LED circuit board structure with fireproof flame-retardant layer

Abstract

According to the LED circuit board structure with the fireproof flame-retardant layer, a plurality of heat dissipation grooves are formed in a circuit main board, LED lamp beads are installed on conductive deformation pieces capable of elastically deforming, and the LED lamp beads are attached to the side walls of the heat dissipation grooves through elastic bent sections and located at the normal light emitting position. An elastic supporting covering piece is arranged in each heat dissipation groove, the two sides of each elastic supporting covering piece are pressed and positioned through pressing plates, and the pressing plates are kept in a downward pressing state through damage supporting pieces. When the circuit board is short-circuited and ignited or is burnt by external flames, the damage supporting piece is heated to be rapidly broken, the pressing plate is reset, the elastic supporting covering piece moves upwards along the guide sliding rail and is elastically unfolded, and the internal flame-retardant film expands to form a fireproof flame-retardant layer covering the LED lamp beads and the conductive deformation piece. According to the invention, the heat dissipation efficiency is ensured in a normal state, flame-retardant protection is actively formed in a fire environment, and the safety and reliability of the LED circuit board are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of circuit board, in particular to an LED circuit board structure with fireproof flame-retardant layer. BACKGROUND

[0002] In the existing LED circuit board structure, the LED lamp beads are usually directly welded and fixed on the surface position of the circuit mainboard, and the lamp beads are arranged in large numbers, so that the circuit board generates high heat under the condition of long-time lighting or high-power working, and the heat dissipation capacity of the circuit board itself is limited, resulting in that the accumulated heat is difficult to be discharged in time. Especially in the case of arranging the LED lamp beads in rows in a dense manner, the heat dissipation path is limited, and the local temperature rise is significantly increased, which easily causes problems such as device aging, soldering point falling off, light decay acceleration and the like, seriously affecting the stability and service life of the product. More importantly, in the traditional LED circuit board, the LED lamp beads are fixedly installed, once the circuit board appears short circuit, power breakdown, or there is flame, high temperature burning in the external environment, the LED lamp beads will be directly exposed to the fire environment, and the LED lamp beads are easily subjected to thermal decomposition, explosion or melting and dripping, further causing more serious secondary damage, and cannot play the role of active flame-retardant and heat insulation protection.

[0003] In the prior art, in order to improve the heat dissipation effect of the LED lamp beads, some schemes try to increase the heat dissipation holes, metal heat conduction sheets or strengthen the heat channel on the back of the circuit board to improve the heat dissipation efficiency, but these measures can only assist in cooling under normal working conditions, and still cannot provide effective fireproof flame-retardant protection in the case of short circuit fire or external flame burning. In addition, the existing circuit board structure generally lacks active response type safety mechanism, and the fixed LED lamp bead structure makes the lamp beads in a completely exposed state no matter internal short circuit or external high temperature occurs, and the lamp beads are easily a weak point causing fire spread.

[0004] Therefore, an LED circuit board capable of maintaining good heat dissipation under normal working condition and automatically forming a fireproof flame-retardant structure when encountering fire source or high temperature impact is needed. SUMMARY

[0005] In order to solve the above problems, the present application provides an LED circuit board structure with fireproof flame-retardant layer, which forms a double fireproof structure by the groove formed by the conductive deformation part and the flame-retardant layer formed by the elastic support cover, so that the LED lamp beads can be quickly isolated under the condition of fire or high temperature environment, and the risk of lamp bead explosion, melting and dripping or further spread is avoided, and the technical defect that the traditional LED circuit board cannot automatically perform fire safety protection due to the fixed lamp bead structure is fundamentally solved.

