Construction method of lightweight thermal insulation ALC (autoclaved lightweight concrete) plate

Abstract

The invention relates to the technical field of plate construction, in particular to a construction method of a lightweight thermal insulation ALC (autoclaved lightweight concrete) plate, which comprises the following steps: determining whether the bonding strength of bonding mortar between plate mortises meets the requirements of plate mortise interface characteristics or not based on the actual bonding strength between plates, and determining the reason that the bonding interface does not meet the use requirements; based on the mortise interface characteristic parameters and the mortar workability parameters, determining that the reason for the bonding interface not meeting the use requirements is mortise surface water absorption or mortise surface roughness of the mortise base material, and determining an adjustment strategy of plate construction; the actual amplitude shift of the plate is obtained through a plurality of horizontal thrust to determine the plate stability coefficient, the rigidity stability of the partition wall is determined based on the plate stability coefficient, and the index threshold value of the bonding state index is adjusted in response to the rigidity stability. According to the method, the construction parameters are adaptively adjusted according to the mortise interface characteristic parameters and the mortar workability parameters, so that the mounting precision of the wall is improved.

Description

Technical Field

[0001] This invention relates to the field of panel construction technology, and in particular to a construction method for lightweight thermal insulation ALC panels. Background Technology

[0002] Lightweight thermal insulation ALC board (autoclaved aerated concrete board) is a high-performance building material. Due to its advantages such as being lightweight, heat-insulating, fireproof, and soundproof, it is widely used in building interior walls, exterior walls, and roofing systems.

[0003] Chinese Patent Publication No. CN113513175A discloses a construction method for ALC panel partition walls in low-temperature environments, aiming to solve the technical problem that ALC panel partition walls cannot be constructed in low-temperature environments. This construction method mainly includes steps such as ALC panel layout, sealing and insulation, preheating, adhesive preparation, partition panel assembly, panel surface treatment, and thermal curing. The method is applicable to the installation of lightweight concrete ALC panel partition walls in low-temperature environments with atmospheric temperatures ranging from 5°C to 5°C. It ensures that the strength of the special adhesive mortar for ALC panels meets the requirement of 0.5 MPa after 14 days, guaranteeing that the bonding quality between the lightweight concrete ALC panels meets the specified quality requirements. However, the aforementioned construction method for ALC panel partition walls in low-temperature environments has the following problems: Unable to respond to the impact of the fixed connection process on the perpendicularity and flatness of the board bonding interface, the parameters of the tenon and groove bonding interface and the bonding process are adapted and adjusted based on the characteristics of the board tenon and groove interface and the mortar workability parameters of the bonding interface. Summary of the Invention

[0004] Therefore, the present invention provides a construction method for lightweight thermal insulation ALC board to overcome the problem in the prior art that it cannot respond to the influence of the fixing and connection process on the verticality and flatness of the board bonding interface, and adapts and adjusts the parameters of the tenon and groove bonding interface and the bonding process based on the characteristic parameters of the board's tenon and groove interface and the mortar workability parameters of the bonding interface.

[0005] To achieve the above objectives, the present invention provides a construction method for lightweight thermal insulation ALC boards, comprising: Verticality deviation and flatness deviation are obtained based on the verticality and flatness of a single board, and the bonding state index of the board is determined based on the verticality deviation and flatness deviation. In response to the bonding state index, which determines the bonding state of one of the plates, the degree of influence of the fixing connection process on the bonding interface of the plates is determined, and the perpendicularity and flatness of the plates and the bolt torque in the fixing connection process are adjusted. In response to the degree of influence of the fixed connection process, the boards are pre-assembled, and the relative displacement between the boards is obtained along the tenon and groove direction to determine the initial stiffness. Based on the initial stiffness, it is determined whether the bonding interface between the boards meets the usage requirements. Based on the mortar's fillability and viscosity, determine whether the mortar's rheological properties meet the fluidity requirements for filling the mortar groove, and determine the reasons why the bonding interface does not meet the usage requirements. Based on the actual bonding strength between the boards, determine whether the bonding strength of the bonding mortar between the board tongue and groove meets the requirements of the board tongue and groove interface characteristics, and determine the reasons why the bonding interface does not meet the usage requirements. Based on the mortar interface characteristic parameters and mortar workability parameters, it was determined that the reason why the bonding interface did not meet the usage requirements was the water absorption rate or surface roughness of the mortar surface of the mortar substrate. Adjustment strategies for board construction were then determined. The actual amplitude displacement of the board is obtained by several horizontal thrusts to determine the board stability coefficient. Based on the board stability coefficient, the rigid stability of the partition wall is determined, and the index threshold of the bonding state index is adjusted in response to the rigid stability.

