Electromechanical pin welding device

Abstract

The invention provides an electromechanical pin welding device and belongs to the technical field of electromechanical pin welding, the electromechanical pin welding device comprises two sets of side supporting plates, an upper sealing assembly, conveying assemblies, a driving assembly, a lower sealing assembly and a solder paste injection assembly, the two sets of side supporting plates are oppositely distributed, the conveying assemblies are arranged on the upper sides and the lower sides of the two sets of side supporting plates, and the driving assembly is arranged on the upper sealing assembly. And the upper sealing assembly is arranged above the two sets of side supporting plates, and the lower sealing assembly is arranged below the two sets of side supporting plates. Compared with the prior art, through the arrangement of the upper sealing assembly, the lower sealing assembly and the solder paste injection assembly, the solder paste can be accurately filled into the welding hole in the circuit board, on one hand, the amount of the solder paste needed by welding is guaranteed, and the welding quality between an electronic component and the circuit board is improved; on the other hand, solder paste is prevented from staining the surface of the circuit board, and short circuit of the circuit board caused by solder paste slag is prevented.

Description

Technical Field

[0001] This invention belongs to the field of electromechanical pin welding technology, specifically an electromechanical pin welding device. Background Technology

[0002] Currently, when electronic components of electromechanical equipment are soldered to circuit boards, solder paste needs to be applied to the soldering holes on the circuit board. Then, the leads of the electronic components are inserted into the soldering holes. Subsequently, the circuit board is heated, and the solvent and some additives in the solder paste located in the soldering holes evaporate at the soldering temperature, thereby soldering the leads of the electronic components into the soldering holes on the circuit board.

[0003] In the prior art, when solder paste is applied to the solder holes on the circuit board, on the one hand, the solder paste is easy to stick to the surface of the circuit board. After the electronic component leads are subsequently soldered to the circuit board, solder paste residue is easily formed on the surface of the circuit board, which can easily lead to short circuits. On the other hand, during the solder paste application process, it is difficult to guarantee the amount of solder paste entering the solder holes, resulting in insufficient soldering stability between the electronic component leads and the circuit board, which in turn affects the soldering quality. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the technical problem to be solved by the embodiments of the present invention is to provide an electromechanical pin welding device.

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution:

[0006] An electromechanical pin soldering device includes a side support plate, an upper sealing assembly, a conveying assembly, a driving assembly, a lower sealing assembly, and a solder paste injection assembly.

[0007] The side support plates are provided in two sets, and the two sets of side support plates are distributed opposite to each other.

[0008] The conveying assembly is installed on the upper and lower sides of the two sets of side support plates and is used to convey the circuit board.

[0009] The upper sealing assembly is disposed above the two sets of side support plates, and the lower sealing assembly is disposed below the two sets of side support plates.

[0010] The drive assembly is mounted on the edge of the side support plate and is used to drive the upper sealing assembly and the lower sealing assembly to move up and down.

[0011] When the upper sealing component moves downward, it acts on the upper surface of the circuit board to seal the upper end of the solder holes on the circuit board.

[0012] When the lower sealing assembly moves upward, it acts on the lower surface of the circuit board to seal the lower end of the solder holes on the circuit board.

[0013] The solder paste injection assembly is located below the two sets of side support plates. After the upper and lower ends of the solder holes on the circuit board are sealed, the solder paste injection assembly is used to inject solder paste into the solder holes.

[0014] As a further improvement of the present invention: a second support plate is fixedly provided on the outer wall of the side support plate.

[0015] The conveying assembly includes two sets of rotating shafts, two sets of semi-circular conveying blocks, and two sets of motors.

[0016] The two sets of motors are fixedly installed on the side wall of the second support plate, the two sets of rotating shafts are respectively installed at the output ends of the two sets of motors, the two sets of semi-circular conveying pipe blocks are respectively fixedly installed outside the two sets of rotating shafts, and the two sets of semi-circular conveying blocks are distributed vertically relative to each other between the two sets of side support plates.

[0017] As a further improvement of the present invention: the upper sealing assembly includes an upper pressure cylinder, an upper pressure rod, a second elastic element, an upper support plate, and an upper sealing block.

