Keyboard

Abstract

The invention relates to a keyboard. The keyboard may include a top case and a bottom case coupled to each other to define an interior compartment. A plurality of inner layers are contained within the inner compartment. The plurality of inner layers may include: a plurality of keys mounted on the switch panel, where a portion of each of the plurality of keys protrudes beyond the top case; a printed circuit board (PCB) layer disposed below the switch board; and the gasket layer is arranged below the PCB layer. The spacer layer includes a peripheral wall and a floor integrally formed with the peripheral wall. And the switch plate is connected with the peripheral wall of the gasket layer.

Description

Technical Field

[0001] This disclosure generally relates to computer peripherals. Specifically, this disclosure relates to keyboards. Background Technology

[0002] Keyboards are one of the most commonly used computer peripherals. Keyboards on the market generally fall into two categories: membrane keyboards and mechanical keyboards. Mechanical keyboards use mechanical switches and have keys with a longer key travel, which provides a superior typing experience. However, conventional mechanical keyboards produce relatively loud noise when typing. Therefore, there is a design need in the keyboard industry to reduce the noise generated by keystrokes in mechanical keyboards.

[0003] Public content

[0004] This disclosure generally describes a keyboard and a method for assembling the keyboard. In some embodiments, the keyboard may include a top shell and a bottom shell connected to each other to define an internal compartment. The internal compartment includes a plurality of internal layers. The plurality of internal layers may include: a plurality of keys mounted on a switch plate, wherein a portion of each of the plurality of keys protrudes beyond the top shell (e.g., from the top surface of the top shell); a printed circuit board layer, i.e., a PCB layer, disposed below the switch plate; and a spacer layer disposed below the PCB layer. The spacer layer may include a peripheral wall and a base plate integrally formed with the peripheral wall. The switch plate may be coupled to the peripheral wall of the spacer layer.

[0005] In some embodiments, the switchboard includes at least one leg formed along the peripheral edge of the switchboard, wherein at least one leg of the switchboard is connected to the peripheral wall of the gasket layer.

[0006] In some embodiments, the gasket layer includes at least one groove formed in the peripheral wall, and each of the at least one leg is inserted into a corresponding groove in the at least one groove.

[0007] In some embodiments, at least one groove is formed at the lower end of the peripheral wall of the gasket layer adjacent to the bottom plate of the gasket layer.

[0008] In some embodiments, each of at least one slot further includes a suspension protrusion, and each of at least one leg of the switch plate further includes an extension and a foot portion, wherein the suspension protrusion rests on the foot portion.

[0009] In some embodiments, the gasket layer includes at least one opening formed through the peripheral wall of the gasket layer.

[0010] In some embodiments, the PCB layer further includes at least one tab formed along the peripheral edge of the PCB layer, wherein each of the at least one tab passes through a corresponding opening in at least one opening formed through the peripheral wall of the pad layer.

[0011] In some embodiments, the gasket layer also includes a plurality of support pins extending upward from the top surface of the base plate, wherein the PCB layer is supported on the plurality of support pins.

[0012] In some embodiments, the multiple inner layers further include a first foam layer, wherein the first foam layer is disposed between the PCB layer and the base plate of the pad layer.

[0013] In some implementations, the multiple inner layers also include a switch foam layer, wherein the switch foam layer is disposed between the switch board and the PCB layer.

[0014] A method for assembling a keyboard may include: forming a sub-assembly by mounting a plurality of keys on a switch board and mounting a PCB layer to the bottom side of the switch board. The method further includes: mounting the sub-assembly in a spacer layer, wherein the spacer layer includes a peripheral wall and a base plate integrally formed with the peripheral wall; connecting the switch board to the peripheral wall of the spacer layer; mounting a bottom shell to the bottom side of the spacer layer; mounting a top shell on the sub-assembly and the spacer layer; and connecting the top shell and the bottom shell to each other.

[0015] In some embodiments, the switch plate includes at least one leg formed along the peripheral edge of the switch plate, wherein connecting the switch plate to the peripheral wall of the gasket layer includes connecting at least one leg of the switch plate to the peripheral wall of the gasket layer.

[0016] In some embodiments, the gasket layer includes at least one groove formed in the peripheral wall, wherein connecting at least one leg of the switch plate to the peripheral wall of the gasket layer includes inserting each of the at least one leg into a corresponding groove in the at least one groove.