[0006] Furthermore, after the panels are installed and fixed with bolts, the perpendicularity and flatness of the panels are tested to obtain the perpendicularity deviation and flatness deviation of the panels to determine the bonding state index. When the bonding state index is less than or equal to the first index threshold, the board is determined to be in the first bonding state, the installation position is ideal, and the bonding layer of the board is stable. When the bonding state index is greater than the first index threshold and less than or equal to the second index threshold, the board is determined to be in the second bonding state. The fixing connection process causes the bonding interface to slide, and there is a deviation in the installation of the board. When the bonding state index is greater than the second index threshold, it is determined that the installation deviation of the board has exceeded the allowable range of the specification, and it is removed and reinstalled.

[0007] Furthermore, when the plate is in the second bonding state, the verticality and flatness of the plate are adjusted, and the bolt torque is reduced according to the bonding state index. The male and female tenons between pre-assembled panels are subjected to progressive test forces along the direction of the tenons, and the relative displacement at the assembly joints is monitored in real time to determine the initial stiffness. When the initial stiffness is greater than the critical threshold, it is determined that the bonding interface of the male and female tenon grooves of the partition wall meets the usage requirements. When the initial stiffness is less than or equal to the critical threshold, it is determined that there is a defect in the interface bonding, the initial stiffness in the male and female tenon grooves is insufficient, and the bonding interface of the male and female tenon grooves of the partition wall does not meet the usage requirements.

[0008] Furthermore, when the bonding interface of the male and female tenon grooves of the partition wall does not meet the usage requirements, the reason for not meeting the usage requirements shall be determined. The actual bonding strength between the boards, the filling degree of the tenon and groove, and the adjustable time are obtained. When the filling degree of the tenon and groove is higher than the standard filling degree and the mortar viscosity is lower than the viscosity threshold, it is determined that the mortar rheology meets the fluidity requirements of the tenon and groove filling. When the filling degree of the tenon and groove is lower than the standard filling degree and the mortar viscosity is higher than the viscosity threshold, it is determined that the mortar rheology does not meet the fluidity requirements of the tenon and groove filling. The reason why the bonding interface of the male and female tenons and grooves does not meet the usage requirements is the fluidity of the mortar.

[0009] Furthermore, when the fluidity requirements of the mortise and tenon filling are met; When the actual bond strength is greater than or equal to the bond strength threshold, the bond strength of the bonding mortar between the tongue and groove of the board is determined to meet the requirements of the interface characteristics of the tongue and groove of the board. When the actual bonding strength is less than the bonding strength threshold, the bonding strength of the bonding mortar between the tongue and groove of the board is deemed insufficient, and the bonding interface does not meet the usage requirements. The reason is the mortar viscosity.

[0010] Furthermore, when the reason why the bonding interface does not meet the usage requirements is the mortar viscosity, an adjustment strategy is determined based on the characteristics of the tongue and groove interface of the board and the workability parameters of the mortar to address the issue that the bonding interface of the male and female tongue and groove of the partition wall board does not meet the usage requirements.

[0011] Furthermore, the characteristics of the tongue and groove interface of the board include the water absorption rate and surface roughness of the tongue and groove surface, and the mortar workability parameters include adjustable duration.

[0012] Furthermore, if the adjustable duration is less than the minimum preset value and the water absorption rate of the tenon and groove surface is greater than the water absorption rate threshold, it is determined that the tenon and groove substrate excessively absorbs water from the mortar, causing the mortar to lose water rapidly at the interface and resulting in insufficient bond strength development. If the water absorption rate of the tongue and groove surface is less than or equal to the water absorption rate threshold and the surface roughness is less than the roughness threshold, then it is determined that the surface of the tongue and groove interface is too smooth and the mechanical anchoring force between the mortar and the board is insufficient.

[0013] Furthermore, if the surface of the mortise and tenon interface is too smooth, increase the roughness of the mortise and tenon surface; When the water absorption rate of the tongue and groove interface on the board surface leads to insufficient bond strength development, an interface agent is sprayed onto the tongue and groove surface of the board.

[0014] Furthermore, the stability coefficient of the plate is determined by applying a horizontal thrust to obtain the actual amplitude displacement of the plate. When the stability coefficient of the board material is greater than or equal to the stability coefficient threshold, the partition wall formed by connecting the boards is determined to be stable. When the stability coefficient of the board material is less than the stability coefficient threshold, it is determined that the rigidity of the partition wall formed by connecting the materials is insufficient, and the second index threshold is adjusted.

