Sensor pin soldering control method and system

Abstract

The present application relates to the technical fields of welding control, and specifically includes a sensor pin welding control method and system, comprising: obtaining welding environment parameters according to sensor pins, determining basic welding parameters, setting welding control parameter matrix in combination with first and second welding execution instruction sequences, and performing welding path dynamic correction; at the same time, welding process restart after basic welding parameter correction and welding spot forming quality compensation are performed according to the dynamic retreat welding execution path. The technical problem of preset fixed trajectory of welding path, sensor pin assembly error unable to be effectively compensated, and risk of virtual welding and false welding is solved, the basic welding parameters are determined, the welding conditions are accurately matched with material characteristics and real-time environment, the welding path dynamic correction is performed in combination with the welding control parameter matrix, the welding alignment accuracy is improved, the process restart and welding spot forming quality compensation are performed after parameter correction, and the technical effects of improving welding yield and product consistency are achieved.

Description

Technical Field

[0001] This invention relates to the field of welding control technology, specifically to a sensor pin welding control method and system. Background Technology

[0002] Sensor pin soldering is a critical process in sensor packaging. It is necessary to achieve a firm connection between the pins and the substrate pads, low impedance conduction, and avoid sensor failure due to soldering defects such as cold solder joints and solder overflow. Currently, sensor pin soldering control is mostly based on setting fixed soldering parameters according to basic parameters such as pin diameter and pad size. The soldering path is mostly a preset fixed trajectory. There is a lack of a real-time deviation correction mechanism based on vision positioning, which cannot effectively compensate for assembly errors such as pad center alignment errors. This results in the risk of cold solder joints and false solder joints, and the yield of sensor pin soldering is limited.

[0003] In summary, the existing technology has the technical problem that the welding path uses a preset fixed trajectory, the assembly error of sensor pins cannot be effectively compensated, and there is a risk of poor soldering and false soldering. Summary of the Invention

[0004] This application provides a sensor pin welding control method and system, aiming to solve the technical problem in the prior art where the welding path uses a preset fixed trajectory, the sensor pin assembly error cannot be effectively compensated, and there is a risk of false welding or cold welding.

[0005] In view of the above problems, the technical solution to achieve the present application is as follows: In a first aspect, this application provides a sensor pin welding control method, wherein the method includes: acquiring welding environment parameters including pin material, diameter, oxidation degree, and substrate pad temperature based on the sensor pin; determining basic welding parameters through multi-dimensional feature analysis of the initial pin state; setting a welding control parameter matrix based on the basic welding parameters and combining a first welding execution command sequence and a second welding execution command sequence; dynamically correcting the welding path using the welding control parameter matrix; and simultaneously restarting the welding process and compensating for solder joint formation quality after correcting the basic welding parameters according to the dynamically retreated welding execution path.

[0006] Preferably, based on the visual positioning unit, the relative positional deviation between the sensor pin center and the PCB pad center is analyzed using X-axis translation compensation and Y-axis translation compensation to determine the first welding execution command sequence.

[0007] Preferably, based on the visual positioning unit, the coplanarity error between the sensor pin end face and the PCB pad surface is analyzed by the Z-axis height adjustment amount to determine the second welding execution command sequence.

[0008] Preferably, a multi-factor coupling influence set is constructed based on the welding environment parameters; after detecting that the substrate pad temperature triggers an over-temperature command due to the thermal coupling response time, the power adjustment range of the heat input is set based on the correlation coefficient between the thermal conductivity corresponding to the pin material and the heat capacity parameter corresponding to the diameter size in the multi-factor coupling influence set.

[0009] Preferably, the thermal conductivity corresponding to the pin material, the heat capacity parameter corresponding to the diameter size, the wetting resistance coefficient corresponding to the oxidation degree, and the thermal coupling response time corresponding to the substrate pad temperature are correlated and modeled to obtain the multi-factor coupling influence set.

[0010] Preferably, the flux spraying amount is uploaded, and the heating slope of the preheating stage is adjusted synchronously according to the real-time change rate of the substrate pad temperature: dynamically matching the heat input and material response characteristics, the heat input and flux activity window have temporal consistency, and the oxide layer removal operation is performed before the solder melts.

[0011] Preferably, the initial pin state includes pin perpendicularity deviation and pin plating; based on the pin perpendicularity deviation in the initial pin state, the Z-axis pressing trajectory is corrected, the welding control parameter matrix is ​​dynamically updated, and the tilt compensation command is integrated into the Z-axis pressing sub-sequence.

[0012] Preferably, based on the pin plating in the initial pin state, the solder alloy composition and welding temperature curve are matched, welding duration constraints are configured for the metal plating, and reflow peak temperature constraints are configured for the tin plating. Based on the welding duration constraints and reflow peak temperature constraints, combined with the power adjustment range of the heat input, the welding duration is flexibly shortened and the heating target value is lowered.

[0013] Preferably, the Z-axis pressing sequence corresponding to the tilt compensation instruction is called and combined with the first welding execution instruction sequence and the second welding execution instruction sequence to generate a dynamic retreat welding execution path; if the substrate pad temperature under heat input continues to rise above the preset safety threshold, the current welding action is immediately interrupted, and the oxide layer removal operation is retried after the substrate pad temperature drops back to the lower limit of the reflow peak temperature constraint condition.