[0018] The upper sealing block is fixedly installed at the bottom of the upper pressure cylinder. The lower end of the upper pressure rod extends from the top of the upper pressure cylinder into the interior of the upper pressure cylinder and is telescopically engaged with the upper pressure cylinder. The upper end extends to the top of the upper pressure cylinder and is fixedly connected to the upper support plate. One end of the second elastic element is connected to the bottom of the upper support plate, and the other end is connected to the upper end of the upper pressure cylinder, which is used to provide elastic support for the upper pressure cylinder.

[0019] As a further improvement of the present invention: the lower sealing assembly includes a lower sealing block, and the lower sealing block has an injection hole.

[0020] The solder paste injection assembly includes a lower pressure cylinder, a lower pressure rod, and a lower support plate.

[0021] The upper sealing block is fixedly installed on the upper end of the lower pressure cylinder. The injection hole communicates with the inner cavity of the lower pressure cylinder. Solder paste is stored inside the lower pressure cylinder. The upper end of the lower pressure rod extends from the bottom of the lower pressure cylinder into the lower pressure cylinder and is telescopically engaged with the lower pressure cylinder. The lower end extends to the bottom of the lower pressure cylinder and is fixedly connected to the lower support plate.

[0022] As a further improvement of the present invention: the driving assembly includes a first incomplete gear, a first rack and pinion, a second incomplete gear, and a second rack and pinion.

[0023] The first incomplete gear is fixedly mounted on one of the sets of rotating shafts, and the second incomplete gear is fixedly mounted on another set of rotating shafts. One end of the first rack is fixedly connected to the upper support plate, and the other end extends to one side of the first incomplete gear and can mesh with the first incomplete gear. One end of the second rack is fixedly connected to the lower support plate, and the other end extends to one side of the second incomplete gear and can mesh with the second incomplete gear.

[0024] As a further improvement of the present invention: a first support plate is fixedly provided on the upper part of the side support plate, a first guide rod is vertically passed through the upper support plate, the first guide rod is fixedly provided on the inner top wall of the first support plate, and a first elastic element is provided on the first support plate for providing elastic support to the upper support plate.

[0025] As a further improvement of the present invention: a third support plate is fixedly provided at the bottom of the side support plate, a second guide rod is vertically passed through the lower support plate, the second guide rod is fixedly provided at the bottom of the third support plate, and a third elastic element is provided on the third support plate for providing elastic support to the lower support plate.

[0026] As a further improvement of the present invention: a solder paste storage box is also provided below the two sets of side support plates, a limiting ring is provided on the outer ring of the lower pressure cylinder, the limiting block is fixedly installed on the inner wall of the side support plate by a support rod, a solder paste delivery hose is provided on the side wall of the lower pressure cylinder, the end of the solder paste delivery hose away from the lower pressure cylinder is connected to the solder paste storage box, and a one-way valve is provided inside the solder paste delivery hose and the lower pressure cylinder.

[0027] As a further improvement of the present invention: a plurality of support rollers are rotatably installed between the two sets of side support plates, and the plurality of support rollers are distributed at horizontal intervals.

[0028] As a further improvement of the present invention: the first elastic element, the second elastic element and the third elastic element are springs or metal sheets.

[0029] Compared with the prior art, the beneficial effects of the present invention are:

[0030] In this embodiment of the invention, when soldering electronic component pins to a circuit board, the circuit board can be placed between two sets of side support plates. The circuit board is then transported by a conveying assembly. When the soldering holes on the circuit board move between the upper and lower sealing assemblies, a driving assembly moves the upper sealing assembly downwards and the lower sealing assembly upwards. When the upper sealing assembly moves downwards, it acts on the upper surface of the circuit board, sealing the upper end of the soldering holes. When the lower sealing assembly moves upwards, it acts on the lower surface of the circuit board, sealing the lower end of the soldering holes. Then, an injection assembly injects solder paste into the sealed soldering holes. The conveying assembly then continues to transport the circuit board, which moves further between the two sets of side support plates to the next stage. In the electronic component insertion station (not shown in the figure), a robotic arm inserts the pins of the electronic components into the soldering holes. Then, a heating mechanism (not shown in the figure) heats the circuit board, melting the solder paste inside the soldering holes. After the alloy components in the solder paste cool and solidify, solder joints are formed between the pins of the electronic components and the circuit board, thus completing the soldering between the electronic components and the circuit board. Compared with existing technologies, the upper sealing component, lower sealing component, and solder paste injection component can accurately fill the soldering holes on the circuit board. This ensures the amount of solder paste required for soldering, thereby improving the soldering quality between the electronic components and the circuit board. On the other hand, it avoids solder paste contamination on the circuit board surface, preventing solder paste residue from causing short circuits on the circuit board. Attached Figure Description

