Wafer activation method and device

Abstract

The invention discloses a wafer activation method and device. The method comprises the following steps: in a target wafer processing process, identifying a film growing process type performed on a target wafer to obtain a process identification result of the target wafer; when it is determined that the target wafer needs to be subjected to the specific activation process, when it is determined that a removable film identifier or a non-removable film identifier exists on the surface of the target wafer according to the process identification result, alarm information is generated to prompt the target wafer to execute cleaning operation; when it is determined that the surface of the target wafer does not have the removable film identifier or the non-removable film identifier according to the process identifier result, obtaining the process capability of the machine; and when the machine process capability is the long carbon film process, executing an activation process on the target wafer. According to the invention, the technical problem that the quality of the activation process is affected due to the fact that a specific type of residual film exists on the surface of the wafer when the wafer is subjected to some long carbon film processes in the prior art is solved.

Description

Technical Field

[0001] This invention relates to the field of automated production technology, and more specifically, to a wafer activation method and apparatus. Background Technology

[0002] In modern semiconductor manufacturing processes, wafer surface condition management is crucial for improving chip yield and performance. Wafer fabrication involves complex physical and chemical processes, including deposition, photolithography, etching, cleaning, and activation. Activation is a critical thermal treatment step used to alter the activity of dopants within or on the wafer's surface, thereby affecting the electrical performance of semiconductor devices. However, if residual organic matter, metal layers, or other types of thin films remain on the wafer surface before activation, it will significantly impact film quality, leading to equipment contamination, decreased wafer electrical performance, and even product scrap. This not only increases production costs but may also affect subsequent batches due to equipment contamination, further reducing overall yield.

[0003] The following problems exist in the current wafer manufacturing process: 1) Film residue: In wafer long film processes, such as oxidation, nitriding, and polysilicon deposition, specific types of thin films are deposited on the wafer surface. If these films are not needed in subsequent processes but cannot be completely removed due to the limitations of the cleaning process, it will adversely affect the activation process. 2) Limitations of cleaning effect: Although the cleaning process can effectively remove some films, such as oxide films and phosphosilicate glass, the cleaning effect is limited for some more difficult-to-remove films, such as polysilicon, silicon nitride, and phosphosilicate glass. This requires that before a specific process, it is necessary to know what type of film has been deposited on the wafer to determine whether additional processing steps are needed. 3) Process interruption and wafer scrap: If there are unwanted films remaining on the surface of the wafer before it enters the activation machine, it will lead to film defects, equipment contamination, and abnormal electrical performance. It may even lead to the scrapping of an entire batch of wafers due to irreversible process interruption, causing significant economic losses. 4) Challenges in System Control and Identification: In highly automated semiconductor factories, the MES system is the core of controlling and managing the wafer processing flow. Accurately recording and identifying the wafer's film layer state within the MES system, and designing reasonable process control logic to ensure the wafer reaches the required state before critical processes, is a significant technical challenge.

[0004] While current semiconductor manufacturing processes utilize Manufacturing Execution Systems (MES) to record and control wafer processing status, they still fall short in identifying and controlling the state of wafer film layers. This is primarily manifested in the following ways: 1) Incomplete process identification: Existing MES systems may not fully consider the complexity of wafer film growth processes, leading to inaccurate identification of film layer types on the wafer and impacting subsequent process decisions. 2) Challenges in batching and splitting: When batching or splitting wafers, existing systems may not be able to effectively determine and update the long-film identification status of the wafers, increasing the difficulty of process control. 3) Limitations of cleaning processes: MES systems may not be fully integrated with the characteristics of cleaning processes, resulting in inaccurate updates to the wafer film layer state after cleaning, affecting subsequent wafer processing. Currently, no effective solutions have been proposed to address these issues. Summary of the Invention

[0005] This invention provides a wafer activation method and apparatus to at least solve the technical problem in the related art where, when a wafer undergoes certain long carbon film processes, a specific type of residual film exists on the wafer surface, affecting the quality of the activation process.

[0006] According to one aspect of the present invention, a wafer activation method is provided, comprising: during the processing of a target wafer, identifying the type of long film process performed on the target wafer to obtain a process identification result of the target wafer; when it is determined that the target wafer needs to undergo a specific activation process, and when it is determined, based on the process identification result, that there is a removable film mark or a non-removable film mark on the surface of the target wafer, generating an alarm message to prompt the target wafer to perform a cleaning operation, wherein the specific activation process is an activation process performed on a wafer that does not have the removable film mark or the non-removable film mark; when it is determined, based on the process identification result, that there is no removable film mark or a non-removable film mark on the surface of the target wafer and the wafer mark of the target wafer is not a non-product wafer, or the wafer mark is a non-product wafer, obtaining the machine process capability; and when the machine process capability is a long carbon film process, performing the activation process on the target wafer.

[0007] Optionally, the process identification result of the target wafer is obtained by identifying the type of long film process that has been performed on the target wafer, including: obtaining the long film process type; automatically identifying whether the target wafer has the removable film identification or the non-removable film identification according to the long film process type, and obtaining the process identification result of the target wafer.

[0008] Optionally, determining that the target wafer needs to undergo a specific activation process includes: when a dispatch event is detected, capturing the machine process capability of the target site where the target wafer is currently located; obtaining the operation type corresponding to the machine process capability; and determining that the target wafer needs to undergo the specific activation process when the attribute of the operation type is an activation attribute.

[0009] Optionally, after determining whether a removable or non-removable film mark exists on the surface of the target wafer based on the process identification result, and generating an alarm message to prompt the target wafer to perform a cleaning operation, the wafer activation method further includes: upon detecting a dispatch event, capturing the process recipe parameters of the target site where the target wafer is currently located; and when the process recipe parameters have the ability to remove thin film layers, performing the cleaning operation on the target wafer when the removable film mark exists on the surface of the target wafer.

