Embedded power module with heat dissipation assembly and inverter

Abstract

The invention relates to an embedded power module with a heat dissipation assembly. The embedded power module comprises an embedded module, the heat dissipation assembly and a connecting material, a heat dissipation assembly is arranged at the bottom of the embedded module through a connecting material; the heat dissipation assembly comprises a uniform temperature plate and a plurality of heat dissipation fins; the uniform temperature plate is attached to the bottom of the embedded module through a connecting material; and the plurality of radiating fins are uniformly arranged at the bottom of the uniform temperature plate. The invention also relates to an inverter. According to the invention, the VC temperature equalizing plate and the liquid cooling fins are combined to form a composite heat dissipation scheme, so that the temperature equalizing characteristic of zero thermal resistance in the plane can be realized, the heat is quickly and uniformly distributed, the heat of the chip is taken away through liquid cooling of the cooling fins, the generation of local hot spots is effectively avoided, and the power cycle life is remarkably prolonged. And meanwhile, the heat capacity of VC is small, transient change of power can be quickly responded, the transient response time is shorter than that of a traditional copper substrate module, the saturation temperature is faster reached, and power surge is avoided.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit manufacturing technology, and in particular to an embedded power module and inverter with heat dissipation components. Background Technology

[0002] As a core component of the inverter, the power module's power density, parasitic parameters, and integration level directly affect the performance of the controller and electric drive. By optimizing and improving the power module's packaging scheme, the inverter's weight and size, as well as module efficiency, can be directly affected, resulting in a significant improvement in the vehicle's range and energy efficiency.

[0003] Currently, the power modules used in the main drive inverters of new energy vehicles are limited by their packaging methods, resulting in significant room for improvement in performance parameters such as stray inductance and thermal resistance. Furthermore, future electric drive assemblies will require even higher levels of integration. Patent CN119833504 A describes an AMB substrate embedded in a PCB package to integrate a power module, which can effectively improve power density and reduce module weight and size. However, its chips are exposed, requiring copper plating on the chip surface before packaging and electrical connection, leading to complex manufacturing processes, low reliability, and high costs. Summary of the Invention

[0004] The first objective of this invention is to provide an embedded power module with a heat dissipation component, which improves the heat dissipation capability of the embedded module, reduces hot spot temperature, significantly increases the power density of the heat dissipation system, and significantly reduces thermal resistance.

[0005] An embedded power module with a heat dissipation component includes an embedded module, a heat dissipation component, and connecting materials;

[0006] The heat dissipation component is provided at the bottom of the embedded module via a connecting material;

[0007] The heat dissipation component includes a heat spreader and several heat sinks;

[0008] The heat spreader is attached to the bottom of the embedded module via the connecting material;

[0009] Several heat sinks are evenly arranged at the bottom of the heat exchange plate.

[0010] Specifically, the heat exchange plate is a VC heat exchange plate.

[0011] Specifically, the connecting material is a silver sintered layer or a tin solder layer.

[0012] Specifically, several heat sinks are evenly arranged on the bottom of the heat spreader by welding.

[0013] A second objective of the present invention is to provide an inverter comprising a plurality of power modules, wherein the power modules are the aforementioned embedded power modules with heat dissipation components.

[0014] Optionally, it also includes a water jacket housing, wherein the heat dissipation component of each power module has an independent heat spreader, and after the heat dissipation component and the embedded module are fixed together to form a module unit, multiple units are then connected to the water jacket housing.

[0015] Optionally, the system also includes a water jacket housing, wherein the heat dissipation assembly of each power module uses the same heat dissipation plate, multiple embedded modules are connected to the heat dissipation assembly, and then the entire assembly is connected to the water jacket housing.

[0016] The embedded power module and inverter with heat dissipation components of the present invention have the following advantages compared with the prior art:

[0017] (1) Using the “VC vapor chamber + heat sink” heat dissipation component, the heat on the chip can be quickly and evenly distributed on the VC vapor chamber, and the heat can be carried away by the liquid cooling heat sink, realizing the rapid lateral diffusion and vertical conduction of heat, improving the heat dissipation capacity of the embedded module, reducing the hot spot temperature, greatly improving the power density of the heat dissipation system, and significantly reducing the thermal resistance.

[0018] (2) Because the temperature distribution is improved by the temperature distribution plate, the liquid cooling system can operate at a reduced flow rate, which reduces the power of the system pump and reduces the system operating cost. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of an embedded power module with a heat dissipation component according to Embodiment 1;

[0020] Figure 2 An exploded view of an embedded power module with a heat dissipation component according to Embodiment 1;

[0021] Figure 3 This is a schematic diagram of the inverter in Example 2;

[0022] Figure 4 This is a schematic diagram of the heat dissipation principle of the inverter in Example 2;

[0023] Figure 5 This is a temperature cloud map of the inverter with conventional copper base plate heat dissipation in Example 2;

[0024] Figure 6 This is a temperature cloud map of the internal chips of the inverter with conventional copper base plate heat dissipation in Example 2;

[0025] Figure 7 This is a temperature cloud map of the inverter in Example 2;

[0026] Figure 8 This is a temperature cloud diagram of the internal chips of the inverter in Example 2;

[0027] Figure 9 This is a schematic diagram showing the connection between the heat spreader and the heat sink in Example 3;

[0028] Figure 10 This is a schematic diagram of the inverter in Example 3. Detailed Implementation

[0029] The specific embodiments of this invention will be further described in detail below with reference to the accompanying drawings.

