Intelligent vehicle-mounted terminal

Abstract

The invention belongs to the technical field of intelligent networked automobile electronics, and particularly relates to an intelligent vehicle-mounted terminal, which comprises an SiP core module, a main processor bare crystal, a high-bandwidth memory stack, a nonvolatile storage bare crystal, a power management integrated circuit bare crystal, a Beidou double-frequency positioning navigation bare crystal, an inertial measurement unit and a wireless communication bare crystal are integrated in the SiP core module, wherein the high-bandwidth memory stack, the nonvolatile storage bare crystal, the power management integrated circuit bare crystal, the Beidou double-frequency positioning navigation bare crystal, the inertial measurement unit and the wireless communication bare crystal are vertically stacked on the main processor bare crystal through a silicon through hole technology. The heat dissipation system comprises a vapor chamber, a heat dissipation fin group arranged on the vapor chamber and a centrifugal fan; and the metal shell is used for accommodating the SiP core module and the heat dissipation system, and an external interface is arranged on the metal shell. Functional units such as calculation, storage, communication, positioning and inertial navigation are integrated, the size is greatly reduced, the reliability is improved, an active heat dissipation scheme that the vapor chamber is combined with the centrifugal fan is adopted, and performance degradation caused by overheating is avoided.

Description

Technical Field

[0001] This invention relates to the field of intelligent connected vehicle electronic technology, and in particular to an intelligent vehicle terminal. Background Technology

[0002] As the level of intelligent driving in commercial vehicles continues to rise, extremely high demands are placed on the computing power, integration, and environmental adaptability of in-vehicle terminals. Traditional in-vehicle terminals use a PCB-level integration method, mounting the central processing unit, memory, storage, global navigation satellite system, and inertial measurement unit as independently packaged chips on the circuit board. This method has the following inherent drawbacks: Size and integration bottlenecks: Each functional chip and its peripheral circuit occupy a large space, making it difficult to lay out in the compact cab of a commercial vehicle, resulting in complex wiring harnesses and low reliability. Performance and power consumption bottlenecks: Chips are interconnected via board-level wiring, resulting in long signal transmission paths, high latency, and limited bandwidth, making it difficult to meet the real-time data processing requirements of advanced autonomous driving (such as 16 TOPS and above computing power). Furthermore, long-distance interconnection also increases power consumption. Heat dissipation challenge: High-performance chips generate a lot of heat during continuous operation. The traditional heat sink plus fan mode is not efficient enough in the wide temperature environment (-40°C ~ +85°C) and limited space of commercial vehicles. This can easily lead to excessively high chip junction temperature, triggering thermal throttling, unstable performance output, or even hardware damage. System-in-package (SIP) technology offers a potential solution to the above problems. However, integrating heterogeneous computing, high-bandwidth storage, multi-band positioning, and high-precision inertial navigation into a single package, and solving the resulting problems of high-density heat dissipation, signal integrity, power integrity, and hardware-software co-optimization, constitutes a formidable technical challenge. This invention provides an improved solution to this problem. Summary of the Invention

[0003] Based on the technical problems existing in the prior art, this invention proposes an intelligent vehicle terminal.

[0004] The present invention proposes an intelligent vehicle terminal, comprising: The SiP core module adopts a cavity structure and integrates the following internal components: The main processor is a bare die, using a 7nm or more advanced process, and integrates a multi-core CPU, GPU and NPU, providing AI computing power of no less than 16 TOPS; High-bandwidth memory stack, consisting of at least two LPDDR5 / 6 memory dies vertically stacked on top of the main processor die via through-silicon via (TSV) technology; Non-volatile memory bare die, using UFS interface; Power management integrated circuit bare die provides multiple adjustable power supplies for each unit within the SiP package; The Beidou dual-frequency positioning and navigation bare crystal supports B1I and B2a signals and integrates RTK calculation function; Inertial measurement unit, including a three-axis MEMS gyroscope and a three-axis MEMS accelerometer; Wireless communication bare crystal, supporting 5G NR and C-V2X communication; The power management integrated circuit (IC) die first starts up and outputs multiple adjustable power supplies to power all dies and the inertial measurement unit (IMU) within the SiP core module. The BeiDou dual-frequency positioning and navigation die receives BeiDou B1I and B2a signals and simultaneously starts the RTK calculation function to generate initial positioning data. The IMU simultaneously collects the vehicle's three-axis angular velocity and three-axis acceleration data. Both data are transmitted to the silicon interposer through the wiring within the SiP package, and then transmitted to the main processor die via a 2.5D interconnect architecture. The main processor die calls the multi-core CPU to perform the fusion calculation of the positioning and IMU data, leveraging NP... U (AI computing power of no less than 16 TOPS) optimizes positioning accuracy (such as eliminating positioning deviations in occluded scenarios), GPU assists in processing data visualization-related calculations, temporary data generated during the process is stored in a high-bandwidth memory stack (high-speed read and write is achieved through an interconnect bus with a bit width of more than 128 bits and a speed of more than 6400MT / s), and finally, key data such as positioning results and vehicle motion parameters are written to non-volatile memory die (UFS interface ensures data access speed), while wireless communication die transmits positioning information and vehicle status data to the outside world through 5GNR / C-V2X.

