Monitoring system and monitoring method of semiconductor device pressing device

Abstract

The invention relates to the technical field of semiconductors, and discloses a monitoring system and a monitoring method for a semiconductor device pressing device, and the system comprises a first platform; a second platform; the lower surface of the pressing head is suitable for applying crimping pressure to the second platform; the driving motor is used for driving the pressure head to move; the torsion sensing module is used for monitoring the output torsion value of the driving motor in real time; the control unit is connected with the torsion sensing module and the driving motor and is used for judging whether the pressing head reaches a preset pressing state or not according to a comparison result of the output torsion value and a preset first torsion value and a preset second torsion value so as to adjust the motion state of the pressing head; the first torque value is the torque required by the operation of the pressure head under the non-load condition; the second torsion value is the torsion required by the pressure head to apply the preset crimping pressure to the second platform; under the condition that a pressure sensor is not installed, the pressing force of the pressing head can be controlled to be within the preset range, and the reliability of the pressing process is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, and in particular to a monitoring system and a monitoring method of a semiconductor device pressing device. BACKGROUND

[0002] In a conventional pressing device, a pressure sensor needs to be installed on the upper surface of a pressing head or the surface to control the pressing force of the pressing head. However, in some pressing devices, the pressing head has special optical application requirements, and the pressing head needs to be transparent. Therefore, the conventional pressure sensor cannot be directly installed on the upper surface and the lower surface of the pressing head, which leads to uncontrollable pressing force of the pressing head. The electronic components may be damaged or broken due to excessive pressure, or the bonding may be poor due to insufficient pressure, which reduces the bonding yield and affects the bonding effect. When the optical assembly is pressed, the optical assembly may have problems such as optical surface warping, coating damage, optical damage, or displacement deviation, which reduces the reliability of the optical assembly and the assembly yield of the optical module.

[0003] Therefore, a monitoring system and a monitoring method of a pressing device are needed, which can control the pressing force of the pressing head within a preset range without installing a pressure sensor, ensure the optical application requirements of the surface of the pressing head, avoid damage or breakage of the electronic components, improve the bonding yield, and improve the reliability of the optical assembly and the assembly yield of the optical module. SUMMARY

[0004] Therefore, the present application provides a monitoring system and a monitoring method of a semiconductor device pressing device to solve the problem that the pressing device with special optical requirements for the pressing head cannot directly install a pressure sensor, which leads to uncontrollable pressing force of the pressing head, may damage or break the electronic components due to excessive pressure, or may cause poor bonding due to insufficient pressure, which reduces the bonding yield, and also reduces the reliability of the optical assembly and the assembly yield of the optical module.

[0005] In a first aspect, the present application provides a monitoring system of a semiconductor device pressing device, comprising: a first platform for carrying a substrate to be bonded; a second platform located above the first platform for fixing an electronic component to be bonded; the electronic component is located below the second platform; a pressing head located above the second platform for pressing the electronic component and the substrate, the pressing head comprising opposite upper and lower surfaces, wherein the lower surface of the pressing head is adapted to apply a pressing force to the second platform; a drive motor connected to the pressing head for driving the pressing head to move in a straight line perpendicular to the direction of the rotating shaft of the drive motor; the drive motor is connected or provided with a brake; The torsion sensing module is located in the driving motor and is used for monitoring the output torsion value of the driving motor in real time. The control unit is connected with the torsion sensing module and the driving motor, and is used for judging whether the pressure head reaches the preset pressing state according to the comparison result of the output torsion value and the first torsion value and the second torsion value, so as to adjust the movement state of the pressure head; when the output torsion value of the torsion sensing module is equal to the sum of the first torsion value and the second torsion value, the pressure head reaches the preset pressing state, and the pressure head applies the preset pressure bonding pressure to the second platform, and the control unit is used for controlling the driving motor and the pressure head to stop moving. The first torsion value is the torsion required by the pressure head under the condition of no load; the second torsion value is the torsion required by the pressure head for applying the preset pressure bonding pressure to the second platform; and the preset pressure bonding pressure is the pressure required for bonding the electronic component and the substrate together.

[0006] The monitoring system of the semiconductor device pressing device provided by the application can monitor the output torsion value of the driving motor in real time through the torsion sensing module without installing the pressure sensor, and can accurately judge whether the pressure bonding pressure applied by the pressure head to the second platform reaches the preset pressure bonding pressure, that is, whether the pressure head reaches the preset pressing state, so as to adjust the movement state of the pressure head, thereby controlling the pressure bonding pressure of the pressure head to the second platform through the output torsion value, and accurately controlling and monitoring the pressure of the pressure head, and making the pressure head cooperate with the optical design requirement and not being limited by the traditional opaque pressure sensor. When the output torsion value of the torsion sensing module is equal to the sum of the first torsion value and the second torsion value, the pressure head reaches the preset pressing state, the pressure bonding pressure applied by the pressure head to the second platform is the preset pressure bonding pressure, and the control unit is used for controlling the driving motor to stop the movement of the pressure head, so that the torsion and pressure applied by the pressure head to the electronic component can be accurately controlled, the damage to the electronic component is avoided, and the process quality and stability are ensured. Therefore, the monitoring system of the semiconductor device pressing device provided by the application has simple structure, can control the pressure of the pressure head in the preset range without installing the pressure sensor, can guarantee the optical application requirement of the surface of the pressure head, can avoid the damage or breakage of the electronic component, can improve the pressing yield and the reliability of the pressing process, and can improve the reliability of the optical assembly and the assembly yield of the optical module.

