Electrode column easy to weld and capacitor

Abstract

The invention discloses an easy-to-weld electrode column and a capacitor, and the electrode column comprises a first column body, a second column body, a third column body and a fourth column body which are connected in sequence, soldering tin infiltrates the surface of the first cylinder to fix the first cylinder with an external structure; the diameter of the second cylinder is smaller than the height; the second column is formed on one side end face of the first column; the diameter of the first cylinder is larger than that of the second cylinder, and the height of the first cylinder is smaller than that of the second cylinder; the third column body is formed on the end face, away from the first column body, of the second column body; the diameter of the third cylinder is larger than that of the second cylinder; the cavity sequentially penetrates through the first column, the second column and the third column, one end of the cavity forms an opening in the end face of the first column, and the other end of the cavity forms an opening in the end face of the third column. According to the easy-to-weld electrode column, heat is gathered to the first column body, the diameter of the second column body is smaller, the temperature rise of the first column body is higher than that of other column bodies, after the temperature reaches the melting temperature of soldering tin, the soldering tin infiltrates the surface of the first column body, and the welding effect and the welding efficiency are improved.

Description

Technical Field

[0001] This invention relates to the field of electronic components, and in particular to an easily solderable electrode post and capacitor. Background Technology

[0002] To achieve quick-connect functionality for capacitor leads, existing technologies employ two approaches: First, designing the leads as quick-connect connectors and integrally molding them with the electrode posts. While this approach enables quick-connect functionality, the integrated molding method is less adaptable, making it difficult to meet the customized needs of different customers, and it also incurs high costs. Second, designing the leads as standard parts and connecting them to the electrode posts via welding. However, the electrode posts are large, have good heat dissipation capabilities, and are difficult to weld, making them prone to cold solder joints and affecting product quality.

[0003] Therefore, there is an urgent need for an electrode post with better welding capabilities. Summary of the Invention

[0004] The present invention aims to at least partially solve one of the technical problems in the aforementioned technologies. Therefore, one object of the present invention is to provide an electrode post that reduces welding time and improves welding efficiency.

[0005] Another object of the present invention is to provide a capacitor.

[0006] To achieve the above objectives, one embodiment of the present invention provides an easily solderable electrode post, comprising the following components connected in sequence: The first pillar has a diameter greater than its height; solder wets the surface of the first pillar to fix it to the external structure; The second column has a diameter smaller than its height and is formed on one end face of the first column. The diameter of the first column is larger than that of the second column, and the height of the first column is smaller than that of the second column; The third column is formed on the end face of the second column that is away from the first column; The diameter of the third column is larger than that of the second column; A cavity extends through the first, second, and third pillars in sequence. One end of the cavity forms an opening on the end face of the first pillar, and the other end forms an opening on the end face of the third pillar.

[0007] According to an embodiment of the present invention, during welding, heat is concentrated in the first column. Since the second column has a smaller diameter and a larger height, the heat transfer speed through the second column is slower, so the temperature of the first column rises higher than that of the other columns per unit time. After reaching the temperature at which the solder melts, the solder wets the surface of the first column without causing a cold solder joint, thus improving the welding effect and welding efficiency.

[0008] In addition, the easily weldable electrode post proposed according to the above embodiments of the present invention may also have the following additional technical features: Optionally, the ratio of the diameter D1 of the first column to the diameter D2 of the second column is 3:1 to 5:1.

[0009] Optionally, the ratio of the height H1 of the first column to the height H2 of the second column is not greater than 1:3.

[0010] Optionally, the end face of the first column fixed to the external structure is textured.

[0011] Furthermore, the texture is one or more of the following: a grid pattern, parallel lines, and polygons.

[0012] Optionally, the first column, the second column, and the third column are integrally formed.

[0013] Furthermore, the integral molding method is turning or powder sintering.

[0014] To achieve the above objectives, a second embodiment of the present invention provides a capacitor comprising: The outer shell is made of plastic or metal; the core is placed inside the outer shell; the space between the core and the outer shell is filled with a filler; the core is made of a thin film wound into a cylindrical shape, with alloy sprayed at both ends, and a gold-plated layer connected to the external structure via leads; electrode posts are provided outside the leads, including those connected in sequence: The first pillar has a diameter greater than its height; solder wets the surface of the first pillar to fix it to the external structure; The second column has a diameter smaller than its height and is formed on one end face of the first column. The diameter of the first column is larger than that of the second column, and the height of the first column is smaller than that of the second column; The ratio of the diameter D1 of the first column to the diameter D2 of the second column is 3:1 to 5:1; The ratio of the height H1 of the first column to the height H2 of the second column is no greater than 1:3; The third column is formed on the end face of the second column that is away from the first column; The diameter of the third column is larger than that of the second column; A cavity extends through the first, second, and third pillars in sequence. One end of the cavity forms an opening on the end face of the first pillar, and the other end forms an opening on the end face of the third pillar.