[0031] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0032] Figure 1 A schematic diagram of the structure of an electromechanical pin soldering device. Figure 1 ;

[0033] Figure 2 A schematic diagram of the structure of an electromechanical pin soldering device. Figure 2 ;

[0034] Figure 3 A schematic diagram of the structure of an electromechanical pin soldering device. Figure 3 ;

[0035] Figure 4 for Figure 1 Enlarged view of region A in the middle;

[0036] Figure 5 for Figure 2Enlarged view of region B in the middle;

[0037] Figure 6 for Figure 2 Enlarged diagram of region C in the middle;

[0038] Figure 7 for Figure 2 Enlarged schematic diagram of region D in the middle;

[0039] In the diagram: 10-Side support plate, 101-First support plate, 102-Second support plate, 103-Support roller, 104-Limiting ring, 105-Third support plate, 20-Solder paste storage box, 30-Circuit board, 301-Soldering hole, 40-Upper sealing assembly, 401-Upper pressure cylinder, 402-First elastic element, 403-Upper pressure rod, 404-Second elastic element, 405-Upper support plate, 406-First guide rod, 407-Upper sealing block, 50-Conveying assembly, 501 - Rotating shaft, 502 - Semi-circular conveying block, 503 - Motor, 60 - Drive assembly, 601 - First incomplete gear, 602 - First rack rod, 603 - Second incomplete gear, 604 - Second rack rod, 70 - Lower sealing assembly, 701 - Lower sealing block, 702 - Injection hole, 80 - Solder paste injection assembly, 801 - Lower pressure cylinder, 802 - Lower pressure rod, 803 - Lower support plate, 804 - Solder paste delivery hose, 805 - Second guide rod, 806 - Third elastic element. Detailed Implementation

[0040] The technical solution of the present invention will be further described in detail below with reference to specific embodiments.

[0041] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0042] In the description of this invention, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0043] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection or setting, a detachable connection or setting, or an integral connection or setting. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0044] Please see Figure 1 , Figure 2 as well as Figure 3 This embodiment provides an electromechanical pin soldering device, including a side support plate 10, an upper sealing assembly 40, a conveying assembly 50, a driving assembly 60, a lower sealing assembly 70, and a solder paste injection assembly 80. Two sets of side support plates 10 are provided, with the two sets of side support plates 10 distributed opposite to each other. The conveying assembly 50 is disposed on the upper and lower sides of the two sets of side support plates 10 for conveying a circuit board 30. The upper sealing assembly 40 is disposed above the two sets of side support plates 10, and the lower sealing assembly 70 is disposed below the two sets of side support plates 10. The driving assembly 60 is mounted on the side of the side support plate 10. The upper sealing assembly 40 and the lower sealing assembly 70 are used to move the upper sealing assembly 40 and the lower sealing assembly 70 up and down. When the upper sealing assembly 40 moves down, it acts on the upper surface of the circuit board 30 to seal the upper end of the solder hole 301 on the circuit board 30. When the lower sealing assembly 70 moves up, it acts on the lower surface of the circuit board 30 to seal the lower end of the solder hole 301 on the circuit board 30. The solder paste injection assembly 80 is located below the two sets of side support plates 10. After the upper and lower ends of the solder hole 301 on the circuit board 30 are sealed, the solder paste injection assembly 80 is used to inject solder paste into the solder hole 301.

