Tile-type phased-array antenna based on glass substrate and preparation method of tile-type phased-array antenna

Abstract

The invention provides a tile-type phased-array antenna based on a glass substrate and a preparation method thereof, and relates to the technical field of communication. According to the invention, the first feed signal holes and the second feed signal holes are formed in the plurality of glass base layers, and the plurality of glass base layers are stacked in a laser bonding manner to form the integrated structure, that is, the plurality of glass base layers are firstly punched and then stacked, so that complex staggered holes can be formed; the technology that staggered holes of a traditional PCB multi-layer board are difficult to form, the number of times of pressing is large, the waste board rate is high due to the multiple staggered holes, and blind buried holes need back drilling, hole plugging and flat plating and the like is broken through, and the cost is reduced. Besides, due to the fact that only the glass substrate is used and liquid crystal materials are not used, instability caused by liquid crystals is avoided, and stability of the tile-type phased-array antenna is improved.

Description

Technical Field

[0001] This invention relates to the field of communication technology, and in particular to a glass-based tile phased array antenna and its fabrication method. Background Technology

[0002] Satellite communication boasts numerous advantages, including wide coverage, long transmission distance, large communication capacity, high transmission quality, flexible and rapid networking, and high security, making it a highly competitive communication method today. In recent years, the development of low-Earth orbit (LEO) communication internet constellations has been rapid both domestically and internationally. my country has also included satellite internet in its "new infrastructure" initiative, with its operating frequency bands primarily concentrated in the Ka and Ku bands. Furthermore, with the rapid development of high-throughput satellite communication and broadband LEO satellite communication, advanced-packaged planar phased array antennas will become the mainstream development direction for mobile communication antennas in the future.

[0003] Traditional tile-type phased arrays have the following problems: 1. For tile-type phased arrays made of traditional PCB and SMT surface mount technology, the chip must be a packaged chip and bare chip cannot be used. 2. For PCB multilayer boards using traditional HDI process, the process accuracy is only 30um. For some fine patterns and fine lines, the thickness of different batches of boards may be difficult to control due to the expansion and contraction during PP lamination and the different residual copper ratios of adjacent boards. 3. Traditional PCBs cannot be designed with multiple staggered holes due to their drilling and lamination sequence. Generally, lamination of 3 or more times will lead to a high scrap rate and soaring costs. 4. Traditional glass substrates have problems such as excessive roughness and difficulty in controlling the shape when using through-hole interconnects, which affect signal integrity; 5. Traditional glass substrates have problems such as brittle materials causing substrate breakage and high scrap rate during multilayer bonding, excessively high process temperatures damaging chips and other devices, and limiting the integration of temperature-sensitive devices. Therefore, traditional processes only make the passive part of the antenna into a glass substrate and then connect the active part through methods such as ball planting. 6. Traditional liquid crystal phased arrays suffer from poor antenna performance due to the sensitivity of liquid crystal materials to voltage and temperature and their poor environmental adaptability. 7. The amplitude and phase control links of traditional liquid crystal phased arrays are too cumbersome, requiring additional space to be opened outside the antenna size range to make the amplitude and phase control links, which is not conducive to the arraying and miniaturization of multiple subarrays. Summary of the Invention

[0004] One objective of this invention is to provide a glass-based tile phased array antenna that solves the technical problems of high cost and low stability of existing tile phased arrays.

[0005] A further objective of this invention is to reduce the packaging cost of the chip.

[0006] Another object of the present invention is to provide a method for fabricating the above-described glass-based tile phased array antenna.

[0007] In particular, the present invention provides a glass-based tile-type phased array antenna, comprising, from top to bottom, an antenna radiating patch, multiple glass substrates, a TFT layer, and a chip device layer; The multiple glass substrates are stacked to form an integral structure by laser bonding, and include, from bottom to top, a ground / pad layer, a first feed signal hole, a feed network layer, a second feed signal hole, and a feed gap; The feed slot is coupled to the antenna radiating patch. The first feed signal aperture is used to realize the vertical interconnection between the ground / pad layer and the feed network layer. The second feed signal aperture is used to realize the vertical interconnection between the feed network layer and the feed slot. The feed network layer is used to perform linear polarization coupling on the feed slot from two orthogonal directions to form electromagnetic waves with specific polarization. The chip device layer includes an RF chip, which is integrated on the TFT layer and is used to amplify and phase-match the radio frequency signal transmitted through the feed network layer. The TFT layer is used to provide the control signals and power to the chip device layer.