[0015] According to an embodiment of the present invention, the capacitor has electrode posts on the outside of the leads. During soldering, heat is concentrated in the first post. Since the second post has a smaller diameter and a larger height, the heat is transferred slowly through the second post. As a result, the temperature of the first post rises higher than that of the other posts per unit time. After reaching the temperature at which the solder melts, the solder wets the surface of the first post without causing a cold solder joint, thus improving the soldering effect and efficiency.

[0016] Optionally, the end face of the first column fixed to the external structure forms a pattern; the pattern is one or more of the following: a grid, parallel lines, and polygons. Attached Figure Description

[0017] Figure 1 A perspective view of the capacitor structure according to the present invention; Figure 2 for Figure 1 A partial structural view; Figure 3 This is a perspective view of an electrode post structure according to an embodiment of the present invention; Figure 4 for Figure 3 Cross-sectional view.

[0018] Label Explanation: Casing 1 Lead 2 Electrode post 3 First column 31, second column 32, third column 33. Detailed Implementation

[0019] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0020] To better understand the above technical solutions, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present invention and to fully convey the scope of the invention to those skilled in the art.

[0021] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0022] Figure 1According to an embodiment of the present invention, the capacitor includes a shell 1, which is made of plastic or metal; a core, which is placed inside the shell 1; the core and the shell 1 are filled with a filler; the core is formed by winding a thin film, and the two ends of the core are coated with an alloy. The gold coating is connected to the external structure through leads 2, and electrode posts 3 are provided outside the leads 2; the structure of the electrode posts 3 makes them easy to solder.

[0023] Figures 2 to 4 An easily solderable electrode post 3 according to an embodiment of the present invention comprises, in sequence: The first pillar 31 has a diameter greater than its height; solder wets the surface of the first pillar 31 to fix the first pillar 31 to the external structure; The second column 32 has a diameter smaller than its height and is formed on one end face of the first column 31. The diameter of the first column 31 is greater than that of the second column 32, and the height of the first column 31 is less than that of the second column 32. The existing electrode post 3 structure uses posts with a uniform diameter. Therefore, when the end is heated during welding, the heat is conducted along the electrode post 3, causing the temperature of the heated end to drop. This leads to a rapid drop in the temperature of the contact surface between the solder and the electrode post 3. Once the temperature drops below the solder's melting point, the solder solidifies. Although it appears that the solder fixes the electrode post 3, in reality, there is only a shape fit between the two, and no stable connection is formed. To overcome this welding problem, increasing the welding temperature is a common method. However, excessively high welding temperatures will cause the solder to age and will also cause the overall temperature rise of the electrode post 3 to be higher, resulting in a greater local thermal impact on the capacitor and making it easier to damage the capacitor.

[0024] Therefore, one of the key design features of this invention is that the second column 32 is made thinner and longer than the first column 31. During the welding process, the first column 31 serves to provide a structure for wetting the solder during melting and encapsulating it during solidification, while the second column 32 acts as a structural connector. By utilizing the smaller diameter and longer length of the second column 32, a thermal resistance section is created, concentrating more heat within the first column 31 and reducing its further inward conduction through the second column 32. Thus, when using existing welding processes, the temperature rise of the first column 31 per unit time will be higher than that of existing single-diameter electrode columns 3, preventing the solder from solidifying prematurely without complete wetting when it comes into contact with the molten solder.

[0025] In order to better utilize the thermal resistance between the first column 31 and the second column 32, in some embodiments, the ratio of the diameter D1 of the first column 31 to the diameter D2 of the second column 32 is 3:1 to 5:1.

[0026] By setting the ratio of the height H1 of the first column 31 to the height H2 of the second column 32 to no more than 1:3, the heat conducted from the first column 31 to the second column 32 can be reduced more effectively, as well as the conduction rate can be lowered.