[0007] In an optional embodiment, the upper surface of the pressure head has an optical structure. The driving motor is connected with the part of the side of the pressure head.

[0008] The monitoring system of the semiconductor device pressing device provided by the application has the optical structure on the upper surface of the pressing head, the part of the driving motor is connected to the side of the pressing head, the pressing force applied by the pressing head to the second platform can be accurately controlled while meeting the optical application requirement of the surface of the pressing head, the control unit is used for controlling the driving motor to stop the movement of the pressing head when the pressing force applied by the pressing head to the second platform reaches the preset pressing force, the control and adjustment of the pressing force of the pressing head can be realized, and the reliability and stability of the pressing process are improved.

[0009] In an optional embodiment, the preset pressing force includes an upper limit value and a lower limit value. The control unit is adapted to adjust the output torque value of the driving motor by the feedback control mode, so as to maintain the pressing force applied by the pressing head to the second platform within the range of the preset pressing force.

[0010] In an optional embodiment, the driving motor is a servo motor, the servo motor drives the pressing head to move downward along the vertical direction, and the electronic element is pressed to the surface of the substrate.

[0011] In an optional embodiment, the first platform and the second platform are movable platforms. The electronic element is aligned with the substrate in the up-down direction.

[0012] The monitoring system of the semiconductor device pressing device provided by the application has the optical structure on the upper surface of the pressing head, the part of the driving motor is connected to the side of the pressing head, the pressing force applied by the pressing head to the second platform can be accurately controlled while meeting the optical application requirement of the surface of the pressing head, the control unit is used for controlling the driving motor to stop the movement of the pressing head when the pressing force applied by the pressing head to the second platform reaches the preset pressing force, the control and adjustment of the pressing force of the pressing head can be realized, and the reliability and stability of the pressing process are improved.

[0013] In a second aspect, the application provides a monitoring method of a semiconductor device pressing device, which utilizes the monitoring system of the semiconductor device pressing device in the first aspect for pressing and monitoring, and includes the following steps. A first torque value required for the operation of the pressing head under the no-load condition is obtained, and a preset pressing force required for pressing the electronic element to be bonded to the substrate together is obtained. A second torque value required for the pressing head to reach the preset pressing state is calculated according to the preset pressing force. The electronic element to be bonded is fixed below the second platform and aligned with the substrate to be bonded on the first platform. The control unit controls the movement of the driving motor, and the driving motor drives the pressing head to move downward. When the pressing head contacts the second platform, the torque sensing module starts to monitor the output torque value of the driving motor in real time. The pressing head continues to press the electronic component and the substrate together; the control unit is configured to determine whether the pressing head reaches a preset pressing state according to a comparison result of the output torque value and the first torque value and the second torque value, so as to adjust a movement state of the driving motor; when the output torque value is equal to a sum of the first torque value and the second torque value, the pressing head reaches the preset pressing state, and a pressing force applied by the pressing head to the second platform is a preset pressing force, and the control unit controls the driving motor and the pressing head to stop moving.

[0014] The monitoring method of the semiconductor device pressing device provided by the application can accurately determine whether the pressing force applied by the pressing head to the second platform reaches the preset pressing force, that is, whether the pressing head reaches the preset pressing state, according to the comparison result of the output torque value and the first torque value and the second torque value without installing a pressure sensor, so that the pressing force of the pressing head to the second platform can be controlled by controlling the output torque value, accurate control and monitoring of the pressing force of the pressing head are realized, and the sum of the first torque value and the second torque value is used as a stopping endpoint of the pressing head, so that the torque and the pressure applied by the pressing head to the electronic component can be accurately controlled, damage to the electronic component is avoided, and process quality and stability are ensured. Therefore, the monitoring method of the semiconductor device pressing device provided by the application does not need to install a traditional pressure sensor on the surface of the pressing head, solves the problem that the traditional pressure monitoring method cannot be implemented due to the limitation of the special design of the surface of the pressing head, simplifies the operation process, and improves the production efficiency, so that the optical application requirement of the surface of the pressing head can be ensured, the damage or breakage of the electronic component is avoided, the pressing yield and the reliability of the pressing process are improved, and the reliability of the optical assembly and the assembly yield of the optical module are improved.

[0015] In an optional embodiment, the second torque value is calculated according to the following formula, T=P r A, wherein T is torque (N•m), P is pressure (Pa or N / m 2 ), r is the radius of rotation (m), and A is the contact area (m 2 ).

[0016] In an optional embodiment, the method further includes: when the output torque value is lower than the sum of the first torque value and the second torque value, the control unit increases the output torque of the driving motor by increasing the current or voltage of the driving motor.

[0017] In an optional embodiment, the method further includes: when the output torque value is equal to the sum of the first torque value and the second torque value, the output torque value is kept unchanged, the movement state of the driving motor and the pressing head is adjusted to be stopped, the pressing head is kept in the preset pressing state, and the pressing force of the pressing head to the second platform is maintained at the preset pressing force. After maintaining the preset pressing state for a certain period of time and performing subsequent processes, the control unit controls the drive motor and the pressure head to move upward, so that the pressure head separates from the second platform.

[0018] In one alternative implementation, the electronic component is a semiconductor chip; the substrate is a packaging substrate. or: The electronic components are optical assemblies; the substrate is an optical assembly carrier or optical assembly stage. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the specific embodiments or related technologies of the present invention, the drawings used in the description of the specific embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the structure of a monitoring system for a semiconductor device bonding apparatus according to an embodiment of the present invention.