[0045] When soldering electronic component pins to circuit board 30, circuit board 30 can be placed between two sets of side support plates 10, and then conveyed by conveying assembly 50. When the soldering hole 301 on circuit board 30 moves between upper sealing assembly 40 and lower sealing assembly 70, drive assembly 60 drives upper sealing assembly 40 to move downward and lower sealing assembly 70 to move upward. When upper sealing assembly 40 moves downward, it acts on the upper surface of circuit board 30, thereby sealing the upper end of soldering hole 301 on circuit board 30. When lower sealing assembly 70 moves upward, it acts on the lower surface of circuit board 30, thereby sealing the lower end of soldering hole 301 on circuit board 30. After sealing, the injection component 80 injects solder paste into the sealed solder hole 301. Then, the conveying component 50 continues to convey the circuit board 30. The circuit board 30 moves further between the two sets of side support plates 10 to the subsequent electronic component insertion station (not shown in the figure). At this time, the robot arm inserts the pins of the electronic components into the solder hole 301. Then, the heating mechanism (not shown in the figure) heats the circuit board 30, causing the solder paste inside the solder hole 301 to melt. After the alloy components in the solder paste cool and solidify, solder joints are formed between the pins of the electronic components and the circuit board 30, thereby completing the soldering between the electronic components and the circuit board 30.

[0046] Please see Figure 1 , Figure 2 as well as Figure 3 In one embodiment, a second support plate 102 is fixedly disposed on the outer wall of the side support plate 10. The conveying assembly 50 includes two sets of rotating shafts 501, two sets of semi-circular conveying blocks 502, and two sets of motors 503. The two sets of motors 503 are fixedly installed on the side wall of the second support plate 102. The two sets of rotating shafts 501 are respectively installed at the output ends of the two sets of motors 503. The two sets of semi-circular conveying blocks 502 are respectively fixedly disposed outside the two sets of rotating shafts 501. The two sets of semi-circular conveying blocks 502 are distributed vertically relative to each other between the two sets of side support plates 10.

[0047] By placing the circuit board 30 between two sets of semi-circular conveyor blocks 502, and then driving two sets of rotating shafts 501 to rotate relative to each other by two sets of motors 503, the two sets of semi-circular conveyor blocks 502 are driven to rotate relative to each other. When the two sets of semi-circular conveyor blocks 502 rotate relative to each other, they act on the upper and lower sidewalls of the circuit board 30 respectively. Then, by means of the friction between the two sets of semi-circular conveyor blocks 502 and the circuit board 30, the circuit board 30 is moved, thus realizing the conveying of the circuit board 30. When the two sets of semi-circular conveyor blocks 502 are separated from the circuit board 30, the welding holes 301 on the circuit board 30 move between the upper sealing component 40 and the lower sealing component 70.

[0048] Please see Figure 1 as well as Figure 4In one embodiment, the upper sealing assembly 40 includes an upper pressure cylinder 401, an upper pressure rod 403, a second elastic element 404, an upper support plate 405, and an upper sealing block 407. The upper sealing block 407 is fixedly disposed at the bottom of the upper pressure cylinder 401. The lower end of the upper pressure rod 403 extends from the top of the upper pressure cylinder 401 into the interior of the upper pressure cylinder 401 and telescopically engages with the upper pressure cylinder 401. The upper end extends above the upper pressure cylinder 401 and is fixedly connected to the upper support plate 405. One end of the second elastic element 404 is connected to the bottom of the upper support plate 405, and the other end is connected to the upper end of the upper pressure cylinder 401, for providing elastic support to the upper pressure cylinder 401.

[0049] When the welding hole 301 on the circuit board 30 moves between the upper sealing assembly 40 and the lower sealing assembly 70, the welding hole 301 is located directly below the upper sealing block 407. At this time, the drive assembly 60 drives the upper support plate 405 to move downward. The upper support plate 405 drives the second elastic element 404, the upper pressure rod 403, the upper pressure cylinder 401, and the upper sealing block 407 to move downward synchronously. When the upper sealing block 407 acts on the upper surface of the circuit board 30, the upper sealing block 407 seals the upper end of the welding hole 301. After the upper sealing block 407 acts on the upper surface of the circuit board 30, the drive assembly 60 continues to drive the upper support plate 405 to move downward. The upper pressure rod 403 moves into the upper pressure cylinder 401, and the second elastic element 404 is compressed to press the upper pressure cylinder 401 and the upper sealing block 407 to the upper surface of the circuit board 30, thereby improving the sealing effect of the upper end of the welding hole 301.