[0017] In some embodiments, at least one groove is formed at the lower end of the peripheral wall of the gasket layer adjacent to the bottom plate of the gasket layer.

[0018] In some embodiments, each of at least one slot further includes a suspension protrusion, and each of at least one leg of the switch plate further includes an extension and a foot portion, wherein the suspension protrusion rests on the foot portion.

[0019] In some embodiments, the gasket layer includes at least one opening formed through the peripheral wall of the gasket layer.

[0020] In some embodiments, the PCB layer further includes at least one tab formed along the peripheral edge of the PCB layer, and the method further includes: passing each of the at least one tab through a corresponding opening in at least one opening formed through the peripheral wall of the pad layer.

[0021] In some embodiments, the gasket layer also includes a plurality of support pins extending upward from the top surface of the base plate, wherein the PCB layer is supported on the plurality of support pins.

[0022] In some embodiments, forming the sub-assembly further includes: mounting a first foam layer, wherein the first foam layer is disposed between the base plate of the PCB layer and the pad layer.

[0023] In some implementations, forming the sub-assembly further includes mounting a first foam layer between the PCB layer and the base plate of the pad layer.

[0024] In some implementations, forming a sub-assembly further includes mounting a switch foam layer between the switch board and the PCB layer.

[0025] In some embodiments, forming the sub-assembly further includes mounting a second foam layer between the switch foam layer and the switch plate.

[0026] The embodiments disclosed herein can provide numerous benefits. For example, the switch board is coupled to a pad layer made of a compressible and flexible material. Noise and vibration generated by keystrokes during typing can be absorbed by the pad layer. The pad layer comprises a one-piece recessed structure having peripheral walls and a base plate. The inner layer includes the switch board, and the PCB layer may be contained within the recess of the pad layer. The pad layer can help absorb vibrations between the internal layers of the keyboard during keystrokes. These and other benefits should be apparent to those skilled in the art upon reading the appended claims in accordance with the specification. Attached Figure Description

[0027] Figure 1 A schematic diagram of a keyboard according to some embodiments of the present disclosure is shown;

[0028] Figure 2 An exploded view of a keyboard according to some embodiments of the present disclosure is shown;

[0029] Figure 3A A schematic diagram of a pad layer for a keyboard according to some embodiments of the present disclosure is shown;

[0030] Figure 3B A partial view of the keyboard pad layer is shown, illustrating the pattern along... Figure 3A The cross section intercepted by line AA in the middle;

[0031] Figure 4AA top view of a switchboard according to some embodiments of the present disclosure is shown;

[0032] Figure 4B A right-side view of a switchboard according to some embodiments of the present disclosure is shown;

[0033] Figure 4C A bottom perspective view of a switchboard according to some embodiments of the present disclosure is shown;

[0034] Figure 5 A top view of a PCB layer according to some embodiments of the present disclosure is shown;

[0035] Figure 6A A cross-sectional side view of a keyboard according to some embodiments of the present disclosure is shown;

[0036] Figure 6B It shows Figure 6A An enlarged view of region B shown; and

[0037] Figure 7 A flowchart of a method for assembling a keyboard according to some embodiments of the present disclosure is shown. Detailed Implementation

[0038] This disclosure generally relates to computer peripherals. Specifically, this disclosure relates to implementations of keyboards.

[0039] The subject matter of embodiments of the invention is specifically described herein to satisfy legal requirements, but this description is not necessarily intended to limit the scope of the claims. The claimed subject matter may be implemented in other ways, may include different elements or steps, and may be used in combination with other existing or future technologies. Unless the order of the steps or the arrangement of the elements is explicitly described, this description should not be construed as implying any particular order or arrangement of the steps or elements.

[0040] Typical keyboards often employ a multi-layered structure, where multiple inner layers are contained within a compartment formed by a top and bottom shell. To reduce noise and vibration generated during typing, absorbent materials can be added between the inner layers, and / or noise-absorbing materials can be incorporated into some of the inner layers. Some embodiments of this disclosure envision using a compressible material to manufacture a pad layer adjacent to the bottom shell. In some embodiments, the pad layer may comprise a one-piece structure with peripheral sidewalls and a base plate. Some inner layers, such as key switch plates on which keys are mounted, may rest on the pad layer. In some embodiments, the peripheral sidewalls may support some of the keyboard's inner layers. For example, the pad layer may form grooves, and some of the keyboard's inner layers may be contained within these grooves. Some embodiments of this disclosure will be further described and illustrated below.