[0015] Compared with existing technologies, the advantages of this invention lie in its ability to achieve refined and intelligent management of ALC partition wall panel construction quality by constructing a multi-level closed-loop control system from single-panel installation and inter-panel assembly to overall wall stability. First, this invention dynamically calculates the bonding state index based on verticality and flatness, providing real-time guidance for installation correction and bolt torque adjustment to ensure precise single-panel placement. Then, by pre-assembling and testing the initial stiffness and mortar rheology of the inter-panel interface, it intelligently diagnoses bonding defects caused by material properties or interface characteristics and generates targeted treatment strategies. Finally, by verifying the overall wall stability coefficient, it reverse-optimizes the control threshold of the preceding processes, forming a negative feedback closed loop. This method effectively improves the installation accuracy, connection reliability, and overall stability of the wall, significantly reduces human error and rework rate, and ensures consistent and efficient construction quality.

[0016] Furthermore, since the boards need to remain in an adhesive state for a certain period of time and are easily affected by subsequent processes, it is necessary to determine the degree of impact of fixing and connection on verticality and flatness. This invention significantly improves the installation accuracy and connection reliability of ALC boards through quantitative evaluation and dynamic control. It detects verticality and flatness deviations in real time after the boards are fixed and innovatively introduces an adhesive state index to classify and judge the installation quality. When in the second adhesive state requiring adjustment, it not only guides manual fine-tuning of the board's position but, more importantly, automatically calculates and adjusts the bolt torque based on the index value, effectively counteracting slippage at the adhesive interface caused by tightening operations. This method transforms the traditional experience-based installation process into a data-driven precision operation, effectively suppressing the accumulation of installation deviations, ensuring the quality of single-board placement and the overall stability of the wall, and reducing subsequent rework and adjustments.

[0017] Furthermore, this invention significantly improves the quality of ALC board tenon and groove splicing through pre-assembly testing and interface performance analysis. By measuring the initial stiffness of the assembly, the reliability of interface bonding can be quickly assessed; when insufficient stiffness is found, a torque sensitivity index is innovatively introduced to quantify the sensitivity of the mortar interface to external forces. By detecting parameters such as actual bond strength and gap filling degree, the root cause of interface defects is accurately diagnosed: when the mortar fluidity is insufficient, the mix ratio is automatically adjusted; when the interface water absorption rate is too high, surface sealing treatment is guided; and when the surface roughness is insufficient, a roughening process is initiated. This method realizes the transformation from "phenomenon judgment" to "mechanism control," effectively solving common quality problems such as incomplete mortar filling and insufficient interface bonding at the tenon and groove splicing, ensuring a strong overall connection between the boards, and greatly improving the structural integrity and service life of the wall.

[0018] Furthermore, this invention pre-assembles the boards in the second bonding state, combining two characteristics of mortar—including mortar rheological properties and mortar shrinkage rate—and the interface characteristics of the board tongue and groove, and analyzes the correlation between interface characteristics and mortar performance, to determine whether there is a risk of premature water loss of mortar due to excessive water absorption of the boards, or a decrease in anchoring force due to an overly smooth surface, and to determine whether it is necessary to perform surface treatment on the board tongue and groove before assembling the boards to control the water absorption rate. This targeted regulation effectively solves the core problems of premature water loss of mortar and insufficient mechanical anchoring force, significantly improves the density and bonding reliability of the tongue and groove splicing, eliminates the risk of board seam cracking from the root, and ensures the integrity and durability of the wall.

[0019] Furthermore, this invention assesses overall construction quality by applying a standard horizontal thrust to the wall after construction and measuring the displacement, thereby calculating an objective wall stability coefficient. When the stability coefficient is insufficient, it automatically reduces the allowable deviations in verticality and flatness during installation (the second index threshold) proportionally, prompting subsequent construction to adopt stricter quality standards. This dynamic adjustment mechanism based on overall performance feedback forms a closed-loop quality control from single-panel installation to wall stability, effectively ensuring the safety and durability of the wall structure and significantly improving the reliability and consistency of engineering construction quality. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the construction method of the lightweight thermal insulation ALC board in an embodiment of the present invention; Figure 2 This is a schematic diagram of the male and female tenon joints of the partition wall panel in an embodiment of the present invention; Figure 3 This is a flowchart illustrating the process of determining the bonding state of the board material in an embodiment of the present invention; Figure 4 This is a schematic diagram of the process for adjusting the index threshold of the bonding state index in an embodiment of the present invention; In the diagram: 1-board material, 2-male tenon, 3-female tenon. Detailed Implementation

[0021] To make the objectives and advantages of the present invention clearer, the present invention will be further described below with reference to embodiments; it should be understood that the specific embodiments described herein are merely for explaining the present invention and are not intended to limit the present invention.

