Liquid cooling heat dissipation device

Abstract

A liquid cooling heat dissipation device of the present invention relates to the technical field of electronic device heat dissipation, and comprises a shell and a water channel, the side surface of the shell is provided with an inflow port and an outflow port of a cooling liquid, and the lower surface of the shell is provided with fin-shaped protrusions; the water channel is arranged in the shell and connected between the inflow port and the outflow port, and the turbulent flow assemblies are arranged in the water channel at intervals. The device does not need to depend on a cooling fan and is not affected by environmental factors of external dust and humidity, the fin-shaped protrusions reduce the temperature difference of the surface of the shell, the condensation risk is reduced, long-term stable operation of the IGBT chip is guaranteed, meanwhile, the heat dissipation area is increased, the auxiliary heat dissipation effect is improved, heat of the IGBT chip is rapidly and evenly absorbed and dissipated, and local overheating of the IGBT chip is avoided; the turbulent flow assembly is arranged in the water channel, the water channel is divided to form a heat dissipation channel, splashing type micro-water flow is generated, the splashing type micro-water flow makes full contact with the inner wall of the water channel, the heat exchange area of cooling liquid and the shell is increased, meanwhile, a water flow boundary layer is damaged, and heat transfer is accelerated.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic device heat dissipation, in particular to a liquid cooling heat dissipation device. BACKGROUND

[0002] At present, IGBT (Insulated Gate Bipolar Transistor) chips as core electronic components in high-voltage and high-current scenarios such as new energy fields will produce obvious switching loss in high-frequency switching process, and there is conduction loss in the on state.

[0003] In the prior art, with the increase of IGBT chip voltage or current level, its loss increases exponentially. If the heat dissipation is not timely or insufficient, it will lead to degradation of IGBT chip device performance, such as increase of on-resistance; at the same time, it reduces the reliability of the device, causes thermal fatigue failure, and even causes IGBT chip transient thermal breakdown, affecting the normal operation of the entire electronic system.

[0004] However, the existing IGBT chip heat dissipation technology mainly includes two types: one is to install a heat dissipation fan near the IGBT chip for heat dissipation, which has poor heat dissipation effect and cannot concentrate on the high-efficiency heat dissipation of the IGBT chip heat generation area, and the heat dissipation fan has a large volume and is easily affected by external dust and humidity environmental factors, resulting in poor heat dissipation stability; the other is to use liquid cooling method to dissipate heat for IGBT chip plate, and in the existing liquid cooling technology, a recess is arranged in the middle of the shell to fix the IGBT chip, but such ordinary liquid cooling heat dissipation device has high requirements for liquid supply system, and has the problems of low heat dissipation efficiency and uneven heat dissipation. SUMMARY

[0005] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application provides a liquid cooling heat dissipation device, which improves the heat dissipation efficiency and effect and guarantees the long-term stable operation of the IGBT chip.

[0006] Therefore, the present application provides a liquid cooling heat dissipation device, which comprises: A shell, the side surface of the shell is provided with a cooling liquid inlet and outlet, and the outer lower surface of the shell is provided with fin-shaped protrusions; A water channel is arranged in the shell and is in communication with the inlet and outlet, respectively; A plurality of turbulence components are arranged in the water channel.

[0007] The liquid cooling heat dissipation device has at least the following technical effects: the device does not depend on a heat dissipation fan, is not affected by external dust and humidity, the fin-shaped protrusions reduce the temperature difference of the surface of the shell, reduce the risk of condensation, and ensure long-term stable operation of the IGBT chip; the fin-shaped protrusions on the surface of the shell increase the heat dissipation area, improve the auxiliary heat dissipation effect, quickly and uniformly absorb and dissipate the heat of the IGBT chip, avoid local overheating of the IGBT chip, and solve the problem of uneven heat dissipation of the existing heat dissipation mode. The water channel is divided by the turbulence component to form a heat dissipation channel and generate a splashing micro water flow, the splashing micro water flow fully contacts the inner wall of the water channel, increases the heat exchange area of the cooling liquid and the shell, and at the same time, destroys the water flow boundary layer and accelerates heat transfer; during the flow of the cooling liquid in the heat dissipation channel, the heat generated by the IGBT chip (or other heat-generating electronic components) fixed on the upper surface of the shell is quickly absorbed through the heat conduction of the shell, the heat dissipation of the IGBT chip is quickly and uniformly absorbed, local overheating of the IGBT chip is avoided, and the problem of uneven heat dissipation in the prior art is solved; the heat exchange efficiency and the heat dissipation uniformity of the cooling liquid and the shell are improved, and the heat dissipation effect of small flow and high efficiency is achieved.

