Design method and system of high-temperature-resistant wave-absorbing / wave-transmitting bearing structure

Abstract

The invention discloses a design method and system of a high-temperature-resistant bearing wave-absorbing / wave-transmitting structure, and belongs to the technical field of calculation of electromagnetic structural strength crossing. Comprising the following steps: carrying out mechanical, thermal and electromagnetic performance characterization on a bearing core layer, and constructing an equivalent transmission line model of the bearing core layer; constructing an equivalent circuit model based on the equivalent transmission line model; importing the structure parameters into the equivalent circuit model, calculating the electrical performance, and researching the influence of the structure parameters on the electromagnetic performance to obtain key design parameters; establishing an optimization model by taking the key design parameters as optimization objects, the electromagnetic performance indexes as optimization targets and the force and thermal performance indexes of the structure as constraint conditions; key design parameters are initialized and imported into the optimization model, deformation and temperature performance indexes of the structure are calculated, and electromagnetic performance indexes under all temperature detection points are obtained; judging whether the thermal performance meets a constraint condition or not and whether the electromagnetic performance index meets an optimization target or not; and if not, modifying the key design parameters until the conditions are met.

Description

Technical Field

[0001] This invention belongs to the interdisciplinary field of computational electromagnetic structural strength, specifically relating to a design method and system for a high-temperature resistant load-bearing wave-absorbing / wave-transmitting structure. Background Technology

[0002] With the continuous development of technology and the increasing speed of high-speed aircraft, the radome at the forefront of these vehicles faces severe aerodynamic and thermal loads. These loads not only deform the radome but also alter the electromagnetic parameters of the structural materials, significantly impacting its mechanical and electrical properties. Ceramic-based honeycomb sandwich structures possess excellent specific strength, specific modulus, temperature resistance, and wave transmission performance, making them widely used in aircraft radomes. By using a ceramic-based honeycomb as the load-bearing core layer and attaching an absorbing / transmitting structure composed of an integrated absorbing / transmitting frequency selective surface (ATFSS) to the high-temperature resistant ceramic-based load-bearing core layer, a high-temperature resistant load-bearing absorbing / transmitting structure can be formed, effectively improving the high-temperature load-bearing / absorbing / transmitting performance of the radome structure.

[0003] However, in existing technologies, when ceramic-based load-bearing core layers are combined with ATFSS, only the presence or absence of high-temperature resistance and microwave absorption / transmission properties are often considered. The configuration is simply a composite of the ceramic-based load-bearing core layer and ATFSS, but multi-physics coupling analysis of high-temperature load-bearing microwave absorption / transmission structures is still lacking. Furthermore, the temperature drift and structural deformation of the constituent materials of high-temperature load-bearing microwave absorption / transmission structures are often not considered during the design process, limiting their broadband application and high-temperature stability. Therefore, conducting research on the mechanical-thermal-electrical matching design of high-temperature load-bearing microwave absorption / transmission structures has significant scientific and engineering application value. To this end, a design method for high-temperature load-bearing microwave absorption / transmission structures is proposed, starting from the integrated multi-physics structural design. Summary of the Invention

[0004] To address the shortcomings of existing technologies, the present invention aims to provide a design method and system for a high-temperature resistant, load-bearing, wave-absorbing / wave-transmitting structure, thereby solving the problems in the prior art.

[0005] The objective of this invention can be achieved through the following technical solutions: A design method for a high-temperature resistant load-bearing / wave-absorbing / transmitting structure includes the following steps: S1, characterize the mechanical, thermal and electromagnetic properties of the bearing core layer of the high-temperature resistant bearing wave-absorbing / wave-transmitting structure, calculate the mechanical, thermal and electromagnetic properties of the bearing core layer, and construct the equivalent transmission line model of the bearing core layer; S2, Based on the equivalent circuit model of the absorbing / transmitting structure, combined with the equivalent transmission line model of the carrying core layer, an equivalent circuit model of the high-temperature resistant carrying absorbing / transmitting structure is constructed. S3. The structural parameters of the absorbing / transmitting structure are imported into the equivalent circuit model of the high-temperature resistant absorbing / transmitting structure. The electrical performance of the high-temperature resistant absorbing / transmitting structure is calculated, and the influence of the absorbing / transmitting structure parameters on its electromagnetic performance is studied to obtain the key design parameters that affect the electromagnetic performance of the absorbing / transmitting structure. S4, taking the key design parameters obtained in S3 as the optimization object, taking the electromagnetic performance index of the wave-transmitting / wave-absorbing structure under the force-thermal coupling environment as the optimization target, and taking the force and thermal performance index of the structure as the constraint, establishes a force-thermal-electric integrated optimization model for the high-temperature load-bearing wave-absorbing / wave-transmitting structure. S5. Initialize the key design parameters of the optimization model, discretize the design temperature, and form n temperature detection points; S6. Import the key design parameters into the optimization model established in S4, and perform mechanical-thermal coupling analysis on the equivalent model of the high-temperature resistant load-bearing microwave absorbing / transmitting structure to obtain the deformation and temperature performance indicators of the high-temperature resistant load-bearing microwave absorbing / transmitting structure at each temperature detection point; import the deformation and temperature performance indicators obtained from the mechanical-thermal coupling analysis into the equivalent circuit model of the high-temperature resistant load-bearing microwave absorbing / transmitting structure to perform mechanical-thermal coupling analysis to obtain the electromagnetic performance indicators at each temperature detection point; S7. Determine whether the mechanical and thermal performance meets the constraints in S4, and whether the electromagnetic performance index meets the optimization objective in S4. If not, modify the key design parameters and repeat S5-S6 until the constraints are met.

[0006] Furthermore, when characterizing the mechanical properties of the load-bearing core layer, a mechanical finite element model of the load-bearing core layer structural cell is established, material properties are assigned, and periodic boundary conditions are applied to the mechanical finite element model to solve for the equivalent mechanical performance parameters. When characterizing the thermal properties of the load-bearing core layer, a thermal finite element model of the load-bearing core layer cell is established, material properties are set, and its equivalent thermal performance parameters are solved based on the finite element method. When characterizing the electromagnetic properties of the core layer, an electromagnetic calculation finite element model of the core layer structure is established, material properties are assigned, and periodic boundary conditions are applied to the electromagnetic calculation finite element model to solve for the equivalent electromagnetic parameters.