[0050] Please see Figure 2 , Figure 4 as well as Figure 6 In one embodiment, the lower sealing assembly 70 includes a lower sealing block 701, the lower sealing block 701 having an injection hole 702, and the solder paste injection assembly 80 includes a lower pressure cylinder 801, a lower pressure rod 802, and a lower support plate 803. The upper sealing block 701 is fixedly disposed on the upper end of the lower pressure cylinder 801, the injection hole 702 communicates with the inner cavity of the lower pressure cylinder 801, the lower pressure cylinder 801 contains solder paste, the upper end of the lower pressure rod 802 extends from the bottom of the lower pressure cylinder 801 into the interior of the lower pressure cylinder 801 and telescopically engages with the lower pressure cylinder 801, and the lower end extends below the lower pressure cylinder 801 and is fixedly connected to the lower support plate 803.

[0051] When the drive assembly 60 moves the upper support plate 405, the second elastic element 404, the upper pressure rod 403, the upper pressure cylinder 401, and the upper sealing block 407 downward, the drive assembly 60 moves the lower support plate 803 upward simultaneously. The lower support plate 803 moves the lower pressure rod 802, the lower pressure cylinder 801, and the lower sealing block 701 upward simultaneously. When the upper sealing block 407 acts on the upper surface of the circuit board 30 to seal the upper end of the solder hole 301, the lower sealing block 701 acts on the lower surface of the circuit board 30 to seal the lower end of the solder hole 301. Subsequently, as the drive assembly 60 continues to move the lower support plate 803 upward, the lower pressure rod 802 moves into the lower pressure cylinder 801 to press the solder paste inside the lower pressure cylinder 801 into the solder hole 301 through the injection hole 702, thereby realizing the automatic filling of solder paste into the solder hole 301.

[0052] Please see Figure 1 In one embodiment, the drive assembly 60 includes a first incomplete gear 601, a first rack 602, a second incomplete gear 603, and a second rack 604. The first incomplete gear 601 is fixedly mounted on one set of the rotating shafts 501, and the second incomplete gear 603 is fixedly mounted on another set of the rotating shafts 501. One end of the first rack 602 is fixedly connected to the upper support plate 405, and the other end extends to one side of the first incomplete gear 601 and can mesh with the first incomplete gear 601. One end of the second rack 604 is fixedly connected to the lower support plate 803, and the other end extends to one side of the second incomplete gear 603 and can mesh with the second incomplete gear 603.

[0053] When the two sets of motors 503 drive the two sets of rotating shafts 501 and the two sets of semi-circular conveying blocks 502 to rotate relative to each other, the two sets of rotating shafts 501 can drive the first incomplete gear 601 and the second incomplete gear 603 to rotate synchronously. When the two sets of semi-circular conveying blocks 502 are separated from the circuit board 30, the first incomplete gear 601 meshes with the first rack 602, and at the same time, the second incomplete gear 603 meshes with the second rack 604. When the first incomplete gear 601 meshes with the first rack 602, it drives the upper support plate 405 to move downward. The upper support plate 405 drives the second elastic element 404, the upper pressure rod 403, the upper pressure cylinder 401, and the upper sealing block 407 to move downward. The second incomplete gear 603 meshes with the second rack 604. When the upper support plate 405 moves downward and the lower support plate 803 moves upward, the lower support plate 803 moves the lower pressure rod 802, the lower pressure cylinder 801 and the lower sealing block 701 upward. When the upper sealing block 407 acts on the upper surface of the circuit board 30 to seal the upper end of the solder hole 301, the lower sealing block 701 acts on the lower surface of the circuit board 30 to seal the lower end of the solder hole 301. Subsequently, as the upper support plate 405 moves further downward and the lower support plate 803 moves further upward, the second elastic element 404 is compressed, the upper sealing block 407 presses against the circuit board 30, and at the same time the lower pressure rod 802 moves into the lower pressure cylinder 801 to press the solder paste inside the lower pressure cylinder 801 into the solder hole 301 through the injection hole 702, thereby realizing the automatic filling of solder paste.

