Figures 3 to 6 The dashed arrow direction in the above formula (1) represents the forward scanning path of the central production region. When the laser direct imaging exposure machine moves in the opposite direction of the dashed arrow, the laser direct imaging exposure machine is controlled to remain in the closed state.

[0117] Based on the same inventive concept, the embodiment provides an exposure control device, comprising:

[0118] An acquisition module is configured to acquire the whole-board glue thickness data of the gluing process board.

[0119] A first determination module is configured to determine the demarcation line between the central production region and the edge region according to the difference between the glue thickness data.

[0120] A second determination module is configured to determine the first scanning mode of the central production region and the second scanning mode of the edge region according to the relationship between the glue thickness data and the exposure energy.

[0121] A laser direct imaging exposure machine is configured to scan the central production region and the edge region by using the first scanning mode and the second scanning mode.

[0122] The exposure control device provided by the embodiment acquires the whole-plate glue thickness data of the gluing process plate through an acquisition module. A first determination module determines a boundary line between a central production area and an edge area according to the difference between the glue thickness data. A second determination module determines a first scanning mode of the central production area and a second scanning mode of the edge area according to the relationship between the glue thickness data and exposure energy. A laser direct imaging exposure machine adopts the first scanning mode and the second scanning mode to scan the central production area and the edge area. The exposure control device provided by the embodiment shortens the exposure scanning time of the edge area, improves the exposure efficiency of the gluing process plate, and reduces the photolithography process cost.

[0123] It should be noted that the above only describes the preferred embodiments of the present application and the applied technical principles. Those skilled in the art will understand that the present application is not limited to the specific embodiments described herein, and various obvious changes, re-adjustments and substitutions can be made by those skilled in the art without departing from the scope of the present application. Therefore, although the present application has been described in detail through the above embodiments, the present application is not limited to the above embodiments, and can include more other equivalent embodiments without departing from the concept of the present application, and the scope of the present application is determined by the scope of the appended claims.

Claims

1. An exposure method, characterized in that, include: Obtain the boundary line between the central production area and the peripheral areas; A first scanning mode is performed in the central production area according to the boundary line, and a second scanning mode is performed in the edge area; the first scanning mode is a forward scan, and the second scanning mode is a combination of forward and reverse scans.

2. The exposure method according to claim 1, characterized in that, The process of obtaining the boundary line between the central production area and the peripheral area includes: Obtain the total adhesive thickness data of the coated board; Based on the differences in the adhesive thickness data, the boundary line between the central production area and the edge area is determined.

3. The exposure method according to claim 2, characterized in that, The step of determining the boundary line between the central production area and the edge area based on the difference in adhesive thickness data includes: The boundary borders are determined based on the preset dimensions of the central production area and the edge areas; The boundary point between the central production area and the edge area is determined based on the difference in adhesive thickness data between at least three points on a straight line perpendicular to the boundary border. Connect at least two boundary points and use least squares fitting to determine the boundary line between the central production area and the edge area; or, determine a preset boundary point based on the size of the boundary border and the edge area, and determine a new boundary point based on the midpoint between the boundary point and the preset boundary point located on the same straight line, and connect at least two new boundary points to determine the boundary line between the central production area and the edge area.

4. The exposure method according to claim 2, characterized in that, The step of performing a first scanning mode in the central production area and a second scanning mode in the edge area according to the boundary line includes: Based on the relationship between the adhesive thickness data and exposure energy in the central production area, the first scanning energy and the first scanning speed of the laser direct imaging exposure machine are determined, and based on the accuracy of the laser direct imaging exposure machine, the first scanning mode is determined to be forward scanning with the first scanning energy and the first scanning speed. Based on the relationship between the adhesive thickness data of the edge region and the exposure energy, the second scanning energy and the second scanning speed of the laser direct imaging exposure machine are determined, and the second scanning mode is determined to be forward scanning and reverse scanning with the second scanning energy and the second scanning speed.

