Server device and test assembly
By using a combination of a housing housing with heating elements and a fan in memory module testing, the temperature is precisely controlled, solving the problem of insufficient temperature control and ensuring the accuracy of test results.
Patent Information
- Application Number
- CN202511666308.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-13
- Publication Date
- 2026-02-13
AI Technical Summary
Existing test components have insufficient temperature control when testing memory modules, which affects the accuracy of test results.
The system employs a housing that encloses the memory, heating element, and fan. The heating element heats the memory, while the fan generates cooling airflow. A temperature sensor monitors the temperature to control the fan speed, creating an independent testing environment.
It enables more precise maintenance of memory testing conditions, avoiding the influence of external environment on test results.
Smart Images
Figure CN121523504A_ABST
Abstract
Description
Technical Field
[0001] This application relates to a server device and testing components, and more particularly to a server device and testing components that perform testing by heating memory using a heating element. Background Technology
[0002] In today's information technology-driven world, most businesses rely on servers to handle operations, such as storing programs, files, and data, thereby improving efficiency. Dual In-line Memory Modules (DIMMs) are widely used in servers for their ability to quickly access data.
[0003] Memory modules generate heat during operation, necessitating solutions for heat dissipation to prevent damage and data loss. Manufacturers typically use testing kits to heat memory modules, ensuring they maintain normal performance within specific temperature ranges and allowing for the design of appropriate cooling systems. However, current testing kits lack sufficient temperature control during memory module testing, affecting test results. Therefore, accurately maintaining optimal testing conditions for memory modules is a crucial issue for researchers to address. Summary of the Invention
[0004] This application aims to provide a server device and testing components to more accurately maintain the testing conditions of memory.
[0005] An embodiment of this application discloses a server device including a chassis, a circuit board, at least one memory module, and a test assembly. The circuit board is disposed within the chassis and has at least one slot. The at least one memory module is electrically inserted into the at least one slot. The test assembly includes a housing, at least one heating element, a fan, a temperature sensor, and a controller. The housing covers the at least one memory module. The at least one heating element and the fan are disposed within the housing. The at least one heating element is thermally coupled to the at least one memory module and is used to heat the at least one memory module. The fan is used to generate cooling airflow toward the at least one memory module. The temperature sensor is electrically connected to the at least one memory module and is used to monitor the temperature of the at least one memory module. The controller is electrically connected to the fan and the temperature sensor and controls the fan speed based on the temperature of the at least one memory module monitored by the temperature sensor.
[0006] Another embodiment of this application discloses a test assembly for installation within a server device and covering at least one memory module electrically plugged into at least one slot. The test assembly includes a housing, at least one heating element, a fan, a temperature sensor, and a controller. The housing is for installation within the server device and covers at least one memory module. The at least one heating element is disposed in the housing and is thermally coupled to the at least one memory module to heat it. The fan is disposed in the housing and generates cooling airflow toward the at least one memory module. The temperature sensor is electrically connected to the at least one memory module and monitors its temperature. The controller is electrically connected to the fan and the temperature sensor and controls the fan speed based on the temperature of the at least one memory module monitored by the temperature sensor.
[0007] According to the server device and test assembly of the above embodiments, since the test assembly's housing houses the memory, heating element, and fan shroud, the test environment inside the housing can be isolated from the external environment when the test assembly tests the memory. This allows for more precise maintenance of the memory's test conditions, thereby preventing the external environment from affecting the memory's test results.
[0008] The above description of the contents of this application and the following description of the embodiments are intended to demonstrate and explain the principles of this application and to provide a further explanation of the scope of this patent application. Attached Figure Description
[0009] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0010] Figure 1 This is a perspective view of a server device according to an embodiment of this application.
[0011] Figure 2 for Figure 1 A partially enlarged 3D schematic diagram of the circuit board and test components of the server device.
[0012] Figure 3 for Figure 1 A partially enlarged exploded view of the circuit board, memory, and test components of the server device.
[0013] Figure 4 For along Figure 2 A partially enlarged cross-sectional view of the circuit board, memory, and test components of the server device with section 4-4 in the middle.
[0014] Figure 5For along Figure 2 Another enlarged cross-sectional view of the circuit board, memory, and test components of the server device with section 5-5 in the middle.
[0015] Figure 6 for Figure 1 A schematic diagram showing the connection between the fan, temperature sensor, and controller of the server device.
[0016] Figure 7 To cool the airflow Figure 1 A magnified cross-sectional view of the airflow within the airflow channel of the test component of the server device.
[0017] Attached image annotations:
[0018] 10: Server equipment
[0019] 11: Chassis
[0020] 12: Circuit Board
[0021] 121: Slot
[0022] 13: Memory
[0023] 14: Test Components
[0024] 141: Shell
[0025] 1411: Air Inlet
[0026] 1412: Air vent
[0027] 1413: Airflow Channel
[0028] 142: Heating element
[0029] 143: Fan
[0030] 144: Temperature sensor
[0031] 145: Power input point
[0032] 15: Controller
[0033] A, B: Direction
[0034] S1: First paragraph
[0035] S2: Second paragraph Detailed Implementation
[0036] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.
