Flexible direct current converter valve modeling analysis method and device, electronic equipment and storage medium

Abstract

The invention discloses a flexible direct current converter valve modeling analysis method and device, electronic equipment and a storage medium. According to the method, physical field coupling simulation is carried out on a valve tower geometric model and a valve hall air port geometric model; the parameter mapping relation between the valve tower geometric parameter and the valve tower equivalent heat exchange coefficient and the parameter mapping relation between the valve hall geometric parameter and the valve hall equivalent heat exchange coefficient can be efficiently established, so that the temperature field distribution of the converter valve is accurately simulated, accurate correlation between different geometric parameters and heat exchange coefficients is obtained through physical field coupling simulation, and the simulation accuracy is improved. A reliable calculation model is provided for temperature field simulation analysis of the converter valve, the calculation model can be applied to updating a corresponding temperature field thermal analysis model due to changes of geometric parameters of the converter valve when the calculation model is applied to temperature field simulation of the converter valve, and thermal boundary conditions of a simulation model do not need to be manually and repeatedly set; therefore, the design accuracy and efficiency of the converter valve are improved, and the method has high practical value and engineering application prospect.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of converter valve modeling, and particularly relates to a flexible DC converter valve modeling analysis method and device, electronic equipment and a storage medium. BACKGROUND

[0002] As a core device of the power system, the design process of the flexible DC converter valve needs to fully consider the correlation characteristics of the electrical performance and the structural parameters. In actual engineering, a valve hall of the flexible DC converter valve is usually stacked into a valve tower by hundreds of power modules in a pyramid structure, a single valve tower contains an insulated gate bipolar transistor (IGBT), a sub-module capacitor, a buffer circuit, a current-carrying copper busbar and other components, the electrical connection between the components is realized through multiple layers of busbars, and the valve tower structure, IGBT module arrangement and busbar wiring of the converter valve directly affect the electrical characteristics and heat dissipation performance of the flexible DC converter valve.

[0003] However, the existing analysis and modeling method for the flexible DC converter valve is difficult to automatically correlate the geometric parameters and the thermal physical parameters. Specifically, the current modeling method lacks a mechanism to automatically and quantitatively convert the changes of the valve tower height, air inlet size and other geometric parameters into the key thermal boundary conditions (such as the equivalent heat transfer coefficient) required for temperature field simulation, resulting in the need for engineers to manually reset the simulation parameters every time the design is changed, which is low in efficiency and difficult to ensure consistency. In addition, although some parameterized analysis and modeling tools support geometric parameter adjustment, when the number of valve tower layers or the module layout is modified, the temperature field boundary conditions still need to be manually reconstructed, and the reconstruction of a single valve tower model is time-consuming and difficult to meet the engineering iterative design requirements. SUMMARY

[0004] Based on this, the present application aims to provide a flexible DC converter valve modeling analysis method, device, electronic equipment and storage medium, to establish the correlation between the geometric parameters of the valve tower and the heat transfer coefficient, and to realize adaptive simulation modeling based on the geometric parameters of the valve tower based on this correlation. The model obtained by modeling can be used for high-precision temperature field calculation without manually setting the thermal boundary conditions.

[0005] In a first aspect, the present application provides a flexible DC converter valve modeling analysis method, comprising:

[0006] Geometrically modeling the converter valve tower and the valve hall air inlet respectively to obtain a valve tower geometric model and a valve hall air inlet geometric model;

[0007] Performing physical field coupling simulation based on the valve tower geometric model to establish a valve tower parameter mapping relationship, the valve tower parameter mapping relationship representing the mapping relationship between the valve tower geometric parameters and the valve tower equivalent heat transfer coefficient;

[0008] The valve hall parameter mapping relationship is established by performing physical field coupling simulation based on the valve hall air port geometric model, and the valve hall parameter mapping relationship represents a mapping relationship between a valve hall air port geometric parameter and an equivalent heat exchange coefficient of the valve hall.

[0009] The parameter calculation analysis model is obtained by using the valve tower parameter mapping relationship and the valve hall parameter mapping relationship, and the parameter calculation analysis model is used for temperature field simulation analysis of the converter valve.

[0010] Further, the valve tower geometric model is obtained by performing geometric modeling on the converter valve tower, and the valve tower geometric model includes:

[0011] The valve tower geometric model is obtained by performing geometric simplified modeling on the converter valve tower to retain the heat dissipation characteristics of the valve tower.

[0012] Further, the geometric simplified modeling on the converter valve tower includes:

[0013] The valve tower including a plurality of valve sections is simplified as a whole while retaining the geometric profile of each valve section and the layout of the cooling pipeline.

