An octagonal sputtering machine with simultaneous wafer picking

Abstract

The application relates to the field of sputtering technology, in particular to a film taking synchronous type eight-edge sputtering machine, which comprises a main cavity and a reaction cavity installed on the outer side of the main cavity, the middle part of the main cavity is internally connected with a clamping and conveying mechanism, a heating cavity is installed at the front of the main cavity, a heating mechanism is fixed above the heating cavity, a edge-positioning cavity is installed on the outer side of the main cavity at the left side of the heating cavity, and a camera is connected above the edge-positioning cavity. The film taking synchronous type eight-edge sputtering machine is characterized in that one air cylinder is used in cooperation with two pilot throttles, so that the pilot throttle can stably adjust the movement speed of the air cylinder, thereby ensuring the synchronism of the action of the two clamping blocks below the clamping plate, the two clamping blocks can take films synchronously, the problem of incorrect film taking is avoided, the processing quality in the later stage is improved, six reaction cavities can be sequentially installed on six surfaces, and the manufacturing efficiency of the eight-edge sputtering machine for electronic special materials is improved.

Description

Technical Field

[0001] This invention relates to the field of sputtering technology, specifically to an octagonal sputtering machine with simultaneous wafer pick-up. Background Technology

[0002] Electronic materials are widely used in the fields of electronic technology and microelectronics. When manufacturing electronic materials, sputtering machines are required. Sputtering machines sputter target atoms at high speed and deposit them onto the surface of the substrate to improve the stability of electronic materials.

[0003] For example, the patent application published in the prior art with publication number "CN120174321A" is entitled "A Bipolar Figure-Eight Magnetron Sputtering Machine". It discloses a supporting frame, a symmetrically arranged first main chamber module and second main chamber module, a transfer buffer chamber module, multiple processing chamber modules and inlet / outlet chamber modules. It can be quickly replaced by a movable transport frame, and the process chambers can be freely combined according to process requirements to meet diverse process needs. The inclined gate valve design reduces the footprint and enhances the uniformity of structural stress, extending the equipment life. The transfer buffer chamber provides cooling and temporary storage functions, isolates the thermal influence of upstream and downstream processes, and ensures the stability of the material handling environment. The medium flow rate and mixing ratio are adjusted in real time through branch pipelines and intelligent distribution units to accurately match the process parameters of each chamber and reduce energy consumption.

[0004] In the existing octagonal sputtering machine, when cooling the wafer is required, the clamping mechanism is driven by lifting two cylinders. This causes the two cylinders to move asynchronously, preventing them from picking up the wafer in sync and resulting in misaligned wafer picking. This not only affects subsequent processing operations but may also damage the wafer. Therefore, we propose an octagonal sputtering machine with synchronous wafer picking to solve the problems mentioned above. Summary of the Invention

[0005] The purpose of this invention is to provide a wafer-picking synchronous octagonal sputtering machine to solve the problem mentioned in the background art. In current octagonal sputtering machines on the market, when the wafer needs to be cooled, the clamping mechanism is driven by lifting two cylinders. This causes the two cylinders to move asynchronously, making it impossible for them to pick up the wafer in sync. This results in misaligned wafer picking, which not only affects subsequent processing operations but may also damage the wafer.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a wafer pick-up synchronous octagonal sputtering machine, comprising a main cavity and a reaction chamber installed on its outer side, wherein a clamping and conveying mechanism is connected to the middle of the main cavity, a heating chamber is installed at the front of the main cavity, a heating mechanism is fixed above the heating chamber, and an edge-tracking positioning chamber is installed on the outer side of the main cavity to the left of the heating chamber, a camera is connected above the edge-tracking positioning chamber, and a cooling chamber is fixed on the outer side of the main cavity to the right of the heating chamber, and a sealing frame is fixed on the upper surface of the cooling chamber. A cylinder is installed through the upper part of the sealing frame, and a clamping mechanism for clamping the wafer is connected to the lower end of the cylinder. Pilot-operated throttle valves are installed at both the air inlet and exhaust port of the cylinder to achieve smooth adjustment of the cylinder movement speed.