[0041] Figure 1 A schematic diagram of a keyboard 10 according to some embodiments of the present disclosure is shown. For example... Figure 1 As illustrated, the keyboard 10 may include a top shell 110 and a bottom shell 120 connected to each other. In some embodiments, the top shell 110 and the bottom shell 120 may define internal compartments for accommodating multiple internal layers, as will be described below. A plurality of keys 190 protrude from the top shell 110. A user can press each of the plurality of keys 190 to input commands to a connected computer (not shown), thereby enabling input operations.

[0042] Figure 2 An exploded view of a keyboard 10 according to some embodiments of the present disclosure is shown. As illustrated, the keyboard 10 may include a plurality of internal layers disposed between a top shell 110 and a bottom shell 120. It should be noted that the keyboard 10 is shown from an upper right perspective, where the top shell 110 is shown below the bottom shell 120. In an actually assembled keyboard 10, the top shell 110 is located at the top in the vertical direction, and the bottom shell 120 is located at the bottom in the vertical direction. Figure 2 As shown, the keyboard 10 may include a pad layer 130 housed within a base housing 120. In some embodiments, the base housing 120 may include a plurality of support pins extending from the top surface of the base housing 120 to support the pad layer 130. In some embodiments, the pad layer 130 may also rest directly on the top surface of the base housing 120. Figure 2 As shown, the pad layer 130 is configured in a recessed shape and may contain at least some of the inner layers of the keyboard 10 within its internal space. In some embodiments, a first foam layer 140, also referred to as a bottom foam layer, may be disposed within the pad layer 130. In some embodiments, the first foam layer 140 may rest on the bottom of the recess of the pad layer 130. In some other embodiments, the pad layer 130 may include a plurality of support pins extending from the upper surface of the bottom of the recess of the pad layer 130 to support the first foam layer 140. It should be noted that the first foam layer 140 is not essential in the keyboard 10, but may be included in some embodiments as described herein. In some embodiments, the keyboard 10 may not include the first foam layer 140 to reduce the overall height of the keyboard 10. In some embodiments, a printed circuit board layer 150, i.e., a PCB layer 150, is disposed on the first foam layer 140. A user can press each of the plurality of keys 190 to bring a portion of the keys into contact with the PCB layer 150, thereby generating an electrical signal on the PCB layer that can be coupled to input data from a connected computer to perform an input operation. In some other embodiments that do not include the first foam layer 140, the PCB layer 150 is disposed on the pad layer 130 or supported by a plurality of pins disposed on the pad layer 130.

[0043] In some implementations, a switch foam layer 160 is disposed on the PCB layer 150 to provide additional noise and vibration absorption. It should be noted that the switch foam layer 160 is not necessary in the keyboard 10. Figure 2 As shown, a second foam layer 170 is disposed on the switch foam layer 160 to provide additional noise and vibration absorption. In embodiments that do not include the switch foam layer 160, the second foam layer 170 is disposed directly on the PCB layer 150. It should be noted that the second foam layer 170 is not essential in the keyboard 10. In some embodiments, a switch plate 180 is disposed on the second foam layer 170. The switch plate 180 may include multiple keyholes for mounting and providing structural support for the multiple keys 190. In some embodiments that do not include the second foam layer 170, the switch plate 180 may be disposed on the switch foam layer 160. Of course, in some embodiments, if the keyboard 10 also does not include the switch foam layer 160, the switch plate 180 may be disposed directly on the PCB layer 150.

[0044] like Figure 2 As shown, multiple keys 190 can be mounted on a switch plate 180, wherein a portion of the key body passes through keyholes formed in the switch plate 180. Finally, a top shell 110 can cover the stack of inner layers including the switch plate 180, the second foam layer 170, the switch foam layer 160, the PCB layer 150, the first foam layer 140, and the spacer layer 130. Figure 2 As shown, the top shell 110 can be configured as a frame with gaps in a portion of the panel area to expose the keycaps of the plurality of keys 190.

[0045] In some embodiments, as will be described in detail below, some or all of the inner layers may be accommodated within a recess in the gasket layer 130, wherein the peripheral wall 310 of the gasket layer 130 (in) Figure 3A (As shown in the image) the perimeter edges surrounding these inner layers.

