Electroplating apparatus and electroplating method
By adding a second conductive structure to the flybar and setting a second conductive position on the tank assembly, the problem of poor conductive contact was solved, the yield of electroplating products was improved, and compatibility between the new and old tank assemblies was achieved.
Patent Information
- Application Number
- CN202511783174.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-28
- Publication Date
- 2026-02-10
AI Technical Summary
In existing gantry electroplating systems, the conductive contact area between the flybar and the process tank is small, which easily leads to poor conductive contact and a decrease in the yield of electroplated products. At the same time, it is difficult to modify old tanks, and new flybars are difficult to adapt to old tanks.
A second conductive structure is added to the flybar, and a second conductive position is set on the tank assembly to increase the electrical contact area; in the old tank assembly, the second conductive structure has no electrical connection, ensuring that the new flybar is suitable for the old tank.
This improved the yield of electroplating products and enabled compatibility between new and old tank components, ensuring the applicability and conductivity reliability of the flybar.
Smart Images
Figure CN121496535A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of electroplating, in particular to an electroplating device and an electroplating method. BACKGROUND
[0002] The structure of the gantry electroplating system generally comprises a crown block, a flying bar, a process tank body and a control system, etc., wherein the crown block carries the load-bearing tool full of workpieces to move, lift and drop accurately between each tank position of pretreatment, electroplating and post-treatment, etc. In some scenarios, the load-bearing tool can rotate to stir the solution in the treatment tank, thereby improving the electroplating effect. When the flying bar is driven by the crown block to drop to the working position, the conductive structure on the flying bar and the conductive position on the process tank body realize conductive contact, thereby providing power for the rotation of the load-bearing tool.
[0003] In the existing gantry electroplating system, a V-shaped conductive seat is arranged on the tank body, and a conductive rod is arranged on the flying bar. When the flying bar and the tank body are in conductive contact, the peripheral wall of the conductive rod is in electrical contact with the opposite two side walls of the V-shaped conductive seat. However, the above-mentioned electrical contact has a small contact area, and the phenomenon of poor conductive contact is prone to occur, thereby reducing the yield of electroplated products. At present, it is urgent to improve the conductive contact between the flying bar and the process tank body. At the same time, the process tank body belongs to hardware facilities, and due to its complexity, it is difficult to modify its structure after it is built. How to make the improved flying bar still applicable to the old process tank body is also a technical problem. SUMMARY
[0004] The main purpose of the present application is to provide an electroplating device and an electroplating method, which aims to provide an electroplating device to improve the yield of electroplated products and ensure the applicability of the flying bar structure.
[0005] To achieve the above-mentioned purpose, the electroplating device provided by the present application comprises: a tank body assembly comprising a plurality of treatment tanks, wherein a first conductive position is arranged on the tank wall of the treatment tank, or a first conductive position and a second conductive position are arranged in series on the tank wall of the treatment tank; and a flying bar on which a product is hung and which drives the product to move following the movement of the crown block, wherein a first conductive structure and a second conductive structure are arranged on the flying bar; When the tank body assembly only comprises the first conductive position, after the flying bar drives the product to drop into the treatment tank, the first conductive structure is electrically connected with the first conductive position, and the second conductive structure is not electrically connected; When the tank body assembly comprises the first conductive position and the second conductive position, after the flying bar drives the product to drop into the treatment tank, the first conductive structure is electrically connected with the first conductive position, and the second conductive structure is electrically connected with the second conductive position.
[0006] In an embodiment, the second conductive structure comprises two first conductive rods, the axial direction of the two first conductive rods is consistent with the lifting direction of the flying bar, and the second conductive position is configured as a first conductive block arranged on the tank wall of the processing tank. When the flying bar drives the product to descend into the processing tank, the lower ends of the two first conductive rods are in electrical contact with the first conductive block.
[0007] In an embodiment, the first conductive rod comprises a mounting shell, an elastic member, and a first conductive rod, the mounting shell is provided with a mounting groove, and a first mounting hole and a second mounting hole are arranged opposite to each other and communicated with the mounting groove, the first conductive rod is mounted in the mounting groove and at least partially extends out of the first mounting hole to be electrically connected with the first conductive block, the first conductive rod is movable relative to the first mounting hole and the second mounting hole, and the elastic member is mounted in the mounting groove to make the first conductive rod have a tendency to extend out of the first mounting hole.
[0008] In an embodiment, the mounting shell is provided with an upper limiting part, the first conductive rod is provided with a lower limiting part, and the two ends of the elastic member are in abutment with the upper limiting part and the lower limiting part, respectively, so as to make the first conductive rod have a tendency to extend out of the first mounting hole.