[0022] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0023] It should be noted that in the description of this invention, the terms "upper", "lower", "left", "right", "inner", "outer", etc., which indicate directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. This is only for the convenience of description and is not intended to indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this invention.

[0024] Furthermore, it should be noted that, in the description of this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0025] Please see Figures 1-4 As shown, Figure 1 This is a schematic diagram of the construction method of the lightweight thermal insulation ALC board in an embodiment of the present invention; Figure 2 This is a schematic diagram of the male and female tenon joints of the partition wall panel in an embodiment of the present invention; Figure 3 This is a flowchart illustrating the process of determining the bonding state of the board material in an embodiment of the present invention; Figure 4 This is a schematic diagram of the process for adjusting the index threshold of the bonding state index in an embodiment of the present invention.

[0026] This invention provides a construction method for lightweight thermal insulation ALC boards, comprising: Step S1: Obtain verticality deviation and flatness deviation based on the verticality and flatness of a single board, and determine the bonding state index of the board based on the verticality deviation and flatness deviation. Step S2: In response to the bonding state of one of the plates determined by the bonding state index, determine the degree of influence of the fixing connection process on the bonding interface of the plates, and adjust the verticality and flatness of the plates and the bolt torque in the fixing connection process. Step S3: In response to the influence of the fixed connection process, pre-assemble the boards, obtain the relative displacement between the boards along the tenon and groove direction to determine the initial stiffness, and determine whether the bonding interface between the boards meets the usage requirements based on the initial stiffness. Step S4: Based on the mortar gap filling degree and mortar viscosity, determine whether the mortar rheology meets the fluidity requirements of mortar filling and determine the reason why the bonding interface does not meet the usage requirements. Step S5: Based on the actual bonding strength between the boards, determine whether the bonding strength of the bonding mortar between the board tongue and groove meets the requirements of the board tongue and groove interface characteristics, and determine the reason why the bonding interface does not meet the usage requirements. Step S6: Based on the mortise and tenon interface characteristic parameters and mortar workability parameters, determine that the reason why the bonding interface does not meet the usage requirements is the water absorption rate of the mortise and tenon surface of the mortise and tenon substrate or the surface roughness of the mortise and tenon surface, and determine the adjustment strategy for board construction. Step S7: Obtain the actual amplitude displacement of the board through several horizontal thrusts to determine the board stability coefficient, determine the rigid stability of the partition wall based on the board stability coefficient, and adjust the index threshold of the bonding state index in response to the rigid stability.

[0027] Specifically, the beneficial effects of this invention lie in achieving refined and intelligent management of ALC partition wall panel construction quality by constructing a multi-level closed-loop control system from single-panel installation and inter-panel assembly to overall wall stability. First, this invention dynamically calculates the bonding state index based on verticality and flatness, providing real-time guidance for installation correction and bolt torque adjustment to ensure precise single-panel placement. Then, by pre-assembling and testing the initial stiffness and mortar rheology of the inter-panel interface, it intelligently diagnoses bonding defects caused by material properties or interface characteristics and generates targeted treatment strategies. Finally, by verifying the overall wall stability coefficient, it reverse-optimizes the control threshold of the preceding processes, forming a negative feedback closed loop. This method effectively improves the installation accuracy, connection reliability, and overall stability of the wall, significantly reduces human error and rework rate, and ensures consistent and efficient construction quality.

[0028] In this embodiment, the ALC insulation board is an ALC partition board, and the partition board has male and female tenon grooves on both sides.

[0029] The core process of the construction method for thermal insulation ALC boards is the board installation process, which includes the following steps: installation, fixing and connection, and quality correction. Prepare the bonding mortar and boards, apply the bonding mortar to the preset position of the boards, transport the boards to the installation position and then bond the boards to the upper and lower floor slabs with mortar. During the implementation, the fixing and connection process is carried out by bolt fixing.

[0030] During implementation, the panels are fixed and connected in the vertical and horizontal directions using connectors. Pipe clamps are installed at the top of the panels corresponding to the bottom of the beams, and expansion bolts are used to fix them to the structural beams. Through the gap at the bottom of the board, the board is fixed to the floor with hook bolts. One end of the hook bolt hooks onto the embedded part at the bottom of the board, and the other end is fixed to the ground with expansion bolts. After adjusting the verticality of the board, fix the top pipe clamp to the embedded part on the side of the board with bolts. A gap of 10-15mm should be left between the boards for filling with special mortar.

[0031] During implementation, the quality correction process involves checking the verticality and flatness of each board after it has been installed using a 2-meter straightedge and a plumb line.

