Polishing device and special-shaped product polishing method

Abstract

The invention relates to the technical field of polishing, in particular to a polishing device and a special-shaped product polishing method.The polishing device comprises a mounting platform, a moving assembly, a fixing assembly and a polishing assembly. The moving assembly is arranged on the mounting platform. The fixing assembly comprises a first profiling jig and a second profiling jig, the first profiling jig and the second profiling jig are both arranged on the moving assembly, and the first profiling jig is used for containing a to-be-polished product. The polishing assembly comprises a lifting structure, a mounting plate, a polishing structure and a pressure sensor, the mounting plate is connected to the lifting structure, the polishing structure is connected to the mounting plate, the pressure sensor is arranged on the mounting plate, the polishing structure corresponds to the first profiling jig, and the pressure sensor corresponds to the second profiling jig. According to the technical scheme, the problem that in the prior art, polishing is not uniform when the special-shaped to-be-polished product is polished is effectively solved.

Description

Technical Field

[0001] This application relates to the technical field of polishing, and more specifically, to a polishing apparatus and a method for polishing irregularly shaped products. Background Technology

[0002] Polishing is an essential process in the processing of glass covers, metals, and ceramics. Polishing reduces surface roughness, resulting in a smooth, glossy surface that improves the product's appearance, feel, performance, and lifespan. In today's market, product shapes are becoming increasingly diverse, with 2D, 3D, and irregular shapes becoming mainstream. While equipment and processes for polishing 2D products are mature, those for 3D products, especially irregularly shaped ones, remain less developed. The main problem is that when polishing 3D and irregularly shaped products, the curvature and unevenness of the surface cause inconsistent pressure from the polishing wheel at each point, making it impossible to achieve uniform grinding depth and resulting in uneven surface polishing.

[0003] To address the issue of uneven polishing force, some existing devices (e.g., application number 202011567331.5, titled "Grinding Machine") include: a horizontally mounted slide rail on the frame; a lifting assembly mounted on the slide rail; a lateral movement assembly for moving the lifting assembly along the slide rail; a detachably mounted grinding head on the lifting assembly, which in turn moves the grinding head vertically; a rotating assembly mounted on the frame and below the grinding head for fixing the workpiece to be polished and rotating it; a control unit including a controller and a pressure sensor, the pressure sensor positioned between the lifting assembly and the grinding head for acquiring the grinding pressure of the grinding head; and a controller for controlling the operation of the lateral movement assembly and the rotating assembly, and adjusting the height of the grinding head using the lifting assembly based on the grinding pressure acquired by the pressure sensor, thereby achieving precise control of the grinding force and providing multiple degrees of freedom to ensure both uniformity and efficiency in grinding.

[0004] However, although this device can detect the force exerted on the grinding head by the lifting component through a pressure sensor to ensure that the force exerted by the lifting component is always consistent, the force exerted on the grinding head will be affected by the shape of the product to be polished, even if the force exerted on the grinding head by the lifting component is always consistent, the force exerted on the product to be polished will be uneven. Summary of the Invention

[0005] This application provides a polishing apparatus and a polishing method for irregularly shaped products to solve the problem of uneven polishing when polishing irregularly shaped products in the prior art.

[0006] A polishing apparatus according to this application includes: a mounting platform, a moving component, a fixing component, and a polishing component. The moving component is disposed on the mounting platform. The fixing component includes a first contour jig and a second contour jig, both of which are disposed on the moving component. The first contour jig is used to place the product to be polished. The polishing component includes a lifting structure, a mounting plate, a polishing structure, and a pressure sensor. The mounting plate is connected to the lifting structure, the polishing structure is connected to the mounting plate, and the pressure sensor is disposed on the mounting plate. The polishing structure and the first contour jig are correspondingly disposed, and the pressure sensor and the second contour jig are correspondingly disposed.

[0007] In some embodiments, the shape of the second contouring fixture facing the pressure sensor is the same as the surface of the product to be polished, and the height of the second contouring fixture is the same as the sum of the height of the first contouring fixture and the height of the product to be polished.

[0008] In some embodiments, the moving component includes a first drive motor, a nut seat, a mounting base, a lead screw, and two sets of bearing seats. The first drive motor is fixed on the mounting platform and is connected to the lead screw via a transmission. The nut seat is sleeved on the circumferential outer side of the lead screw and is connected to the mounting base. A first and a second profiling fixture are both mounted on the mounting base. The two sets of bearing seats are arranged opposite each other on the mounting platform, and the two ends of the lead screw are rotatably mounted in the two sets of bearing seats.