[0010] Optionally, after determining whether a removable or non-removable film mark exists on the surface of the target wafer based on the process identification result, and generating an alarm message to prompt the target wafer to perform a cleaning operation, the wafer activation method further includes: upon detecting a dispatch event, capturing the process recipe parameters of the target site where the target wafer is currently located; if the attribute of the process recipe parameters is that it does not have the ability to remove thin film layers, capturing the machine process capability of the target site where the target wafer is currently located; obtaining the operation type corresponding to the machine process capability; if the attribute of the operation type is removable, and if a carbon film mark is detected on the surface of the target wafer, performing the cleaning operation on the target wafer.

[0011] Optionally, after performing a cleaning operation on the target wafer, the wafer activation method further includes: performing a film identification update operation on the target wafer according to the cleaning parameters of the cleaning process of the target wafer, so as to update the film identification of the target wafer.

[0012] Optionally, the wafer activation method further includes: obtaining attribute values ​​of all batches of the target wafers that need to be merged; and merging all batches of the target wafers when the attribute values ​​indicate whether all batches of the target wafers have carbon film markings or do not have carbon film markings.

[0013] Optionally, after batching the target wafers in all batches, the wafer activation method further includes: modifying the batch attribute values ​​of the parent batch of the target wafers to the union of the attribute values ​​of all batches.

[0014] According to another aspect of the present invention, a wafer activation apparatus is also provided, comprising: an identification unit, configured to identify the type of long film process performed on the target wafer during the target wafer processing, thereby obtaining a process identification result of the target wafer; a first determination unit, configured to generate an alarm message to prompt the target wafer to perform a cleaning operation when it is determined that the target wafer needs to undergo a specific activation process, based on the process identification result, whether a removable film mark or a non-removable film mark exists on the surface of the target wafer; wherein the specific activation process is an activation process performed on a wafer that does not have the removable film mark or the non-removable film mark; a second determination unit, configured to obtain the machine process capability when it is determined based on the process identification result that the surface of the target wafer does not have a removable film mark or a non-removable film mark; and an activation unit, configured to perform the activation process on the target wafer when the machine process capability is a long carbon film process and the wafer mark of the target wafer is not a non-product wafer, or the wafer mark is a non-product wafer.

[0015] Optionally, the identification unit includes: a first acquisition module for acquiring the long film process type; and an identification module for automatically identifying whether the target wafer has the removable film identification or the non-removable film identification according to the long film process type, thereby obtaining the process identification result of the target wafer.

[0016] Optionally, the first determining unit includes: a capturing module, used to capture the machine process capability of the target site where the target wafer is currently located when a dispatch event is detected; a second obtaining module, used to obtain the operation type corresponding to the machine process capability; and a first determining module, used to determine that the target wafer needs to perform the specific activation process when the attribute of the operation type is an activation attribute.

[0017] Optionally, the wafer activation device further includes: a first grasping unit, configured to generate an alarm message when it is determined, based on the process identification result, that there is a removable film mark or a non-removable film mark on the surface of the target wafer, to prompt the target wafer to perform a cleaning operation, and upon detecting a dispatch event, to grasp the process recipe parameters of the target site where the target wafer is currently located; and a first cleaning unit, configured to perform the cleaning operation on the target wafer when the process recipe parameters have the ability to remove thin film layers and when there is a removable film mark on the surface of the target wafer.

[0018] Optionally, the wafer activation device further includes: a second grasping unit, configured to generate an alarm message when the surface of the target wafer is determined to have a removable or non-removable film mark based on the process identification result, to prompt the target wafer to perform a cleaning operation, and upon detecting a dispatch event, to grasp the process recipe parameters of the target site where the target wafer is currently located; a third grasping unit, configured to grasp the machine process capability of the target site where the target wafer is currently located when the attribute of the process recipe parameters is that it does not have the ability to remove the thin film layer; a first acquisition unit, configured to acquire the operation type corresponding to the machine process capability; and a second cleaning unit, configured to perform the cleaning operation on the target wafer when the attribute of the operation type is removable and a carbon film mark is detected on the surface of the target wafer.

[0019] Optionally, the wafer activation device further includes: an update unit, configured to perform a film identification update operation on the target wafer according to the cleaning parameters of the cleaning process of the target wafer after performing a cleaning operation on the target wafer, so as to update the film identification of the target wafer.

[0020] Optionally, the wafer activation device further includes: a second acquisition unit, configured to acquire attribute values ​​of all batches of the target wafers that need to be batched; and a batching unit, configured to batch all batches of the target wafers when the attribute values ​​indicate whether all batches of the target wafers have carbon film markings or do not have carbon film markings.

[0021] Optionally, the wafer activation device further includes: a modification unit, configured to modify the batch attribute value of the parent batch of the target wafer to the union of the attribute values ​​of all batches after batching all batches of the target wafer.

[0022] According to another aspect of the present invention, a computer-readable storage medium is also provided, the computer-readable storage medium comprising a stored program, wherein the program executes the wafer activation method described in any one of the foregoing embodiments.

[0023] According to another aspect of the present invention, a processor is also provided, the processor being configured to run a program, wherein the program, when running, performs the wafer activation method described in any one of the foregoing embodiments.

[0024] According to another aspect of the present invention, a computer program product is also provided, including computer instructions. According to another aspect of the present invention, the computer instructions are also provided to perform the wafer activation method described in any one of the above embodiments when executed by a processor.

[0025] In this embodiment of the invention, during the processing of the target wafer, the type of long film process performed on the target wafer is identified to obtain the process identification result of the target wafer; when it is determined that the target wafer needs to undergo a specific activation process, if it is determined according to the process identification result that there is a removable film mark or a non-removable film mark on the surface of the target wafer, an alarm message is generated to prompt the target wafer to perform a cleaning operation. The specific activation process is an activation process performed on wafers that do not have a removable film mark or a non-removable film mark; when it is determined according to the process identification result that there is no removable film mark or a non-removable film mark on the surface of the target wafer, the machine process capability is obtained; when the machine process capability is a long carbon film process and the wafer mark of the target wafer is not a non-product wafer, or the wafer mark is a non-product wafer, the activation process is performed on the target wafer. The technical solution provided by this invention realizes intelligent management and control of film layer status using a MES system. Through automatic identification, status checking and capability matching, it ensures that the wafer reaches the optimal state before entering the activation process, thereby avoiding film layer residue problems, reducing the risk of wafer scrapping, and solving the technical problem in related technologies that when wafers undergo certain long carbon film processes, specific types of residual films will exist on the wafer surface, affecting the quality of the activation process. Attached Figure Description

[0026] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this application, illustrate exemplary embodiments of the invention and, together with their description, serve to explain the invention and do not constitute an undue limitation thereof. In the drawings:

[0027] Figure 1 This is a hardware structure block diagram of a mobile terminal for a wafer activation method according to an embodiment of the present invention.

