Vehicle-mounted display screen temperature adjusting device and method and vehicle-mounted display equipment

Abstract

The invention discloses a vehicle-mounted display screen temperature adjusting device and method and vehicle-mounted display equipment, and the device comprises a PI film which is fixedly arranged on a die-casting metal steel sheet behind an IC in a screen module of a vehicle-mounted display screen, and the layout area of the PI film on the die-casting metal steel sheet corresponds to the binding area of the IC on a glass substrate of the vehicle-mounted display screen; the heating control module is used for acquiring the current environment temperature of the IC binding area of the vehicle-mounted display screen and generating a heating starting signal of the PI film according to the current environment temperature; and the driving module is electrically connected with the heating control module, the PI film and the vehicle-mounted power supply, and is used for receiving the starting heating signal sent by the heating control module and controlling the PI film to be electrified and heated based on the starting heating signal so as to directionally heat the IC binding area. According to the vehicle-mounted display screen temperature adjusting device, it can be guaranteed that the vehicle-mounted display screen works stably in the low-temperature environment and smooth loading and application of fire regulation materials can be achieved.

Description

TECHNICAL FIELD

[0001] The present application generally relates to the technical field of vehicle display device. More particularly, the present application relates to a vehicle display screen temperature adjusting device, a vehicle display screen temperature adjusting method and a vehicle display device. BACKGROUND

[0002] The vehicle display screen is a core component of the vehicle human-computer interaction system, and its working stability at different ambient temperatures is directly related to the user's driving operation experience and driving safety, especially in cold regions or extreme low temperature scenarios, the display screen needs to maintain stable display performance to ensure normal operation of vehicle functions. The current vehicle display screen generally needs to meet the low temperature use requirement of-30℃, and with the gradual entry of non-regulated materials into the vehicle field due to cost advantages, how to adapt to the temperature limit of non-regulated materials has become an important issue for balancing the performance and cost control of vehicle display screens.

[0003] For the problem of low temperature display abnormality of vehicle display screen, there are mainly two types of solutions in the prior art. One is to use low temperature driving voltage compensation technology, which adjusts the liquid crystal driving voltage to try to improve the liquid crystal polarization inversion characteristics at low temperature, but this technology can only slightly alleviate the display problem, and has limited improvement effect on the phenomenon of flashing screen, residual image and the like at-30℃ extreme low temperature, and cannot completely guarantee the display reliability of the display screen. Another is to replace special low temperature liquid crystal material, which can improve the low temperature adaptation ability to a certain extent, but will greatly increase the development cost and material cost of the product, which is not conducive to market competition. In addition, the non-regulated flexible optical light guide plate has a significant cost advantage as a vehicle material, and its low temperature use threshold is only-20℃, and display abnormalities will inevitably occur below this temperature, and the temperature limit becomes a core obstacle for the application of non-regulated materials in vehicle applications. The existing technology has not yet effectively broken through this limit in a low-cost way.

[0004] Therefore, it is urgent to provide a vehicle display screen temperature adjusting scheme to ensure the stable operation of the vehicle display screen in a low temperature environment and the smooth application of non-regulated materials in vehicles. SUMMARY

[0005] In order to at least solve one or more technical problems mentioned above, the present application proposes a vehicle display screen temperature adjusting scheme in multiple aspects.

[0006] In a first aspect, this application provides a temperature regulation device for an in-vehicle display screen, characterized in that it comprises: a polyimide film (PI film), the PI film being fixed on a die-cast metal sheet behind an integrated circuit (IC) in the screen module of the in-vehicle display screen, and the arrangement area of ​​the PI film on the die-cast metal sheet corresponding to the bonding area of ​​the IC on the glass substrate of the in-vehicle display screen; a heating control module, the heating control module acquiring the current ambient temperature of the IC bonding area of ​​the in-vehicle display screen and generating a start heating signal for the PI film based on the current ambient temperature; and a driving module, the driving module being electrically connected to the heating control module, the PI film, and the in-vehicle power supply, respectively, for receiving the start heating signal sent by the heating control module, and controlling the PI film to be energized and heated based on the start heating signal, so as to directionally heat the IC bonding area.

[0007] In some embodiments, the PI film is a three-layer composite structure, comprising, in sequence along the direction away from the die-cast metal sheet: a high-temperature resistant layer, a heating layer, and a heat insulation layer; wherein, the high-temperature resistant layer is made of polyimide and has a thickness of 50 μm; the heating layer is an indium tin oxide conductive layer used to convert electrical energy into heat energy; and the heat insulation layer is made of aerogel composite material with a thermal conductivity of less than 0.01 W / (m·K).

