LED dispensing packaging process and LED lamp bead

Abstract

The invention discloses an LED dispensing packaging technology and an LED lamp bead, and the technology comprises the steps: determining the glue powder mass ratio and dispensing position of dispensing glue according to the total light-emitting area and the number of LED chips in an LED support which is subjected to main dispensing; a dispensing machine is used for conducting upper-layer dispensing and lower-layer dispensing on the LED chip in the LED support through glue with the determined glue powder mass proportion according to the dispensing position, and the total dispensing frequency of the upper-layer dispensing and the lower-layer dispensing is 3 times or 4 times; and the LED chip is subjected to sedimentation centrifugation after each time of dispensing, and then is subjected to curing treatment. Compared with a traditional two-time dispensing method, by means of a layered multi-time dispensing mode, on one hand, the attaching strength of the glue layer and the LED support is improved through the layered dispensing mode, on the other hand, dispensing blind areas such as the edge of a bonding pad and a chip gap can be effectively eliminated, light leakage of the lamp beads is avoided, and the light emitting performance of the LED lamp beads is improved.

Description

TECHNICAL FIELD The present application relates to the technical field of dispensing packaging, in particular to a LED dispensing packaging process and LED lamp bead. BACKGROUND LED chips are very fragile and easily affected by external environmental factors such as moisture, oxygen, dust, etc. These factors can reduce the performance and life of the chip. Dispensing packaging can form a protective film on the surface of the chip to isolate the interference of the external environment and protect the chip from damage. By selecting appropriate packaging glue and using dispensing process to accurately coat it around the chip, effective refraction and scattering of light can be achieved, reducing the total reflection of light inside the chip, thereby improving the light emitting performance of the LED lamp bead.

[0001] In the prior art, LED dispensing packaging generally adopts a two-time dispensing process, that is, first lower layer dispensing and solidification, and then upper layer dispensing to complete packaging. However, as shown in the prior art, the two-time dispensing process is limited by the flow characteristics of the glue and the dispensing path, and is prone to form dispensing blind areas in the pad edge, chip gap and other areas, resulting in the inability of the glue to cover the pad and chip, causing the lamp bead to leak light, and affecting the reliability and optical performance of the LED lamp bead. Figures 14 to 17 SUMMARY To solve the above technical problems, the present application provides a LED dispensing packaging process and LED lamp bead.

[0002] To achieve the above purpose, the present application provides a LED dispensing packaging process, comprising: According to the total light emitting area and the number of chips in the LED chip inside the LED support to be dispensed, the mass proportion of the dispensing glue powder and the dispensing position are determined; Using a dispensing machine, the determined glue powder mass proportion of the glue is dispensed on the LED chip inside the LED support according to the dispensing position, and the upper layer dispensing and the lower layer dispensing are performed on the LED chip, and the total dispensing times of the upper layer dispensing and the lower layer dispensing are 3 or 4 times; After each dispensing of the LED chip is completed, the sedimentation centrifugation is performed, and then the solidification treatment is performed.

[0003] By adopting the above technical solution, the present application determines the mass proportion of the dispensing glue powder and the dispensing position based on the total light emitting area and the number of chips of the LED chip, ensuring that the flowability, light transmittance and bonding performance of the glue are adapted to the packaging requirements of the target chip; secondly, compared with the traditional two-time dispensing method, the layered and multiple dispensing method can improve the adhesion strength of the glue layer and the LED support on the one hand, and can effectively eliminate the dispensing blind areas in the pad edge, chip gap and other areas on the other hand, avoiding the light leakage of the lamp bead and improving the optical performance of the LED lamp bead.

[0004] ​An LED dispensing packaging process as described above, when the total dispensing times is 3 times, including 1 time of upper layer dispensing and 2 times of lower layer dispensing, or 2 times of upper layer dispensing and 1 time of lower layer dispensing. When the total dispensing times is 4 times, including 1 time of upper layer dispensing and 3 times of lower layer dispensing, or 3 times of upper layer dispensing and 1 time of lower layer dispensing.