[0008] According to some embodiments of the present application, the turbulence components are arranged in the water channel along a first direction and a second direction, and the first direction and the second direction are intersecting directions. By arranging the turbulence components in multiple directions, a grid-type turbulence is formed, and the heat dissipation effect is better.

[0009] According to some embodiments of the present application, the turbulence component includes a plurality of groups of turbulence columns, and an interval is provided between two adjacent turbulence columns to ensure that the cooling liquid can be disturbed by the turbulence throughout the flow in the water channel.

[0010] According to some embodiments of the present application, the turbulence component includes a plurality of turbulence plates, each of which includes a first side surface and a second side surface intersecting at the edges, the first side surface is a surface with a first curvature, the second side surface is a surface with a second curvature, the first curvature is smaller than the second curvature and is curved in the same direction, the outer convex side of the first side surface faces the flow inlet, and the inner concave side of the second side surface faces the flow outlet. The turbulence plate with two curved surfaces of different curvatures can generate a composite vortex to strengthen heat transfer, break the thermal boundary layer, reduce the heat exchange dead angle, and improve the heat exchange efficiency.

[0011] According to some embodiments of the present application, a plurality of turbulence plates with decreasing side areas are arranged in the direction from the flow inlet to the flow outlet to form a turbulence plate component, and a plurality of turbulence plate components are arranged in the water channel. The step-type area design optimizes the flow resistance distribution, balances the heat dissipation efficiency and water flow energy consumption, and improves the overall heat exchange stability and energy utilization efficiency of the heat sink.

[0012] According to some embodiments of the present application, the flow inlet and the flow outlet are arranged on two symmetrical sides of the shell respectively; or the flow inlet and the flow outlet are arranged on the same side of the shell; and a quick connector is arranged at each of the flow inlet and the flow outlet, and the quick connector is welded and fixed with the shell. By adapting the external cooling liquid pipeline with the quick connector, the quick plug-in connection of the external cooling liquid pipeline and the shell is realized, without complex pipeline disassembly operation, and the convenience during device installation and maintenance is greatly improved.

[0013] According to some embodiments of the present application, when the flow inlet and the flow outlet are arranged on the same side of the shell, a partition plate is arranged between the flow inlet and the flow outlet, and the water channel is divided into two incomplete closed parts. By the bidirectional water channel, the cooling liquid uniformly covers the entire water channel cross section, and cooperates with the vortex generated by the two directional spoiler plates, so that the dead water area of the traditional unidirectional water channel is completely broken. There is no local low flow area in the water channel, which further avoids the imbalance problem of overheating in some areas and excessive heat dissipation in some areas, reduces the temperature difference of each part of the radiator, and improves the heat dissipation stability of the device.

[0014] According to some embodiments of the present application, a movable spiral guide rib is arranged at the turning part and the end of the water channel, and the guide rib has a spiral angle of 30°-45° along the water flow direction, and is used for guiding the cooling liquid in the water channel to flow along a spiral track. Under different water flow pressures, when the fluid flows through the upper and lower surfaces of the guide rib, a flow rate difference is formed, so that the guide rib itself is slightly changed in shape, position or angle, and then the turbulent state, flow rate and flow rate in the water channel are adjusted, and the heat dissipation efficiency is changed; at the same time, the cooling liquid is guided to flow along the spiral track, so as to avoid the formation of vortex and stagnation area at the turning part.

[0015] According to some embodiments of the present application, the water channel includes a core heating area channel and an edge auxiliary area channel, the core heating area channel is located in the middle of the edge auxiliary area channel, and the core heating area channel and the edge auxiliary area channel are connected through a gradual transition channel. The partitioned variable-diameter heat dissipation channel effectively reduces the temperature of the core heating area of the IGBT chip, solves the local hot spot problem, and avoids the failure of the IGBT chip due to local overheating.

