Cutting oil, diamond cutting slurry and preparation method thereof

Abstract

The invention relates to the technical field of fine chemical engineering, in particular to cutting oil and diamond cutting slurry and a preparation method thereof, in particular to cutting oil and diamond cutting slurry for cutting hard and brittle crystal bars and blocks and a preparation method thereof, and the cutting oil comprises mineral oil, a suspension dispersant, a surfactant, an antioxidant and an anti-wear reagent at extreme pressure. Through cooperation of the mineral oil, the suspension dispersant, the surfactant, the antioxidant and the anti-wear reagent at extreme pressure, the cutting oil has the advantages of long suspension time, good lubricity, low viscosity, long service life, no hardening of diamond abrasives after shutdown, and easy cleaning of wafers. The diamond cutting slurry is prepared by mixing the cutting oil and a diamond abrasive, and has a good application prospect in hard and brittle material cutting, especially in a third-generation semiconductor SiC crystal bar linear cutting process. The preparation method disclosed by the invention has the characteristics of simple process, mild and controllable preparation conditions, high production efficiency and suitability for large-scale production.

Description

Technical Field

[0001] This invention relates to the field of fine chemical technology, specifically to a cutting oil and a diamond cutting slurry and their preparation method, particularly to a cutting oil and a diamond cutting slurry for cutting hard and brittle crystal rods and bulk materials and their preparation method. Background Technology

[0002] Third-generation semiconductor SiC boasts a large bandgap, high critical breakdown electric field strength, high electron saturation migration rate, high electron density, high thermal conductivity, and low dielectric constant. It also possesses numerous superior properties such as high frequency and high efficiency, high voltage resistance, high temperature resistance, strong radiation resistance, and chemical stability. Therefore, it has very attractive application prospects in strategic emerging fields such as semiconductor lighting, 5G communication technology, solar energy, smart grids, new energy grid integration, high-speed rail transportation, national defense, uninterruptible power supplies, new energy vehicles, consumer electronics, fast charging, and wireless charging. Furthermore, it plays a crucial role in energy conservation, emission reduction, and industrial upgrading. Third-generation semiconductor SiC is becoming a new technological high ground in the global semiconductor industry and a key to a new round of technological revolution.

[0003] Currently, the ultra-precision processing technology for SiC single crystals, in its processing sequence, mainly includes the following steps: directional cutting, grinding (rough grinding and fine grinding), polishing (mechanical polishing), and ultra-precision polishing (chemical mechanical polishing). Among these, cutting is the most important process in single-crystal wafer processing. The cutting process involves slicing the crystal ingot into thin crystal wafers along a specific direction. Cutting the SiC crystal ingot into wafers with low warpage, uniform thickness, and low cutting loss is crucial for subsequent grinding and polishing.

[0004] SiC crystals possess high Mohs hardness (9.2), high mechanical strength, and good chemical stability. Currently, SiC crystal rod slicing primarily utilizes an oil-based diamond cutting slurry prepared with steel wire and (super)hard abrasives (diamond, boron carbide, silicon carbide, alumina), which is then used to cut the SiC crystal rod through high-speed reciprocating motion. However, existing oil-based diamond cutting slurries suffer from several technical challenges, including insufficient lubrication, high viscosity, poor diamond abrasive suspension, easy abrasive caking and difficulty in redispersing after shutdown, and difficulty in cleaning SiC wafers after cutting. Summary of the Invention

[0005] To overcome the shortcomings of the prior art, the first objective of this invention is to provide a cutting oil that has the advantages of long suspension time, good lubrication, low viscosity, long service life, no caking of diamond abrasive after shutdown, and easy cleaning of wafers.

[0006] The second objective of this invention is to provide a method for preparing cutting oil, which has the advantages of simple process, mild and controllable preparation conditions, and high production efficiency.

[0007] The third objective of this invention is to provide a diamond cutting slurry that has the advantages of long suspension time, good lubricity, low viscosity, long service life, no diamond abrasive caking after shutdown, and easy wafer cleaning, and has good application prospects in SiC crystal rod cutting process.

[0008] The fourth objective of this invention is to provide a method for preparing diamond cutting slurry, which has the advantages of simple process, mild and controllable preparation conditions, and high production efficiency.

[0009] To achieve the first objective of the invention, the technical solution adopted by the present invention is as follows: This invention provides a cutting oil comprising the following components in parts by weight: 70-95 parts mineral oil 1 to 10 parts of suspending dispersant 4 to 15 parts surfactant Antioxidant 0.01 to 2 parts Extreme pressure anti-wear agent 0.5 to 5 parts; The extreme pressure anti-wear agent is one or more of sulfurized lard, sulfurized fatty acid ester, alkyl phosphite ester, or polyricinoleate.