[0014] Further, the valve tower parameter mapping relationship is established by performing physical field coupling simulation based on the valve tower geometric model, and the valve tower parameter mapping relationship includes:

[0015] The valve tower height is changed under the condition of the same cooling water flow rate, the electro-thermal-fluid coupling simulation is performed based on the valve tower geometric model, the equivalent heat exchange coefficient of the valve tower corresponding to each valve tower height is calculated, and the mapping relationship between the valve tower height and the equivalent heat exchange coefficient of the valve tower is recorded as the valve tower parameter mapping relationship.

[0016] Further, the valve tower parameter mapping relationship is represented as follows:

[0017] ,

[0018] wherein, represents the equivalent heat exchange coefficient of the valve tower, represents the valve tower height, , , D represents a parameter scanned and calibrated by the electro-thermal-fluid coupling simulation, represents the cooling water flow rate, represents a power operation with as the base and D as the index.

[0019] Further, the valve hall air port geometric model is obtained by performing geometric modeling on the valve hall air port, and the valve hall air port geometric model includes:

[0020] The air supply port and the return air port of the valve hall are simplified as a rectangular opening model, and the length-width ratio of the rectangular opening model is kept consistent with the real physical profile of the valve hall air port, to obtain the valve hall air port geometric model.

[0021] Further, the physical field coupling simulation is performed based on the valve hall air port geometric model to establish the valve hall parameter mapping relationship, including:

[0022] The valve hall air port geometric model is taken as the fluid boundary condition of the valve hall and the external environment, the valve hall air supply port radius is changed under different input air speed conditions, the heat-fluid coupling simulation calculation and the valve hall equivalent heat exchange coefficient corresponding to each valve hall air supply port radius are calculated, and the mapping relationship between the valve hall air supply port radius and the valve hall equivalent heat exchange coefficient is recorded as the valve hall parameter mapping relationship.

[0023] Further, the valve hall parameter mapping relationship is represented as follows:

[0024] ,

[0025] Among them, the valve hall equivalent heat exchange coefficient is represented as follows: 、 the valve hall air supply port radius of the two air supply ports is represented as follows: 、 、 、 、 , F represents the parameter scanned and calibrated through the electro-thermal-fluid coupling simulation, the input air speed is represented as follows: the power operation with as the base and F as the index is represented as follows.

[0026] In the second aspect, the present application provides a flexible DC converter valve modeling and analysis device, including:

[0027] The geometric modeling module is used for respectively geometric modeling of the converter valve tower and the valve hall air port to obtain a valve tower geometric model and a valve hall air port geometric model.

[0028] The first coupling simulation module is used for performing physical field coupling simulation based on the valve tower geometric model to establish a valve tower parameter mapping relationship, and the valve tower parameter mapping relationship represents the mapping relationship between the valve tower geometric parameter and the valve tower equivalent heat exchange coefficient.

[0029] The second coupling simulation module is used for performing physical field coupling simulation based on the valve hall air port geometric model to establish a valve hall parameter mapping relationship, and the valve hall parameter mapping relationship represents the mapping relationship between the valve hall air port geometric parameter and the valve hall equivalent heat exchange coefficient.

[0030] The parameter calculation module is used for calculating a parameter simulation analysis model by using the valve tower parameter mapping relationship and the valve hall parameter mapping relationship, and the parameter simulation analysis model is used for temperature field simulation analysis of the converter valve.

[0031] In a third aspect, the present application provides an electronic device comprising a memory storing computer executable instructions and a processor, when the computer executable instructions are executed by the processor, the device is caused to perform the steps of the flexible HVDC converter valve modeling analysis method provided in the first aspect.

[0032] In a fourth aspect, the present application provides a readable storage medium storing computer executable program, when the program is executed, the steps of the flexible HVDC converter valve modeling analysis method provided in the first aspect can be realized.

[0033] Compared with the existing simulation method, the present application has the following beneficial effects:

[0034] The present application provides a flexible HVDC converter valve modeling analysis method, by coupling physical field simulation on the valve tower geometric model and the valve hall air port geometric model, the parameter mapping relationship between the valve tower geometric parameters and the heat transfer coefficient, and the valve hall air port geometric parameters and the heat transfer coefficient can be efficiently established, the parameter calculation and analysis model is calculated by using the established parameter mapping relationship, and the parameter calculation and analysis model is used for temperature field simulation, so that the temperature field distribution of the converter valve can be accurately and efficiently simulated without re-designing the simulation parameters or the temperature field boundary conditions due to different converter valve geometric parameters each time the temperature field simulation is performed, the method provided by the present application retains the heat dissipation characteristics by geometric modeling of the valve tower and the valve hall air port, significantly reduces the calculation complexity, and obtains the accurate correlation between different geometric parameters and heat transfer coefficients by coupling physical field simulation and parameter scanning under multiple working conditions, so as to provide a reliable calculation model for temperature field simulation analysis of the converter valve, the calculation model can be applied to update the corresponding temperature field thermal analysis model due to the change of the converter valve geometric parameters in the temperature field simulation of the converter valve, without manually and repeatedly setting the thermal boundary conditions of the simulation model, thereby improving the accuracy and efficiency of the converter valve design, and having strong practical value and engineering application prospect. BRIEF DESCRIPTION OF DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced as follows. Obviously, the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor on the basis of the provided drawings.

[0036] Figure 1 The flexible HVDC converter valve modeling analysis method provided by the embodiment of the present application is realized by the flow chart.

[0037] Figure 2 The schematic diagram of the geometric simplified modeling of the valve tower provided by the embodiment of the present application is shown in the figure.

[0038] Figure 3A schematic diagram of geometric simplified modeling of a valve hall provided for an embodiment of the present application is shown in FIG. 1.

[0039] Figure 4 A structural schematic diagram of a flexible DC converter valve modeling and analysis device provided for an embodiment of the present application is shown in FIG. 2.

[0040] Figure 5 An electronic device architecture diagram provided for an embodiment of the present application is shown in FIG. 3. DETAILED DESCRIPTION

[0041] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0042] Referring to Figure 1 An embodiment of the present application provides a flexible DC converter valve modeling and analysis method, comprising the following steps:

[0043] Step S110. Geometrically modeling the converter valve tower and the valve hall air outlet respectively to obtain a valve tower geometric model and a valve hall air outlet geometric model.

[0044] This step obtains a structure model balanced between calculation precision and simulation efficiency by reasonably modeling and simplifying the geometric structure of the valve tower and the valve hall air outlet, and provides an input boundary and a geometric framework for subsequent multi-physical field coupling analysis.

[0045] In a flexible DC converter system, the valve tower structure is usually composed of several valve segments stacked together, and each valve segment internally includes power modules, cooling water pipelines and corresponding support structures. In order to reduce simulation complexity while ensuring main thermal characteristics, this step performs geometric simplified modeling of the valve tower.

[0046] Specifically, considering that air flow is the main influencing factor for temperature field calculation inside the valve hall, the air domain inside the valve hall can be regarded as a whole, this step combines multiple independent valve segments into a whole model, retains the basic geometric profile of each valve segment and the spatial layout of the cooling water main pipeline, thereby maintaining the real heat dissipation characteristics while simplifying the structure.

[0047] For modeling of the valve hall air outlet, based on the air turbulence theory inside the valve hall, this step performs simplified modeling of the air supply outlet and the air return outlet of the converter station valve hall. Specifically, the actual air supply outlet and air return outlet shapes are equivalent to a rectangular opening model, and the length-width ratio of the rectangular opening is consistent with the actual physical structure. Through this geometric simplification, the simulation calculation amount can be effectively reduced under the condition that the air flow characteristics and jet size remain unchanged.

[0048] Finally, the valve tower geometry model and the valve hall air port geometry model are obtained, which together constitute the simulation basis of the converter valve system.

[0049] In some embodiments, when the converter valve tower is geometrically modeled, a direct modeling method can be used. This method is based on the design drawings of the converter valve, and a three-dimensional geometric structure model of the valve tower is established by using three-dimensional modeling software, so that the details of each structure of the valve tower are completely retained, so as to perform high-precision simulation analysis on the local temperature distribution and heat dissipation performance.

[0050] In some preferred embodiments, the simplified air supply port and air return port can be respectively set as the fluid boundary conditions of the valve hall and the external environment, and the physical parameters such as the air flow rate, temperature and flow direction of the air supply port are input in the subsequent simulation, so as to realize the equivalent description of the convective heat transfer process in the air domain of the valve hall.

[0051] In further embodiments, the establishment of the valve tower geometry model and the valve hall air port geometry model can be realized in the same modeling and simulation platform, the valve tower solid domain and the valve hall fluid domain are respectively constructed, and the coupling of the two domains is realized by setting the interface boundary, so as to form a complete converter valve system geometry model, and provide a basis for subsequent multi-physical field simulation analysis.

[0052] Exemplarily, Figure 2 and Figure 3 respectively illustrate the valve tower geometry simplified modeling and the valve hall air port geometry model provided by an embodiment of the present application.