[0032] Use a crowbar and rubber mallet to fine-tune the verticality and flatness of the boards to ensure that the wall is within the allowable deviation, typically with verticality ≤3mm and flatness ≤3mm.

[0033] After the plates are installed and fixed with bolts The perpendicularity and flatness of the board are detected, and the perpendicularity deviation and flatness deviation of the board are calculated. The perpendicularity deviation is the deviation value of the perpendicularity of the board from 90 degrees, and the flatness deviation is the angular deviation value of the bottom edge centerline of the board from the marked position line. The bonding state index is calculated based on the perpendicularity deviation and flatness deviation of the board material. The bonding state index = ; When the bonding state index is less than or equal to the first index threshold, the board is determined to be in the first bonding state, the installation position is ideal, and the bonding layer of the board is stable. When the bonding state index is greater than the first index threshold and less than or equal to the second index threshold, the board is determined to be in the second bonding state. The fixing connection process causes the bonding interface to slide, and there is a deviation in the installation of the board. When the bonding state index is greater than the second index threshold, it is determined that the installation deviation of the board has exceeded the allowable range of the specification, and it is removed and reinstalled. In practice, the first index threshold is 2 mm and the second index threshold is 4 mm.

[0034] In the second bonding state, it is necessary to adjust the verticality and flatness of the board on the one hand, and the torque of the bolts in the fixing connection process on the other hand. When the board is in the second bonding state, adjust the verticality and flatness of the board, and adjust the bolt torque according to the bonding state index; Specifically, the bolt torque is reduced based on the ratio of the first index threshold to the bond state index; During implementation, the personnel used correction tools such as rubber mallets to fine-tune the boards to eliminate deviations.

[0035] Understandably, the second bonding state indicates that the fixing and connection process affects the bonding interface after the bonding mortar is applied, resulting in slight slippage. Therefore, further analysis is needed.

[0036] Specifically, since the boards need to remain in an adhesive state for a certain period of time, they are easily affected by subsequent processes. Therefore, it is necessary to determine the degree of impact of fixing and connection on verticality and flatness. This invention significantly improves the installation accuracy and connection reliability of ALC boards through quantitative evaluation and dynamic control. It detects verticality and flatness deviations in real time after the boards are fixed and innovatively introduces an adhesive state index to classify and judge the installation quality. When in the second adhesive state requiring adjustment, it not only guides manual fine-tuning of the board's position but, more importantly, automatically calculates and adjusts the bolt torque based on the index value, effectively counteracting slippage at the adhesive interface caused by tightening operations. This method transforms the traditional experience-based installation process into a data-driven precision operation, effectively suppressing the accumulation of installation deviations, ensuring the quality of single-board placement and the overall stability of the wall, and reducing subsequent rework and adjustments.

[0037] ALC lightweight partition wall panel material is a newly developed energy-saving and environmentally friendly wall material. It is a wall material that looks like a hollow floor slab, but it has male and female tongue and groove on both sides. During installation, you only need to stand the board up, apply a small amount of jointing mortar to the male and female tongue and groove, and then assemble it.

[0038] The male and female tenons of the sample partition wall panel are pre-assembled, and a progressive test force is applied along the direction of the tenons to monitor the relative displacement at the assembly joint in real time. Calculate the initial stiffness, where the initial stiffness = change in test force / change in relative displacement. The initial stiffness reflects the ability of the adhesive interface to resist deformation under small external forces.

[0039] When the initial stiffness is greater than the critical threshold, it is determined that the bonding interface of the male and female tenon grooves of the partition wall meets the usage requirements. When the initial stiffness is less than or equal to the critical threshold, it is determined that there is a defect in the interface bonding, the initial stiffness in the male and female tenon grooves is insufficient, and the bonding interface of the male and female tenon grooves of the partition wall panel does not meet the usage requirements. When the bonding interface of the male and female tongue and groove of the partition wall does not meet the usage requirements, determine the reason for the non-compliance. Specifically, the torque sensitivity index is calculated, which is calculated as the bond state index divided by the actual torque value. This index reflects the change in the bond state index caused by a unit torque. The larger the torque sensitivity index, the more sensitive the current mortar bond layer is to the fastening operation, the weaker its resistance to deformation, and the more unstable the interface.

[0040] The actual bonding strength, tenon and groove gap filling degree, and adjustable duration of the pre-assembled sample partition panels are tested to determine the mortar rheological properties. When the filling degree of the tenon and groove is lower than the standard filling degree and the mortar viscosity is higher than the viscosity threshold, it is determined that the mortar rheology does not meet the fluidity requirements of the tenon and groove filling. The reason why the bonding interface of the male and female tenons and grooves does not meet the usage requirements is the fluidity of the mortar.