[0006] The present application is realized by the following technical scheme: an LED circuit board structure with fireproof flame-retardant layer, comprising: The circuit mainboard is provided with one or more than one heat dissipation groove on the upper end surface along the width direction of the circuit mainboard. The conductive layer is embedded in the circuit mainboard. The conductive deformation member is elastically bent at one end to form an elastic bending section and is in conductive connection with the conductive layer, and the conductive deformation member is elastically deformed to be attached to one side of each heat dissipation groove. The conductive deformation member is provided with a solder pad along the length direction of the conductive deformation member, and each LED lamp bead is arranged on the solder pad. When the conductive deformation member is elastically deformed and attached to one side of the heat dissipation groove, each LED lamp bead is located on the upper end surface of the circuit mainboard. The elastic supporting cover is arranged in each heat dissipation groove and is used for positioning and pressing the elastically deformed conductive deformation member, so that the conductive deformation member is in an elastically deformed state. The positioning base is fixedly arranged on both sides of the circuit mainboard, and an active cavity is formed between the positioning base and the upper end surface of the circuit mainboard. The pressing plate is arranged in each active cavity, and the two sides of the elastic supporting cover are respectively inserted into the active cavity and are pressed by the pressing plate. The elastic supporting cover is positioned and maintained in the heat dissipation groove by the pressing plate. The destruction supporting member is arranged on the upper end of the pressing plate and is used for keeping the pressing plate in a pressed state. When the destruction supporting member is destroyed by fire, the pressing plate is reset, and the elastic supporting cover is elastically expanded along the guide rail to form a fireproof flame-retardant layer covering the top of each conductive deformation member and LED lamp bead. When each elastic supporting cover is elastically expanded, each guide deformation member is restored to be elastically deformed and is buckled into the heat dissipation groove.

[0007] As a preferred technical solution, the conductive deformation member comprises an elastic outer protective layer and a conductive connection layer embedded in the outer protective layer, and the conductive connection layer is connected with the conductive layer in the circuit mainboard.

[0008] As a preferred technical solution, the conductive deformation member comprises the elastic bending section, an L-shaped connection section and a closed protruding section. The solder pad is arranged on the L-shaped connection section. One end of the L-shaped connection section is connected with the elastic bending section, and the other end is connected with the closed protruding section. When each guide deformation member is restored to be elastically deformed and buckled into the heat dissipation groove, the closed protruding section is buckled on the top of the heat dissipation groove. At this time, each LED lamp bead is located on the lower end surface of the closed protruding section and is arranged vertically to the horizontal plane.

[0009] Preferably, the outer protective layer outside the L-shaped connecting section and the closed protruding section is made of hard plastic material, and the outer protective layer outside the elastic bending section is made of elastic plastic.

[0010] Preferably, the elastic supporting cover includes a first cover part and a second cover part, and the first cover part and the second cover part are internally formed with a containing cavity, and a wrinkle-shaped elastic compression fireproof flame-retardant film is arranged in the containing cavity of the first cover part and the second cover part, and the wrinkle-shaped elastic compression fireproof flame-retardant film elastically expands the first cover part and the second cover part when the first cover part and the second cover part are separated from the heat dissipation groove along the guide slide rail.

[0011] Preferably, the guide slide rail includes longitudinal slide rails and a transverse slide rail, each longitudinal slide rail is in communication with the transverse slide rail, and the first cover part and the second cover part are provided with protruding guide slide blocks corresponding to the positions of the longitudinal slide rails, and the guide slide blocks can be guided to move along the longitudinal slide rails and the transverse slide rail.

[0012] Preferably, the bottom of the longitudinal slide rail is provided with a first spring, and the first spring is compressed when the elastic supporting cover is located in the heat dissipation groove.

[0013] Preferably, the top of the pressing plate is further provided with one or more second springs, one end of the second spring is fixedly connected with the positioning base, and the other end of the second spring is fixedly connected with the pressing plate, and each second spring is in an elastic stretching state when the pressing plate is in a pressed state.

[0014] Preferably, the first cover part and the second cover part are made of heat-conducting metal material, and are used for conducting heat dissipation of the LED lamp beads.

[0015] Preferably, the positioning base is internally formed with a heat dissipation air guide channel in the width direction, and the heat dissipation air guide channel is in communication with each heat dissipation groove.

[0016] The present application has the following advantages: all LED lamp beads are installed on the conductive deforming member with elasticity and deformability, and through the unique elastic bending section and the buckling structure, the LED lamp beads are in the working position above the main circuit board in the normal state, and once the support member is fused or damaged due to high temperature or fire, the conductive deforming member can quickly recover elasticity and automatically flip and buckle into the heat dissipation groove originally used for heat dissipation, so that the LED lamp beads are entirely sunk into the groove and the heat dissipation groove is closed by the conductive deforming member.