[0008] In some embodiments, the number of PI films is two, and the two PI films are symmetrically arranged along the width direction of the die-cast metal sheet. The width of each PI film is 2mm to 4mm, the thickness is 0.3mm, and the length is adapted to the length of the IC bonding area.

[0009] In some embodiments, the indium tin oxide heating wire used for conductive heating in the heating layer is electrically connected to the drive module by means of spring clip crimping or welding.

[0010] In some embodiments, the driving module includes a MOSFET, and the terminals of the MOSFET are connected as follows: the gate terminal of the MOSFET is electrically connected to the signal output terminal of the heating control module for receiving the start heating signal; the drain terminal of the MOSFET is electrically connected to the heating layer of the PI film for conducting under the triggering of the start heating signal, so that the vehicle power supply supplies power to the PI film; the source terminal of the MOSFET is electrically connected to the output terminal of the vehicle power supply, wherein the vehicle power supply is a 12V battery.

[0011] In some embodiments, the heating control module comprises a voltage stabilizer, a temperature detection circuit, a microcontroller unit and a comparator, the temperature detection circuit is composed of a negative temperature coefficient (NTC) resistor and a voltage dividing resistor; the voltage stabilizer is electrically connected with the output end of the vehicle-mounted power supply, for supplying power to the whole heating control module; the NTC resistor is integrated on the screen flexible printed circuit board (FPC) of the screen module, for sensing the current environment temperature and converting it into a voltage dividing value and outputting; the positive input end of the comparator is connected with the voltage dividing output end of the temperature detection circuit, the negative input end is connected with a first voltage threshold, and the output end is connected with the wake-up pin of the microcontroller unit, for outputting a high-level wake-up signal to the microcontroller unit when the voltage dividing value is less than the first voltage threshold; the microcontroller unit is used for generating the start heating signal and sending it to the driving module after receiving the wake-up signal.

[0012] In some embodiments, the negative input end of the comparator is also used for connecting a second voltage threshold, for outputting a low-level sleep signal to the microcontroller unit when the voltage dividing value reaches the second voltage threshold; the microcontroller unit is also used for generating a close heating signal and sending it to the driving module after receiving the sleep signal, and then returning to the sleep state; the driving module is also used for receiving the close heating signal, and controlling the PI film to stop heating based on the close heating signal.

[0013] In some embodiments, the heating control module is configured to have a total static current less than 50uA, wherein the static current of the voltage stabilizer is 25uA, the static current of the comparator is 5uA, the static current of the microcontroller unit in the sleep state is 1uA, and the static current of the voltage dividing resistor is less than 10uA.

[0014] In the second aspect, the application provides a vehicle-mounted display screen temperature adjusting method, characterized in that the method is applied to the vehicle-mounted display screen temperature adjusting device in the first aspect and any one of the embodiments, and the method comprises: acquiring the current environment temperature of the IC bonding area of the vehicle-mounted display screen through the heating control module, and generating a start heating signal of the PI film according to the current environment temperature; receiving the start heating signal through the driving module, and controlling the PI film to be powered and heated based on the start heating signal, so as to perform directional heating on the IC bonding area, wherein the PI film is fixedly arranged on the die-casting metal sheet behind the integrated circuit (IC) in the screen module of the vehicle-mounted display screen, and the arrangement area of the PI film on the die-casting metal sheet corresponds to the bonding area of the IC on the glass substrate of the vehicle-mounted display screen.

[0015] In a third aspect, the present application provides a vehicle-mounted display device, characterized in that comprising a vehicle-mounted display screen body; and the vehicle-mounted display screen temperature adjusting device according to any one of the preceding first aspect and each embodiment, which is adapted to the IC bonding area of the vehicle-mounted display screen body; or the vehicle-mounted display device comprises a processor, a memory, and a vehicle-mounted display screen temperature adjusting program stored in the memory and executable by the processor, wherein the vehicle-mounted display screen temperature adjusting program, when executed by the processor, implements the vehicle-mounted display screen temperature adjusting method according to the preceding second aspect Through the vehicle-mounted display screen temperature adjusting device provided as above, the embodiments of the present application realize precise heating of the display screen integrated circuit bonding area through the corresponding layout of the polyimide film (PI film) and the IC bonding area of the vehicle-mounted display screen, the precise acquisition of the current environmental temperature of the IC bonding area by the heating control module and the generation of the start heating signal, and the cooperative action of the driving module controlling the PI film to generate heat based on the start heating signal, thereby guaranteeing the stable display performance of the vehicle-mounted display screen under extreme low temperature in a low-cost manner, effectively breaking through the temperature use limit of the non-regulated material, and helping the non-regulated material to smoothly realize vehicle-mounted application. BRIEF DESCRIPTION OF DRAWINGS