[0041] The standard filling degree ranges from 92% to 98%, and the viscosity threshold ranges from 45 Pa·s to 55 Pa·s.

[0042] When the filling degree of the tenon groove is higher than the standard filling degree and the mortar viscosity is lower than the viscosity threshold, the mortar rheology is determined to meet the fluidity requirements of the tenon groove filling. The rheological properties and shrinkage rate of mortar are correlated with the surface water absorption rate and roughness of the tongue and groove interface of the board. Specifically, when the actual bond strength is greater than or equal to the bond strength threshold, the bond strength of the bonding mortar between the tongue and groove of the board is determined to meet the requirements of the interface characteristics of the tongue and groove of the board. When the actual bonding strength is less than the bonding strength threshold, the reason why the bonding strength of the bonding mortar between the tongue and groove of the board is insufficient and the bonding interface does not meet the usage requirements is the mortar viscosity. When the reason why the bonding interface does not meet the requirements is the mortar viscosity, the adjustment strategy for the bonding interface of the male and female tenons of the partition wall board that does not meet the requirements is determined based on the surface water absorption rate and actual roughness of the tenon and groove interface characteristics of the board. Cross-correlation analysis was performed between the tenon and groove interface characteristic parameters and the mortar workability parameters to obtain the adjustable time for the sample partition board test, and the water absorption rate and surface roughness of the tenon and groove surface for board quality inspection. Specifically, if the adjustable duration is less than the minimum preset value and the water absorption rate of the tenon and groove surface is greater than the water absorption rate threshold, it is determined that the tenon and groove substrate has excessively absorbed the water in the mortar, causing the mortar to lose water rapidly at the interface and the bonding strength to be insufficient. If the water absorption rate of the tongue and groove surface is less than or equal to the water absorption rate threshold and the surface roughness is less than the roughness threshold, then it is judged that the surface of the tongue and groove interface is too smooth and the mechanical anchoring force between the mortar and the board is insufficient. In practice, the bonding strength threshold ranges from 0.50 MPa to 0.70 MPa, with a minimum preset value of 20 min, and the water absorption threshold ranges from 10% to 15%.

[0043] Understandably, when the surface roughness is too low to provide sufficient "interlocking" structure for the hardened mortar, the mechanical interlocking effect is greatly weakened; even if the mortar itself has high strength, its bonding interface with the smooth substrate becomes the weakest link under stress, and it is prone to interface peeling when subjected to load.

[0044] Specifically, this invention significantly improves the quality of ALC board tenon and groove splicing through pre-assembly testing and interface performance analysis. By measuring the initial stiffness of the assembly, the reliability of interface bonding can be quickly assessed; when insufficient stiffness is found, a torque sensitivity index is innovatively introduced to quantify the sensitivity of the mortar interface to external forces. By detecting parameters such as actual bond strength and gap filling degree, the root cause of interface defects is accurately diagnosed: when the mortar fluidity is insufficient, the mix ratio is automatically adjusted; when the interface water absorption rate is too high, surface sealing treatment is guided; and when the surface roughness is insufficient, a roughening process is initiated. This method realizes the transformation from "phenomenon judgment" to "mechanism control," effectively solving common quality problems such as incomplete mortar filling and insufficient interface bonding at the tenon and groove splicing, ensuring a strong overall connection between the boards, and greatly improving the structural integrity and service life of the wall.

[0045] Based on the surface water absorption rate and actual roughness of the tongue and groove interface characteristics of the board, determine the adjustment strategy for the bonding interface of the male and female tongue and groove of the partition board that does not meet the usage requirements. Specifically, when the water absorption rate of the tongue and groove interface on the board surface leads to insufficient bond strength development, an interface agent is sprayed onto the tongue and groove surface of the board. During implementation, before the panels are transported to the assembly station, operators use a metered spraying device to evenly spray a layer of water-based epoxy or acrylic interface agent onto the surface of the male and female tongue and groove joints. The spraying amount is calculated based on the difference between the measured water absorption rate and the target water absorption rate, and is usually controlled at 200-300 g / m². 2 .

[0046] The interface agent can quickly penetrate into the open pores on the surface of the ALC board, forming a dense film. This film physically prevents the tongue and groove substrate from absorbing moisture excessively and rapidly from the bonding mortar, thereby ensuring that the mortar has sufficient moisture and time at the tongue and groove interface, i.e., the adjustable time, to complete the hydration reaction. Interface agent is a polymer material with adhesive properties. It can form an intermediate transition layer between the board substrate and the mortar, and bond tightly to the board surface through chemical bonding force. At the same time, it can form a strong bond with the cementitious material of the mortar, thereby improving the overall bonding strength between the mortar and the board.