[0053] Step S120. Perform physical field coupling simulation based on the valve tower geometry model to establish a valve tower parameter mapping relationship.

[0054] This step is based on the geometry model of the valve tower to establish a valve tower parameter mapping relationship for reflecting the quantitative relationship between the geometric parameters and the thermal characteristics.

[0055] In this step, by performing electric-thermal-fluid multi-physical field coupling simulation on the valve tower geometry model, the heat transfer performance variation law of the valve tower under different structure sizes, cooling flow rates or working conditions can be obtained, so as to obtain the functional mapping relationship between the valve tower geometry parameters (such as height, layer spacing, etc.) and the equivalent heat transfer coefficient. This step converts the nonlinear relationship between the complex three-dimensional geometry structure and the heat dissipation performance into a calculable mathematical model by using the multi-physical field simulation method, so as to provide high-precision parameter input for subsequent temperature field analysis.

[0056] In some embodiments, when performing physical field coupling simulation based on the valve tower geometric model, a traversal parameterized simulation method can be used, a series of geometric parameter combinations are set for the simplified valve tower model in the simulation environment, and the height or interlayer spacing and other key size parameters of the valve tower are changed one by one under the condition of the same cooling water flow rate, and the electric-thermal-fluid coupling is solved respectively. After each simulation is completed, the heat transfer coefficient of the outer surface of the valve tower, the temperature rise of each valve section, and the cooling liquid temperature difference and other physical quantities can be extracted, and the calculation results are curve fitted or polynomial regressed, so as to establish the parameter mapping relationship between the valve tower geometric parameters and the equivalent heat transfer coefficient.

[0057] In further embodiments, the electric-thermal-fluid coupling simulation can be implemented in a multi-physical field simulation software, and the current density distribution, the heat conduction equation and the fluid momentum equation are solved simultaneously. Among them, the electric field module is used to calculate the current density distribution of the power device; the thermal field module calculates the temperature distribution based on the material thermal conductivity and the heat dissipation boundary condition; the fluid module is used to simulate the flow characteristics of the cooling water in the internal channel of the valve tower. The three physical fields are bidirectionally coupled through the energy equation to obtain accurate temperature rise and heat transfer behavior.

[0058] In some embodiments, to improve the simulation accuracy, boundary layer refinement and fluid-solid coupling grid division strategies can be introduced in the electric-thermal-fluid coupling solution, for example, local encryption grid can be used in the valve tower cooling water pipe and heat transfer surface area to ensure the calculation accuracy of temperature gradient and flow rate gradient, and through the combination of steady-state solution and transient solution, the thermal response of the system under continuous operation or load fluctuation is evaluated.

[0059] Further, the multi-physical field coupling simulation of the present step regards the valve tower as a composite system excited by current heating and cooled by cooling water and air convection, adopts a traversal parameterized simulation method, changes the valve tower height parameter under the same cooling water flow rate, and performs electric-thermal-fluid field joint solution on the discretized valve tower model under different working conditions to obtain the temperature distribution and heat transfer coefficient under each working condition.

[0060] The valve tower parameter mapping relationship is represented as follows:

[0061]

[0062] Among them, represents the equivalent heat transfer coefficient of the valve tower, represents the height of the valve tower, , , , D represents the parameter scanned and calibrated by the electric-thermal-fluid coupling simulation, represents the cooling water flow rate, represents the power operation of as the base and D as the index.

[0063] The valve tower parameter mapping relationship is written into the simulation environment, so that when the user modifies the valve tower height parameter, the corresponding equivalent heat exchange coefficient of the valve tower can be automatically calculated by calling the relationship, thereby updating the temperature field analysis model of the valve tower and providing convenience for temperature field analysis.

[0064] Step S130. Perform physical field coupling simulation based on the valve hall air port geometric model to establish a valve hall parameter mapping relationship.

[0065] This step performs multi-physical field coupling simulation based on the valve hall air port geometric model to establish a valve hall parameter mapping relationship. Specifically, according to the geometric characteristics of the valve hall air port and the internal air flow organization form, a physical field model of air flow and temperature distribution is constructed, and through thermal-fluid coupling analysis, the mapping relationship between the air port geometric parameters (such as the size of the air inlet, the position, height and number of the air outlet) and the internal temperature field distribution characteristics of the valve hall (such as temperature gradient, air flow velocity distribution, local heat exchange efficiency) is obtained. Thus, the influence of different air port design schemes on the overall temperature field and heat exchange performance of the valve hall can be quantified.