[0046] Figure 3A A schematic diagram of a pad layer 130 of a keyboard 10 according to some embodiments of the present disclosure is shown. Figure 3B A partial view of the pad layer 130 of the keyboard 10 is shown, illustrating the arrangement along... Figure 3A The cross-section is taken by line AA in the figure. As illustrated, in some embodiments, the gasket layer 130 can be manufactured as a one-piece structure using, for example, extrusion or molding processes. In some embodiments, the gasket layer 130 may include a peripheral wall 310 and a base plate 320 integrally formed with the peripheral wall 310. In some embodiments, the gasket layer 130 may be configured as a recessed shape, which may accommodate or contain other internal layers such as Figure 2The diagram shows a first foam layer 140 (when the first foam layer 140 is included), a PCB layer 150, a switch foam layer 160 (when the switch foam layer 160 is included), a second foam layer 170 (when the second foam layer 170 is included), a switch plate 180, and a portion of the keys 190. A peripheral wall 310 may surround the peripheral edges of these inner layers. In some embodiments, the gasket layer 130 may be made of a compressible and / or flexible material, such as silicone rubber, thermoplastic elastomer (TPE), and polyurethane (PU) foam. These materials can help the gasket layer 130 provide noise and vibration absorption for the keyboard 10.

[0047] like Figure 3A As shown, in some embodiments, the peripheral wall 310 may include a first wall segment 312, a second wall segment 314, a third wall segment 316, and a fourth wall segment 318. In a typical rectangular keyboard layout, the first wall segment 312 and the third wall segment 316 extend opposite and parallel to each other, and the second wall segment 314 and the fourth wall segment 318 extend opposite and parallel to each other. It should be noted that wall segments 312 to 318 are not necessarily constructed in this manner. In some embodiments not shown, wall segments 312 to 318 may be constructed to surround different quadrilaterals, such as parallelograms, trapezoids, or other shapes, for a particular application.

[0048] like Figure 3A As shown, in some embodiments, the peripheral wall 310 may be joined to the base plate 320 at the corner of the intersection between the peripheral wall 310 and the base plate 320. In some embodiments, the thickness of the peripheral wall 310 may be slightly greater than the thickness of the base plate 320. For example, the peripheral wall 310 may have a thickness of 3 mm to 5 mm, and the base plate 320 may have a thickness of 1 mm to 3 mm. In some embodiments, the peripheral wall 320 is a continuous peripheral wall. It should be noted that the peripheral wall 310 does not necessarily have to be continuous. In some other embodiments not shown, the peripheral wall 310 may include small gaps at appropriate locations along the peripheral wall 310. For example, these small gaps may provide space to help release stress applied to the peripheral wall 310 when the pad layer 130 is assembled in the keyboard 10.

[0049] In some implementations, the switchboard 180 (in) Figure 2 (As shown in the diagram) can be connected to the peripheral wall 310 of the gasket layer 130. For example... Figure 3A and Figure 3BAs shown, in some embodiments, the peripheral wall 310 may include at least one groove 315 formed in the peripheral wall 310. Specifically, in some embodiments, the groove 315 may be formed at the lower end of the peripheral wall 310 adjacent to the base plate 320. In other words, in some embodiments, the groove 315 may be formed at the corner where the peripheral wall 310 intersects the base plate 320. When assembling the keyboard 10, the support leg 410 of the switch plate 180 (in Figure 4A and Figure 4B As shown in the diagram, it can be inserted into the slot 315 to help the switch board 180 press the underlying inner layers, such as the second foam layer 170 (if present), the switch foam layer 160 (if present), the PCB layer 150, and the first foam layer 140 (if present), against the base plate 320 of the pad layer 130. This configuration facilitates the securing of these underlying inner layers constructed within the recess of the pad layer 130.

[0050] like Figure 3B As shown, in some embodiments, the groove 315 may not penetrate the total thickness of the peripheral wall 310. Instead, the groove 315 may cut into the peripheral wall 310 to a thickness less than the total thickness of the peripheral wall 310. In such cases, a hanging protrusion 317 may be formed in the peripheral wall 310. In some embodiments, the groove 315 may extend through the base plate 320 along the extending direction of the peripheral wall 310 to reach the bottom of the gasket layer 130. In some embodiments, the hanging protrusion 317 may rest on the support leg 410 of the switch plate 180 (in... Figures 4A to 4B On a portion shown below, to prevent or reduce the vertical movement of the switch plate 180, as referenced below. Figures 6A to 6B Further description.