[0047] Specifically, when the surface of the mortise and tenon interface is too smooth, increase the roughness of the mortise and tenon surface; During implementation, the travel speed and processing depth of the processing equipment are set according to the difference between the current roughness and the target roughness to ensure that the surface roughness value after processing is not less than 0.5mm.

[0048] Specifically, this invention involves pre-assembling boards in a second bonding state. By combining two characteristics of mortar—rheological properties and shrinkage rate—with the interfacial characteristics of the board tongue and groove, the interfacial characteristics are correlated with mortar performance. This analysis determines whether there is a risk of premature water loss in the mortar due to excessive water absorption by the boards, or a decrease in anchoring force due to an overly smooth surface. It also determines whether surface treatment of the board tongue and groove is necessary before assembling the boards to control water absorption. This targeted regulation effectively solves the core problems of premature water loss in mortar and insufficient mechanical anchoring force, significantly improving the density and bonding reliability of the tongue and groove joints. It eliminates the risk of board seam cracking from the root, ensuring the integrity and durability of the wall.

[0049] After construction is completed, a standardized horizontal thrust is applied to different parts of several plates using a thrust gauge to measure the actual amplitude displacement of the plates and determine the plate stability coefficient. The plate stability coefficient is calculated as: horizontal thrust / average value of each actual amplitude displacement. When the stability coefficient of the board material is greater than or equal to the stability coefficient threshold, the partition wall formed by connecting the boards is determined to be stable. When the stability coefficient of the board is less than the stability coefficient threshold, it is determined that the rigidity of the partition wall formed by connecting the boards is insufficient, and the second index threshold is adjusted. In practice, the second index threshold is reduced based on the ratio of the plate stability coefficient to the stability coefficient threshold, wherein the stability coefficient threshold ranges from 1.5 kN / mm to 2.5 kN / mm.

[0050] Specifically, this invention assesses overall construction quality by applying a standard horizontal thrust to the wall after construction and measuring the displacement, calculating an objective wall stability coefficient. When the stability coefficient is insufficient, it automatically reduces the allowable deviations (second index threshold) of verticality and flatness during installation proportionally, prompting subsequent construction to adopt stricter quality standards. This dynamic adjustment mechanism based on overall performance feedback forms a closed-loop quality control from single-panel installation to wall stability, effectively ensuring the safety and durability of the wall structure and significantly improving the reliability and consistency of engineering construction quality.

[0051] The technical solution of the present invention has been described above with reference to the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the scope of protection of the present invention is obviously not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the scope of protection of the present invention.

[0052] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A construction method for a lightweight thermal insulation ALC board, characterized in that, include: Verticality deviation and flatness deviation are obtained based on the verticality and flatness of a single board, and the bonding state index of the board is determined based on the verticality deviation and flatness deviation. In response to the bonding state index, which determines the bonding state of one of the plates, the degree of influence of the fixing connection process on the bonding interface of the plates is determined, and the perpendicularity and flatness of the plates and the bolt torque in the fixing connection process are adjusted. Based on the degree of influence of the fixed connection process on the bonding interface of the boards, the boards are pre-assembled, and the relative displacement between the boards is obtained along the tenon and groove direction to determine the initial stiffness. Based on the initial stiffness, it is determined whether the bonding interface between the boards meets the usage requirements. Based on the filling degree of the tenon and groove and the viscosity of the mortar, determine whether the rheological properties of the mortar meet the fluidity requirements of the tenon and groove filling. Based on the actual bonding strength between the boards, determine whether the bonding strength of the bonding mortar between the tenon and groove of the boards meets the requirements of the tenon and groove interface characteristics of the boards, and determine the reasons why the bonding interface does not meet the usage requirements. Based on the mortar interface characteristic parameters and mortar workability parameters, it was determined that the reason why the bonding interface did not meet the usage requirements was the water absorption rate or surface roughness of the mortar surface of the mortar substrate. Adjustment strategies for board construction were then determined. The actual amplitude displacement of the board is obtained by several horizontal thrusts to determine the board stability coefficient. Based on the board stability coefficient, the rigid stability of the partition wall is determined, and the index threshold of the bonding state index is adjusted in response to the rigid stability.

2. The construction method of the lightweight thermal insulation ALC board according to claim 1, characterized in that, Based on the completed installation and fixing connection of the board, the verticality and flatness of the board are detected to obtain the verticality deviation and flatness deviation of the board to determine the bonding state index. When the bonding state index is less than or equal to the first index threshold, the board is determined to be in the first bonding state, the installation position is ideal, and the bonding layer of the board is stable. When the bonding state index is greater than the first index threshold and less than or equal to the second index threshold, the board is determined to be in the second bonding state. The fixing connection process causes the bonding interface to slide, and there is a deviation in the installation of the board. When the bonding state index is greater than the second index threshold, the board is determined to be in the third bonding state. The installation deviation of the board has exceeded the allowable range of the specification, and it is removed and reinstalled.