[0008] Optionally, both the first power supply signal hole and the second power supply signal hole are through holes formed by TGV.

[0009] Optionally, the plurality of glass substrates include a first glass substrate, a second glass substrate, and a third glass substrate arranged sequentially from top to bottom, wherein the first glass substrate, the second glass substrate, and the third glass substrate are stacked and formed by laser bonding. The first glass substrate includes the antenna radiating patch and the feed gap, the second glass substrate includes the second feed signal hole and the feed network layer, and the third glass substrate includes the first feed signal hole and the ground / pad layer.

[0010] Optionally, the RF chip is integrated on the TFT layer via COB packaging.

[0011] Optionally, the chip device layer may also include other die devices, including power amplifiers, low-noise amplifiers, and DC-DC power conversion chips.

[0012] Optionally, the feed network layer includes a main feed line for distributing radio frequency energy and branch feed lines connected to the feed gaps in two orthogonal directions respectively. The path length difference between the main feed line and the branch feed lines corresponds to a ±90° phase difference, so as to achieve left- or right-hand circular polarization or 360° adjustable linear polarization.

[0013] Optionally, it also includes: A heat dissipation structure is disposed on the side of the chip device layer away from the TFT layer, and has multiple protrusions and heat dissipation cavities communicating with the protrusions. Each protrusion is attached to one of the RF chips or other die devices, thereby dissipating heat from the RF chip and the other die devices.

[0014] Optionally, it also includes: A power supply control connector, connected to the TFT layer, is used to supply power and provide control signals; An RF connector, connected to the power supply gap, is used to synthesize the signal processed by the RF chip and then export it through a synthesis network.

[0015] Optionally, each of the antenna radiating patches corresponds to two of the feed slots and one feed network, forming an antenna element, and each of the RF chips corresponds to four of the antenna elements.

[0016] In particular, the present invention also provides a method for fabricating a glass-based tile-type phased array antenna, which, using the above-mentioned tile-type phased array antenna, is characterized by comprising the following steps: The TGV method is used to drill holes in the second glass substrate and the third glass substrate respectively, so as to form a second power supply signal hole in the second glass substrate and a first power supply signal hole in the third glass substrate; The first and second feed signal holes are metallized using a metallization filling process. Metal layers are formed on the surfaces of the first glass substrate, the second glass substrate, and the third glass substrate respectively by a double-sided sputtering process; The metal layers of the first glass substrate, the second glass substrate, and the third glass substrate are etched into target patterns and pads using photolithography. The first glass substrate, the second glass substrate, and the third glass substrate are stacked using a laser bonding process to form an integral structure.

[0017] This invention forms first and second feed signal holes on multiple glass substrates, and stacks these glass substrates into a single structure using laser bonding. In other words, holes are drilled first, then the substrates are stacked, enabling the formation of complex interlaced holes. This overcomes the challenges of forming interlaced holes in traditional PCB multilayer boards, which often results in numerous lamination steps, high scrap rates, and the need for back drilling and plating processes for blind and buried vias, thus reducing costs. Furthermore, since only glass substrates are used, without liquid crystal materials, the instability caused by liquid crystals is eliminated, thereby improving the stability of the tile-type phased array antenna.

[0018] Furthermore, in this invention, the RF chip is integrated on the TFT layer using COB packaging. COB packaging technology is used to replace traditional SMT surface mount technology for assembling the RF chip. Traditional packaging involves first packaging the chip into a device and then mounting it onto the substrate. Compared to SMT, COB packaging directly integrates the chip onto the substrate, meaning that bare chips can be directly packaged, thereby reducing the cost of chip packaging.

[0019] The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments of the invention in conjunction with the accompanying drawings. Attached Figure Description

[0020] The following sections will describe some specific embodiments of the invention in detail by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or portions. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings: Figure 1 This is a schematic structural diagram of a glass-based tile-type phased array antenna according to an embodiment of the present invention; Figure 2 This is a schematic structural diagram of a glass-based tile phased array antenna according to another embodiment of the present invention; Figure 3 This is a schematic structural diagram of an antenna element according to an embodiment of the present invention; Figure 4 This is a schematic structural diagram of a single board with a watt-type phased array antenna according to an embodiment of the present invention; Figure 5 This is a schematic flowchart illustrating a method for fabricating a glass-based tile phased array antenna according to an embodiment of the present invention.