[0016] The above and other objects, features and advantages of the exemplary embodiments of the present application will be readily understood through reading the following detailed description in conjunction with the accompanying drawings, in which several embodiments of the present application are illustrated in example, not limitation. In the drawings, the same or corresponding parts are denoted by the same or corresponding reference numerals, and in which: Figure 1 An exemplary structural block diagram of the vehicle-mounted display screen temperature adjusting device of the embodiments of the present application is shown; Figure 2 An exemplary exploded view of the screen module of the embodiments of the present application is shown; Figure 3 A temperature distribution diagram of the PI film heating screen module related components of the embodiments of the present application is shown; Figure 4 A schematic diagram of the temperature detection circuit of the embodiments of the present application is shown; Figure 5 An exemplary flowchart of the vehicle-mounted display screen temperature adjusting method of the embodiments of the present application is shown. DETAILED DESCRIPTION

[0017] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0018] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship between the components in a specific posture. If the specific posture changes, the directional indications will also change accordingly. In this application, unless otherwise explicitly specified and limited, the terms "connection" and "fixed" should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0019] It should be understood that the terms "comprising" and "including" used in the specification and claims of this application indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0020] It should also be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application. As used in this specification and claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used in this specification and claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes such combinations.

[0021] As used in this specification and claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrase "if determined" or "if [described condition or event] is detected" may be interpreted, depending on the context, as "once determined," "in response to determination," "once [described condition or event] is detected," or "in response to detection of [described condition or event]."

[0022] The specific embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0023] Figure 1An exemplary structural block diagram of an in-vehicle display temperature regulation device 100 according to an embodiment of this application is shown. Figure 1 As shown, the device includes a polyimide film (PI film) 101, a heating control module 102, and a drive module 103.

[0024] Since the integrated circuit (IC) is bonded to the left and right edges of the glass substrate, in order to achieve directional heating, the aforementioned PI film 101 can be fixed on the die-cast metal sheet behind the IC in the screen module of the automotive display. The area where the PI film 101 is laid on the die-cast metal sheet corresponds to the bonding area of ​​the IC on the glass substrate of the automotive display. The die-cast metal sheet has good thermal conductivity and structural strength, which can quickly absorb the heat generated by the PI film and withstand the vibration and impact of the automotive environment. The corresponding design of the laying area and the IC bonding area allows the heating heat to be directly conducted to the IC area, avoiding ineffective heating of non-target areas. This ensures that the heating heat is accurately conducted to the IC area, avoiding liquid crystal response lag and screen flicker caused by low temperatures.

[0025] In addition, the heating control module 102 and the drive module 103 can be integrated and soldered onto the TLCM PCBA in the screen module. The PCBA is located behind the backlight cover of the vehicle display screen module and inside the plastic back cover. This position can accommodate the reserved installation space at the rear of the screen module, avoiding the occupation of the structural space of the display area. It can also shorten the length of the electrical connection line between the PCBA and the PI film fixed on the die-cast metal sheet, reducing signal transmission loss and electromagnetic interference. At the same time, the plastic back cover can also provide physical protection for the circuit components, adapting to the vibration, dust and other operating conditions in the vehicle environment, and facilitating the later inspection and maintenance of the circuit.

[0026] Furthermore, in one specific embodiment, there are two PI films, symmetrically arranged along the width direction of the die-cast metal sheet. Each PI film has a width of 2mm to 4mm, a thickness of 0.3mm, and a length adapted to the length of the IC bonding area. The width of 2mm to 4mm can accommodate the width range of IC bonding areas for different specifications of automotive displays, while the thickness of 0.3mm balances heat conduction efficiency with the installation space of the screen module. The symmetrical arrangement allows the IC area on the left and right edges of the glass substrate to receive uniform heat, avoiding display instability caused by temperature differences on one side. This design ensures heating uniformity while avoiding excessive space occupation.

[0027] In another specific embodiment, to concentrate heat towards the Flexible Optical Guide (FOG) and reduce heat dissipation towards the rear shell, the PI film has a three-layer composite structure, comprising, in sequence, a high-temperature resistant layer, a heating layer, and a heat insulation layer along the direction away from the die-cast metal sheet. This structural sequence is precisely planned for the direction of heat conduction: the high-temperature resistant layer close to the die-cast metal sheet resists the high temperatures generated by heating, the middle heating layer is responsible for converting electrical energy into heat energy, and the heat insulation layer away from the steel sheet prevents heat from diffusing backward, thereby achieving concentrated heat transfer towards the FOG.