[0066] In some embodiments, the multi-physical field coupling simulation includes fluid mechanics modeling of the valve hall air domain, numerical solution of the air flow characteristics at the inlet and outlet air ports using computational fluid dynamics methods, analysis of air flow paths and vortex distribution by setting boundary conditions (including air port flow rate, temperature, turbulence intensity, etc.), and determination of the influence of different air port geometric arrangements on the temperature field distribution of the valve hall.

[0067] In further embodiments, the simulation can use steady-state or transient solution methods. When the heat dissipation characteristics of the valve hall under stable operation are concerned, a steady-state solution is used. When the response characteristics of the valve hall under load changes or environmental temperature fluctuations are concerned, a transient solution is used to obtain dynamic temperature distribution characteristics.

[0068] In some embodiments, the valve hall air port geometric model can be established by parameterization. The size, number, position and angle of the air port are all input variables. The temperature field results under different parameter combinations are calculated through iterative simulation, the characteristic parameters (such as average heat exchange coefficient, maximum temperature rise area temperature) are extracted, and the valve hall parameter mapping relationship is established using multivariate regression or response surface analysis method.

[0069] In further embodiments, a functional relationship between the air port structure parameters and the heat exchange performance indicators can be fitted based on the simulation results, for example, an association function between the inlet air port area, outlet air port height and the average heat exchange coefficient of the valve hall is established, which is used for subsequent parameterized optimization design and temperature field prediction.

[0070] In a more preferred embodiment, taking the valve hall with two air inlets as an example, the step takes the simplified rectangular opening model of the air supply port and the air return port as the boundary condition of the valve hall and the external environment, performs parameter scanning on the geometric parameters of the air supply port through fluid-thermal multi-physical field coupling simulation, changes the radius parameter of the air supply port under different input air speed conditions, and simulates to obtain the equivalent heat transfer coefficient of the valve hall and the external environment corresponding to the air supply port.

[0071] The valve hall parameter mapping relationship is expressed as follows:

[0072]

[0073] wherein, represents the equivalent heat transfer coefficient of the valve hall, , represents the air supply port radius of the two air supply ports of the valve hall, , , , , , F represents the parameter scanned and calibrated through the electro-thermal-fluid coupling simulation, represents the input air speed, represents the power operation with F as the index and as the base.

[0074] Similarly, the valve hall parameter mapping relationship is written into the simulation environment, so that when the user modifies the input air speed condition and the air supply port radius parameter, the corresponding equivalent heat transfer coefficient of the valve hall can be automatically calculated according to the relationship, thereby updating the temperature field analysis model of the valve hall and providing convenience for the temperature field analysis.

[0075] Step S140. Obtain a parameter calculation analysis model by using the valve tower parameter mapping relationship and the valve hall parameter mapping relationship, and the parameter calculation analysis model is used for temperature field simulation analysis of the converter valve.

[0076] This step uses the aforementioned valve tower parameter mapping relationship and valve hall parameter mapping relationship to establish a parameter calculation model for simulating and analyzing the temperature field of the converter valve. Specifically, the valve tower parameter mapping relationship (for example, the functional relationship between the valve tower height and the equivalent heat transfer coefficient of the valve tower) obtained based on the valve tower geometric model can be coupled with the valve hall parameter mapping relationship (for example, the functional relationship between the air flow heat transfer efficiency and the air port structure parameter) obtained based on the valve hall air port geometric model, and the thermal characteristics of the valve tower structure features and the valve hall air flow organization are associated through a unified parameterized calculation framework, so as to realize the prediction and calculation of the overall temperature field distribution of the converter valve.

[0077] In some embodiments, the parameter calculation model can be realized by joint solution of multiple physical fields, introducing the interaction relationship of electric field, thermal field and flow field into a unified energy balance equation, comprehensively considering the heating power of the valve tower, the ventilation efficiency of the valve hall and the air temperature distribution, so as to obtain the temperature distribution and thermal balance state of the key parts of the converter valve.

[0078] In further embodiments, the parameter calculation model can adopt a modular structure design, in which the equivalent heat exchange model of the valve tower part and the air flow model of the valve hall part are independent sub-modules, and are coupled through thermal boundary conditions. In the model solving process, iterative solution can be realized based on the input and output parameters of each module to obtain higher precision of the temperature field prediction results.

[0079] In some embodiments, the parameter calculation model can adopt a combination of numerical simulation and analytical calculation: through numerical simulation, the local nonlinear temperature variation law is obtained, and an analytical expression is formed by using a fitting algorithm, so as to significantly improve the calculation efficiency and meet the demand of rapid evaluation in engineering application.