[0028] Figure 2 This is a flowchart of a wafer activation method according to an embodiment of the present invention;

[0029] Figure 3 This is a flowchart of the activation process according to an embodiment of the present invention;

[0030] Figure 4 This is a flowchart of the long film process according to an embodiment of the present invention;

[0031] Figure 5 This is a flowchart of the cleaning process according to an embodiment of the present invention;

[0032] Figure 6 This is a flowchart illustrating the process of batching involving long film marking according to an embodiment of the present invention;

[0033] Figure 7 This is a schematic diagram of a wafer activation apparatus according to an embodiment of the present invention.

[0034] The above figures include the following reference numerals:

[0035] 102. Processor; 104. Memory; 106. Transmission device; 108. Input / output device. Detailed Implementation

[0036] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0037] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0038] As described in the background section, in related technologies, when wafers undergo certain long carbon film processes, specific types of residual films may exist on the wafer surface, affecting the quality of the activation process. Embodiments of this invention provide a wafer activation method and apparatus, a computer-readable storage medium, a processor, and a computer program product.

[0039] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

[0040] The methods and embodiments provided in this invention can be executed on a mobile terminal, a computer terminal, or a similar computing device. Taking running on a mobile terminal as an example, Figure 1 This is a hardware structure block diagram of a mobile terminal using a wafer activation method according to an embodiment of the present invention. Figure 1 As shown, a mobile terminal may include one or more ( Figure 1Only one is shown in the diagram. A processor 102 (which may include, but is not limited to, a microprocessor MCU or a programmable logic device FPGA, etc.) and a memory 104 for storing data are also shown. The mobile terminal may further include a transmission device 106 for communication functions and an input / output device 108. Those skilled in the art will understand that... Figure 1 The structure shown is for illustrative purposes only and does not limit the structure of the mobile terminal described above. For example, the mobile terminal may also include components that are more... Figure 1 The more or fewer components shown, or having the same Figure 1 The different configurations shown.

[0041] The memory 104 can be used to store computer programs, such as application software programs and modules, like the computer program corresponding to the wafer activation method in this embodiment of the invention. The processor 102 executes various functional applications and data processing by running the computer program stored in the memory 104, thereby implementing the above-described method. The memory 104 may include high-speed random access memory and may also include non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some instances, the memory 104 may further include memory remotely located relative to the processor 102, and these remote memories can be connected to the mobile terminal via a network. Examples of the aforementioned networks include, but are not limited to, the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof. The transmission device 106 is used to receive or send data via a network. Specific examples of the aforementioned networks may include wireless networks provided by the mobile terminal's communication provider. In one example, the transmission device 106 includes a network interface controller (NIC), which can be connected to other network devices via a base station to communicate with the Internet. In one example, the transmission device 106 may be a radio frequency (RF) module, which is used to communicate with the Internet wirelessly.

[0042] Example 1

[0043] According to an embodiment of the present invention, a method embodiment of a wafer activation method is provided. It should be noted that the steps shown in the flowchart in the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions. Furthermore, although a logical order is shown in the flowchart, in some cases, the steps shown or described may be executed in a different order than that shown here.

[0044] Figure 2 This is a flowchart of a wafer activation method according to an embodiment of the present invention, such as... Figure 2 As shown, the wafer activation method includes the following steps:

[0045] Step S202: During the target wafer processing, the type of long film process performed on the target wafer is identified to obtain the process identification result of the target wafer.

[0046] In the wafer fabrication process, whenever a wafer undergoes a film-lengthening process (such as oxidation, nitriding, deposition, etc.), the MES system automatically reads the type of the process and adds a specific film identifier to the wafer based on the different film-lengthening processes, such as "Removable" or "UnRemovable". This step is achieved through real-time interaction with the process database via a programming interface.

[0047] The properties of the surface film are determined based on the type of wafer process. Different types of films have different effects on subsequent processes, so they need to be classified and labeled according to the removability of different films.

[0048] Through automatic labeling, the MES system can clearly record the film layer status of each wafer, providing reliable data support for subsequent process decisions and avoiding process errors caused by manual recording mistakes or omissions.

[0049] Step S204: When it is determined that the target wafer needs to undergo a specific activation process, if the surface of the target wafer has a removable film mark or a non-removable film mark based on the process identification result, an alarm message is generated to prompt the target wafer to perform a cleaning operation. The specific activation process is an activation process performed on wafers that do not have a removable film mark or a non-removable film mark.

[0050] In this embodiment, when the system detects a dispatch event indicating that a wafer needs to undergo a specific activation process, it automatically extracts the current film marking result of the wafer. If the wafer's marking result shows that its surface has removable or non-removable film markings, the system prohibits dispatching the wafer to the activation machine and triggers an alarm mechanism to remind the operator or the system to perform the cleaning process.

[0051] Because certain activation processes often require a clean wafer surface free of any residual film, as residual film can affect activation effectiveness and lead to a decline in product quality, pre-inspection of film markings allows for the timely detection and resolution of problems before the wafer enters critical steps.

[0052] This step effectively prevents improperly cleaned wafers from entering the activation process, significantly reducing wafer scrap rates and equipment contamination risks caused by film residues, and improving overall production yield and equipment stability.

[0053] Step S206: When the process identification results determine that there are no removable or non-removable film markings on the surface of the target wafer, the machine process capability is obtained.