[0005] An LED dispensing packaging process as described above, the glue powder mass ratio of the dispensing glue is determined according to the total light emitting area and the number of LED chips in the LED support to be dispensed, including: When the number of chips in the LED support is 4, and the total light emitting area of LED chips is greater than 570 , the glue powder mass ratio of the dispensing glue is glue:powder = 1.4:1; When the number of chips in the LED support is 3, and the total light emitting area of LED chips is in the range of 580-1275 , the glue powder mass ratio of the dispensing glue is glue:powder = 1.1:1; When the number of chips in the LED support is 3, and the total light emitting area of LED chips is ≥1275 , the glue powder mass ratio of the dispensing glue is glue:powder = 3.5:1; When the number of chips in the LED support is 2, and the total light emitting area of LED chips is 850 , the glue powder mass ratio of the dispensing glue is glue:powder = 0.9:1.

[0006] An LED dispensing packaging process as described above, when the number of chips in the LED support is ≥2, the chip area is ≥850 , and the glue powder mass ratio is glue:powder ≤0.9:1, the total dispensing times is 4 times.

[0007] An LED dispensing packaging process as described above, the LED chip is subjected to sedimentation centrifugation after each dispensing is completed, and then subjected to solidification treatment, including: The dispensing glue is subjected to sedimentation centrifugation by using a centrifuge, the centrifugal speed of the centrifuge is 2000r / min, and the centrifugation time is 120s.

[0008] An LED dispensing packaging process as described above, the LED chip is subjected to sedimentation centrifugation after each dispensing is completed, and then subjected to solidification treatment, further including: The solidification treatment includes upper layer solidification treatment when the upper layer dispensing is performed and lower layer solidification treatment when the lower layer dispensing is performed, the upper layer solidification treatment includes first solidification at a solidification temperature of 110℃ for 1H, and then solidification at a solidification temperature of 160℃ for 4H, and the lower layer solidification treatment includes solidification at a solidification temperature of 160℃ for 25-30min.

[0009] The height range of the upper layer dispensing is 190-270 um when the LED chip is subjected to the upper layer dispensing according to the LED dispensing packaging process; The height range of the lower layer dispensing is 180-260 um when the LED chip is subjected to the lower layer dispensing.

[0010] The temperature of the dispensing machine bottom plate is 80-90 DEG C when the dispensing machine is used to perform dispensing according to the LED dispensing packaging process.

[0011] The dispensing needle head aperture of the dispensing machine is 0.6 mm when the dispensing machine performs one-time dispensing of the upper layer or the lower layer according to the LED dispensing packaging process. The dispensing needle head aperture of the dispensing machine is 0.4 mm when the dispensing machine performs two-time dispensing or three-time dispensing of the upper layer or the lower layer.

[0012] In addition, the LED lamp bead is made by the LED dispensing packaging process.

[0013] Compared with the prior art, the LED dispensing packaging process and the LED lamp bead have the following beneficial effects: 1. The LED dispensing packaging process can improve the adhesion strength of the glue layer and the LED support through the layered dispensing, and can effectively eliminate the dispensing blind area such as the pad edge and the chip gap, thereby avoiding the light leakage of the lamp bead and improving the optical performance of the LED lamp bead.

[0014] 2. The dispensing glue powder mass ratio is determined according to the total light emitting area and the chip quantity of the LED chip in the LED support to be dispensed. Since the dispensing glue powder mass ratio directly affects the light transmittance, the adhesion and the flowability of the glue, the dispensing glue powder mass ratio corresponding to different types of LED supports is determined, so that the dispensing glue can adapt to different types of LED supports, and the glue can meet the requirements of covering the pad and the LED chip, and the glue layer after solidification does not affect the light emitting performance of the LED lamp bead. BRIEF DESCRIPTION OF DRAWINGS In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced.

[0015] Figure 1 The specific flow chart of the LED dispensing packaging process is shown in the figure. Figure 2 The first structure of the LED lamp bead is shown in the figure. Figure 3A-A sectional view of Figure 2 Figure 4 A-A sectional view of Figure 2 Figure 5 A-A sectional view of Figure 6 A-A sectional view of Figure 4 Figure 7 A-A sectional view of Figure 5 Figure 8 A-A sectional view of Figure 9 A-A sectional view of Figure 6 Figure 10 A-A sectional view of Figure 8 Figure 11 A-A sectional view of Figure 12 A-A sectional view of Figure 8 Figure 13 A-A sectional view of Figure 11 Figure 14 A-A sectional view of Figure 15 A-A sectional view of Figure 16 A-A sectional view of Figure 17 A-A sectional view of