[0005] The main processor die, high-bandwidth memory stack, non-volatile memory die, and power management integrated circuit die are interconnected in 2.5D via a silicon interposer. The BeiDou dual-frequency positioning and navigation die and the inertial measurement unit are connected to the silicon interposer via SiP package wiring. The 2.5D interconnect architecture and the package wiring work together to build a data transmission network: high-speed data interaction between the main processor die and the high-bandwidth memory stack, non-volatile memory die, and power management integrated circuit die is completed through the silicon interposer, ensuring low latency and high bandwidth for data transmission between multiple components. The data collected by the BeiDou dual-frequency positioning and navigation die and the inertial measurement unit are first aggregated to the silicon interposer via the package wiring, and then uniformly distributed to the main processor die, avoiding data transmission path confusion and ensuring that the data of each unit is synchronously transmitted to the main processor for fusion processing.

[0006] The heat dissipation system includes: The heat spreader has its bottom surface bonded to the SiP package cover of the SiP core module through a high-performance thermal interface material. The interior of the heat spreader has a cavity structure filled with working fluid. Heat dissipation fins are welded to the upper surface of the heat spreader. A centrifugal fan is positioned against the heat dissipation fin assembly to generate forced airflow; The heat generated during the operation of the SiP core module (especially during the main processor die and BeiDou dual-frequency positioning and navigation die calculations) is transferred through the SiP package cover to the high-performance thermal interface material, and then quickly introduced into the heat spreader. The working fluid inside the heat spreader evaporates upon heating, absorbs heat, and moves to the lower temperature area in the cavity. Upon encountering cooling, it condenses and releases heat, transferring the heat to the upper surface of the heat spreader. The heat dissipation fins welded to the upper surface of the heat spreader increase the heat dissipation area and distribute the heat evenly. At this time, the centrifugal fan starts and generates forced airflow towards the fins, accelerating the airflow on the fin surface and quickly carrying away the heat, thus achieving active heat dissipation of the SiP core module and preventing the component from performance degradation or damage due to high temperature.

[0007] The external interfaces and metal casing include a power interface, a vehicle CAN bus interface, an Ethernet interface, and an antenna interface. All interfaces are connected to the corresponding pins of the SiP core module. The metal casing is made of metal and also serves as an electromagnetic shield, providing mechanical protection for the entire terminal. The power interface connects to the vehicle's power supply to power the entire terminal (working with the power management integrated circuit die within the SiP core module to achieve voltage regulation). The vehicle CAN bus interface connects to the vehicle's CAN network, receiving vehicle speed, steering angle, and other vehicle data, and transmitting it to the SiP core module for fusion with positioning / inertial navigation data to improve the accuracy of positioning and vehicle status matching. The Ethernet interface is used for high-speed data interaction between the terminal and the vehicle's central control and cloud platforms (such as transmitting high-definition positioning logs and AI analysis results). The antenna interface connects the Beidou antenna and the communication antenna, providing signal input for the Beidou dual-frequency positioning and navigation die and a signal transmission and reception channel for the wireless communication die. Simultaneously, the metal casing encloses the internal components of the terminal, shielding them from external electromagnetic interference (preventing vehicle electrical appliances and external wireless signals from affecting terminal data acquisition and processing) and protecting them from vibration, impact, and dust intrusion during vehicle operation, providing mechanical protection for the terminal.