[0054] In this embodiment of the invention, the system only checks the capability of the currently activated equipment when the wafer's film marking results show that there are no removable or non-removable film markings on its surface. Only after confirming that the equipment has the capability to process the wafer to the required state, particularly for equipment capable of performing long carbon film processes, can the wafer be assigned a job to perform a specific activation process.

[0055] By cross-validating the capabilities of the MES system and equipment, the compatibility between the wafer and the upcoming activation process is ensured, avoiding adverse consequences caused by insufficient equipment performance or incompatible wafer conditions.

[0056] This step further ensures the success rate of the wafer activation process, reduces production waste caused by equipment or wafer mismatch, and improves the efficiency and product quality of the semiconductor production line.

[0057] Step S208: When the machine's process capability is long carbon film process and the target wafer's wafer identifier is not a non-product wafer, or the wafer identifier is a non-product wafer, perform an activation process on the target wafer.

[0058] In this embodiment, it can be further determined whether the target wafer is an NPW (Non-Product Wafer). When the target wafer is not an NPW, the activation process can be performed if it is determined that there is a carbon film on its surface. Conversely, when the target wafer is an NPW, the activation process can be performed without determining whether there is a carbon film on its surface.

[0059] As described above, in this embodiment of the invention, during the processing of the target wafer, the type of long film process performed on the target wafer is identified to obtain the process identification result of the target wafer. When it is determined that the target wafer needs to undergo a specific activation process, an alarm message is generated when it is determined, based on the process identification result, that there is a removable or non-removable film mark on the surface of the target wafer, to prompt the target wafer to perform a cleaning operation. The specific activation process is an activation process performed on wafers that do not have a removable or non-removable film mark. When it is determined, based on the process identification result, that there is no removable or non-removable film mark on the surface of the target wafer, the machine process capability is obtained. When the machine process capability is a long carbon film process and the wafer identification of the target wafer is not a non-product wafer, or the wafer identification is a non-product wafer, the activation process is performed on the target wafer. This realizes intelligent management and control of the film layer status using the MES system. Through automatic identification, status checking, and capability matching, it ensures that the wafer reaches the optimal state before entering the activation process, thereby avoiding film layer residue problems and reducing the risk of wafer scrap.

[0060] Furthermore, the above method integrates information management and physical process control. Through precise data recording and analysis, it enables real-time monitoring and rational allocation of wafer surface conditions, ensuring that each process step can be carried out under optimal conditions. Ultimately, this improves the yield and efficiency of chip manufacturing and reduces production costs.

[0061] Therefore, the technical solutions provided by the embodiments of the present invention solve the technical problem in the related art that when wafers undergo certain long carbon film processes, there will be specific types of residual films on the wafer surface, which affect the quality of the activation process.

[0062] According to the above embodiments of the present invention, the process identification result of the target wafer is obtained by identifying the type of long film process performed on the target wafer, including: obtaining the long film process type; automatically identifying whether the target wafer has a removable film identification or a non-removable film identification according to the long film process type, and obtaining the process identification result of the target wafer.

[0063] In this embodiment, the system can automatically identify the wafer status according to the type of long film process, which helps to accurately control subsequent wafer processes. The technical effect is reflected in improving the intelligence level of the MES system, making process control more refined.

[0064] According to the above embodiments of the present invention, determining that a target wafer needs to undergo a specific activation process includes: when a dispatch event is detected, capturing the machine process capability of the target site where the target wafer is currently located; obtaining the operation type corresponding to the machine process capability; and determining that the target wafer needs to undergo a specific activation process when the operation type attribute is the activation attribute.

[0065] Through system monitoring and decision-making, process scheduling errors caused by human mistakes are avoided. The technical effect is to enhance the safety and reliability of the wafer processing flow.

[0066] Figure 3 This is a flowchart of the activation process according to an embodiment of the present invention, such as... Figure 3As shown, when a batch is dispatched via JobPrep, the value of the FurnaceAction attribute of the Capability of the current site is retrieved, and it is determined whether the value is Activation. If it is, it indicates that the current site is a special activation process, and the value of the ThinFilm attribute of the current job batch needs to be retrieved. If the value contains Removable or UnRemovable, an error is returned, and dispatching cannot proceed. If Removable or UnRemovable does not exist, it continues to determine whether the current batch is NPW. If it is, dispatching is allowed. If not, it continues to determine whether the ThinFilm attribute value of the current batch contains C_cap. If it does not exist, an error is returned, and dispatching cannot proceed. If it exists, dispatching proceeds normally; if not, the current site is not a special activation process, and there is no need to verify the long film identifier on the batch; normal operation logic is followed.

[0067] It should be noted that JobPrep is a function of the MES system, which can be understood as a preparation step before batch operation. It selects the machine to be operated on, the relevant process capabilities, and some verifications to see if the conditions are met. The Capability (machine process capability) in the system has the following two configuration items: 1) FurnaceAction: (1) When the value is ACTivation, it means that the Capability is a special activation process, which requires that the wafer operated on in this Capability does not have removable and non-removable films, and must have carbon film; (2) When the value is C_Remove, it means that the Capability is a carbon film removal process, and the batch after the operation in this Capability needs to remove the carbon film mark on the batch. 2) Thin Film: (1) When the value is C_cap, it means that the Capability is a long "carbon film" process. The carbon film identifier will be recorded in the batch database after the operation of this Capability. (2) When the value is Removable, it means that the Capability is a long "removable film" process. The removable film identifier will be recorded in the batch database after the operation. (3) When the value is UnRemovable, it means that the Capability is a long "non-removable film" process. The removable film identifier will be recorded in the batch database after the operation.

[0068] The "FurnaceAction" attribute is used to define and differentiate different types of process actions or process objectives. For example, it can identify whether the current site is performing activation, cleaning, long film deposition, or other specific types of processes. By setting this attribute, the MES system can determine whether to allow the wafer to enter a specific process, or whether certain pre-processing (such as cleaning) is required before proceeding to the next process, based on the wafer's current state (e.g., the type of film layer present) and the type of process to be performed (e.g., the value of the "FurnaceAction" attribute).