[0007] Preferably, the cooling cavity is open at both the top and bottom, and the length of the opening at the top of the cooling cavity is greater than the length of the opening at the bottom of the cooling cavity.

[0008] The above structure allows for easy embedding of the cooling plate into the upper part of the cooling chamber, and also facilitates the disassembly of the cooling plate in the cooling chamber later, meeting different usage needs. The open design at the bottom of the cooling chamber facilitates the installation and disassembly of the water inlet and drain pipes, making operation convenient.

[0009] Preferably, a cooling plate is installed inside the cooling cavity, and the upper surface of the cooling plate is provided with a diversion hole, a diversion groove and a convergence groove. The diversion hole is connected to the diversion groove on the outside, and the diversion groove is connected to the convergence groove on the outside. The length of the cooling plate is greater than the length of the opening below the cooling cavity.

[0010] The above structure allows water in the diversion hole to flow into the diversion channel, and water in the diversion channel to flow into the convergence channel.

[0011] Preferably, the diversion hole is inclined, the diversion groove is composed of a rectangular groove and an arc-shaped groove, and the lowest point of the convergence groove is lower than the lowest point of the diversion hole and the diversion groove.

[0012] The above structure allows the water in the flow collection tank to be discharged through the drain pipe later.

[0013] Preferably, a water inlet pipe is installed on the bottom surface of the cooling chamber, and the upper part of the water inlet pipe is connected to the interior of the diversion hole. A drain pipe is installed through the cooling plate located directly below the flow collection groove. The upper part of the cooling plate is connected to the sealing cover plate by a sealing ring and screws.

[0014] With the above structure, the sealing cover and the cooling plate are sealed together to prevent coolant leakage.

[0015] Preferably, the clamping mechanism includes a clamping plate installed at the lower end of the cylinder, and clamping blocks are installed on the lower left and right sides of the clamping plate, with the clamping blocks arranged in an "L" shape.

[0016] With the above-described structure, the L-shaped clamping block can effectively lift and hold the corresponding position on the bottom surface of the wafer.

[0017] Preferably, a fixed suction cup is embedded inside the horizontal section of the clamping block, and a control component for controlling its automatic adsorption and automatic release is installed inside the fixed suction cup.

[0018] With the above structure, there is no need to manually control the adsorption and release of the fixed suction cup, making operation convenient.

[0019] Preferably, the control component includes a piston assembly that fits and is connected to the inner wall of the fixed suction cup, and the bottom end of the piston assembly penetrates the bottom surface of the fixed suction cup and is connected to the connecting plate. Moreover, the bottom surfaces of both ends of the connecting plate are connected to the grooves opened inside the horizontal section of the clamping block through return springs.

[0020] With the above-described structure, the stored force of the reset spring can automatically drive the connecting plate to move upward and reset.

[0021] Preferably, two connecting ropes are symmetrically installed on the bottom surface of the connecting plate, a guide rod is installed on the bottom surface of the horizontal section of the clamping block, and one end of the connecting rope passes through the outside of the guide rod and then through the inside of the vertical section of the clamping block.

[0022] Preferably, the upper end of the connecting rope passes through the interior of the clamping plate and connects to the inner wall of the sealing frame.

[0023] With the above structure, the upper end of the connecting rope is fixed and does not move. Moreover, the connecting rope is slidably connected to the inside of the clamping plate and the vertical section of the clamping block, so that the lower end of the connecting rope will be pulled when the clamping plate and the clamping block descend.