[0014] In a second aspect, this application provides a sensor pin welding control system, wherein the system comprises: a welding environment parameter acquisition module: acquiring welding environment parameters including pin material, diameter, oxidation degree, and substrate pad temperature based on the sensor pin, and determining basic welding parameters through multi-dimensional feature analysis of the initial pin state; a dynamic correction module: setting a welding control parameter matrix based on the basic welding parameters and in conjunction with a first welding execution command sequence and a second welding execution command sequence, and dynamically correcting the welding path using the welding control parameter matrix; and a welding control module: simultaneously restarting the welding process and compensating for solder joint formation quality after the basic welding parameter correction according to the dynamically retreated welding execution path.

[0015] In summary, one or more technical solutions provided in this application achieve the following technical effects: determining basic welding parameters, accurately matching welding conditions with material properties and real-time environment, dynamically correcting welding paths by combining welding control parameter matrix, improving welding alignment accuracy, restarting the process and compensating for weld point formation quality after parameter correction, thereby improving welding yield and product consistency. Attached Figure Description

[0016] Figure 1 This application provides a flowchart illustrating a sensor pin welding control method.

[0017] Figure 2 This application provides a schematic diagram of a sensor pin welding control system.

[0018] Explanation of reference numerals in the attached diagram: Welding environment parameter acquisition module M100, dynamic correction module M200, welding control module M300. Detailed Implementation

[0019] Example 1: The present application will be described in detail below with reference to the accompanying drawings, as follows... Figure 1 As shown, this application provides a sensor pin soldering control method, wherein the method includes: S1: Based on the sensor pins, obtain welding environment parameters including pin material, diameter, oxidation level, and substrate pad temperature, and determine basic welding parameters through multi-dimensional feature analysis of the initial pin state.

[0020] Specifically, welding environment parameters refer to various external conditions that affect welding quality during the welding process, including lead material (copper, aluminum, etc.), diameter, thickness and state of oxide layer on lead surface, degree of oxidation, and substrate pad temperature. Welding environment parameters directly affect heat conduction, wettability, and solder flow during the welding process. Initial lead state refers to the original state of the lead before welding, including lead perpendicularity deviation and lead plating, which determines the specific measures to be taken during welding to ensure welding quality. Multidimensional feature analysis refers to the comprehensive evaluation of multiple related features such as material, size, and degree of oxidation to determine the most suitable welding parameters.

[0021] Execution Steps: During the soldering process, soldering environment parameters are acquired, including lead material, diameter, oxidation level, and substrate pad temperature. Specifically, a spectral analyzer is used to determine the lead material, a laser rangefinder to measure the diameter, an oxide layer thickness gauge to determine the oxidation level, and thermocouples to measure the substrate pad temperature. Further, multi-dimensional feature analysis is used to determine basic soldering parameters. Specifically, copper leads have higher thermal conductivity and require higher heat input; larger diameter leads require longer soldering times and higher temperatures; and leads with higher oxidation levels require longer preheating times and stronger flux activity. Real-time monitoring of the substrate pad temperature ensures temperature stability during soldering, preventing soldering defects caused by excessively high or low temperatures. These steps acquire soldering environment parameters and determine basic soldering parameters, providing a data foundation for subsequent soldering processes.

[0022] S2: Based on the basic welding parameters, a welding control parameter matrix is ​​set in combination with the first welding execution command sequence and the second welding execution command sequence, and the welding path is dynamically corrected using the welding control parameter matrix; S3: At the same time, the welding process is restarted and the weld point forming quality is compensated after the basic welding parameters are corrected according to the dynamic retreat welding execution path.

[0023] Specifically, the welding control parameter matrix is ​​a collection of various welding parameters. It combines basic welding parameters such as welding current, voltage, and time with welding execution command sequences for dynamic parameter control. The welding control parameter matrix can be adjusted based on real-time welding environment parameters and feedback information during the welding process to ensure the accuracy and stability of the welding process. The first welding execution command sequence is a compensation command sequence for the relative position deviation between the pin center and the PCB pad center, used to adjust the welding path and ensure precise alignment between the pin and the pad. The second welding execution command sequence is a compensation command sequence for the coplanarity error between the pin end face and the PCB pad surface, used to adjust the welding path and ensure coplanarity between the pin and the pad, avoiding height inconsistencies during the welding process. During the welding process, if abnormal situations such as excessive temperature or poor solder joint formation occur, the system will automatically switch to a dynamic retreat welding execution path, temporarily stopping the welding action for necessary adjustments and corrections. The dynamic retreat welding execution path allows the system to safely retreat in abnormal situations, avoiding further welding defects.

[0024] Execution steps: Based on the basic welding parameters, and combined with the first and second welding execution command sequences, a welding control parameter matrix is ​​set. Specifically, the welding control parameter matrix dynamically adjusts the welding path according to real-time welding environment parameters and feedback information from the vision positioning unit. Furthermore, if the vision positioning unit detects X-axis and Y-axis deviations between the pin center and the PCB pad center, the first welding execution command sequence generates corresponding compensation commands to adjust the welding path and ensure precise alignment between the pin and the pad. Similarly, if the vision positioning unit detects Z-axis coplanarity errors between the pin end face and the PCB pad surface, the second welding execution command sequence generates corresponding compensation commands to adjust the height of the welding path and ensure coplanarity of the welding.