[0017] Meanwhile, the elastic support cover previously used for assisting heat dissipation rises along the guide slide rail after losing the restriction of the pressing plate and is automatically elastically expanded, and the originally wrinkled and compressed fireproof flame-retardant film inside is immediately fully expanded and covers above the LED lamp beads to form a second layer of active flame-retardant barrier. The groove formed by the conductive deformation piece and the flame-retardant layer formed by the elastic support cover jointly constitute a double fireproof structure, so that the LED lamp beads can be quickly isolated in a fire or high-temperature environment to avoid the risk of lamp bead explosion, melting and dripping or further spreading. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor based on these drawings.

[0019] Figure 1 It is a schematic diagram of the overall structure of the present application. Figure 2 It is an enlarged view of the front partial structure of the present application. Figure 3 It is a cross-sectional schematic diagram of the present application. Figure 1 Figure 4 It is a partial enlarged view of A in the present application. Figure 3 Figure 5 It is a cross-sectional schematic diagram of the present application. Figure 2 Explanation of reference signs: 1, main board of circuit; 10, heat dissipation groove; 6, conductive deformation piece; 61, elastic bending section; 5, LED lamp bead; 3, elastic support cover; 2, positioning base; 4, pressing plate; 7, breaking support piece; 62, L-shaped connecting section; 63, closed protruding section; 31, first covering part; 32, second covering part; 33, fireproof flame-retardant film; 14, longitudinal slide rail; 13, transverse slide rail; 12, first spring; 11, second spring; 8, heat dissipation air guide channel. DETAILED DESCRIPTION

[0020] All features disclosed in this specification, or all steps of any methods or processes disclosed, can be combined in any combination, except combinations where at least some of the features and / or steps are mutually exclusive.

[0021] ​​​Any feature in the foregoing specification that is presented in terms of a single combination of features should also be perceived as presented in terms of any one of the individual features or any combination of two or more of the features.

[0022] As Figures 1-5 shown in the embodiment, an LED circuit board with a fireproof flame-retardant layer, the main body of which comprises a circuit main board 1, in this embodiment, the size of the circuit main board is 320*160mm, a plurality of heat dissipation grooves 10 are equidistantly arranged on the upper end surface of the circuit main board 1 along the width direction thereof, each heat dissipation groove 10 is in the form of a downwardly recessed strip groove structure, and is used to form a heat dissipation channel for the LED lamp beads 5 in normal operation, so as to reduce the temperature rise of the lamp beads in a long-term heating state.

[0023] A conductive layer is embedded in the circuit main board 1, and is in electrical communication with an external power supply loop, and is used to provide stable working current to each LED lamp bead 5.

[0024] In order to make the installation of the LED lamp beads 5 no longer fixed to the surface layer of the circuit main board 1, the deformable conductive deformation piece 6 is used as the direct bearing structure of the lamp beads in this embodiment.

[0025] The conductive deformation piece 6 can be formed by elastically bending one end thereof to form an elastic bending section 61, the elastic bending section 61 is in conductive connection with the conductive layer in the circuit main board 1, so that the conductive deformation piece 6 has the ability of controllable elastic deformation while maintaining the conductive function.

[0026] The side edge of the conductive deformation piece 6 can be attached to the side wall position of the heat dissipation groove 10 under the driving of the elastic bending section 61, and a plurality of solder pads are arranged on the outer surface thereof along the length direction, and each solder pad is soldered with an LED lamp bead 5, so that the LED lamp bead 5 is in the working position of the upper end surface of the circuit main board 1 under the support of the elastic bending section 61.

[0027] The conductive deformation piece 6 preferably adopts an elastic outer protective layer structure, and a conductive connection layer is embedded in the inner part of the outer protective layer, the conductive connection layer is connected with the conductive layer in the circuit main board 1 through the elastic bending section 61, and the electrical connection of the LED lamp bead 5 is ensured to be reliable and not affected by the deformation action.

[0028] In order to realize the reversible protection structure of the lamp beads, as Figure 4 shown, the conductive deformation piece 6 specifically comprises an elastic bending section 61, an L-shaped connecting section 62, and a closed protruding section 63. The L-shaped connecting section 62 is used to arrange the solder pads in a suitable direction, so that the LED lamp bead 5 emits light vertically upward in a normal state; The closing protruding section 63 is arranged at the other end of the L-shaped connecting section 62, and when the conductive deformed part 6 is buckled back into the heat dissipation groove 10 due to resetting, the closing protruding section 63 can be tightly buckled at the top position of the heat dissipation groove 10, thereby forming a closed groove structure, so that the LED lamp bead 5 is located at the lower end surface of the closing protruding section 63 and arranged vertically to the horizontal plane.

