Crystalline silicon plate side edge polishing device

Abstract

The invention discloses a crystalline silicon plate side edge polishing device, and relates to the technical field of crystalline silicon plate processing, the crystalline silicon plate side edge polishing device comprises a rack, the top of the rack is provided with a main conveyor belt and a polishing device used for polishing the side wall of a crystalline silicon plate, the rack is provided with a chain scraper conveyor, and the chain scraper conveyor corresponds to the polishing device in position; and an adsorption assembly for adsorbing and positioning the bottom surface of the crystal silicon plate is mounted on the chain scraper conveyor. Through the arrangement of the adsorption assembly, when the crystalline silicon plate is conveyed to the polishing device to be polished, vertically downward adsorption force is provided for the crystalline silicon plate, friction force between the crystalline silicon plate and the main conveying belt is increased, and meanwhile adsorption positioning is formed for the bottom of the crystalline silicon plate; therefore, the possibility that the crystalline silicon plate slides and deflects when the crystalline silicon plate makes contact with the polishing disc is reduced, and it is ensured that the crystalline silicon plate is stabilized on a preset constant polishing path.

Description

Technical Field

[0001] This invention relates to the field of crystalline silicon substrate processing technology, and more specifically, to a crystalline silicon substrate side polishing device. Background Technology

[0002] After being cut, the edges of crystalline silicon substrates are rough and sharp, requiring polishing. The edge polishing process is a key step in the processing of crystalline silicon substrates.

[0003] In existing technologies, conveyor belts are commonly used to continuously transport crystalline silicon substrates to a workstation equipped with high-speed rotating polishing discs on both sides for side polishing. However, in actual production, it has been found that when the polishing discs come into high-speed contact with the sides of the crystalline silicon substrate, significant lateral friction and impact forces are generated. Due to the limited static friction between the crystalline silicon substrate and the conveyor belt, and the inherent mass inertia of the substrate, it is highly susceptible to slippage or deflection on the conveyor belt. This causes a deviation between the preset constant polishing path and the actual edge position of the substrate, resulting in missed or over-polishing, and in severe cases, chipping and other damage at the edges. Summary of the Invention

[0004] To solve the above-mentioned technical problems, the present invention provides a side polishing device for crystalline silicon substrates.

[0005] The technical solution is as follows: A side polishing device for crystalline silicon substrates includes a frame, a main conveyor belt mounted on the top of the frame, the main conveyor belt extending along the length of the frame from the front end to the rear end of the frame, two mounting seats symmetrically mounted at the middle of the top of the frame, the two mounting seats being located outside the main conveyor belt, and polishing devices for polishing the sidewalls of the crystalline silicon substrates mounted on the two mounting seats, a chain conveyor mounted on the frame, the chain conveyor corresponding to the position of the polishing devices, and an adsorption component for adsorbing and positioning the bottom surface of the crystalline silicon substrates.

[0006] Furthermore, the adsorption assembly includes two symmetrical fixed seats fixedly mounted on the frame and multiple adsorption components detachably disposed at both ends of the chain plate of the chain conveyor. The fixed seats include two symmetrically arranged and detachably connected mating components. The side walls of the two mating components that are close to each other are provided with grooves. The two grooves together form an air cavity. The periphery of the grooves has protrusions. An air passage communicating with the air cavity is formed between the protrusions of the two mating components. The adsorption components communicate with the air passage and the air cavity.

[0007] Furthermore, the adsorption component includes a connecting arm fixedly connected to the end of the chain plate of the chain conveyor, a vertical tube slidably mounted on the connecting arm, a base mounted on the top of the vertical tube, a suction cup mounted on the top of the base, and a spring installed between the base and the connecting arm.

[0008] Furthermore, a sliding groove is provided on the side of the protrusion away from the groove, and the sliding grooves of the two mating parts together form a sliding cavity. An air pipe is installed at the bottom of the vertical tube, and a slider that mates with the sliding cavity is installed at the end of the air pipe away from the vertical tube.

[0009] Furthermore, an annular flexible belt is slidably installed inside the sliding cavity, and the annular flexible belt is fixedly connected to the top of the slider. An electromagnetic valve is installed on the vertical tube, and the electromagnetic valve is located below the connecting arm.

[0010] Furthermore, a guide groove is provided on the side of the protrusion facing the sliding cavity, a positioning block that cooperates with the guide groove is provided at the bottom of the slider, and pulleys that cooperate with the side wall of the sliding groove are rotatably installed at both ends of the slider.