[0025] Simultaneously, various parameters during the welding process are monitored in real time, such as substrate pad temperature, welding current, and voltage. If an abnormality is detected, such as the substrate pad temperature exceeding a preset safety threshold, the system immediately switches to a dynamic retreat welding execution path. Under the dynamic retreat welding execution path, the system temporarily stops the welding action, makes necessary adjustments and corrections, and further, if the temperature is too high, reduces the heat input power. After the temperature drops back to a safe range, the welding process is restarted, and welding is performed according to the corrected basic welding parameters. This not only avoids welding defects caused by abnormalities but also ensures the consistency of welding quality through solder joint formation quality compensation. In the above steps, by dynamically correcting the welding path and the abnormality handling mechanism, and by setting a dynamic retreat welding execution path, welding defects caused by abnormalities can be effectively reduced, and welding alignment accuracy and welding quality consistency can be significantly improved.

[0026] Furthermore, by combining the first welding execution command sequence and the second welding execution command sequence to set the welding control parameter matrix, the method of this application includes: Based on the visual positioning unit, the relative positional deviation between the sensor pin center and the PCB pad center is analyzed using the X-axis translation compensation amount and the Y-axis translation compensation amount to determine the first welding execution command sequence.

[0027] Specifically, the vision positioning unit is typically equipped with a high-resolution camera and image processing software to detect and analyze the relative position of the sensor pins and PCB pads in real time. It can accurately measure the deviation between the pin center and the pad center in the X-axis direction and the Y-axis direction. The X-axis translation compensation amount and Y-axis translation compensation amount are the deviation values ​​between the pin center and the pad center in the corresponding coordinate axis directions detected by the vision positioning unit. The X-axis and Y-axis translation compensation amounts are used to adjust the positional deviation of the pin in the horizontal direction. The first welding execution instruction sequence refers to a series of instructions generated based on the deviation values ​​detected by the vision positioning unit, which are used to adjust the welding path to ensure the precise alignment of the pins and pads, including parameters such as the direction of movement, distance of movement, and speed of the welding head.

[0028] Execution steps: The vision positioning unit performs real-time detection of the sensor pins and PCB pads, captures images of the pins and pads using a high-resolution camera, and calculates the relative positional deviations of the pin center and pad center along the X-axis and Y-axis using image processing algorithms. Based on these compensation values, a first welding execution command sequence is generated. This sequence guides the welding head to move and adjust accordingly to ensure precise alignment between the pins and pads. In these steps, real-time detection and dynamic adjustment of the welding path improve welding alignment accuracy, achieving high-precision alignment, reducing the risk of cold solder joints and improving welding yield and product reliability.

[0029] Furthermore, the method of this application includes: Based on the visual positioning unit, the coplanarity error between the sensor pin end face and the PCB pad surface is analyzed by the Z-axis height adjustment amount to determine the second welding execution command sequence.

[0030] Specifically, coplanarity error refers to the height difference between the sensor pin end face and the PCB pad surface in the Z-axis direction. During the soldering process, the pin end face and the pad surface need to be kept on the same plane to ensure soldering quality and solder joint reliability. The existence of coplanarity error leads to poor contact between the pin and the pad during soldering, thereby causing soldering defects. The Z-axis height adjustment amount is used to adjust the position deviation of the pin in the vertical direction. The second soldering execution command sequence refers to a series of commands generated based on the coplanarity error detected by the vision positioning unit, which are used to adjust the soldering path to ensure the coplanarity of the pin end face and the pad surface, including parameters such as Z-axis height adjustment of the soldering head, soldering time, and soldering temperature adjustment.

[0031] Execution steps: The vision positioning unit detects the coplanarity error between the pin end face and the pad surface. Specifically, it measures the height difference between the pin end face and the pad surface in the Z-axis direction and converts this height difference into a specific Z-axis height adjustment amount. Based on these measurement results, a second welding execution command sequence is generated. This sequence guides the welding head to make corresponding adjustments. During the welding process, the welding head adjusts the Z-axis height to keep the pin end face and the pad surface on the same plane. Furthermore, the welding time and temperature are adjusted according to the magnitude of the coplanarity error to ensure the stability of the welding process and the quality of the solder joints. In the above steps, by real-time detection and dynamic adjustment of the welding path, the coplanarity of the pin end face and the pad surface is ensured, thereby improving welding quality and solder joint reliability.

[0032] Furthermore, the method of this application includes: Based on the welding environment parameters, a multi-factor coupling influence set is constructed; after detecting that the substrate pad temperature triggers an over-temperature command due to the thermal coupling response time, the power adjustment range of the heat input is set based on the correlation coefficient between the thermal conductivity corresponding to the pin material and the heat capacity parameter corresponding to the diameter size in the multi-factor coupling influence set.

[0033] Specifically, the multi-factor coupling effect set is a collection of multiple parameters that affect the soldering process, including the thermal conductivity of the pin material, the heat capacity of the diameter, the wetting resistance coefficient of the oxidation degree, and the thermal coupling response time of the substrate pad temperature. These parameters interact and are correlated with each other, jointly affecting the heat input and solder joint formation quality during the soldering process. The thermal coupling response time refers to the response time of the substrate pad to the heat input during the soldering process. When the heat input causes the substrate pad temperature to rise, the thermal coupling response time refers to the time from the start of the heat input to the substrate pad temperature reaching a certain threshold, which is used to monitor the heat transfer efficiency and stability during the soldering process.