[0010] Preferably, the alkyl phosphite is a dialkyl phosphite or an octadecyl phosphite.

[0011] Preferably, the polyricinoleate is a dimer ricinoleate, a tetramer ricinoleate, or a hexamer ricinoleate.

[0012] In this invention, a cutting oil comprises mineral oil that provides lubrication, cooling, and rust prevention. Furthermore, the synergistic effect of mineral oil and surfactants washes away chips and powder, preventing adhesion and ensuring continuous processing, thus providing a cleaning function. A suspending and dispersing agent reduces the interfacial tension between abrasive particles and the liquid, enhancing the wettability of the cutting oil on the workpiece surface, thereby improving lubrication and heat dissipation efficiency. It also inhibits particle aggregation, reduces performance degradation caused by sedimentation, maintains stable operation, reduces the frequency of oil replacement, and extends service life. An antioxidant delays the oxidative deterioration of the cutting oil, preventing deposit formation, thus maintaining stable lubrication performance and extending service life. An extreme pressure anti-wear agent forms a protective film in the cutting oil to isolate direct contact between the two metals during cutting, preventing sintering and wear, while also improving lubrication performance, enhancing anti-wear capabilities, and improving processing quality. Therefore, this invention's cutting oil, through the synergistic effect of mineral oil, suspending and dispersing agent, surfactant, antioxidant, and extreme pressure anti-wear agent, has the advantages of long suspension time, good lubricity, low viscosity, long service life, and prevents diamond abrasive from caking after shutdown, making the wafers easy to clean.

[0013] Furthermore, the mineral oil is a paraffinic mineral oil or a naphthenic mineral oil; wherein, both paraffinic and naphthenic mineral oils possess excellent lubrication, rust prevention, cooling, high-temperature stability, and are non-toxic and environmentally friendly. And / or The viscosity of the mineral oil is 1 mPa·s to 100 mPa·s. Mineral oils with this viscosity exhibit good lubrication and cooling properties. Preferably, the viscosity of the mineral oil is 3 mPa·s to 50 mPa·s.

[0014] Furthermore, the suspending and dispersing agent is one or a combination of two of bentonite or polyamide wax. Both bentonite and polyamide wax have good suspension and dispersing properties and good anti-settling effects.

[0015] Furthermore, the surfactant is one or a combination of two or more of fatty alcohol polyoxyethylene ether, nonylphenol polyoxyethylene ether, or organosilicon surfactants. The surfactant enhances the cleaning ability and lubrication properties of the cutting oil.

[0016] Furthermore, the antioxidant is one or a combination of two or more of butylated hydroxyanisole, butylated hydroxytoluene, tert-butylhydroquinone, and tocopherol.

[0017] To achieve the second objective of the invention, the technical solution adopted by the present invention is as follows: This invention provides a method for preparing cutting oil, comprising the following steps: S1. Add the prescribed amount of suspending and dispersing agent to the mineral oil, stir and mix to obtain the first solution; S2. Add the formulated amounts of surfactant, antioxidant and extreme pressure anti-wear agent to the first solution in sequence, stir and mix to obtain the cutting oil.

[0018] In the above technical solution, in step S1, the stirring and mixing time is 0.5h~1h; and / or In step S2, the mixing time is 1h to 2h.

[0019] To achieve the third objective of the invention, the technical solution adopted by the present invention is as follows: This invention provides a diamond cutting slurry, comprising the cutting oil described above, specifically including the following components in parts by weight: 5 to 30 parts diamond abrasive 70-85 parts cutting oil.

[0020] The diamond cutting slurry of the present invention, due to the use of the cutting oil of the present invention, has the advantages of long suspension time, good lubricity, low viscosity, long service life, no caking of diamond abrasive after shutdown, and easy cleaning of wafers, and has good application prospects in SiC crystal rod cutting process.

[0021] To achieve the fourth objective of the invention, the technical solution adopted by the present invention is as follows: This invention provides a method for preparing diamond cutting slurry, comprising the following steps: adding a specified amount of diamond abrasive to cutting oil and stirring to mix, thereby obtaining the diamond cutting slurry.

[0022] In the above technical solution, the mixing time is 1 hour to 3 hours; and / or The diamond abrasive has a particle size of 5μm to 30μm.