[0016] According to some embodiments of the present application, the inner wall of the water channel is provided with a composite plating layer of copper and graphene; and a micro-nano level convex point array is further arranged on the composite plating layer of copper and graphene of the inner wall of the water channel. By forming a dense oxide layer on the surface of the composite plating layer of copper and graphene, the corrosion resistance of the device to the cooling liquid is improved; the micro-nano level convex point array increases the contact area of the composite plating layer and the cooling liquid, so that the heat absorbed by the composite plating layer can be quickly transferred to the cooling liquid, and the waste of heat conduction performance caused by the fact that the heat cannot be timely discharged from the composite plating layer is avoided.

[0017] Additional aspects and advantages of the present application will be made apparent from the following description. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from the structures shown in the drawings without creative labor.

[0019] Figure 1 Structure diagram of a liquid cooling heat dissipation device of the present application Figure 1 Figure 2 Structure diagram of a liquid cooling heat dissipation device of the present application Figure 2 Figure 3 Structure diagram of an internal turbulence column of a liquid cooling heat dissipation device of the present application in embodiment 1 Figure 4 Structure diagram of an internal turbulence plate of a liquid cooling heat dissipation device of the present application in embodiment 2 Figure 5 Front view of the liquid cooling heat dissipation device Figure 4 Sectional view of A-A in the liquid cooling heat dissipation device Figure 6 Figure 4

[0020] Explanation of reference signs: 100, housing; 101, flow inlet; 102, flow outlet; 103, quick connector; 104, fin-shaped protrusion; 200, water channel; 300, turbulence assembly; 301, turbulence column; 302, turbulence plate; 3021, first side; 3022, second side; 303, partition.

[0021] The purposes of the drawings, functional features and advantages will be further described with reference to the embodiments and the drawings. DETAILED DESCRIPTION

[0022] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation of the present application.

[0023] ​​​​In the description of the present application, it should be understood that the orientation description, such as the orientation or positional relationship indicated by up, down, front, back, left, right and the like, is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0024] In the description of the present application, one or more is understood as one or more, more than two is understood as more than two, greater than, less than, more than, etc. are understood as not including the number, above, below, etc. are understood as including the number. If the first, second is described, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or the order of technical features indicated.

[0025] In the description of the present application, unless otherwise explicitly limited, the words such as setting, mounting, connecting, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical solution.

[0026] In order to make the purpose, technical scheme and advantages of the present application more clear and explicit, the present application will be further described in detail below in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the present application and are not used to limit the present application, that is, the described examples are only a part of the examples of the present application, not all examples. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0027] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed application, but only represents selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0028] Example 1 Referring to Figures 1 to 3 As shown in the drawings, a liquid cooling heat dissipation device of the present application is used to cool IGBT chips or other heat generating electronic components mounted on the surface of the shell 100; comprising a shell 100, a water channel 200 and a plurality of turbulence components 300. Among them, the side of the shell 100 is provided with a cooling liquid inlet 101 and an outlet 102, and the outer lower surface of the shell 100 is provided with a fin-shaped protrusion 104; the water channel 200 is arranged inside the shell 100 and is respectively communicated with the inlet 101 and the outlet 102; a plurality of turbulence components 300 are arranged in the water channel 200.

[0029] In the embodiment, the shell 100 is provided with an inlet 101 for the cooling liquid to flow into the device and an outlet 102 for the cooling liquid to flow out of the device. Inside the shell 100, a water channel 200 is arranged for the cooling liquid to flow through. One end of the water channel 200 is connected to the inlet 101, and the other end of the water channel 200 is connected to the outlet 102. When the cooling liquid flows from the inlet 101 into the water channel 200, and then flows out of the water channel 200 from the outlet 102, the cooling liquid exchanges heat with the IGBT chips in the process, thereby cooling the IGBT chips by liquid cooling. Referring to Figure 2 As shown, the shell 100 is uniformly provided with fin-shaped protrusions 104 on the lower surface. The fin-shaped protrusions 104 effectively increase the contact area between the shell 100 and the external air. When hot air flows through the outer wall of the shell 100, the fin-shaped protrusions 104 can accelerate the dissipation of heat from the shell 100 to the air, thereby assisting to improve the heat dissipation efficiency and reducing the risk of condensation by reducing the temperature difference on the surface of the shell 100. The water channel 200 is arranged inside the shell 100, and the passage for the cooling liquid to flow between the inlet 101 and the outlet 102 is the water channel 200. A plurality of turbulence components 300 are arranged in the water channel 200.