[0028] The high-temperature resistant layer is made of polyimide with a thickness of 50μm, capable of withstanding temperatures above 400℃ and achieving uniform heat diffusion towards the FOG direction. Polyimide also possesses excellent electrical insulation properties, preventing current leakage from the heating layer to the die-cast metal sheet and improving the electrical safety of the device. The heating layer is an indium tin oxide conductive layer used to convert electrical energy into heat energy when energized. The thermal insulation layer uses an aerogel composite material with a thermal conductivity of less than 0.01W / (m·K) and a thickness of 0.1-0.2mm, significantly reducing heat loss towards the rear shell. Furthermore, the indium tin oxide heating wire in the heating layer, used for conductive heating, is electrically connected to the drive module 103 via spring clip pressing or welding, ensuring reliable electrical connections under vehicle vibration environments.

[0029] Figure 2 An exemplary exploded view of a screen module according to an embodiment of this application is shown. Figure 2 As shown, the screen module is stacked from back to front as follows: backlight cover, reflector, LGP (light guide plate), LED light board (LED+PC) with integrated FPC thermal conductive adhesive, diffuser, lower bef, upper bef, DBEF (brightness enhancement film), bezel, foam, COG (glass substrate and IC chip bonding structure), OCA (optical adhesive), and CG (cover plate). These stacked structures not only conduct light related to display functions but also assist in the transfer of heat to the IC bonding area. Additionally, behind the backlight cover are auxiliary components such as PI film (fixed on a die-cast metal sheet), TLCM PCBA, plastic back cover, PCBA, and bracket. These components are integrated at the rear of the screen module and do not interfere with the display structure.

[0030] The heat generated by the PI film is first transferred to the die-cast metal sheet, and then diffused forward through the backlight cover, reflector, and other structures to the IC chip bonding area corresponding to the COG, achieving precise temperature rise of the IC chip. During heat conduction, the heat insulation layer of the PI film effectively prevents heat loss to the back of the die-cast metal sheet, ensuring concentrated forward heat transfer. Experiments show that the PI film, heated to 6W, can rise from -30℃ to 0℃ in 2 minutes. This power meets the rapid preheating requirements under extreme low temperatures without causing excessive energy consumption. At the same time, through heat conduction, the temperature of the COG bonding area is raised by about 25℃, ensuring that the IC chip operates stably within a suitable temperature range above -20℃.

[0031] Figure 3 A schematic diagram illustrating the temperature distribution of relevant components in the screen module after heating the PI film according to an embodiment of this application is shown. Figure 3 In the diagram, the red, orange, and yellow areas on the left edge correspond to the higher temperatures of the PI film's heating area, indicating that heat has been concentrated and transferred to the IC bonding area. The large dark blue area in the middle represents the lower temperatures of areas such as the display screen itself that are not concentratedly heated. The yellow and green areas on the right edge represent another area with slightly higher temperatures, corresponding to the heating area of ​​another PI film. This diagram visually demonstrates the "directional heating" effect of the PI film, where heat is concentrated at the corresponding location in the IC bonding area, while the temperature of other areas remains at a lower level, achieving the heating goal of the insulation layer blocking heat loss and concentrating heat transfer.

[0032] The aforementioned drive module 103 is electrically connected to the heating control module 102, the PI film 101, and the vehicle power supply. The drive module 103 is the actuator between the heating control module 102 and the PI film 101. It is responsible for receiving the signals output by the heating control module 102 and converting them into power supply actions for the PI film 101. For example, the drive module 103 is used to receive the start heating signal sent by the heating control module 102 and control the PI film 101 to be energized and heated based on the start heating signal, so as to perform directional heating of the IC bonding area.

[0033] Specifically, the driving module 103 includes a MOSFET, and the connections of its terminals are as follows: the gate of the MOSFET is electrically connected to the signal output terminal of the heating control module 102 to receive the start heating signal; the drain of the MOSFET is electrically connected to the heating layer of the PI film 101 to conduct under the trigger of the start heating signal, enabling the vehicle power supply to power the PI film 101; the source of the MOSFET is electrically connected to the output terminal of the vehicle power supply. The selected MOSFET has a low on-resistance, which can reduce energy loss during power supply. In practical applications, the vehicle power supply is a constant 12V battery. This power supply selection ensures that the PI film 101 can still be powered and heated after the vehicle is locked, preventing the display from malfunctioning due to low temperature during the next startup.