3. The construction method of the lightweight thermal insulation ALC board according to claim 2, characterized in that, When the board is in the second bonding state, adjust the perpendicularity and flatness of the board, and reduce the bolt torque according to the bonding state index; The male and female tenons between pre-assembled panels are subjected to progressive test forces along the direction of the tenons, and the relative displacement at the assembly joints is monitored in real time to determine the initial stiffness. When the initial stiffness is greater than the critical threshold, it is determined that the bonding interface of the male and female tenon grooves of the partition wall meets the usage requirements. When the initial stiffness is less than or equal to the critical threshold, it is determined that there is a defect in the interface bonding, the initial stiffness in the male and female tenon grooves is insufficient, and the bonding interface of the male and female tenon grooves of the partition wall does not meet the usage requirements.

4. The construction method of the lightweight thermal insulation ALC board according to claim 3, characterized in that, When the bonding interface of the male and female tongue and groove of the partition wall does not meet the usage requirements, determine the reason for the non-compliance. The actual bonding strength between the boards, the filling degree of the tenon and groove, and the adjustable time are obtained. When the filling degree of the tenon and groove is higher than the standard filling degree and the mortar viscosity is lower than the viscosity threshold, it is determined that the mortar rheology meets the fluidity requirements of the tenon and groove filling. When the filling degree of the tenon and groove is lower than the standard filling degree and the mortar viscosity is higher than the viscosity threshold, it is determined that the mortar rheology does not meet the fluidity requirements of the tenon and groove filling. The reason why the bonding interface of the male and female tenons and grooves does not meet the usage requirements is the fluidity of the mortar.

5. The construction method of the lightweight thermal insulation ALC board according to claim 4, characterized in that, When the fluidity requirements of the mortise and tenon filling are met; When the actual bond strength is greater than or equal to the bond strength threshold, the bond strength of the bonding mortar between the tongue and groove of the board is determined to meet the requirements of the interface characteristics of the tongue and groove of the board. When the actual bonding strength is less than the bonding strength threshold, the bonding strength of the bonding mortar between the tongue and groove of the board is deemed insufficient, and the bonding interface does not meet the usage requirements. The reason is the mortar viscosity.

6. The construction method of the lightweight thermal insulation ALC board according to claim 5, characterized in that, The reason why the bonding interface does not meet the usage requirements is the mortar viscosity. Based on the characteristics of the tongue and groove interface of the board and the workability parameters of the mortar, it is determined that the bonding interface of the male and female tongue and groove of the partition board does not meet the usage requirements. Therefore, the roughness of the tongue and groove surface or the water absorption rate of the tongue and groove surface is adjusted.

7. The construction method of the lightweight thermal insulation ALC board according to claim 6, characterized in that, The characteristics of the tongue and groove interface of the board include the water absorption rate and surface roughness of the tongue and groove surface, and the mortar workability parameters include the adjustable duration.

8. The construction method of the lightweight thermal insulation ALC board according to claim 7, characterized in that, If the adjustable duration is less than the minimum preset value and the water absorption rate of the tenon and groove surface is greater than the water absorption rate threshold, it is determined that the tenon and groove substrate has excessively absorbed the water in the mortar, causing the mortar to lose water rapidly at the interface and the bonding strength to be insufficient. If the water absorption rate of the tongue and groove surface is less than or equal to the water absorption rate threshold and the surface roughness is less than the roughness threshold, then it is determined that the surface of the tongue and groove interface is too smooth and the mechanical anchoring force between the mortar and the board is insufficient.

9. The construction method of the lightweight thermal insulation ALC board according to claim 8, characterized in that, When the surface of the mortise and tenon joint is too smooth, increase the roughness of the mortise and tenon surface; When the water absorption rate of the tongue and groove interface on the board surface leads to insufficient bond strength development, an interface agent is sprayed onto the tongue and groove surface of the board.

10. The construction method of the lightweight thermal insulation ALC board according to claim 9, characterized in that, Apply a horizontal thrust to obtain the actual amplitude displacement of the plate and determine the plate stability coefficient; When the stability coefficient of the board material is greater than or equal to the stability coefficient threshold, the partition wall formed by connecting the boards is determined to be stable. When the stability coefficient of the board is less than the stability coefficient threshold, it is determined that the rigidity of the partition wall formed by connecting the boards is insufficient, and the second index threshold is adjusted.

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