Millimeter wave tile type phased array antenna heat transfer-heat storage system

Abstract

The invention provides a millimeter wave tile-type phased-array antenna heat transfer-heat storage system, and the system comprises a heat transfer main body which is provided with a radiating surface, a heat conduction surface, and at least one heat dissipation surface; wherein an electrical function module of the phased-array antenna is arranged on the heat conduction surface to transfer heat generated by operation to the heat conduction surface, a heat conduction path and a phase change heat storage unit are formed in the heat conduction surface, the phase change heat storage unit is used for absorbing and storing part of heat, the heat conduction path is connected with the heat dissipation surface, and the phase change heat storage unit is connected with the heat dissipation surface. At least part of heat generated by the electrical function module is transmitted to the heat dissipation surface through the heat conduction path of the heat conduction surface for heat dissipation. The radiating surface is used as a signal radiating window of the phased-array antenna; and the phase change heat storage module is arranged outside the heat transfer main body, is connected with the heat dissipation surface and is used for absorbing heat dissipated by the heat dissipation surface. The invention provides an efficient heat transfer-heat storage technical scheme, and solves the thermal control problem of high-power work of the phased-array antenna on a platform within limited time.

Description

Technical Field

[0001] This invention relates to the field of phased array antenna thermal control technology, and more specifically, to a millimeter-wave phased array antenna heat transfer-heat storage system. Background Technology

[0002] With the rapid development of modern communication and radar technologies, millimeter-wave watt-type phased array antennas have been increasingly widely used in military, aerospace, and communications fields due to their unique performance advantages, such as high resolution, high data transmission rate, and fast beam scanning. However, with the continuous improvement of application requirements, millimeter-wave watt-type phased array antennas face many challenges during operation, among which heat dissipation is particularly prominent and has become one of the key bottlenecks restricting their engineering applications.

[0003] Millimeter-wave watt-type phased array antennas typically consist of a large number of densely packed array elements, which generate significant heat during operation. Due to their highly compact internal structure, dense element density, and small internal dimensions, the local heat flux density of the components continuously increases. In certain specialized applications, such as missile-borne and rocket-borne platforms, the heat dissipation problem becomes even more severe. The limited space on missile-borne and rocket-borne platforms prevents the provision of sufficient heat dissipation paths and heat sinks for the antenna, making it difficult to effectively apply conventional thermal control technologies such as conductive cooling, air cooling, and liquid cooling. Therefore, how to efficiently solve the heat dissipation problem and ensure the normal operation of millimeter-wave watt-type phased array antennas has become a pressing technical challenge.

[0004] To address this problem, researchers have begun exploring new thermal control methods. Utilizing the property of phase change thermal storage materials (PCMs) that can absorb a large amount of heat during a phase change while maintaining a temperature close to the phase change point, thermal control management of phased array antennas has gradually become a feasible method for missile and rocket platforms. PCMs can absorb or release large amounts of heat within a specific temperature range, thus regulating temperature and stabilizing the thermal environment. However, this thermal control method also has some limitations. When using PCMs to absorb heat, their heat storage capacity is essentially proportional to their weight. Currently, most industrially produced PCMs are low-density materials, typically with a density not exceeding 1 g / cm³. 3 As missile-borne phased array antennas become increasingly compact and their operating times lengthen, the internal space of the antenna is often insufficient to meet the volume requirements for PCM thermal storage. This significantly limits the use of phase change thermal storage materials in practical applications, hindering their full realization of thermal control potential.

[0005] Furthermore, existing phased array antenna heat dissipation structures have some shortcomings. Traditional heat dissipation structures often fail to quickly and evenly dissipate the heat generated during antenna operation, leading to heat accumulation in localized areas and affecting antenna performance and reliability. Moreover, the integration between these heat dissipation structures and the antenna's electrical functional modules is insufficient, hindering efficient thermal management. Therefore, a novel heat dissipation system is needed to effectively solve the heat dissipation problem of millimeter-wave phased array antennas, while simultaneously ensuring the antenna's electrical performance and structural compactness to meet the growing application demands. Summary of the Invention

[0006] The present invention aims to solve at least one of the aforementioned technical problems existing in the prior art.