[0034] The aforementioned heating control module 102 is configured to acquire the current ambient temperature of the IC bonding area of ​​the vehicle display screen and generate a start heating signal for the PI film 101 based on the current ambient temperature. From a hardware implementation perspective, the heating control module 102 may include a voltage regulator 1021, a temperature detection circuit 1022, a microcontroller unit 1023, and a comparator 1024. The temperature detection circuit 1022 is composed of a negative temperature coefficient (NTC) resistor and a voltage divider resistor. Each component has a clear division of labor and works together to achieve temperature detection and control signal output. From an architectural design perspective, the heating control module 102 can adopt a wake-up architecture design. Regardless of whether the vehicle is running, when the temperature detection circuit 1022 detects that the current ambient temperature is below -20°C, it starts the heating control. This design can achieve all-weather low-temperature protection for the vehicle display screen to ensure that the vehicle display screen operates within a suitable temperature range.

[0035] In the embodiments of this application, the heating control module 102 is configured with a total quiescent current of less than 50μA, specifically allocated as follows: the quiescent current of the voltage regulator 1021 is 25μA, the quiescent current of the comparator 1024 is 5μA, the quiescent current of the microcontroller unit 1023 in sleep mode is 1μA, and the quiescent current of the voltage divider resistor is less than 10μA. The current parameters of each component are selected based on the low-power requirements of the automotive scenario. For example, the microcontroller unit is a low-power automotive-specific model, and the voltage regulator is also a low quiescent current specification. This low leakage current design effectively avoids power loss during vehicle standby.

[0036] Specifically, the voltage regulator 1021 can be a low-power LDO with a quiescent current of 25μA. It is electrically connected to the output of the vehicle power supply (a constant 12V battery), converting the vehicle power supply into a stable low voltage to provide a stable voltage for the entire heating control module. The NTC resistor in the temperature detection circuit 1022 is integrated on the flexible printed circuit board (FPC) of the screen module. This placement allows the NTC resistor to be close to the IC bonding area, improving the accuracy of temperature detection. The NTC resistor has a resistance of 47.5kΩ at an ambient temperature of -20℃ and 21kΩ at an ambient temperature of 0℃. These resistance values ​​are obtained through actual calibration. Therefore, the NTC resistor can sense the current ambient temperature of the IC bonding area, convert it into a voltage divider value, and output it, providing data for temperature regulation.

[0037] Figure 4 A schematic diagram of a temperature detection circuit 1022 according to an embodiment of this application is shown. Figure 4As shown, the circuit consists of a voltage divider branch formed by a voltage divider resistor R33007 (10KΩ) and an NTC resistor RT33000 (10KΩ) connected in series. The resistance of the NTC resistor changes negatively with temperature, that is, the resistance decreases when the temperature rises and increases when the temperature falls. Therefore, the voltage at the voltage divider node, i.e. the test point TP33002, will change synchronously with the ambient temperature, thereby realizing the signal conversion from temperature to resistance and then to voltage, which facilitates the subsequent components to identify and process the temperature signal.

[0038] The voltage signal, after being divided, is transmitted through resistor R33008 (47KΩ) and then passes through an RC low-pass filter circuit consisting of capacitor C3306 (10nF) and ground. This filter removes electromagnetic interference from engine start-stop and onboard equipment operation in the vehicle environment, making the voltage signal more stable. Finally, the divided voltage signal is output through test point TP33003. Next, comparator 1024 acquires the voltage value of this signal and compares it with a first voltage threshold and a second voltage threshold to determine whether to start or stop the PI film heating operation.

[0039] Voltage divider of temperature detection circuit 1022 The calculation follows the formula: (1) Where 3.3V is the stable supply voltage output by the voltage regulator. This is the fixed resistance value of the voltage divider resistor. This represents the resistance value of the NTC resistor as it changes with stability.

[0040] When the ambient temperature is -20℃ =47.5kΩ, substituting into formula (1) yields the following result: The voltage is approximately 0.82V. This voltage value of 0.82V is then used as the first voltage threshold. -20℃ is the lowest stable operating temperature of the FOG (Flaming Air Regulator). This voltage threshold enables timely heating at low temperatures. The comparator 1024 determines whether the current ambient temperature is below -20℃ by comparing the real-time detected voltage division value with the first voltage threshold.

[0041] When the ambient temperature is 0℃ =21 kΩ, substituting into formula (1) yields the result. The voltage is approximately 1.06V. This voltage value of 1.06V is then used as the second voltage threshold. 0℃ is the lower limit of the suitable operating temperature for the IC chip. This threshold helps prevent the IC chip from overheating. The comparator 1024 determines whether the current ambient temperature has reached 0℃ by comparing the real-time detected voltage division value with the second voltage threshold.

