Vapor chamber, vapor chamber manufacturing method and electronic equipment
By setting up staggered first and second flow channels inside the vapor chamber to form a heat flow network, the shortcomings of traditional vapor chambers in heat conduction and distribution are solved, achieving efficient heat conduction and uniform heat dissipation, which is suitable for high power density electronic devices.
Patent Information
- Application Number
- CN202411044880.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-31
- Publication Date
- 2026-02-03
AI Technical Summary
Traditional heat spreaders are inadequate in terms of heat conduction and distribution, making it difficult to meet the high heat dissipation requirements of modern electronic devices.
A heat exchanger is designed with an internally connected first and second flow channels that intersect in their directions to form a heat flow network. The heat transfer medium moves in both directions within the heat exchanger to improve heat transfer efficiency.
It improves heat conduction efficiency, avoids local overheating, extends the service life of electronic devices, and meets the heat dissipation requirements of high power density electronic devices.
Smart Images
Figure CN121463373A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of heat transfer, and more particularly, to a vapor chamber, a manufacturing method of the vapor chamber and an electronic device. BACKGROUND
[0002] With the increasing integration of electronic devices, the heat dissipation problem has become one of the key factors restricting the performance improvement of the electronic devices. As a kind of high-efficiency heat dissipation element, the vapor chamber is widely used in various high-power-density electronic devices. However, the traditional vapor chamber still has deficiencies in heat conduction and distribution, which is difficult to meet the high requirements of modern electronic devices on heat dissipation performance. SUMMARY
[0003] In view of the above-mentioned shortcomings of the prior art, the purpose of the present application is to provide a new type of vapor chamber, a manufacturing method of the vapor chamber and an electronic device.
[0004] According to one aspect of the present application, a vapor chamber is provided.
[0005] The vapor chamber comprises:
[0006] a housing, an accommodation cavity is formed in the housing;
[0007] a support located in the accommodation cavity, the support comprises a body portion and at least one support portion connected to the body portion, the support portion abuts against an inner wall of the housing, each support portion has a first flow channel, the body portion has a second flow channel, the first flow channel and the second flow channel are in communication, and the extension direction of the first flow channel intersects with the extension direction of the second flow channel.
[0008] Optionally, the support comprises a plurality of support portions, and the extension directions of the plurality of first flow channels are the same.
[0009] Optionally, the cross-sectional shapes of the plurality of support portions are the same.
[0010] Optionally, the cross-sectional shape of the support portion comprises at least one of a circle, a triangle, a rectangle, a cross, a streamline shape and a biomimetic shape.
[0011] Optionally, the first flow channel extends along the height direction of the vapor chamber, and the extension direction of the first flow channel is perpendicular to the extension direction of the second flow channel.
[0012] Optionally, the cross-sectional shape of the first flow channel comprises at least one of a mesh shape, a radial shape, a streamline shape and a biomimetic shape.
[0013] and / or, the cross-sectional shape of the second flow channel comprises at least one of a mesh shape, a radial shape, a streamline shape and a biomimetic shape.
[0014] Optionally, the heat spreader further comprises a liquid absorbing member, the liquid absorbing member is located in the accommodating cavity, the liquid absorbing member is arranged adjacent to the support member, and the liquid absorbing member is used for collecting the liquefied heat-conducting working medium.
[0015] Optionally, the liquid absorbing member comprises at least one of a metal wire mesh, a metal powder, a foamed metal, and a groove.
[0016] Optionally, the shell comprises a first shell and a second shell, the first shell and the second shell are sealingly connected and form the accommodating cavity, and the support portion abuts against an inner wall of the first shell.
[0017] Optionally, the heat spreader further comprises a liquid absorbing member, the liquid absorbing member is arranged between the support member and the second shell, and the liquid absorbing member is used for collecting the liquefied heat-conducting working medium.
[0018] According to another aspect of the present application, there is provided a manufacturing method of the heat spreader as described above, comprising:
[0019] manufacturing a shell, the shell has an accommodating cavity formed therein;
[0020] manufacturing a support member and connecting the support member to the accommodating cavity;
[0021] wherein the support member comprises a body portion and at least one support portion connected to the body portion, the support portion abuts against an inner wall of the shell, each of the support portions has a first flow channel, the body portion has a second flow channel, the first flow channel and the second flow channel are in communication, and an extension direction of the first flow channel intersects with an extension direction of the second flow channel.
[0022] Optionally, the first flow channel and the second flow channel are formed by an etching process.
[0023] According to still another aspect of the present application, there is provided an electronic device comprising the heat spreader as described above.