[0007] Therefore, the present invention provides a millimeter-wave tile-type phased array antenna heat transfer-heat storage system.

[0008] This invention proposes a millimeter-wave tile-type phased array antenna heat transfer-heat storage system, comprising: The phased array antenna is equipped with several electrical functional modules; The heat transfer body has a closed or semi-closed structure, and has a radiating surface, a heat-conducting surface, and at least one heat-dissipating surface. The electrical functional modules of the phased array antenna are disposed on the heat-conducting surface to transfer the heat generated during operation to the heat-conducting surface. A heat-conducting path and a phase-change heat storage unit are formed inside the heat-conducting surface. The phase-change heat storage unit absorbs and stores a portion of the heat. The heat-conducting path is connected to the heat-dissipating surface, and at least a portion of the heat generated by the electrical functional modules is transferred to the heat-dissipating surface for heat dissipation through the heat-conducting path of the heat-conducting surface. The radiating surface serves as the signal radiation window of the phased array antenna. The phase change thermal storage module is located outside the heat transfer body and connected to the heat dissipation surface to absorb the heat emitted by the heat dissipation surface.

[0009] According to the above-described technical solution of the present invention, a millimeter-wave tile-type phased array antenna heat transfer-heat storage system may further have the following additional technical features: In the above technical solution, there are two heat dissipation surfaces, the heat conduction path is located between the two heat dissipation surfaces, and both ends are connected to the two heat dissipation surfaces respectively.

[0010] In the above technical solution, a plurality of heat conduction paths are formed inside the heat conduction surface; the plurality of heat conduction paths are arranged at intervals on the heat conduction surface; The number of phase change thermal storage units is multiple, and several phase change thermal storage units are evenly distributed on the heat-conducting surface; The heat conduction path does not interfere with the phase change thermal storage unit.

[0011] In the above technical solution, the heat transfer body adopts a box structure; The radiating surface is disposed on the top cover of the box structure, the heat dissipation surface is disposed on the side wall of the box structure, and the heat conducting surface is disposed on the bottom plate of the box structure or on the receiving plate inside the box structure connected to the side wall.

[0012] In the above technical solution, a high thermal conductivity component is provided inside the plate with a thermally conductive surface. The high thermal conductivity component is used to concentrate the heat absorbed by the thermally conductive surface to form a thermal conduction path. Several high thermal conductivity components are arranged at equal intervals inside a plate with a thermally conductive surface, and each high thermal conductivity component penetrates the plate with a thermally conductive surface to connect with a side wall with a heat dissipation surface.

[0013] In the above technical solution, the high thermal conductivity component is made of a material or component with a thermal conductivity higher than that of the plate itself with a thermally conductive surface.

[0014] In the above technical solution, the phase change thermal storage module is connected to the side wall; The sidewall is provided with a heat diffusion structure to diffuse the heat flow transferred to the heat dissipation surface through the heat conduction path into a relatively low-density heat flow.

[0015] In the above technical solution, at least a number of independent sealed cavities are formed between adjacent high thermal conductivity components inside the plate with a heat-conducting surface. The sealed cavities are filled with phase change heat storage material and the sealed cavities are evenly arranged.

[0016] In the above technical solution, a number of transition holes and slots are provided on the plate with a heat-conducting surface. The transition holes and slots are used to form an interconnection channel for a number of electrical functional modules disposed on both sides of the plate. The positions of the transition slot, the high thermal conductivity component, and the sealed cavity do not overlap.

[0017] In the above technical solution, each side wall of the box structure with a heat dissipation surface is equipped with a corresponding phase change thermal storage module.

[0018] In summary, due to the adoption of the above-mentioned technical features, the beneficial effects of the present invention are: This invention combines high-efficiency thermal conductivity technology with phase change thermal storage technology. It utilizes a high thermal conductivity structure to conduct the heat generated by the internal components of the antenna to the outside of the antenna and diffuse the high heat flux. The phase change thermal storage material inside the antenna can effectively store heat, equalize the temperature, and buffer against instantaneous thermal shock. Adding a phase change thermal storage device to the outside of the antenna expands the overall thermal storage capacity of the system based on the heat transfer capability of the high-efficiency thermal conductivity structure, thereby improving the system's flexibility and adaptability.