[0023] Compared with the prior art, the beneficial effects of the present invention are as follows: (1) The cutting oil of the present invention has the following advantages: mineral oil can play a role in lubrication, cooling and heat dissipation and rust prevention; in addition, mineral oil and surfactant can synergistically wash away chips and powder, prevent adhesion, ensure continuous processing, and thus have a cleaning function; suspending and dispersing agent can reduce the interfacial tension between abrasive particles and liquid, enhance the wettability of the cutting oil on the surface of the cutting object, thereby improving the lubrication effect and heat dissipation efficiency, and can inhibit particle aggregation, reduce the performance degradation of the cutting oil due to precipitation, maintain a stable working state, reduce the frequency of cutting oil replacement, and thus extend the service life; antioxidant can delay the oxidation and deterioration of the cutting oil, prevent the formation of deposits, thereby maintaining stable lubrication performance and extending service life; extreme pressure anti-wear agent can form a protective film in the cutting oil to isolate the two metals from direct contact during cutting, prevent sintering and wear, and also improve lubrication performance, enhance anti-wear ability, and improve processing quality. Therefore, the present invention has the advantages of long suspension time, good lubricity, low viscosity, long service life, no diamond abrasive caking after shutdown, and easy cleaning of wafers by synergistically combining mineral oil, suspending and dispersing agent, surfactant, antioxidant and extreme pressure anti-wear agent.

[0024] (2) A method for preparing cutting oil according to the present invention has the characteristics of simple process, mild and controllable preparation conditions, high production efficiency and suitability for large-scale production.

[0025] (3) The diamond cutting slurry of the present invention is prepared by mixing the cutting oil of the present invention with diamond abrasive. It has the advantages of long suspension time, good lubricity, low viscosity, long service life, no caking of diamond abrasive after shutdown, and easy cleaning of wafers. This diamond cutting slurry has good application prospects in the cutting of hard and brittle materials, especially in the wire cutting process of third-generation semiconductor SiC crystal rods.

[0026] (4) A method for preparing diamond cutting slurry according to the present invention has the characteristics of simple process, mild and controllable preparation conditions, high production efficiency and suitability for large-scale production. Detailed Implementation

[0027] To make the technical problem to be solved, the technical solution, and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0028] The terminology used in the embodiments of this invention is for the purpose of describing particular embodiments only and is not intended to limit the invention. In this invention, the singular forms “a,” “the,” and “the” as used in the embodiments and appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0029] In this embodiment of the invention, a cutting oil comprises the following components in parts by weight: 70-95 parts mineral oil 1 to 10 parts of suspending dispersant 4 to 15 parts surfactant Antioxidant 0.01 to 2 parts Extreme pressure anti-wear agent 0.5 to 5 parts; The extreme pressure anti-wear agent is one or more of sulfurized lard, sulfurized fatty acid ester, alkyl phosphite ester, or polyricinoleate.

[0030] In some embodiments, the mineral oil is a paraffinic mineral oil or a naphthenic mineral oil; and / or The viscosity of the mineral oil is 1 mPa·s to 100 mPa·s.

[0031] In some embodiments, the suspending dispersant is one or a combination of two of bentonite or polyamide wax.

[0032] In some embodiments, the surfactant is one or a combination of two or more of fatty alcohol polyoxyethylene ether, nonylphenol polyoxyethylene ether, or organosilicon surfactant.

[0033] In some embodiments, the antioxidant is one or a combination of two or more of butylated hydroxyanisole, butylated hydroxytoluene, tert-butylhydroquinone, and tocopherol.

[0034] In this embodiment of the invention, a method for preparing cutting oil includes the following steps: S1. Add the prescribed amount of suspending and dispersing agent to the mineral oil, stir and mix to obtain the first solution; S2. Add the formulated amounts of surfactant, antioxidant and extreme pressure anti-wear agent to the first solution in sequence, stir and mix to obtain the cutting oil.

[0035] In some embodiments, in step S1, the stirring and mixing time is 0.5 h to 1 h; and / or In step S2, the mixing time is 1h to 2h.

[0036] In this embodiment of the invention, a diamond cutting slurry includes the cutting oil described above, specifically comprising the following components in parts by weight: 5 to 30 parts diamond abrasive Cutting oil: 70-95 parts.

[0037] In this embodiment of the invention, a method for preparing a diamond cutting slurry includes the following steps: adding a specified amount of diamond abrasive to cutting oil and stirring to mix, thereby obtaining the diamond cutting slurry.

[0038] In some embodiments, the mixing time is 1 hour to 3 hours; and / or The diamond abrasive has a particle size of 5μm to 30μm.

[0039] The following description is based on specific embodiments.