[0042] Next, the operation of comparator 1024, microcontroller unit 1023 and drive module 103 during the temperature regulation process will be described in detail.

[0043] The comparator 1024 can be a TLV7031 model, with a quiescent current of 5μA and an integrated Schmitt trigger hysteresis circuit. This circuit prevents frequent output state switching of the comparator when the temperature fluctuates near the threshold, thus preventing frequent switching. The first voltage threshold of the negative input terminal of the comparator 1024 is set to 0.82V, and the second voltage threshold is set to 1.06V. The microcontroller unit (MCU) can be a low-power automotive-grade model with a quiescent current of 1μA in sleep mode. The low sleep current further reduces the standby power consumption of the system.

[0044] In one implementation scenario, the positive input of comparator 1024 is connected to the voltage divider output of temperature detection circuit 1022, the negative input is connected to the first voltage threshold, and the output is connected to the wake-up pin of microcontroller unit 1023. This is used to output a high-level wake-up signal to microcontroller unit 1023 when the voltage divider value is less than the first voltage threshold. Microcontroller unit 1023 generates a start-up heating signal after receiving the wake-up signal and sends it to drive module 103. The start-up heating signal is a level signal that can directly trigger the conduction of the MOSFET. After the MOSFET is turned on, the PI film can be energized and heated, thus realizing the control of PI film 101 heating by drive module 103 based on the start-up heating signal.

[0045] In another implementation scenario, the negative input of comparator 1024 is also connected to a second voltage threshold, used to output a low-level sleep signal to microcontroller unit 1023 when the voltage divider value reaches the second voltage threshold. In this scenario, microcontroller unit 1023 generates a heating-off signal after receiving the sleep signal and sends it to the drive module. Subsequently, the MOSFET is turned off, the PI film stops heating, and the drive module 103 receives the heating-off signal and controls the PI film 101 to power off and stop heating based on the heating-off signal. Then, microcontroller unit 1023 returns to sleep mode, and the entire system returns to a low-power standby monitoring state, waiting for the next low-temperature trigger.

[0046] The above combination Figures 1 to 4This application describes a vehicle-mounted display temperature regulation device according to an embodiment of the present application. The device achieves precise heating of the display integrated circuit bonding area by means of the corresponding arrangement of polyimide film (PI film) and the bonding area of ​​integrated circuit (IC) of the vehicle-mounted display, the precise acquisition of the current ambient temperature of the IC bonding area by the heating control module and the generation of the start heating signal, and the synergistic effect of the drive module controlling the PI film to be energized and heated based on the start heating signal. This ensures the stable display performance of the vehicle-mounted display at extreme low temperatures in a low-cost manner, while effectively breaking through the temperature usage restrictions of compliant materials and helping compliant materials to be successfully applied in vehicles.

[0047] Next, combined Figure 5 The present application provides a detailed description of a vehicle display temperature adjustment method 500 according to an embodiment of this application. This method 500 is applicable to... Figures 1 to 4 The described vehicle-mounted display temperature regulation device is fully compatible with the device's hardware architecture. It achieves automated temperature control through the coordinated action of hardware components. Its core logic corresponds one-to-one with the device's structural design and can be directly implemented based on the device's hardware layout. It is understood that the descriptions of the various embodiments in this application emphasize the differences between them, while their similarities or corresponding aspects can be referred to interchangeably. For the sake of brevity, these will not be elaborated upon further.

[0048] like Figure 5 As shown, in step S501, the current ambient temperature of the IC bonding area of ​​the vehicle display screen can be obtained by the heating control module, and a start heating signal for the PI film can be generated based on the current ambient temperature. The PI film is fixed on the die-cast metal sheet behind the integrated circuit (IC) in the screen module of the vehicle display screen, and the area where the PI film is laid on the die-cast metal sheet corresponds to the bonding area of ​​the IC on the glass substrate of the vehicle display screen.

[0049] Next, in step S502, the driving module can receive a start heating signal and control the PI film to be energized and heated based on the start heating signal, so as to perform directional heating on the IC bonding area. As a signal execution component, the response speed and conduction stability of the driving module directly affect the heating effect. The selected MOSFET has fast conduction characteristics and can immediately supply power to the PI film after receiving the signal. At the same time, the three-layer composite structure of the PI film can concentrate the heat to the IC bonding area, reducing ineffective heat loss.

[0050] Specifically, the heating control module may include a voltage regulator, a temperature detection circuit, a microcontroller unit, and a comparator. The temperature detection circuit consists of a negative temperature coefficient (NTC) resistor and a voltage divider resistor.