[0019] Specifically, the system of this invention does not rely on platform environmental control or external heat dissipation. The main heat loss is absorbed by the phase change material, eliminating the need for a platform-provided heat sink and minimizing external heat transfer, making it suitable for missile and rocket platforms. Employing a two-layer phase change heat storage method, the phase change material inside the base plate of the housing is close to the heat-generating components, serving to store heat, equalize temperatures, and prevent thermal shock. The outer phase change heat storage module increases the total heat storage capacity. Furthermore, due to the use of an external phase change heat storage module, it occupies minimal internal antenna space, does not affect the antenna's internal design, fully utilizes the space available on the platform, and offers high flexibility and adaptability.

[0020] Additional aspects and advantages of the invention will become apparent in the following description or may be learned by practice of the invention. Attached Figure Description

[0021] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic diagram of the structure of a millimeter-wave tile-type phased array antenna heat transfer-heat storage system according to an embodiment of the present invention; Figure 2 This is a three-dimensional structural schematic diagram of a millimeter-wave tile-type phased array antenna heat transfer-heat storage system according to an embodiment of the present invention. Figure 3 This is a bottom view of the housing of a millimeter-wave tile-type phased array antenna heat transfer-heat storage system according to an embodiment of the present invention. Figure 4 This is a schematic diagram of heat flow transfer in a millimeter-wave tile-type phased array antenna heat transfer-heat storage system according to an embodiment of the present invention.

[0022] in, Figures 1 to 4 The correspondence between the reference numerals and component names in the attached drawings is as follows: 1. Electrical functional module; 2. Heat transfer main body; 3. Phase change thermal storage module; 201. Radiating surface; 202. Heat-conducting surface; 203. Heat-dissipating surface; 204. Heat conduction path; 21. Box bottom plate; 22. Side wall; 211. High thermal conductivity components; 212. Phase change thermal storage unit; 213. Transition slots; 221. Diffusion heat flow structure; 31. Phase change thermal storage materials. Detailed Implementation

[0023] To better understand the above-mentioned objectives, features, and advantages of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0024] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and therefore the scope of protection of the invention is not limited to the specific embodiments disclosed below.

[0025] The following reference Figures 1 to 4 This describes a millimeter-wave tile-type phased array antenna heat transfer-storage system provided according to some embodiments of the present invention.

[0026] Some embodiments of this application provide a millimeter-wave phased array antenna heat transfer-storage system.

[0027] like Figure 1 As shown, the first embodiment of the present invention proposes a millimeter-wave phased array antenna heat transfer-heat storage system, which mainly includes a phased array antenna, a heat transfer body 2 and a phase change heat storage module 3.

[0028] The phased array antenna is provided with several electrical functional modules 1; it is understood that the electrical functional modules 1 referred to in this disclosure are mainly heat-generating devices or modules such as power amplifiers, control units, low-noise amplifiers, and power supplies.

[0029] The heat transfer body 2 has a closed or semi-closed structure. The purpose of adopting a closed or semi-closed structure is mainly to limit the space for heat flow. At the same time, the heat transfer body 2 also serves as a protective and support structure. That is to say, the phased array antenna is deployed inside the heat transfer body 2, and the aforementioned electrical functional modules 1 are all located inside the heat transfer body 2.

[0030] Specifically, the heat transfer body 2 has a radiating surface 201, a heat-conducting surface 202, and at least one heat-dissipating surface 203; wherein, the electrical functional module 1 of the phased array antenna is disposed on the heat-conducting surface 202 to transfer the heat generated during operation to the heat-conducting surface 202; a heat-conducting path 204 and a phase change heat storage unit 212 are formed inside the heat-conducting surface 202, the phase change heat storage unit 212 is used to absorb and store part of the heat, that is, the phase change heat storage unit 212 serves as the heat-absorbing material inside the heat transfer body 2, and can play the role of internal heat storage, temperature equalization, and heat buffering; the heat-conducting path 204 is connected to the heat-dissipating surface 203, and at least part of the heat generated by the electrical functional module 1 is transferred to the heat-dissipating surface 203 for heat dissipation through the heat-conducting path 204 of the heat-conducting surface 202; the radiating surface 201 serves as the signal radiation window of the phased array antenna.