[0051] like Figure 3B As shown, the groove 315 may include a platform 319 extending upward from the base plate 320 of the pad layer 130. In some embodiments, the platform 319 may enclose the groove 315. In some embodiments, the PCB layer 150 may rest on the platform 319.

[0052] like Figure 3A As shown, the peripheral wall 310 may include a plurality of slots 315 disposed at appropriate locations along the peripheral wall 310. For example, as Figure 3A As shown, the first wall segment 312 may include four slots 315, and the second wall segment 314 may include one slot 315. Although Figure 3A Not shown, but it should be understood that wall sections 316 and 318 may also include one or more slots 315. In some embodiments, the switch plate 180 may include corresponding legs 410 (in... Figures 4A to 4B(As shown in the diagram), the support leg 410 is for being inserted into a slot 315 formed in the peripheral wall 310. In some embodiments, the switch plate 180 may include a smaller number of support legs 410 than the number of slots 315 formed in the peripheral wall 310 (in...). Figures 4A to 4B (As shown in the diagram). This configuration provides design redundancy for the gasket layer 130 to accommodate different switch plates 180 with different numbers of legs 410. It should be noted that... Figure 3B Only details of one slot 315 are shown, and the remaining slots 315 may share the same structure and configuration. In some embodiments, such as Figure 3A As shown, these grooves 315 may have different lengths along the wall segment in which they are formed. Of course, in some other embodiments, these grooves 315 may have the same length.

[0053] like Figure 3A As shown, in some embodiments, the base plate 320 may include a plurality of support pins 322 disposed at certain locations on the base plate 320. In some embodiments, each support pin 322 may extend upward from the base plate 320 to a certain height, such as 1 mm to 3 mm. In some embodiments, the aforementioned inner layer, such as the first foam layer 140, may be supported on the support pins 322. In some embodiments not shown, the base plate 320 may not include the support pins 322. In such cases, the aforementioned inner layer, such as the first foam layer 140, may rest directly on the base plate 320.

[0054] like Figure 3A As shown, in some embodiments, the peripheral wall 310 may include at least one opening 313 extending through the thickness of the peripheral wall 310. In some embodiments, the opening 313 may be a tab 510 formed in the PCB layer 150 for connection to an external interface of a connected computer, such as a USB port, a type-C port, etc. Figure 5 (As shown in the image) provides a channel.

[0055] Figure 4A A top view of a switchboard 180 according to some embodiments of the present disclosure is shown. Figure 4B A right-side view of a switchboard 180 according to some embodiments of the present disclosure is shown. Figure 4C A bottom perspective view of a switchboard 180 according to some embodiments of the present disclosure is shown. Figure 4A As illustrated, the switch plate 180 may include at least one leg 410 formed along the peripheral edge of the switch plate 180. When assembling the keyboard 10, the leg 410 can be inserted into a corresponding slot 315 (in...). Figure 3A (As shown in the image). Figure 4BAs shown, the support leg 410 may include an extension portion 412 and a foot portion 414 connected to the extension portion 412. (See reference...) Figure 3B When the outrigger 410 is inserted into the slot 315, the suspension protrusion 317 can rest on the upper surface of the foot portion 414 to prevent the outrigger 410 from moving vertically in the slot 315, as will be described below. Figures 6A to 6B Further description.

[0056] like Figure 4B and Figure 4C As shown, in some embodiments, the switch plate 180 may include a plurality of support pins 420 extending from the bottom surface of the switch plate 180. In some embodiments, such as Figure 2 As shown, the support pin 420 can pass through the underlying inner layers, such as the second foam layer 170 (when the second foam layer 170 is included), the switch foam layer 160 (when the switch foam layer 160 is included), the PCB layer 150, and the first foam layer 140 (when the first foam layer 140 is included), to rest on the base plate 320 of the pad layer 130. Figure 3A (shown in the diagram) on the upper surface. In this configuration, the support pin 420 prevents the switch plate 180 and the underlying inner layer from sagging. In some other embodiments, the switch plate 180 may not include the support pin 420.

[0057] Figure 5 A top view of a PCB layer 150 according to some embodiments of the present disclosure is shown. As illustrated, in some embodiments, the PCB layer 150 may include at least one tab 510 formed along the peripheral edge of the PCB layer 150. In some embodiments, the tab 510 may pass through an opening 313 formed in the peripheral wall 310 of the pad layer 130 (in... Figure 3A (As shown in the diagram). For example, tab 510 may include interface circuitry, such as USB port circuitry or Type-C port circuitry. In this configuration, keyboard 10 can provide electrical connections between these interface circuitry and a computer externally connected to keyboard 10.