[0080] In further embodiments, the temperature field under different operating conditions can be predicted based on the parameter calculation model, including environmental temperature change, cooling air speed adjustment, valve tower height or air outlet position change and other conditions, so as to realize the sensitivity analysis and design optimization of the temperature distribution of the converter valve. For example, through the temperature gradient and local maximum temperature rise information output by the model, the ventilation design of the valve hall and the layout optimization of the valve tower can be guided to reduce the risk of local hot spots and improve the heat dissipation performance of the system.

[0081] The application will be further described below with a specific application example.

[0082] After the valve tower parameter mapping relationship and the valve hall parameter mapping relationship are written into the modeling and analysis system, the user only needs to input the basic geometric parameters of the valve hall, the valve tower and the air outlet, and the modeling and analysis system retrieves the corresponding geometric model template from the pre-built model library according to the output basic geometric parameters to generate a parameterized three-dimensional geometric model of the valve hall.

[0083] For example, the geometric parameters of the valve hall can include: valve hall length, valve hall width, valve hall height, number of valve hall length direction, number of valve hall width direction, valve hall length direction spacing, valve hall width direction spacing, etc.; the geometric parameters of the valve tower can include: valve tower length, valve tower width, valve tower height, valve tower height direction spacing, valve tower length direction spacing, valve tower width direction spacing, number of valve tower height direction, number of valve tower length direction, number of valve tower width direction, valve tower base point x-axis coordinate, valve tower base point y-axis coordinate, valve tower base point z-axis coordinate, etc.; the geometric parameters of the air outlet can include: number of valve hall air return outlets, valve hall air return outlet spacing, valve hall air supply outlet radius, coordinates of valve hall air supply outlet and air return outlet, number of valve hall air supply outlets, valve hall air supply outlet spacing, etc.

[0084] After the geometry parameters of the valve tower and the valve hall are determined, the system calculates the corresponding equivalent heat exchange coefficients of the valve tower and the valve hall by using the valve tower parameter mapping relationship and the valve hall parameter mapping relationship, and uses the equivalent heat exchange coefficients as new thermal physical parameters to serve the thermal analysis network of the corresponding valve tower surface and valve hall boundary, and as the key boundary conditions for temperature field simulation analysis.

[0085] Finally, the system generates a complete analysis model including geometry parameters and thermal physical parameters, which can be directly used for simulation calculation of the temperature field and the flow field, and there is no need to manually set the thermal boundary conditions according to the valve tower or the valve hall with different geometry parameters.

[0086] The above-mentioned method can be implemented in various forms of equipment, and therefore the present application further discloses a device corresponding to the above-mentioned method, and specific embodiments are given below for detailed description.

[0087] As shown in FIG. 1, one embodiment of the present application provides a flexible HVDC converter valve modeling and analysis device, which comprises: Figure 4 a geometry modeling module 402, configured to perform geometry modeling on the converter valve tower and the valve hall air port respectively, to obtain a valve tower geometry model and a valve hall air port geometry model;

[0088] a first coupling simulation module 404, configured to perform physical field coupling simulation based on the valve tower geometry model, to establish a valve tower parameter mapping relationship, the valve tower parameter mapping relationship representing a mapping relationship between valve tower geometry parameters and valve tower equivalent heat exchange coefficients;

[0089] a second coupling simulation module 406, configured to perform physical field coupling simulation based on the valve hall air port geometry model, to establish a valve hall parameter mapping relationship, the valve hall parameter mapping relationship representing a mapping relationship between valve hall air port geometry parameters and valve hall equivalent heat exchange coefficients;

[0090] a parameter calculation module 408, configured to calculate a parameter simulation analysis model by using the valve tower parameter mapping relationship and the valve hall parameter mapping relationship, the parameter simulation analysis model being used for temperature field simulation analysis of the converter valve.

[0091] The device provided in the embodiments of the present application has the same implementation principle and technical effects as the above-mentioned method embodiments, and for brief description, the part not mentioned in the device embodiment part can be referred to the corresponding content in the above-mentioned method embodiments.

[0092]

[0093] ​The methods and related apparatuses mentioned in the above embodiments are described with reference to the method flowcharts and / or structural diagrams provided in the embodiments of this application. Specifically, each block of the method flowchart and / or structural diagram, as well as combinations of blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing device to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing device, generate instructions for implementing the process. Figure 1 A schematic diagram of one or more processes and / or structures. Figure 1 The computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to operate in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 A schematic diagram of one or more processes and / or structures. Figure 1 The functions specified in one or more boxes. These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable apparatus for implementing the process. Figure 1 A process or multiple processes and / or structures illustrate the steps of the functions specified in one or more boxes.