[0029] In order to ensure smooth deformation and stable structure, the outer protective layer of the L-shaped connecting section 62 and the closing protruding section 63 is made of hard plastic, so as to ensure the support strength after buckling; and the outer protective layer of the elastic bending section 61 is made of elastic plastic, so that it can quickly recover deformation under stress or heat triggering.

[0030] The elastic support cover 3 is arranged inside each heat dissipation groove 10, which is used to press and position the conductive deformed part 6 in the normal working state, so that it maintains the working angle after elastic deformation.

[0031] The elastic support cover 3 includes a first cover part 31 and a second cover part 32, both of which form a containing cavity inside, and a wrinkle-shaped elastic compression fireproof flame-retardant film 33 is arranged in the containing cavity.

[0032] The first cover part 31 and the second cover part 32 are respectively installed on the longitudinal slide rail 14 through corresponding guide sliding blocks, and the plurality of longitudinal slide rails 14 are in communication with the transverse slide rail 13, so that the two cover parts can be guided and moved in the heat dissipation groove 10 along the longitudinal and transverse directions.

[0033] When the elastic support cover 3 is pressed by the pressing plate 4, the bottom part is compressed downward to the first spring 12 at the bottom of the longitudinal slide rail 14, so that the whole cover is in a pressed and locked state.

[0034] The positioning base 2 is fixedly installed on both sides of the circuit mainboard 1, and the movable cavity is formed between the positioning base 2 and the upper end surface of the circuit mainboard 1. After the two sides of the elastic support cover 3 extend into the movable cavity, the pressing plate 4 in the movable cavity is used for pressing and fixing.

[0035] As shown in Figure 5 The second spring 11 is arranged at the top of the pressing plate 4, one end of the second spring 11 is fixed with the positioning base 2, and the other end is fixed with the pressing plate 4. When the pressing plate 4 is in the pressed state, the second spring 11 is stretched, so that the pressing plate 4 has an elastic tendency of upward resetting. In order to keep the pressing plate 4 in the pressed state for a long time, a damage support 7 is arranged at the upper end of the pressing plate 4 in the embodiment, which can melt, break or soften in a high temperature or fire environment, so that the pressing plate 4 loses support in the extreme environment.

[0036] In the specific embodiment, the destruction support 7 can be made of a material that softens, melts or quickly breaks in a high-temperature or flame environment to ensure that it quickly fails when a short-circuit fire or external flame burns, causing the pressing plate 4 to automatically reset. To achieve this controllable thermal destruction effect, the destruction support 7 can be made of a material with a lower melting point or weaker thermal stability, such as polyethylene wax material, hot melt adhesive material, low melting point alloy (such as Bi-Sn low melting point metal alloy), hot melt resin, flammable plastic parts or lightweight materials that easily carbonize and powder at high temperatures, etc. The above materials are only exemplary descriptions of suitable materials, as long as they can quickly fail when triggered by flame or high temperature, causing the pressing plate 4 to lose support and complete the automatic reset action, they can be used as the destruction support 7 of the present application.

[0037] When the circuit board generates high temperature due to internal short circuit or external flame, the destruction support 7 is first heated and broken, losing its support strength. The pressing plate 4 quickly resets upward under the tension of the second spring 11, and the elastic support cover 3 that was originally compressed immediately rises along the guide rail. Since the first spring 12 was originally compressed, the first spring 12 begins to release the elastic force upward at this moment, causing the first cover part 31 and the second cover part 32 to move upward along the longitudinal slide rail 14, move along the transverse slide rail 13 after reaching the limit position, and finally gradually separate and move out of the groove range of the heat dissipation groove 10.

[0038] After the first cover part 31 and the second cover part 32 are separated, the fireproof and flame-retardant film 33 inside, which is in a crumpled and compressed state, quickly and elastically expands without external constraints, pushing the two cover parts to further open outward, forming a large-area expanded flame-retardant cover structure. Multiple elastic support covers 3 simultaneously expand elastically and abut each other, finally forming a continuous fireproof and flame-retardant layer above the entire LED lamp bead 5.