[0069] For example, when the "FurnaceAction" attribute is set to "Activation," it indicates that the site is responsible for performing the activation process. In this case, the MES system may need to check whether the wafer has specific removable or non-removable film markings to ensure that the wafer's surface condition meets process requirements before entering the activation equipment. If the wafer does not meet the requirements, the system will prevent the process from executing and report an error.

[0070] According to the above embodiments of the present invention, after determining, based on the process identification result, whether there is a removable film mark or a non-removable film mark on the surface of the target wafer, an alarm message is generated to prompt the target wafer to perform a cleaning operation. The wafer activation method further includes: when a dispatch event is detected, capturing the process recipe parameters of the target site where the target wafer is currently located; when the attribute of the process recipe parameters is IsFilmRemove, which has the ability to remove thin film layers, performing a cleaning operation on the target wafer when there is a removable film mark on the surface of the target wafer.

[0071] Figure 4 This is a flowchart of the long film process according to an embodiment of the present invention, such as... Figure 4 As shown, when a batch is dispatched via JobPrep, the value of the ThinFilm attribute of the current site's Capability is retrieved: If the value is C_cap: The ThinFilm attribute value of the current job batch is read. If Removable or Unremovable exists, an error is returned, and dispatching cannot proceed. If it does not exist, the job runs normally, and when the batch leaves the site, the value C_cap is added to the batch's ThinFilm attribute. If the value is Removable, the job runs normally, and when the batch leaves the site, the value Removable is added to the batch's ThinFilm attribute. If the value is Unremovable, the job runs normally, and when the batch leaves the site, the value Unremovable is added to the batch's ThinFilm attribute.

[0072] In semiconductor manufacturing MES systems, the "IsFilmRemove" attribute is primarily used to identify whether a specific cleaning process (Recipe) has the capability to remove thin films from the wafer surface. During chip manufacturing, various types of thin films may be deposited on the wafer surface, including but not limited to oxide films, polycrystalline silicon films, and silicon nitride films. These films may need to be retained or removed at different manufacturing stages to meet the requirements of subsequent processes.

[0073] When a cleaning process is designed or configured, the "IsFilmRemove" attribute is typically set to a Boolean value (True or False), indicating whether the cleaning process is specifically designed to remove thin films from the wafer surface. If the attribute value is True, the cleaning process is considered capable of removing thin films. After the wafer undergoes this cleaning process, the MES system updates the wafer's film identification status and removes the corresponding film identifier, such as removing the "Removable" identifier from the wafer's ThinFilm attribute, indicating that the thin film layer has been successfully removed.

[0074] The "IsFilmRemove" attribute plays a crucial role in the automated control of the cleaning process. It helps the MES system determine which cleaning processes can remove specific types of films and which cannot, thereby making the correct scheduling decisions in the wafer processing flow and preventing wafers from having films that need to be removed remaining before entering the next process, which could lead to product quality problems or process interruptions.

[0075] For example, in the dispatching logic of a specific cleaning process, the MES system reads the "IsFilmRemove" attribute value on the Recipe. If the value is True, and the current wafer's film identifier contains a Removable film, the system will allow the cleaning process to be executed and update the wafer's film identifier status after the process is completed, removing the Removable identifier. Conversely, if the wafer's film identifier status does not meet the removal capability of the cleaning process, the MES system will prevent dispatching and issue an error message to the process engineer or operator, thus avoiding incorrect process scheduling.

[0076] According to the above embodiments of the present invention, after generating an alarm message to prompt the target wafer to perform a cleaning operation when it is determined from the process identification result that there is a removable film mark or a non-removable film mark on the surface of the target wafer, the wafer activation method further includes: when a dispatch event is detected, capturing the process recipe parameters of the target site where the target wafer is currently located; when the attribute of the process recipe parameters is IsFilmRemove (not capable of removing thin film layer), capturing the machine process capability of the target site where the target wafer is currently located; obtaining the operation type corresponding to the machine process capability; when the attribute of the operation type is removable C_Remove, if a carbon film C_cap mark is detected on the surface of the target wafer, performing a cleaning operation on the target wafer.

[0077] In this embodiment, ensuring that the wafer is properly cleaned before entering the activation process significantly reduces the process failure rate caused by residual film layers on the wafer surface.

[0078] Figure 5 This is a flowchart of the cleaning process according to an embodiment of the present invention, such as... Figure 5 As shown, when a batch is dispatched via JobPrep, the value of the IsFilmRemove attribute of the current site's job Recipe is read: If the value is T: when the batch leaves the site, if the ThinFilm attribute value of the batch contains Removable, then Removable is removed; if the value is not T: the value of the FurnaceAction attribute of the current site's Capability is read. If the value is C_Remove, when the batch leaves the site, if the ThinFilm attribute value of the batch contains C_cap, then C_cap is removed.

[0079] According to the above embodiments of the present invention, after performing a cleaning operation on the target wafer, the wafer activation method further includes: performing a film identification update operation on the target wafer according to the cleaning parameters of the cleaning process of the target wafer, so as to update the film identification of the target wafer.

[0080] In this embodiment, updating the wafer identifier after cleaning helps maintain the accuracy of wafer status information and enhances the precision and effectiveness of process scheduling.

[0081] According to the above embodiments of the present invention, the wafer activation method further includes: obtaining the attribute values ​​of all batches of the target wafer that need to be batched; when the attribute value indicates whether all batches of the target wafer have a carbon film C_cap identifier or do not have a carbon film C_cap identifier, batching all batches of the target wafer.

[0082] In this embodiment, batch consolidation (or batch combination) typically occurs at multiple stages of the semiconductor manufacturing process, depending on the factory's process flow and manufacturing requirements. Batch consolidation refers to combining two or more independent wafer batches into a single batch for processing. This is a common operation in production, used to improve equipment utilization, simplify process management, or meet specific production needs. Here, batch consolidation particularly emphasizes the assessment and updating of wafer film marking status before and after consolidation to ensure that the consolidated wafer batch meets the requirements of subsequent processes and avoids process problems or product quality degradation caused by improper consolidation operations. Batch consolidation operations are usually automatically controlled by the MES system, making intelligent decisions based on the current wafer status and process requirements.