[0009] In an embodiment, the first conductive rod comprises a rod body and a limiting ring arranged on the rod body and protruding outward, the lower limiting part is configured as the limiting ring, the lower end of the elastic member is in abutment with the limiting ring, the lower end of the rod body extends out of the mounting groove, the limiting ring is located in the mounting groove, and the outer diameter of the limiting ring is greater than the hole diameter of the first mounting hole, so as to limit the limiting ring from being pulled out of the mounting groove.
[0010] In an embodiment, the upper limiting part is configured as a limiting groove arranged on the inner wall of the mounting shell, and the upper end of the elastic member is mounted in the limiting groove and in abutment with the groove wall of the limiting groove.
[0011] In an embodiment, the first conductive position is configured as a V-shaped seat, and the first conductive structure comprises a second conductive rod, the axial direction of the second conductive rod is consistent with the width direction of the processing tank. When the flying bar drives the product to descend into the processing tank, the outer wall of the second conductive rod is in electrical contact with the opposite two side walls of the V-shaped seat.
[0012] The application further provides an electroplating method suitable for the electroplating device, and the electroplating method comprises the following steps: performing degreasing treatment on the product; After the defatting product is activated for the first time, it is put into a copper plating solution to perform copper plating treatment, so that copper is deposited on the surface of the product; After the copper-plated product is activated for the second time, it is put into a palladium plating solution to perform palladium plating treatment, so that palladium is deposited on the surface of the product; After the palladium-plated product is put into a gold plating solution to perform gold plating treatment, so that gold is deposited on the surface of the product; After the gold-plated product is put into a platinum plating solution to perform platinum plating treatment, so that platinum is deposited on the surface of the product.
[0013] In an embodiment, the defatting treatment includes chemical defatting and electrolytic defatting, the solution components of the chemical defatting include sodium bicarbonate, sodium dihydrogen phosphate, sodium hydroxide, and sodium dodecyl sulfate, the processing temperature of the chemical defatting is 50-60°C, and the processing time of the chemical defatting is 1-3 min; The solution components of the electrolytic defatting include sodium bicarbonate, sodium carbonate, sodium silicate, sodium hydroxide, and sodium dodecyl sulfate, the processing temperature of the electrolytic defatting is 45-55°C, and the processing time of the electrolytic defatting is 1-3 min.
[0014] In an embodiment, the solution of the copper plating treatment includes copper, sulfuric acid, hydrochloric acid, brightener, and running agent, the current density of the copper plating treatment is 1-4 A / dm 3 , the temperature of the copper plating treatment is 20-28°C, and the time of the copper plating treatment is 10-20 min.
[0015] In an embodiment, the solution of the palladium plating treatment includes palladium and ammonia water, the current density of the palladium plating treatment is 0.5-1.5 A / dm 3 , the temperature of the palladium plating treatment is 55-65°C, and the time of the palladium plating treatment is 6-9 min.
[0016] In an embodiment, the solution of the gold plating treatment includes potassium gold cyanide, potassium cyanide, and citric acid, the current density of the gold plating treatment is 0.5-2 A / dm 3 , the temperature of the gold plating treatment is 45-55°C, and the time of the gold plating treatment is 3-6 min.
[0017] The technical solution of this invention involves assembling a tank assembly and a flybar in an electroplating apparatus. The tank assembly includes multiple processing tanks, each with a first conductive position on its wall, or a first conductive position and a second conductive position connected in series at intervals on the wall of the processing tank. A product is suspended on the flybar, which moves along with the crane. The flybar has a first conductive structure and a second conductive structure. When the tank assembly only includes the first conductive position, after the flybar lowers the product into the processing tank, the first conductive structure and the first conductive position are electrically connected, while the second conductive structure is not electrically connected. When the tank assembly includes both the first and second conductive positions, after the flybar lowers the product into the processing tank, the first conductive structure and the first conductive position are electrically connected, and the second conductive structure and the second conductive position are also electrically connected. Thus, on the one hand, compared to existing technologies, the addition of a second conductive structure on the flybar and a second conductive position on the new tank assembly ensures that when the flybar is used with the new tank assembly, the first conductive structure on the flybar and the first conductive position on the processing tank make conductive contact, and the second conductive structure on the flybar and the second conductive position on the processing tank make conductive contact. This increases the electrical contact area between the flybar and the processing tank, ensuring the reliability of conductivity between them and thus improving the yield of electroplated products. On the other hand, when using the old tank assembly, the first conductive structure on the flybar makes conductive contact with the first conductive position on the processing tank, while the second conductive structure on the flybar is in a non-contact state. The second conductive structure does not interfere with other structures on the processing tank, ensuring that the new flybar is suitable for both new and old tank assemblies, achieving the sharing of new and old lines and guaranteeing the applicability of the flybar. Attached Figure Description
[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0019] Figure 1 A schematic diagram of the structure of a flybar in an embodiment of the electroplating apparatus provided by the present invention; Figure 2 for Figure 1 A schematic diagram of the structure of one embodiment of the first conductive rod; Figure 3 This is a schematic diagram of electrical contact in an embodiment of a first conductive position and a first conductive structure in an electroplating apparatus. Figure 4 This is a schematic diagram of electrical contact in one embodiment of a second conductive position and a second conductive structure in an electroplating apparatus.