[0007] Furthermore, the process of establishing an equivalent circuit model for a high-temperature resistant load-bearing / wave-transmitting structure includes: establishing a transmission line model that reflects the relationship between the structural parameters of the load-bearing core layer and its mechanical, thermal, and electromagnetic properties, based on the equivalent circuit principle; and establishing an equivalent circuit model that reflects the electrical performance of the load-bearing / wave-transmitting structure by equating the wave-absorbing / wave-transmitting structure to a series-parallel capacitor-inductor circuit, based on the equivalent circuit principle; and combining the transmission line model and the equivalent circuit model to construct an equivalent circuit model for the high-temperature resistant load-bearing / wave-transmitting structure.

[0008] Furthermore, the formula for obtaining the key design parameters affecting the electromagnetic performance of the absorbing / transmitting structure is as follows: in, and These are: the transmission / reflection coefficients of high-temperature resistant, load-bearing, wave-absorbing / wave-transmitting structures. TZ A transmission matrix for carrying the equivalent circuit of a high-temperature resistant absorbing / transmitting structure; TS The normalized transfer matrix represents the loss layer structure. TC Represented as the normalized transmission matrix carrying the core layer, TT This represents the normalized transfer matrix of the bandpass layer. For free space impedance, The impedance of the loss layer substrate. The impedance of the bandpass layer substrate. The equivalent surface impedance of the loss layer FSS is... To bear the equivalent impedance of the core layer, The equivalent surface impedance of the bandpass layer FSS is... The thickness of the loss layer dielectric substrate, The thickness of the bandpass dielectric substrate. The out-of-plane deformation of the load-bearing core structure caused by thermal and force fields; , , These are the propagation constants of the loss layer substrate, core layer, and bandpass layer substrate, respectively. The speed of light in a vacuum. It is the equivalent dielectric constant.

[0009] Furthermore, the optimization model is as follows: in, To ensure the transmission coefficient of the high-temperature resistant, wave-absorbing / wave-transmitting structure at the resonant frequency, The maximum stress under mechanical and thermal loads. The maximum deformation is in the height direction. n Number of temperature detection points For material strength, S The target transmission coefficient at the resonant frequency. h For core layer height, m 0 represents the initial cell mass of the target optimization result. a , b These are the structural parameters of the loss layer and the bandpass layer, respectively. and These are the absorption band bandwidth and transmission band bandwidth of the structure, respectively. It is the expected reflectance coefficient. , To satisfy the endpoints of the absorbing band, It is the expected transmission coefficient. , End of the wave-transparent zone.

[0010] Furthermore, the steps for calculating the mechanical and thermal performance indicators of the high-temperature resistant load-bearing / wave-transmitting structure at each temperature detection point include: Material properties are assigned to the thermal finite element model of the core structure, the initial temperature of the overall structure is constrained, a temperature load is applied to the upper surface of the structure, and the temperature of the integrated wave-absorbing / wave-transmitting structure is calculated through transient heat conduction analysis. Material properties are assigned to the mechanical finite element model of the load-bearing core structure, the longitudinal displacement of the bottom surface of the finite element model is constrained, a uniformly distributed load is applied to the upper surface, and the deformation of the load-bearing core structure is calculated through mechanical-thermal coupling analysis. The process of calculating the electromagnetic performance indicators of the structure at each temperature detection point is as follows: The calculated temperature and deformation of the load-bearing core structure are imported into the equivalent circuit model of the high-temperature load-bearing absorbing / transmitting structure. An electromagnetic structural finite element model of the high-temperature load-bearing absorbing / transmitting structure is established, and material properties are assigned. Periodic boundary conditions are applied, and its transmission and reflection coefficients are solved. Its absorption and transmission bandwidths are calculated.

[0011] A design system for a high-temperature resistant, load-bearing, wave-absorbing / wave-transmitting structure includes: Performance characterization module: Characterizes the mechanical, thermal, and electromagnetic properties of the load-bearing core layer of the high-temperature resistant load-bearing wave-absorbing / wave-transmitting structure, calculates the mechanical, thermal, and electromagnetic properties of the load-bearing core layer, and constructs an equivalent transmission line model of the load-bearing core layer; Equivalent circuit model construction module: Based on the equivalent circuit model of the absorbing / transmitting structure, combined with the equivalent transmission line model of the carrying core layer, an equivalent circuit model of the high-temperature resistant carrying absorbing / transmitting structure is constructed.

[0012] Key design parameter acquisition module: The structural parameters of the absorbing / transmitting structure are imported into the equivalent circuit model of the high-temperature resistant absorbing / transmitting structure, the electrical performance of the high-temperature resistant absorbing / transmitting structure is calculated, the influence of the absorbing / transmitting structure parameters on its electromagnetic performance is studied, and the key design parameters affecting the electromagnetic performance of the absorbing / transmitting structure are obtained. Optimization Model Construction Module: Taking key design parameters as optimization objects, electromagnetic performance indicators of wave-transmitting / wave-absorbing structures under force-thermal coupling environment as optimization objectives, and force and thermal performance indicators of structures as constraints, a force-thermal-electric integrated optimization model for high-temperature load-bearing wave-absorbing / wave-transmitting structures is established. Parameter initialization module: Initializes the key design parameters of the optimization model, discretizes the design temperature, and forms n temperature detection points; The index solving module imports key design parameters into the optimization model and performs mechanical-thermal coupling analysis on the equivalent model of the high-temperature resistant load-bearing microwave absorbing / transmitting structure to obtain the deformation and temperature performance indices of the high-temperature resistant load-bearing microwave absorbing / transmitting structure at each temperature detection point. The deformation and temperature performance indices obtained from the mechanical-thermal coupling analysis are then imported into the equivalent circuit model of the high-temperature resistant load-bearing microwave absorbing / transmitting structure for mechanical-thermal coupling analysis to obtain the electromagnetic performance indices at each temperature detection point. Judgment module: Determines whether the mechanical and thermal performance meets the constraints and whether the electromagnetic performance index meets the optimization objective; if not, it modifies the key design parameters and repeats the parameter initialization module to the index solving module until the constraints are met.