[0021] Figure 2 This is a schematic flowchart of a monitoring method for a semiconductor device bonding apparatus according to an embodiment of the present invention.

[0022] Figure 3 This is a schematic diagram illustrating the specific process of a semiconductor device lamination and monitoring method according to an embodiment of the present invention.

[0023] Figure 4 This is a schematic diagram of the pressure head in the first state in the monitoring system of a semiconductor device pressing device according to an embodiment of the present invention.

[0024] Figure 5 This is a schematic diagram of the pressure head in the second state in the monitoring system of a semiconductor device pressing device according to an embodiment of the present invention.

[0025] Figure 6 This is a schematic diagram of the structure of a monitoring system for a semiconductor device pressing apparatus according to an embodiment of the present invention, showing the pressing head in a preset pressing state.

[0026] Figure label: 10. First platform; 11. Electronic components; 20. Second platform; 21. Substrate; 30. Press head; 40. Drive motor; 50. Torque sensing device; 60. Control unit. Detailed Implementation

[0027] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the invention, not the entire structure.

[0028] In the following description, descriptions of well-known structures and techniques are omitted to avoid unnecessarily obscuring the concepts of the present invention. Various structural schematic diagrams according to embodiments of the present invention are shown in the accompanying drawings. These drawings are not to scale, and some details are enlarged for clarity, and some details may be omitted. The shapes of the various regions and layers shown in the drawings, as well as their relative sizes and positional relationships, are merely exemplary and may deviate in practice due to manufacturing tolerances or technical limitations. Furthermore, those skilled in the art can design regions / layers with different shapes, sizes, and relative positions as needed. In the context of the present invention, when a layer / element is referred to as being "on" another layer / element, the layer / element may be directly on the other layer / element, or there may be an intermediate layer / element between them. Additionally, if a layer / element is "on" another layer / element in one orientation, then when the orientation is reversed, the layer / element may be "below" the other layer / element.

[0029] In conventional lamination apparatuses, pressure sensors are installed on the upper or lower surface of the indenter head to control its downward pressure. However, in some lamination apparatuses, due to special optical application requirements, the indenter head must be transparent. Therefore, it is impossible to directly install traditional pressure sensors on the upper and lower surfaces of the indenter head. This results in uncontrollable lamination pressure, which may cause damage or breakage of electronic components due to excessive pressure, or poor bonding due to insufficient pressure, reducing lamination yield and affecting bonding effect. When laminating optical components, the inability to monitor the lamination pressure by installing pressure sensors can also lead to problems such as optical surface warping, coating damage, optical damage, or displacement deviation, reducing the reliability of optical components and the assembly yield of optical modules.

[0030] Therefore, a monitoring system and method for the pressing device are needed to control the downward pressure of the pressing head within a preset range without installing a pressure sensor. This would ensure the optical application requirements of the pressing head surface while avoiding damage or breakage of electronic components, thereby improving the pressing yield, the reliability of optical components, and the assembly yield of optical modules.

[0031] like Figure 1 As shown, the present invention provides a monitoring system for a semiconductor device bonding apparatus, comprising: The first platform 10 is used to support the substrate 21 to be bonded; The second platform 20 is located above the first platform 10 and is used to fix the electronic component 11 to be bonded; the electronic component 11 is located below the second platform 20. A pressure head 30, located above the second platform 20, is used to press the electronic component 11 and the substrate 21 together. The pressure head 30 includes opposing upper and lower surfaces, wherein the lower surface of the pressure head 30 is adapted to apply pressing pressure to the second platform 20. A drive motor 40 is connected to a pressure head 30 and is used to drive the pressure head 30 to perform linear motion perpendicular to the rotation axis of the drive motor 40; the drive motor 40 is connected to or equipped with a brake. The torque sensing module, located inside the drive motor 40, is used to monitor the output torque value of the drive motor 40 in real time. The control unit 60, connected to the torque sensing module and the drive motor 40, is used to determine whether the pressure head 30 has reached the preset pressing state based on the comparison result of the output torque value with the preset first torque value and second torque value, so as to adjust the movement state of the pressure head 30; when the output torque value of the torque sensing module is equal to the sum of the first torque value and the second torque value, the pressure head 30 reaches the preset pressing state, the pressing pressure applied by the pressure head 30 to the second platform 20 is the preset pressing pressure, and the control unit 60 is used to control the drive motor 40 and the pressure head 30 to stop moving; The first torque value is the torque required for the pressure head 30 to operate under no-load conditions; the second torque value is the torque required for the pressure head 30 to apply a preset pressing pressure to the second platform 20; the preset pressing pressure is the pressure required to press the electronic component 11 and the substrate 21 together.

[0032] In practice, the pressure head 30 is made of a light-transmitting material, and the surface of the pressure head has special optical application requirements, so traditional pressure sensors cannot be directly installed.

