Semiconductor refrigerating and cooling helmet

Abstract

The invention belongs to the technical field of helmets, and particularly relates to a semiconductor refrigeration cooling helmet. Comprising a refrigeration device and a helmet, the refrigeration device is fixedly installed on the helmet, the refrigeration device comprises a TEC refrigeration sheet, a first cooling fin, a second cooling fin, a first cooling fan, a second cooling fan, a battery and a control circuit board, the first cooling fin is arranged towards the outside of the helmet, and the second cooling fin is arranged towards the inside of the helmet. The TEC cooling fin is arranged between the first cooling fin and the second cooling fin, the control circuit board is electrically connected with the battery, the control circuit board is electrically connected with the TEC cooling fin, the first cooling fan is arranged on the upper portion of the first cooling fin and communicated with the first cooling fin, and the second cooling fan is arranged on the lower portion of the second cooling fin. The second cooling fan is communicated with the second cooling fins, a plurality of flow guide grooves are formed in the helmet, and the flow guide grooves are communicated with the second cooling fins. The air conditioner is compact in structure, high in function integration degree, low in cost and high in refrigeration efficiency.

Description

Technical Field

[0001] This invention belongs to the field of helmet technology, and specifically relates to a semiconductor cooling helmet. Background Technology

[0002] Existing helmet cooling technologies include three types: passive cold storage cooling, active air cooling, and active cooling. Passive cold storage cooling technology mainly utilizes the phase change of materials to absorb heat and cool down. However, the cooling effect gradually decreases to zero over time, at which point the material is depleted. If it cannot be fully utilized, it needs to be replaced frequently, and the cooling capacity cannot be dynamically adjusted.

[0003] Active air cooling typically uses a multi-fan array to blow outside air into the helmet, promoting airflow, but the cooling effect is not significant. The temperature reduction mainly comes from the fans increasing the airflow near sweat, leading to evaporation and heat absorption. When used in hot weather, this design fails to provide effective cooling because hot air is blown into the helmet, and the multi-fan array is noisy.

[0004] Active cooling uses semiconductor cooling chips for cooling, but conventional designs suffer from low cooling efficiency due to interference between hot and cold air ducts, as well as complex heat conduction structures and high manufacturing costs. Summary of the Invention

[0005] (a) Technical problems to be solved

[0006] To address the aforementioned problems in the prior art, this invention provides a semiconductor cooling helmet with high cooling efficiency and low cost.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, the main technical solution adopted by the present invention includes: a semiconductor cooling helmet, comprising a cooling device and a helmet, wherein the cooling device is fixedly installed on the helmet, the cooling device comprising a TEC cooling plate, a first heat sink, a second heat sink, a first cooling fan, a second cooling fan, a battery, and a control circuit board, wherein the first heat sink is disposed facing the outside of the helmet, the second heat sink is disposed facing the inside of the helmet, the TEC cooling plate is disposed between the first heat sink and the second heat sink, the control circuit board is electrically connected to the battery, the control circuit board is electrically connected to the TEC cooling plate, the control circuit board is electrically connected to the first cooling fan, and the control circuit board is electrically connected to the second cooling fan, the first cooling fan is disposed on the upper part of the first heat sink and communicates with the first heat sink, the second cooling fan is disposed on the lower part of the second heat sink and communicates with the second heat sink, and the helmet is provided with a plurality of airflow channels, the airflow channels communicating with the second heat sink.

[0009] Furthermore, the cooling device is installed at the rear of the helmet, the rear end of the airflow channel is connected to the second heat sink, and the airflow channel extends along the inner wall of the helmet from the rear of the helmet to the front of the helmet.

[0010] Furthermore, the cooling device includes a temperature sensor, which is electrically connected to the control circuit board and is located at the bottom of the first heat sink.

[0011] Furthermore, a baffle is provided between the second cooling fan and the first heat sink. The baffle is made of heat-insulating material and is set at a predetermined angle to the TEC cooling chip.