[0013] A computer storage medium storing a readable program, which, when executed, instructs a computing device to perform a design method for a high-temperature resistant, load-bearing, wave-absorbing / wave-transmitting structure as described above.

[0014] An electronic device includes: a processor, a memory, a communication interface, and a communication bus, wherein the processor, the memory, and the communication interface communicate with each other through the communication bus; The memory is used to store at least one executable instruction, which causes the processor to perform the operation corresponding to the design method of a high-temperature resistant load-bearing / wave-transmitting structure described above.

[0015] A computer program product includes computer instructions that instruct a computing device to perform operations corresponding to the design method of a high-temperature resistant load-bearing / wave-absorbing / wave-transmitting structure described above.

[0016] The beneficial effects of this invention are: 1. An equivalent circuit model of a high-temperature load-bearing absorbing / transparent structure was established, which can simulate the electromagnetic performance of the high-temperature load-bearing absorbing / transparent structure under high-temperature load-bearing environment. The variation law of the mechanical, thermoelectric and electromagnetic properties of the high-temperature load-bearing absorbing / transparent structure under mechanical and thermal loads was analyzed, providing a reference for the high-temperature load-bearing and broadband absorbing / transparent design of high-temperature load-bearing absorbing / transparent structures.

[0017] 2. A mechanical-thermal-electric integrated optimization design method for high-temperature load-bearing wave-absorbing / transmitting structures was proposed, realizing the parametric and automated design of high-temperature load-bearing wave-absorbing / transmitting structures. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a flowchart of the design method for the high-temperature resistant load-bearing wave-absorbing / wave-transmitting structure of the present invention; Figure 2 This is a schematic diagram and equivalent circuit diagram of a high-temperature resistant, load-bearing, wave-absorbing / wave-transmitting structure. Figure 3 Diagram of the core cell structure of a high-temperature resistant, wave-absorbing / wave-transmitting structure; Figure 4 Structural diagram of the loss layer and bandpass layer of a high-temperature resistant, load-bearing microwave absorbing / transmitting structure; Figure 5 Electrical performance diagram of a high-temperature load-bearing microwave absorbing / transmitting structure at 0 ℃; Figure 6 Electrical performance diagram of a high-temperature load-bearing microwave absorbing / transmitting structure at 1000 ℃; Figure 7 Stress cloud diagram for high-temperature resistant, load-bearing / wave-transmitting structures; Figure 8 Deformation cloud diagram of a high-temperature resistant, load-bearing / wave-transmitting structure. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] Example 1 like Figure 1 As shown, a design method for a high-temperature resistant load-bearing / wave-absorbing / transmitting structure includes the following steps: S1, characterize the mechanical, thermal and electromagnetic properties of the bearing core layer of the high-temperature resistant bearing wave-absorbing / wave-transmitting structure, calculate the mechanical, thermal and electromagnetic properties of the bearing core layer, and construct the transmission line equivalent performance parameters of the bearing core layer; S11, When characterizing the mechanical properties of the load-bearing core layer, a mechanical finite element model of the core layer structural cell is established, material properties are assigned, and periodic boundary conditions are applied to the mechanical finite element model to solve for the equivalent mechanical performance parameters; the solution process is as follows: According to Hooke's law, the constitutive equation of the material is shown in equation (1).

[0022] (1) In the formula: σ The stress matrix; D Here is the stiffness matrix; ε Let be the strain matrix. Its expansion is: (2) In the formula: σ uu It is normal stress; τ uv Shear stress; C uv This is the stiffness coefficient; ε uu For positive strain; γ uv For shear strain.

[0023] The stiffness matrix of the supporting core structure cell is equivalently solved using the finite element method; during the solution, the strain of the cell is taken into account. ε =[ ε 11 , ε 22 , ε 33 , γ 12 , γ 23 , γ 31 ] T For the boundary conditions of the simulation analysis, the boundary conditions are set such that the strain is... i The value of each element is ε ( i ), ε ( i If ) ≠ 0, the values ​​of the remaining elements are 0; at this time, the equivalent stiffness matrix is...i The value of the column can be obtained through equation (3): (3) In the formula: D e ( i ) is the first of the equivalent stiffness matrices. i List; V The volume of a cell; N This represents the number of cell grid units; σ n For the first n Stress of each unit; Δ V n For the first n The volume of each unit.

[0024] The equivalent stiffness matrix of the load-bearing core structure can be obtained using the above method. D e Then the corresponding compliance coefficient matrix can be obtained. B : (4) In the formula: E 11 , E 22 , E 33 It is the elastic modulus; G 12 , G 23 , G 13 Shear modulus; v 12 , v 23 , v 13 Poisson's ratio; Then, the equivalent elastic parameters and Poisson's ratio can be obtained from equation (5): (5) In the formula, B uv The flexibility coefficient, E uv For the equivalent elastic modulus, G uv For equivalent shear modulus, V uv This is the equivalent Poisson's ratio.

[0025] If the core layer is equivalent to a homogeneous substrate, the equivalent mechanical properties parameters obtained above are the mechanical properties parameters of the equivalent homogeneous dielectric substrate.

[0026] S12, When characterizing the thermal properties of the load-bearing core layer, a thermal finite element model of the load-bearing core layer cell is established, material properties are set, and its equivalent thermal performance parameters are solved based on the finite element method. The process of solving for the equivalent thermal conductivity is as follows: (6) In the formula: The density is the equivalent homogeneous plate material density; D The thickness of the honeycomb wall; L The length of the honeycomb wall; ρ 0 represents the density of the cell material; Thermal conductivity can be solved using Fourier's law of thermal conductivity: (7) In the formula: Φ Heat flow; A For heat transfer area; x Let the coordinates be on the heat-conducting surface. is the thermal conductivity.