[0094] The following embodiments illustrate the application of this method to a computer device. It is understood that the computer device can be any device with computing and processing capabilities, including but not limited to servers or personal laptops. In one embodiment, the computer device can be an application server, which can be a server used to run the application under test.

[0095] See Figure 5 This document illustrates a hardware block diagram of an electronic device intended to represent various forms of digital computers, such as laptops, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframes, and other suitable computers. The electronic device may also represent various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the present application described and / or claimed herein.

[0096] like Figure 5As shown, the electronic device comprises at least one processor 1, at least one communication interface 2, at least one memory 3 and at least one communication bus 4;

[0097] In the embodiments of the present application, the number of the processor 1, the communication interface 2, the memory 3 and the communication bus 4 is at least one, and the processor 1, the communication interface 2 and the memory 3 complete the communication with each other through the communication bus 4;

[0098] The processor 1 can be a central processing unit CPU, or an application specific integrated circuit ASIC, or one or more integrated circuits configured to implement the embodiments of the present application, etc.

[0099] The memory 3 can include a high-speed RAM memory, and can also include a non-volatile memory, etc., such as at least one disk memory.

[0100] The memory stores a program, and the processor can call the program stored in the memory, and the program is used to implement the various processing procedures of the flexible DC converter valve modeling analysis scheme.

[0101] The embodiments of the present application also provide a readable storage medium having a computer program stored thereon, and the computer program is executed by the processor to implement the various processing procedures of the flexible DC converter valve modeling analysis scheme provided by the above embodiments and / or any possible implementation manner combined with the embodiments.

[0102] The above embodiments have described the present application in detail with respect to possible cases, and those skilled in the art will recognize that the present application can be practiced by other embodiments. The specific naming of the components, the capitalization of terms, the attributes, data structures or any other programming or structural aspects of the system described in the specification is not mandatory or important, and the mechanisms of the present application can have different names, forms or procedures, and can be implemented by different mechanisms or features. The system can be implemented by a combination of hardware and software (as described), entirely by hardware elements, or entirely by software elements. The specific division of functions between various system components described in the specification is only exemplary, and is not mandatory; on the contrary, the functions performed by a single system component can be performed by multiple components, or the functions performed by multiple components can be performed by a single component.

[0103] Those skilled in the art will appreciate that the various steps of the methods disclosed above can be implemented by general computing devices, which can be centralized on a single computing device or distributed across a network of multiple computing devices, and optionally can be implemented by program code executable by a computing device, which can be stored in a storage device and executed by a computing device, or can be implemented by individual integrated circuit modules, or by multiple modules or steps implemented by a single integrated circuit module. Thus, the embodiments of the present application are not limited to any particular combination of hardware and software.

[0104] The computing device executable programs (also referred to as programs, software, software applications, or code) include machine instructions for a programmable processor, and can be implemented using high level procedural and / or object oriented programming languages, and / or assembly / machine languages. As used herein, the terms "machine-readable medium" and "computer-readable medium" refer to any computer program product, apparatus and / or device (e.g., magnetic discs, optical disks, memory, Programmable Logic Devices (PLDs)) used to provide machine instructions and / or data to a programmable processor, including a machine-readable medium that receives machine instructions as a machine-readable signal. The term "machine-readable signal" refers to any signal that can be used to provide machine instructions and / or data to a programmable processor.

[0105] Certain aspects of the present application include process steps and instructions described herein in the form of an algorithm. It should be noted that the process steps and instructions of the present application can be implemented in software, firmware and / or hardware, and when implemented in software, they can be downloaded from a variety of operating systems used on different platforms and operated therefrom.

[0106] Those skilled in the art can understand that the structures shown in the various figures are only block diagrams of part of the structures related to the schemes of the present application, and do not constitute a limitation on the terminal device to which the schemes of the present application are applied. The specific terminal device can include more or less components than those shown in the figures, or combine certain components, or have a different arrangement of components.

[0107] In the description of the specification, the description of the terms "one embodiment", "some embodiments", "example", "specific example", or "possible design" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are contained in at least one embodiment or example of the application. In the description of the specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in one or more embodiments or examples. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the specification and the features of the different embodiments or examples without contradiction and combination.