[0033] The torque required for the pressure head 30 to operate under no-load conditions is the first torque value. When the pressure head 30 contacts the second platform 20, it will be subjected to a reaction force from the second platform 20. This reaction force is equal to the pressing pressure applied by the pressure head 30 to the second platform 20. During the process of driving the pressure head 30 to move, the drive motor 40 increases the torque to overcome the reaction force, which corresponds to the pressing pressure applied by the pressure head 30 to the second platform 20 (i.e., the downward pressure of the pressure head 30). Therefore, there is a corresponding relationship between the pressing pressure applied by the pressure head 30 to the second platform 20 and the difference between the output torque value of the drive motor 40 and the first torque value. In order to facilitate the control of the downward pressure by torque, the corresponding second torque value is obtained according to the preset pressing pressure required during the pressing process; then, the comparison result between the output torque value and the sum of the first torque value and the second torque value is used as the condition for determining whether the pressure head 30 has reached the preset pressing state. This allows for accurate control of the downward pressure and timely adjustment of the movement state of the pressure head 30. Therefore, the present invention controls the pressing pressure (i.e. the downward pressure of the pressing head) applied to the second platform by controlling the output torque value of the drive motor.

[0034] The monitoring system for the semiconductor device pressing device provided by this invention, on the one hand, can monitor the output torque value of the drive motor in real time through a torque sensing module without installing a pressure sensor. Based on the comparison result of the output torque value with the preset first torque value and second torque value, it can accurately determine whether the pressing pressure applied by the pressing head to the second platform has reached the preset pressing pressure, that is, whether the pressing head has reached the preset pressing state, so as to adjust the movement state of the pressing head. Thus, the pressing pressure of the pressing head on the second platform can be controlled by controlling the output torque value, thereby achieving accurate control and monitoring of the pressing head pressure. At the same time, the pressing head can be designed to meet optical requirements and is not limited by traditional opaque pressure sensors. On the other hand, when the output torque value of the torque sensing module equals the sum of the first torque value and the second torque value, the pressure head reaches the preset pressing state. The pressing pressure applied by the pressure head to the second platform is the preset pressing pressure. The control unit is used to control the drive motor to stop the pressure head. By using the sum of the first torque value and the second torque value as the stopping point of the pressure head, the torque and pressure applied by the pressure head to the electronic components can be accurately controlled, avoiding damage to the electronic components and ensuring process quality and stability. Therefore, the monitoring system of the semiconductor device pressing device provided in this application has a simple structure and can control the downward pressure of the pressure head within a preset range without installing a pressure sensor. While ensuring the optical application requirements of the pressure head surface, it avoids damage or breakage of electronic components, improves the pressing yield and the reliability of the pressing process, and improves the reliability of optical components and the assembly yield of optical modules.

[0035] In some alternative implementations, the pressure head has optical features.

[0036] In some alternative implementations, the pressure head is made of a light-transmitting material, enabling functions that traditional pressure sensors (which are opaque) cannot provide as pressure monitoring systems. For example, the design of this application can be adapted to LCB (laser compression bonding) requirements, meaning that during the pressure head pressing process, both laser transmission and pressure monitoring requirements must be met.

[0037] In some alternative embodiments, the upper surface of the pressure head 30 has an optical structure; The drive motor 40 is connected to a portion of the side of the pressure head 30.

[0038] In practice, the drive motor 40 is installed on the side of the pressure head 30, and the need for optics can be avoided through mechanism design (such as cantilever structure).

[0039] The monitoring system for the semiconductor device lamination apparatus provided by this invention features a pressure head made of a light-transmitting material with an optical structure on its upper surface. By connecting a drive motor to a portion of the side of the pressure head, the system can accurately control the lamination pressure applied by the pressure head to the second platform while ensuring the optical application requirements of the pressure head surface. When the lamination pressure applied by the pressure head to the second platform reaches the preset lamination pressure, the control unit controls the drive motor to stop the pressure head from moving. This system enables control and adjustment of the pressure applied by the pressure head, thereby improving the reliability and stability of the lamination process.

[0040] In some optional implementations, the preset crimping pressure includes an upper limit and a lower limit; The control unit 60 is adapted to adjust the output torque value of the drive motor 40 through feedback control to maintain the pressing pressure applied by the pressure head 30 to the second platform 20 within the preset pressing pressure range.

[0041] In some alternative embodiments, the drive motor 40 is a servo motor, which drives the pressure head 30 to move downward in the vertical direction, pressing the electronic component 11 onto the surface of the substrate 21.

[0042] In some alternative implementations, the first platform 10 and the second platform 20 are movable platforms; Electronic component 11 is aligned vertically with substrate 21.

[0043] In practice, both the first platform 10 and the second platform 20 are equipped with precision positioning devices to ensure accurate alignment between the electronic component 11 and the substrate 21.

[0044] The monitoring system for the semiconductor device bonding apparatus provided by the present invention has a first platform and a second platform that are movable platforms and are both equipped with precision positioning devices. This can further improve the alignment accuracy between electronic components and substrates, reduce the problem of uneven pressure distribution caused by positional deviations, and thus improve bonding quality.

[0045] In some alternative implementations, the drive motor 40 also includes a direction conversion structure; The direction conversion structure is used to convert the torque of the drive motor 40 into the force that drives the pressure head 30 to move downward. The drive motor 40 is fixed to either the second platform or the pressure head 30, and the drive motor's rotation axis is horizontal. The drive motor 40 drives the pressure head 30 to move vertically following the drive motor 40. Through a direction conversion structure, the horizontal rotational torque of the horizontal shaft is converted into a vertical driving force, enabling the pressure head 30 to move relative to the second platform and apply pressure to it. The direction conversion structure can be, for example, a combination of a gear set and a lead screw.

[0046] In some alternative implementations, the drive motor 40 and the pressure head 30 are connected and fixed together.