[0024] One technical effect of the embodiments of the present disclosure is that:
[0025] The heat spreader comprises a shell and a support member, the shell has an accommodating cavity formed therein; the support member is located in the accommodating cavity, the support member comprises a body portion and at least one support portion connected to the body portion, the support portion abuts against an inner wall of the shell, each of the support portions has a first flow channel, the body portion has a second flow channel, the first flow channel and the second flow channel are in communication, and an extension direction of the first flow channel intersects with an extension direction of the second flow channel.
[0026] Thus, by setting up interconnected first and second flow channels inside the support component, with their extension directions intersecting, a heat flow network can be formed. This design allows the heat-conducting working fluid to move in two directions inside the vapor chamber, enabling efficient heat conduction within the vapor chamber, thereby improving heat transfer efficiency and facilitating rapid cooling of electronic devices equipped with this vapor chamber.
[0027] Other features and advantages of the invention will become clear from the following detailed description of exemplary embodiments of the invention with reference to the accompanying drawings. Attached Figure Description
[0028] The accompanying drawings, which form part of this specification, illustrate embodiments of the invention and, together with the specification, serve to explain the principles of the invention.
[0029] Figure 1 This is an exploded view of a heat spreader according to an embodiment of this disclosure;
[0030] Figure 2 This is a cross-sectional view of a heat spreader according to an embodiment of the present disclosure;
[0031] Figure 3 This is a cross-sectional view of another heat spreader according to an embodiment of this disclosure;
[0032] Figure 4 This is a schematic diagram of a support member according to an embodiment of the present disclosure;
[0033] Figure 5 This is a schematic diagram of another support member according to an embodiment of the present disclosure;
[0034] Figure 6 This is a schematic diagram of another support member according to an embodiment of the present disclosure;
[0035] Figure 7 This is a schematic diagram of another support member according to an embodiment of the present disclosure;
[0036] Figure 8 This is a schematic diagram of another support member according to an embodiment of the present disclosure;
[0037] Figure 9 This is a schematic diagram of another support member according to an embodiment of the present disclosure.
[0038] Explanation of reference numerals in the attached figures:
[0039] 1. Shell; 11. First shell; 12. Second shell; 2. Support member; 21. Main body; 22. Supporting part; 3. Liquid suction member. Detailed Implementation
[0040] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values of the components and steps set forth in these embodiments do not limit the scope of the invention.
[0041] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the invention or its application or use.
[0042] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.
[0043] In all the examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.
[0044] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.
[0045] This invention provides a heat dissipation plate that can be applied to heat dissipation in electronic devices such as mobile phones, watches, tablets, and computers.
[0046] like Figures 1 to 3 As shown, the heat spreader provided in this embodiment of the invention includes:
[0047] Housing 1, wherein a receiving cavity is formed within the housing 1;
[0048] The support member 2 is located in the receiving cavity. The support member 2 includes a body portion 21 and at least one support portion 22 connected to the body portion 21. The support portion 22 abuts against the inner wall of the housing 1. Each support portion 22 has a first flow channel. The body portion 21 has a second flow channel. The first flow channel communicates with the second flow channel, and the extension direction of the first flow channel intersects the extension direction of the second flow channel.
[0049] Specifically, the heat spreader provided in this embodiment of the invention includes a shell 1 made of high thermal conductivity materials such as aluminum alloy and copper. Depending on the actual design, the shell 1 can be a split structure or an integral structure. The shell 1 has a closed receiving cavity with a height not exceeding 1 mm, used to accommodate the support member 2 and other heat-conducting elements. The upper and lower surfaces of the shell 1 can be provided with a thermally conductive coating or thermally conductive fins as needed to enhance heat exchange with the external environment.
[0050] like Figures 1 to 3As shown, the support member 2 may include a body portion 21 and at least one support portion 22. The body portion 21 may be in the form of a perforated plate or perforated sheet, allowing it to have a large heat capacity and heat-conducting area, thus ensuring its heat conduction capability. Depending on the actual design, the height of the body portion 21 can be adjusted to reduce the overall height of the heat spreader. A second flow channel is provided inside the body portion 21, extending along a specific direction to achieve its heat conduction effect.
[0051] The support member 2 may include one or more support portions 22, which may be evenly distributed around the body portion 21. The support portions 22 can be connected to the body portion 21 by welding, bonding, or other fixing methods. The support portions 22 have a certain degree of elasticity to ensure close contact with the inner wall of the housing 1. Furthermore, the stable connection between the body portion 21 and the support portions 22 of the support member 2 forms a stable support structure. This structure not only ensures the stability of the heat spreader during operation but also improves its resistance to vibration and impact.