[0021] Figure label: 100-Wall phased array antenna based on glass substrate, 10-Antenna radiating patch, 20-Multiple glass substrates, 21-First glass substrate, 22-Second glass substrate, 23-Third glass substrate, 30-TFT layer, 40-Chip device layer, 211-Feed gap, 221-Second feed signal hole, 222-Feed network layer, 231-First feed signal hole, 232-Ground / pad layer, 41-RF chip, 42-Other bare die devices, 50-Heat dissipation structure, 51-Boss, 52-Heat dissipation cavity, 60-Antenna element, 70-RF connector, 80-Power supply control connector. Detailed Implementation

[0022] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0023] In the description of this invention, it should be understood that the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0024] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature, that is, include one or more of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. When a feature "includes or contains" one or more of the features it encompasses, unless otherwise specifically stated, this indicates that other features are not excluded and may be further included.

[0025] Unless otherwise expressly specified and limited, the terms "connection," "installation," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0026] Unless otherwise specified, all terms (including technical and scientific terms) used in the description of this embodiment have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0027] Figure 1 This is a schematic structural diagram of a glass-based tile-type phased array antenna 100 according to an embodiment of the present invention. Figure 1 As shown, in a specific embodiment, the glass-based tile-type phased array antenna 100 includes, from top to bottom, an antenna radiating patch 10, multiple glass substrates 20, a TFT layer 30, and a chip device layer 40. The multiple glass substrates 20 are stacked to form a single structure via laser bonding, and include, from bottom to top, a ground / pad layer 232, a first feed signal aperture 231, a feed network layer 222, a second feed signal aperture 221, and a feed slot 211. The feed slot 211 is coupled to the antenna radiating patch 10. The first feed signal aperture 231 is used to achieve vertical interconnection between the ground / pad layer 232 and the feed network layer 222. The second feed signal aperture 221 is used to achieve vertical interconnection between the feed network layer 222 and the feed slot 211. The feed network layer 222 is used to linearly polarize the feed slots 211 from two orthogonal directions to form electromagnetic waves with specific polarization. The chip device layer 40 includes an RF chip 41, which is integrated on the TFT layer 30 and is used to amplify and phase the radio frequency signals transmitted via the feed network layer 222. The TFT layer 30 provides control signals and power to the chip device layer 40. Here, the RF chip 41 can process the radio frequency signals and simultaneously split or synthesize 4, 8, or 16 signals.

[0028] This embodiment forms a first feed signal hole 231 and a second feed signal hole 221 on multiple glass substrates 20, and stacks the multiple glass substrates 20 into a single structure by laser bonding. In other words, holes are drilled first and then stacked, thus forming complex interlaced holes. This overcomes the difficulties in forming interlaced holes in traditional PCB multilayer boards, the high number of lamination steps and scrap rate caused by multiple interlaced holes, and the need for back drilling and plating processes for blind and buried holes, thereby reducing costs. The use of laser bonding technology solves the problems of excessive temperature and breakage / deformation during multilayer stacking of glass substrates. Furthermore, because a glass substrate is used and liquid crystal materials are not used, the instability caused by liquid crystals is eliminated, thereby improving the stability of the tile-type phased array antenna 100.

[0029] If drilling is only possible on a single layer of glass substrate, and multilayer glass substrates cannot be stacked, then only consumer-grade products with simple circuitry and layering can be produced. However, laser bonding technology, as the key to stacking multilayer glass substrates, makes the stacking and interconnection of multilayer glass substrates possible.

[0030] In some embodiments, both the first feed signal hole 231 and the second feed signal hole 221 are through holes formed by TGV. Specifically, TGV3.0 process is used for drilling to ensure the stability of the through hole processing and interconnection electrical performance. Interleaved holes and blind / buried holes can be used at will. Only by realizing arbitrary drilling and hole formation on glass substrate materials can the glass substrate be made possible as a phased array antenna substrate.

[0031] In some embodiments, the plurality of glass substrates 20 include a first glass substrate 21, a second glass substrate 22, and a third glass substrate 23 arranged sequentially from top to bottom, and the first glass substrate 21, the second glass substrate 22, and the third glass substrate 23 are stacked by laser bonding. The first glass substrate 21 includes an antenna radiating patch 10 and a feed slot 211, the second glass substrate 22 includes a second feed signal aperture 221 and a feed network layer 222, and the third glass substrate 23 includes a first feed signal aperture 231 and a ground / pad layer 232. In other embodiments, the number of glass substrates can be determined according to specific design requirements.