[0030] The device does not need to rely on a heat dissipation fan and is not affected by environmental factors such as dust and humidity. The fin-shaped protrusions 104 reduce the temperature difference on the surface of the shell 100, thereby reducing the risk of condensation and ensuring the long-term stable operation of the IGBT chips. The fin-shaped protrusions 104 on the surface of the shell 100 increase the heat dissipation area and improve the auxiliary heat dissipation effect, thereby quickly and uniformly absorbing and dissipating the heat of the IGBT chips and avoiding local overheating of the IGBT chips. The device solves the problem of uneven heat dissipation in the prior art. The plurality of turbulence components 300 divide the water channel 200 to form a heat dissipation passage and generate a splashing micro water flow. The splashing micro water flow fully contacts the inner wall of the water channel 200, thereby increasing the heat exchange area between the cooling liquid and the shell 100 and breaking the boundary layer of the cooling liquid flow, thereby accelerating heat transfer. During the flow of the cooling liquid in the heat dissipation passage, the cooling liquid quickly absorbs the heat generated by the IGBT chips (or other heat-generating electronic components) fixed on the upper surface of the shell 100 through the heat conduction of the shell 100, thereby quickly and uniformly absorbing the heat dissipation of the IGBT chips and avoiding local overheating of the IGBT chips. The device solves the problem of uneven heat dissipation in the prior art. The device improves the heat exchange efficiency and uniformity between the cooling liquid and the shell 100, thereby achieving the effect of small flow and high efficiency heat dissipation.

[0031] In some specific embodiments of the present application, the turbulence components 300 are arranged in the water channel 200 along a first direction and a second direction, respectively, and the first direction and the second direction are intersecting directions.

[0032] In a specific embodiment, the first direction is parallel to the long side of the shell 100, the second direction is parallel to the short side of the shell 100, and the angle between the first direction and the second direction is 90°; it can be understood that, according to the actual heat dissipation requirement, the angle between the first direction and the second direction can be any angle between 0 and 180°, excluding 0° and 180°. By arranging the spoiler assembly 300 in multiple directions and in combination with the interval distribution of the spoiler assembly 300, the spoiler assembly 300 and the water channel 200 form a through heat dissipation channel, forming a spoiler grid, so that the heat dissipation effect is better.

[0033] In some specific embodiments of the present application, the spoiler assembly 300 includes a plurality of groups of spoiler columns 301; there is a gap between adjacent two spoiler columns 301.

[0034] In the present embodiment, referring to Figure 3 It is shown that a plurality of spoiler columns 301 are fixedly arranged in the middle region of the water channel 200, the spoiler column 301 is a cylindrical structure axially perpendicular to the flow direction of the cooling liquid, and the spoiler column 301 cooperates with the inner wall of the water channel 200 to divide the water channel 200 into a plurality of through heat dissipation channels. When the cooling liquid enters the water channel 200 from the inlet 101 and flows through the heat dissipation channels formed by the spoiler columns 301, the cooling liquid flow will be dispersed by the spoiler columns 301, forming a splashing micro water flow, which can fully contact the inner wall of the water channel 200, increase the heat exchange area of the cooling liquid and the shell 100, and at the same time destroy the water flow boundary layer to accelerate heat transfer; during the flow of the cooling liquid in the heat dissipation channel, the heat generated by the IGBT chip (or other heat generating electronic components) fixed on the upper surface of the shell 100 is quickly absorbed through the heat conduction of the shell 100, and then flows out through the outlet 102, which can quickly and uniformly absorb the heat emitted by the IGBT chip, avoid local overheating of the IGBT chip, and solve the problem of uneven heat dissipation in the prior art; improve the heat exchange efficiency and uniformity of the cooling liquid and the shell 100, which is the core of realizing small flow and high efficiency heat dissipation.