5. The exposure method according to any one of claims 1 to 4, characterized in that, The step of performing a first scanning mode in the central production area and a second scanning mode in the edge area according to the boundary line includes: The central production area is scanned in a time-division manner based on the first scanning mode, and the edge area is scanned in a time-division manner based on the second scanning mode; or... The central production area is scanned using the first scanning mode and the edge area is scanned using the second scanning mode.

6. The exposure method according to claim 5, characterized in that, The step of performing time-division scanning of the central production area based on the first scanning mode and the edge area based on the second scanning mode includes: The central production area is scanned forward using the first scanning mode. After the central production area is scanned, the edge area is scanned bidirectionally using the second scanning mode; or... The edge region is scanned bidirectionally using the second scanning mode. After the edge region scanning is completed, the central production area is scanned using the first scanning mode.

7. The exposure method according to claim 6, characterized in that, The edge region includes a first sub-edge region and a second sub-edge region extending along a first direction and arranged opposite to each other, and a third sub-edge region and a fourth sub-edge region extending along a second direction and arranged opposite to each other; the first sub-edge region is adjacent to both the third sub-edge region and the fourth sub-edge region, and the second sub-edge region is adjacent to both the third sub-edge region and the fourth sub-edge region; the first direction and the second direction intersect each other; The step of performing a bidirectional scan of the edge region using the second scanning mode includes: Along the second direction, the fourth sub-edge region is scanned bidirectionally. After the fourth sub-edge region is scanned, the first sub-edge region is scanned bidirectionally. After the first sub-edge region is scanned, the third sub-edge region is scanned bidirectionally. After the third sub-edge region is scanned, the second sub-edge region is scanned bidirectionally.

8. The exposure method according to claim 6, characterized in that, The step of performing a forward scan of the central production area using the first scanning mode includes: The central production area is scanned line by line in a forward direction along the second direction; In the opposite direction to the second direction, the laser direct imaging exposure machine is kept in the off state.

9. The exposure method according to claim 5, characterized in that, The edge region includes a first sub-edge region and a second sub-edge region extending along a first direction and arranged opposite to each other, and a third sub-edge region and a fourth sub-edge region extending along a second direction and arranged opposite to each other; the first sub-edge region is adjacent to both the third sub-edge region and the fourth sub-edge region, and the second sub-edge region is adjacent to both the third sub-edge region and the fourth sub-edge region; The method of interleaving the scanning of the central production area based on the first scanning mode and the edge area based on the second scanning mode includes: When scanning along the second direction, the second scanning mode is performed in the fourth sub-edge region to perform bidirectional scanning; When scanning along the second direction, the second scanning mode is performed for forward scanning in the first sub-edge region, the first scanning mode is performed for forward scanning in the central production region, and the second scanning mode is performed for forward scanning in the second sub-edge region; when scanning in the opposite direction of the second direction, the second scanning mode is performed for reverse scanning in the second sub-edge region, the laser direct imaging exposure machine is turned off in the central production region, and the second scanning mode is performed for reverse scanning in the first sub-edge region. When scanning along the second direction, the second scanning mode is performed in the third sub-edge region for bidirectional scanning.

10. The exposure method according to any one of claims 6 to 9, characterized in that, When the adhesive thickness in the edge region is greater than that in the central production region, the scanning energy in the edge region is greater than that in the central production region, and the scanning speed in the edge region is equal to that in the central production region. When the adhesive thickness in the edge region is less than or equal to the adhesive thickness in the central production region, the scanning energy in the edge region is greater than the scanning energy in the central production region, and the scanning speed in the edge region is greater than the scanning speed in the central production region.

11. An exposure control device, characterized in that, include: The acquisition module is used to acquire the total glue thickness data of the glue-coated board. The first determining module is used to determine the boundary line between the central production area and the edge area based on the difference between the glue thickness data; The second determining module is used to determine the first scanning mode of the central production area and the second scanning mode of the edge area based on the relationship between the adhesive thickness data and the exposure energy. A laser direct imaging exposure machine is used to scan the central production area and the edge area using the first scanning mode and the second scanning mode.

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