[0032] In some embodiments, the RF chip 41 is integrated on the TFT layer 30 using COB packaging. COB packaging technology replaces traditional SMT (Surface Mount Technology) for assembling the RF chip 41. Traditional packaging involves first packaging the chip into a device and then mounting it onto a substrate. COB packaging, compared to SMT, directly integrates the chip onto the substrate, meaning a bare chip can be directly packaged, thus reducing chip packaging costs. This embodiment uses a TFT circuit to provide control and power supply circuitry for the RF chip 41, with linewidth and line spacing below 5µm.

[0033] In this embodiment, the introduction of the RF chip 41 enables each radiation port of each antenna element 60 to control its amplitude and phase. Therefore, the amplitude and phase of the antenna elements 60 in the horizontal and vertical directions can be controlled independently to achieve two-dimensional scanning of the azimuth plane from 0 to 360°.

[0034] In some embodiments, the chip device layer 40 further includes other die devices 42, including power amplifiers, low-noise amplifiers, and DC-DC power conversion chips. Here, the other die devices 42 are also assembled onto the TFT layer 30 using COB packaging technology.

[0035] For traditional phased array antennas, the chip spacing is generally one wavelength of the antenna's operating frequency. For satellite communication phased arrays, the spacing varies from 26mm to 10mm (10.7-31GHz). Similarly, the limit for the hole spacing is generally 2mil-4mil (0.05mm-0.1mm) or higher to meet the processing limits of printed circuit boards, which is far lower than the 5um process limit between lines in TFT circuits.

[0036] In some embodiments, the feed network layer 222 includes a main feed line for distributing radio frequency energy and branch feed lines connected to two orthogonal feed gaps 211 respectively. The path length difference between the main feed line and the branch feed lines corresponds to a ±90° phase difference, so as to achieve left- or right-hand circular polarization or 360° adjustable linear polarization.

[0037] Figure 2 This is a schematic structural diagram of a glass-based tile-type phased array antenna 100 according to another embodiment of the present invention. Figure 2 As shown, in some embodiments, the glass-based Watt phased array antenna 100 further includes a heat dissipation structure 50. The heat dissipation structure 50 is disposed on the side of the chip device layer 40 away from the TFT layer 30, and has a plurality of protrusions 51 and heat dissipation cavities 52 communicating with the protrusions 51. Each protrusion 51 is attached to an RF chip 41 or other bare die device 42, thereby dissipating heat from the RF chip 41 and other bare die device 42.

[0038] In addition to the feasibility of the manufacturing process, this embodiment also considers the chip's heat dissipation method and heat density. Since traditional TFT-LCD circuits integrate pixel chips onto the surface of a glass substrate, and the surface and display end are directly exposed to air, excessive chip density and heat dissipation will inevitably lead to heat dissipation difficulties. However, for the phased array antenna, the RF chip 41, which uses COB packaging and TFT circuit connection control, is located at the bottom layer of the entire antenna-RF board. This allows the RF chip 41 and other bare die devices 42 to directly contact the external heat dissipation structure 50, thus forming a good heat dissipation path and improving heat dissipation efficiency.

[0039] Figure 3 This is a schematic structural diagram of an antenna element 60 according to an embodiment of the present invention. Figure 3As shown, in some embodiments, each antenna radiating patch 10 corresponds to two feed slots 211 and one feed network, forming an antenna element 60, and each RF chip 41 corresponds to four antenna elements 60. The linear polarization of the two orthogonal feed slots 211 after passing through the feed network layer 222 can form two polarizations, left and right, through the ±90° phase difference formed by the feed network layer 222. Then, it is vertically transitioned to the TFT layer 30 through the first feed signal aperture 231, and then electrically connected to the RF chip 41 through the traces of the TFT layer 30. The RF chip 41 can adjust the amplitude and phase of each branch, giving each antenna element 60 port a regular phase and amplitude, thereby realizing two-dimensional scanning or beamforming. This embodiment integrates amplitude and phase control functions onto the RF chip 41. The advantage of this is that the entire array size is limited to the antenna's radiation range, resulting in a fully vertically integrated tile-type phased array. Traditional liquid crystal phased arrays often occupy a significant area beyond the antenna dimensions for amplitude and phase control links. This not only increases the overall space required but also hinders the implementation of multiple phased array boards or two-dimensional wireless expansion. Furthermore, this embodiment uses a glass substrate with stable material properties as the phased array base instead of liquid crystal material, avoiding the dielectric instability caused by temperature or voltage fluctuations in liquid crystal materials. This increases product reliability.