[0034] The over-temperature command is a command triggered by the system when the temperature of the substrate pads exceeds a preset safety threshold. It is used to notify the system to make necessary adjustments to prevent overheating from causing welding defects or damaging the substrate. The heat input power adjustment range refers to adjusting the magnitude of the heat input power during the welding process based on the parameter relationships in the multi-factor coupling effect set. The heat input power adjustment range is determined based on the correlation coefficient between the thermal conductivity of the pin material and the heat capacity of the diameter size to ensure that the heat input during the welding process matches the material properties.

[0035] Execution steps: Construct a multi-factor coupling influence set based on welding environment parameters. The multi-factor coupling influence set includes the thermal conductivity of the pin material, the heat capacity of the diameter, the wetting resistance coefficient of the oxidation degree, and the thermal coupling response time of the substrate pad temperature. Specifically, for copper pins, the thermal conductivity is high, while pins with larger diameters have larger heat capacity. These parameters interact with each other and jointly affect the heat input and solder joint formation quality during the welding process.

[0036] During the soldering process, the substrate pad temperature is monitored in real time. When an over-temperature command is triggered due to the thermal coupling response time, adjustments are made based on the parameter relationships in the multi-factor coupling effect set. Specifically, the power adjustment range of the heat input is set based on the correlation coefficient between the thermal conductivity of the pin material and the heat capacity parameter of the diameter. Furthermore, if the thermal conductivity of the pin material is high and the diameter is large, the heat input power is appropriately reduced to prevent the substrate pad temperature from becoming too high; conversely, if the thermal conductivity of the pin material is low and the diameter is small, the heat input power is appropriately increased to ensure the stability of the soldering process. In the above steps, by dynamically adjusting the heat input power, it is ensured that the heat input during the soldering process matches the material properties, thereby improving the soldering quality and the reliability of the solder joints.

[0037] Furthermore, based on the aforementioned welding environment parameters, a multi-factor coupled influence set is constructed. The method of this application includes: The thermal conductivity corresponding to the pin material, the heat capacity parameter corresponding to the diameter size, the wetting resistance coefficient corresponding to the oxidation degree, and the thermal coupling response time corresponding to the substrate pad temperature are correlated and modeled to obtain the multi-factor coupling influence set.

[0038] Specifically, thermal conductivity is used to assess a material's ability to conduct heat, typically measured in watts per meter Kelvin. The thermal conductivity of the pin material determines the rate at which heat is transferred within the pin. Heat capacity is used to assess a material's ability to absorb or release heat, typically measured in joules per kilogram Kelvin. The heat capacity parameter corresponding to the diameter size reflects the pin's ability to absorb and release heat during soldering. The wetting resistance coefficient describes the degree of influence of the oxide layer on the pin surface on the solder's wettability. Generally, a higher wetting resistance coefficient means that the solder has poor wettability on the pin surface, requiring more heat and time to overcome the oxide layer's resistance. Thermal coupling response time refers to the response time of the substrate pad temperature to the heat input, reflecting the rate at which the substrate pad absorbs and transfers heat during soldering. Correlation modeling refers to linking multiple related parameters through mathematical models to describe their interactions and influences, used to predict and optimize heat input and solder joint formation quality during the soldering process.

[0039] Execution steps: A correlation model is performed to model the thermal conductivity of the pin material, the heat capacity parameter of the diameter, the wetting resistance coefficient of the oxidation degree, and the thermal coupling response time of the substrate pad temperature. Specifically, parameters such as the thermal conductivity of the pin material, the heat capacity parameter of the diameter, the wetting resistance coefficient of the oxidation degree, and the thermal coupling response time of the substrate pad temperature are obtained through experimental measurements and theoretical calculations. These parameters are then correlated using a mathematical model. Furthermore, a linear or nonlinear model is established to describe the relationship between thermal conductivity, heat capacity, wetting resistance coefficient, and thermal coupling response time. The accuracy of the model is verified through data, and the model parameters are adjusted until the model's predictions match the experimental data. In the above steps, correlation modeling integrates multiple parameters affecting the welding process, forming a multi-factor coupling influence set. This multi-factor coupling influence set is used to dynamically adjust the heat input during the welding process, ensuring the stability of the welding process and the quality of the solder joints.

[0040] Furthermore, the method of this application includes: Upload the flux spraying amount and simultaneously adjust the heating slope of the preheating stage according to the real-time change rate of the substrate pad temperature: dynamically match the heat input and material response characteristics, the heat input and flux activity window have temporal consistency, and perform oxide layer removal operation before the solder melts.

[0041] Specifically, flux spray amount refers to the amount of flux sprayed onto the soldering area during the soldering process. The role of flux is to remove the oxide layer on the surface of the pins and pads, prevent oxidation during the soldering process, and thus ensure that the solder can be well wetted and adhered. The heating slope refers to the rate at which the temperature of the substrate pads rises over time during the preheating stage. The heating slope is crucial for controlling the heat input during the soldering process because it affects the melting rate of the solder and the soldering quality.