[0008] Preferably, the interconnect bus between the main processor die and the high-bandwidth memory stack has a bit width of no less than 128 bits and a data transmission rate of no less than 6400MT / s. When the main processor die performs high-frequency operations such as BeiDou-INS data fusion, RTK calculation optimization, and AI positioning accuracy correction, it needs to call a large amount of temporary data in real time (such as multi-frame positioning raw data, INS sampling sequences, and AI model parameters). An interconnect bus with a bit width of more than 128 bits and a rate of more than 6400MT / s can realize high-speed data interaction between the main processor and the high-bandwidth memory stack, avoid computational delays caused by data transmission bottlenecks, ensure real-time output of positioning results (such as meeting a positioning update frequency of more than 1Hz during vehicle dynamic driving), and at the same time ensure memory read and write efficiency when multiple tasks are processed in parallel (such as positioning calculation and C-V2X data transmission are performed simultaneously).

[0009] Preferably, the SiP packaging substrate of the SiP core module is made of high-performance ceramic or a composite material with a similar coefficient of thermal expansion to ensure structural reliability over a wide temperature range. In automotive scenarios, the terminal needs to withstand wide temperature environments ranging from -40℃ to 85℃ (such as summer vehicle exposure to direct sunlight or winter low-temperature startup). The high-performance ceramic or composite material substrate has a coefficient of thermal expansion that closely matches the coefficients of thermal expansion of components such as the main processor die, silicon interposer, and die package within the SiP core module. When the temperature changes, the thermal expansion and contraction of the substrate and its internal components are essentially the same, avoiding problems such as package cracking, interconnect solder joint detachment, and wiring breakage due to differences in thermal stress. This ensures the structural integrity and electrical connection reliability of the SiP core module under wide temperature conditions, guaranteeing stable terminal operation.

[0010] Preferably, the inertial measurement unit (IMU) communicates with the main processor die via an I3C bus integrated within the SiP package to achieve low-latency, high-synchronization data acquisition. The IMU needs to acquire tens to hundreds of data points from the three-axis gyroscope and accelerometer per second, and this data must be strictly time-synchronized with the positioning data from the BeiDou dual-frequency positioning and navigation die (otherwise, it will lead to fusion positioning deviation). The low-latency characteristics of the I3C bus (transmission latency can be as low as microseconds) can quickly transmit the inertial navigation data to the main processor die, while its high-synchronization design (supporting bus timing calibration) can ensure that the timestamps of the inertial navigation data and the BeiDou positioning data are accurately aligned. When the main processor performs fusion calculations based on the synchronized two types of data, it can effectively eliminate positioning errors caused by time differences (such as positioning offsets during rapid acceleration / sharp turning of the vehicle), improving the positioning continuity and accuracy of the terminal in complex driving scenarios.

[0011] This invention provides a control method for an intelligent vehicle terminal. After the terminal is powered on, the following control flow is executed: Cooperative initialization (S1): The main processor loads the operating system and application from the UFS storage. At the same time, it configures the range and filter of the IMU through the I3C bus, obtains the ephemeris from the Beidou bare crystal through the dedicated serial bus, the PMIC powers on each unit in sequence, and the temperature sensor (integrated in the PMIC or main processor) reads the initial temperature. Tightly Coupled Fusion Positioning (S2): The system operates in 10ms cycles. At the beginning of each cycle, a hardware timer synchronously triggers IMU sampling and BeiDou bare crystal data output. The main processor acquires angular velocity, acceleration, pseudorange, and carrier phase data with precise timestamps. Subsequently, a tightly coupled Kalman filter algorithm is executed on the main processor's NPU or DSP core. This algorithm uses IMU data to recursively deduce the state and uses raw GNSS observations (rather than position results) for correction. Even when only 2-3 satellites are visible, it can still provide reliable positioning output. Dynamic thermal management (S3): The temperature monitoring unit reads the junction temperature Tj every 100ms. The controller adjusts the system behavior according to the value of Tj. For example, when Tj rises from 70°C to 78°C, the system first reduces the CPU frequency from 2.0GHz to 1.6GHz, and at the same time increases the fan speed from 4000RPM to 6000RPM. If the temperature continues to rise to 87°C, some GPU cores are further shut down, the fan runs at full speed (8000RPM), and an overheat alarm is sent to the vehicle host. Health monitoring and recording (S4): The system background task continuously checks the LPDDR5 ECC error count, the number of bad blocks in UFS, the carrier-to-noise ratio of the BeiDou signal, and the IMU self-test flag. All navigation results (latitude, longitude, altitude, speed, attitude), key system parameters (temperature, voltage, current), and any abnormal events are recorded in a specific partition of UFS storage in the form of a circular queue to ensure that the most recent data is not lost in the event of an unexpected power outage.