[0108] Finally, it should also be noted that, in this document, the relationship terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between the entities or operations. Moreover, the terms "include", "contain" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or device. Without more limitations, the element defined by the statement "including a" does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0109] The above embodiments are only used to illustrate the technical solutions of the present application, but not to limit it; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced by equivalent; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A modeling and analysis method for flexible DC converter valves, characterized in that, include: Geometric models of the valve tower and valve hall air vents of the flexible DC converter valve are obtained respectively. Physical field coupling simulation is performed based on the valve tower geometric model to establish the valve tower parameter mapping relationship, which represents the mapping relationship between the valve tower geometric parameters and the valve tower equivalent heat transfer coefficient. Physical field coupling simulation is performed based on the geometric model of the valve hall vent to establish the valve hall parameter mapping relationship, which represents the mapping relationship between the geometric parameters of the valve hall vent and the equivalent heat transfer coefficient of the valve hall. A parameter calculation and analysis model is obtained by using the valve tower parameter mapping relationship and the valve hall parameter mapping relationship. The parameter calculation and analysis model is used for temperature field simulation analysis of the converter valve.

2. The method according to claim 1, characterized in that, The geometric model of the converter valve tower is obtained by performing geometric modeling, including: The converter valve tower is geometrically simplified and modeled to preserve its heat dissipation characteristics, resulting in the geometric model of the valve tower.

3. The method according to claim 1, characterized in that, The physical field coupling simulation based on the valve tower geometric model to establish the valve tower parameter mapping relationship includes: Under the same cooling water flow rate, the valve tower height is changed, and an electro-thermal-fluid coupling simulation is performed based on the valve tower geometric model to calculate the valve tower equivalent heat transfer coefficient corresponding to each valve tower height. The mapping relationship between valve tower height and valve tower equivalent heat transfer coefficient is recorded as the valve tower parameter mapping relationship.

4. The method according to claim 3, characterized in that, The valve tower parameter mapping relationship is expressed as follows: ， in, Indicates the equivalent heat transfer coefficient of the valve tower. Indicates the height of the valve tower. , , D represents the parameters calibrated through electro-thermal-fluid coupling simulation scanning. Indicates the cooling water flow rate. Indicates The base is D, and the exponent is the power of the exponent.

5. The method according to claim 1, characterized in that, The geometric model of the valve hall vent is obtained by performing geometric modeling on the vent, which includes: The supply and return air vents of the valve hall are simplified into rectangular opening models, and the aspect ratio of the rectangular opening models is kept consistent with the actual physical contour of the valve hall vents, thus obtaining the geometric model of the valve hall vents.

6. The method according to claim 1, characterized in that, The physical field coupling simulation based on the geometric model of the valve hall vent to establish the valve hall parameter mapping relationship includes: Using the geometric model of the valve hall air outlet as the fluid boundary condition between the valve hall and the external environment, the radius of the valve hall air outlet is changed under different input wind speed conditions. The equivalent heat transfer coefficient of the valve hall corresponding to the radius of each valve hall air outlet is calculated by using heat-fluid coupling simulation. The mapping relationship between the radius of the valve hall air outlet and the equivalent heat transfer coefficient of the valve hall is recorded as the valve hall parameter mapping relationship.

7. The method according to claim 6, characterized in that, The valve chamber parameter mapping relationship is expressed as follows: ， in, This represents the equivalent heat transfer coefficient of the valve hall. , These represent the air outlet radii of the two air outlets in the valve hall. , , , , F represents the parameters calibrated through electro-thermal-fluid coupling simulation scanning. Indicates the input wind speed. Indicates The base is F, and the exponent is the power of the exponent.

8. A flexible DC converter valve modeling and analysis device, characterized in that, include: The geometric modeling module is used to geometrically model the converter valve tower and the valve hall air outlet respectively, and obtain the geometric model of the valve tower and the geometric model of the valve hall air outlet. The first coupled simulation module is used to perform physical field coupled simulation based on the valve tower geometric model to establish the valve tower parameter mapping relationship, which represents the mapping relationship between the valve tower geometric parameters and the valve tower equivalent heat transfer coefficient. The second coupled simulation module is used to perform physical field coupled simulation based on the geometric model of the valve hall vent to establish the valve hall parameter mapping relationship, which represents the mapping relationship between the geometric parameters of the valve hall vent and the equivalent heat transfer coefficient of the valve hall. The parameter calculation module is used to calculate the parameter simulation analysis model using the valve tower parameter mapping relationship and the valve hall parameter mapping relationship. The parameter simulation analysis model is used for the temperature field simulation analysis of the converter valve.

9. An electronic device, characterized in that, It includes a memory storing computer-executable instructions and a processor, which, when executed by the processor, causes the device to perform the flexible DC converter valve modeling and analysis method as described in any one of claims 1 to 7.

10. A readable storage medium, characterized in that, It contains a computer-executable program that, when executed, enables the flexible DC converter valve modeling and analysis method as described in any one of claims 1 to 7.

Images