[0042] Material response characteristics refer to the way soldering materials such as leads, pads, and solder respond to heat input during the soldering process. These characteristics include properties such as thermal conductivity, heat capacity, and melting point, which determine the temperature and physical state changes of the material during soldering. The flux activity window refers to the time interval within which the flux exhibits optimal activity within a specific temperature range. Within this window, the flux effectively removes oxide layers and prevents oxidation, improving soldering quality. Timing consistency refers to the degree of temporal matching between heat input and the flux activity window. Ensuring synchronization between heat input and the flux activity window maximizes flux activity, improving soldering efficiency and quality.

[0043] Execution steps: Upload flux application amount to ensure sufficient flux in the soldering area to remove oxide layer; dynamically adjust the heating slope during the preheating stage based on the real-time temperature change rate of the substrate pads; monitor the temperature change of the substrate pads in real time using sensors and adjust the heating rate during the preheating stage based on this data to ensure the stability of the soldering process and the quality of the solder joints; specifically, if the real-time temperature change rate of the substrate pads shows that the temperature rises too quickly, automatically reduce the heating slope to prevent excessive temperature from causing soldering defects; conversely, if the temperature rises too slowly, appropriately increase the heating slope to ensure the efficiency of the soldering process.

[0044] Simultaneously, dynamically matching heat input with material response characteristics ensures temporal consistency between heat input and flux activity window. This means that adjusting heat input must consider not only the material's thermal conductivity and heat capacity but also ensure the flux functions within its optimal activity window. Before solder melts, an oxide layer removal operation is performed to ensure a clean solder surface, preventing premature flux evaporation due to excessively rapid heating or carbonization due to excessively slow heating, thus improving the interfacial bonding quality of the solder joint. In the above steps, by dynamically adjusting the heating slope and heat input during the preheating stage, the temperature control during the welding process is ensured to match the flux activity, thereby improving welding quality and solder joint reliability.

[0045] Furthermore, the method of this application includes: The initial pin state includes pin perpendicularity deviation and pin plating; based on the pin perpendicularity deviation in the initial pin state, the Z-axis pressing trajectory is corrected, the welding control parameter matrix is ​​dynamically updated, and the tilt compensation command is integrated into the Z-axis pressing sub-sequence.

[0046] Specifically, pin perpendicularity deviation refers to the angle of deviation of the pin from the ideal vertical direction before soldering. Pin perpendicularity deviation affects the contact quality between the pin and the pad during soldering, thus affecting the soldering effect. Pin plating refers to the metal coating on the pin surface, such as tin plating or gold plating. The type and thickness of the plating affect the wettability and thermal conductivity during soldering. Z-axis pressing trajectory refers to the movement path of the soldering head along the Z-axis during soldering. The Z-axis pressing trajectory determines the contact method and pressure distribution between the soldering head and the pin and pad.

[0047] The welding control parameter matrix is ​​dynamically updated. Specifically, the welding control parameter matrix is ​​adjusted and updated based on the real-time detected welding environment parameters and initial pin status to ensure that the welding parameters can adapt to changes in the welding process, thereby improving welding quality. The tilt compensation command is a command generated based on the pin perpendicularity deviation. It is used to adjust the Z-axis pressing trajectory of the welding head to compensate for the pin tilt angle. The tilt compensation command is integrated into the Z-axis pressing sub-sequence to ensure that the welding head can correctly contact the pin and pad.

[0048] Execution steps: Detect the initial pin status, including pin perpendicularity deviation and pin plating. Determine the pin perpendicularity deviation using a vision positioning unit or laser measurement equipment. Based on the tilt compensation command, correct the Z-axis pressing trajectory. Specifically, when the soldering head moves along the Z-axis, adjust its movement path according to the tilt compensation command to compensate for the pin tilt, ensuring that the soldering head can correctly contact the pin and pad.

[0049] Simultaneously, the welding control parameter matrix is ​​dynamically updated, including adjusting the welding head's movement speed, pressure distribution, and other relevant parameters to ensure the stability of the welding process and the quality of the solder joints. Furthermore, the type and thickness of the pin plating also affect the welding process; specifically, tin-plated pins require higher temperatures and shorter welding times, while gold-plated pins require lower temperatures and longer welding times. Based on the type and thickness of the pin plating, relevant parameters in the welding control parameter matrix are adjusted to ensure the stability of the welding process and the quality of the solder joints. In the above steps, by dynamically adjusting the Z-axis pressing trajectory and the welding control parameter matrix, it is ensured that the welding head can correctly contact the pins and pads, thereby improving welding quality and the reliability of the solder joints.

[0050] Furthermore, the method of this application also includes: Based on the pin plating in the initial pin state, the solder alloy composition and welding temperature curve are matched, and welding duration constraints are configured for the metal plating. The reflow peak temperature constraint is configured for the tin plating. Based on the welding duration constraint and reflow peak temperature constraint, combined with the power adjustment range of the heat input, the welding duration is flexibly shortened and the heating target value is lowered.

[0051] Specifically, pin plating refers to the metal coating on the pin surface, such as tin plating or gold plating. The type and thickness of the plating affect the wettability and thermal conductivity during the soldering process. Solder alloy composition refers to the specific composition of the alloy material used for soldering, such as tin-silver-copper alloy. Different alloy compositions have different melting points, wettability, and thermal conductivity. Soldering temperature profile refers to the temperature change curve over time during the soldering process, including the preheating stage, the holding stage, and the cooling stage. The soldering temperature profile determines the heat input and solder joint formation quality during the soldering process.