[0012] Compared with the prior art, the present invention provides an intelligent vehicle terminal with the following advantages: 1. High Integration and Performance Enhancement: Through SiP 2.5D / 3D integration, computing, storage, communication, positioning, and inertial navigation functional units are integrated into one unit, greatly reducing size and improving reliability. High-speed interconnection between chips significantly reduces latency, improves data throughput, and ensures stable output of high computing power.

[0013] 2. Precise positioning and reliability: The integrated BeiDou dual-frequency RTK and IMU, combined with hardware synchronization and tightly coupled algorithms, provide continuous, stable and high-precision positioning and navigation capabilities, especially performing well in environments where GNSS signals are blocked.

[0014] 3. High-efficiency heat dissipation and stable operation: The active heat dissipation solution, which combines a heat spreader with a centrifugal fan, is optimized for the high heat flux density of SiP modules. Combined with a dynamic thermal management strategy, it ensures that the terminal can maintain stable performance in the harsh thermal environment of commercial vehicles and avoids performance degradation due to overheating.

[0015] 4. System-level optimization and traceability: Collaborative design from the chip level, package level to the system level achieves the optimal balance between power consumption, heat dissipation, and performance. Comprehensive health monitoring and data logging functions provide strong support for system maintenance and optimization. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the external structure of an intelligent vehicle terminal proposed in this invention; Figure 2 This is a schematic diagram of the internal structure of an intelligent vehicle terminal proposed in this invention; Figure 3 This is a flowchart illustrating a control method for an intelligent vehicle terminal proposed in this invention.

[0017] In the diagram: 1. Metal casing; 2. External interface; 3. SiP core module; 4. Heat dissipation system. Detailed Implementation

[0018] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0019] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0020] Example 1, referring to Figures 1-2 A smart vehicle terminal, the core of which is SiP core module 3. This module adopts a cavity SiP package with a size of 25mm×25mm. The SiP package substrate is made of alumina ceramic. On the substrate, the main processor die (process 7nm) is mounted through microbumps. Above the main processor die, four LPDDR5 memory dies are vertically stacked through silicon vias and microbumps to form a high-bandwidth memory stack. UFS storage die, PMIC die, Beidou dual-frequency positioning and navigation die, and 5G communication die are also interconnected through silicon interposers. The inertial measurement unit is mounted in the form of a chip in a dedicated cavity on the substrate. All dies are interconnected in high density through silicon interposers and are sealed and protected by the SiP package cover. In operation, the power management integrated circuit die first starts up and outputs multiple adjustable power supplies to power all dies and the inertial measurement unit within the SiP core module 3. The Beidou dual-frequency positioning and navigation die receives Beidou B1I and B2a signals and simultaneously starts the RTK calculation function to generate initial positioning data. The inertial measurement unit simultaneously collects the vehicle's three-axis angular velocity and three-axis acceleration data. Both data are transmitted to the silicon interposer via wiring within the SiP package, and then transmitted to the main processor die via a 2.5D interconnect architecture. The main processor die calls the multi-core CPU to perform the fusion calculation of the positioning and inertial navigation data. The NPU (with AI computing power of no less than 16 TOPS) is used to optimize positioning accuracy (such as eliminating positioning deviations in occluded scenarios). The GPU assists in processing data visualization-related calculations. Temporary data generated during the process is stored in a high-bandwidth memory stack (high-speed read and write is achieved through an interconnect bus with a bit width of more than 128 bits and a speed of more than 6400MT / s). Finally, key data such as positioning results and vehicle motion parameters are written to a non-volatile memory die (UFS interface ensures data access speed). At the same time, the wireless communication die transmits positioning information and vehicle status data to the outside world through 5G NR / C-V2X.