[0027] During the solution process, the boundary conditions are that the temperatures of the upper and lower surfaces remain constant, and the remaining surfaces are adiabatic. The average heat flux density of the supporting core cell under steady-state conditions can then be obtained. According to Fourier's law and the fact that the equivalent total heat flux equals the total heat flux of the honeycomb core structure, the equivalent thermal conductivity along the cell height direction is: (8) In the formula: Here, h represents the equivalent thermal conductivity along the cell height direction, and h is the height of the load-bearing core layer. To support the average heat flux density of the core layer, To support the heat transfer area of ​​the core layer, The equivalent volumetric heat transfer area, The temperature difference between the upper and lower surfaces. , These are the temperatures of the upper and lower surfaces, respectively. Porosity of the core layer: (9) If the core layer is equivalent to a homogeneous substrate, the equivalent thermal performance parameters obtained above are the thermal performance parameters of the equivalent homogeneous dielectric substrate.

[0028] S13, when characterizing the electromagnetic properties of the core layer, the reflection coefficient S11 and transmission coefficient S21 of the core layer are obtained through simulation calculation, and then the equivalent dielectric constant of the material is inverted; an electromagnetic calculation finite element model of the core layer structure is established, material properties are assigned, and periodic boundary conditions are applied to the electromagnetic calculation finite element model to solve for the equivalent electromagnetic parameters: the solution process is as follows: According to transmission line theory, the transmission formula for a two-port network is: (10) In the formula: S11 and S21 are the reflection coefficient and transmission coefficient, respectively, and satisfy the following conditions: , Both can be obtained through simulation calculations; b is the input signal; a is the output signal; For a homogeneous flat plate structure, the transfer matrix can be written in the following analytical form: (11) In the formula: For the transmission matrix ，n The refractive index of the material; Z The intrinsic impedance of the material; d The thickness is that of a homogeneous flat plate; k For free space wavenumber; Based on the above transmission matrix The relationship between the reflection coefficient and the transmission coefficient can be obtained by the following formula: (12) The refractive index can be obtained from formula (9). n and intrinsic impedance Z The equivalent dielectric constant after homogenization εe and equivalent permeability μe It can be calculated using the following formula: (13) For ceramic-based dielectric materials, their equivalent permeability typically satisfies At this point, the effect of the equivalent permeability on the electromagnetic properties of the metamaterial's high-temperature load-bearing core can be ignored.

[0029] If the core layer is equivalent to a homogeneous substrate, the equivalent electromagnetic performance parameters obtained above are the electromagnetic performance parameters of the equivalent homogeneous dielectric substrate.

[0030] Based on the transmission line equivalent performance parameters of the carrying core layers in S11-S13, a transmission line model that reflects the relationship between the structural parameters of the carrying core layers and their mechanical, thermal, and electromagnetic properties is established.

[0031] S2, based on the principle of equivalent circuit, the absorbing / transparent structure is equivalent to a series and parallel circuit of capacitor and inductor, and an equivalent circuit model that can reflect the electrical performance of the absorbing / transparent structure is established; the influence law of the absorbing / transparent structure parameters on its electromagnetic performance is studied, the key design parameters affecting the electromagnetic performance of the absorbing / transparent structure are obtained, and the transmission line model and equivalent circuit model of S1 are combined to construct an equivalent circuit model of the high temperature resistant bearing absorbing / transparent structure; The process of constructing an equivalent circuit model for a high-temperature resistant, wave-absorbing / wave-transmitting structure includes: S21, based on the equivalent circuit principle, the metal patch gap portion of the ATFSS is equivalent to a capacitor, and the metal grid portion can be equivalent to an inductor. Therefore, the high-temperature resistant wave-absorbing / wave-transmitting structure can be equivalent to a capacitor-resistor series-parallel circuit, establishing an equivalent circuit model that accurately reflects the wave-absorbing / wave-transmitting structure. S22, Solve for the thermoelectric response of the absorbing / transmitting structure under high temperature conditions. The electromagnetic properties of the absorbing / transmitting structure will be affected under high-temperature thermal loads. Under mechanical thermal loads, the equivalent surface impedance of the loss layer FSS is... : (14) The equivalent surface impedance of the bandpass layer FSS is : (15) In the formula: R represents the loss layer resistance in the absorbing / transmitting structure. The temperature stability of the loss layer resistance can be evaluated by the temperature coefficient of resistance (TCR). When the ambient temperature increases, the sheet resistance of the loss layer will change accordingly. The formula for calculating the TCR value is: (16) In the formula: The resistance value under initial temperature conditions. The initial temperature. Let be the temperature. At this point, the resistance of the thick-film resistor at any temperature can be calculated: (17) The design of high-temperature resistant load-bearing / transparent structures requires determining the equivalent electromagnetic parameters of the load-bearing core layer. Under high-temperature conditions, the electromagnetic properties of the substrate material for the load-bearing / transparent structure also change, especially its dielectric constant. It will increase, the increase amount It can be obtained through experimentation.

[0032] S23, solve for the deformation of the wave-absorbing / wave-transmitting structure under high temperature conditions. Based on the equivalent thermal performance parameters of the load-bearing core layer obtained in S1, solve for the deformation in the thickness direction of the load-bearing core layer under high temperature conditions.

[0033] The temperature distribution of the radome is mainly calculated based on the three-dimensional thermal conductivity differential equation in Cartesian coordinates: (18) In the formula: For temperature, , , These are the object's position coordinates. For thermal diffusivity, For density, For specific heat capacity, is the thermal conductivity.

[0034] The temperature distribution can be obtained from equation (16), and then substituted into the elastic equation considering thermoelasticity: (19) In the formula: For Young's modulus, Poisson's ratio, The temperature difference between the upper and lower surfaces, and the volumetric strain. The value is: (20) In the formula: , , This represents the displacement component.