[0012] (III) Beneficial Effects

[0013] The beneficial effects of this invention are as follows: First, the invention has a compact structure and high functional integration. The cooling module is rigidly connected to the helmet shell and integrated with the embedded airflow channel, making full use of the helmet's internal space. It organically integrates the cooling source, airflow channel, and air outlet, eliminating the need for bulky external pipes or devices, achieving a high degree of system integration and effectively reducing manufacturing costs. This also allows the final product to maintain the helmet's original appearance and wearing comfort while adding an active cooling function, making it highly practical. Second, the cool air inside the helmet is precisely guided by the airflow channel. This directional airflow method conforms to the human body's thermal perception principles, enabling rapid and targeted cooling of the main heat-generating areas of the head, resulting in high cooling efficiency and a cool user experience. Attached Figure Description

[0014] Figure 1This is a schematic diagram of the cooling device of the semiconductor cooling helmet of the present invention;

[0015] Figure 2 This is a cross-sectional view of the airflow channel of the semiconductor cooling helmet of the present invention;

[0016] Figure 3 This is a cross-sectional view of the helmet of the semiconductor cooling helmet of the present invention.

[0017] [Explanation of Labels in the Attached Image]

[0018] 1. TEC cooling chip; 2. First heat sink; 3. First cooling fan; 4. Second heat sink; 5. Second cooling fan; 6. Temperature sensor; 7. Helmet; 71. Airflow channel; 8. Baffle. Detailed Implementation

[0019] To better explain and facilitate understanding of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0020] Please refer to Figure 1-3 A semiconductor cooling helmet 7 includes a cooling device and a helmet 7. The cooling device is fixedly installed on the helmet 7. The cooling device includes a TEC cooling plate 1, a first heat sink 2, a second heat sink 4, a first cooling fan 3, a second cooling fan 5, a battery, and a control circuit board. The first heat sink 2 is disposed facing the outside of the helmet 7, and the second heat sink 4 is disposed facing the inside of the helmet 7. The TEC cooling plate 1 is disposed between the first heat sink 2 and the second heat sink 4. The control circuit board is electrically connected to the battery, the TEC cooling plate 1, the first cooling fan 3, and the second cooling fan 5. The first cooling fan 3 is disposed on the upper part of the first heat sink 2 and is connected to the first heat sink 2. The second cooling fan 5 is disposed on the lower part of the second heat sink 4 and is connected to the second heat sink 4. The helmet 7 has a plurality of airflow channels 71 inside, and the airflow channels 71 are connected to the second heat sink 4. After the TEC cooling plate 1 is connected to the battery, it can achieve simultaneous cooling and heating. The first heat sink 2 and the first cooling fan 3 are located on the hot side of the TEC cooling plate 1, used to conduct heat to the outside of the helmet 7. The connection between the first cooling fan 3 and the first heat sink 2 means that air convection can be achieved between them. The operation of the first cooling fan 3 can drive airflow towards the first heat sink 2. The second heat sink 4 and the second cooling fan 5 are located on the cold side of the TEC cooling plate 1, used to conduct cold air into the inside of the helmet 7. The connection between the second heat sink 4 and the second cooling fan 5 means that air convection can be achieved between them. The operation of the second cooling fan 5 can drive airflow towards the second heat sink 4. The airflow channel 71 is integrally formed with the helmet 7, resulting in low manufacturing cost. In actual production, the helmet 7 has mounting holes, and the cooling device is installed in the mounting holes of the helmet 7 through an embedded (interference fit), resulting in a compact structure.

[0021] The beneficial effects of this invention are as follows: First, the invention has a compact structure and high functional integration. The cooling module is rigidly connected to the helmet shell 7 and integrated with the embedded airflow channel 71, making full use of the helmet's internal space. It organically integrates the cooling source, airflow channel 71, and air outlet, eliminating the need for bulky external pipes or devices, achieving a high degree of system integration and effectively reducing manufacturing costs. This also allows the final product to maintain the original appearance and wearing comfort of the helmet 7 while adding an active cooling function, making it highly practical. Second, the cool air inside the helmet 7 is precisely guided by the airflow channel 71. This directional airflow method conforms to the human body's thermal perception principles, enabling rapid and targeted cooling of the main heat-generating areas of the head, resulting in high cooling efficiency and a cool user experience.