[0024] Compared with the prior art, the beneficial effects of the present invention are: this synchronous wafer-picking octagonal sputtering machine allows two clamping blocks to pick up wafers simultaneously, avoiding the problem of misaligned wafer picking. Simultaneously, six reaction chambers can be sequentially installed on six sides, improving the manufacturing efficiency of the octagonal sputtering machine for electronic-specific materials. The specific details are as follows:

[0025] (1) By setting up a cylinder and two pilot-operated throttle valves, the pilot-operated throttle valves can smoothly adjust the cylinder movement speed, ensuring that the cylinder can stably drive the clamping plate and clamping block to move, thereby ensuring the synchronicity of the two clamping blocks under the clamping plate, so that the two clamping blocks can pick up the wafer synchronously, avoiding the problem of incorrect wafer picking, thereby improving the subsequent processing quality and facilitating wafer protection;

[0026] (2) The heating chamber is integrated into the front of the main cavity, so that an additional reaction chamber can be installed on the working surface of the main cavity. At the same time, six reaction chambers can be installed on the six sides in sequence, which improves the manufacturing efficiency of the octagonal sputtering machine for electronic special materials.

[0027] (3) By adjusting the settings of the components, the fixed suction cup can automatically adsorb the wafer, thereby further improving the stability of the clamping block in clamping the wafer, and further ensuring the synchronization of wafer removal, which facilitates the cooling operation of the wafer and avoids damage to the wafer due to unstable clamping.

[0028] (4) At the same time, the fixed suction cup can automatically release the adsorption operation of the wafer by the storage of the reset spring. No additional power source is required, and no manual release operation is required. The operation is convenient and meets the subsequent use needs. It will not affect the use efficiency of the octagonal sputtering machine. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the present invention;

[0030] Figure 2 This is a schematic diagram of the three-dimensional structure of the main cavity of the present invention;

[0031] Figure 3 This is a schematic diagram of the rear view of the main cavity structure of the present invention;

[0032] Figure 4 This is a schematic cross-sectional view of the cooling cavity structure of the present invention;

[0033] Figure 5 This is a bottom view of the sealing frame structure of the present invention;

[0034] Figure 6 This is a schematic diagram of the three-dimensional structure of the clamping support block of the present invention;

[0035] Figure 7 This is a schematic diagram of the separation structure of the cooling plate and the sealing cover plate of the present invention;

[0036] Figure 8 This is a schematic cross-sectional view of the cooling plate structure of the present invention;

[0037] Figure 9 This is a schematic diagram of the three-dimensional structure of the clamping support block in Embodiment 2 of the present invention;

[0038] Figure 10 This is a schematic cross-sectional view of the clamping support block in Embodiment 2 of the present invention;

[0039] Figure 11 This is a bottom view schematic diagram of the clamping support block structure in Embodiment 2 of the present invention;

[0040] Figure 12 This is a cross-sectional view of the fixed suction cup structure of the present invention.

[0041] In the diagram: 1. Main cavity; 2. Reaction chamber; 3. Clamping and conveying mechanism; 4. Edge-tracking positioning chamber; 5. Camera; 6. Heating chamber; 7. Cooling chamber; 8. Sealing frame; 9. Cylinder; 10. Heating mechanism; 11. Pilot-operated throttle valve; 12. Clamping plate; 13. Clamping support block; 14. Cooling plate; 141. Diverting hole; 142. Diverting groove; 143. Converging groove; 15. Sealing cover plate; 16. Water inlet pipe; 17. Drain pipe; 18. Fixed suction cup; 19. Connecting plate; 20. Connecting rope; 21. Guide rod; 22. Return spring; 23. Piston assembly. Detailed Implementation

[0042] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0043] Please see Figures 1-12 The present invention provides the following technical solution:

[0044] Example 1: The synchronous wafer pick-up octagonal sputtering machine in this example uses a cylinder 9 in conjunction with two pilot-operated throttle valves 11 to ensure the synchronous movement of the two clamping blocks 13 below the clamping plate 12. This allows the two clamping blocks 13 to pick up the wafer synchronously, avoiding misalignment during wafer pick-up, preventing wafer damage, and avoiding interference with subsequent processing operations. For the specific structure, please refer to the attached diagram. Figures 1-8As shown, the device includes a main cavity 1 and a reaction chamber 2 installed on its outer side. A clamping and conveying mechanism 3 is connected to the middle of the main cavity 1. A heating chamber 6 is installed in front of the main cavity 1. A heating mechanism 10 is fixed above the heating chamber 6. An edge-tracking positioning chamber 4 is installed on the outer side of the main cavity 1 to the left of the heating chamber 6. A camera 5 is connected above the edge-tracking positioning chamber 4. A cooling chamber 7 is fixed on the outer side of the main cavity 1 to the right of the heating chamber 6. A sealing frame 8 is fixed on the upper surface of the cooling chamber 7. A cylinder 9 is installed through the upper part of the sealing frame 8. A clamping mechanism for holding the wafer is connected to the lower end of the cylinder 9. Pilot-operated throttle valves 11 are installed at the air inlet and exhaust port of the cylinder 9 to achieve smooth adjustment of the movement speed of the cylinder 9.