[0054] Please see Figure 1 , Figure 5 as well as Figure 7 In one embodiment, a first support plate 101 is fixedly disposed on the upper part of the side support plate 10, a first guide rod 406 is vertically inserted through the upper support plate 405, the first guide rod 406 is fixedly disposed on the inner top wall of the first support plate 101, a first elastic element 402 is disposed on the first support plate 101 for providing elastic support to the upper support plate 405, a third support plate 105 is fixedly disposed on the bottom of the side support plate 10, a second guide rod 805 is vertically inserted through the lower support plate 803, the second guide rod 805 is fixedly disposed on the bottom of the third support plate 105, and a third elastic element 806 is disposed on the third support plate 105 for providing elastic support to the lower support plate 803.

[0055] When the first incomplete gear 601 meshes with the first rack and pinion 602, thereby driving the upper support plate 405, the second elastic element 404, the upper pressure rod 403, the upper pressure cylinder 401, and the upper sealing block 407 to move downward, the upper support plate 405 slides downward along the first guide rod 406, and the first elastic element 402 is compressed. Through the arrangement of the first guide rod 406, the upper support plate 405, the second elastic element 404, the upper pressure rod 403, the upper pressure cylinder 401, and the upper sealing block 407 can be compressed. The movement of block 407 provides a guiding function, enabling the upper sealing block 407 to accurately seal the upper end of the welding hole 301. When the second incomplete gear 603 meshes with the second rack rod 604, thereby driving the lower support plate 803, lower pressure rod 802, lower pressure cylinder 801, and lower sealing block 701 to move upward, the lower support plate 803 slides upward along the second guide rod 805, and the third elastic element 806 is compressed. Through the setting of the second guide rod 805, the lower support plate can be compressed. The movement of 803, the lower pressure rod 802, the lower pressure cylinder 801, and the lower sealing block 701 provides a guiding function, enabling the lower sealing block 701 to accurately seal the lower end of the welding hole 301. When the first incomplete gear 601 disengages from the first rack rod 602, the second incomplete gear 603 and the second rack rod 604 disengage simultaneously. At this time, the first elastic element 401 pushes the upper support plate 405 upward, thereby driving the second elastic element 404, the upper pressure rod 403, the upper pressure cylinder 401, and the upper sealing block 407 upward, causing the upper sealing block 407 to separate from the upper surface of the circuit board 30. At the same time, the second elastic element 806 pushes the lower support plate 803 downward, thereby driving the lower pressure rod 802, the lower pressure cylinder 801, and the lower sealing block 701 downward, causing the lower sealing block 701 to separate from the lower surface of the circuit board 30, so that the two sets of semi-circular conveying blocks 502 can smoothly convey the circuit board 30 when it subsequently acts on it.

[0056] Please see Figure 1 , Figure 2 , Figure 4 as well as Figure 6 In one embodiment, a solder paste storage box 20 is also provided below the two sets of side support plates 10. A limiting ring 104 is provided on the outer ring of the lower pressure cylinder 801. The limiting block 104 is fixedly installed on the inner wall of the side support plate 10 by a support rod. A solder paste delivery hose 804 is provided on the side wall of the lower pressure cylinder 801. One end of the solder paste delivery hose 804 away from the lower pressure cylinder 801 is connected to the solder paste storage box 20. A one-way valve (not shown in the figure) is provided inside both the solder paste delivery hose 804 and the lower pressure cylinder 801.

[0057] When the second incomplete gear 603 meshes with the second rack 604, thereby driving the lower pressure rod 802 to move into the lower pressure cylinder 801, the one-way valve inside the lower pressure cylinder 801 opens, and the one-way valve inside the solder paste delivery hose 804 closes. The lower pressure rod 802 then presses the solder paste inside the lower pressure cylinder 801 into the soldering hole 301 through the injection hole 702. When the second incomplete gear 603 disengages from the second rack 604, causing the third elastic element 806 to push the lower support plate 803 downward, the lower support plate 803 drives the lower pressure rod 802, the lower pressure cylinder 801, and the lower sealing block 7. 01 moves downward synchronously. The lower pressure cylinder 801 moves downward relative to the limiting ring 104. After the lower sealing block 701 separates from the lower surface of the circuit board 30, the lower sealing block 701 acts on the upper part of the limiting ring 104 and stops moving downward. The lower pressure cylinder 801 stops moving downward synchronously. At this time, the lower pressure rod 802 moves downward relative to the lower pressure cylinder 801. The one-way valve inside the lower pressure cylinder 801 closes, and the one-way valve inside the solder paste delivery hose 804 opens. The lower pressure rod 802 draws the solder paste inside the solder paste storage box 20 into the lower pressure cylinder 801 through the solder paste delivery hose 804, realizing automatic replenishment of solder paste.