[0021] Among them, the main processor die, high-bandwidth memory stack, non-volatile memory die, and power management integrated circuit die are interconnected in 2.5D through a silicon interposer; the Beidou dual-frequency positioning and navigation die and the inertial measurement unit are connected to the silicon interposer through SiP package internal wiring. In use, the aforementioned 2.5D interconnect architecture and in-package wiring work together to construct a data transmission network: high-speed data interaction between the main processor die and the high-bandwidth memory stack, non-volatile memory die, and power management integrated circuit die is completed through the silicon interposer, ensuring low latency and high bandwidth for data transmission between multiple components; the data collected by the Beidou dual-frequency positioning and navigation die and the inertial measurement unit are first aggregated to the silicon interposer through in-package wiring, and then uniformly distributed to the main processor die, avoiding data transmission path confusion and ensuring that the data of each unit is synchronously transmitted to the main processor for fusion processing.

[0022] The bottom surface of the heat dissipation system 4 heat dissipation plate is tightly attached to the SiP package cover of the SiP core module 3 through thermal grease. The heat dissipation fins are brazed onto the heat dissipation plate, and a high-efficiency centrifugal fan is installed above the fins. During operation, the heat generated by the SiP core module 3 (especially during the main processor die and Beidou dual-frequency positioning and navigation die calculations) is transferred through the SiP package cover to the high-performance thermal interface material, and then quickly introduced into the heat spreader. The working fluid inside the heat spreader evaporates upon heating, absorbs heat, and moves to the lower temperature area in the cavity. Upon encountering cooling, it condenses and releases heat, transferring the heat to the upper surface of the heat spreader. The heat dissipation fins welded to the upper surface of the heat spreader increase the heat dissipation area and distribute the heat evenly. At this time, the centrifugal fan starts and generates forced airflow towards the fins, accelerating the airflow on the fin surface and quickly carrying away the heat, thus achieving active heat dissipation of the SiP core module 3 and preventing the components from experiencing performance degradation or damage due to high temperatures.

[0023] The entire SiP core module 3 and heat dissipation system 4 are installed in an aluminum metal casing 1, which integrates a power interface, a CANFD interface, a gigabit Ethernet interface, and multiple antenna interfaces.

[0024] During use, the power interface connects to the vehicle's power supply to power the entire terminal (working with the power management integrated circuit die in the SiP core module 3 to achieve voltage regulation); the vehicle CAN bus interface connects to the vehicle's CAN network to receive vehicle speed, steering angle, and other vehicle data, and transmits them to the SiP core module 3 for fusion with positioning / inertial navigation data to improve the accuracy of positioning and vehicle status matching; the Ethernet interface is used for high-speed data interaction between the terminal and the vehicle's central control and cloud platforms (such as transmitting high-definition positioning logs and AI analysis results); the antenna interface connects the Beidou antenna and the communication antenna, providing signal input for the Beidou dual-frequency positioning and navigation die and providing a signal transmission and reception channel for the wireless communication die; at the same time, the metal shell 1 encloses the internal components of the terminal, shielding external electromagnetic interference (preventing vehicle electrical appliances and external wireless signals from affecting the terminal's data acquisition and processing), and resisting vibration, impact, and dust intrusion during vehicle operation, providing mechanical protection for the terminal.

[0025] Preferably, the interconnect bus width between the main processor die and the high-bandwidth memory stack is not less than 128 bits, and the data transfer rate is not less than 6400MT / s; When in use, the main processor bare die needs to call a large amount of temporary data in real time (such as multi-frame positioning raw data, inertial navigation sampling sequence, and AI model parameters) when performing high-frequency calculations such as BeiDou-inertial navigation data fusion, RTK calculation optimization, and AI positioning accuracy correction. The interconnect bus with a bit width of more than 128 bits and a speed of more than 6400MT / s can realize high-speed data interaction between the main processor and the high-bandwidth memory stack, avoid the calculation delay caused by data transmission bottlenecks, ensure the real-time output of positioning results (such as meeting the positioning update frequency of more than 1Hz during vehicle dynamic driving), and at the same time ensure the memory read and write efficiency when multi-task parallel processing (such as positioning calculation and C-V2X data transmission are performed simultaneously).