[0047] In some alternative embodiments, the control unit 60 is used to control the drive motor 40 to move and drive the pressure head 30 to move in the vertical direction. The control unit 60 is also used to adjust the output torque value of the drive motor 40 to control the motion state of the drive motor 40.

[0048] In some alternative implementations, the first torque value T A The torque required for the pressure head 30 to operate under no-load conditions; the second torque value T B The torque corresponding to the preset crimping pressure; the sum of the first torque value and the second torque value is T. C ;T C =T A +T B .

[0049] In some alternative implementations, during the pressing process of the semiconductor device pressing apparatus, the control unit 60 controls the output torque value of the drive motor 40 to gradually increase to T. C The pressure head 30 has three states during the entire pressing process; When the torque of the drive motor 40 is less than the first torque value T A At this time, the pressure head 30 is in the first state. In the first state, the pressure head 30 moves downward without load, such as... Figure 4 As shown; When the torque of the drive motor 40 is greater than the first torque value T A And less than T CAt this time, the pressure head 30 begins to contact the second platform 20. At this point, the pressure head 30 is in its second state. In the first state, the pressure applied by the pressure head 30 to the second platform 20 continuously increases, such as... Figure 5 As shown; When the torque of the drive motor 40 is equal to T C When the pressing pressure applied by the pressing head 30 to the second platform 20 reaches the preset pressing pressure, and the pressing head 30 reaches the third state (i.e., the preset pressing state), the control unit 60 controls the drive motor 40 to stop the pressing head 30 from moving. At this time, the pressing pressure is maintained at the preset pressing pressure, such as... Figure 6 As shown.

[0050] In some alternative implementations, the torque sensing module detects the output torque value of the drive motor 40 in real time throughout the pressing process. In other alternative implementations, the torque sensing module begins to monitor the output torque value of the drive motor 40 in real time when the pressure head 30 begins to contact the second platform 20.

[0051] In some optional implementations, the torque sensing module further includes: a calibration unit for zero-point calibration of the torque sensing module before system startup; a filtering unit for filtering the acquired torque signal to eliminate noise interference; and a data transmission interface for sending the processed torque signal to the control unit 60.

[0052] The monitoring system for the semiconductor device pressing device provided by the present invention, on the one hand, performs zero-point calibration on the torque sensing module by setting a calibration unit to ensure the initial accuracy of torque detection; on the other hand, it filters the collected torque signal by a filtering unit to effectively reduce the influence of environmental noise on the measurement results, thereby improving the accuracy of judging the pressure of the pressing head 30 and the state of the pressing head 30 using the torque output value.

[0053] In some optional embodiments, the control unit 60 further includes a calculation module, which can accurately calculate a second torque value based on a preset crimping pressure input by the user and in conjunction with a pre-established torque-crimping pressure correspondence model; the calculation module can also be used to calculate the sum of the first torque value and the second torque value as T. C ;T C =T A +T B .

[0054] In some alternative implementations, the control unit 60 further includes an adjustment module for adjusting the torque value and motion state of the drive motor 40 based on the judgment result. For example, the adjustment module can control the output torque value by adjusting the current, voltage, or motor speed, thereby indirectly controlling the downward pressure applied by the pressure head 30.

[0055] likeFigure 2 As shown, this embodiment provides a monitoring method for a semiconductor device pressing apparatus, which uses the monitoring system of the semiconductor device pressing apparatus to perform pressing and monitoring. The method includes, but is not limited to, steps S101 to S106.

[0056] Step S101: Obtain the first torque value required for the pressure head 30 to operate under no-load conditions; and the preset pressing pressure required for the electronic component 11 to be bonded to be pressed together with the substrate 21 to be bonded.

[0057] Step S102: Calculate the second torque value required for the pressure head 30 to reach the preset pressing state based on the preset pressing pressure.

[0058] Step S103: Fix the electronic component 11 to be bonded below the second platform 20 and align it with the substrate 21 to be bonded on the first platform 10.

[0059] In step S104, the control unit 60 controls the drive motor 40 to move, and the drive motor 40 drives the pressure head 30 to move downward.

[0060] In step S105, when the pressure head 30 begins to contact the second platform 20, the torque sensing module begins to monitor the output torque value of the drive motor 40 in real time.

[0061] In step S106, the pressure head 30 continues to press the electronic component 11 and the substrate 21 together; the control unit 60 is used to determine whether the pressure head 30 has reached the preset pressing state based on the comparison result of the output torque value with the preset first torque value and second torque value, so as to adjust the movement state of the drive motor 40; when the output torque value is equal to the sum of the first torque value and the second torque value, the pressure head 30 reaches the preset pressing state, the pressing pressure applied by the pressure head 30 to the second platform 20 is the preset pressing pressure, and the control unit 60 controls the drive motor 40 and the pressure head 30 to stop moving.

[0062] In practice, the drive motor 40 drives the pressure head 30 in the first stage. When the pressure head 30 contacts the workpiece, the second stage begins, at which point the second platform 20 generates a reaction force on the pressure head 30. When the total torque output by the drive motor 40 (the sum of the torque driving the pressure head 30 and the torque corresponding to the reaction force) reaches the set value C, the control unit 60 stops the drive motor 40 and the motor, and the process enters the third stage, proceeding with the subsequent process flow.