[0020] Explanation of icon numbers: 110, First conductive position; 111, V-shaped base; 120, Second conductive position; 121, First conductive block; 200, Flybar; 210, First conductive structure; 211, Second conductive rod; 220, Second conductive structure; 221, First conductive rod; 310. Mounting shell; 311. Mounting groove; 312. First mounting hole; 313. Second mounting hole; 314. Limiting groove; 320. Elastic element; 330. First conductive rod; 331. Limiting ring; 332. Rod body.
[0021] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.
[0023] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.
[0024] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.
[0025] Gantry electroplating, also known as linear electroplating line or automatic gantry electroplating line, is an automated electroplating equipment controlled by a central computer (PLC) and centered on a "gantry" shaped crane system to automatically transfer workpieces between different process tanks.
[0026] A typical gantry electroplating system includes an overhead crane, a flybar, process tanks, and a control system. The overhead crane, via the flybar, carries a fully loaded workpiece as a support tool, precisely moving, lifting, and lowering it between various tanks for pretreatment, electroplating, and post-treatment. In some scenarios, the support tool can rotate to agitate the solution in the treatment tank, improving the electroplating effect. When the flybar, driven by the overhead crane, lowers the support tool to the working position, the conductive structure on the flybar makes conductive contact with the conductive parts on the process tank, thus providing power for the rotation of the support tool.
[0027] In existing gantry electroplating systems, a V-shaped conductive seat is installed on the tank, and a conductive rod is installed on the flybar. When the flybar and the tank make conductive contact, the peripheral wall of the conductive rod makes electrical contact with the opposite side walls of the V-shaped conductive seat. However, the above-mentioned electrical contact method has a small contact area, which easily leads to poor conductive contact. This causes the rotation of the carrier tool to stop or intermittently pause, resulting in the accumulation or stacking of products inside the carrier tool. The covered surfaces of the products cannot be effectively electroplated, thus reducing the yield of electroplated products.
[0028] Currently, there is an urgent need to improve the conductive contact between the flybar and the process tank. At the same time, it is understandable that the process tank is a hardware facility, and due to its complex structure, it is difficult to modify its structure after it has been assembled. How to ensure that the improved flybar can still be used with the old process tank is also a technical challenge.
[0029] This invention proposes an electroplating apparatus.
[0030] Please see Figure 1 In one embodiment of the present invention, the electroplating apparatus includes a tank assembly (not shown) and a flybar 200. The tank assembly includes a plurality of processing tanks, and the tank walls of the processing tanks are provided with first conductive positions 110, or the tank walls of the processing tanks are provided with first conductive positions 110 and second conductive positions 120 connected in series at intervals. The flybar 200 suspends the product and moves the product along with the movement of the overhead crane. The flybar 200 is provided with a first conductive structure 210 and a second conductive structure 220. When the tank assembly includes only the first conductive position 110, after the flybar 200 lowers the product into the processing tank, the first conductive structure 210 and the first conductive position 110 are electrically connected, and the second conductive structure 220 is not electrically connected; when the tank assembly includes the first conductive position 110 and the second conductive position 120, after the flybar 200 lowers the product into the processing tank, the first conductive structure 210 and the first conductive position 110 are electrically connected, and the second conductive structure 220 and the second conductive position 120 are electrically connected.
[0031] As is understood, the electroplating apparatus is a complete system, including the overhead crane, the flybar 200, the process tank, and the control system. The technical solution of this invention focuses on the electrical contact between the conductive structure on the flybar 200 and the conductive position on the process tank, so as to provide a rotational power source for the carrying tool that carries the product. Other structures will not be described in detail here.
[0032] The electroplating apparatus includes a tank assembly (not shown), which comprises multiple processing tanks (not shown) arranged in a row. Each processing tank contains a different solution to achieve different functions, such as cleaning, activation, copper plating, and gold plating. In one embodiment, each processing tank has a first conductive position 110 on its wall. In another embodiment, each processing tank has a first conductive position 110 and a second conductive position 120 on its wall, the first conductive position 110 and the second conductive position 120 being spaced apart and connected in series.