[0011] Furthermore, a trigger switch is installed at the bottom of the connecting arm, a first trigger element for turning on the trigger switch is fixedly installed at the bottom of the fixed seat near the input end of the chain conveyor, and a second trigger element for turning off the trigger switch is fixedly installed at the top of the fixed seat near the output end of the chain conveyor. The first trigger element and the second trigger element are located on the movement path of the trigger switch.

[0012] Furthermore, each of the mounting bases is equipped with an auxiliary conveyor belt and a clamping assembly. The auxiliary conveyor belt is located above the main conveyor belt and includes two drive wheels with a belt installed between them. The clamping assembly includes a fixed frame located on the side wall of the mounting base and multiple cylinders fixedly mounted on the fixed frame. A connecting plate is installed on the telescopic end of the cylinder. The fixed frame is provided with a mounting cavity. Multiple evenly spaced mounting posts are fixedly mounted on the connecting plate. After passing through the bottom wall of the mounting cavity, the mounting posts are connected to a pressure plate. The mounting posts slide in cooperation with the fixed frame.

[0013] Furthermore, two guide assemblies are symmetrically installed on the frame near the input end of the main conveyor belt. The guide assembly includes a drive device located on the top of the frame. The drive device is fixedly connected to a mounting frame, and the mounting frame is provided with rollers that cooperate with the side wall of the crystalline silicon plate.

[0014] Furthermore, a rinsing device and a drying device are fixedly installed on the frame at the output end of the chain conveyor.

[0015] As described above, the beneficial effects of the crystalline silicon substrate side polishing device of the present invention are as follows: By incorporating the adsorption components, a vertically downward adsorption force is provided to the silicon wafers as they are conveyed to the polishing device. This increases the friction between the wafers and the main conveyor belt while simultaneously creating an adsorption and positioning effect on the bottom of the wafers. This reduces the possibility of slippage and deflection of the wafers when they come into contact with the polishing disc, ensuring that the wafers remain stable on the preset, constant polishing path. This prevents damage such as missed or over-polishing, as well as chipping at the edges and corners, significantly improving product yield and surface consistency. Furthermore, the fully automated conveying, positioning, polishing, and release process enables efficient and continuous operation, enhancing production efficiency.

[0016] The spring mechanism provides upward pressure, ensuring the suction cup adapts to minor unevenness on the bottom surface of the silicon wafer, achieving a tight fit between the suction device and the wafer. Simultaneously, it absorbs minor vertical movement that may occur during transport, preventing rigid impacts from damaging the suction cup or the wafer.

[0017] By coordinating a trigger switch with the first and second triggering elements, the adsorption and release processes are fully automated. Before the silicon wafer is moved by the chain conveyor to the polishing area (i.e., before the starting point of the polishing device), the first triggering element activates the trigger switch, opening the solenoid valve and initiating adsorption. When the silicon wafer is about to leave the polishing area (i.e., the polishing device), the second triggering element deactivates the trigger switch, thereby closing the solenoid valve and stopping the adsorption. This gradually releases the adsorption and positioning of the bottom of the silicon wafer. The entire process requires no manual intervention or additional sensor positioning, cleverly utilizing the positional relationships of the mechanical structure itself for control. This improves the reliability and response speed of the device, achieving precise synchronization with the production cycle.

[0018] By setting the clamping component, the top surface of the crystalline silicon plate is limited, which also creates friction between the top surface of the crystalline silicon plate and the belt of the auxiliary conveyor belt, thus improving the stability of the polishing device when polishing the side wall of the crystalline silicon plate. Attached Figure Description

[0019] Figure 1 This is a three-dimensional schematic diagram of the overall components of the present invention from a first perspective; Figure 2 This is a two-dimensional schematic diagram of the overall components of the present invention from a second perspective; Figure 3 This is a three-dimensional schematic diagram of the clamping assembly and other components of the present invention; Figure 4 This is a three-dimensional schematic diagram of the chain conveyor and adsorption assembly of the present invention; Figure 5 This is a cross-sectional schematic diagram of the chain conveyor and adsorption assembly of the present invention; Figure 6 This is a three-dimensional schematic diagram of the adsorption component of the present invention; Figure 7 This is a side sectional view of the entire invention; Figure 8 This is a three-dimensional schematic diagram of the second trigger element and other components of the present invention.