[0052] The welding duration constraint sets upper and lower limits for the welding duration based on the type and thickness of the pin plating. This constraint ensures the welding time remains within a suitable range to avoid welding defects. The reflow peak temperature constraint sets upper and lower limits for the reflow peak temperature during the welding process, also based on the type and thickness of the pin plating. This constraint ensures the welding temperature remains within a suitable range to avoid welding defects. The flexible shortening of the welding duration involves dynamically adjusting the welding duration based on real-time monitoring data during the welding process, minimizing it while still meeting welding quality requirements. Finally, the reduction of the target heating value involves dynamically adjusting the target heating temperature based on real-time monitoring data during the welding process, lowering it as much as possible while still meeting welding quality requirements.

[0053] Execution steps: Based on the pin plating in the initial pin state, match the solder alloy composition with the soldering temperature profile. Specifically, if the pin plating is tin-plated, select a suitable solder alloy composition and corresponding soldering temperature profile. The solder alloy composition is such as SAC305, which is 96.5% tin, 3% silver, and 0.5% copper. The soldering temperature profile typically includes a preheating stage, a holding stage, and a cooling stage. The temperature and time of each stage are precisely designed to ensure soldering quality. Based on the type and thickness of the pin plating, configure soldering duration constraints and reflow peak temperature constraints. These constraints ensure that the soldering process is carried out within appropriate parameter ranges, avoiding soldering defects caused by excessive time or temperature.

[0054] It is important to understand that brittle intermetallic compounds are formed during the soldering process through the interaction between the solder and the lead metal. These compounds typically exhibit high hardness and brittleness, leading to a decrease in the mechanical properties of the weld joint and affecting weld quality. Preferably, based on constraints on the soldering duration and reflow peak temperature, and combined with adjustments to the heat input power, the soldering duration is flexibly shortened and the target heating value is lowered. Specifically, if a rapid temperature rise is detected during the soldering process, the soldering duration is appropriately shortened and the target heating temperature is reduced. This dynamic adjustment ensures the stability of the soldering process and the quality of the weld joint, while simultaneously suppressing the formation of brittle intermetallic compounds. In these steps, by dynamically adjusting the soldering duration and target heating temperature, the soldering process is ensured to occur within a suitable parameter range, thereby improving soldering yield and product reliability.

[0055] Furthermore, by flexibly shortening the welding duration and lowering the target heating value, the method of this application includes: The Z-axis pressing sequence corresponding to the tilt compensation command is called and combined with the first welding execution command sequence and the second welding execution command sequence to generate a dynamic retreat welding execution path. If the substrate pad temperature under heat input continues to rise above the preset safety threshold, the current welding action is immediately interrupted. After the substrate pad temperature drops back to the lower limit of the reflow peak temperature constraint condition, the oxide layer removal operation is retried.

[0056] Specifically, the Z-axis pressing sequence corresponding to the tilt compensation command is a command sequence generated based on the pin perpendicularity deviation. It is used to adjust the pressing trajectory of the welding head in the Z-axis direction to compensate for the pin tilt angle. The Z-axis pressing sequence ensures that the welding head can correctly contact the pin and pad. During the welding process, if abnormal conditions such as excessive temperature occur, the system will switch to the dynamic retreat welding execution path, temporarily stop the welding action, and make necessary adjustments and corrections. The dynamic retreat welding execution path allows the system to safely retreat in abnormal conditions and avoid further welding defects.

[0057] The first welding execution command sequence is a compensation command sequence for the relative positional deviation between the pin center and the PCB pad center, used to adjust the welding path and ensure precise alignment between the pin and the pad. The second welding execution command sequence is a compensation command sequence for the coplanarity error between the pin end face and the PCB pad surface, used to adjust the welding path and ensure coplanarity between the pin and the pad. When the substrate pad temperature exceeds a preset safety threshold, a safety mechanism is triggered to interrupt the welding operation to prevent welding defects or damage to the substrate caused by excessive temperature. The reflow peak temperature constraint lower limit is specifically set according to the welding process requirements. When the substrate pad temperature drops below this temperature, the welding operation is restarted. The oxide layer removal operation refers to the removal of the oxide layer on the pin and pad surface through flux and heat input during the welding process to ensure good wetting and adhesion of the solder.

[0058] Execution steps: The Z-axis pressing sequence corresponding to the tilt compensation instruction is invoked and combined with the first and second welding execution instruction sequences to generate a dynamic retreat welding execution path. This dynamic retreat welding execution path integrates compensation for pin perpendicularity deviation, positional deviation, and coplanarity error, ensuring the welding head can correctly contact the pins and pads. During welding, the substrate pad temperature is monitored in real time: if heat input causes the substrate pad temperature to rise continuously above a preset safety threshold, the current welding action is immediately interrupted, switching to the dynamic retreat welding execution path. Welding is paused, waiting for the substrate pad temperature to drop back to the reflow peak temperature constraint limit. Once the substrate pad temperature returns to a safe range, the oxide layer removal operation is retried. This operation uses flux and appropriate heat input to remove the oxide layer from the pin and pad surfaces, ensuring a clean welding surface and improving welding quality. In the above steps, the dynamic retreat welding execution path and temperature monitoring mechanism ensure that the welding process is executed under continuous, safe, and stable conditions.