[0031] The phase change thermal storage module 3 is disposed outside the heat transfer body 2 and connected to the heat dissipation surface 203, and is used to absorb the heat dissipated by the heat dissipation surface 203. That is to say, in this disclosure, the heat dissipation surface 203 serves as the external thermal interface of the heat transfer body 2, transferring the heat generated during the operation of the phased array antenna to the phase change thermal storage module 3 through this thermal interface. It should be noted that the phase change thermal storage module 3 can be a functional module of any shape and size filled with phase change thermal storage material 31, as long as one side can be in contact with the heat dissipation surface 203, thus making it suitable for assembly conditions of different platforms and environments.

[0032] In some embodiments, there are two heat dissipation surfaces 203, and the heat conduction path 204 is located between the two heat dissipation surfaces 203, with both ends connected to the two heat dissipation surfaces 203 respectively. By increasing the number of heat dissipation surfaces 203, the heat dissipation efficiency of the heat transfer body 2 is further improved. Simultaneously, based on the method of connecting the heat conduction path 204 to the two heat dissipation surfaces 203 respectively, the actual heat conduction distance can be effectively shortened, further improving the heat conduction efficiency. It is understood that the number of heat dissipation surfaces 203 can be more than two; when the number of heat dissipation surfaces 203 is two, two opposing heat dissipation surfaces 203 are preferred.

[0033] In some embodiments, a plurality of heat conduction paths 204 are formed inside the heat conduction surface 202; the plurality of heat conduction paths 204 are arranged at intervals on the heat conduction surface 202; the number of phase change heat storage units 212 is plurality of, and the plurality of phase change heat storage units 212 are evenly distributed on the heat conduction surface 202. In this embodiment, the multiple heat conduction paths 204 and the multiple phase change heat storage units 212 not only improve the overall heat conduction and heat storage capacity of the system, but also, by evenly distributing the heat conduction paths 204 and the phase change heat storage units 212, balance the temperature of the heat transfer body 2, i.e., the heat conduction surface 202, as much as possible, thereby meeting the temperature uniformity requirements of the phased array antenna and resisting instantaneous thermal shock.

[0034] Furthermore, the positions of the heat conduction path 204 and the phase change thermal storage unit 212 do not interfere with each other. That is to say, the heat absorption function of the phase change thermal storage unit 212 and the heat conduction function of the heat conduction path 204 are independent of each other, and the two are set apart without affecting each other.

[0035] It should be noted that when assembling electrical functional module 1, it should be placed as close as possible to phase change thermal storage unit 212 so that phase change thermal storage unit 212 can absorb the heat generated by the device nearby.

[0036] In some embodiments, such as Figure 2 As shown, the heat transfer body 2 adopts a box structure; the box structure can be integrally formed.

[0037] The radiating surface 201 is disposed on the top cover of the box structure, the heat dissipation surface 203 is disposed on the side wall 22 of the box structure, and the heat-conducting surface 202 is disposed on the bottom plate of the box structure or on a supporting plate connected to the side wall 22 inside the box structure. For ease of understanding, in this disclosure, the plates with heat-conducting surfaces 202 are collectively referred to as the box bottom plate 21. It should be noted that "box bottom plate 21" does not necessarily refer to a plate located on the bottom surface of the box, but is only a name relative to the top cover of the box structure; it can also be as follows. Figure 1 As shown, the bottom plate 21 of the box is located in the middle of the box body. At this time, both the upper and lower surfaces of the bottom plate 21 of the box body serve as heat-conducting surfaces 202. Several electrical functional modules 1 are attached to the heat-conducting surfaces 202 from the upper and lower sides of the bottom plate 21 of the box body. When the bottom plate 21 of the box body is located in the middle of the box body, the box body structure can be equipped with an additional bottom plate for encapsulation, or it can be directly fixed to the corresponding assembly position based on the hanging ears or mounting holes configured on the side wall 22.