[0020] The reference numerals in the accompanying drawings of this invention are as follows: 100. Rack; 200. Main conveyor belt; 210. Chain conveyor; 300. Auxiliary conveyor belt; 410. Fixing bracket; 420. Cylinder; 430. Mounting post; 440. Pressure plate; 450. Connecting plate; 500. Polishing equipment; 610. Mounting bracket; 620. Roller; 630. Drive unit; 710. Fixing base; 711. Groove; 712. Protrusion; 713. Slide groove; 714. Guide groove; 720. Bolt; 730. Annular flexible belt; 741. Connecting arm; 742. Vertical tube; 743. Base; 744. Suction cup; 745. Spring; 746. Solenoid valve; 747. Air pipe; 748. Slider; 7481. Pulley; 7482. Positioning block; 749. Trigger switch; 750. First trigger element; 760. Second trigger element. Detailed Implementation

[0021] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0022] The embodiments provided by the present invention will be described in detail below: like Figures 1 to 8As shown, a side polishing device for crystalline silicon substrates includes a frame 100. Multiple main conveyor belts 200 are mounted on the top of the frame 100. The conveying direction of the main conveyor belts 200 is along the length of the frame 100, extending from the head end to the tail end of the frame 100. The multiple main conveyor belts 200 are arranged along the width direction of the frame 100, and are parallel to each other with equal spacing. The main conveyor belts 200 are used to transport crystalline silicon substrates. Due to the large area of ​​the crystalline silicon substrates, the use of multiple main conveyor belts 200 ensures the stability of the transport. Two mounting seats are symmetrically mounted at the middle of the top of the frame 100, located outside the two outermost main conveyor belts 200. Each mounting seat is equipped with an auxiliary conveyor belt 300, which is positioned above the main conveyor belts 200. The crystalline silicon substrate can pass through the gap between the auxiliary conveyor belt 300 and the main conveyor belt 200. A polishing device 500 for polishing the sidewalls of a crystalline silicon substrate is mounted on the mounting base. The polishing device 500 is located outside the auxiliary conveyor belt 300. A chain conveyor 210 is mounted on the frame 100, corresponding to the polishing device 500. The chain conveyor 210 is located below the main conveyor belt 200, and its operation does not interfere with the operation of the main conveyor belt 200. An adsorption assembly for adsorbing and positioning the bottom wall of the crystalline silicon substrate is mounted on the chain conveyor 210.

[0023] It should be noted that the polishing device 500 includes a motor and a polishing disc located on the output end of the motor. The polishing disc is driven by the motor to rotate and polish the sidewall of the crystalline silicon plate. This is existing technology and will not be described in detail here.

[0024] A rinsing device (not shown) and a drying device (not shown) are fixedly installed on the frame 100 at the output end of the chain conveyor 210. The rinsing device is used in conjunction with the polishing device 500 to rinse the silicon plate when polishing the sidewall of the silicon plate, and the drying device is used to dry the water on the silicon plate.

[0025] The adsorption assembly includes two symmetrical mounting bases 710 fixedly mounted on the frame 100 and multiple adsorption components detachably mounted at both ends of the chain plate of the chain conveyor 210. The mounting base 710 includes two symmetrically arranged interlocking fittings. The two symmetrically arranged fittings are detachably connected by bolts 720. The side wall of the two fittings that are close to each other has a groove 711. The grooves 711 of the two fittings together form an air cavity. The grooves 711 have protrusions 712 around their periphery. An air passage communicating with the air cavity is formed between the protrusions 712 of the two fittings.

[0026] A groove 713 is provided on the side of the protrusion 712 away from the groove 711. The grooves 713 of the two mating parts together form a sliding cavity. An annular flexible belt 730 is slidably installed in the sliding cavity. A guide groove 714 is provided on the side of the protrusion 712 facing the sliding cavity.

[0027] It should be noted that the adsorption assembly also includes a negative pressure pump (not shown) mounted on the mounting base 710. The negative pressure pump is used to draw the air chamber to negative pressure. This is existing technology and will not be described in detail here.

[0028] like Figure 5 and Figure 6 As shown, the adsorption component includes a connecting arm 741 fixedly connected to the end of the chain plate of the chain conveyor 210. A vertical tube 742 is slidably mounted on the connecting arm 741. A base 743 is mounted on the top of the vertical tube 742. A suction cup 744 for adsorbing the bottom surface of the crystalline silicon plate is mounted on the top of the base 743. A spring 745 is installed between the base 743 and the connecting arm 741. The spring 745 is used to provide an elastic force to keep the base 743 upward.