[0035] S24, the material temperature drift and structural deformation of the high-temperature resistant load-bearing / absorbing / transmitting structure obtained in S22 and S23 under high-temperature load-bearing conditions are imported into the equivalent circuit model of the absorbing / transmitting structure. According to equivalent circuit theory, the normalized transfer matrix calculation formula for the equivalent circuit model of the high-temperature resistant load-bearing / absorbing / transmitting structure constructed in S2 is as follows: (twenty one) (twenty two) (twenty three) In the formula: TS The normalized transfer matrix represents the loss layer structure. TC Represented as the normalized transmission matrix carrying the core layer, TT This represents the normalized transfer matrix of the bandpass layer. For free space impedance, The impedance of the loss layer substrate. ZTF The impedance of the bandpass layer substrate. The equivalent surface impedance of the FSS layer is the loss layer. To bear the equivalent impedance of the core layer, ZT The equivalent surface impedance of the bandpass layer FSS is... h 1 represents the thickness of the loss layer dielectric substrate. h 2 represents the thickness of the bandpass dielectric substrate. The out-of-plane deformation of the load-bearing core structure caused by the thermal and force fields is determined by the deformation calculated by S23. , , are the propagation constants of the loss layer substrate, core layer, and bandpass layer substrate, respectively, where: (twenty four) In the formula: The speed of light in a vacuum. The equivalent dielectric constant of the core layer is determined by the temperature distribution calculated by S22.

[0036] At this point, the total normalized transmission matrix of the high-temperature resistant wave-absorbing / wave-transmitting structure is: (25) Where A, B, C, and D are the total normalized transfer matrices, respectively. T Z The constituent elements; S3, Analyze the influence of the microwave absorbing / transmitting structure parameters on its electromagnetic properties, and obtain the key design parameters that affect the electromagnetic properties of the material; Key design parameters affecting the electromagnetic properties of materials include: structural parameters of the core structure and partial dimensional parameters of the ATFSS (Amplitude-Absorbing and Wave-Transmitting Structural Unit). The steps to obtain these key design parameters are as follows: The equivalent circuit model of the high-temperature resistant absorbing / transmitting structure established by S2 has the following transmission coefficient: (26) The reflection coefficient of the absorbing / transmitting structure is: (27) The transmission coefficient and reflection coefficient of the high-temperature resistant load-bearing absorbing / transmitting structure at various frequency points can be calculated from equations (26) and (27). The absorption bandwidth of the structure is then: (28) The bandwidth of the high-temperature resistant load-bearing wave-absorbing / wave-transmitting structure is: (29) In the formula: It is the expected reflectance coefficient. , To satisfy the endpoints of the absorbing band, It is the expected transmission coefficient. , End of wave-transmitting zone; By changing the structural parameters, the law of change of the absorption / transmission bandwidth with the structural parameters is summarized, and the key design parameters that have a significant impact on the transmission / reflection coefficient are selected as the optimization design parameters of the equivalent circuit model of the high-temperature resistant load-bearing absorption / transmission structure.

[0037] S4. Initialize the optimization design parameters of the equivalent circuit model of the high-temperature resistant load-bearing microwave absorbing / transmitting structure. Take the electromagnetic performance index of the high-temperature resistant load-bearing microwave absorbing / transmitting structure under force and thermal coupling environment as the optimization target and the force and thermal performance index of the high-temperature resistant load-bearing microwave absorbing / transmitting structure as the constraint condition to construct the optimization model. The minimum value of the product of the absorption and transmission bandwidths at different temperature detection points is used as the optimization objective to maximize the performance of the target within the design temperature range. The constraint is the transmission coefficient of the structure at the resonant frequency. Maximum stress under mechanical and thermal loads Maximum deformation in the height direction And the value range of each optimization parameter. This optimization model can be expressed as: (30) In the formula: The transmission coefficient at the target resonant frequency. Number of temperature detection points For material strength, The target transmission coefficient at the resonant frequency. For core layer height, , These are the structural parameters for the loss layer and the bandpass layer, respectively; to avoid... or In extreme cases where the value is too small, the minimum value of the product of the structural absorbing band and the transmitting band bandwidth at different temperature detection points is used as the optimization target.

[0038] S5 discretizes the design temperature to form n temperature detection points; The temperature discretization method is as follows: based on the designed temperature range, the designed temperature range is divided into several temperature intervals. For each temperature interval, a temperature value is taken as a temperature detection point. The selected temperature detection point should include two extreme temperature values.

[0039] S6, based on the equivalent circuit model of the high-temperature resistant load-bearing wave-absorbing / wave-transmitting structure established in S2, performs force / thermal / electromagnetic multi-physics field coupling analysis to obtain the force / thermal / electromagnetic performance indicators of the high-temperature resistant load-bearing wave-absorbing / wave-transmitting structure at each temperature detection point; The steps for calculating the mechanical and thermal performance indicators of high-temperature resistant load-bearing / wave-transmitting structures at various temperature detection points include: S61 assigns material properties to the mechanical-thermal coupled finite element model of the load-bearing core structure of the high-temperature load-bearing wave-absorbing / wave-transmitting structure. For the thermal finite element model of the structure, the initial temperature of the overall structure is constrained and a temperature load is applied to the upper surface of the structure. The longitudinal displacement of the bottom surface of the finite element model is constrained and a uniformly distributed load is applied to the upper surface. The temperature and deformation of the structure are calculated through mechanical-thermal coupling analysis. S62, based on the calculated deformation and temperature, determine whether the mechanical and thermal performance indicators of the designed high-temperature resistant load-bearing wave-absorbing / wave-transmitting structure meet the requirements, and determine whether the mechanical and thermal performance indicators meet the constraint conditions specified in S42.

[0040] The steps for calculating the electromagnetic performance indicators at each temperature detection point include: S63. The temperature and deformation calculated in S61-S62 are imported into the equivalent circuit model of the high-temperature load-bearing absorbing / transmitting structure to establish the electromagnetic finite element model of the high-temperature load-bearing absorbing / transmitting structure. Material properties are assigned, periodic boundary conditions are applied, its transmission / reflection coefficients are solved, and its absorbing / transmitting bandwidth is calculated according to S41.

[0041] S7. Based on the calculated electromagnetic performance indicators, determine whether the electromagnetic performance indicators of the designed high-temperature load-bearing absorbing / transmitting structure meet the optimization target specified in S4. If they meet the target, output the high-temperature load-bearing absorbing / transmitting structure. If they do not meet the target, modify the structural parameters of the absorbing / transmitting structure and repeat S6 until the result meets the requirements.

