Detector array structure

By combining the cross-sub photodetector unit and grating microstructure of the detector array structure with the ceramic substrate and semiconductor substrate layer, the problem of complex optical beam splitting in differential measurement of photoelectric sensors is solved, realizing efficient and reliable differential measurement and integration.

CN121463548APending Publication Date: 2026-02-03BEIJING SEMICON EQUIP INST THE 45TH RES INST OF CETC
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Patent Information

Application Number
CN202511641408.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-11-11
Publication Date
2026-02-03

AI Technical Summary

Technical Problem

In existing differential measurement schemes for photoelectric sensors, the combination of optical beam splitting and independent detection is complex, requires high processing precision, increases manufacturing costs, and suffers severe signal loss, making it difficult to meet the requirements of high integration and stable performance.

Method used

The detector array structure, including cross-arranged sub-photodetector units and grating microstructures, combined with a ceramic substrate and a semiconductor substrate layer, uses an adhesive method to fix the photodetector chip, enabling differential measurement without additional optical beam splitting.

Benefits of technology

It simplifies the design of the optical system, reduces the difficulty of integration and debugging, reduces signal transmission loss, and improves measurement efficiency, reliability and integration of differential measurement.

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Abstract

The invention provides a detector array structure which comprises a detector substrate and a photoelectric detection chip arranged on the detector substrate, and the photoelectric detection chip comprises a semiconductor substrate layer and at least one photoelectric detection unit arranged on the semiconductor substrate layer. The photoelectric detection unit comprises two sub-photoelectric detection units which are arranged in a crossed manner, each sub-photoelectric detection unit comprises a conductive electrode, a plurality of conductive leads connected with the conductive electrode and a grating microstructure connected with each conductive lead, and the grating microstructures in the two sub-photoelectric detection units are arranged in a crossed manner. According to the invention, not only can the measurement efficiency be improved, but also the reliability and integration level of differential measurement can be improved.
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