[0045] The cooling chamber 7 has openings at both the top and bottom, with the length of the upper opening greater than the length of the lower opening. A cooling plate 14 is installed inside the cooling chamber 7, and the upper surface of the cooling plate 14 has a diversion hole 141, a diversion groove 142, and a converging groove 143. The diversion hole 141 is connected to the diversion groove 142 on its outer side, and the diversion groove 142 is connected to the converging groove 143 on its outer side. The length of the cooling plate 14 is greater than the length of the lower opening of the cooling chamber 7. The diversion hole 141 is inclined, and the diversion groove 142 consists of rectangular and arc-shaped grooves. Furthermore, the lowest point of the converging channel 143 is lower than the lowest point of the diversion hole 141 and the diversion channel 142. A water inlet pipe 16 is installed on the bottom surface of the cooling chamber 7, and the upper part of the water inlet pipe 16 is connected to the interior of the diversion hole 141. A drain pipe 17 is installed through the cooling plate 14 located directly below the converging channel 143. The upper part of the cooling plate 14 is connected to the sealing cover plate 15 through a sealing ring and screws. The clamping mechanism includes a clamping plate 12 installed at the lower end of the cylinder 9, and clamping blocks 13 are installed on the lower left and right sides of the clamping plate 12. The clamping blocks 13 are arranged in an "L" shape.

[0046] The wafer is transported into the main cavity 1 via the infeed / outfeed chamber module installed on the main cavity 1. Then, the wafer is sequentially transferred to multiple reaction chambers 2 according to a preset path by the clamping and conveying mechanism 3 for the first-stage processing. The reaction chamber 2 includes at least one of magnetron sputtering chamber, plasma cleaning chamber, and ion plating chamber. The process sequence of each chamber is arranged by a programmable logic controller. The clamping and conveying mechanism 3 is a three-dimensional moving conveying mechanism used to transfer wafers across chambers. After the first-stage processing is completed, the wafer enters the heating chamber 6 through the clamping and conveying mechanism 3 and is heated by the heating mechanism 10. The heating chamber 6 is integrated into the main cavity. The position at the front of the main body 1 allows for the installation of an additional reaction chamber 2 on the working surface of the main body 1. Simultaneously, six reaction chambers 2 can be installed sequentially on the six sides, improving the manufacturing efficiency of the octagonal sputtering machine for electronic special materials. The clamping and conveying mechanism 3 transports the wafer to the cooling chamber 7 for cooling. After the final product is cooled or heated, it is output by the clamping and conveying mechanism 3 through the inlet and outlet chamber module. The clamping and conveying mechanism 3 transports the wafer to the edge-tracking and positioning chamber 4, where the camera 5 performs edge-tracking and positioning of the wafer. This process is fast and highly accurate. Since the above parts are all existing technologies, they will not be described in detail here, and the inlet and outlet chamber module is not shown in the figure.