[0026] Preferably, the SiP packaging substrate of the SiP core module 3 is made of high-performance ceramic or a composite material with a similar coefficient of thermal expansion to ensure structural reliability over a wide temperature range. When in use, the terminal needs to cope with a wide temperature range of -40℃ to 85℃ in vehicle scenarios (such as summer vehicle exposure to sunlight and winter low-temperature start-up). The high-performance ceramic or composite material substrate with a similar coefficient of thermal expansion has a coefficient of thermal expansion that is highly matched with the coefficient of thermal expansion of the main processor die, silicon interposer, die package and other components in the SiP core module 3. When the temperature changes, the thermal expansion and contraction of the substrate and each internal component are basically consistent, which can avoid problems such as package cracking, interconnect solder joint detachment and wiring breakage caused by thermal stress differences. This ensures the structural integrity and electrical connection reliability of the SiP core module 3 in a wide temperature environment and guarantees the stable operation of the terminal.

[0027] Preferably, the inertial measurement unit communicates with the main processor die via an I3C bus integrated within the SiP package to achieve low-latency, high-synchronization data acquisition. In use, the inertial measurement unit (IMU) needs to collect tens to hundreds of data points from the three-axis gyroscope and accelerometer per second, and this data must be strictly synchronized with the positioning data of the BeiDou dual-frequency positioning and navigation die (otherwise, it will lead to positioning deviation). The low latency of the I3C bus (transmission latency can be as low as microseconds) can quickly transmit the inertial navigation data to the main processor die, while its high synchronization design (supporting bus timing calibration) can ensure that the timestamps of the inertial navigation data and the BeiDou positioning data are accurately aligned. When the main processor performs fusion calculations based on the synchronized two types of data, it can effectively eliminate positioning errors caused by time differences (such as positioning offsets when the vehicle accelerates or turns sharply), and improve the positioning continuity and accuracy of the terminal in complex driving scenarios.

[0028] Example 2, refer to Figure 3 This invention provides a control method for an intelligent vehicle terminal, comprising the following steps: S1: System Startup and Co-initialization After the terminal is powered on, the main processor die boots the system and initializes each unit in the SiP package: loads the ephemeris and ambiguity parameters of the Beidou dual-frequency positioning and navigation die, calibrates the zero bias and scale factor of the inertial measurement unit, configures the network parameters of the wireless communication die, and performs self-tests on the memory and storage. At the same time, it starts the temperature monitoring unit and reads the initial temperature T0. S2: Multi-source data synchronous acquisition and tightly coupled fusion positioning Synchronous acquisition: Trigger the BeiDou dual-frequency positioning and navigation die and the inertial measurement unit to perform data acquisition synchronously at a fixed period Ts (e.g., 10 ms). Utilize the hardware timestamp mechanism integrated in the SiP package to ensure that the time alignment accuracy between GNSS observations (pseudorange, carrier phase) and IMU observations (angle increment, velocity increment) is better than 1 ms. Tight coupling fusion: Run the tight coupling integrated navigation algorithm on the main processor die. The state vector xk of this algorithm includes position, velocity, attitude errors, as well as the zero bias and scale factor errors of the IMU. The observation vector is the difference between the GNSS raw observations and the predicted value of the position calculated based on the IMU. State prediction equation: ; where, Fk is the state transition matrix, Bk is the control input matrix, uk is the control vector (mainly from the IMU), and wk is the process noise. Observation update equation: ; where, zk is the observation residual, Hk is the observation matrix, and vk is the observation noise. Through continuous iteration of the Kalman filter, output high-precision position, velocity, and attitude information. S3: Dynamic thermal management and performance scheduling Temperature monitoring: Monitor the internal junction temperature Tj of the SiP core module 3 in real time. Adaptive control: Dynamically adjust the system performance and heat dissipation strategy according to the junction temperature Tj: If Tj < T1 (the first temperature threshold, e.g., 75 °C), the system operates in the full-performance mode, and the centrifugal fan runs at a low speed. If T1 ≤ Tj < T2 (the second temperature threshold, e.g., 85 °C), the system activates the dynamic voltage and frequency adjustment technology, reduces the operating voltage and frequency of the main processor die according to the preset curve, and at the same time, the rotation speed of the centrifugal fan is increased to medium speed. If Tj ≥ T2, the system enters the conservative mode, further reduces the computing power, turns off the unnecessary coprocessors, the centrifugal fan runs at the highest speed, and records the overheat event. The relationship between the fan rotation speed ω and the junction temperature Tj can be defined by the following function: ; where, ωmin is the minimum rotation speed, and K is the proportionality coefficient. S4: Health status monitoring and data recording Continuously monitor the health status of each functional unit in the SiP package, including memory error checking, storage life loss, positioning signal quality, IMU self-check status, etc. Record all key navigation data, system status, temperature logs, and abnormal events in the non-volatile storage die in the form of timestamps, supporting post-event fault diagnosis and performance analysis.