[0033] Understandably, the conductive parts are set during the construction of the tank assembly, and are also in place once the tank assembly is completed. However, due to the complex structure of the tank assembly, it is difficult to modify the structure of its conductive parts after construction. The tank assembly with only the first conductive position 110 is the existing tank assembly, i.e., the old tank assembly; the tank assembly with both the first conductive position 110 and the second conductive position 120 is the new tank assembly.
[0034] One end of the Flybar 200 is connected to the overhead crane, and the other end is connected to a carrying tool, which includes a hanging rod and rollers. Products are placed on the hanging rod and inside the rollers. When the overhead crane moves the Flybar 200, the products also move with it. The Flybar 200 is equipped with a first conductive structure 210 and a second conductive structure 220.
[0035] When using the old tank assembly, the tank assembly only has a first conductive position 110. When the flybar 200 lowers the product into the processing tank, the first conductive structure 210 on the flybar 200 and the first conductive position 110 on the processing tank make conductive contact. At this time, there is no conductive position on the processing tank that cooperates with the second conductive structure 220 on the flybar 200, so the second conductive structure 220 is in a state of no electrical connection. At this time, the electrical connection between the first conductive structure 210 and the first conductive position 110 provides a complete electrical circuit for the rotation of the carrying tool, enabling the carrying tool to rotate.
[0036] When a new tank assembly is used, the tank assembly includes a first conductive position 110 and a second conductive position 120. When the flybar 200 lowers the product into the processing tank, the first conductive structure 210 on the flybar 200 and the first conductive position 110 on the processing tank make conductive contact, and the second conductive structure 220 on the flybar 200 and the second conductive position 120 on the processing tank make conductive contact. The first conductive position 110 and the second conductive position 120 are connected in series, so that the first conductive structure 210, the first conductive position 110, the second conductive position 120, and the second conductive structure 220 form an electrical connection, thereby providing power for the rotation of the carrying tool.
[0037] Thus, compared to the prior art, this invention adds a second conductive structure 220 to the flybar 200 and a second conductive position 120 to the new tank assembly. When the new tank assembly is used, the first conductive structure 210 on the flybar 200 and the first conductive position 110 on the processing tank are in conductive contact, and the second conductive structure 220 on the flybar 200 and the second conductive position 120 on the processing tank are in conductive contact. This increases the electrical contact area between the flybar 200 and the processing tank, ensuring the conductivity reliability between them, and thus improving the product yield of electroplating. At the same time, when the old tank assembly is used, the first conductive structure 210 on the flybar 200 and the first conductive position 110 on the processing tank are in conductive contact, while the second conductive structure 220 on the flybar 200 is in a non-contact state. The second conductive structure 220 does not interfere with other structures on the processing tank, ensuring that the new flybar 200 can be used with both new and old tank assemblies, realizing the use of both new and old lines and ensuring the applicability of the flybar 200.
[0038] Please see Figure 3 In an embodiment of the present invention, the first conductive position 110 is configured as a V-shaped seat 111; the first conductive structure 210 includes a second conductive rod 211, the axial direction of the second conductive rod 211 being consistent with the width direction of the processing tank; when the flybar 200 drives the product down into the processing tank, the outer wall of the second conductive rod 211 makes electrical contact with the opposite side walls of the V-shaped seat 111.
[0039] Specifically, a V-shaped seat 111 is provided on the wall of the processing tank, with the opening of the V-shaped seat 111 facing upwards. The first conductive position 110 is configured as the V-shaped seat 111. A second conductive rod 211 is provided on the flybar 200, with the first conductive structure 210 configured as the second conductive rod 211. The axial direction of the second conductive rod 211 is consistent with the width direction of the processing tank. The width direction of the processing tank is perpendicular to the vertical movement direction and the forward and backward movement direction of the flybar 200, respectively. When the flybar 200 lowers the product, the second conductive rod 211 moves closer to the V-shaped seat 111. After the product falls into the processing tank, the second conductive rod 211 overlaps the V-shaped seat 111, so that the outer wall of the second conductive rod 211 contacts the opposite side walls of the V-shaped seat 111, thereby realizing the electrical connection between the two.
[0040] Please see Figure 1 and Figure 4 In an embodiment of the present invention, the second conductive structure 220 includes two first conductive rods 221, the axial direction of the two first conductive rods 221 is consistent with the lifting direction of the flybar 200, and the second conductive position 120 is configured as a first conductive block 121 disposed on the wall of the processing tank. When the flybar 200 lowers the product into the processing tank, the lower ends of the two first conductive rods 221 make electrical contact with the first conductive block 121.