[0047] When the conveying mechanism 3 transports the wafer into the cooling chamber 7, at this time, as attached Figure 4 As shown, the wafer is positioned below the clamping plate 12 and above the horizontal section of the clamping support block 13. Then, cylinder 9 is activated, and its output drives the clamping plate 12 upwards. The clamping plate 12 simultaneously moves the two clamping supports block 13 upwards, causing their horizontal sections to contact and lift the bottom surface of the wafer at the corresponding position. This separates the wafer from the conveying mechanism 3, which then exits from the cooling chamber 7. Next, the output of cylinder 9 moves the clamping plate 12 and the two clamping supports block 13 downwards, causing the clamping supports block 13 to move downwards. As the wafer approaches the cooling plate 14, one pilot-operated throttle valve 11 is installed at the air inlet of the cylinder 9 to regulate the speed by controlling the airflow into the cylinder 9. The other pilot-operated throttle valve 11 is installed at the exhaust port of the cylinder 9 to control the exhaust speed, thereby achieving smooth regulation of the movement speed of the cylinder 9. This ensures that the cylinder 9 stably drives the clamping plate 12 and the clamping support block 13 to move, thus ensuring the synchronicity of the movement of the two clamping support blocks 13 below the clamping plate 12. This allows the two clamping support blocks 13 to pick up the wafer synchronously, avoiding the problem of misaligned wafer picking.

[0048] External cooling water enters the inclined diversion hole 141 through the inlet pipe 16, and then the cooling water is diverted into the diversion tank 142 and the converging tank 143 through the diversion hole 141. Then, the cooling water can be heat-conducted through the cooling plate 14 and the sealing cover plate 15, which are both made of copper, so that the coolant in the cooling plate 14 can effectively cool the wafer above. Later, the cooling water can flow into the drain pipe 17 through the converging tank 143 for drainage and replacement.

[0049] Example 2: The wafer pick-up synchronous octagonal sputtering machine in this example, based on Example 1, can further improve the stability of wafer clamping and avoid damage to the wafer due to unstable clamping during cooling. See attached diagram for the specific structure. Figures 9-12 As shown, a fixed suction cup 18 is embedded inside the horizontal section of the clamping block 13, and a control component for controlling its automatic adsorption and automatic release is installed inside the fixed suction cup 18. The control component includes a piston assembly 23 that fits and is connected to the inner wall of the fixed suction cup 18. The bottom end of the piston assembly 23 passes through the bottom surface of the fixed suction cup 18 and is connected to the connecting plate 19. Both bottom surfaces of the connecting plate 19 are connected to the grooves opened inside the horizontal section of the clamping block 13 through the return springs 22. Two connecting ropes 20 are symmetrically installed on the bottom surface of the connecting plate 19. A guide rod 21 is installed on the bottom surface of the horizontal section of the clamping block 13. One end of the connecting rope 20 passes through the outside of the guide rod 21 and passes through the interior of the vertical section of the clamping block 13. The upper end of the connecting rope 20 passes through the interior of the clamping plate 12 and is connected to the inner wall of the sealing frame 8.

[0050] When the horizontal sections of the two clamping blocks 13 contact and lift the bottom surface of the wafer, and the output end of the cylinder 9 drives the clamping plate 12 and the two clamping blocks 13 to move downward, the upper end of the connecting rope 20 is connected to the inner wall of the sealing frame 8. Therefore, when the clamping plate 12 moves downward, the guide rod 21 will exert a pulling force on the lower end of the connecting rope 20, causing the lower end of the connecting rope 20 to pull the connecting plate 19 downward. The connecting plate 19 drives the piston assembly 23 above to move downward. The piston assembly 23 evacuates the air between the upper part of the fixed suction cup 18 and the wafer, so that the upper part of the fixed suction cup 18 is in close contact with the bottom surface of the wafer. This improves the stability of the clamping blocks 13 in clamping the wafer. At this time, the return spring 22 stores force, so that the clamping blocks 13 stably drive the wafer to move downward together, bringing the wafer close to the cooling plate 14 and the sealing cover plate 15, which facilitates the subsequent cooling operation of the wafer.

[0051] After the cooling process is completed, the clamping block 13 moves the wafer upward. Then, as described above, the resetting spring 22 drives the connecting plate 19 and the piston assembly 23 to move upward, releasing the suction cup 18 from holding the wafer. The clamping block 13 then moves the wafer upward to a certain position and fixes it in place. The wafer is then removed from the clamping block 13 by the clamping and conveying mechanism 3. The operation is convenient, meets the subsequent usage requirements, and does not affect the efficiency of the octagonal sputtering machine.