[0027] During the soldering process, the wetting and encapsulation effect of the solder on the first pillar 31 determines the firmness and resistance value of the soldered electrode pillar 3. Therefore, in some embodiments, the end face of the first pillar 31 fixed to the external structure forms a texture to facilitate solder climbing. Furthermore, these textures are a grid structure, such as a waffle pattern, or a pattern composed of parallel lines, or one or more of the following: a pattern composed of multiple polygons.

[0028] Optionally, the first pillar 31 is a prism, which can be a triangular prism or a hexagonal prism, etc. Using a prism for the first pillar 31 can reduce the sliding of the entire electrode pillar 3 on the solder pad, and can also fit with the holes of the external structure to prevent rotation before and during the soldering process.

[0029] When a prism is used, the dimension D1 of the prism is the diameter of its inscribed circle.

[0030] The third column 33 is formed on the end face of the second column 32 away from the first column 31; the diameter of the third column 33 is larger than that of the second column 32; the third column 33 is used to connect the second column 32 and the core in the capacitor body structure, etc., so its shape is determined by its specific function. A cavity is formed by sequentially passing through the first column 31, the second column 32 and the third column 33. One end of the cavity forms an opening on the end face of the first column 31, and the other end forms an opening on the end face of the third column 33. The cavity allows the capacitor lead 2 to pass through.

[0031] In some embodiments, the first column 31, the second column 32, and the third column 33 are integrally formed. Specifically, the integral forming method is turning or powder sintering. The structure of the bar is turned, which has good integrity and high structural strength. The structure of the first column 31 with irregular shape can be manufactured by powder sintering, which can reduce costs and manufacture more types of first columns 31 with irregular shapes.

[0032] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0033] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0034] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0035] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. An easily weldable electrode post, characterized in that, Including those connected sequentially: The first pillar has a diameter greater than its height; solder wets the surface of the first pillar to fix it to the external structure; The second column has a diameter smaller than its height and is formed on one end face of the first column. The diameter of the first column is larger than that of the second column, and the height of the first column is smaller than that of the second column; The third column is formed on the end face of the second column that is away from the first column; The diameter of the third column is larger than that of the second column; A cavity extends through the first, second, and third pillars in sequence. One end of the cavity forms an opening on the end face of the first pillar, and the other end forms an opening on the end face of the third pillar.

2. The easily weldable electrode post as described in claim 1, characterized in that: The ratio of the diameter D1 of the first column to the diameter D2 of the second column is 3:1 to 5:

1.

3. The easily weldable electrode post as described in claim 1, characterized in that: The ratio of the height H1 of the first column to the height H2 of the second column is less than 1:

3.

4. The easily weldable electrode post as described in claim 1, characterized in that: The first column forms a texture on the end face of the side where it is fixed to the external structure.

5. The easily weldable electrode post as described in claim 4, characterized in that: The texture is one or more of the following: grid pattern, parallel lines, and polygons.

6. The easily weldable electrode post as described in claim 1, characterized in that: The first column, the second column, and the third column are integrally formed.

7. The easily weldable electrode post as described in claim 7, characterized in that: The method of integral molding is turning or powder sintering.

8. A capacitor, characterized in that, include: The outer shell is made of plastic or metal; the core is placed inside the outer shell. The space between the core and the outer shell is filled with a filler; the core is made of a thin film wound into a cylindrical shape, with alloy sprayed at both ends, and the gold-plated layer is connected to the external structure via leads. The leads are equipped with easily solderable electrode posts; the easily solderable electrode posts include the following connected in sequence: The first pillar has a diameter greater than its height; solder wets the surface of the first pillar to fix it to the external structure; The second column has a diameter smaller than its height and is formed on one end face of the first column. The diameter of the first column is larger than that of the second column, and the height of the first column is smaller than that of the second column; The ratio of the diameter D1 of the first column to the diameter D2 of the second column is 3:1 to 5:1; The ratio of the height H1 of the first column to the height H2 of the second column is no greater than 1:3; The third column is formed on the end face of the second column that is away from the first column; The diameter of the third column is larger than that of the second column; A cavity extends through the first, second, and third pillars in sequence. One end of the cavity forms an opening on the end face of the first pillar, and the other end forms an opening on the end face of the third pillar.

9. The capacitor as claimed in claim 8, characterized in that: The first column is fixed to the end face of the external structure, forming a pattern; the pattern is one or more of the following: a grid, parallel lines, and polygons.

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