[0037] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0038] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0039] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0040] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0041] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.
[0042] Please see Figures 1 to 3 . Figure 1 This is a perspective view of a server device according to an embodiment of this application. Figure 2 for Figure 1 A partially enlarged 3D schematic diagram of the circuit board and test components of the server device. Figure 3 for Figure 1 A partially enlarged exploded view of the circuit board, memory, and test components of the server device.
[0043] The server device 10 of this embodiment includes a housing 11, a circuit board 12, a memory 13, and a test component 14. The circuit board 12 is disposed within the housing 11 and has a plurality of slots 121. The memory 13 is, for example, in the form of a dual in-line memory module and is electrically plugged into one of these slots 121.
[0044] Please refer to the following: Figures 4 to 6 . Figure 4 For along Figure 2 A partially enlarged cross-sectional view of the circuit board, memory, and test components of the server device with a 4-4 section. Figure 5 For along Figure 2 Another enlarged cross-sectional view of the server device's circuit board, memory, and test components along the 5-5 section line. Figure 6 for Figure 1 A schematic diagram showing the connection between the fan, temperature sensor, and controller of the server device.
[0045] Test assembly 14 is used to test the operational performance of memory 13 and includes a housing 141, multiple heating elements 142, a fan 143, a temperature sensor 144, and a controller 15. The housing 141 covers the memory 13, for example, by snapping into the slot 121 into which the memory 13 is inserted. The housing 141 has an air inlet 1411, an air outlet 1412, and an airflow channel 1413. Specifically, the housing 141 has an air inlet 1411 on the side away from the slot 121, and an air outlet 1412 on the side of the housing 141 adjacent to the slot 121. The airflow channel 1413 has a first segment S1 and a second segment S2. The first segment S1 is connected to the second segment S2. The first segment S1 is located on the side of the second segment S2 away from the slot 121 and extends in a direction away from the slot 121. The air inlet 1411 is located in the first segment S1, and the air outlet 1412 is located in the second segment S2. In other words, the air inlet 1411 and the air outlet 1412 are respectively connected to the opposite sides of the airflow channel 1413.
[0046] These heating elements 142 are, for example, electrothermal films and are disposed in the housing 141, with the memory 13 and these heating elements 142 located in the second section S2 of the airflow channel 1413. These heating elements 142 are thermally coupled to the memory 13. Furthermore, these heating elements 142, for example, do not directly contact the memory 13, but assist in heating the memory 13 through thermal radiation or thermal convection, but are not limited thereto. In this way, the test assembly 14 can test the operation of the memory 13 under high-temperature conditions. A fan 143 is disposed at the air inlet 1411 of the housing 141 and is used to generate cooling airflow towards the memory 13 within the airflow channel 1413.
[0047] Temperature sensor 144 is electrically connected to memory 13 and is used to monitor the temperature of memory 13. Controller 15 is electrically connected to fan 143 and temperature sensor 144, and controls the speed of fan 143 based on the temperature of memory 13 monitored by temperature sensor 144, thereby adjusting the cooling airflow's cooling capacity on memory 13, and thus controlling the heating temperature of memory 13 to maintain memory 13 at a preset temperature. The preset temperature is, for example, 85°C.
[0048] In this embodiment, the housing 141 has two power input points 145. The two power input points 145 are located at the air inlet 1411. An external power source (not shown) supplies power to the heating elements 142, fan 143, temperature sensor 144, and controller 15 through the two power input points 145.
[0049] In this embodiment, since the housing 141 of the test assembly 14 encloses the memory 13, the heating elements 142, and the fan 143, the test environment inside the housing 141 can be isolated from the external environment when the test assembly 14 tests the memory 13. In this way, the test conditions of the memory 13 can be maintained more accurately, thereby avoiding the influence of the external environment on the test results of the memory 13.
[0050] In this embodiment, the circuit board 12 has multiple slots 121, but this is not a limitation. In other embodiments, the circuit board may have only a single slot.
[0051] In this embodiment, the number of memory cells 13 is only one, but it is not limited to this. In other embodiments, the number of memory cells may also be multiple.
[0052] In this embodiment, the housing 141 of the test component 14 is snapped into the slot 121 into which the memory 13 is inserted, for example, but is not limited thereto. In other embodiments, the housing of the test component may also be fixed to the slot into which the memory is inserted by other fixing methods.
[0053] In this embodiment, the side of the housing 141 away from the slot 121 has an air inlet 1411, and the side of the housing 141 adjacent to the slot 121 has an air outlet 1412. The first segment S1 of the airflow channel 1413 is located on the side of the second segment S2 away from the slot 121 and extends in a direction away from the slot 121, but is not limited thereto. In other embodiments, the air inlet, air outlet, and airflow channel can also be modified according to actual needs.