[0042] Based on a similar inventive concept, this embodiment of the invention also provides a computer storage medium storing a readable program that, when run by a processor, can execute the above-described design method for a high-temperature resistant, wave-absorbing / wave-transmitting structure.

[0043] Based on a similar inventive concept, this invention provides an electronic device, including: a processor, a memory, a communication interface, and a communication bus, wherein the processor, the memory, and the communication interface communicate with each other through the communication bus; The memory is used to store at least one executable instruction, which causes the processor to perform the operation corresponding to the above-described design method for a high-temperature resistant, wave-absorbing / wave-transmitting structure.

[0044] Based on a similar inventive concept, this invention also provides a computer program product, including computer instructions, which instruct a computing device to perform the operations corresponding to the above-described design method for a high-temperature resistant, load-bearing, wave-absorbing / wave-transmitting structure.

[0045] Example 2 In this embodiment, a specific example is used to verify the effectiveness of the design method of the present invention; 1. Parameter settings like Figure 1 As shown, this invention proposes a design method for a high-temperature resistant load-bearing wave-absorbing / wave-transmitting structure, in order to... Figure 2 The method will be explained in detail using the honeycomb sandwich ATFSS structure shown as an example. Figure 2 (a) in the diagram is a schematic diagram of a high-temperature resistant load-bearing wave-absorbing / wave-transmitting structure. Figure 2 (b) in the diagram is the equivalent circuit diagram of the high-temperature resistant load-bearing wave-absorbing / wave-transmitting structure. The cell side length of the honeycomb sandwich ATFSS structure is 15 mm, the thickness of the ATFSS substrate is 0.5 mm, and the honeycomb core layer is a hexagonal honeycomb. The material parameters of the honeycomb sandwich ATFSS structure under the initial conditions are shown in Table 1. Table 1 Material Parameters 2. Design Results Using this invention, a high-temperature resistant, load-bearing, integrated wave-absorbing / wave-transmitting design was developed for the aforementioned honeycomb sandwich ATFSS structure. The design results are as follows: Figure 3 and Figure 4 As shown in Table 2, the structural parameters of the designed high-temperature resistant load-bearing wave-absorbing / wave-transmitting structure are shown in Table 2. The microstructure model of the designed honeycomb sandwich ATFSS metamaterial is shown in Table 2. Figure 4 As shown, Figure 4 (a) in the diagram is a structural diagram of the loss layer and the resonant ring. Figure 4Table (b) shows the bandpass layer structure. The changes in the equivalent thermo-electromagnetic parameters of the honeycomb sandwich ATFSS structure before and after optimization are shown in Table 3. It can be seen that the honeycomb sandwich structure significantly improves wave transmission performance and mass. The equivalent dielectric constant of the honeycomb sandwich absorbing / transmitting structure decreased by 18.80%, the equivalent density decreased by 45.93%, and the unit cell mass decreased by 18.90% compared to before optimization. The electrical performance of the designed honeycomb sandwich ATFSS structure at 0 ℃ is shown in Table 3. Figure 5 As shown, Figure 5 In the diagram, (a) and (b) correspond to vertical polarization and horizontal polarization, respectively; the electrical properties at 1000 °C are as follows: Figure 6 As shown, Figure 6 In Table 4, (a) and (b) represent vertical and horizontal polarization, respectively. The absorption / transmission bandwidths calculated based on electrical performance are shown in Table 4. Within a temperature range of 0℃ to 1000℃ and an incident angle of 0° to 40°, the absorption bandwidth reaches 4.3 GHz, and the transmission bandwidth exceeds 1.3 GHz. At the resonant frequency of 10 GHz, the transmission coefficient of the structure is no less than -0.646 dB, demonstrating that the designed honeycomb sandwich absorption / transmission structure exhibits stable wide-bandwidth absorption / transmission performance. Figure 7 and Figure 8 In the design, the gradient honeycomb sandwich ATFSS structure has a maximum displacement of 9.663 μm and a maximum stress of 47 MPa, which meets the design specifications.

[0046] Table 2 Optimization Design Results of Honeycomb Sandwich Absorbing Structure Table 3. Cellular Core Layer Structure Parameters Table 4. Bandwidth variation of high-temperature resistant load-bearing / wave-absorbing / wave-transmitting structures In summary, the high-temperature resistant load-bearing wave-absorbing / wave-transmitting structure obtained based on the method of the present invention can maintain stable wide bandwidth and wide angle wave-absorbing / wave-transmitting performance while ensuring force / thermal load-bearing performance.

[0047] Example 3 In this embodiment, a design system for a high-temperature resistant, load-bearing, wave-absorbing / wave-transmitting structure is proposed, specifically including: Performance characterization module: Characterizes the mechanical, thermal, and electromagnetic properties of the load-bearing core layer of the high-temperature resistant load-bearing wave-absorbing / wave-transmitting structure, calculates the mechanical, thermal, and electromagnetic properties of the load-bearing core layer, and constructs an equivalent transmission line model of the load-bearing core layer; Equivalent circuit model construction module: Based on the equivalent circuit model of the absorbing / transmitting structure, combined with the equivalent transmission line model of the carrying core layer, an equivalent circuit model of the high-temperature resistant carrying absorbing / transmitting structure is constructed.

[0048] Key design parameter acquisition module: The structural parameters of the absorbing / transmitting structure are imported into the equivalent circuit model of the high-temperature resistant absorbing / transmitting structure, the electrical performance of the high-temperature resistant absorbing / transmitting structure is calculated, the influence of the absorbing / transmitting structure parameters on its electromagnetic performance is studied, and the key design parameters affecting the electromagnetic performance of the absorbing / transmitting structure are obtained. Optimization Model Construction Module: Taking key design parameters as optimization objects, electromagnetic performance indicators of wave-transmitting / wave-absorbing structures under force-thermal coupling environment as optimization objectives, and force and thermal performance indicators of structures as constraints, a force-thermal-electric integrated optimization model for high-temperature load-bearing wave-absorbing / wave-transmitting structures is established. Parameter initialization module: Initializes the key design parameters of the optimization model, discretizes the design temperature, and forms n temperature detection points; The index solving module imports key design parameters into the optimization model and performs mechanical-thermal coupling analysis on the equivalent model of the high-temperature resistant load-bearing microwave absorbing / transmitting structure to obtain the deformation and temperature performance indices of the high-temperature resistant load-bearing microwave absorbing / transmitting structure at each temperature detection point. The deformation and temperature performance indices obtained from the mechanical-thermal coupling analysis are then imported into the equivalent circuit model of the high-temperature resistant load-bearing microwave absorbing / transmitting structure for mechanical-thermal coupling analysis to obtain the electromagnetic performance indices at each temperature detection point. Judgment module: Determines whether the mechanical and thermal performance meets the constraints and whether the electromagnetic performance index meets the optimization objective; if not, it modifies the key design parameters and repeats the parameter initialization module to the index solving module until the constraints are met.