[0063] The monitoring method for the semiconductor device pressing apparatus provided by this invention can accurately determine whether the pressing pressure applied by the pressing head to the second platform has reached the preset pressing pressure, i.e., whether the pressing head has reached the preset pressing state, based on the comparison result of the output torque value and the preset first torque value and second torque value, without installing a pressure sensor. Therefore, the pressing pressure of the pressing head on the second platform can be controlled by controlling the output torque value, achieving accurate control and monitoring of the pressing head's downward pressure. Simultaneously, by using the sum of the first torque value and the second torque value as the stopping point of the pressing head, the torque and pressure applied by the pressing head to the electronic components can be accurately controlled, avoiding damage to the electronic components and ensuring process quality and stability. Therefore, the monitoring method for the semiconductor device pressing apparatus provided by this application eliminates the need to install traditional pressure sensors on the pressing head surface, solving the problem that traditional pressure monitoring methods cannot be implemented due to the special design limitations of the pressing head surface. It also simplifies the operation process, improves production efficiency, and can ensure the optical application requirements of the pressing head surface while avoiding damage or breakage of electronic components, improving pressing yield and the reliability of the pressing process, as well as the reliability of optical components and the assembly yield of optical modules.

[0064] In some alternative implementations, the second torque value is calculated according to the following formula: T=P r A, Where T is torque (N•m) and P is pressure (Pa or N / m) 2 ), r is the radius of rotation (m), A is the contact area (m²) 2 ).

[0065] Specifically, torque is defined as: T=F r, where T is torque (N•m), F is the tangential force (N) acting at radius r of the drive motor, and r is the radius of rotation (m); pressure is defined as: P=F / A, where P is pressure (Pa or N / m). 2 A is the contact area (m²) 2 Since the drive motor 40 generates downward force through torque, the two equations can be combined to establish a corresponding relationship, resulting in T=P. r A.

[0066] In addition, since energy loss may occur during the movement of the pressure head 30, an efficiency coefficient or correction factor needs to be added for practical applications.

[0067] In some alternative implementations, the formula for calculating the second torque value is T. B =P r A m, where T is torque (N•m) and P is pressure (Pa or N / m) 2 ), r is the radius of rotation (m), A is the contact area (m²) 2 ), where m is the correction factor.

[0068] In some optional embodiments, the method for calculating the second torque value required for the pressure head to reach the preset pressing state based on the preset pressing pressure includes: Provides a curve showing the relationship between the pressing pressure on the lower surface of the indenter and the torque of the drive motor; The second torque value is calculated from the corresponding relationship curve based on the preset crimping pressure.

[0069] In some alternative implementations, the theoretical value is usually corrected by experimentally establishing a curve relating torque to downforce (i.e., the pressing pressure on the lower surface of the indenter) and obtaining a curve relating the actual pressing pressure to the torque of the drive motor.

[0070] In some alternative implementations, the method further includes: when the output torque value is lower than the sum of the first torque value and the second torque value, the control unit 60 increases the output torque value of the drive motor 40 by increasing the current or voltage of the drive motor 40.

[0071] In some optional embodiments, the method further includes: when the output torque value is equal to the sum of the first torque value and the second torque value, keeping the output torque value unchanged, adjusting the movement state of the drive motor 40 and the pressure head 30 to stop, keeping the pressure head 30 in a preset pressing state, and maintaining the pressing pressure of the pressure head 30 on the second platform 20 at the preset pressing pressure. After maintaining the preset pressing state for a certain period of time and performing subsequent processes, the control unit 60 controls the drive motor 40 and the pressure head 30 to move upward, so that the pressure head 30 separates from the second platform 20.

[0072] In some optional implementations, the preset crimping pressure includes an upper limit value and a lower limit value, and the corresponding second torque value includes a second torque upper limit value and a second torque lower limit value; When the output torque value is less than the sum of the first torque value and the second lower torque limit value, the control unit 60 increases the output torque value of the drive motor 40 to further increase the pressing pressure applied by the pressure head 30 to the second platform 20. When the output torque value is greater than the sum of the first torque value and the second upper torque limit value, the control unit 60 decreases the output torque value of the drive motor 40 to reduce the pressing pressure applied by the pressure head 30 to the second platform 20. When the difference between the output torque value and the first torque value is between the second upper torque limit value and the second lower torque limit value, the control unit 60 controls the drive motor 40 and the pressure head 30 to stop moving, so that the pressing pressure applied by the pressure head 30 to the second platform 20 is maintained within the preset pressing pressure range.

[0073] In some alternative embodiments, electronic component 11 is a semiconductor chip; substrate 21 is a packaging substrate 21; or: Electronic component 11 is an optical assembly; substrate 21 is an optical assembly carrier or optical assembly stage.

[0074] In some alternative implementations, the optical components may be lens modules, optical filters, optical receiving components, etc.

[0075] like Figure 3 As shown in the figure, this embodiment provides a specific flowchart of a method for bonding and monitoring a semiconductor device, including but not limited to steps S201 to S206.

[0076] Step S201: Obtain the first torque value T required for the pressure head 30 to operate under no-load conditions. A ; and the preset pressing pressure P required to press the electronic component 11 to be bonded together with the substrate 21 to be bonded. B .

[0077] Step S202 provides a curve showing the relationship between the pressing pressure on the lower surface of the pressure head 30 and the torque of the drive motor 40.

[0078] Step S203, according to the preset crimping pressure P B The second torque value T required for the pressure head 30 to reach the preset pressing state is calculated based on the corresponding relationship curve. B The sum of the first and second torque values ​​was calculated to be T. C .

[0079] Step S204: Fix the electronic component 11 to be bonded below the second platform 20 and align it with the substrate 21 to be bonded on the first platform 10.