[0016] Wherein, the reference signs correspond as follows: 1, LED support; 2, LED chip; 3, glue

DETAILED DESCRIPTION

[0017] ​​​​​​​​Currently, LED dispensing packaging generally adopts twice dispensing process, that is, first dispensing and solidification are performed, and then twice dispensing is implemented to complete packaging. However, the twice dispensing process is limited by the flow characteristics of glue and dispensing path, and is prone to form dispensing blind area in the edge of the pad, the gap between the chips and other areas, which causes the glue to fail to completely cover the pad, and leads to the light leakage of the lamp bead, thereby affecting the reliability and optical performance of the LED lamp bead.

[0018] To solve the above problems, the embodiment of the present application provides a solution: according to the total light emitting area and the number of chips of the LED chips in the LED support to be dispensed, the glue powder mass ratio of the dispensing glue and the dispensing position are determined, and then the dispensing machine is used to dispense the glue with the determined glue powder mass ratio to the LED chips in the LED support according to the dispensing position, wherein the total dispensing times of the upper layer dispensing and the lower layer dispensing is 3 or 4, and finally the settling centrifugation is performed after each dispensing of the LED chips is completed, and then the solidification treatment is performed.

[0019] Through the above solution, the total light emitting area and the number of chips of the LED chips are used to determine the glue powder mass ratio and the dispensing position, which ensures that the flowability, light transmittance and bonding performance of the glue are adapted to the packaging requirements of the target chip; secondly, compared with the traditional twice dispensing method, the layered multiple dispensing method can improve the adhesion strength of the glue layer and the LED support on the one hand, and can effectively eliminate the dispensing blind area in the edge of the pad, the gap between the chips and other areas, thereby avoiding the light leakage of the lamp bead and improving the optical performance of the LED lamp bead.

[0020] Based on the above content, please refer to Figure 1 The embodiment of the present application provides an LED dispensing packaging process, which comprises steps S1-S3, wherein: S1, according to the total light emitting area and the number of chips of the LED chips in the LED support to be dispensed, the glue powder mass ratio of the dispensing glue and the dispensing position are determined.

[0021] The total light emitting area of the LED chips in the LED support determines the effective area range and the minimum dosage threshold of the pad to be covered by the glue, for example, when the total light emitting area of the LED chips is large, if the glue powder mass ratio is low (i.e. the concentration of the glue is too low), it is easy to make the glue fail to form a continuous glue layer with sufficient coverage area, which is easy to cause the exposure of the edge of the pad, the junction of the LED chip and the support; when the total light emitting area of the LED chips is small, if the glue powder mass ratio is high (i.e. the amount of glue used is too much), it is easy to cause the glue layer to be too thick, which affects the light emitting performance of the light emitting surface of the LED chip; Secondly, the number of LED chips in the LED support represents the spatial topological complexity in the support. When the number of LED chips is large, the gap between adjacent chips forms a glue flow blind area. If the mass ratio of glue powder is improper, it is easy to cause the glue to be difficult to fill the gap, so that a cavity is formed at the gap, and the pad cannot be completely covered. Similarly, when the number of LED chips is small, if the mass ratio of glue powder is improper, the glue is easy to accumulate locally due to too strong flowability, so that the thickness of the glue layer on the pad is uneven, and the risk of light leakage of the lamp bead is increased.

[0022] In this embodiment, since the mass ratio of glue powder of the glue directly affects the light transmittance, adhesion and flowability of the glue, the application determines the mass ratio of glue powder of the glue for LED supports with different total light emitting areas and numbers of LED chips, so that the glue can adapt to different types of LED supports, and ensure that the glue can meet the needs of covering the pads and LED lamp beads, and also ensure that the glue does not affect the light emitting performance of the LED lamp beads after solidifying into a glue layer.

[0023] S2, using a glue dispenser, according to the glue dispensing position, the glue with the determined mass ratio of glue powder is used to perform upper layer glue dispensing and lower layer glue dispensing on the LED chips in the LED support respectively.

[0024] The total glue dispensing times of the upper layer glue dispensing and the lower layer glue dispensing are 3 or 4.

[0025] Specifically, the lower layer glue dispensing refers to the electrical connection between the bottom of the LED support and the LED chip and the conductive pad (such as the pad pin, the chip soldering pin, etc.), and the upper layer glue dispensing refers to the remaining space of the LED support lamp bead bowl cup after the lower layer glue dispensing.