[0083] According to the above embodiments of the present invention, after batching all batches of target wafers, the wafer activation method further includes: modifying the batch attribute values ​​of the parent batch of the target wafer to the union of the attribute values ​​of all batches.

[0084] This embodiment specifies rules for pre-batch status checks and post-batch status updates to ensure process compatibility between batches. The technical advantage lies in improving the flexibility of wafer processing and scalability for large-scale production.

[0085] Figure 6 This is a flowchart illustrating the process of batching involving long film marking according to an embodiment of the present invention, such as... Figure 6 As shown, the ThinFilm attribute values ​​of all batches to be merged are retrieved. It is then checked whether all batches contain C_cap or none contain it. If so, the merging proceeds normally, and after outbound shipment, the ThinFilm attribute value of the parent batch is changed to the union of the ThinFilm values ​​of all batches. If not, an error is returned, and the merging fails.

[0086] The technical solutions provided by the above embodiments of the present invention solve the following technical problems: 1) When a batch undergoes a carbon film growth process, the wafer cannot have films that can be removed by cleaning processes (Oxide / LPSIN / LPTEOS, etc.) or films that cannot be removed by cleaning processes (DPOLY / PESIN / BPSG, etc.). Therefore, different identifiers are added to these three processes. When a batch undergoes a process with a removable film, a removable film identifier (Removable) is added to the batch; when a batch undergoes a process with a non-removable film, a non-removable film identifier (UnRemovable) is added to the batch. When performing a carbon film growth process, the presence of a removable or non-removable film in the batch is checked. If it exists, an error is reported during the work order. If it does not exist, the work order is successfully completed, and a carbon film identifier (C_cap) is added to the batch after the work order. 2) When a batch undergoes a specific activation process, the wafer cannot have a removable or non-removable film; a carbon film is required. The system uses the long film identifier currently recorded in the batch to control whether the current batch meets the requirements of the activation process. If it does, work can be dispatched; otherwise, an error message is displayed to the user. 3) After a batch undergoes a specific cleaning process, the system needs to remove the corresponding long film identifier from the batch according to the cleaning capacity configured for that process. 4) When batches are split or combined, different processing logic is applied based on the long film identifier on the batch. Furthermore, in the slab separation workflow, the system also determines whether long film-related logic needs to be executed based on the configured station's process, ensuring that this function is applicable to all work scenarios. 5) The long film identifier on the batch in the system can be manually modified to handle abnormal situations.

[0087] Meanwhile, the technical solution provided by the above embodiments of the present invention enables the system to control whether a batch meets the wafer state required by the activation process, ensuring that the wafer is clean and residue-free before entering the activation machine, reducing the possibility of wafer scrap and machine contamination. Furthermore, by recording the long film markings of batches after different long film processes and cleaning processes through the MES system, the system controls batches to meet the corresponding long film markings before being assigned to work in certain processes with specific requirements, thereby improving wafer yield and reducing the possibility of wafer scrap.

[0088] It should be noted that, for the sake of simplicity, the foregoing method embodiments are all described as a series of actions. However, those skilled in the art should understand that this application is not limited to the described order of actions, as some steps may be performed in other orders or simultaneously according to this application. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions and modules involved are not necessarily essential to this application.

[0089] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods according to the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes several instructions to cause a terminal device (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods described in the various embodiments of this application.

[0090] Example 2

[0091] According to embodiments of the present invention, a wafer activation apparatus for implementing the above-described wafer activation method is also provided. Figure 7 This is a schematic diagram of a wafer activation apparatus according to an embodiment of the present invention, such as... Figure 7 As shown, the device includes: an identification unit 701, a first determination unit 703, a second determination unit 705, and an activation unit 707. The wafer activation device will now be described.

[0092] The identification unit 701 is used to identify the type of long film process that has been performed on the target wafer during the target wafer processing, and to obtain the process identification result of the target wafer.

[0093] The first determining unit 703 is used to generate an alarm message when it is determined that a specific activation process is required for the target wafer, and when it is determined that there is a removable film mark or a non-removable film mark on the surface of the target wafer based on the process identification result, so as to prompt the target wafer to perform a cleaning operation. The specific activation process is an activation process performed on wafers that do not have a removable film mark or a non-removable film mark.

[0094] The second determining unit 705 is used to obtain the machine process capability when it is determined from the process identification result that there is no removable film mark or no removable film mark on the surface of the target wafer.

[0095] Activation unit 707 is used to perform an activation process on the target wafer when the machine's process capability is long carbon film process and the wafer identifier of the target wafer is not a non-product wafer, or the wafer identifier is a non-product wafer.

[0096] It should be noted that the above-mentioned identification unit 701, first determination unit 703, second determination unit 705 and activation unit 707 correspond to steps S202 to S208 in the above embodiments. The four units and the corresponding steps implement the same instances and application scenarios, but are not limited to the content disclosed in the above embodiments.

[0097] As can be seen from the above, in the scheme described in the above embodiments of the present invention, the identification unit can be used to identify the type of long film process performed on the target wafer during the target wafer processing to obtain the process identification result of the target wafer; when the first determining unit determines that the target wafer needs to undergo a specific activation process, and determines whether there is a removable film mark or a non-removable film mark on the surface of the target wafer based on the process identification result, an alarm message is generated to prompt the target wafer to perform a cleaning operation, wherein the specific activation process is an activation process performed on wafers that do not have a removable film mark or a non-removable film mark; the second determining unit... The positioning unit determines the machine's process capability based on the process identification results, indicating whether the target wafer's surface lacks removable or non-removable film markings. Then, the activation unit performs an activation process on the target wafer when the machine's process capability is a long carbon film process and the target wafer's wafer marking is not a non-product wafer, or if the wafer marking is a non-product wafer. This achieves intelligent management and control of the film layer status using the MES system. Through automatic identification, status checks, and capability matching, it ensures that the wafer reaches its optimal state before entering the activation process, thereby avoiding film residue problems and reducing the risk of wafer scrap.