[0035] In a specific embodiment, referring to Figure 3 It is shown that the cross section of the water channel 200 in the shell 100 is rectangular, the width is 8mm, and the height is 6mm; the spoiler column 301 is made of aluminum alloy and has a cylindrical shape with a diameter of 1mm; the spoiler columns 301 are distributed in a longitudinal and transverse staggered manner to form a 6mm×6mm heat dissipation channel; the spoiler columns 301 are fixed on the inner wall of the water channel 200 by laser welding, and the length of the heat dissipation channel is consistent with the length of the water channel 200, so that the cooling liquid can be disturbed throughout the flow in the water channel 200.

[0036] In some specific embodiments of the present application, the flow inlet 101 and the flow outlet 102 are respectively arranged on two symmetrical sides of the shell 100; or the flow inlet 101 and the flow outlet 102 are arranged on the same side of the shell 100; and a quick connector 103 is arranged at each of the flow inlet 101 and the flow outlet 102, and the quick connector 103 is welded and fixed with the shell 100.

[0037] In the present embodiment, according to the arrangement in the water channel 200, the flow inlet 101 and the flow outlet 102 are respectively arranged on two symmetrical sides of the shell 100 along the length direction, or the flow inlet 101 and the flow outlet 102 are arranged on the same side of the shell 100, which is flexible in arrangement and suitable for different cooling requirements. A quick connector 103 is arranged at each of the flow inlet 101 and the flow outlet 102, and the quick connector 103 is welded and fixed with the shell 100. The quick connector 103 is adapted with the external cooling liquid pipeline, so as to realize the quick plug-in connection of the external cooling liquid pipeline with the shell 100, without the need of complicated pipeline dismounting operation, and greatly improving the convenience during installation and maintenance of the device.

[0038] Further, a sealing ring is arranged at the connection between the quick connector 103 and the shell 100.

[0039] In the present embodiment, the sealing ring adopts a double-layer fluorine rubber sealing ring, the inner layer is an O-shaped ring with a diameter of 10 mm, and the outer layer has a trapezoidal cross section. A nickel-titanium alloy memory metal spring is embedded in the inner side of the sealing ring. When the plug-in times of the quick connector 103 are greater than 500 times, the nickel-titanium alloy memory metal spring deforms to compensate for the wear of the sealing ring, and the compensation amount is 0.1 mm-0.3 mm, so as to ensure that the sealing pressure is greater than 0.8 MPa. The sealing ring improves the sealing effect between the quick connector 103 and the shell 100, prevents the cooling liquid from overflowing, and guarantees the cooling effect.

[0040] In some specific embodiments of the present application, movable spiral flow guide ribs are arranged at the turning and the end of the water channel 200, and the flow guide ribs have a spiral angle of 30°-45° along the water flow direction, and are used for guiding the cooling liquid in the water channel 200 to flow along a spiral track.

[0041] In the present embodiment, movable spiral flow guide ribs are arranged at the turning and the end of the water channel 200 in the shell 100 and are fixed in the rail groove with a gap. In one specific embodiment, the height of the movable spiral flow guide rib is 1 mm, the pitch is 5 mm, the material is consistent with the shell 100, and the flow guide rib has a spiral angle of 30° along the water flow direction. Under different water flow pressures, the movable spiral flow guide rib can be driven to slightly change the shape or position and angle due to the flow rate difference when the fluid flows through the upper and lower surfaces of the flow guide rib, so as to adjust the turbulent state, flow rate and flow velocity in the water channel 200, and change the heat dissipation efficiency; at the same time, the movable spiral flow guide rib can guide the cooling liquid to flow along a spiral track, so as to avoid the formation of vortex and stagnation zone at the turning.

[0042] In some specific embodiments of the present application, the water channel 200 includes a core heating area channel and an edge auxiliary area channel, the core heating channel is in the middle of the edge auxiliary area channel, and the core heating area channel and the edge auxiliary area channel are connected through a gradual transition channel.