[0059] In summary, the beneficial effects of the embodiments of this application are: This application provides a sensor pin welding control method and system. It achieves the following technical effects: determining welding environment parameters, including pin material, diameter, oxidation level, and substrate pad temperature, based on the sensor pins; determining basic welding parameters through multi-dimensional feature analysis of the initial pin state; setting a welding control parameter matrix based on the basic welding parameters and combining it with a first welding execution command sequence and a second welding execution command sequence; dynamically correcting the welding path using the welding control parameter matrix; and restarting the welding process and compensating for solder joint formation quality after the basic welding parameter correction according to the dynamically retreated welding execution path.

[0060] Example 2, based on the same inventive concept as the sensor pin welding control method in the foregoing examples, such as... Figure 2 As shown in the figure, this application embodiment provides a sensor pin welding control system, wherein the system includes: The welding environment parameter acquisition module M100 acquires welding environment parameters, including pin material, diameter, oxidation level, and substrate pad temperature, based on the sensor pins. It determines the basic welding parameters through multi-dimensional feature analysis of the initial pin state.

[0061] Dynamic correction module M200: Based on the basic welding parameters, and combined with the first welding execution command sequence and the second welding execution command sequence, a welding control parameter matrix is ​​set, and the welding path is dynamically corrected using the welding control parameter matrix.

[0062] Welding control module M300: Simultaneously, it restarts the welding process and compensates for weld point formation quality after correcting the basic welding parameters according to the dynamic retreat welding execution path.

[0063] Furthermore, the dynamic correction module M200 is used to perform the following method: Based on the visual positioning unit, the relative positional deviation between the sensor pin center and the PCB pad center is analyzed using the X-axis translation compensation amount and the Y-axis translation compensation amount to determine the first welding execution command sequence.

[0064] Furthermore, the dynamic correction module M200 is used to perform the following method: Based on the visual positioning unit, the coplanarity error between the sensor pin end face and the PCB pad surface is analyzed by the Z-axis height adjustment amount to determine the second welding execution command sequence.

[0065] Furthermore, the welding environment parameter acquisition module M100 is also used to perform the following method: Based on the welding environment parameters, a multi-factor coupling influence set is constructed; after detecting that the substrate pad temperature triggers an over-temperature command due to the thermal coupling response time, the power adjustment range of the heat input is set based on the correlation coefficient between the thermal conductivity corresponding to the pin material and the heat capacity parameter corresponding to the diameter size in the multi-factor coupling influence set.

[0066] Furthermore, the welding environment parameter acquisition module M100 is also used to perform the following method: The thermal conductivity corresponding to the pin material, the heat capacity parameter corresponding to the diameter size, the wetting resistance coefficient corresponding to the oxidation degree, and the thermal coupling response time corresponding to the substrate pad temperature are correlated and modeled to obtain the multi-factor coupling influence set.

[0067] Furthermore, the welding environment parameter acquisition module M100 is also used to perform the following method: Upload the flux spraying amount and simultaneously adjust the heating slope of the preheating stage according to the real-time change rate of the substrate pad temperature: dynamically match the heat input and material response characteristics, the heat input and flux activity window have temporal consistency, and perform oxide layer removal operation before the solder melts.

[0068] Furthermore, the dynamic correction module M200 is also used to perform the following method: The initial pin state includes pin perpendicularity deviation and pin plating; based on the pin perpendicularity deviation in the initial pin state, the Z-axis pressing trajectory is corrected, the welding control parameter matrix is ​​dynamically updated, and the tilt compensation command is integrated into the Z-axis pressing sub-sequence.

[0069] Furthermore, the dynamic correction module M200 is also used to perform the following method: Based on the pin plating in the initial pin state, the solder alloy composition and welding temperature curve are matched, and welding duration constraints are configured for the metal plating. The reflow peak temperature constraint is configured for the tin plating. Based on the welding duration constraint and reflow peak temperature constraint, combined with the power adjustment range of the heat input, the welding duration is flexibly shortened and the heating target value is lowered.

[0070] Furthermore, the welding control module M300 is also used to perform the following methods: The Z-axis pressing sequence corresponding to the tilt compensation command is called and combined with the first welding execution command sequence and the second welding execution command sequence to generate a dynamic retreat welding execution path. If the substrate pad temperature under heat input continues to rise above the preset safety threshold, the current welding action is immediately interrupted. After the substrate pad temperature drops back to the lower limit of the reflow peak temperature constraint condition, the oxide layer removal operation is retried.

[0071] In summary, any step can be stored as a computer instruction or program in an unrestricted computer memory and can be called and recognized by an unrestricted computer processor; no further restrictions are imposed here.

[0072] Furthermore, the above technical solutions only embody the preferred technical solutions of the embodiments of this application. Any changes that those skilled in the art may make to certain parts of these solutions embody the novel principles of the embodiments of this application. Obviously, those skilled in the art can make various modifications and variations to this application without departing from the scope of this application.