[0041] Specifically, the second conductive structure 220 includes two first conductive rods 221, which are respectively configured as positive and negative electrodes. The axial direction of the two first conductive rods 221 is consistent with the lifting direction of the flybar 200, that is, the axial direction of the two first conductive rods 221 extends in the vertical direction. The second conductive position 120 is configured as a first conductive block 121 on the wall of the processing tank. When the flybar 200 lowers the product, the first conductive rods 221 move closer to the first conductive block 121. When the product is lowered into the processing tank, the first conductive rods 221 come into contact with the first conductive block 121, thereby realizing the electrical connection between the two.
[0042] In this invention, the axial direction of the first conductive rod 221 is aligned with the lifting direction of the flybar 200. Thus, when the flybar 200 lowers the product into the processing tank, the end face of the first conductive rod 221 can make surface contact with the first conductive block 121. This surface contact also increases the electrical contact area between the first conductive rod 221 and the first conductive block 121, thereby improving the conductivity reliability between them. Furthermore, by adding surface contact between the first conductive rod 221 and the first conductive block 121 to the point contact between the second conductive rod 211 and the V-shaped seat 111, the reliability of the electrical contact between the processing tank and the flybar 200 is further enhanced.
[0043] Please see Figure 2In an embodiment of the present invention, the first conductive rod 221 includes a mounting shell 310, an elastic element 320, and a first conductive rod 330. The mounting shell 310 is provided with a mounting groove 311 and a first mounting hole 312 and a second mounting hole 313 that are respectively connected to and opposite to the mounting groove 311. The first conductive rod 330 is mounted in the mounting groove 311 and at least partially extends out of the first mounting hole 312 to be electrically connected to the first conductive block 121. The first conductive rod 330 is movable relative to the first mounting hole 312 and the second mounting hole 313. The elastic element 320 is mounted in the mounting groove 311 to give the first conductive rod 330 a tendency to extend out of the first mounting hole 312.
[0044] Specifically, in one embodiment, the first conductive rod 221 includes a mounting shell 310, an elastic element 320, and a first conductive rod 330. A mounting groove 311 is formed within the mounting shell 310. In one embodiment, the mounting shell 310 includes an upper shell and a lower shell, which are connected to enclose the mounting groove 311, thus facilitating the installation of the elastic element 320 into the mounting groove 311. The mounting shell 310 also has a first mounting hole 312 and a second mounting hole 313 respectively communicating with the mounting groove 311. The first mounting hole 312 and the second mounting hole 313 are arranged opposite to each other. In one embodiment, the first mounting hole 312 is located below the mounting shell 310, and the second mounting hole 313 is located above the mounting shell 310. The first conductive rod 330 is installed in the mounting groove 311 and extends at least partially from the first mounting hole 312; that is, the connection direction of the first mounting hole 312 and the second mounting hole 313 is consistent with the axial direction of the first conductive rod 330. Simultaneously, the first conductive rod 330 can also move relative to the first mounting hole 312 and the second mounting hole 313. An elastic element 320 is installed within the mounting groove 311 to give the first conductive rod 330 a tendency to extend out of the first mounting hole 312.
[0045] Understandably, when the flybar 200 lowers the product into the processing tank, the second conductive rod 211 contacts the V-shaped seat 111, and the lower end of the first conductive rod 330 contacts the first conductive block 121. The first conductive rod 330 receives an upward reaction force from the first conductive block 121. Under this reaction force, the first conductive rod 330 moves upward relative to the first mounting hole 312 and the second mounting hole 313, and part of the first conductive rod 330 may protrude from the second mounting hole 313. Simultaneously, the upward movement of the first conductive rod 330 compresses the elastic element 320 within the mounting groove 311. Under the elastic force of the elastic element 320, the first conductive rod 330 experiences a downward force. The elastic element 320 ensures the reliable electrical connection between the first conductive rod 330 and the first conductive block 121. Furthermore, the elastic element 320 helps reduce the accuracy of the flybar 200's descent movement, improving the flybar 200's adaptability.
[0046] Please see Figure 2 In an embodiment of the present invention, the mounting shell 310 is provided with an upper limit portion, the first conductive rod 330 is provided with a lower limit portion, and the two ends of the elastic member 320 abut against the upper limit portion and the lower limit portion respectively, so that the first conductive rod 330 tends to extend out of the first mounting hole 312.