[0038] In some embodiments, a high thermal conductivity component 211 is provided inside the plate having a heat-conducting surface 202. The high thermal conductivity component 211 is used to concentrate the heat absorbed by the heat-conducting surface 202 to form a heat conduction path 204. A plurality of high thermal conductivity components 211 are arranged at equal intervals inside the plate having the heat-conducting surface 202, and each high thermal conductivity component 211 penetrates through the plate having the heat-conducting surface 202 to be connected to the side wall 22 having a heat dissipation surface 203.

[0039] That is to say, in this embodiment, a horizontally penetrating high thermal conductivity component 211 is used so that the two ends of the heat conduction path 204 are respectively connected to two opposite side walls 22 (heat dissipation surface 203), and each high thermal conductivity component 211 corresponds to a heat conduction path 204.

[0040] Specifically, the high thermal conductivity component 211 is made of a material or component with a higher thermal conductivity than the plate itself with the thermal conductive surface 202, such as a strip VC plate, a welded heat pipe, or an embedded high thermal conductivity metal composite material (such as graphite aluminum or diamond copper).

[0041] In some embodiments, the phase change thermal storage module 3 is connected to a sidewall 22 having a heat dissipation surface 203; a heat diffusion structure 221 is provided inside the sidewall 22 to diffuse the heat flow transferred from the heat conduction path 204 to the heat dissipation surface 203 into a relatively low-density heat flow. Specifically, the heat diffusion structure 221 can be a vapor chamber (VC plate) embedded inside the sidewall 22, and can be replaced with other heat diffusion structures 221 with high thermal conductivity, such as high thermal conductivity metal composite materials (e.g., graphite aluminum, diamond copper), or inexpensive copper, depending on the actual heat flow conditions and environmental requirements. Of course, liquid heat dissipation fluid can be filled inside the sidewall 22 to achieve the same function.

[0042] like Figure 2As shown, based on the design of this disclosure, a corresponding phase change thermal storage module 3 can be assembled on each sidewall 22 of the housing structure that is equipped with a heat dissipation surface 203. The shape and size of the phase change thermal storage module 3 are not limited by the internal space of the antenna and can be adapted according to the actual situation to meet the corresponding platform space and environmental requirements.

[0043] In some embodiments, at least a plurality of independent sealed cavities are formed between adjacent high thermal conductivity components 211 inside the plate having a thermally conductive surface 202. The sealed cavities are filled with phase change thermal storage material 31, and the plurality of sealed cavities are evenly arranged. It is understood that the high thermal conductivity components 211 and the phase change thermal storage material 31 are isolated by the sealed cavities to form a phase change thermal storage unit 212.

[0044] In some embodiments, such as Figure 3 As shown, the bottom plate 21 of the housing has several transition slots 213, which form interconnection channels for several electrical functional modules 1 disposed on both sides of the plate. The positions of the transition slots 213, the high thermal conductivity component 211, and the sealed cavity do not overlap. In practical applications, it is usually necessary to first determine the position of the transition slots 213 to meet the interconnection requirements of the electrical functional modules 1 inside the phased array antenna, and then design the positions of the high thermal conductivity component 211 and the sealed cavity based on the position of the transition slots 213. It should be noted that the uniform arrangement referred to in this disclosure refers to a relatively uniform arrangement under the condition of satisfying the antenna's own assembly, not a strict equal spacing.

[0045] In some embodiments, the transition between the bottom plate 21 and the side wall 22 of the box body needs to fully consider the strength and heat conduction requirements. The integrated metal structure can be reinforced and heat conducted as needed, such as by using a stepped transition or a bent heat pipe transition.

[0046] Figure 4 The heat transfer path of the heat transfer-storage system disclosed herein is shown in the figure. The heat from the heating device and the heating module is transferred to the bottom plate 21 of the box. Part of the heat is absorbed and stored by the phase change material in the phase change storage unit 212, and part of the heat is transferred to the side wall 22 of the box through the high thermal conductivity component 211. The heat is diffused into a relatively low density heat flow under the action of the heat spreader in the side wall 22 of the box and is evenly conducted to the phase change storage module 3 outside the box. The phase change material contained inside the phase change storage module 3 serves as the main heat sink and works on the principle of heat storage. It does not require the platform to provide environmental control air, coolant or heat sink, which is more suitable for the needs of aerospace engineering.