[0051] The voltage regulator uses a low-power LDO, which is electrically connected to the output of the vehicle power supply. It converts the vehicle's 12V constant power into a stable 3.3V low voltage, providing a stable power supply for the entire heating control module and ensuring the accuracy of temperature detection and signal comparison. The NTC resistor is integrated on the flexible circuit board (FPC) of the screen module and is close to the IC fixed area. The NTC resistor can sensitively sense the current ambient temperature and convert it into a voltage divider output. Its resistance value changes negatively with temperature, which is the core of temperature-voltage conversion. The comparator uses the TLV7031 model, which has low quiescent current and high anti-interference. Its positive input is connected to the voltage divider output of the temperature detection circuit, its negative input is connected to the first voltage threshold, and its output is connected to the wake-up pin of the microcontroller unit. The comparator can stably compare the voltage divider value with the first voltage threshold and output a high-level wake-up signal to the microcontroller unit when the voltage divider value is less than the first voltage threshold. Subsequently, the microcontroller unit can quickly generate a start heating signal after receiving the wake-up signal and send it to the drive module. The microcontroller unit is a low-power model specifically designed for automotive applications, ensuring high efficiency in wake-up and signal generation.

[0052] Furthermore, the negative input of the comparator is also used to connect to a second voltage threshold, which corresponds to the suitable operating temperature of the IC bonding area. Thus, the comparator can continuously compare the divided voltage value with the second voltage threshold, and output a low-level sleep signal to the microcontroller unit when the divided voltage value reaches the second voltage threshold. Subsequently, the microcontroller unit can promptly generate a heating-off signal upon receiving the sleep signal and send it to the driver module, then return to sleep mode. In sleep mode, the static current is only 1μA, significantly reducing system power consumption. The driver module can quickly receive the heating-off signal and control the PI film to power off and stop heating based on the heating-off signal, achieving automated closed-loop control of the heating process without manual intervention.

[0053] Furthermore, this application also provides an in-vehicle display device, which includes an in-vehicle display screen body and a combination thereof. Figures 1 to 4 The described vehicle display temperature regulation device is adapted to the IC bonding area of ​​the vehicle display body. The PI film of the temperature regulation device can be directly attached to the die-cast metal sheet of the screen module of the vehicle display body. Its placement is precisely aligned with the IC bonding area of ​​the body. The heating control module and the drive module are integrated on the TLC MPCBA of the body. There is no need to modify the original display structure and optical path of the vehicle display body. It is compatible with vehicle display bodies of different sizes and specifications. While ensuring display clarity and smooth operation, it can achieve directional temperature control of the IC bonding area.

[0054] Alternatively, this application also provides an in-vehicle display device, which includes a processor, a memory, and an in-vehicle display temperature adjustment program stored in the memory and executable by the processor, wherein when the in-vehicle display temperature adjustment program is executed by the processor, it achieves the combination of... Figure 5 The described method for temperature regulation of an in-vehicle display screen includes a memory that can be a dedicated in-vehicle flash memory or EEPROM, used to stably store the temperature regulation program and parameters such as the first voltage threshold and the second voltage threshold. The processor is electrically connected to the temperature detection circuit and drive module of the in-vehicle display screen. When executing the program, it can receive temperature detection signals in real time and generate start or stop heating signals according to the preset logic of the program to drive the PI film to complete the heating or stop operation, ensuring efficient coordination between the temperature regulation method and the equipment hardware, and achieving automated and precise temperature control.

[0055] While numerous embodiments of this application have been shown and described herein, it will be apparent to those skilled in the art that such embodiments are provided by way of example only. Many modifications, alterations, and alternatives will arise for those skilled in the art without departing from the spirit and intent of this application. It should be understood that various alternatives to the embodiments of this application described herein may be employed in the practice of this application. The appended claims are intended to define the scope of protection of this application and therefore cover equivalents or alternatives within the scope of these claims.

Claims

1. A temperature control device for a vehicle-mounted display screen, characterized in that, include: A polyimide film (PI film) is fixed on a die-cast metal sheet behind an integrated circuit (IC) in the screen module of an automotive display screen, and the area on which the PI film is disposed on the die-cast metal sheet corresponds to the bonding area of ​​the IC on the glass substrate of the automotive display screen. A heating control module acquires the current ambient temperature of the IC bonding area of ​​the vehicle display screen and generates a start heating signal for the PI film based on the current ambient temperature. The driving module is electrically connected to the heating control module, the PI film, and the vehicle power supply, respectively. It is used to receive the start heating signal sent by the heating control module and control the PI film to be energized and heated based on the start heating signal, so as to perform directional heating on the IC bonding area.