[0047] Understandably, in order for the elastic element 320 to act on the first conductive rod 330, so that the first conductive rod 330 tends to extend out of the first mounting hole 312, limiting portions need to be provided on the upper and lower sides of the elastic element 320. In one embodiment, an upper limiting portion is provided inside the mounting shell 310, and a lower limiting portion is provided on the first conductive rod 330. The two ends of the elastic element 320 abut against the upper limiting portion and the lower limiting portion respectively, so that the elastic element 320 can deform when the first conductive rod 330 moves upward relative to the first mounting hole 312. In this way, the upper limiting portion is provided on the mounting shell 310, and the lower limiting portion is directly provided on the first conductive rod 330, thereby avoiding the need for additional limiting structures and simplifying the structure of the first conductive rod 221.
[0048] Please see Figure 2 In an embodiment of the present invention, the first conductive rod 330 includes a rod body 332 and a limiting ring 331 disposed on the rod body 332 and protruding outward. The lower limiting part is configured as the limiting ring 331. The lower end of the elastic member 320 abuts against the limiting ring 331. The lower end of the rod body 332 extends out of the mounting groove 311. The limiting ring 331 is located in the mounting groove 311, and the outer diameter of the limiting ring 331 is larger than the diameter of the first mounting hole 312, so as to restrict the limiting ring 331 from falling out of the mounting groove 311.
[0049] Specifically, in the embodiment shown in the figures of this invention, the first conductive rod 330 includes a rod body 332 and a limiting ring 331. The limiting ring 331 is disposed on the rod body 332 and protrudes outward relative to the rod body 332. The limiting ring 331 is located at one end of the rod body 332 near the first mounting hole 312. The lower limiting portion is configured as the limiting ring 331. The lower end of the elastic member 320 abuts against the limiting ring 331. In one embodiment, the outer diameter of the lower end of the elastic member 320 is smaller than the outer diameter of the limiting ring 331, so that the limiting ring 331 can provide support and abutment for the elastic member 320. The lower end of the rod body 332 extends out of the first mounting hole 312, and the limiting ring 331 is disposed in the mounting groove 311. The outer diameter of the limiting ring 331 is larger than the outer diameter of the first mounting hole 312, thereby preventing the limiting ring 331 from dislodging from the first mounting hole 312 into the mounting groove 311.
[0050] Please see Figure 2In an embodiment of the present invention, the upper limit portion is configured as a limiting groove 314 provided on the inner wall of the mounting shell 310, and the upper end of the elastic member 320 is installed in the limiting groove and abuts against the groove wall of the limiting groove.
[0051] Specifically, the inner wall of the mounting shell 310 is provided with a limiting groove 314, which is connected to the mounting groove 311 and the second mounting hole 313. The upper end of the elastic member 320 is installed in the limiting groove 314, and the upper end of the elastic member 320 abuts against the groove wall of the limiting groove 314, thereby preventing the elastic member 320 from coming out of the mounting groove 311 from the second mounting hole 313. The limiting groove 314 provides positioning for the installation of the elastic member 320 and also provides guidance for the elastic deformation of the elastic member 320. In one embodiment, the outer diameter of the upper end of the elastic member 320 is larger than the diameter of the second mounting hole 313, and the groove diameter of the limiting groove 314 is larger than the outer diameter of the upper end of the elastic member 320, so that the upper end face of the elastic member 320 can abut against the groove wall of the limiting groove 314.
[0052] In one embodiment, the elastic element 320 is configured as a spring, which is sleeved on the first conductive rod 330. Of course, the elastic element 320 can also be a metal spring sheet, etc.
[0053] Please see Figure 2 In one embodiment, the first conductive rod 221 extends out of the second mounting hole 313 for electrical connection with the power supply of the flybar 200. It is understood that the first conductive rod 330 can move up and down relative to the first mounting hole 312 and the second mounting hole 313 to facilitate the adaptability of the flybar 200. In one embodiment, the first conductive rod 330 is relatively long; when the limiting ring 331 abuts against the groove wall of the mounting groove 311, the upper end of the first conductive rod 330 extends out of the second mounting hole 313, thereby facilitating the electrical connection between the first conductive rod 330 and the power supply of the flybar 200.
[0054] In an embodiment of the present invention, the first conductive block 121 is configured as a titanium plate. It is understood that the first conductive block 121, installed on the wall of the processing tank, is subjected to a long-term environment of high temperature, high humidity, and strong acid, making it susceptible to corrosion and oxidation. To prevent corrosion and oxidation of the first conductive block 121, it is configured as a titanium plate.