[0052] The support portion 22 has a first flow channel inside, which extends along a specific direction of the support portion 22 and forms a channel that intersects with the second flow channel. That is, the first flow channel and the second flow channel are not parallel to each other, which allows the heat-conducting working fluid to move in multiple directions within the support member 2, thereby improving the heat conduction effect of the heat spreader.
[0053] Furthermore, the first flow channel inside the support section 22 is connected to the second flow channel inside the body section 21 through a connecting channel, which ensures that the heat transfer medium flows smoothly between the support section 22 and the body section 21, facilitating heat transfer. The heat transfer medium is typically water or water vapor.
[0054] like Figures 1 to 3 As shown, the first flow channel can be set to extend along the height direction of the support 22, that is, the first flow channel extends along the height direction of the heat spreader, forming a longitudinal channel. Among them, according to the actual heat conduction requirements, the first flow channel can be designed as a straight line, a broken line, a streamline, or a spiral, which can increase the heat exchange area of the heat transfer medium and extend the heat exchange path.
[0055] The second flow channel is located within the body section 21, and its extension direction intersects with the first flow channel, for example, they intersect perpendicularly or obliquely, forming a transverse or oblique channel. Considering the requirement for uniform heat distribution, the second flow channel can be designed as a mesh, honeycomb, radial, or other shapes.
[0056] like Figures 1 to 3As shown, when one side of the heat spreader is heated, heat enters the shell 1 from the side of the heat spreader, causing the nearby liquid working fluid to absorb heat and vaporize. The vaporized working fluid flows along the second flow channel inside the main body 21 and moves from the second flow channel to the first flow channel of the support 22. Finally, it liquefies in the contact area between the support 22 and the shell 1 and transfers heat to the external environment through the shell 1. The liquefied liquid working fluid returns to the heat spreader for the next cycle, thereby achieving the heat conduction effect of the heat spreader.
[0057] The vapor chamber in this invention forms a heat flow network by having a first flow channel and a second flow channel that are interconnected inside the support member 2 and whose extension directions intersect. This design allows the heat-conducting working fluid to move in two directions inside the vapor chamber, enabling efficient heat conduction within the vapor chamber and thus improving heat transfer efficiency. This facilitates rapid cooling of electronic devices equipped with the vapor chamber.
[0058] The staggered arrangement of the first and second flow channels results in a more uniform distribution of the heat-conducting working fluid within the vapor chamber. Even in high heat flux environments, the vapor chamber of this invention maintains a low temperature gradient, preventing localized overheating and thus extending the service life of electronic devices equipped with this vapor chamber.
[0059] Furthermore, the close contact between the support 22 and the inner wall of the housing 1 reduces thermal resistance while forming a reliable support, allowing heat to be transferred more smoothly from the support 2 to the outside of the housing 1. The close contact between the support 22 and the inner wall of the housing 1 also reduces gap changes caused by thermal expansion and contraction, thereby improving the reliability of the vapor chamber. The upper and lower surfaces of the housing 1 can be provided with thermally conductive coatings or heat dissipation fins as needed, further enhancing the heat exchange capacity between the vapor chamber and the external environment, thus meeting the heat dissipation requirements of high-power-density electronic devices.
[0060] Optionally, the support member 2 includes a plurality of support portions 22, and the plurality of first flow channels extend in the same direction.
[0061] like Figures 1 to 3 As shown, the support member 2 includes multiple support parts 22. The end of each support part 22 away from the main body part 21 abuts against the inner wall of the shell 1, thereby improving the support effect of the support member 2 on the shell 1 and also improving the structural stability of the heat exchange plate.
[0062] Each support section 22 has a first flow channel for the movement of the heat-conducting working fluid, thereby increasing the heat exchange area of the heat-conducting working fluid by utilizing the design of multiple first flow channels, which facilitates the improvement of its heat conduction capacity. Among them, according to the actual heat conduction requirements, multiple support sections 22 can be set up evenly distributed, or multiple support sections 22 can be set up non-uniformly arranged near the heat source.
[0063] Optionally, the cross-sectional shape of the plurality of support portions 22 is the same.
[0064] like Figures 1 to 3 As shown, the multiple support parts 22 are provided with the same cross-sectional shape. On the one hand, this facilitates the rapid prototyping of the multiple support parts 22, which reduces the processing difficulty and cost. On the other hand, the same cross-sectional shape also ensures that the thermal conductivity of the multiple support parts 22 is basically the same, which facilitates uniform heat conduction and avoids the occurrence of local overheating.