[0009] In some embodiments, the polishing structure includes a second drive motor and a polishing roller. The mounting plate has a horizontal plate and a vertical plate. The second drive motor is fixed on the vertical plate. The polishing roller and the second drive motor are connected in a transmission manner. The polishing roller is located above the first contouring fixture.

[0010] In some embodiments, the polishing structure further includes a polishing slurry nozzle mounted on a horizontal plate and positioned above the polishing roller.

[0011] In some embodiments, the lifting structure includes a support frame and a lifting part. The support frame is mounted on the mounting platform, one end of the lifting part is fixed to the support frame, and the other end is connected to the horizontal plate. The lifting part is an electric actuator, a hydraulic cylinder, or a pneumatic cylinder.

[0012] In some embodiments, a groove is provided on the side opposite to the support frame and the vertical plate, and a slider is provided on the side opposite to the vertical plate and the support frame, the slider being movably disposed in the groove.

[0013] In some embodiments, the first profiling fixture secures the product to be polished by negative pressure or adhesive.

[0014] A polishing method for irregularly shaped products according to this application includes: Step S10: Fix the product to be polished onto the first contour jig; Step S20: Connect the pressure sensor and the second contour jig. Step S30: The first contour jig moves the product to be polished. In step S40, the lifting structure drives the polishing structure to adjust its height in real time according to the signal from the pressure sensor. In some embodiments, in step S50, the first and second profiling fixtures are arranged in parallel, and the first and second profiling fixtures move synchronously through a moving component.

[0015] According to the technical solution of this application, the polishing device includes: a mounting platform, a moving component, a fixing component, and a polishing component. The moving component is mounted on the mounting platform. The fixing component includes a first contouring fixture and a second contouring fixture, both of which are mounted on the moving component. The moving component can drive the first and second contouring fixtures to move synchronously. The polishing component includes a lifting structure, a mounting plate, a polishing structure, and a pressure sensor. The mounting plate is connected to the lifting structure, which adjusts the height of the mounting plate. The polishing structure is connected to the mounting plate and moves synchronously with the lifting of the mounting plate. The pressure sensor is mounted on the mounting plate. The polishing structure and the first contouring fixture are correspondingly positioned. The first contouring fixture is used to fix the product to be polished, and the polishing structure polishes the product. The pressure sensor and the second contouring fixture are correspondingly positioned. At this time, the pressure sensor detects the force acting on the second contouring fixture, which is equivalent to the force acting on the product to be polished by the polishing structure. Therefore, even if the product to be polished is irregularly shaped, as long as the height of the polishing structure is adjusted according to the detection result, adaptive matching for irregularly shaped polishing surfaces can be achieved, improving polishing uniformity. The technical solution of this application effectively solves the problem of uneven polishing when polishing irregularly shaped products in the prior art. Attached Figure Description

[0016] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A schematic diagram of the polishing apparatus according to an embodiment of this application is shown; Figure 2 This invention provides a schematic diagram of the polishing apparatus from another angle, representing an embodiment of the present application. Figure 3 A schematic flowchart of a polishing method for irregularly shaped products according to an embodiment of this application is shown.

[0019] The above figures include the following reference numerals: 10. Mounting platform; 20. Moving component; 21. First drive motor; 22. Nut seat; 23. Mounting seat; 24. Lead screw; 25. Bearing seat; 30. Fixing component; 31. First contour jig; 32. Second contour jig; 40. Polishing component; 41. Lifting structure; 411. Support frame; 4111. Slide groove; 412. Lifting part; 42. Mounting plate; 43. Polishing structure; 431. Second drive motor; 432. Polishing roller; 433. Polishing liquid nozzle; 44. Pressure sensor. Detailed Implementation

[0020] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0021] It should be noted that the following detailed descriptions are illustrative and intended to provide further explanation of this application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0022] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways, rotated 90 degrees, or in other orientations, and the spatial relative descriptions used herein will be interpreted accordingly.

[0023] like Figure 1 and Figure 2As shown, this embodiment relates to a polishing apparatus, including: a mounting platform 10, a moving component 20, a fixing component 30, and a polishing component 40. The moving component 20 is disposed on the mounting platform 10. The fixing component 30 includes a first contouring fixture 31 and a second contouring fixture 32, both of which are disposed on the moving component 20. The first contouring fixture 31 is used to place the product to be polished. The polishing component 40 includes a lifting structure 41, a mounting plate 42, a polishing structure 43, and a pressure sensor 44. The mounting plate 42 is connected to the lifting structure 41, the polishing structure 43 is connected to the mounting plate 42, and the pressure sensor 44 is disposed on the mounting plate 42. The polishing structure 43 and the first contouring fixture 31 are correspondingly disposed, and the pressure sensor 44 and the second contouring fixture 32 are correspondingly disposed.