[0080] In step S205, the control unit 60 controls the drive motor 40 to start the pressing process, which includes a first stage, a second stage, and a third stage; wherein, the control unit 60 is used to determine the output torque value and the preset T based on the torque value. C Based on the comparison results, it is determined whether the pressure head 30 has reached the preset pressing state, so as to adjust the movement state of the drive motor 40. Step S205 includes steps S205-1 to S205-3.

[0081] Step S205-1, first stage: control unit 60 controls drive motor 40 to operate at a first torque value T. A Moving downwards, the drive motor 40 drives the pressure head 30 to move downwards; the pressure head 30 is in its first state, as shown below. Figure 4 As shown; Step S205-2: When the pressure head 30 begins to contact the second platform 20, the second stage begins. The control unit 60 controls the drive motor 40 to gradually increase the torque and drive the pressure head 30 downward. The pressure head 30 continues to press the electronic component 11 and the substrate 21 together. The torque sensing module begins to monitor the output torque value of the drive motor 40 in real time. In the second stage, if the output torque value is lower than T... C At this time, the pressing pressure applied by the pressure head 30 to the second platform 20 is less than the preset pressing pressure, and the pressure head 30 is in the second state, such as... Figure 5 As shown; Step S205-3, when the output torque value equals T C At this point, entering the third stage, the pressure head 30 reaches the preset pressing state. The pressing pressure applied by the pressure head 30 to the second platform 20 reaches the preset pressing pressure. The control unit 60 controls the drive motor 40 and the pressure head 30 to stop moving. The lower surface of the pressure head 30 maintains the preset pressing pressure, continuously pressing the second platform 20 and the first platform 10 together. Figure 6 As shown.

[0082] In step S206, the electronic component 11 and the substrate 21 are held in a preset pressing state for a certain period of time, and subsequent processes are performed to bond them together under a preset pressing pressure.

[0083] In step S207, the control unit 60 controls the drive motor 40 and the pressure head 30 to move upward, so that the pressure head 30 separates from the second platform 20.

[0084] The monitoring system and method for a semiconductor chip bonding apparatus provided by this invention can be applied to the bonding process of semiconductor chips and the assembly process of optical components. Specifically, this invention provides Embodiment 1 and Embodiment 2.

[0085] Example 1 This embodiment provides a monitoring system and method for a semiconductor chip bonding apparatus, used in semiconductor chip bonding processes, and particularly suitable for processes that precisely bond semiconductor chips onto substrates (such as packaging substrates or glass carriers).

[0086] The system includes a first platform, a second platform, a servo motor, a pressure head, a torque sensing module, and a control unit. The first platform has a substrate mounted on its upper surface; the second platform has a semiconductor chip fixed underneath.

[0087] According to such Figure 3 The semiconductor device bonding and monitoring method shown in the diagram bonds semiconductor chips together.

[0088] During implementation, the system first calculates the initial torque value T required for the pressure head to operate under no-load conditions. AThen, based on the structure and material properties of the semiconductor chip and substrate, the preset pressing pressure is determined; and the second torque value T required corresponding to the preset pressing pressure is calculated according to the curve showing the relationship between the pressing pressure and the torque of the drive motor. B .

[0089] During the pressing process, the servo motor drives the pressure head to move vertically. In the first stage, the control unit sets the pressure head to move at a first torque value T. A The unloaded downward movement continues. When the pressure head contacts the second platform and generates a reaction force, the torque gradually increases, entering the second stage, gradually pressing the chip down to the corresponding substrate surface. The torque sensing module, located in the motor or transmission mechanism, begins to monitor the output torque value of the drive motor in real time. When the torque sensing module senses that the output torque value reaches T... C Time (T) C =T A +T B The control unit immediately stops the motor drive to ensure that the pressure applied to the chip by the pressure head is just right.

[0090] The pressing method described in Example 1 can effectively prevent chip breakage due to excessive pressure or poor bonding due to insufficient pressure, thereby improving packaging yield and product stability.

[0091] Example 2 This embodiment provides a monitoring system and method for a semiconductor chip pressing device, which is applied to high-precision assembly operations of optical components (such as lens modules, optical filters, and optical receiving components), with particular emphasis on the controllability and stability of the pressing head when applying pressure to the optical interface.

[0092] The system includes a first platform, a second platform, a servo motor, a pressure head, a torque sensing module, and a control unit. The electronic components are optical assemblies; the substrate is an optical assembly carrier or stage. For example, the substrate can be a positioning base, an adhesive surface, or a microstructure stage.

[0093] During implementation, the system first calculates the initial torque value T required for the pressure head to operate under no-load conditions. A Then, based on the material and structural characteristics of the specific optical components, the preset pressing pressure is determined; and the second torque value T required corresponding to the preset pressing pressure is calculated according to the curve of the relationship between the pressing pressure and the torque of the drive motor. B .

[0094] During the pressing process, when the motor drives the pressure head downwards and contacts the optical components, the torque sensing unit begins to monitor the total torque value; once the output torque value reaches the set T... C Time (T) C =T A +T BThe control unit stops the motor and can selectively initiate the fixing, curing, or visual calibration process. Finally, it controls the motor and pressure head to move upwards to end the pressing process.

[0095] The pressing method described in Example 2 ensures consistent contact pressure between the press head and the optical components, preventing optical surface warping, coating damage, or micro-displacement deviations, which helps improve the overall assembly yield and product consistency of the optical module.