[0026] It is worth noting that when the total glue dispensing times are 3, the upper layer glue dispensing is preferably 1 time and the lower layer glue dispensing is preferably 2 times. In some models of LED supports, the upper layer glue dispensing can also be 2 times and the lower layer glue dispensing can also be 1 time. When the total glue dispensing times are 4, the upper layer glue dispensing is preferably 1 time and the lower layer glue dispensing is preferably 3 times. In some models of LED supports, the upper layer glue dispensing can also be 3 times and the lower layer glue dispensing can also be 1 time, or the upper layer glue dispensing can also be 2 times and the lower layer glue dispensing can also be 2 times.

[0027] In this embodiment, by means of layered and multiple glue dispensing of the LED chips in the LED support, compared with the traditional two-time glue dispensing method, the glue dispensing blind area such as the pad edge and the chip gap can be effectively eliminated, and light leakage of the lamp bead can be avoided.

[0028] S3, after each glue dispensing of the LED chip is completed, the LED chip is subjected to sedimentation centrifugation and solidification treatment.

[0029] The above sedimentation centrifugation refers to that after dispensing, a directional force is applied by a centrifuge to generate a radial pressure on the glue just coated on the LED chip or the LED support, to drive the glue to overcome the surface tension and fill the gap between the adjacent LED chips or the LED chip and the LED support, so as to eliminate the gap cavity. In addition, the glue is easy to wrap small bubbles during dispensing, and when the sedimentation centrifugation is performed, the bubbles move quickly to the surface of the glue layer under the centrifugal force due to the density much lower than that of the glue, and finally escape from the glue layer, so as to ensure the density of the glue layer. In addition, the above curing treatment refers to that after the sedimentation centrifugation is completed, the glue is cured by heat to cause cross-linking polymerization reaction, so that the glue layer is permanently shaped.

[0030] In the embodiment, the sedimentation centrifugation is performed in time after each dispensing, so that the glue can fill the gap and avoid the formation of the gap cavity, which leads to the light leakage between the lamp beads. The bubbles in the glue are also discharged by the sedimentation centrifugation, so as to avoid the shielding of the light emission of the LED chip or the influence on the density of the glue layer. At the same time, after the sedimentation centrifugation, the curing treatment is performed to cause the cross-linking polymerization reaction of the glue, so as to drive the uniform distribution of the phosphor and activate the light transmission and the aging resistance of the glue layer, so as to ensure the stability of the long-term light emission performance of the LED lamp bead. In the curing process, the glue layer is permanently shaped, and is completely fixed in the gap and on the surface of the LED chip, so as to improve the reliability and stability of the glue layer structure.

[0031] Optionally, in step S1, the step of determining the mass ratio of the glue powder of the dispensing glue according to the total light emission area and the number of the LED chips in the LED support to be dispensed is specifically: When the number of the chips in the LED support is 4, the total light emission area of the LED chips is greater than 570 , the mass ratio of the glue powder of the dispensing glue is glue: powder = 1.4:1; When the number of the chips in the LED support is 3, the total light emission area of the LED chips is in the range of 580-1275 , the mass ratio of the glue powder of the dispensing glue is glue: powder = 1.1:1; When the number of the chips in the LED support is 3, the total light emission area of the LED chips is greater than or equal to 1275 , the mass ratio of the glue powder of the dispensing glue is glue: powder = 3.5:1; When the number of the chips in the LED support is 2, the total light emission area of the LED chips is 850 , the mass ratio of the glue powder of the dispensing glue is glue: powder = 0.9:1.

[0032] In the embodiment, since the mass ratio of glue powder directly affects the light transmittance, adhesion and fluidity of the glue, and the number of LED chips in the common LED support is usually 2-4, the application determines the corresponding mass ratio of glue powder of the glue dispensing for the common LED support specifications, so that the dispensing glue can adapt to different types of LED supports, and ensure that the glue can meet the needs of covering the pads and LED chips, and the cured glue layer does not affect the light emitting performance of the LED lamp bead.

[0033] It should be noted that when the number of chips in the LED support is ≥2, the chip area is ≥850 and the mass ratio of glue powder is glue: powder ≤0.9:1, the total dispensing frequency of the upper dispensing and the lower dispensing is 4 times.