[0098] Therefore, the technical solutions provided by the embodiments of the present invention solve the technical problem in the related art that when wafers undergo certain long carbon film processes, there will be specific types of residual films on the wafer surface, which affect the quality of the activation process.

[0099] Optionally, the identification unit includes: a first acquisition module for acquiring the long film process type; and an identification module for automatically identifying whether the target wafer has a removable film identification or a non-removable film identification based on the long film process type, thereby obtaining the process identification result of the target wafer.

[0100] Optionally, the first determining unit includes: a capturing module, used to capture the machine process capability of the target site where the target wafer is currently located when a dispatch event is detected; a second obtaining module, used to obtain the operation type corresponding to the machine process capability; and a first determining module, used to determine that the target wafer needs to undergo a specific activation process when the operation type attribute is the activation attribute.

[0101] Optionally, the wafer activation device further includes: a first gripping unit, used to generate an alarm message when it is determined from the process identification result that there is a removable film mark or a non-removable film mark on the surface of the target wafer, so as to prompt the target wafer to perform a cleaning operation, and to grab the process recipe parameters of the target site where the target wafer is currently located when a dispatch event is detected; and a first cleaning unit, used to perform a cleaning operation on the target wafer when the process recipe parameter attribute is IsFilmRemove with the ability to remove thin film layers and there is a removable film mark on the surface of the target wafer.

[0102] Optionally, the wafer activation device further includes: a second grasping unit, used to generate an alarm message when it is determined from the process identification result that there is a removable film mark or a non-removable film mark on the surface of the target wafer, so as to prompt the target wafer to perform a cleaning operation, and to grasp the process recipe parameters of the target site where the target wafer is currently located when a dispatch event is detected; a third grasping unit, used to grasp the machine process capability of the target site where the target wafer is currently located when the attribute of the process recipe parameter is not capable of removing thin film layer IsFilmRemove; a first acquisition unit, used to acquire the operation type corresponding to the machine process capability; and a second cleaning unit, used to perform a cleaning operation on the target wafer when the operation type attribute is removable C_Remove and a carbon film C_cap mark is detected on the surface of the target wafer.

[0103] Optionally, the wafer activation apparatus further includes: an update unit, configured to perform a film identification update operation on the target wafer according to the cleaning parameters of the cleaning process of the target wafer after performing a cleaning operation on the target wafer, so as to update the film identification of the target wafer.

[0104] Optionally, the wafer activation device further includes: a second acquisition unit, used to acquire the attribute values ​​of all batches of the target wafers that need to be batched; and a batching unit, used to batch all batches of the target wafers when the attribute values ​​indicate whether all batches of the target wafers have a carbon film C_cap identifier or do not have a carbon film C_cap identifier.

[0105] Optionally, the wafer activation apparatus further includes: a modification unit, configured to modify the batch attribute value of the parent batch of the target wafer to the union of the attribute values ​​of all batches after batching all batches of the target wafer.

[0106] According to another aspect of the present invention, a processor is also provided, which is used to run a program, wherein the program executes the wafer activation method of any one of the above-described methods during runtime.

[0107] According to another aspect of the present invention, a computer program product is also provided, including computer instructions. According to another aspect of the present invention, a wafer activation method is also provided in which the computer instructions are executed by a processor to perform any of the above-described methods.

[0108] According to another aspect of the present invention, a computer-readable storage medium is also provided, the computer-readable storage medium including a stored program, wherein the program executes the wafer activation method of any of the above.

[0109] Optionally, in this embodiment, the computer-readable storage medium may be located in any computer terminal in a group of computer terminals in a computer network, or in any communication device in a group of communication devices.

[0110] Optionally, in this embodiment, the computer-readable storage medium is configured to store program code for performing the following steps: during the target wafer processing, the type of long film process performed on the target wafer is identified to obtain the process identification result of the target wafer; when it is determined that the target wafer needs to undergo a specific activation process, and when it is determined according to the process identification result that there is a removable film mark or a non-removable film mark on the surface of the target wafer, an alarm message is generated to prompt the target wafer to perform a cleaning operation, wherein the specific activation process is an activation process performed on wafers that do not have a removable film mark or a non-removable film mark; when it is determined according to the process identification result that there is no removable film mark or a non-removable film mark on the surface of the target wafer, the machine process capability is obtained; when the machine process capability is a long carbon film process and the wafer identification of the target wafer is not a non-product wafer, or the wafer identification is a non-product wafer, the activation process is performed on the target wafer.

[0111] Optionally, in this embodiment, the computer-readable storage medium is configured to store program code for performing the following steps: obtaining the long film process type; automatically identifying whether the target wafer has a removable film identifier or a non-removable film identifier according to the long film process type, and obtaining the process identifier result of the target wafer.

[0112] Optionally, in this embodiment, the computer-readable storage medium is configured to store program code for performing the following steps: when a dispatch event is detected, capturing the machine process capability of the target site where the target wafer is currently located; obtaining the operation type corresponding to the machine process capability; and determining that the target wafer needs to undergo a specific activation process when the operation type attribute is Activation.

[0113] Optionally, in this embodiment, the computer-readable storage medium is configured to store program code for performing the following steps: when it is determined, based on the process identification result, that there is a removable or non-removable film mark on the surface of the target wafer, an alarm message is generated to prompt the target wafer to perform a cleaning operation; after listening to the dispatch event, the process recipe parameters of the target site where the target wafer is currently located are captured; when the attribute of the process recipe parameter is IsFilmRemove, and when there is a removable film mark on the surface of the target wafer, a cleaning operation is performed on the target wafer.

[0114] Optionally, in this embodiment, the computer-readable storage medium is configured to store program code for performing the following steps: when it is determined, based on the process identification result, that there is a removable or non-removable film mark on the surface of the target wafer, an alarm message is generated to prompt the target wafer to perform a cleaning operation; after listening to the dispatch event, the process recipe parameters of the target site where the target wafer is currently located are captured; when the attribute of the process recipe parameters is not IsFilmRemove, the machine process capability of the target site where the target wafer is currently located is captured; the operation type corresponding to the machine process capability is obtained; when the attribute of the operation type is C_Remove, if a C_cap mark is detected on the surface of the target wafer, a cleaning operation is performed on the target wafer.