[0058] Figure 6A A cross-sectional side view of a keyboard 10 according to some embodiments of the present disclosure is shown. Figure 6B It shows Figure 6A An enlarged view of region B shown in the image. Figure 6AAs illustrated, in some embodiments, the keyboard 10 may include a top shell 110 and a bottom shell 120 connected to each other. An internal compartment is defined between the top shell 110 and the bottom shell 120 to accommodate an internal layer including a gasket layer 130, a first foam layer 140 (when the first foam layer 140 is included), a PCB layer 150, a switch foam layer 160 (when the switch foam layer 160 is included), a second foam layer 170 (when the second foam layer 170 is included), a switch plate 180, and a portion of the keys of a plurality of keys 190. As illustrated, the gasket layer 130 is configured as a recessed shape having a peripheral wall 310 and a base plate 320. In some embodiments, the recesses in the pad layer 130 may accommodate inner layers, such as the first foam layer 140 (when the first foam layer 140 is included), the PCB layer 150, the switch foam layer 160 (when the switch foam layer 160 is included), the second foam layer 170 (when the second foam layer 170 is included), the switch board 180, and a portion of the keys of the plurality of keys 190. In other words, the peripheral wall 310 surrounds the peripheral edge of these inner layers.

[0059] In some implementations, such as Figure 6B As shown, the switch plate 180 is coupled to the peripheral wall 310 of the pad layer 130. In this configuration, the switch plate 180 can press the underlying layers, including the second foam layer 170 (when the second foam layer 170 is included), the switch foam layer 160 (when the switch foam layer 160 is included), the PCB layer 150, and the first foam layer 140 (when the first foam layer 140 is included), onto the upper surface of the base plate 320 of the pad layer 130. In an alternative embodiment, if the pad layer 130 includes a support pin 322 (in... Figure 3A (As shown in the diagram), the switch plate 180 can press the lower layer onto the support pin 322 resting on the base plate 320 of the pad layer 130. When the user presses a key 190 of the keyboard 10, the noise and vibration generated by the key strike can be absorbed and / or damped by the material of the pad layer 130.

[0060] like Figure 6B As shown, in some embodiments, the legs 410 of the switch plate 180 can be inserted into grooves 315 formed in the peripheral wall 310 of the pad layer 130, wherein a suspension protrusion 317 engages the upper surface of the foot portion 414 of the legs 410. In this configuration, the connection between the suspension protrusion 317 of the pad layer 130 and the legs 410 of the switch plate 180 prevents the switch plate 180, together with the underlying inner layer, from moving vertically relative to the pad layer 130.

[0061] In another aspect of this disclosure, a method for assembling a keyboard 10 is proposed. As a first part of the method, a sub-assembly comprising a plurality of keys 190, a switch plate 180, a second foam layer 170 (when the second foam layer 170 is included), a switch foam layer 160 (when the switch foam layer 160 is included), a PCB layer 150, and a first foam layer 140 (when the first foam layer 140 is included) is formed or assembled. The sub-assembly can then be mounted in a spacer layer 130, wherein the switch plate 180 is coupled to the spacer layer 130. Next, a top shell 110 is mounted on top of the sub-assembly. Finally, a bottom shell 120 is mounted on the bottom of the spacer layer 130, wherein the bottom shell 120 is coupled to the top shell 110.