[0034] Optionally, in step S3, after each dispensing of the LED chip is completed, the settling centrifugation is performed, and then the curing treatment is performed. After the dispensing is completed, the settling centrifugation can be performed on the dispensing glue by using a centrifuge.

[0035] Preferably, when the settling centrifugation is performed by the centrifuge, the centrifugal speed is 2000r / min, and the centrifugal time is 120s.

[0036] Optionally, in step S3, after each dispensing of the LED chip is completed, the settling centrifugation is performed, and then the curing treatment is performed. When the curing treatment is performed, it includes the upper curing treatment for the upper dispensing and the lower curing treatment for the lower dispensing.

[0037] Specifically, when the upper curing treatment is performed, the curing temperature is first 110℃ for 1H, and then the curing temperature is 160℃ for 4H. When the lower curing treatment is performed, the curing temperature is 160℃ for 25-30min.

[0038] In the embodiment, the upper glue layer of the LED support is the outer protective layer of the LED lamp bead, which mainly functions to seal the chip edge and isolate the moisture / dust in the external environment from entering the support interior to affect the light emitting performance of the LED lamp bead. When the upper glue layer is cured, the pre-curing at 110℃ is first performed, and then the curing at 160℃ is performed. Through the step-by-step curing, the hardness and sealing property of the glue layer are improved, and the cracks caused by the uneven shrinkage rate of the glue layer during the direct high-temperature curing of the upper glue layer are avoided. Secondly, the main purpose of the lower glue layer of the LED support is to fill the small gap between the LED chip and the LED support, protect the silver-plated functional area from corrosion, and directly contact the chip electrode and the light emitting surface to excite the fluorescent powder, so that the curing and shaping are quickly performed to prevent the chip from shifting.

[0039] Optionally, when using a dispensing machine, the temperature of the dispensing machine's base plate is 80℃~90℃.

[0040] Optionally, when the dispensing machine performs one dispensing operation on the upper or lower layer, the dispensing needle orifice diameter is 0.6mm; when the dispensing machine performs two or three dispensing operations on the upper or lower layer, the dispensing needle orifice diameter is 0.4mm.

[0041] It should be noted that when the above-mentioned dispensing machine performs one dispensing operation, it means that the dispensing machine performs one dispensing operation on the upper layer or one dispensing operation on the lower layer; when the above-mentioned dispensing machine performs two or three dispensing operations, it means that the dispensing machine performs two or three dispensing operations on the upper layer or two or three dispensing operations on the lower layer.

[0042] In this embodiment, when applying adhesive to the upper or lower layer in one application, a dispensing needle with an aperture of 0.6 mm is used because a single layer coverage needs to be completed in one application. If a small aperture (0.4 mm) is used, the adhesive powder ratio is too small, the powder concentration is too high, and the adhesive flow is poor, resulting in blind spots and failure to completely cover the pads, causing light leakage from the LEDs. However, when applying adhesive in multiple applications, the coverage position is optimized and extended enough to cover the pads, and the amount of adhesive dispensed at one time is small, which allows for precise dispensing to intermittent or corner blind spots. Therefore, a dispensing needle with an aperture of 0.4 mm is used.

[0043] It is worth noting that the dispensing machine is equipped with dispensing needles of various aperture sizes, and the ability to automatically switch the dispensing needle of the corresponding aperture size according to the needs during dispensing is a conventional technology. Therefore, this manual will not elaborate on the specific structure and method of how the dispensing machine switches dispensing needles.

[0044] Optionally, when applying upper layer adhesive to the LED chip, the height range of the upper layer adhesive application is 190–270 μm; when applying lower layer adhesive to the LED chip, the height range of the lower layer adhesive application is 180–260 μm.

[0045] Please refer to Figures 2 to 13 As shown in the figure, an embodiment of the present invention also proposes an LED lamp bead, which is manufactured by dispensing and encapsulating the LED lamp bead using the above-mentioned LED dispensing and encapsulation process.

[0046] It is worth noting that since the LED beads of the present invention are made by dispensing and encapsulating using the above-mentioned LED dispensing and encapsulation process, the embodiments of the LED beads of the present invention include all the technical solutions of all the embodiments of the above-mentioned LED dispensing and encapsulation process, and the technical effects achieved are exactly the same, so they will not be repeated here.