[0047] In this specification, the illustrative expressions of the terms used do not necessarily refer to the same embodiments or examples. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0048] Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this invention shall be included within the scope of protection of this invention.

Claims

1. A millimeter-wave tile-type phased array antenna heat transfer-heat storage system, characterized in that, include: The phased array antenna is equipped with several electrical functional modules; The heat transfer body has a closed or semi-closed structure, and has a radiating surface, a heat-conducting surface, and at least one heat-dissipating surface. The electrical functional modules of the phased array antenna are disposed on the heat-conducting surface to transfer the heat generated during operation to the heat-conducting surface. A heat-conducting path and a phase-change heat storage unit are formed inside the heat-conducting surface. The phase-change heat storage unit absorbs and stores a portion of the heat. The heat-conducting path is connected to the heat-dissipating surface, and at least a portion of the heat generated by the electrical functional modules is transferred to the heat-dissipating surface for heat dissipation through the heat-conducting path of the heat-conducting surface. The radiating surface serves as the signal radiation window of the phased array antenna. The phase change thermal storage module is located outside the heat transfer body and connected to the heat dissipation surface to absorb the heat emitted by the heat dissipation surface.

2. The millimeter-wave tile-type phased array antenna heat transfer-storage system according to claim 1, characterized in that, The number of heat dissipation surfaces is two, and the heat conduction path is located between the two heat dissipation surfaces, with both ends connected to the two heat dissipation surfaces respectively.

3. The millimeter-wave tile-type phased array antenna heat transfer-storage system according to claim 2, characterized in that, Several heat conduction paths are formed inside the heat conduction surface; the several heat conduction paths are arranged at intervals on the heat conduction surface; The number of phase change thermal storage units is multiple, and several phase change thermal storage units are evenly distributed on the heat-conducting surface; The heat conduction path does not interfere with the phase change thermal storage unit.

4. The millimeter-wave tile-type phased array antenna heat transfer-heat storage system according to claim 1, characterized in that, The heat transfer body adopts a box structure; The radiating surface is disposed on the top cover of the box structure, the heat dissipation surface is disposed on the side wall of the box structure, and the heat conducting surface is disposed on the bottom plate of the box structure or on the receiving plate inside the box structure connected to the side wall.

5. The millimeter-wave tile-type phased array antenna heat transfer-storage system according to claim 4, characterized in that, The plate with a heat-conducting surface has a high thermal conductivity component inside, which is used to concentrate the heat absorbed by the heat-conducting surface to form a heat conduction path; Several high thermal conductivity components are arranged at equal intervals inside a plate with a thermally conductive surface, and each high thermal conductivity component penetrates the plate with a thermally conductive surface to connect with a side wall with a heat dissipation surface.

6. The millimeter-wave tile-type phased array antenna heat transfer-storage system according to claim 5, characterized in that, The high thermal conductivity component is made of a material or element with a thermal conductivity higher than that of the plate itself with a thermally conductive surface.

7. The millimeter-wave tile-type phased array antenna heat transfer-storage system according to claim 4, characterized in that, The phase change thermal storage module is connected to the side wall; The sidewall is provided with a heat diffusion structure to diffuse the heat flow transferred to the heat dissipation surface through the heat conduction path into a relatively low-density heat flow.

8. The millimeter-wave tile-type phased array antenna heat transfer-heat storage system according to claim 5, characterized in that, Several independent sealed cavities are formed between adjacent high thermal conductivity components inside a plate with a thermally conductive surface. The sealed cavities are filled with phase change thermal storage material and the several sealed cavities are evenly arranged.

9. A millimeter-wave tile-type phased array antenna heat transfer-storage system according to claim 6, characterized in that, The plate with a heat-conducting surface has several transition holes and slots, which are used to form interconnection channels for several electrical functional modules disposed on both sides of the plate. The positions of the transition slot, the high thermal conductivity component, and the sealed cavity do not overlap.

10. The millimeter-wave tile-type phased array antenna heat transfer-storage system according to claim 4, characterized in that, Each sidewall of the box structure with a heat dissipation surface is equipped with a corresponding phase change thermal storage module.

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