[0029] It should be noted that, through the design of spring 745, the upward clamping force provided by spring 745 ensures that the suction cup 744 adapts to the slight unevenness of the bottom surface of the crystalline silicon plate, achieving a tight fit between the suction component and the crystalline silicon plate. At the same time, it can also absorb the slight vertical movement that may occur in the crystalline silicon plate during transportation, preventing rigid impacts from damaging the suction cup 744 or the crystalline silicon plate.

[0030] Understandably, the mounting base 710 is detachably assembled from two symmetrically arranged mating parts, which facilitates the installation of the slider 748 and the annular flexible belt 730.

[0031] like Figure 6 As shown, an air pipe 747 is fixedly connected to the bottom of the vertical pipe 742. A slider 748 that cooperates with the sliding cavity is installed at the end of the air pipe 747 away from the vertical pipe 742. The slider 748 is located in the sliding cavity and can slide in the sliding cavity. An annular flexible belt 730 is connected to the top of the slider 748. A solenoid valve 746 is installed on the vertical pipe 742. The solenoid valve 746 is located below the connecting arm 741 and can control the opening and closing of the air passage of the vertical pipe 742.

[0032] Both ends of the slider 748 are rotatably mounted with pulleys 7481 that cooperate with the side wall of the slide groove 713, and the bottom of the slider 748 is provided with a positioning block 7482 that cooperates with the guide groove 714.

[0033] It should be noted that the slider 748 and pulley 7481 are designed to allow the slider 748 to slide stably along the sliding cavity. In conjunction with the positioning block 7482, the slider 748 is prevented from rotating during movement, thereby further improving the stability of the slider 748's sliding motion.

[0034] Specifically, the operation of the chain conveyor 210 drives the chain plate on the chain conveyor 210 to move in a cycle. The cyclic movement of the chain plate drives the adsorption component on the chain plate to move in a cycle. The movement of the adsorption component drives the slider 748 on the adsorption component to move. The movement of the slider 748 drives the annular flexible belt 730 to slide along the sliding cavity.

[0035] like Figures 5 to 8 As shown, a trigger switch 749 is installed at the bottom of the connecting arm 741. A first trigger 750 for turning on the trigger switch 749 is fixedly installed at the bottom of the fixed base 710 near the input end of the chain conveyor 210. A second trigger 760 for turning off the trigger switch 749 is fixedly installed at the top of the fixed base 710 near the output end of the chain conveyor 210. The first trigger 750 and the second trigger 760 are located on the movement path of the trigger switch 749. When a certain adsorption component moves to the output end of the chain conveyor 210, and the trigger switch 749 on the adsorption component contacts the second trigger 760, the second trigger 760 will touch the button of the trigger switch 749, causing the adsorption component to close. The adsorption component continues to move with the chain conveyor 210 until it moves to the input end of the chain conveyor 210, and when the trigger switch 749 on the adsorption component contacts the first trigger 750, the first trigger 750 will touch the button of the trigger switch 749, causing the adsorption component to open. Therefore, when the adsorption component moves further to above the fixed seat 710, it is in the open adsorption state.

[0036] By setting up the adsorption component, when the silicon wafer is conveyed to the polishing device 500 for polishing, a vertically downward adsorption force is provided on the silicon wafer. This increases the friction between the silicon wafer and the main conveyor belt 200, while also forming an adsorption and positioning effect on the bottom of the silicon wafer. This reduces the possibility of slippage and deflection of the silicon wafer when it comes into contact with the polishing pad, ensuring that the silicon wafer is stable on the preset constant polishing path. This avoids damage such as missed polishing, over-polishing, and chipping at the edges and corners, significantly improving the product qualification rate and surface consistency. At the same time, the fully automated conveying, positioning, polishing, and release process enables efficient and continuous operation, improving production efficiency.

[0037] Furthermore, the adsorption and release processes are fully automated through the cooperation of the trigger switch 749 with the first trigger 750 and the second trigger 760. Before the silicon wafer is moved by the chain conveyor 210 to the polishing area (i.e., before the starting point of the polishing device 500), the first trigger 750 activates the trigger switch 749, opening the solenoid valve 746, initiating adsorption. When the silicon wafer is about to leave the polishing area (i.e., the polishing device 500), the second trigger 760 deactivates the trigger switch 749, thereby closing the solenoid valve 746, stopping the adsorption, and gradually releasing the adsorption and positioning of the bottom of the silicon wafer. The entire process requires no manual intervention or additional sensor positioning, cleverly utilizing the positional relationships of the mechanical structure itself for control, improving the reliability and response speed of the device, and achieving precise synchronization with the production cycle.