[0049] The methods of the present invention can be implemented in hardware, firmware, or as software or computer code that can be stored in a recording medium (such as a CD-ROM, RAM, floppy disk, hard disk, or magneto-optical disk), or as computer code originally stored on a remote recording medium or a non-transitory machine-readable medium and subsequently stored on a local recording medium, downloaded via a network. Thus, the methods described herein can be processed by software stored on a recording medium using a general-purpose computer, a dedicated processor, or programmable or dedicated hardware (such as an ASIC or FPGA). It is understood that the computer, processor, microprocessor controller, or programmable hardware includes storage components (e.g., RAM, ROM, flash memory, etc.) capable of storing or receiving software or computer code that, when accessed and executed by the computer, processor, or hardware, implements the methods described herein. Furthermore, when a general-purpose computer accesses the code used to implement the methods shown herein, the execution of the code transforms the general-purpose computer into a dedicated computer for performing the methods shown herein.

[0050] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention.

Claims

1. A design method for a high-temperature resistant load-bearing wave-absorbing / wave-transmitting structure, characterized in that, Includes the following steps: S1, characterize the mechanical, thermal and electromagnetic properties of the bearing core layer of the high-temperature resistant bearing wave-absorbing / wave-transmitting structure, calculate the mechanical, thermal and electromagnetic properties of the bearing core layer, and construct the equivalent transmission line model of the bearing core layer; S2, Based on the equivalent circuit model of the absorbing / transmitting structure, combined with the equivalent transmission line model of the carrying core layer, an equivalent circuit model of the high-temperature resistant carrying absorbing / transmitting structure is constructed. S3. The structural parameters of the absorbing / transmitting structure are imported into the equivalent circuit model of the high-temperature resistant absorbing / transmitting structure. The electrical performance of the high-temperature resistant absorbing / transmitting structure is calculated, and the influence of the absorbing / transmitting structure parameters on its electromagnetic performance is studied to obtain the key design parameters that affect the electromagnetic performance of the absorbing / transmitting structure. S4, taking the key design parameters obtained in S3 as the optimization object, taking the electromagnetic performance index of the wave-transmitting / wave-absorbing structure under the force-thermal coupling environment as the optimization target, and taking the force and thermal performance index of the structure as the constraint, establishes a force-thermal-electric integrated optimization model for the high-temperature load-bearing wave-absorbing / wave-transmitting structure. S5. Initialize the key design parameters of the optimization model, discretize the design temperature, and form n temperature detection points; S6. Import the key design parameters into the optimization model established in S4, and perform mechanical-thermal coupling analysis on the equivalent model of the high-temperature resistant load-bearing microwave absorbing / transmitting structure to obtain the deformation and temperature performance indicators of the high-temperature resistant load-bearing microwave absorbing / transmitting structure at each temperature detection point; import the deformation and temperature performance indicators obtained from the mechanical-thermal coupling analysis into the equivalent circuit model of the high-temperature resistant load-bearing microwave absorbing / transmitting structure to perform mechanical-thermal coupling analysis to obtain the electromagnetic performance indicators at each temperature detection point; S7, determine whether the mechanical and thermal performance meets the constraints in S4, and whether the electromagnetic performance index meets the optimization objective in S4; If the conditions are not met, modify the key design parameters and repeat steps S5-S6 until the constraints are met.

2. The design method of a high-temperature resistant load-bearing wave-absorbing / wave-transmitting structure according to claim 1, characterized in that, When characterizing the mechanical properties of the load-bearing core layer, a mechanical finite element model of the load-bearing core layer structural cell is established, material properties are assigned, and periodic boundary conditions are applied to the mechanical finite element model to solve for the equivalent mechanical performance parameters. When characterizing the thermal properties of the load-bearing core layer, a thermal finite element model of the load-bearing core layer cell is established, material properties are set, and its equivalent thermal performance parameters are solved based on the finite element method. When characterizing the electromagnetic properties of the core layer, an electromagnetic calculation finite element model of the core layer structure is established, material properties are assigned, and periodic boundary conditions are applied to the electromagnetic calculation finite element model to solve for the equivalent electromagnetic parameters.

3. The design method of a high-temperature resistant load-bearing wave-absorbing / wave-transmitting structure according to claim 1, characterized in that, The process of establishing an equivalent circuit model for a high-temperature resistant load-bearing / wave-transmitting structure includes: establishing a transmission line model that reflects the relationship between the structural parameters of the load-bearing core layer and its mechanical, thermal, and electromagnetic properties, based on the equivalent circuit principle; and establishing an equivalent circuit model that reflects the electrical performance of the load-bearing / wave-transmitting structure by equating the wave-absorbing / wave-transmitting structure to a series-parallel capacitor-inductor circuit, based on the equivalent circuit principle; and combining the transmission line model and the equivalent circuit model to construct an equivalent circuit model for the high-temperature resistant load-bearing / wave-transmitting structure.