[0040] Figure 4 This is a schematic structural diagram of a single-board unit with a watt-type phased array antenna 100 according to an embodiment of the present invention. Figure 4 As shown, in some embodiments, the glass-based Watt phased array antenna 100 further includes a power supply control connector 80 and an RF connector 70. The power supply control connector 80 is connected to the TFT layer 30 and is used to supply power and provide control signals. The RF connector 70 is connected to the feed slot 211 and is used to synthesize the signal processed by the RF chip 41 and then export it through a synthesizing network.

[0041] This embodiment differs from traditional liquid crystal phased arrays. The glass-based Watt phased array antenna 100 adopts pure vertical integration, and the antenna size is the size of the entire panel. It does not occupy other panels horizontally to make amplitude and phase control equipment. All control, power supply and radio frequency links are vertically integrated, and then vertically interconnected to other control panels or directly output through radio frequency connectors 70. The advantage of this design is that it can be wirelessly expanded in two dimensions through this small subarray. There are no gaps between the small panels and it will not have a negative impact on the synthesis of the radiation pattern.

[0042] Figure 5 This is a schematic flowchart illustrating a method for fabricating a glass-based tile-type phased array antenna 100 according to an embodiment of the present invention. Figure 5As shown, in a specific embodiment, the fabrication method of the glass-based tile phased array antenna 100 applies the tile phased array antenna 100 as described in any of the above embodiments, and the fabrication method includes the following steps: Step S100: Drill holes in the second glass substrate 22 and the third glass substrate 23 respectively using the TGV method to form a second power supply signal hole 221 in the second glass substrate 22 and a first power supply signal hole 231 in the third glass substrate 23. Step S200: The first feed signal hole 231 and the second feed signal hole 221 are metallized by a metallization filling process; In step S300, metal layers are formed on the surfaces of the first glass substrate 21, the second glass substrate 22, and the third glass substrate 23 respectively by a double-sided sputtering process. In step S400, the metal layers of the first glass substrate 21, the second glass substrate 22 and the third glass substrate 23 are etched into target patterns and pads by photolithography. In step S500, the first glass substrate 21, the second glass substrate 22 and the third glass substrate 23 are stacked by laser bonding process to form an integral structure.

[0043] In step S300, the material of the metal layer is copper.

[0044] The advantage of glass-based laminates over printed circuit board laminates is that they allow for arbitrary stacking of interleaved vias without increasing the number of lamination passes or back-drilling and filling processes. However, this presents a problem: glass is a hard and brittle material. Conventional drilling and bonding methods can cause glass breakage, potential risks due to residual stress after hole formation, or copper outflow and hole bursting after high-temperature bonding. Furthermore, the difference in expansion coefficients between glass and copper after cooling can lead to hole tearing and breakage. Therefore, there is an urgent need for a drilling and bonding process that can be completed at room temperature to achieve glass-based laminate stacking. Comparing common drilling and bonding methods, we found that the TGV3.0 process can be used to drill holes in a single-layer glass substrate, and laser bonding can be used to stack multiple glass-based laminates.

[0045] Traditional glass substrate bonding technologies include direct bonding, anodic bonding, glass melt bonding, eutectic bonding, hot-press bonding, and polymer adhesive bonding. Traditional hot-press bonding often leads to substrate breakage during the hot-pressing process due to the brittleness of glass and the mismatch between the glass's and metal's coefficients of thermal expansion. Room-temperature laser bonding (LSL) technology, utilizing high-energy laser pulses and precise control, avoids problems such as glass breakage, copper bursting, stress residue, and mismatched coefficients of thermal expansion caused by high temperatures and temperature fluctuations.

[0046] This embodiment differs from traditional tile-type phased arrays, which use a printed circuit board (PCB) + SMT packaged chip design. The glass-based phased array utilizes TFT technology + COB packaging + RF chip 41, linking the commercial display industry and the PCB manufacturing industry. Leveraging the more stable electrical properties, lower cost advantages suitable for mass production, and superior panel processing capabilities of glass, it replaces traditional PCBs as the substrate material for phased array antennas, achieving the ultimate goal of high integration, low cost, and high stability suitable for civilian mass production. To replace traditional PCBs with glass substrates, this embodiment uses TGV technology to solve the problem of glass substrate through-hole interconnection, COB packaging technology to solve the problem of bare die packaging, TFT technology to control and power the bare die, and laser bonding technology to solve the problem of multilayer stacking of the glass substrate.