[0055] This invention also proposes an electroplating method applicable to an electroplating apparatus. The specific structure of the electroplating apparatus is described in the above embodiments. Since this electroplating method employs all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated upon here. The electroplating method includes: The product undergoes degreasing treatment; After the degreased product is activated for the first time, it is placed in a copper plating solution for copper plating treatment, so that copper is deposited on the surface of the product. After copper plating, the product is activated a second time and then placed in a palladium plating solution for palladium plating treatment, so that palladium is deposited on the product surface. The palladium-plated product is placed in a gold plating solution for gold plating treatment, so that gold is deposited on the surface of the product. The gold-plated product is placed in a platinum plating solution for platinum plating treatment, so that platinum is deposited on the surface of the product.
[0056] Thus, by sequentially plating the product with copper, palladium, gold, and platinum, the stability of the surface coating is improved, as well as the product's corrosion resistance, conductivity, and high-temperature resistance.
[0057] In embodiments of the present invention, the degreasing treatment includes chemical degreasing and electrolytic degreasing. The chemical degreasing solution comprises sodium bicarbonate, sodium dihydrogen phosphate, sodium hydroxide, and sodium dodecyl sulfate. The chemical degreasing treatment temperature is 50-60°C, and the chemical degreasing treatment time is 1-3 minutes. The electrolytic degreasing solution comprises sodium bicarbonate, sodium carbonate, sodium silicate, sodium hydroxide, and sodium dodecyl sulfate. The electrolytic degreasing treatment temperature is 45-55°C, and the electrolytic degreasing time is 1-3 minutes.
[0058] Thus, the degreasing process is divided into two steps: chemical degreasing and electrolytic degreasing. Chemical degreasing removes the grease initially, while electrolytic degreasing removes stubborn oil and grease, resulting in a better degreasing effect on the product, which is beneficial for subsequent plating.
[0059] In embodiments of the present invention, the copper plating solution includes copper, sulfuric acid, hydrochloric acid, brightener, and leveling agent, and the current density for copper plating is 1-4 A / dm³. 3 The copper plating temperature is 20-28℃, and the plating time is 10-20 minutes. Copper plating helps improve the adhesion of the plating layer, enhances conductivity, and also helps with leveling.
[0060] After degreasing and before copper plating, the product needs to undergo a first activation treatment to remove the oxide layer. The solution for the first activation treatment includes sulfuric acid, the treatment temperature is room temperature, and the treatment time is 1-3 minutes.
[0061] In embodiments of the present invention, the palladium plating solution includes palladium and ammonia, and the current density for palladium plating is 0.5-1.5 A / dm³. 3 The palladium plating treatment is performed at a temperature of 55-65℃ for 6-9 minutes. Palladium plating effectively prevents the diffusion of the underlying metal, i.e., the copper layer, into the gold layer, thus ensuring the stability between the copper and gold layers.
[0062] After copper plating and before palladium plating, the product needs to undergo a second activation treatment to remove the oxide layer. The solution for the second activation treatment includes sulfuric acid, the treatment temperature is room temperature, and the treatment time is 1-3 minutes.
[0063] In embodiments of the present invention, the gold plating solution includes potassium gold cyanide, potassium cyanide, and citric acid, and the current density for gold plating is 0.5-2 A / dm³. 3 The gold plating process takes place at a temperature of 45-55℃ for 3-6 minutes. Gold plating can improve the conductivity and corrosion resistance of the product.
[0064] In embodiments of the present invention, the platinum plating solution includes platinum and sulfuric acid, and the current density for platinum plating is 1-4 A / dm³. 3 The platinum plating treatment temperature is 45-65℃, and the treatment time is 7-10 minutes. Platinum plating can improve the corrosion resistance and high temperature resistance of the product.
[0065] The above description is merely an exemplary embodiment of the present invention and does not limit the scope of protection of the present invention. Any equivalent structural transformations made based on the technical concept of the present invention and the contents of the specification and drawings of the present invention, or direct / indirect applications in other related technical fields, are included within the scope of protection of the present invention.
Claims
1. An electroplating apparatus, characterized in that, include: A tank assembly includes multiple processing tanks, wherein the tank walls are provided with first conductive positions, or, the tank walls are provided with first conductive positions and second conductive positions connected in series at intervals; and A flybar, on which the product is suspended, moves along with the crane. The flybar is equipped with a first conductive structure and a second conductive structure. When the tank assembly includes only the first conductive position, after the flybar drives the product down into the processing tank, the first conductive structure and the first conductive position are electrically connected, while the second conductive structure is not electrically connected. When the tank assembly includes a first conductive position and a second conductive position, after the flybar drives the product down into the processing tank, the first conductive structure and the first conductive position are electrically connected, and the second conductive structure and the second conductive position are electrically connected.