4. The design method of a high-temperature resistant load-bearing wave-absorbing / wave-transmitting structure according to claim 1, characterized in that, The formula for obtaining the key design parameters affecting the electromagnetic performance of the absorbing / transmitting structure is as follows: in, and These are: the transmission / reflection coefficients of high-temperature resistant, load-bearing, wave-absorbing / wave-transmitting structures. TZ A transmission matrix for carrying the equivalent circuit of a high-temperature resistant absorbing / transmitting structure; TS The normalized transfer matrix represents the loss layer structure. TC Represented as the normalized transmission matrix carrying the core layer, TT This represents the normalized transfer matrix of the bandpass layer. For free space impedance, The impedance of the loss layer substrate. The impedance of the bandpass layer substrate. The equivalent surface impedance of the loss layer FSS is... To bear the equivalent impedance of the core layer, The equivalent surface impedance of the bandpass layer FSS is... The thickness of the loss layer dielectric substrate, The thickness of the bandpass dielectric substrate. The out-of-plane deformation of the load-bearing core structure caused by thermal and force fields; , , These are the propagation constants of the loss layer substrate, core layer, and bandpass layer substrate, respectively. The speed of light in a vacuum. It is the equivalent dielectric constant.

5. The design method of a high-temperature resistant load-bearing wave-absorbing / wave-transmitting structure according to claim 1, characterized in that, The optimization model is as follows: in, To ensure the transmission coefficient of the high-temperature resistant, wave-absorbing / wave-transmitting structure at the resonant frequency, The maximum stress under mechanical and thermal loads. The maximum deformation is in the height direction. n Number of temperature detection points For material strength, S The target transmission coefficient at the resonant frequency. h For core layer height, m 0 represents the initial cell mass of the target optimization result. a , b These are the structural parameters of the loss layer and the bandpass layer, respectively. and These are the absorption band bandwidth and transmission band bandwidth of the structure, respectively. It is the expected reflectance coefficient. , To satisfy the endpoints of the absorbing band, It is the expected transmission coefficient. , End of the wave-transparent zone.

6. The design method of a high-temperature resistant load-bearing wave-absorbing / wave-transmitting structure according to claim 1, characterized in that, The steps for calculating the mechanical and thermal performance indicators of high-temperature resistant load-bearing / wave-transmitting structures at various temperature detection points include: Material properties are assigned to the thermal finite element model of the core structure, the initial temperature of the overall structure is constrained, a temperature load is applied to the upper surface of the structure, and the temperature of the integrated wave-absorbing / wave-transmitting structure is calculated through transient heat conduction analysis. Material properties are assigned to the mechanical finite element model of the load-bearing core structure, the longitudinal displacement of the bottom surface of the finite element model is constrained, a uniformly distributed load is applied to the upper surface, and the deformation of the load-bearing core structure is calculated through mechanical-thermal coupling analysis. The process of calculating the electromagnetic performance indicators of the structure at each temperature detection point is as follows: The calculated temperature and deformation of the load-bearing core structure are imported into the equivalent circuit model of the high-temperature load-bearing absorbing / transmitting structure. An electromagnetic structural finite element model of the high-temperature load-bearing absorbing / transmitting structure is established, and material properties are assigned. Periodic boundary conditions are applied, and its transmission and reflection coefficients are solved. Its absorption and transmission bandwidths are calculated.

7. A design system for a high-temperature resistant, load-bearing, wave-absorbing / wave-transmitting structure, characterized in that, include: Performance characterization module: Characterizes the mechanical, thermal, and electromagnetic properties of the load-bearing core layer of the high-temperature resistant load-bearing wave-absorbing / wave-transmitting structure, calculates the mechanical, thermal, and electromagnetic properties of the load-bearing core layer, and constructs an equivalent transmission line model of the load-bearing core layer; Equivalent circuit model construction module: Based on the equivalent circuit model of the absorbing / transmitting structure, combined with the equivalent transmission line model of the carrying core layer, an equivalent circuit model of the high-temperature resistant carrying absorbing / transmitting structure is constructed. Key design parameter acquisition module: The structural parameters of the absorbing / transmitting structure are imported into the equivalent circuit model of the high-temperature resistant absorbing / transmitting structure, the electrical performance of the high-temperature resistant absorbing / transmitting structure is calculated, the influence of the absorbing / transmitting structure parameters on its electromagnetic performance is studied, and the key design parameters affecting the electromagnetic performance of the absorbing / transmitting structure are obtained. Optimization Model Construction Module: Taking key design parameters as optimization objects, electromagnetic performance indicators of wave-transmitting / wave-absorbing structures under force-thermal coupling environment as optimization objectives, and force and thermal performance indicators of structures as constraints, a force-thermal-electric integrated optimization model for high-temperature load-bearing wave-absorbing / wave-transmitting structures is established. Parameter initialization module: Initializes the key design parameters of the optimization model, discretizes the design temperature, and forms n temperature detection points; The index solving module imports key design parameters into the optimization model and performs mechanical-thermal coupling analysis on the equivalent model of the high-temperature resistant load-bearing microwave absorbing / transmitting structure to obtain the deformation and temperature performance indices of the high-temperature resistant load-bearing microwave absorbing / transmitting structure at each temperature detection point. The deformation and temperature performance indices obtained from the mechanical-thermal coupling analysis are then imported into the equivalent circuit model of the high-temperature resistant load-bearing microwave absorbing / transmitting structure for mechanical-thermal coupling analysis to obtain the electromagnetic performance indices at each temperature detection point. Judgment module: Determines whether the mechanical and thermal performance meets the constraints and whether the electromagnetic performance index meets the optimization objective; If the conditions are not met, the key design parameters are modified, and the parameter initialization module is repeated until the index solution module is satisfied.

8. A computer storage medium storing a readable program, characterized in that, When the program runs, it can instruct the computing device to execute a design method for a high-temperature resistant load-bearing / wave-transmitting structure as described in any one of claims 1-6.

9. An electronic device, characterized in that, include: The processor, memory, communication interface, and communication bus are provided, wherein the processor, memory, and communication interface communicate with each other via the communication bus. The memory is used to store at least one executable instruction, which causes the processor to perform the operation corresponding to the design method of a high-temperature resistant load-bearing / wave-transmitting structure as described in any one of claims 1-6.

10. A computer program product comprising computer instructions, characterized in that, The computer instructions instruct the computing device to perform the operation corresponding to the design method of a high-temperature resistant load-bearing wave-absorbing / wave-transmitting structure as described in any one of claims 1-6.

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