[0043] In this embodiment, according to the heat density distribution of the IGBT chip, the heat density of the center of the IGBT chip is about 30 W / cm², and the heat density of the edge driving circuit is 5 W / cm². The water channel 200 is divided into a core heating area channel and an edge auxiliary area channel. The core heating channel and the edge auxiliary area channel are both circular regions, and the core heating channel is in the middle of the edge auxiliary area channel. The core heating area channel corresponds to the center of the IGBT chip, and the edge auxiliary area channel corresponds to the edge of the IGBT chip. The two types of channels are connected through a gradual transition channel. The partitioned variable-diameter heat dissipation channel effectively reduces the temperature of the core heating area of the IGBT chip, solves the problem of local hot spots, and avoids the failure of the IGBT chip due to local overheating.

[0044] Further, two longitudinal flow guide ribs are additionally arranged on the inner wall of the core heating area channel. The height of the longitudinal flow guide rib is 0.5 mm, and the width is 0.3 mm. The longitudinal flow guide rib guides the cooling liquid to flow through the high heat area first, so that the heat exchange area of the core heating area is significantly increased, and the temperature of the local hot spot is effectively reduced. Through the structure of the partitioned variable-diameter heat dissipation channel, different diameter water channels 200 and flow guide ribs are designed according to the heat density partition of the IGBT chip, so as to realize precise heat dissipation of the local high heat area.

[0045] In some specific embodiments of the present application, the inner wall of the water channel 200 is provided with a composite plating layer of copper and graphene. The composite plating layer of copper and graphene on the inner wall of the water channel is further provided with a micro-nano level bump array.

[0046] In this embodiment, the inner wall of the water channel 200 is provided with a composite plating layer of copper and graphene. The thickness of the composite plating layer is 50 μm, which is prepared by a chemical vapor deposition process. The content of graphene is 5%-8%. The thermal conductivity is improved, and a dense oxide layer is formed on the surface of the plating layer, so that the corrosion resistance of the cooling liquid is improved. Moreover, the main body of the shell 100 is made of aluminum alloy structure, which improves the heat conduction efficiency, corrosion resistance and lightweight performance of the device. The composite plating layer of copper and graphene on the inner wall of the water channel 200 is further provided with a micro-nano level bump array. The height of the bumps of the bump array is 50 μm-100 μm, the diameter is 100 μm-150 μm, and the distance between adjacent bumps is 200 μm-300 μm. The bump array increases the contact area between the composite plating layer and the cooling liquid, so that the heat absorbed by the composite plating layer can be quickly transferred to the cooling liquid, avoiding the waste of heat conduction performance caused by the heat not being able to be discharged in time.

[0047] In some specific embodiments of the present application, a mounting groove for fixing the IGBT chip is formed on the upper surface of the shell 100; a detachable heat-conducting gasket set is arranged in the mounting groove, and the gasket set comprises a plurality of layers of copper foil layers, flexible graphite layers and silica gel heat-conducting pads, and a positioning buckle is arranged around the gasket set, which is matched with the clamping groove on the edge of the groove of the shell 100.

[0048] In the present embodiment, the upper surface of the shell 100 is provided with a mounting groove, and the electronic components are fixed in the mounting groove by screwing. At least one electronic component is fixed in the mounting groove. A detachable heat-conducting gasket set is arranged in the mounting groove, and the gasket set is composed of three layers of thin sheets made of different materials and thicknesses. The top layer is a 0.2mm-thick copper foil, which is used to ensure high heat conduction. The middle layer is a 0.5mm-thick flexible graphite, which is used to compensate for the installation gap. The bottom layer is a 0.3mm-thick silica gel heat-conducting pad, which is used for insulation and shock absorption. Positioning buckles are arranged around the gasket set, which are matched with the clamping grooves on the edges of the grooves of the shell 100. Through the combination of the multi-layer buckled detachable heat-conducting gasket set, the adaptation of multiple models of IGBT chips and the compensation of installation gaps are realized. Through the detachable gasket set, multiple IGBT chip packaging models are adapted without the need to replace the shell 100, thereby reducing the user's use cost.

[0049] Embodiment 2 The difference between the present embodiment and Embodiment 1 is that, as shown in Figures 4 to 6 The flow disturbance assembly 300 is a plurality of spoiler plates 302, which include a first side surface 3021 and a second side surface 3022 intersecting at the edges. The first side surface 3021 is a surface with a first curvature, and the second side surface 3022 is a surface with a second curvature. The first curvature is smaller than the second curvature and is curved in the same direction. The convex side of the first side surface 3021 faces the inlet 101, and the concave side of the second side surface 3022 faces the outlet 102.