[0065] Optionally, the cross-sectional shape of the support portion 22 includes at least one of the following: circular, triangular, rectangular, cross-shaped, streamlined, and biomimetic. For example... Figures 4 to 7 As shown, the cross-sectional shape of the support part 22 can be flexibly designed according to the actual design, including but not limited to circular, elliptical, triangular, rectangular, cross-shaped, biomimetic or other shapes.
[0066] In this configuration, some support parts 22 may have the same cross-sectional shape, while others may have different cross-sectional shapes; alternatively, multiple support parts 22 may have completely different cross-sectional shapes; or multiple support parts 22 may have completely identical cross-sectional shapes.
[0067] Optionally, the first flow channel extends along the height direction of the heat spreader, and the extension direction of the first flow channel is perpendicular to the extension direction of the second flow channel.
[0068] like Figures 1 to 3 As shown, a first flow channel can be configured to extend longitudinally along the height of the vapor chamber, and a second flow channel can extend laterally along the length of the vapor chamber, forming a heat flow network. This design allows the heat-conducting medium to move in two directions within the vapor chamber, enabling uniform heat conduction within the vapor chamber, thereby improving heat transfer efficiency and facilitating rapid and uniform cooling of electronic devices equipped with this vapor chamber.
[0069] Optionally, the cross-sectional shape of the first flow channel includes at least one of mesh, radial, streamlined, and biomimetic shapes;
[0070] And / or, the cross-sectional shape of the second flow channel includes at least one of mesh, radial, streamlined and biomimetic shapes.
[0071] like Figure 8 and Figure 9 As shown, the first and second flow channels can be flexibly designed according to the actual heat conduction requirements and the location of the heat source, which can reduce the flow resistance of the heat transfer medium and increase the heat exchange area of the heat transfer medium, thereby improving the heat conduction effect of the heat spreader.
[0072] Optionally, it also includes a liquid suction member 3, which is located in the receiving cavity, is disposed adjacent to the support member 2, and is used to collect the liquefied heat-conducting working fluid.
[0073] like Figures 1 to 3 As shown, when one side of the heat spreader is heated, heat enters the housing 1 from the side of the heat spreader, causing the liquid working medium in the liquid absorber 3 to absorb heat and vaporize. The vaporized working medium flows along the second flow channel inside the main body 21 and rises from the second flow channel to the first flow channel of the support 22. Finally, it liquefies in the contact area between the support 22 and the housing 1 and transfers heat to the external environment through the housing 1. The liquefied liquid working medium returns to the liquid absorber 3 for the next cycle, thereby achieving the heat conduction effect of the heat spreader.
[0074] Optionally, the liquid-absorbing element 3 includes at least one of the following: metal wire mesh, metal powder, metal foam, and grooves. The specific structure of the liquid-absorbing element 3 can be flexibly designed according to the actual application to achieve good heat conduction.
[0075] Optionally, the housing 1 includes a first housing 11 and a second housing 12, the first housing 11 and the second housing 12 are sealed together to form the receiving cavity, and the support portion 22 abuts against the inner wall of the first housing 11.
[0076] like Figures 1 to 3 As shown, the first housing 11 and the second housing 12 can be sealed together by welding, bonding, etc., and corresponding cavities are formed inside the first housing 11 and the second housing 12. The support part 22 abuts against the inner wall of the first housing 11, for example, the support part 22 is set to abut against the inner side of the top wall of the first housing 11, so that the first flow channel in the support part 22 extends longitudinally, which can facilitate the vaporization and rise of the gaseous working fluid, and the liquid working fluid after being liquefied in the area where the support part 22 abuts against the first housing 11 can flow back to the liquid suction member 3 under the action of gravity.
[0077] Optionally, it also includes a liquid-absorbing component 3, which is disposed between the support 2 and the second housing 12, and is used to collect the liquefied heat-conducting working fluid.
[0078] like Figures 1 to 3 As shown, the liquid suction member 3 is positioned close to the second housing 12 so that the liquid working medium inside the liquid suction member 3 can cool the electronic device with the heat spreader. The heat generated by the electronic device during operation is transferred from the first housing 11 to the external environment through the second housing 1 and the support member 2.
[0079] This invention also provides a method for manufacturing the aforementioned heat spreader, comprising:
[0080] A housing 1 is fabricated, and a receiving cavity is formed inside the housing 1;
[0081] Fabricate support member 2 and connect support member 2 to the receiving cavity;
[0082] The support member 2 includes a body portion 21 and at least one support portion 22 connected to the body portion 21. The support portion 22 abuts against the inner wall of the housing 1. Each support portion 22 has a first flow channel, and the body portion 21 has a second flow channel. The first flow channel communicates with the second flow channel, and the extension direction of the first flow channel intersects with the extension direction of the second flow channel.