[0022] In this embodiment, the cooling device is installed at the rear of the helmet 7. The rear end of the airflow channel 71 is connected to the second heat sink 4, and the airflow channel 71 extends along the inner wall of the helmet 7 from the rear to the front. This arrangement allows cold air to flow from the rear to the front of the helmet 7, resulting in good cooling performance. The cooling device is located at the lower rear of the helmet 7, maximizing the length of the airflow channel 71 and ensuring sufficient airflow within the helmet 7 for effective cooling. However, in practical applications, the cooling device can also be located at the upper rear of the helmet 7, and is not limited to this location.

[0023] In this embodiment, the cooling device includes a temperature sensor 6, which is electrically connected to the control circuit board and is located at the bottom of the first heat sink 2. The temperature sensor 6 monitors the temperature of the TEC cooling chip 1. If the temperature is too high (exceeding 45°C), the operating circuit of the TEC cooling chip 1 will be disconnected, while other circuits continue to operate normally. The first cooling fan 3 can continue to run for heat dissipation, providing a safety protection function. Of course, in practical applications, the temperature sensor 6 can also be replaced by a temperature control switch, which is connected in series with the positive or negative terminal of the TEC cooling chip 1. The temperature sensor 6 can also be installed on the side or top of the first heat sink 2, and is not limited to these locations.

[0024] In this embodiment, a baffle 8 is provided between the second cooling fan 5 and the first heat sink 2. The baffle 8 is made of heat-insulating material and is set at a predetermined angle to the TEC cooling plate 1. Installing the baffle 8 avoids the problem of severely reduced cooling efficiency caused by crosstalk between hot and cold air ducts in traditional designs, ensuring maximum cooling efficiency. The heat-insulating material further isolates hot and cold air, improving cooling efficiency. The heat-insulating material is ABS, and the baffle 8 is set at a 90° angle to the TEC cooling plate 1. However, in practical applications, the heat-insulating material can also be polyurethane foam, vacuum board, PP, etc., and the baffle 8 can be set at a 60° or 80° angle to the TEC cooling plate 1; it is not limited to these methods.

[0025] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent modifications made based on the content of the present invention specification and drawings, or direct or indirect applications in related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A semiconductor cooling helmet, characterized in that, The device includes a cooling unit and a helmet. The cooling unit is fixedly mounted on the helmet and includes a TEC cooling plate, a first heat sink, a second heat sink, a first cooling fan, a second cooling fan, a battery, and a control circuit board. The first heat sink faces outwards from the helmet, and the second heat sink faces inwards from the helmet. The TEC cooling plate is positioned between the first and second heat sinks. The control circuit board is electrically connected to the battery, the TEC cooling plate, the first cooling fan, and the second cooling fan. The first cooling fan is positioned above and communicates with the first heat sink. The second cooling fan is positioned below and communicates with the second heat sink. The helmet contains multiple airflow channels that communicate with the second heat sink.

2. The semiconductor cooling helmet according to claim 1, characterized in that, The cooling device is installed at the rear of the helmet, the rear end of the airflow channel is connected to the second heat sink, and the airflow channel extends along the inner wall of the helmet from the rear of the helmet to the front of the helmet.

3. The semiconductor cooling helmet according to claim 1, characterized in that, The cooling device includes a temperature sensor, which is electrically connected to the control circuit board and is located at the bottom of the first heat sink.

4. The semiconductor cooling helmet according to claim 1, characterized in that, A baffle is provided between the second cooling fan and the first heat sink. The baffle is made of heat-insulating material and is set at a predetermined angle to the TEC cooling chip.

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