[0039] Inside the elastic support cover 3, to achieve the expected effect of flame barrier, smoke suppression and heat protection, the fireproof and flame-retardant film 33 provided inside can be made of a flame-retardant material with high-temperature resistance, flame impact resistance and repeated elastic expansion performance, to ensure that it is in a crumpled and compressed state in normal state and can quickly and elastically expand after losing external compression. The fireproof and flame-retardant film 33 can be made of materials including but not limited to high-temperature resistant aramid flame-retardant fiber film, silicone-based flame-retardant film, glass fiber reinforced composite flame-retardant cloth, ceramic fiber film, expanded graphite flame-retardant film, polyimide flame-retardant film, high-temperature resistant PVDF flame-retardant film, etc. Among them, aramid cloth and ceramic fiber material have excellent heat resistance and non-combustion performance, silicone-based flame-retardant film has excellent elasticity and high-temperature resistance, and expanded graphite flame-retardant film can quickly expand to form a heat insulation carbon layer after being heated. The present application does not limit the specific type of the above materials, as long as they can maintain non-combustion, heat insulation and structural integrity in a high-temperature environment, and can quickly and elastically expand after being released, they can be used as the fireproof and flame-retardant film 33 material.

[0040] At the same time, since the elastic support cover 3 has completely separated from the heat dissipation groove 10, the elastic deformation energy stored in the elastic bending section 61 of the conductive deformation piece 6 originally pressed against the side of the groove is quickly released after losing the external force restriction, the conductive deformation piece 6 immediately flips inward from the position originally attached to the side wall of the heat dissipation groove 10, the L-shaped connecting section 62 drives the solder pad to turn with the LED lamp bead 5 as a whole, and the closing protruding section 63 is finally buckled on the top of the heat dissipation groove 10 to close the entire heat dissipation groove 10, and the LED lamp bead 5 is flipped to the space below the heat dissipation groove 10. At this time, the LED lamp bead 5 is completely protected inside the groove by the conductive deformation piece 6 and is no longer exposed to external flames or high-temperature gas flow, realizing the first structural passive fireproof isolation.

[0041] Since the first cover part 31 and the second cover part 32 are made of heat-conducting metal materials, they can assist the heat dissipation of the LED lamp bead 5 in normal operation, quickly conducting the heat generated by the lamp bead to the heat dissipation groove 10 and the external air circulation path. For this purpose, the positioning base 2 is formed with a heat dissipation air guide channel 8 in the width direction, and each heat dissipation groove 10 is communicated with the air guide channel, so that the air inside the air duct can form circulation exchange with the inside of the heat dissipation groove 10, thereby further improving the heat dissipation performance.

[0042] Through the above structure, under the action of extreme flame or high temperature, the support 7 is damaged first, the pressing plate 4 is automatically reset, the elastic support cover 3 is separated from the heat dissipation groove 10 and is opened by the internal flame-retardant film to form an external flame-retardant layer, and the conductive deformation piece 6 actively flips and buckles the LED lamp bead 5 into the groove. The two mechanisms act simultaneously and complete the establishment of the double fireproof flame-retardant structure in milliseconds, so that the LED lamp bead 5 obtains the double insulation effect of internal closed protection and external flame-retardant covering, fundamentally solving the technical problems of lack of active safety response of the traditional LED circuit board under high temperature or electrical fault state, and the lamp bead is easily damaged or even causes secondary fire, ensuring the safety and reliability of the LED circuit board under extreme conditions.

[0043] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, any change or replacement without creative labor should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be limited by the protection scope defined in the claims.