[0047] Therefore, those skilled in the art should recognize that although numerous exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications conforming to the principles of the present invention can be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the invention. Thus, the scope of the present invention should be understood and construed as covering all such other variations or modifications.

Claims

1. A glass-based tile-type phased array antenna, characterized in that, It includes, from top to bottom, an antenna radiating patch, multiple glass substrates, a TFT layer, and a chip device layer; The multiple glass substrates are stacked to form an integral structure by laser bonding, and include, from bottom to top, a ground / pad layer, a first feed signal hole, a feed network layer, a second feed signal hole, and a feed gap; The feed slot is coupled to the antenna radiating patch. The first feed signal aperture is used to realize the vertical interconnection between the ground / pad layer and the feed network layer. The second feed signal aperture is used to realize the vertical interconnection between the feed network layer and the feed slot. The feed network layer is used to perform linear polarization coupling on the feed slot from two orthogonal directions to form electromagnetic waves with specific polarization. The chip device layer includes an RF chip, which is integrated on the TFT layer and is used to amplify and phase-match the radio frequency signal transmitted through the feed network layer. The TFT layer is used to provide the control signals and power to the chip device layer.

2. The tile-type phased array antenna according to claim 1, characterized in that, Both the first and second feed signal holes are through holes formed by TGV.

3. The tile-type phased array antenna according to claim 2, characterized in that, The plurality of glass substrates include a first glass substrate, a second glass substrate, and a third glass substrate arranged sequentially from top to bottom, and the first glass substrate, the second glass substrate, and the third glass substrate are stacked and formed by laser bonding. The first glass substrate includes the antenna radiating patch and the feed gap, the second glass substrate includes the second feed signal hole and the feed network layer, and the third glass substrate includes the first feed signal hole and the ground / pad layer.

4. The tile-type phased array antenna according to any one of claims 1-3, characterized in that, The RF chip is integrated onto the TFT layer via COB packaging.

5. The tile-type phased array antenna according to any one of claims 1-3, characterized in that, The chip device layer also includes other die devices, including power amplifiers, low-noise amplifiers, and DC-DC power conversion chips.

6. The tile-type phased array antenna according to any one of claims 1-3, characterized in that, The feed network layer includes a main feed line for distributing radio frequency energy and branch feed lines connected to the feed gaps in two orthogonal directions respectively. The path length difference between the main feed line and the branch feed line corresponds to a ±90° phase difference, so as to achieve left- or right-hand circular polarization or 360° adjustable linear polarization.

7. The tile-type phased array antenna according to claim 5, characterized in that, Also includes: A heat dissipation structure is disposed on the side of the chip device layer away from the TFT layer, and has multiple protrusions and heat dissipation cavities communicating with the protrusions. Each protrusion is attached to one of the RF chips or other die devices, thereby dissipating heat from the RF chip and the other die devices.

8. The tile-type phased array antenna according to any one of claims 1-3, characterized in that, Also includes: A power supply control connector, connected to the TFT layer, is used to supply power and provide control signals; An RF connector, connected to the power supply gap, is used to synthesize the signal processed by the RF chip and then export it through a synthesis network.

9. The tile-type phased array antenna according to any one of claims 1-3, characterized in that, Each of the antenna radiating patches corresponds to two of the feed slots and one feed network, forming an antenna element, and each of the RF chips corresponds to four antenna elements.

10. A method for fabricating a glass-based tile phased array antenna, using the tile phased array antenna as described in any one of claims 1-9, characterized in that, Includes the following steps: The TGV method is used to drill holes in the second glass substrate and the third glass substrate respectively, so as to form a second power supply signal hole in the second glass substrate and a first power supply signal hole in the third glass substrate; The first and second feed signal holes are metallized using a metallization filling process. Metal layers are formed on the surfaces of the first glass substrate, the second glass substrate, and the third glass substrate respectively by a double-sided sputtering process; The metal layers of the first glass substrate, the second glass substrate, and the third glass substrate are etched into target patterns and pads using photolithography. The first glass substrate, the second glass substrate, and the third glass substrate are stacked using a laser bonding process to form an integral structure.

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