[0030] Example 1

[0031] In this embodiment, as Figure 1 and Figure 2 As shown, an embedded power module with a heat dissipation component includes an embedded module 10, a heat dissipation component 30, and a connecting material 20.

[0032] The heat dissipation component 30 is provided at the bottom of the embedded module 10 via the connecting material 20;

[0033] The heat dissipation component 30 includes a heat spreader 31 and a plurality of heat sinks 32;

[0034] The temperature distribution plate 31 is attached to the bottom of the embedded module 10 via the connecting material;

[0035] Several heat sinks 32 are evenly arranged at the bottom of the heat spreader 31.

[0036] In this embodiment, the heat exchange plate 31 is a VC (Vapor Chamber) heat exchange plate.

[0037] In this embodiment, the connecting material 20 is a silver sintered layer or a tin solder layer.

[0038] Specifically, a number of heat sinks 32 are evenly arranged on the bottom of the heat spreader 31 by welding.

[0039] Working principle: A composite heat dissipation solution combining a VC (Vapor Chamber) heat sink and a liquid-cooled heatsink achieves zero in-plane thermal resistance and uniform temperature distribution, rapidly and evenly distributing heat. The heat is then dissipated from the chip via liquid cooling, effectively preventing localized hotspots and significantly improving power cycle life. Simultaneously, the VC's low thermal capacity allows for rapid response to transient power changes, with a shorter transient response time than traditional copper-based modules, reaching saturation temperature faster and preventing power surges.

[0040] Example 2

[0041] like Figure 3As shown, an inverter includes several power modules 100 and a water jacket housing 200; the power module 100 is an embedded power module with heat dissipation components described in Embodiment 1; the heat dissipation components of each power module 100 have independent heat dissipation plates 31, and after the heat dissipation components 30 and the embedded modules 10 are fixed together to form a module unit, multiple module units are then connected to the water jacket housing 200.

[0042] Working principle: such as Figure 4 As shown, using a "VC vapor chamber + heatsink" heat dissipation component can quickly and evenly distribute the heat on the chip onto the VC vapor chamber, and then remove the heat through the liquid-cooled heatsink. This achieves rapid lateral diffusion and vertical conduction of heat, improving the heat dissipation capacity of the embedded module, reducing hot spot temperatures, significantly increasing the power density of the cooling system, and markedly reducing thermal resistance. Furthermore, because the vapor chamber improves temperature distribution, the liquid cooling system can operate at a lower flow rate, reducing the power of the system pump and lowering system operating costs.

[0043] like Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown, the inverter with conventional copper base plate heat dissipation and the inverter in Example 2 were tested by simulation. The inverter provided in this example has a 12.6% decrease in thermal resistance and an 8.5°C decrease in average junction temperature of the chip under continuous operation. Compared with the inverter with conventional copper base plate heat dissipation, its uniform heat dissipation effect is significant.

[0044] Example 3

[0045] like Figure 9 and Figure 10 As shown, an inverter includes several power modules 100 and a water jacket housing 200; the power module 100 is an embedded power module with a heat dissipation component described in Embodiment 1; the heat dissipation component of each power module 100 has the same heat dissipation plate 31, and multiple embedded modules 10 are connected to the heat dissipation component 30, and then the whole is connected to the water jacket housing.

[0046] The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to the embodiments described. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and these equivalent modifications or substitutions are all included within the scope defined by the claims of this application.

Claims

1. An embedded power module with a heat dissipation component, characterized in that, Includes embedded modules, heat dissipation components, and connection materials; The heat dissipation component is provided at the bottom of the embedded module via a connecting material; The heat dissipation component includes a heat spreader and several heat sinks; The heat spreader is attached to the bottom of the embedded module via the connecting material; Several heat sinks are evenly arranged at the bottom of the heat exchange plate.

2. An embedded power module with a heat dissipation component according to claim 1, characterized in that, The heat exchange plate is a VC heat exchange plate.

3. An embedded power module with a heat dissipation component according to claim 1, characterized in that, The connecting material is a silver sintered layer or a tin solder layer.

4. An embedded power module with a heat dissipation component according to any one of claims 1 to 3, characterized in that, Several heat sinks are evenly arranged on the bottom of the heat spreader by welding.

5. An inverter, characterized in that, It includes several power modules, wherein the power modules are embedded power modules with heat dissipation components as described in any one of claims 1 to 4.

6. An inverter according to claim 5, characterized in that, It also includes a water jacket housing, and the heat dissipation component of each power module has an independent heat dissipation plate. After the heat dissipation component and the embedded module are fixed together to form a module unit, multiple units are then connected to the water jacket housing.

7. A power module assembly according to claim 5, characterized in that, It also includes a water jacket housing, and the heat dissipation components of each power module have the same heat dissipation plate. Multiple embedded modules are connected to the heat dissipation components, and then the whole is connected to the water jacket housing.

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