[0115] Optionally, in this embodiment, the computer-readable storage medium is configured to store program code for performing the following steps: after performing a cleaning operation on the target wafer, performing a film identification update operation on the target wafer according to the cleaning parameters of the cleaning process of the target wafer, so as to update the film identification of the target wafer.

[0116] Optionally, in this embodiment, the computer-readable storage medium is configured to store program code for performing the following steps: obtaining attribute values ​​of all batches of the target wafers that need to be batched; batching all batches of the target wafers when the attribute value indicates whether all batches of the target wafers have the C_cap identifier or do not have the C_cap identifier.

[0117] Optionally, in this embodiment, the computer-readable storage medium is configured to store program code for performing the following steps: after batching all batches of target wafers, modifying the batch attribute values ​​of the parent batch of the target wafers to the union of the attribute values ​​of all batches.

[0118] The sequence numbers of the above embodiments of the present invention are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0119] In the above embodiments of the present invention, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0120] In the several embodiments provided in this application, it should be understood that the disclosed technical content can be implemented in other ways. The device embodiments described above are merely illustrative; for example, the division of units can be a logical functional division, and in actual implementation, there may be other division methods. For instance, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the displayed or discussed mutual coupling, direct coupling, or communication connection may be through some interfaces; the indirect coupling or communication connection between units or modules may be electrical or other forms.

[0121] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0122] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0123] Furthermore, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0124] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, read-only memory (ROM), random access memory (RAM), portable hard drives, magnetic disks, or optical disks.

[0125] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A wafer activation method, characterized by, The method comprises the following steps: identifying a long film process type that has been performed on the target wafer to obtain a process identification result of the target wafer; when it is determined that the target wafer needs to perform a specific activation process, generating an alarm information according to the process identification result to prompt the target wafer to perform a cleaning operation, wherein the specific activation process is an activation process performed on a wafer without the removable film mark or the non-removable film mark; when it is determined that the surface of the target wafer does not have the removable film mark or the non-removable film mark according to the process identification result, obtaining a machine process capability; when the machine process capability is a long carbon film process and the wafer identification of the target wafer is not a non-product wafer, or the wafer identification is the non-product wafer, performing the activation process on the target wafer.

2. The wafer activation method of claim 1, wherein, identifying a long film process type that has been performed on the target wafer to obtain a process identification result of the target wafer, comprising: obtaining the long film process type; automatically identifying whether the target wafer has the removable film mark or the non-removable film mark according to the long film process type to obtain the process identification result of the target wafer.

3. The wafer activation method of claim 1, wherein, determining that the target wafer needs to perform a specific activation process, comprising: when a dispatch event is listened to, grabbing a machine process capability of a target site where the target wafer is currently located; obtaining an operation type corresponding to the machine process capability; when an attribute of the operation type is an activation attribute, determining that the target wafer needs to perform the specific activation process.

4. The wafer activation method of claim 1, wherein when it is determined that the surface of the target wafer has the removable film mark or the non-removable film mark according to the process identification result, generating an alarm information to prompt the target wafer to perform a cleaning operation, the wafer activation method further comprises: when a dispatch event is listened to, grabbing a process recipe parameter of a target site where the target wafer is currently located; when an attribute of the process recipe parameter is a capability of removing a thin film layer, performing the cleaning operation on the target wafer when the surface of the target wafer has the removable film mark.

5. The wafer activation method of claim 1, wherein when it is determined that the surface of the target wafer has the removable film mark or the non-removable film mark according to the process identification result, generating an alarm information to prompt the target wafer to perform a cleaning operation, the wafer activation method further comprises: when a dispatch event is listened to, grabbing a process recipe parameter of a target site where the target wafer is currently located; when an attribute of the process recipe parameter is a capability of removing a thin film layer, grabbing a machine process capability of the target site where the target wafer is currently located; obtaining an operation type corresponding to the machine process capability; when an attribute of the operation type is a removable attribute, if it is detected that the surface of the target wafer has a carbon film mark, performing the cleaning operation on the target wafer.

6. The wafer activation method according to claim 4 or 5, characterized by, after performing the cleaning operation on the target wafer, the wafer activation method further comprises: According to a cleaning parameter of a cleaning process of the target wafer, a film identification updating operation is performed on the target wafer to update the film identification of the target wafer.

7. The wafer activation method of claim 1, wherein, The wafer activation method further includes: obtaining attribute values of all batches of the target wafer that need to be batched; when the attribute values represent whether the target wafers of all batches have carbon film identification or do not have the carbon film identification, batch the target wafers of all batches.

8. The wafer activation method of claim 7, wherein, After batch processing the target wafers of all batches, the wafer activation method further includes: modifying the attribute values of the batches of the parent batch of the target wafer to the union set of the attribute values of all batches.

9. A wafer activation device, characterized by, comprises: an identification unit configured to identify a long film process type that has been performed on a target wafer during a target wafer processing process to obtain a process identification result of the target wafer; a first determination unit configured to, when it is determined that a specific activation process needs to be performed on the target wafer, generate an alarm information to prompt the target wafer to perform a cleaning operation according to the process identification result when it is determined that a removable film identification or a non-removable film identification exists on the surface of the target wafer, wherein the specific activation process is an activation process performed on a wafer that does not have the removable film identification or the non-removable film identification; a second determination unit configured to, when it is determined that the removable film identification or the non-removable film identification does not exist on the surface of the target wafer according to the process identification result, obtain a machine process capability; an activation unit configured to, when the machine process capability is a long carbon film process and the wafer identification of the target wafer is not a non-product wafer, or when the wafer identification is the non-product wafer, perform the activation process on the target wafer.

10. A computer program product comprising computer instructions, characterized in that, The computer instructions, when executed by a processor, perform the wafer activation method of any one of claims 1 to 8.

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