[0062] Figure 7 A flowchart of a method 700 for assembling a keyboard 10 according to some embodiments of the present disclosure is shown. (Refer to...) Figure 2 as well as Figures 6A to 6BThe method 700 is described. Step 710 includes mounting a plurality of keys 190 onto a switch plate 180. Specifically, this step includes mounting each of the plurality of keys 190 through a respective keyhole formed in the switch plate 180, wherein an upper portion of each key 190 protrudes from a top surface of the switch plate 180 and a lower portion of each key 190 protrudes from a bottom surface of the switch plate 180. At step 720, the method 700 may include mounting a second foam layer 170 to a bottom side of the switch plate 180. In some embodiments, the top side of the second foam layer 170 may include an adhesive. In such a case, the top side of the second foam layer 170 may be attached to the bottom side of the switch plate. Of course, in some embodiments that do not include the second foam layer 170, step 720 may be omitted. At step 730, the method 700 may include mounting a switch foam layer 160 to the bottom side of the second foam layer 170. In some embodiments, the top side of the second foam layer 170 may include an adhesive. In this case, the top side of the switch foam layer 160 can be attached to the bottom side of the second foam layer 170. Of course, in some embodiments that do not include the switch foam layer 160, step 730 can be omitted. At step 740, method 700 can include mounting the PCB layer 150 to the bottom side of the switch foam layer 160. Of course, in some embodiments that do not include the switch foam layer 160 and the second foam layer 170, the PCB layer 150 can be mounted to the bottom side of the switch board 180. At step 750, method 700 can include mounting the first foam layer 140 to the bottom side of the PCB layer 150. In some embodiments, the top side of the first foam layer 140 can include an adhesive. In this case, the top side of the first foam layer 140 can be attached to the bottom side of the PCB layer 150. Of course, in some embodiments that do not include the first foam layer 140, step 750 can be omitted. Therefore, a sub-assembly comprising multiple keys 190, a switch board 180, a second foam layer 170 (when the second foam layer 170 is included), a switch foam layer 160 (when the switch foam layer 160 is included), a PCB layer 150, and a first foam layer 140 (when the first foam layer 140 is included) is assembled. It should be noted that the first foam layer 140, the switch foam layer 160, and the second foam layer 170 are optional. In some embodiments, the sub-assembly may comprise only multiple keys 190, a switch board 180, and a PCB layer 150. The corresponding steps for installing other optional internal layers as described above can be omitted.

[0063] After forming the sub-assembly, at step 760, method 700 may include mounting the sub-assembly in the gasket layer 130. Then, at step 770, method 700 may include coupling the switch plate 180 to the peripheral wall 310 of the gasket layer 130. Specifically, this step may include coupling the legs 410 of the switch plate 180 to the peripheral wall 310 of the gasket layer 130, for example, by coupling the legs 410 of the switch plate 180 (in...) Figure 6B (As shown in the diagram) Inserted into a groove 315 formed in the peripheral wall 310 of the spacer layer 130. It should be understood that the material of the spacer layer 130 is compressible and flexible. Inserting the leg 410 into the groove 315 of the peripheral wall 310 may cause temporary deformation of the peripheral wall 310 of the spacer layer 130. After insertion, the peripheral wall 310 can return to its configuration before deformation. This step may then include inserting the tab 510 formed in the PCB layer 150 (in...) into a groove 315 formed in the peripheral wall 310 of the spacer layer 130. Figure 5 (as shown in the diagram) through the opening 313 formed in the peripheral wall 310 of the gasket layer 130 (in Figure 3A (as shown in the image).

[0064] At step 780, the method may include mounting the bottom shell 120 to the bottom side of the gasket layer 130. Then, at step 790, the method may include mounting the top shell 110 onto the structure including the sub-assembly and the gasket layer 130 below it. Finally, the top shell 110 and the bottom shell 120 may be joined together by fasteners, such as screws or other suitable coupling methods.

[0065] It should be noted that the systems and devices discussed above are intended only as examples. It must be emphasized that various implementations may omit, substitute, or add various steps or components as appropriate. Furthermore, features described with respect to certain implementations may be combined in various other implementations. Different aspects and elements of implementations may be combined in a similar manner. Moreover, it should be emphasized that technology is constantly evolving, and therefore many of these elements are illustrative and should not be construed as limiting the scope of this disclosure.

[0066] Specific details are set forth in the description to provide a thorough understanding of the embodiments. However, it will be understood by those skilled in the art that these embodiments can be practiced without these specific details. For example, well-known structures and techniques have been shown without unnecessary detail so as not to obscure the embodiments. This specification provides only exemplary embodiments and is not intended to limit the scope, applicability, or configuration of this disclosure. Rather, the foregoing description of the embodiments will provide those skilled in the art with a description of the feasibility of implementing the embodiments of this disclosure. Various changes can be made to the function and arrangement of the elements without departing from the spirit and scope of this disclosure.

[0067] Furthermore, when the words “comprising,” “including,” “containing,” “comprising,” “containing,” “having,” and “including” are used in this specification and the appended claims, they are intended to specify the presence of the stated feature, integer, component, or step, but do not exclude the presence or addition of one or more other features, integers, components, steps, actions, or groups.