[0024] Using the technical solution of this embodiment, the polishing device includes: a mounting platform 10, a moving component 20, a fixing component 30, and a polishing component 40. The moving component 20 is disposed on the mounting platform 10. The fixing component 30 includes a first contouring fixture 31 and a second contouring fixture 32, both of which are disposed on the moving component 20. The moving component 20 can drive the first contouring fixture 31 and the second contouring fixture 32 to move synchronously. The polishing assembly 40 includes a lifting structure 41, a mounting plate 42, a polishing structure 43, and a pressure sensor 44. The mounting plate 42 is connected to the lifting structure 41, which adjusts the height of the mounting plate 42. The polishing structure 43 is connected to the mounting plate 42 and moves synchronously with the lifting of the mounting plate 42. The pressure sensor 44 is mounted on the mounting plate 42. The polishing structure 43 and the first contouring fixture 31 are correspondingly arranged. The first contouring fixture 31 is used to fix the product to be polished, and the polishing structure 43 polishes the product. The pressure sensor 44 and the second contouring fixture 32 are correspondingly arranged. At this time, the pressure sensor 44 detects the force acting on the second contouring fixture 32, which is equivalent to the force acting on the product to be polished by the polishing structure 43. Therefore, even if the product to be polished is irregularly shaped, as long as the height of the polishing structure 43 is adjusted according to the detection result, adaptive matching for irregularly shaped polishing surfaces can be achieved, improving polishing uniformity. The technical solution of this embodiment effectively solves the problem of uneven polishing when polishing irregularly shaped products in the prior art.

[0025] It should be noted that the product to be polished is an irregularly shaped product, that is, the side facing the polishing structure 43 is an irregular surface.

[0026] In some embodiments, the shape of the side of the second contouring fixture 32 facing the pressure sensor 44 is the same as the surface to be polished of the product to be polished, and the height of the second contouring fixture 32 is the same as the sum of the height of the first contouring fixture 31 and the height of the product to be polished. In this case, the second contouring fixture 32 can be considered equivalent to the product to be polished mounted on the first contouring fixture 31. The pressure sensor 44 detects the force acting on the second contouring fixture 32 and compares it with a standard value. The lifting structure 41 adjusts its height so that the value detected by the pressure sensor 44 maintains the standard value. The polishing structure 43 adjusts its height synchronously with the lifting structure 41, so that the force exerted by the polishing structure 43 on the product to be polished precisely matches the irregular surface to be polished.

[0027] like Figure 1 and Figure 2 As shown, in some embodiments, the moving component 20 includes a first drive motor 21, a nut seat 22, a mounting base 23, a lead screw 24, and two sets of bearing seats 25. The first drive motor 21 is fixed on the mounting platform 10. The first drive motor 21 and the lead screw 24 are connected by a transmission, and the first drive motor 21 drives the lead screw 24 to rotate. The nut seat 22 is sleeved on the circumferential outer side of the lead screw 24 and is screwed to the lead screw 24. The nut seat 22 can move along the extension direction of the lead screw 24. The nut seat 22 is connected to the mounting base 23, and the mounting base 23 moves synchronously with the nut seat 22. The first contour jig 31 and the second contour jig 32 are both set on the mounting base 23. The first contour jig 31 and the second contour jig 32 move synchronously with the mounting base 23. The product to be polished on the first contour jig 31 moves synchronously, thereby realizing the change of polishing position until all polishing is completed. Two sets of bearing seats 25 are arranged opposite to each other on the mounting platform 10. The two ends of the lead screw 24 are rotatably arranged in the two sets of bearing seats 25, and the bearing seats 25 provide support for the lead screw 24.

[0028] It should be noted that the movable component 20 also includes two sets of slide rails, which are arranged opposite to each other on the mounting platform 10. Sliders are provided at both ends of the mounting base 23, and the sliders are movably arranged in the slide rails to keep the mounting base 23 moving stably.

[0029] like Figure 1 and Figure 2 As shown, in some embodiments, the polishing structure 43 includes a second drive motor 431 and a polishing roller 432. The mounting plate 42 has a horizontal plate and a vertical plate. The second drive motor 431 is fixed on the vertical plate. The polishing roller 432 and the second drive motor 431 are connected in transmission. The second drive motor 431 drives the polishing roller 432 to rotate. The polishing roller 432 is located above the first contour jig 31 to achieve polishing of the product to be polished.