[0096] In the description of this specification, the references to terms such as "this embodiment," "an embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, those skilled in the art can combine and integrate the different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of the present invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0097] The above description does not provide detailed explanations of the technical aspects of each layer's patterning, etching, etc. However, those skilled in the art should understand that various technical means can be used to form layers and regions of the desired shape. Furthermore, to form the same structure, those skilled in the art can also design methods that are not entirely identical to those described above. Additionally, although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination.

[0098] The above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described above, and various obvious changes, readjustments, combinations, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention. The scope of protection of the present invention is determined by the scope of the appended claims.

Claims

1. A monitoring system for a semiconductor device bonding apparatus, characterized in that, include: The first platform is used to support the substrate to be bonded; The second platform, located above the first platform, is used to fix the electronic components to be bonded; The electronic components are located below the second platform; A pressure head, located above the second platform, is used to press the electronic components and the substrate together. The pressure head includes opposing upper and lower surfaces, wherein the lower surface of the pressure head is adapted to apply pressing pressure to the second platform. A drive motor is connected to the pressure head and is used to drive the pressure head to perform linear motion perpendicular to the rotation axis of the drive motor; the drive motor is connected to or equipped with a brake. A torque sensing module, located inside the drive motor, is used to monitor the output torque value of the drive motor in real time. The control unit, connected to the torque sensing module and the drive motor, is used to determine whether the pressure head has reached a preset pressing state based on the comparison result of the output torque value with a preset first torque value and a second torque value, so as to adjust the movement state of the pressure head; when the output torque value of the torque sensing module is equal to the sum of the first torque value and the second torque value, the pressure head reaches the preset pressing state, the pressing pressure applied by the pressure head to the second platform is the preset pressing pressure, and the control unit is used to control the drive motor to stop the movement of the pressure head; Wherein, the first torque value is the torque required for the pressure head to operate under no-load conditions; The second torque value is the torque required for the pressure head to apply a preset pressing pressure to the second platform; the preset pressing pressure is the pressure required to press the electronic component and the substrate together.

2. The monitoring system for the semiconductor device bonding apparatus according to claim 1, characterized in that, The upper surface of the pressure head has an optical structure; The drive motor is connected to the side of the pressure head.

3. The monitoring system for the semiconductor device bonding apparatus according to claim 1, characterized in that, The preset crimping pressure includes an upper limit and a lower limit; The control unit is adapted to adjust the output torque value of the drive motor through feedback control to maintain the pressing pressure applied by the pressure head to the second platform within the range of the preset pressing pressure.

4. The monitoring system for the semiconductor device bonding apparatus according to claim 1, characterized in that, The drive motor is a servo motor, which drives the pressure head to move downward in the vertical direction, pressing the electronic components onto the surface of the substrate.

5. The monitoring system for the semiconductor device bonding apparatus according to claim 1, characterized in that, The first platform and the second platform are portable platforms; The electronic components are aligned vertically with the substrate.

6. A monitoring method for a semiconductor device bonding apparatus, characterized in that, The monitoring system for the semiconductor device bonding apparatus as described in claim 1 is used for bonding and monitoring, including: Obtain the first torque value required for the pressure head to operate under no-load conditions; and the preset pressing pressure required for the electronic components to be bonded to be pressed together with the substrate; Calculate the second torque value required for the pressure head to reach the preset pressing state based on the preset pressing pressure; The electronic components to be bonded are fixed below the second platform and aligned with the substrate to be bonded on the first platform; The control unit controls the drive motor to move, and the drive motor drives the pressure head to move downward; When the pressure head begins to contact the second platform, the torque sensing module begins to monitor the output torque value of the drive motor in real time; The pressure head continues to press the electronic components together with the substrate; the control unit is used to determine whether the pressure head has reached a preset pressing state based on the comparison result of the output torque value with the preset first torque value and second torque value, so as to adjust the movement state of the drive motor; when the output torque value is equal to the sum of the first torque value and the second torque value, the pressure head reaches the preset pressing state, the pressing pressure applied by the pressure head to the second platform is the preset pressing pressure, and the control unit controls the drive motor and the pressure head to stop moving.

7. The monitoring method for the semiconductor device bonding apparatus according to claim 6, characterized in that, The second torque value is calculated using the following formula. T=P r A, Where T is torque (N•m) and P is pressure (Pa or N / m) 2 ), r is the radius of rotation (m), A is the contact area (m²) 2 ).

8. The monitoring method for the semiconductor device bonding apparatus according to claim 6, characterized in that, The method further includes: when the output torque value is lower than the sum of the first torque value and the second torque value, the control unit increases the output torque of the drive motor by increasing the current or voltage of the drive motor.

9. The monitoring method for the semiconductor device bonding apparatus according to claim 6, characterized in that, The method further includes: when the output torque value is equal to the sum of the first torque value and the second torque value, keeping the output torque value unchanged, adjusting the movement state of the drive motor and the pressure head to stop, keeping the pressure head in a preset pressing state, and maintaining the pressure of the pressure head on the second platform at a preset pressing pressure. After maintaining the preset pressing state for a certain period of time and performing subsequent processes, the control unit controls the drive motor and the pressure head to move upward, so that the pressure head separates from the second platform.

10. The monitoring method for the semiconductor device bonding apparatus according to claim 6, characterized in that, The electronic component is a semiconductor chip; the substrate is a packaging substrate. or: The electronic component is an optical assembly; the substrate is an optical assembly carrier or an optical assembly stage.

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