[0050] Specifically, a plurality of groups of flow disturbance assemblies 300 are arranged staggered along the water channel 200, as shown in Figures 4 to 6As shown, the spoiler 302 comprises a first side 3021 and a second side 3022, the first side 3021 is a surface with a first curvature, and the second side 3022 is a surface with a second curvature, both of which have obvious convex curves and curvature changes. The first curvature is smaller than the second curvature and is curved in the same direction, that is, the first side 3021 wraps the second side 3022 inside, and the edges of the first side 3021 and the second side 3022 overlap together to form a shell-like structure. The convex side of the first side 3021 faces the flow inlet 101, that is, the flow of the cooling liquid, and the concave side of the second side 3022 faces the flow outlet 102; when the cooling liquid flows through the first side 3021 of the spoiler 302, the cooling liquid that is close to the convex side of the first side 3021 will separate due to the extrusion and deflection of the curved surface, and the separated cooling liquid flow forms a low pressure area on the convex side of the first side 3021, which drives the surrounding fluid to rotate, thereby generating a vortex, similar to the wake vortex when water flows around a tall rock. Moreover, the second side 3022 of the spoiler 302 will form a stable vortex on the concave side of the second side 3022 through the "fluid trapping" effect, and the vortex formed on the convex side of the first side 3021 and the vortex formed on the concave side of the second side 3022 will form a composite vortex system.

[0051] Because the cooling liquid flow in the shell 100 is not ideal and uniform, there is a certain flow velocity gradient and flow direction deviation. When this non-uniform cooling liquid flow impacts or flows around the first side 3021 of the spoiler 302, the kinetic energy will be converted into rotational kinetic energy under the guidance of the curved surface, further promoting the generation and maintenance of the vortex.

[0052] At the same time, after a plurality of spoilers 302 are arranged in the water channel 200 of the shell 100, the vortex generated by the upstream spoiler 302 will become a "flow disturbance source" for the downstream spoiler 302. The interaction between the wake flow and the curved surface of the downstream spoiler 302 will intensify the rotational motion of the water flow, forming a more complex vortex group, such as an alternating shedding Karman vortex street.

[0053] The spoiler 302 combined with two curved surfaces of different curvatures can generate a composite vortex to strengthen heat transfer, break the thermal boundary layer, reduce the dead angle of heat transfer, and improve the heat transfer efficiency.

[0054] In some specific embodiments of the present application, a plurality of spoilers 302 with decreasing side areas in the direction from the flow inlet 101 to the flow outlet 102 are arranged in the water channel 200 to form a spoiler component, and a plurality of spoiler components are arranged in the water channel 200.

[0055] Specifically, each spoiler member includes three layers of spoiler plates 302 arranged in sequence along the direction of the cooling liquid flow, the area of each layer of spoiler plates 302 in each spoiler member decreases in sequence along the direction of the water flow, forming a stepped flow field disturbance structure, which is respectively the largest area spoiler plate 302, the intermediate area spoiler plate 302 and the smallest area spoiler plate 302. The largest area spoiler plate 302 first performs preliminary disturbance on the water flow, the intermediate area spoiler plate 302 further refines the vortex wake of the previous layer, and the smallest area spoiler plate 302 further refines the vortex wake of the previous layer, avoiding the problem of vortex extrusion and flow field disorder caused by consistent area of multi-layer structure. Through multi-layer composite vortex heat transfer enhancement, the thermal boundary layer is broken, the heat exchange dead angle is reduced, and the flow channel resistance distribution is optimized through the stepped area, balancing the heat dissipation efficiency and water flow energy consumption, improving the overall heat exchange stability and energy utilization efficiency of the liquid cooling heat dissipation device.

[0056] Further, when the flow inlet 101 and the flow outlet 102 are arranged on the same side of the shell 100, a partition plate 303 is arranged between the flow inlet 101 and the flow outlet 102, and the water channel 200 is divided into two incomplete closed parts.