[0058] Please see Figure 2 In one embodiment, a plurality of support rollers 103 are rotatably mounted between the two sets of side support plates 10. The plurality of support rollers 103 are horizontally spaced to provide rolling support for the circuit board 30, so that when the two sets of semi-circular conveying blocks 502 act on the upper and lower surfaces of the circuit board 30, the circuit board 30 can move smoothly, thereby realizing the smooth conveying of the circuit board 30.

[0059] In one embodiment, the first elastic element 402, the second elastic element 404, and the third elastic element 806 can be springs or metal sheets, and there is no limitation here.

[0060] In this embodiment of the invention, when soldering the pins of electronic components to the circuit board 30, the circuit board 30 can be placed between two sets of side support plates 10, and then conveyed by the conveying assembly 50. When the soldering hole 301 on the circuit board 30 moves between the upper sealing assembly 40 and the lower sealing assembly 70, the driving assembly 60 drives the upper sealing assembly 40 to move downward and the lower sealing assembly 70 to move upward. When the upper sealing assembly 40 moves downward, it acts on the upper surface of the circuit board 30, thereby sealing the upper end of the soldering hole 301 on the circuit board 30. When the lower sealing assembly 70 moves upward, it acts on the lower surface of the circuit board 30, thereby sealing the lower end of the soldering hole 301 on the circuit board 30. Then, the injection assembly 80 injects solder paste into the sealed soldering hole 301. Then, the conveying assembly 50 continues to convey the circuit board 30. The circuit board 30 is placed between the two sets of side support plates 10. The board 10 is further moved to the subsequent electronic component insertion station (not shown in the figure). At this time, the robot arm inserts the pins of the electronic components into the soldering holes 301. Then, the heating mechanism (not shown in the figure) heats the circuit board 30, causing the solder paste inside the soldering holes 301 to melt. After the alloy components in the solder paste cool and solidify, solder joints are formed between the pins of the electronic components and the circuit board 30, thereby completing the soldering between the electronic components and the circuit board 30. Compared with the prior art, the setting of the upper sealing component 40, the lower sealing component 70 and the solder paste injection component 80 can accurately fill the solder paste into the soldering holes 301 on the circuit board 30. On the one hand, it ensures the amount of solder paste required for soldering, thereby improving the soldering quality between the electronic components and the circuit board 30. On the other hand, it avoids solder paste from adhering to the surface of the circuit board 30, preventing solder paste residue from causing short circuits in the circuit board 30.

[0061] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention, and no reference numerals in the claims should be construed as limiting the scope of the claims.

[0062] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity, and those skilled in the art should consider the specification as a whole.

Claims

1. An electromechanical pin soldering device, characterized in that, Includes side support plates, upper sealing assembly, conveying assembly, drive assembly, lower sealing assembly, and solder paste injection assembly. The side support plates are provided in two sets, and the two sets of side support plates are distributed opposite to each other. The conveying assembly is installed on the upper and lower sides of the two sets of side support plates and is used to convey the circuit board. The upper sealing assembly is disposed above the two sets of side support plates, and the lower sealing assembly is disposed below the two sets of side support plates. The drive assembly is mounted on the edge of the side support plate and is used to drive the upper sealing assembly and the lower sealing assembly to move up and down. When the upper sealing component moves downward, it acts on the upper surface of the circuit board to seal the upper end of the solder holes on the circuit board. When the lower sealing assembly moves upward, it acts on the lower surface of the circuit board to seal the lower end of the solder holes on the circuit board. The solder paste injection assembly is located below the two sets of side support plates. After the upper and lower ends of the solder holes on the circuit board are sealed, the solder paste injection assembly is used to inject solder paste into the solder holes.