[0052] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A piece-taking synchronous eight-edge sputtering machine, comprising a main cavity (1) and a reaction cavity (2) mounted on the outside of the main cavity (1), and a pinch conveying mechanism (3) connected in the middle of the inside of the main cavity (1), characterized in that: The front of the main cavity (1) is provided with a heating cavity (6), the upper side of the heating cavity (6) is fixedly provided with a heating mechanism (10), the left side of the main cavity (1) is provided with a edge positioning cavity (4), the upper side of the edge positioning cavity (4) is connected with a camera (5), the right side of the main cavity (1) is fixedly provided with a cooling cavity (7), the upper surface of the cooling cavity (7) is fixedly provided with a sealing frame (8), the inside of the upper side of the sealing frame (8) is penetratedly provided with a cylinder (9), the lower end of the cylinder (9) is connected with a clamping mechanism for clamping a wafer, the gas inlet and the gas outlet of the cylinder (9) are provided with a pilot throttling valve (11), the movement speed of the cylinder (9) is smoothly adjusted, the clamping mechanism comprises a clamping plate (12) provided on the lower end of the cylinder (9), the lower sides of the left and right sides of the clamping plate (12) are provided with clamping blocks (13), the clamping blocks (13) are provided in an "L" shape, the inside of the horizontal section of the clamping block (13) is embeddedly provided with a fixed suction disc (18), the inside of the fixed suction disc (18) is provided with a control assembly for controlling automatic adsorption and automatic release of adsorption, the control assembly comprises a piston assembly (23) connected with the inner wall of the fixed suction disc (18), the bottom end of the piston assembly (23) is connected with a connecting plate (19) through the bottom surface of the fixed suction disc (18), the bottom surfaces of the two ends of the connecting plate (19) are connected with the inside of the groove of the horizontal section of the clamping block (13) through return springs (22).

2. The octopolar sputtering machine of claim 1, wherein: The upper and lower sides of the cooling cavity (7) are provided in an open shape, and the opening length of the upper side of the cooling cavity (7) is greater than the opening length of the lower side of the cooling cavity (7).

3. The octopolar sputtering machine of claim 1, wherein: The inside of the cooling cavity (7) is provided with a cooling plate (14), the inside of the upper surface of the cooling plate (14) is provided with a shunt hole (141), a shunt groove (142) and a convergent groove (143), the outside of the shunt hole (141) is communicated with the shunt groove (142), the outside of the shunt groove (142) is communicated with the convergent groove (143), and the length of the cooling plate (14) is greater than the opening length of the lower side of the cooling cavity (7).

4. The octopolar sputtering machine of claim 3, wherein: The shunt hole (141) is provided in an inclined manner, the shunt groove (142) is composed of a rectangular groove and an arc-shaped groove, and the lowest point of the convergent groove (143) is lower than the lowest points of the shunt hole (141) and the shunt groove (142).

5. The octopolar sputtering machine of claim 3, wherein: The bottom surface of the cooling cavity (7) is provided with a water inlet pipe (16), the upper side of the water inlet pipe (16) is communicated with the inside of the shunt hole (141), the inside of the cooling plate (14) directly below the convergent groove (143) is penetratedly provided with a water outlet pipe (17), and the upper side of the cooling plate (14) is connected with a sealing cover plate (15) through a sealing ring and a screw.

6. The octopolar sputtering system of claim 1, wherein: The bottom surface of the connecting plate (19) is symmetrically provided with two connecting ropes (20), the horizontal section of the clamping block (13) is provided with a guide rod (21), and one end of the connecting rope (20) penetrates through the outside of the guide rod (21) and then penetrates through the inside of the vertical section of the clamping block (13).

7. The octopolar sputtering machine of claim 6, wherein: The upper end of the connecting rope (20) penetrates the inside of the clamping plate (12) and is connected with the inner wall of the sealing frame (8).

Images