[0057] Specifically, referring to Figure 4 As shown, the partition plate 303 is transversely placed between the flow inlet 101 and the flow outlet 102, and the cooling liquid flow direction in the water channel 200 is divided into two opposite directions. The placement direction of the several spoiler plate members in the divided part at the flow inlet 101 is that the outer convex side of the first side 3021 faces the flow inlet 101; the placement direction of the several spoiler plate members in the divided part at the flow outlet 102 is that the inner concave side of the second side 3022 faces the flow outlet 102, both of which are placed along the direction of the cooling liquid flow. Through the bidirectional water channel, the cooling liquid uniformly covers the entire cross section of the water channel 200, and cooperates with the vortex generated by the directional spoiler plates 302 on both sides to completely break the dead water area of the traditional unidirectional water channel. There is no local area with too low flow rate in the water channel 200, further avoiding the uneven problem of overheating in some areas and excessive heat dissipation in some areas, reducing the temperature difference of each part of the radiator, and improving the heat dissipation stability of the device.

[0058] The above content is only a modification or supplement to the structure of the present application or an alternative using a similar way, as long as it does not deviate from the structure of the invention or exceed the scope defined by the present claims, it shall belong to the protection scope of the present application.

Claims

1. A liquid cooling heat sink, comprising: The application relates to a cooling device for electronic equipment, which comprises the following parts: a shell (100), the side of the shell (100) is provided with an inlet (101) and an outlet (102) of cooling liquid, and the outer lower surface of the shell (100) is provided with fin-shaped protrusions (104); a water channel (200) arranged in the shell (100) and communicating with the inlet (101) and the outlet (102) respectively; a plurality of turbulence components (300) arranged in the water channel (200) at intervals.

2. The liquid cooling heat dissipation device according to claim 1, characterized in that, The turbulence components (300) are arranged in the water channel (200) along a first direction and a second direction, and the first direction and the second direction are intersecting directions.

3. The liquid cooling heat dissipation device according to claim 2, characterized in that, The turbulence component (300) comprises a plurality of groups of turbulence columns (301), and there is an interval between two adjacent turbulence columns (301).

4. The liquid cooling heat dissipation device according to claim 2, characterized in that, The turbulence component (300) is a plurality of turbulence plates (302), the turbulence plate (302) comprises a first side (3021) and a second side (3022) with intersecting edges, the first side (3021) is a surface with a first curvature, the second side (3022) is a surface with a second curvature, the first curvature is smaller than the second curvature and is a same-direction bending, the outer convex side of the first side (3021) faces the inlet (101), and the inner concave side of the second side (3022) faces the outlet (102).

5. The liquid cooling heat dissipation device according to claim 4, characterized in that, A plurality of turbulence plate (302) components are arranged in the water channel (200) along the direction from the inlet (101) to the outlet (102) in sequence, and the side area of the turbulence plate (302) is sequentially decreased.

6. The liquid cooling heat dissipation device according to claim 3 or 5, characterized in that, The inlet (101) and the outlet (102) are arranged on the two symmetrical sides of the shell (100) respectively, or the inlet (101) and the outlet (102) are arranged on the same side of the shell (100), and a quick connector (103) is arranged at the inlet (101) and the outlet (102), and the quick connector (103) is welded and fixed with the shell (100).

7. The liquid cooling heat dissipation device according to claim 6, characterized in that, When the inlet (101) and the outlet (102) are arranged on the same symmetrical side of the shell (100), a partition plate (303) is arranged between the inlet (101) and the outlet (102), and the water channel (200) is divided into two incomplete closed parts.

8. The liquid cooling heat dissipation device according to claim 7, characterized in that, A movable spiral flow guide rib is arranged at the turning part and the end of the water channel (200), the spiral angle of the flow guide rib along the water flow direction is 30-45 degrees, and the flow guide rib is used for guiding the cooling liquid in the water channel (200) to flow along a spiral track.

9. The liquid cooling heat dissipation device of claim 1, wherein, The water channel (200) comprises a core heating area channel and an edge auxiliary area channel, the core heating area channel is located in the middle of the edge auxiliary area channel, and the core heating area channel and the edge auxiliary area channel are connected through a gradual transition channel.

10. The liquid cooling heat dissipation device of claim 1, wherein, The inner wall of the water channel (200) is provided with a composite plating layer of copper and graphene, and the composite plating layer of copper and graphene on the inner wall of the water channel (200) is further provided with a micro-nano level bump array.

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