[0038] The overall workflow is as follows: The main conveyor belt 200 transports the silicon wafer to the chain conveyor 210. When the silicon wafer reaches the input end of the chain conveyor 210, it contacts the suction cups 744, and the bottom surface of the wafer is attracted by the suction cups 744. After the wafer is completely transported onto the chain conveyor 210, the bottom surface of the wafer is attracted by multiple suction cups 744, forming an adsorption positioning on the bottom of the wafer. The polishing device 500 polishes the sidewalls of the silicon wafer. When the wafer is transported to the output end of the chain conveyor 210, the second trigger 760 sequentially triggers the trigger switch 749 on the adsorption component, closing the solenoid valve 746, causing the adsorption component to sequentially detach from the bottom of the wafer, thereby releasing the adsorption positioning of the wafer. When the closed adsorption unit rotates back to the input end of the chain conveyor 210 along with the chain conveyor 210, it touches the first trigger 750. The first trigger 750 triggers the trigger switch 749 on the adsorption unit to reopen the solenoid valve 746. This cycle can be repeated to continuously adsorb and position the crystalline silicon plate.

[0039] like Figures 1 to 3As shown, the auxiliary conveyor belt 300 includes two drive wheels, with a belt installed between them. A clamping assembly is fixedly mounted on the mounting base. The clamping assembly includes a fixing frame 410 located on the side wall of the mounting base and multiple cylinders 420 fixedly mounted on the fixing frame 410. The multiple cylinders 420 are arranged in a row and evenly spaced on the fixing frame 410, which is located between the two drive wheels. A connecting plate 450 is installed on the telescopic end of the cylinders 420. The fixing frame 410 has a mounting cavity. Multiple evenly spaced mounting posts 430 are fixedly mounted on the connecting plate 450. The mounting posts 430 pass through the bottom wall of the mounting cavity and are connected to a pressure plate 440. The mounting posts 430 slide in cooperation with the fixing frame 410. The pressure plate 440 is located above the belt of the auxiliary conveyor belt 300 in the lower position. The cylinders 420 drive the connecting plate 450 to move up and down, causing the pressure plate 440 on the mounting posts 430 to squeeze the belt of the auxiliary conveyor belt 300 in the lower position.

[0040] When the silicon wafer is conveyed to the position of the chain conveyor 210, the cylinder 420 drives the connecting plate 450 and the pressure plate 440 to move downward, limiting the top surface of the silicon wafer and also creating friction between the top surface of the silicon wafer and the belt of the auxiliary conveyor belt 300, which improves the stability of the polishing device 500 when polishing the side wall of the silicon wafer.

[0041] like Figure 2 As shown, two guide components are symmetrically installed on the frame 100 near the input end of the main conveyor belt 200. The guide components include a drive device 630 located on the top of the frame 100. In this embodiment, the drive device 630 can be a cylinder. A mounting bracket 610 is installed on the telescopic end of the drive device 630. The mounting bracket 610 is provided with rollers 620 that cooperate with the side wall of the crystalline silicon plate.

[0042] When the silicon wafer is placed on the main conveyor belt 200, it is located between two guide components. The drive unit 630 pushes the roller 620 to move toward the silicon wafer, guiding it so that it can be transported along a designated path, providing a basis for the silicon wafer to enter the polishing unit 500 for polishing.

[0043] It is readily understood that those skilled in the art can combine, split, or reorganize the embodiments provided in this application to obtain other embodiments, all of which do not exceed the protection scope of this application.

[0044] The present invention and its embodiments have been described above illustratively. This description is not restrictive, and the embodiments shown are only a part of the embodiments of the present invention. The actual structure is not limited thereto. Therefore, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the spirit of the present invention, they should all fall within the protection scope of the present invention.

Claims

1. A side polishing device for crystalline silicon substrates, characterized in that, The system includes a frame (100), a main conveyor belt (200) mounted on the top of the frame (100), the conveying direction of the main conveyor belt (200) is along the length of the frame (100), the main conveyor belt (200) extends from the head end of the frame (100) to the tail end of the frame (100), two mounting seats are symmetrically mounted in the middle of the top of the frame (100), the two mounting seats are located on the outside of the main conveyor belt (200), the two mounting seats are equipped with polishing devices (500) for polishing the sidewalls of the crystalline silicon plate, a chain conveyor (210) is mounted on the frame (100), the chain conveyor (210) corresponds to the polishing device (500), and an adsorption component for adsorbing and positioning the bottom surface of the crystalline silicon plate is mounted on the chain conveyor (210).