[0068] Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly or conventionally understood. As used herein, the terms “a” and “an” refer to one or more of the grammatical objects of the term (i.e., at least one). For example, “an element” refers to one or more elements. As used herein, “about” and / or “approximately”, when referring to measurable values ​​such as quantities, durations of time, etc., cover variations of ±20% or ±10%, ±5% or +0.1% compared to a specified value, as such variations are appropriate in the context of the systems, devices, circuits, methods, and other implementations described herein. As used herein, “substantially”, when referring to measurable values ​​such as quantities, durations of time, physical properties (e.g., frequency), also covers variations of ±20% or ±10%, ±5% or +0.1% compared to a specified value, as such variations are appropriate in the context of the systems, devices, circuits, methods, and other implementations described herein.

[0069] Where a range of values ​​is provided, it should be understood that, unless the context explicitly specifies otherwise, the smallest unit of each intermediate value between the upper and lower limits of the range, down to the lower limit, is also explicitly disclosed. This encompasses any narrower range between any specified or unspecified intermediate value within the specified range and any other specified or intermediate value within that specified range. The upper and lower limits of these narrower ranges may be independently included in or excluded from the range, and each range in which any limit, zero limit, or both limits are included is also covered by this technique, subject to any explicitly excluded limits within the specified range. Where the specified range includes one or both limits, it also includes ranges excluding any or both of those included limits.

[0070] As used herein, including in the claims, the use of "and" in a list of items beginning with "at least one" or "one or more" indicates that any combination of the listed items may be used. For example, a list of "at least one of A, B, and C" includes combinations of A or B or C, or AB or AC or BC, and / or any combination of ABC (i.e., A and B and C). Furthermore, where items A, B, or C may appear or be used more than once, multiple uses of A, B, and / or C may constitute part of the intended combination. For example, a list of "at least one of A, B, and C" may also include AA, AAB, AAA, BB, etc.

Claims

1. A keyboard, comprising: A top shell and a bottom shell, the top shell and the bottom shell being connected to each other to define an internal compartment, wherein the internal compartment includes a plurality of internal layers, wherein the plurality of internal layers include: A plurality of keys are mounted on a switch plate, wherein a portion of each of the plurality of keys protrudes from the top surface of the top housing; PCB layer, the PCB layer being disposed below the switch board; and A spacer layer is disposed below the PCB layer, wherein the spacer layer includes a peripheral wall and a base plate integrally formed with the peripheral wall. The switch plate is connected to the peripheral wall of the gasket layer.

2. The keyboard according to claim 1, wherein, The switch plate includes at least one leg formed along the peripheral edge of the switch plate, wherein the at least one leg of the switch plate is connected to the peripheral wall of the gasket layer.

3. The keyboard according to claim 2, wherein, The gasket layer includes at least one groove formed in the peripheral wall, and each of the at least one legs is inserted into a corresponding groove in the at least one groove.

4. The keyboard according to claim 3, wherein, The at least one groove is formed at the lower end of the peripheral wall of the gasket layer adjacent to the bottom plate of the gasket layer.

5. The keyboard according to claim 3, wherein, Each of the at least one slot further includes a suspension protrusion, and each of the at least one leg of the switch plate further includes an extension and a foot portion, wherein the suspension protrusion rests on the foot portion.

6. The keyboard according to claim 2, wherein, The gasket layer includes at least one opening formed through the peripheral wall of the gasket layer.

7. The keyboard according to claim 6, wherein, The PCB layer further includes at least one tab formed along the peripheral edge of the PCB layer, wherein each of the at least one tab passes through a corresponding opening in the at least one opening formed through the peripheral wall of the pad layer.

8. The keyboard according to claim 1, wherein, The gasket layer also includes a plurality of support pins extending upward from the top surface of the base plate, wherein the PCB layer is supported on the plurality of support pins.

9. The keyboard according to claim 1, wherein, The plurality of inner layers further include a first foam layer, wherein the first foam layer is disposed between the PCB layer and the base plate of the pad layer.

10. The keyboard according to claim 1, wherein, The plurality of inner layers also include a switch foam layer, wherein the switch foam layer is disposed between the switch board and the PCB layer.

11. The keyboard according to claim 10, wherein, The plurality of inner layers further include a second foam layer, wherein the second foam layer is disposed between the switch foam layer and the switch plate.

Images