2. The apparatus according to claim 1, characterized in that, The PI film has a three-layer composite structure, which includes, in sequence, a high-temperature resistant layer, a heating layer and a heat insulation layer along the direction away from the die-cast metal sheet; The high-temperature resistant layer is made of polyimide and has a thickness of 50 μm; the heating layer is an indium tin oxide conductive layer used to convert electrical energy into heat energy; and the heat insulation layer is made of aerogel composite material with a thermal conductivity of less than 0.01 W / (m·K).

3. The apparatus according to claim 2, characterized in that, The number of PI films is two, and the two PI films are symmetrically arranged along the width direction of the die-cast metal sheet. The width of each PI film is 2mm to 4mm, the thickness is 0.3mm, and the length is adapted to the length of the IC bonding area.

4. The apparatus according to claim 2, characterized in that, The indium tin oxide heating wire used for conductive heating in the heating layer is electrically connected to the drive module through spring clip pressing or welding.

5. The apparatus according to claim 1, characterized in that, The driving module includes a MOSFET, and the connection relationship of each terminal of the MOSFET is as follows: The gate terminal of the MOS transistor is electrically connected to the signal output terminal of the heating control module to receive the start heating signal; The drain terminal of the MOS transistor is electrically connected to the heating layer of the PI film, and is used to turn on when triggered by the start heating signal, so that the vehicle power supply can supply power to the PI film. The source terminal of the MOSFET is electrically connected to the output terminal of the vehicle power supply, wherein the vehicle power supply is a 12V battery.

6. The apparatus according to claim 1, characterized in that, The heating control module includes a voltage regulator, a temperature detection circuit, a microcontroller unit, and a comparator. The temperature detection circuit consists of a negative temperature coefficient (NTC) resistor and a voltage divider resistor. The voltage regulator is electrically connected to the output terminal of the vehicle power supply and is used to power the entire heating control module. The NTC resistor is integrated on the flexible printed circuit board (FPC) of the screen module and is used to sense the current ambient temperature, convert it into a voltage divider value, and output it. The positive input terminal of the comparator is connected to the voltage divider output terminal of the temperature detection circuit, the negative input terminal is connected to the first voltage threshold, and the output terminal is connected to the wake-up pin of the microcontroller unit, which is used to output a high-level wake-up signal to the microcontroller unit when the voltage divider value is less than the first voltage threshold. The microcontroller unit is used to generate the start heating signal after receiving the wake-up signal and send it to the drive module.

7. The apparatus according to claim 6, characterized in that, The negative input terminal of the comparator is also used to connect to a second voltage threshold, and is used to output a low-level sleep signal to the microcontroller unit when the voltage division value reaches the second voltage threshold. The microcontroller unit is also configured to generate a heating off signal after receiving the sleep signal and send it to the drive module, and then return to the sleep state; The drive module is also used to receive the heating off signal and control the PI film to stop heating based on the heating off signal.

8. The apparatus according to claim 6, characterized in that, The heating control module is configured with a total quiescent current of less than 50 μA, wherein the quiescent current of the voltage regulator is 25 μA, the quiescent current of the comparator is 5 μA, the quiescent current of the microcontroller unit in sleep mode is 1 μA, and the quiescent current of the voltage divider resistor is less than 10 μA.

9. A method for adjusting the temperature of an in-vehicle display screen, characterized in that, The method is applied to the vehicle display temperature control device according to any one of claims 1 to 8, and the method includes: The heating control module obtains the current ambient temperature of the IC bonding area of ​​the vehicle display screen and generates a start heating signal for the PI film based on the current ambient temperature. The driving module receives the start heating signal and controls the PI film to be energized and heated based on the start heating signal to directionally heat the IC bonding area. The PI film is fixed on the die-cast metal sheet behind the integrated circuit (IC) in the screen module of the vehicle display screen, and the area where the PI film is arranged on the die-cast metal sheet corresponds to the bonding area of ​​the IC on the glass substrate of the vehicle display screen.

10. A vehicle-mounted display device, characterized in that, Includes an in-vehicle display screen body; and an in-vehicle display screen temperature adjustment device according to any one of claims 1 to 8, wherein the temperature adjustment device is adapted to the IC bonding area of ​​the in-vehicle display screen body; or, The vehicle-mounted display device includes a processor, a memory, and a vehicle-mounted display temperature adjustment program stored in the memory and executable by the processor, wherein when the vehicle-mounted display temperature adjustment program is executed by the processor, the vehicle-mounted display temperature adjustment method according to claim 9 is implemented.

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