[0029] The above are merely preferred embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. An intelligent vehicle-mounted terminal, characterized in that, include: The SiP core module (3) integrates a main processor die, a high-bandwidth memory stack vertically stacked on the main processor die through through-silicon via (TSV) technology, a non-volatile memory die, a power management integrated circuit die, a Beidou dual-frequency positioning and navigation die, an inertial measurement unit, and a wireless communication die. The main processor die, high-bandwidth memory stack, non-volatile memory die, and power management integrated circuit die are interconnected in 2.5D through a silicon interposer. The heat dissipation system (4) includes a heat dissipation plate that is attached to the SiP package cover of the SiP core module (3), a heat dissipation fin group disposed on the heat dissipation plate, and a centrifugal fan aligned with the heat dissipation fin group. And a metal casing (1) that houses the SiP core module (3) and the heat dissipation system (4), wherein an external interface (2) is provided on the metal casing (1).

2. The intelligent vehicle terminal according to claim 1, characterized in that, The high-bandwidth memory stack is composed of LPDDR5 or LPDDR6 memory dies, and the interconnect bus width between the main processor die and the high-bandwidth memory stack is not less than 128 bits.

3. The intelligent vehicle terminal according to claim 1, characterized in that, The Beidou dual-frequency positioning and navigation bare crystal supports B1I and B2a signals and integrates real-time dynamic differential positioning calculation function.

4. The intelligent vehicle terminal according to claim 1, characterized in that, The inertial measurement unit communicates with the main processor die via an I3C bus integrated within the SiP package.

5. The intelligent vehicle terminal according to claim 1, characterized in that, The SiP packaging substrate of the SiP core module (3) is made of ceramic or a composite material with a matching coefficient of thermal expansion.

6. A control method for an intelligent vehicle terminal according to any one of claims 1-5, characterized in that, Including the following steps: System startup and collaborative initialization: Initialize and self-test each functional unit within the SiP package; Multi-source data synchronous acquisition and tightly coupled fusion positioning: synchronously acquire GNSS raw observations and IMU observations at fixed intervals, and execute tightly coupled integrated navigation algorithms on the main processor to output navigation information; Dynamic thermal management and performance scheduling, real-time monitoring of the junction temperature of the SiP core module (3), and dynamic adjustment of the main processor computing power and centrifugal fan speed according to the junction temperature; Health status monitoring and data recording: Monitor the health status of each unit and record system operation data.

7. The control method for an intelligent vehicle terminal according to claim 6, characterized in that, In the multi-source data synchronous acquisition and tightly coupled fusion positioning step, the hardware timestamp mechanism integrated within the SiP package is used to ensure that the time alignment accuracy between GNSS observations and IMU observations is better than 1 millisecond.

8. The control method for an intelligent vehicle terminal according to claim 6, characterized in that, The dynamic thermal management and performance scheduling steps specifically include: When the junction temperature is below the first threshold, the system operates in full-performance mode and the fan runs at low speed; when the junction temperature is between the first and second thresholds, the system initiates dynamic voltage frequency adjustment and increases the fan speed. When the junction temperature reaches or exceeds the second threshold, the system enters conservative mode, reducing computing power and running the fans at full speed.

9. The control method for an intelligent vehicle terminal according to claim 8, characterized in that, The rotational speed ω of the centrifugal fan satisfies a functional relationship with the junction temperature Tj. Where ωmin is the preset minimum speed, K is the proportional coefficient, and T1 is the first threshold.

10. The control method for an intelligent vehicle terminal according to claim 6, characterized in that, In the health status monitoring and data recording steps, the recorded data includes navigation results, system temperature, voltage, current, error codes, and abnormal events, and is stored in the non-volatile memory die.

Images