[0047] The person skilled in the art should also understand that the above description is an embodiment provided in combination with specific content, and does not mean that the specific implementation of the application is limited to these descriptions, and is not limited to the above naming and English naming due to different industry naming. Any method, structure, etc. similar to or similar to the application, or any technical deduction or replacement under the premise of the application concept, should be considered as the protection scope of the application.

Claims

1. An LED dispensing and encapsulation process, characterized in that, include: Based on the total light-emitting area and number of LED chips in the LED bracket to be glued, determine the mass ratio of glue powder and the glue dispensing location. Using a dispensing machine, according to the dispensing location, glue with a determined mass ratio of glue powder is applied to the upper and lower layers of the LED chip inside the LED bracket, respectively. The total number of dispensing operations for the upper and lower layers is 3 or 4. After each dispensing of adhesive, the LED chip undergoes sedimentation and centrifugation before being cured.

2. The LED dispensing and encapsulation process according to claim 1, characterized in that, When the total number of dispensing times is 3, it includes 1 dispensing of the upper layer and 2 dispensings of the lower layer, or 2 dispensings of the upper layer and 1 dispensing of the lower layer. When the total number of dispensing operations is 4, it includes 1 dispensing operation on the upper layer and 3 dispensing operations on the lower layer, or 3 dispensing operations on the upper layer and 1 dispensing operation on the lower layer.

3. The LED dispensing and encapsulation process according to claim 2, characterized in that, The determination of the adhesive powder mass ratio based on the total light-emitting area and number of LED chips within the LED bracket to be adhesiveed includes: When the number of chips in the LED bracket is 4, the total luminous area of ​​the LED chips is greater than 570. When applying the adhesive, the mass ratio of adhesive powder to glue is 1.4:

1. When the number of chips in the LED bracket is 3, the total luminous area of ​​the LED chips is between 580 and 1275. When the range is defined, the mass ratio of adhesive powder to glue in the dispensing solution is glue:powder = 1.1:1; When the number of chips in the LED bracket is 3, the total luminous area of ​​the LED chips is ≥1275. When applying the adhesive, the mass ratio of adhesive powder to glue is 3.5:

1. When there are 2 chips in the LED bracket, the total luminous area of ​​the LED chips is 850. When applying the adhesive, the mass ratio of adhesive powder to glue is 0.9:

1.

4. The LED dispensing and encapsulation process according to claim 3, characterized in that, When the number of chips in the LED bracket is ≥2 and the chip area is ≥850 When the mass ratio of adhesive powder to powder is ≤0.9:1, the total number of dispensing times is 4.

5. The LED dispensing and encapsulation process according to claim 1, characterized in that, After each dispensing of adhesive, the LED chip undergoes sedimentation and centrifugation, followed by curing, including: The dispensing adhesive was subjected to sedimentation centrifugation using a centrifuge with a centrifugation speed of 2000 r / min and a centrifugation time of 120 s.

6. The LED dispensing and encapsulation process according to claim 1, characterized in that, The LED chip undergoes sedimentation and centrifugation after each dispensing process, followed by curing. The process also includes: The curing process includes an upper layer curing process during upper layer dispensing and a lower layer curing process during lower layer dispensing. The upper layer curing process includes curing at 110°C for 1 hour and then curing at 160°C for 4 hours. The lower layer curing process includes curing at 160°C for 25-30 minutes.

7. The LED dispensing and encapsulation process according to claim 1, characterized in that, When applying top-layer adhesive to LED chips, the height range of the top-layer adhesive application is 190–270 μm. When applying adhesive to the LED chip, the height range of the adhesive application is 180–260 μm.

8. The LED dispensing and encapsulation process according to claim 1, characterized in that, When using a dispensing machine, the temperature of the dispensing machine's base plate should be 80℃~90℃.

9. The LED dispensing and encapsulation process according to claim 1, characterized in that, When the dispensing machine performs one dispensing operation on the upper or lower layer, the dispensing needle orifice diameter of the dispensing machine is 0.6mm. When the dispensing machine performs two or three dispensing passes on the upper or lower layer, the dispensing needle orifice diameter of the dispensing machine is 0.4mm.

10. An LED lamp bead, characterized in that, The LED beads are manufactured by dispensing and encapsulating using the LED dispensing and encapsulation process described in any one of claims 1 to 9.

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