[0083] like Figures 1 to 3 As shown, the shell 1 is first processed, which includes a first shell 11 and a second shell 12. The first shell 11 and the second shell 12 together form the cavity required for the internal space of the steam chamber. Then, the support member 2 is processed to form a body part 21 and a support part 22. A first flow channel is formed on the support part 22, and a second flow channel is formed on the body part 21.
[0084] Next, the first housing 11, the second housing 12, the support 2, and the liquid-absorbing component 3 are degreased and derusted. Then, the liquid-absorbing component 3 and the support 2 are placed sequentially on the inner wall of the second housing 12. The first housing 11 and the second housing 12 are then assembled and sealed by welding or bonding to obtain a heat spreader. Next, the heat-conducting medium is injected into the heat spreader and a vacuum is applied to remove gas. After degassing, the heat spreader is sealed. Sealing methods include, but are not limited to, cold pressure welding, ultrasonic welding, brazing, laser welding, and adhesive sealing.
[0085] Optionally, the first flow channel and the second flow channel are formed by an etching process.
[0086] Specifically, the first and second flow channels can be flexibly designed according to the actual heat conduction requirements and the location of the heat source, which can reduce the flow resistance of the heat transfer medium and increase the heat exchange area of the heat transfer medium, thereby improving the heat conduction effect of the heat spreader.
[0087] This invention also provides an electronic device, including the aforementioned heat spreader.
[0088] The above embodiments mainly describe the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be elaborated here.
[0089] While specific embodiments of the invention have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of the invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims
1. A heat spreader, characterized in that, include: A housing (1) having a receiving cavity formed therein; A support member (2) is located in the receiving cavity. The support member (2) includes a body portion (21) and at least one support portion (22) connected to the body portion (21). The support portion (22) abuts against the inner wall of the housing (1). Each support portion (22) has a first flow channel. The body portion (21) has a second flow channel. The first flow channel communicates with the second flow channel, and the extension direction of the first flow channel intersects the extension direction of the second flow channel.
2. The temperature distribution plate according to claim 1, characterized in that, The support member (2) includes a plurality of support portions (22), and the plurality of first flow channels extend in the same direction.
3. The temperature distribution plate according to claim 2, characterized in that, The cross-sectional shape of the multiple support portions (22) is the same.
4. The temperature distribution plate according to claim 1, characterized in that, The cross-sectional shape of the support (22) includes at least one of the following: circular, triangular, rectangular, cross-shaped, streamlined, and biomimetic.
5. The temperature distribution plate according to claim 1, characterized in that, The first flow channel extends along the height direction of the heat spreader, and the extension direction of the first flow channel is perpendicular to the extension direction of the second flow channel.
6. A temperature distribution plate according to claim 1, characterized in that, The cross-sectional shape of the first flow channel includes at least one of mesh, radial, streamline, and biomimetic shapes; And / or, the cross-sectional shape of the second flow channel includes at least one of mesh, radial, streamlined and biomimetic shapes.
7. The temperature distribution plate according to claim 1, characterized in that, It also includes a liquid suction member (3), which is located in the receiving cavity. The liquid suction member (3) is arranged adjacent to the support member (2), and the liquid suction member (3) is used to collect the liquefied heat-conducting working fluid.
8. The temperature distribution plate according to claim 7, characterized in that, The liquid suction element (3) includes at least one of the following: metal wire mesh, metal powder, foam metal, and groove.
9. The temperature distribution plate according to claim 1, characterized in that, The housing (1) includes a first housing (11) and a second housing (12), the first housing (11) and the second housing (12) are sealed together to form the receiving cavity, and the support (22) abuts against the inner wall of the first housing (11).
10. The temperature distribution plate according to claim 9, characterized in that, It also includes a liquid suction member (3), which is disposed between the support member (2) and the second housing (12), and the liquid suction member (3) is used to collect the liquefied heat-conducting working fluid.
11. A method for manufacturing a heat spreader as described in any one of claims 1 to 10, characterized in that, include: A housing is fabricated, wherein a receiving cavity is formed within the housing; Fabricate a support member and connect the support member to the receiving cavity; The support member includes a body portion and at least one support portion connected to the body portion. The support portion abuts against the inner wall of the housing. Each support portion has a first flow channel, and the body portion has a second flow channel. The first flow channel communicates with the second flow channel, and the extension direction of the first flow channel intersects with the extension direction of the second flow channel.
12. The method for manufacturing a heat spreader according to claim 11, characterized in that, The first flow channel and the second flow channel are formed by an etching process.
13. An electronic device, characterized in that, Includes the temperature distribution plate as described in any one of claims 1 to 10.