2. The electromechanical pin welding device according to claim 1, characterized in that, A second support plate is fixedly installed on the outer wall of the side support plate. The conveying assembly includes two sets of rotating shafts, two sets of semi-circular conveying blocks, and two sets of motors. The two sets of motors are fixedly installed on the side wall of the second support plate, the two sets of rotating shafts are respectively installed at the output ends of the two sets of motors, the two sets of semi-circular conveying pipe blocks are respectively fixedly installed outside the two sets of rotating shafts, and the two sets of semi-circular conveying blocks are distributed vertically relative to each other between the two sets of side support plates.

3. The electromechanical pin welding device according to claim 2, characterized in that, The upper sealing assembly includes an upper pressure cylinder, an upper pressure rod, a second elastic element, an upper support plate, and an upper sealing block. The upper sealing block is fixedly installed at the bottom of the upper pressure cylinder. The lower end of the upper pressure rod extends from the top of the upper pressure cylinder into the interior of the upper pressure cylinder and is telescopically engaged with the upper pressure cylinder. The upper end extends to the top of the upper pressure cylinder and is fixedly connected to the upper support plate. One end of the second elastic element is connected to the bottom of the upper support plate, and the other end is connected to the upper end of the upper pressure cylinder, which is used to provide elastic support for the upper pressure cylinder.

4. The electromechanical pin welding device according to claim 3, characterized in that, The lower sealing assembly includes a lower sealing block, on which an injection hole is provided. The solder paste injection assembly includes a lower pressure cylinder, a lower pressure rod, and a lower support plate. The upper sealing block is fixedly installed on the upper end of the lower pressure cylinder. The injection hole communicates with the inner cavity of the lower pressure cylinder. Solder paste is stored inside the lower pressure cylinder. The upper end of the lower pressure rod extends from the bottom of the lower pressure cylinder into the lower pressure cylinder and is telescopically engaged with the lower pressure cylinder. The lower end extends to the bottom of the lower pressure cylinder and is fixedly connected to the lower support plate.

5. The electromechanical pin welding device according to claim 4, characterized in that, The drive assembly includes a first incomplete gear, a first rack and pinion, a second incomplete gear, and a second rack and pinion. The first incomplete gear is fixedly mounted on one of the sets of rotating shafts, and the second incomplete gear is fixedly mounted on another set of rotating shafts. One end of the first rack is fixedly connected to the upper support plate, and the other end extends to one side of the first incomplete gear and can mesh with the first incomplete gear. One end of the second rack is fixedly connected to the lower support plate, and the other end extends to one side of the second incomplete gear and can mesh with the second incomplete gear.

6. The electromechanical pin welding device according to claim 4, characterized in that, A first support plate is fixedly installed on the upper part of the side support plate, and a first guide rod is vertically inserted through the upper support plate. The first guide rod is fixedly installed on the inner top wall of the first support plate, and a first elastic element is provided on the first support plate for providing elastic support to the upper support plate.

7. The electromechanical pin welding device according to claim 6, characterized in that, A third support plate is fixedly installed at the bottom of the side support plate, and a second guide rod is vertically inserted through the lower support plate. The second guide rod is fixedly installed at the bottom of the third support plate, and a third elastic element is provided on the third support plate to provide elastic support for the lower support plate.

8. The electromechanical pin welding device according to claim 4, characterized in that, A solder paste storage box is also provided below the two sets of side support plates. A limiting ring is provided on the outer ring of the lower pressure cylinder. The limiting block is fixedly installed on the inner wall of the side support plate by a support rod. A solder paste delivery hose is provided on the side wall of the lower pressure cylinder. The end of the solder paste delivery hose away from the lower pressure cylinder is connected to the solder paste storage box. A one-way valve is provided inside both the solder paste delivery hose and the lower pressure cylinder.

9. The electromechanical pin welding device according to claim 1, characterized in that, Several support rollers are rotatably installed between the two sets of side support plates, and the support rollers are distributed at horizontal intervals.

10. The electromechanical pin welding device according to claim 7, characterized in that, The first elastic element, the second elastic element, and the third elastic element are springs or metal sheets.

Images