2. The electroplating apparatus as described in claim 1, characterized in that, The second conductive structure includes two first conductive rods, the axial direction of the two first conductive rods is consistent with the lifting direction of the flybar, and the second conductive position is configured as a first conductive block on the wall of the processing tank; When the flybar lowers the product into the processing tank, the lower ends of the two first conductive rods make electrical contact with the first conductive block.
3. The electroplating apparatus as described in claim 2, characterized in that, The first conductive rod includes a mounting shell, an elastic element, and a first conductive rod. The mounting shell has a mounting groove, a first mounting hole, and a second mounting hole that are respectively connected to and opposite to the mounting groove. The first conductive rod is mounted in the mounting groove and at least partially extends out of the first mounting hole to be electrically connected to the first conductive block. The first conductive rod is movable relative to the first mounting hole and the second mounting hole. The elastic element is mounted in the mounting groove to give the first conductive rod a tendency to extend out of the first mounting hole.
4. The electroplating apparatus as described in claim 3, characterized in that, The mounting housing has an upper limit portion, and the first conductive rod has a lower limit portion. The two ends of the elastic member abut against the upper limit portion and the lower limit portion respectively, so that the first conductive rod tends to extend out of the first mounting hole.
5. The electroplating apparatus as described in claim 4, characterized in that, The first conductive rod includes a rod body and a limiting ring disposed on the rod body and protruding outward. The lower limiting portion is configured as the limiting ring. The lower end of the elastic member abuts against the limiting ring. The lower end of the rod body extends out of the mounting groove. The limiting ring is located in the mounting groove, and the outer diameter of the limiting ring is larger than the diameter of the first mounting hole to restrict the limiting ring from coming out of the mounting groove.
6. The electroplating apparatus as described in claim 4, characterized in that, The upper limit portion is configured as a limiting groove on the inner wall of the mounting shell, and the upper end of the elastic member is installed in the limiting groove and abuts against the groove wall.
7. The electroplating apparatus as described in claim 1, characterized in that, The first conductive position is configured as a V-shaped seat; the first conductive structure includes a second conductive rod, the axial direction of which is consistent with the width direction of the processing groove; When the flybar lowers the product into the processing tank, the outer wall of the second conductive rod makes electrical contact with the opposite side walls of the V-shaped seat.
8. An electroplating method, characterized in that, The electroplating apparatus as described in any one of claims 1 to 7, wherein the electroplating method comprises: The product undergoes degreasing treatment; After the degreased product is activated for the first time, it is placed in a copper plating solution for copper plating treatment, so that copper is deposited on the surface of the product. After copper plating, the product is activated a second time and then placed in a palladium plating solution for palladium plating treatment, so that palladium is deposited on the product surface. The palladium-plated product is placed in a gold plating solution for gold plating treatment, so that gold is deposited on the surface of the product. The gold-plated product is placed in a platinum plating solution for platinum plating treatment, so that platinum is deposited on the surface of the product.
9. The electroplating method as described in claim 8, characterized in that, The degreasing treatment includes chemical degreasing and electrolytic degreasing. The solution components for chemical degreasing include sodium bicarbonate, sodium dihydrogen phosphate, sodium hydroxide, and sodium dodecyl sulfate. The treatment temperature for chemical degreasing is 50-60℃, and the treatment time for chemical degreasing is 1-3 minutes. The solution composition for electrolytic degreasing includes sodium bicarbonate, sodium carbonate, sodium silicate, sodium hydroxide, and sodium dodecyl sulfate. The electrolytic degreasing treatment temperature is 45-55℃, and the electrolytic degreasing time is 1-3 minutes.
10. The electroplating method as described in claim 8, characterized in that, The copper plating solution includes copper, sulfuric acid, hydrochloric acid, brightener, and leveling agent; the current density for the copper plating process is 1-4 A / dm³. 3 The copper plating process is carried out at a temperature of 20-28°C for 10-20 minutes.
11. The electroplating method as described in claim 8, characterized in that, The palladium plating solution includes palladium and ammonia, and the current density for the palladium plating process is 0.5-1.5 A / dm³. 3 The palladium plating treatment is performed at a temperature of 55-65℃ for 6-9 minutes.
12. The electroplating method as described in claim 8, characterized in that, The gold plating solution includes potassium gold cyanide, potassium cyanide, and citric acid, and the current density for the gold plating process is 0.5-2 A / dm³. 3 The gold plating process is carried out at a temperature of 45-55℃ for 3-6 minutes.