2. The side polishing device for crystalline silicon substrates according to claim 1, characterized in that, The adsorption assembly includes two symmetrical fixed seats (710) fixedly installed on the frame (100) and a plurality of adsorption components detachably disposed at both ends of the chain plate of the chain conveyor (210). The fixed seat (710) includes two symmetrically arranged and detachably connected mating parts. The side wall of the two mating parts that are close to each other is provided with a groove (711). The two grooves (711) together form an air cavity. The groove (711) has a protrusion (712) around its periphery. An air passage communicating with the air cavity is formed between the protrusions (712) of the two mating parts. The adsorption component communicates with the air passage and the air cavity.

3. The side polishing device for crystalline silicon substrates according to claim 2, characterized in that, The adsorption component includes a connecting arm (741) fixedly connected to the end of the chain plate of the chain conveyor (210), a vertical tube (742) is slidably installed on the connecting arm (741), a base (743) is installed at the top of the vertical tube (742), a suction cup (744) is installed at the top of the base (743), and a spring (745) is installed between the base (743) and the connecting arm (741).

4. The side polishing device for crystalline silicon substrates according to claim 3, characterized in that, The protrusion (712) has a sliding groove (713) on the side away from the groove (711). The sliding grooves (713) of the two mating parts together form a sliding cavity. An air pipe (747) is installed at the bottom of the vertical tube (742). A slider (748) that mates with the sliding cavity is installed at the end of the air pipe (747) away from the vertical tube (742).

5. The side polishing device for crystalline silicon substrates according to claim 4, characterized in that, An annular flexible belt (730) is slidably installed inside the sliding cavity. The annular flexible belt (730) is fixedly connected to the top of the slider (748). A solenoid valve (746) is installed on the vertical tube (742). The solenoid valve (746) is located below the connecting arm (741).

6. The side polishing device for crystalline silicon substrates according to claim 5, characterized in that, The protrusion (712) has a guide groove (714) on the side facing the sliding cavity. The bottom of the slider (748) is provided with a positioning block (7482) that cooperates with the guide groove (714). Both ends of the slider (748) are rotatably mounted with pulleys (7481) that cooperate with the side wall of the sliding groove (713).

7. The side polishing device for crystalline silicon substrates according to claim 6, characterized in that, A trigger switch (749) is installed at the bottom of the connecting arm (741). A first trigger (750) for turning on the trigger switch (749) is fixedly installed at the bottom of the fixed seat (710) near the input end of the chain conveyor (210). A second trigger (760) for turning off the trigger switch (749) is fixedly installed at the top of the fixed seat (710) near the output end of the chain conveyor (210). The first trigger (750) and the second trigger (760) are located on the movement path of the trigger switch (749).

8. The side polishing device for crystalline silicon substrates according to claim 1, characterized in that, Each of the mounting bases is equipped with an auxiliary conveyor belt (300) and a clamping assembly. The auxiliary conveyor belt (300) is located above the main conveyor belt (200). The auxiliary conveyor belt (300) includes two drive wheels and a belt is installed between the two drive wheels. The clamping assembly includes a fixed frame (410) located on the side wall of the mounting base and multiple cylinders (420) fixedly installed on the fixed frame (410). A connecting plate (450) is installed on the telescopic end of the cylinder (420). The fixed frame (410) is provided with a mounting cavity. Multiple evenly spaced mounting columns (430) are fixedly installed on the connecting plate (450). After the mounting column (430) passes through the bottom wall of the mounting cavity, it is connected to a pressure plate (440). The mounting column (430) slides in cooperation with the fixed frame (410).

9. The side polishing device for a crystalline silicon substrate according to claim 1, characterized in that, Two guide components are symmetrically installed on the rack (100) near the input end of the main conveyor belt (200). The guide components include a drive device (630) located on the top of the rack (100). The drive device (630) is fixedly connected to a mounting frame (610). The mounting frame (610) is provided with rollers (620) that cooperate with the side wall of the silicon wafer.

10. The side polishing device for a crystalline silicon substrate according to claim 1, characterized in that, The frame (100) is fixedly installed with a rinsing device and a drying device at the output end of the chain conveyor (210).

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