[0040] Example 1 A cutting oil comprising the following components in parts by weight: 91.9 parts paraffinic mineral oil, 1 part bentonite, 5 parts fatty alcohol polyoxyethylene ether, 0.1 part butylated hydroxyanisole, and 1 part sulfurized lard.

[0041] In this embodiment, the viscosity of the paraffin-based mineral oil is 50 mPa·s.

[0042] The above-mentioned method for preparing cutting oil includes the following steps: S1. Add the prescribed amount of bentonite to paraffin-based mineral oil and stir for 0.8 hours to obtain the first solution; S2. Add the prescribed amounts of fatty alcohol polyoxyethylene ether, butylated hydroxyanisole, and sulfurized lard to the first solution in sequence, and stir for 1.5 hours to obtain the cutting oil.

[0043] Example 2 A cutting oil comprising the following components in parts by weight: 89.7 parts naphthenic mineral oil, 2 parts polyamide wax, 6.5 parts nonylphenol polyoxyethylene ether, 0.5 parts butylated hydroxytoluene, and 2 parts sulfurized fatty acid ester.

[0044] In this embodiment, the viscosity of the naphthenic mineral oil is 3 mPa·s.

[0045] The above-mentioned method for preparing cutting oil includes the following steps: S1. Add the prescribed amount of polyamide wax to the naphthenic mineral oil and stir for 0.5 hours to obtain the first solution; S2. Add the formulated amounts of nonylphenol polyoxyethylene ether, butylated hydroxytoluene, and sulfurized fatty acid ester to the first solution in sequence, and stir and mix for 1 hour to obtain the cutting oil.

[0046] Example 3 A cutting oil comprising the following components in parts by weight: 90 parts paraffinic mineral oil, 4 parts bentonite, 6 parts polyamide wax, 4 parts fatty alcohol polyoxyethylene ether, 0.3 parts tert-butylhydroquinone, and 0.5 parts dialkyl phosphite.

[0047] In this embodiment, the viscosity of the paraffin-based mineral oil is 30 mPa·s.

[0048] The above-mentioned method for preparing cutting oil includes the following steps: S1. Add the prescribed amounts of bentonite and polyamide wax to the paraffin-based mineral oil and stir for 1 hour to obtain the first solution; S2. Add the prescribed amounts of fatty alcohol polyoxyethylene ether, tert-butylhydroquinone, and dialkyl phosphite to the first solution in sequence, and stir for 2 hours to obtain the cutting oil.

[0049] Example 4 A cutting oil comprising the following components in parts by weight: 92 parts naphthenic mineral oil, 5 parts bentonite, 10 parts fatty alcohol polyoxyethylene ether, 5 parts nonylphenol polyoxyethylene ether, 0.6 parts tocopherol, and 3 parts tetrameric castor oil ester.

[0050] In this embodiment, the viscosity of the naphthenic mineral oil is 1 mPa·s.

[0051] The above-mentioned method for preparing cutting oil includes the following steps: S1. Add the prescribed amount of bentonite to the cycloalkyl mineral oil and stir for 0.6 hours to obtain the first solution; S2. Add the formulated amounts of fatty alcohol polyoxyethylene ether, nonylphenol polyoxyethylene ether, tocopherol and tetrameric castor oil ester to the first solution in sequence, and stir and mix for 1.2 hours to obtain the cutting oil.

[0052] Example 5 A cutting oil comprising the following components in parts by weight: 70 parts paraffinic mineral oil, 2.5 parts polyamide wax, 12 parts silicone surfactant, 0.01 parts butylated hydroxyanisole, 3 parts octadecyl phosphite, and 2 parts hexameric castor oil ester.

[0053] In this embodiment, the viscosity of the paraffin-based mineral oil is 100 mPa·s.

[0054] The above-mentioned method for preparing cutting oil includes the following steps: S1. Add the prescribed amount of polyamide wax to the paraffin-based mineral oil and stir for 0.9 hours to obtain the first solution; S2. Add the formulated amounts of organosilicon surfactant, butylated hydroxyanisole, octadecyl phosphite and hexameric castor oil to the first solution in sequence, and stir for 1 to 2 hours to obtain the cutting oil.

[0055] Example 6 A cutting oil comprising the following components in parts by weight: 95 parts naphthenic mineral oil, 8 parts polyamide wax, 8 parts fatty alcohol polyoxyethylene ether, 1 part butylated hydroxytoluene, 1 part tert-butylhydroquinone, 0.8 parts sulfurized fatty acid ester, and 2 parts dimeric castor oil ester.

[0056] In this embodiment, the viscosity of the naphthenic mineral oil is 15 mPa·s.