[0030] like Figure 1As shown, in some embodiments, the polishing structure 43 further includes a polishing slurry nozzle 433, which is mounted on the horizontal plate and located above the polishing roller 432. The polishing slurry nozzle 433 is connected to an externally mounted polishing slurry storage tank (not shown) via a delivery hose. During the polishing process, the polishing slurry nozzle 433 sprays polishing slurry to absorb the heat generated during polishing and to act as a lubricant.

[0031] It should be noted that the mounting base 23 is provided with a polishing liquid recovery tank. The polishing liquid recovery tank is arranged around the first contour jig 31. The bottom of the polishing liquid recovery tank is inclined in the same direction. A recovery hole is opened on the side wall of the polishing liquid recovery tank. The polishing liquid flows into the polishing liquid recovery tank and collects. Finally, it flows out from the recovery hole. The polishing liquid can be recovered by connecting a recovery hose in the recovery hole or by placing a recovery bucket directly corresponding to the recovery hole.

[0032] like Figure 1 and Figure 2 As shown, in some embodiments, the lifting structure 41 includes a support frame 411 and a lifting part 412. The support frame 411 is mounted on the mounting platform 10. One end of the lifting part 412 is fixed to the support frame 411, and the other end is connected to the horizontal plate. The lifting part 412 is an electric actuator, a hydraulic cylinder, or a pneumatic cylinder. The cylinder body of the lifting part 412 is fixed to the support frame, and the piston rod is connected to the horizontal plate. This enables the mounting plate 42 to be lifted and lowered.

[0033] It should be noted that the polishing device also includes a PLC controller. The PLC controller is electrically connected to the pressure sensor 44, the first drive motor 21, the second drive motor 431, and the lifting unit 412 to realize signal reception and corresponding control.

[0034] like Figure 1 As shown, in some embodiments, a groove 4111 is provided on the side opposite to the support frame 411 and the vertical plate, and a slider is provided on the side opposite to the vertical plate and the support frame 411. The slider is movably disposed in the groove 4111 to guide the lifting and lowering of the mounting plate 42 and improve the stability of the lifting and lowering.

[0035] like Figure 1 As shown, in some embodiments, the first contouring fixture 31 fixes the product to be polished using negative pressure or adhesive. When fixing the product to be polished using negative pressure, the first contouring fixture 31 has a negative pressure groove inside, and the negative pressure groove is connected to an external vacuum generator through a negative pressure pipe. The first contouring fixture 31 also has a negative pressure adsorption hole, which is connected to the negative pressure groove. The product to be polished is attached to the negative pressure adsorption hole, and fixation is achieved by negative pressure. To prevent polishing liquid from flowing into the negative pressure adsorption hole, a sealing ring is also placed inside the negative pressure adsorption hole.

[0036] like Figure 3As shown, this embodiment also relates to a polishing method for irregularly shaped products, the polishing method for irregularly shaped products including: Step S10: Fix the product to be polished onto the first contour jig 31; Step S20: The pressure sensor 44 and the second contour jig 32 are brought into contact; In step S30, the first contour jig 31 moves the product to be polished. In step S40, the lifting structure 41 drives the polishing structure 43 to adjust its height in real time according to the signal from the pressure sensor 44. Step S50: Polishing structure 43 polishes the product to be polished.

[0037] Specifically, the product to be polished is fixed on the first contour jig 31. The lifting structure 41 drives the mounting plate 42, polishing structure 43 and pressure sensor 44 to move down synchronously. After the pressure sensor 44 comes into contact with the second contour jig 32, it detects the force and converts the force into an electrical signal and sends it to the PLC controller. The PLC controller has a standard value of the force stored in advance. The detected value is compared with the standard value. If the detected value is too large, the lifting structure 41 will rise. If the detected value is too small, the lifting structure will fall. At this time, the force detected by the pressure sensor 44 is the force exerted by the polishing roller 432 on the product to be polished. The moving component 20 drives the first contour jig 31 and the second contour jig 32 to move synchronously, so as to gradually adjust the polishing position. Due to the irregularity of the surface to be polished, the irregular shape of the product to be polished will affect the detection value of the pressure sensor 44. The lifting structure 41 makes adaptive adjustments to make the detection value of the pressure sensor become the standard value. At this time, the force exerted by the polishing roller 432 on the irregular surface to be polished is always uniform. With the movement of the first contour jig 31, the polishing structure 43 achieves uniform polishing of the entire surface to be polished.