Claims

1. A method for controlling the soldering of sensor pins, characterized in that, The method includes: Based on the sensor pins, welding environment parameters including pin material, diameter, oxidation degree, and substrate pad temperature are obtained. Basic welding parameters are determined through multi-dimensional feature analysis of the initial pin state, which includes pin perpendicularity deviation and pin plating. Based on the aforementioned basic welding parameters, a welding control parameter matrix is ​​set in combination with the first welding execution command sequence and the second welding execution command sequence, and the welding path is dynamically corrected using the welding control parameter matrix. Simultaneously, the welding process is restarted and the weld point formation quality is compensated after the basic welding parameters are corrected according to the dynamic retreat welding execution path. The method further includes: Based on the pin plating in the initial pin state, the solder alloy composition and welding temperature curve are matched, welding duration constraints are configured for the metal plating, and reflow peak temperature constraints are configured for the optimized reflow peak temperature of the tin plating. Based on the aforementioned welding duration constraints and reflow peak temperature constraints, and combined with the power adjustment range of the heat input, the welding duration is flexibly shortened and the heating target value is lowered. The method of flexibly shortening the welding duration and lowering the target heating value includes: The Z-axis pressing sequence corresponding to the tilt compensation instruction is called and combined with the first welding execution instruction sequence and the second welding execution instruction sequence to generate a dynamic retreat welding execution path; If the substrate pad temperature under heat input continues to rise above the preset safety threshold, the current soldering operation will be immediately interrupted. After the substrate pad temperature drops back to the lower limit of the reflow peak temperature constraint, the oxide layer removal operation will be triggered again.

2. The sensor pin soldering control method as described in claim 1, characterized in that, The method for setting a welding control parameter matrix by combining a first welding execution command sequence and a second welding execution command sequence includes: Based on the visual positioning unit, the relative positional deviation between the sensor pin center and the PCB pad center is analyzed using the X-axis translation compensation amount and the Y-axis translation compensation amount to determine the first welding execution command sequence.

3. The sensor pin welding control method as described in claim 2, characterized in that, The method includes: Based on the visual positioning unit, the coplanarity error between the sensor pin end face and the PCB pad surface is analyzed by the Z-axis height adjustment amount to determine the second welding execution command sequence.

4. The sensor pin welding control method as described in claim 1, characterized in that, The method includes: Based on the aforementioned welding environment parameters, a multi-factor coupling influence set is constructed; After detecting that the temperature of the substrate pads is triggered by the thermal coupling response time, an over-temperature command is set, and then the power adjustment range of the heat input is set based on the correlation coefficient between the thermal conductivity of the pin material and the heat capacity parameter corresponding to the diameter size in the multi-factor coupling influence set.

5. The sensor pin soldering control method as described in claim 4, characterized in that, Based on the welding environment parameters, a multi-factor coupled influence set is constructed, the method comprising: The thermal conductivity corresponding to the pin material, the heat capacity parameter corresponding to the diameter size, the wetting resistance coefficient corresponding to the oxidation degree, and the thermal coupling response time corresponding to the substrate pad temperature are correlated and modeled to obtain the multi-factor coupling influence set.

6. The sensor pin soldering control method as described in claim 5, characterized in that, The method includes: Upload the flux spraying amount and simultaneously adjust the heating slope of the preheating stage according to the real-time change rate of the substrate pad temperature: dynamically match the heat input and material response characteristics, the heat input and flux activity window have temporal consistency, and perform oxide layer removal operation before the solder melts.

7. The sensor pin welding control method as described in claim 6, characterized in that, Based on the pin perpendicularity deviation in the initial pin state, the Z-axis pressing trajectory is corrected, the welding control parameter matrix is ​​dynamically updated, and the tilt compensation command is integrated into the Z-axis pressing sub-sequence.

8. A sensor pin welding control system, characterized in that, The system comprising the steps for implementing a sensor pin soldering control method according to any one of claims 1-7, wherein the system includes: Welding environment parameter acquisition module: Based on the sensor pins, it acquires welding environment parameters including pin material, diameter, oxidation degree and substrate pad temperature, and determines basic welding parameters through multi-dimensional feature analysis of the initial pin state; Dynamic correction module: Based on the basic welding parameters, a welding control parameter matrix is ​​set in combination with the first welding execution command sequence and the second welding execution command sequence, and the welding path is dynamically corrected using the welding control parameter matrix; Welding control module: Simultaneously, the welding process is restarted and the weld formation quality is compensated after the basic welding parameters are corrected according to the dynamic retreat welding execution path; The dynamic correction module is also used to perform the following methods: Based on the pin plating in the initial pin state, the solder alloy composition and welding temperature curve are matched, welding duration constraints are configured for the metal plating, and reflow peak temperature constraints are configured for the optimized reflow peak temperature of the tin plating. Based on the aforementioned welding duration constraints and reflow peak temperature constraints, and combined with the power adjustment range of the heat input, the welding duration is flexibly shortened and the heating target value is lowered. The welding control module is used to perform the following methods: The Z-axis pressing sequence corresponding to the tilt compensation command is invoked and combined with the first welding execution command sequence and the second welding execution command sequence to generate a dynamic retreat welding execution path. If the substrate pad temperature under heat input continues to rise above the preset safety threshold, the current soldering operation will be immediately interrupted. After the substrate pad temperature drops back to the lower limit of the reflow peak temperature constraint, the oxide layer removal operation will be retried.

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