[0057] The above-mentioned method for preparing cutting oil includes the following steps: S1. Add the prescribed amount of polyamide wax to the naphthenic mineral oil and stir for 0.7 h to obtain the first solution; S2. Add the formulated amounts of fatty alcohol polyoxyethylene ether, butylated hydroxytoluene, tert-butylhydroquinone, sulfurized fatty acid ester and dimeric castor oil ester to the first solution in sequence, and stir and mix for 1.8 hours to obtain the cutting oil.

[0058] Example 7 A diamond cutting slurry comprises the following components in parts by weight: 15 parts diamond abrasive and 85 parts cutting oil. In this embodiment, the diamond abrasive has a particle size of 5 μm.

[0059] The above-mentioned method for preparing diamond cutting slurry includes the following steps: adding the prescribed amount of diamond abrasive to the cutting oil and stirring for 2 hours to obtain the diamond cutting slurry.

[0060] Example 8 A diamond cutting slurry comprises the following components in parts by weight: 5 parts diamond abrasive and 95 parts cutting oil. In this embodiment, the diamond abrasive has a particle size of 10 μm.

[0061] The above-mentioned method for preparing diamond cutting slurry includes the following steps: adding the prescribed amount of diamond abrasive to the cutting oil and stirring for 1 hour to obtain the diamond cutting slurry.

[0062] Example 9 A diamond cutting slurry comprises the following components in parts by weight: 25 parts diamond abrasive and 75 parts cutting oil. In this embodiment, the diamond abrasive has a particle size of 15 μm.

[0063] The above-mentioned method for preparing diamond cutting slurry includes the following steps: adding the prescribed amount of diamond abrasive to the cutting oil and stirring for 3 hours to obtain the diamond cutting slurry.

[0064] Example 10 A diamond cutting slurry comprises the following components in parts by weight: 30 parts diamond abrasive and 70 parts cutting oil. In this embodiment, the diamond abrasive has a particle size of 30 μm.

[0065] The above-mentioned method for preparing diamond cutting slurry includes the following steps: adding the prescribed amount of diamond abrasive to the cutting oil and stirring for 1.5 hours to obtain the diamond cutting slurry.

[0066] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A cutting oil, characterized in that, The components include the following parts by weight: 70-95 parts mineral oil 1 to 10 parts of suspending dispersant 4 to 15 parts surfactant Antioxidant 0.01 to 2 parts Extreme pressure anti-wear agent 0.5 to 5 parts; The extreme pressure anti-wear agent is one or more of sulfurized lard, sulfurized fatty acid ester, alkyl phosphite ester, or polyricinoleate.

2. The cutting oil as described in claim 1, characterized in that, The mineral oil is a paraffinic mineral oil or a naphthenic mineral oil; and / or The viscosity of the mineral oil is 1 mPa·s to 100 mPa·s.

3. The cutting oil as described in claim 1, characterized in that, The suspending dispersant is one or a combination of two of bentonite or polyamide wax.

4. The cutting oil as described in claim 1, characterized in that, The surfactant is one or a combination of two or more of fatty alcohol polyoxyethylene ether, nonylphenol polyoxyethylene ether, or organosilicon surfactants.

5. The cutting oil as described in claim 1, characterized in that, The antioxidant is one or a combination of two or more of butylated hydroxyanisole, butylated hydroxytoluene, tert-butylhydroquinone, and tocopherol.

6. A method for preparing cutting oil according to any one of claims 1 to 5, characterized in that, Includes the following steps: S1. Add the prescribed amount of suspending and dispersing agent to the mineral oil, stir and mix to obtain the first solution; S2. Add the formulated amounts of surfactant, antioxidant and extreme pressure anti-wear agent to the first solution in sequence, stir and mix to obtain the cutting oil.

7. The method for preparing cutting oil as described in claim 6, characterized in that, In step S1, the stirring and mixing time is 0.5 h to 1 h; and / or In step S2, the mixing time is 1h to 2h.

8. A diamond cutting slurry, characterized in that: The cutting oil according to claims 1 to 5 specifically comprises the following components in parts by weight: 5 to 30 parts diamond abrasive Cutting oil: 70-95 parts.

9. A method for preparing a diamond cutting slurry according to claim 8, characterized in that, The process includes the following steps: adding the prescribed amount of diamond abrasive to the cutting oil and stirring to mix, thus obtaining the diamond cutting slurry.

10. The method for preparing a diamond cutting slurry as described in claim 9, characterized in that, The mixing time is 1 hour to 3 hours; and / or The diamond abrasive has a particle size of 5μm to 30μm.