[0038] In some embodiments, in step S30, the first contouring fixture 31 and the second contouring fixture 32 are arranged in parallel, and the first contouring fixture 31 and the second contouring fixture 32 are moved synchronously by the moving component 20. This arrangement is to ensure that the force exerted by the pressure sensor 44 on the second contouring fixture 32 can reflect the force exerted by the polishing roller 432 on the first contouring fixture 31.

[0039] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0040] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0041] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A polishing apparatus characterized by comprising: The utility model relates to a polishing device for polishing product, which comprises: a mounting platform (10); a moving assembly (20) arranged on the mounting platform (10); a fixing assembly (30) comprising a first profiling jig (31) and a second profiling jig (32), both of which are arranged on the moving assembly (20), and the first profiling jig (31) is used for placing a product to be polished; a polishing assembly (40) comprising a lifting structure (41), a mounting plate (42), a polishing structure (43) and a pressure sensor (44), the mounting plate (42) is connected to the lifting structure (41), the polishing structure (43) is connected to the mounting plate (42), the pressure sensor (44) is arranged on the mounting plate (42), the polishing structure (43) and the first profiling jig (31) are correspondingly arranged, and the pressure sensor (44) and the second profiling jig (32) are correspondingly arranged.

2. The polishing apparatus according to claim 1, wherein The side of the second profiling jig (32) facing the pressure sensor (44) has the same shape as the surface to be polished of the product to be polished, and the height of the second profiling jig (32) is the same as the height of the first profiling jig (31) plus the height of the product to be polished.

3. The polishing apparatus according to claim 1, wherein The moving assembly (20) comprises a first driving motor (21), a nut seat (22), a mounting seat (23), a lead screw (24) and two groups of bearing seats (25), the first driving motor (21) is fixed on the mounting platform (10), the first driving motor (21) and the lead screw (24) are in transmission connection, the nut seat (22) is sleeved on the circumferential outer side of the lead screw (24), the nut seat (22) and the mounting seat (23) are connected, the first profiling jig (31) and the second profiling jig (32) are arranged on the mounting seat (23), and two groups of the bearing seats (25) are oppositely arranged on the mounting platform (10), and the two ends of the lead screw (24) are rotatably arranged in the two groups of bearing seats (25) respectively.

4. The polishing apparatus according to claim 1, wherein The polishing structure (43) comprises a second driving motor (431) and a polishing roller (432), the mounting plate (42) has a horizontal plate and a vertical plate, the second driving motor (431) is fixed on the vertical plate, the polishing roller (432) and the second driving motor (431) are in transmission connection, and the polishing roller (432) is located above the first profiling jig (31).

5. The polishing apparatus according to claim 4, wherein The polishing structure (43) further comprises a polishing liquid spray head (433), the polishing liquid spray head (433) is mounted on the horizontal plate, and the polishing liquid spray head (433) is located above the polishing roller (432).

6. The polishing apparatus according to claim 4, wherein The lifting structure (41) comprises a support frame (411) and a lifting part (412), the support frame (411) is arranged on the mounting platform (10), one end of the lifting part (412) is fixed on the support frame (411), and the other end is connected with the horizontal plate, and the lifting part (412) is an electric push rod, a hydraulic cylinder or an air cylinder.

7. The polishing apparatus according to claim 6, wherein The support frame (411) and the vertical plate are provided with a sliding groove (4111) on the opposite side, and the vertical plate and the support frame (411) are provided with a sliding block on the opposite side, and the sliding block is movably arranged in the sliding groove (4111).

8. The polishing apparatus according to claim 1, wherein The first profiling jig (31) is fixed to the product to be polished by negative pressure or glue.

9. A method of polishing a profiled product, characterized by The special-shaped product polishing method adopts the polishing device of any one of claims 1-8, and the special-shaped product polishing method comprises: Step S10, fixing the product to be polished on the first profiling jig (31); Step S20, abutting the pressure sensor (44) and the second profiling jig (32); Step S30, the first profiling jig (31) drives the product to be polished to move; Step S40, the lifting structure (41) drives the polishing structure (43) to adjust the height in real time according to the signal of the pressure sensor (44); Step S50, the polishing structure (43) polishes the product to be polished.

10. The method of claim 9 wherein, In step S30, the first profiling jig (31) and the second profiling jig (32) are arranged in parallel, and the first profiling jig (31) and the second profiling jig (32) are synchronously moved by the moving assembly (20).

Images