Claims

1. An LED circuit board structure with a fire-retardant layer, characterized in that, include: A circuit board (1) has one or more heat dissipation slots (10) equidistantly spaced along the width direction of the circuit board (1) on its upper surface. A conductive layer is embedded within the circuit board (1); The conductive deformable part (6) has one end that is elastically bent to form an elastic bending section (61) and is electrically connected to the conductive layer. The conductive deformable part (6) is attached to one side of each heat dissipation groove (10) after elastic deformation through the elastic bending section (61). The conductive deformable part (6) has pads along its length, and each pad is provided with an LED bead (5). When the conductive deformable part (6) elastically deforms and adheres to one side of the heat sink (10), each LED bead (5) is located on the upper surface of the circuit board (1). An elastic support cover (3) is provided in each of the heat dissipation grooves (10), which is used to position and press the conductive deformable part (6) after elastic deformation, so that the conductive deformable part (6) is in an elastic deformation state. The positioning base (2) is fixedly installed on both sides of the circuit main board (1), and a movable cavity is formed between the positioning base (2) and the upper surface of the circuit main board (1); Pressure plate (4) is provided in each of the movable cavities. The two sides of the elastic support cover (3) extend into the movable cavity and are pressed by the pressure plate (4). The pressure plate (4) positions and holds the elastic support cover (3) in the heat dissipation groove (10). The support member (7) is disposed at the upper end of the pressure plate (4) to keep the pressure plate (4) in a downward state; When the broken support (7) is destroyed by fire, the pressure plate (4) is reset, and the elastic support cover (3) moves along the guide rail and then unfolds elastically. A fireproof and flame-retardant layer is formed by the elastic unfolding of one or more elastic support covers (3) and covers the top of each conductive deformable part (6) and LED lamp bead (5). When each elastic support cover (3) is elastically unfolded, each guide deformation member restores its elastic deformation and snaps into the heat dissipation groove (10).

2. The LED circuit board structure with a fire-retardant layer according to claim 1, characterized in that: The conductive deformable component (6) includes an elastic outer protective layer and a conductive connection layer embedded in the outer protective layer, the conductive connection layer being connected to the conductive layer in the circuit board (1).

3. The LED circuit board structure with a fire-retardant layer according to claim 2, characterized in that: The conductive deformable component (6) includes the elastic bending section (61), the L-shaped connecting section (62), and the closed protrusion section (63). The pad is disposed on the L-shaped connecting section (62). One end of the L-shaped connecting section (62) is connected to the elastic bending section (61), and the other end is connected to the closed protrusion section (63). When each guide deformable component recovers its elastic deformation and is snapped into the heat dissipation groove (10), the closed protrusion section (63) snaps onto the top of the heat dissipation groove (10). At this time, each LED bead (5) is located on the lower end face of the closed protrusion section (63) and is set perpendicular to the horizontal plane.

4. The LED circuit board structure with a fire-retardant layer according to claim 3, characterized in that: The outer protective layer of the L-shaped connecting section (62) and the closed protrusion section (63) is made of rigid plastic material, and the outer protective layer of the elastic bending section (61) is made of elastic plastic.

5. The LED circuit board structure with a fire-retardant layer according to claim 1, characterized in that: The elastic support cover (3) includes a first cover (31) and a second cover (32). The interior of the first cover (31) and the second cover (32) each forms a receiving cavity. A pleated elastically compressed fireproof and flame-retardant film (33) is disposed in the receiving cavity of the first cover (31) and the second cover (32). When the first cover (31) and the second cover (32) are separated from the heat dissipation groove (10) along the guide slide, the pleated elastically compressed fireproof and flame-retardant film (33) elastically expands the first cover (31) and the second cover (32).

6. The LED circuit board structure with a fire-retardant layer according to claim 5, characterized in that: The guide rail includes a longitudinal slide rail (14) and a transverse slide rail (13). Each longitudinal slide rail (14) is connected to the transverse slide rail (13). The first cover (31) and the second cover (32) are provided with protruding guide sliders at positions corresponding to the longitudinal slide rails (14). The guide sliders can be guided to move along the longitudinal slide rails (14) and the transverse slide rails (13).

7. The LED circuit board structure with a fire-retardant layer according to claim 6, characterized in that: Each of the longitudinal slide rails (14) is provided with a first spring (12) at its bottom. When the elastic support cover (3) is located in the heat dissipation groove (10), the first spring (12) is compressed.

8. The LED circuit board structure with a fire-retardant layer according to claim 1, characterized in that: The top of the pressure plate (4) is also provided with one or more second springs (11). One end of the second spring (11) is fixedly connected to the positioning base (2), and the other end of the second spring (11) is fixedly connected to the pressure plate (4). When the pressure plate (4) is in the pressed state, each second spring (11) is in the elastic tension state.

9. The LED circuit board structure with a fire-retardant layer according to claim 5, characterized in that: Both the first cover (31) and the second cover (32) are made of thermally conductive metal material to conduct heat dissipation of each LED bead (5).

10. The LED circuit board structure with a fire-retardant layer according to claim 1, characterized in that: The positioning base (2) forms a heat dissipation air guide channel (8) in the width direction, and the heat dissipation air guide channel (8) is connected to each heat dissipation slot (10).

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