[0054] In this embodiment, the number of heating elements 142 is multiple, but not limited to this. In other embodiments, the number of heating elements may be only a single one.
[0055] Please see Figure 7 . Figure 7 To cool the airflow Figure 1 This is a partially enlarged cross-sectional view of the airflow within the airflow channel of the test component of the server device. In this embodiment, when the test component 14 needs to test the operation of the memory 13 at a preset temperature, the heating elements 142 assist in heating the memory 13, and the temperature of the memory 13 is monitored by the temperature sensor 144.
[0056] When the temperature sensor 144 detects that the temperature of the memory 13 exceeds the preset temperature, the controller 15 controls the fan 143 to generate a cooling airflow along direction A from the air inlet 1411 into the first section S1 of the airflow channel 1413. Then, the cooling airflow along direction A from the first section S1 of the airflow channel 1413 into the second section S2. Next, the cooling airflow along direction B flows through the memory 13 in the second section S2 to dissipate heat from the memory 13. Finally, the cooling airflow along direction B flows out of the airflow channel 1413 from the air outlet 1412. In this way, when the test component 14 tests the operation of the memory 13, the operating environment of the memory 13 can be maintained at the preset temperature.
[0057] According to the server device and test assembly of the above embodiments, since the test assembly's housing houses the memory, heating elements, and fan shroud, the test environment inside the housing can be isolated from the external environment when the test assembly tests the memory. This allows for more precise maintenance of the memory's test conditions, thereby preventing the external environment from affecting the memory's test results.
[0058] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0059] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.
Claims
1. A server device, characterized in that, include: A casing; A circuit board is disposed within the housing and has at least one slot; At least one memory chip, electrically connected to at least one of the aforementioned slots; and A test assembly includes a housing, at least one heating element, a fan, a temperature sensor, and a controller. The housing covers at least one of the memory modules. The at least one heating element and the fan are disposed in the housing. The at least one heating element is thermally coupled to at least one of the memory modules and is used to heat the at least one memory module. The fan is used to generate a cooling airflow toward the at least one memory module. The temperature sensor is electrically connected to at least one memory module and is used to monitor the temperature of the at least one memory module. The controller is electrically connected to the fan and the temperature sensor and controls the speed of the fan based on the temperature of the at least one memory module monitored by the temperature sensor.
2. The server device according to claim 1, characterized in that, The housing of the test component has an air inlet and an air outlet, the air inlet and the air outlet are connected, and the fan is disposed at the air inlet.
3. The server device according to claim 2, characterized in that, The housing has the air inlet on the side away from at least one of the slots, and the housing has the air outlet on the side adjacent to at least one of the slots.
4. The server device according to claim 2, characterized in that, The housing of the test component also has an airflow channel, the air inlet and the air outlet are respectively connected to opposite sides of the airflow channel, at least one of the memory modules and the fan are located in the airflow channel, and the airflow channel is used for the circulation of cooling airflow generated by the fan.
5. The server apparatus according to claim 4, characterized in that, The airflow channel has a first section and a second section, the first section being connected to the second section, the first section being located on the side of the second section away from at least one of the slots and extending in a direction away from at least one of the slots, the fan and the air inlet being located in the first section, and the air outlet being located in the second section.
6. A test component for installation within a server device and covering at least one memory electrically plugged into at least one slot, characterized in that, The test components include: A housing for mounting within the server device and covering at least one of the memory modules; At least one heating element is disposed in the housing and is used for thermal coupling to at least one of the memory modules to heat the at least one of the memory modules; A fan, disposed in the housing, is used to generate a cooling airflow toward at least one of the memory modules; A temperature sensor, electrically connected to at least one of the memory modules, and used to monitor the temperature of at least one of the memory modules; and A controller, electrically connected to the fan and the temperature sensor, is used to control the fan speed based on the temperature of at least one of the memory cells monitored by the temperature sensor.
7. The test component according to claim 6, characterized in that, The housing has an air inlet and an air outlet, the air inlet and the air outlet are connected, and the fan is disposed at the air inlet.
8. The test component according to claim 7, characterized in that, The housing has the air inlet on the side away from at least one of the slots, and the housing has the air outlet on the side adjacent to at least one of the slots.
9. The test component according to claim 7, characterized in that, The housing also has an airflow channel, the air inlet and the air outlet are respectively connected to the opposite sides of the airflow channel, at least one of the memory modules and the fan are located in the airflow channel, and the airflow channel is used to allow the cooling airflow generated by the fan to circulate.
10. The test component according to claim 9, characterized in that, The airflow channel has a first section and a second section, the first section being connected to the second section, the first section being located on the side of the second section away from at least one of the slots and extending in a direction away from at least one of the slots, the fan and the air inlet being located in the first section, and the air outlet being located in the second section.