Multicolor micro-display unit assembly and micro-display optical machine
By integrating multicolor microdisplay units through flexible or rigid-flex circuit boards, the problems of complex connections and difficulty in miniaturization have been solved, resulting in high-yield and miniaturized multicolor microdisplay components suitable for near-eye display devices.
Patent Information
- Application Number
- CN202511674673.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-14
- Publication Date
- 2026-02-13
AI Technical Summary
In existing technologies, the connection of micro-display panels is complex and the size is difficult to reduce, which makes it difficult to reduce the bezel volume of near-eye display products. At the same time, the yield of multi-color chip packaging is low, which affects product quality and cost.
By using flexible or rigid-flex circuit boards, multi-color micro-display units are integrated onto the same circuit board. By adjusting the position and angle through bending, connector settings are simplified, enabling flexible assembly and size reduction of multi-color micro-display unit components.
It simplifies the assembly process, improves yield, reduces product size and installation space requirements, and lowers production costs.
Smart Images
Figure CN121528124A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of microdisplay technology, and more particularly to a multicolor microdisplay unit component and a microdisplay optical engine. Background Technology
[0002] Microdisplay optical engines are commonly used in near-eye display devices such as smart glasses. They typically include a light combining component, a lens component, and three microdisplay panels of different colors. The light emitted from the three microdisplay panels of different colors is combined by the light combining component and then emitted from the lens component to achieve color display.
[0003] Currently, the three micro-display panels of different colors are red, green and blue. Each display panel includes a rigid-flex board and a Micro LED chip and connector (BTB connector) set on the rigid-flex board. When connecting, the red and blue display panels need to be connected to the connector of the green display panel through their connectors, and then connected to the system through the connector of the green display panel. The connection is relatively complicated.
[0004] Meanwhile, green screen display panels require multiple connectors, and due to space constraints, two connectors are typically placed side-by-side. Because of limitations in the number of lines and connector manufacturing processes, the size of the connectors is difficult to reduce, which in turn hinders the reduction in the size of the rigid-flex board for the green screen display panel. This problem is particularly prominent in current near-eye display applications. As the size of the X-cube continues to shrink, the size of the rigid-flex board for the green screen display panel often exceeds that of the X-cube, becoming the biggest obstacle to further reducing the bezel size of near-eye display products.
[0005] Furthermore, directly packaging the R, G, and B light-emitting chips onto a single circuit board would severely impact yield, affecting the overall module quality and cost. Currently, with advanced manufacturing processes, the yield rate for packaging a single light-emitting chip onto a circuit board to form a monochrome display panel is only about 85%, sometimes as low as 70%. Packaging all three chips onto a single circuit board would result in an even lower yield, making it even more difficult to guarantee.
[0006] Therefore, it is necessary to improve the existing technology to overcome the aforementioned defects.
[0007] The above content is only used to help understand the technical solution of this application and does not constitute an admission that the above is prior art. Summary of the Invention
[0008] The purpose of this invention is to provide a multicolor microdisplay unit component and a microdisplay optical engine to solve at least one problem existing in the prior art.
[0009] To achieve the above-mentioned objectives, in one respect, the present invention proposes a multi-color micro-display unit assembly, including a circuit board and a first color micro-display unit, a second color micro-display unit, a third color micro-display unit, and a connector, all connected to the circuit board. The circuit board is at least partially flexible to adjust the relative position and angle between the first color micro-display unit, the second color micro-display unit, and the third color micro-display unit.
[0010] Furthermore, the multicolor microdisplay unit assembly can be bent to the following orientation:
[0011] The second color micro-display unit and the third color micro-display unit are arranged opposite to each other, the first color micro-display unit is located between the second color micro-display unit and the third color micro-display unit, and the display areas of the first color micro-display unit, the second color micro-display unit and the third color micro-display unit face the internal space formed between the three micro-display units.
[0012] Furthermore, the circuit board includes a first part and a second part, a third part, and a fourth part, all of which are flexibly connected to the first part. The second part and the third part are respectively connected to both ends of the first part in a first direction, and the fourth part is connected to the end of the first part in a third direction. The first direction is perpendicular to the third direction. The first color micro-display unit is connected to the first part, the second color micro-display unit is connected to the second part, the third color micro-display unit is connected to the third part, and the connector is connected to the fourth part.
[0013] Furthermore, the circuit board has a first surface and a second surface located at both ends in its thickness direction, the first color micro-display unit, the second color micro-display unit and the third color micro-display unit are located on the first surface of the circuit board, and the connector is disposed on the first surface or the second surface of the circuit board.
[0014] Furthermore, the circuit board includes a first part and a second part, a third part, and a fourth part, all of which are flexibly connected to the first part. The second part and the third part are respectively connected to both ends of the first part in a first direction, and the fourth part is connected to the end of the first part in a third direction. The first direction is perpendicular to the third direction. The connector is connected to the first part, the second color micro-display unit is connected to the second part, the third color micro-display unit is connected to the third part, and the first color micro-display unit is connected to the fourth part.
[0015] Furthermore, the circuit board has a first surface and a second surface located at both ends in its thickness direction, the second color micro-display unit and the third color micro-display unit are located on the first surface of the circuit board, and the connector and the first color micro-display unit are located on the second surface.
[0016] Furthermore, the first color micro-display unit, the second color micro-display unit, and the third color micro-display unit are packaging units for light-emitting chips, which are soldered to the circuit board, and the light-emitting chip is provided with a display area.
[0017] Furthermore, the first color microdisplay unit, the second color microdisplay unit, and the third color microdisplay unit each include a substrate, a light-emitting chip connected to the substrate, and a plurality of first pads electrically connected to the light-emitting chip. The first pads and the light-emitting chip are respectively located on opposite sides of the substrate. The circuit board is provided with a plurality of second pads corresponding to the first pads. The first color microdisplay unit, the second color microdisplay unit, and the third color microdisplay unit are all soldered to the second pads through their first pads.
[0018] Furthermore, the first part is connected to the second part, the third part, and the fourth part by flexible connecting parts.
[0019] Furthermore, a reinforcing plate is provided on the back side of the portion of the circuit board where the first color micro display unit, the second color micro display unit, and the third color micro display unit are located.
[0020] Furthermore, the circuit board as a whole is a flexible circuit board; or,
[0021] The circuit board is a rigid-flex board, and except for the part used to install the connector which is a rigid circuit board, the rest of the circuit board is a flexible circuit board.
[0022] On the other hand, the present invention proposes a micro-display optical engine, comprising:
[0023] The multicolor microdisplay unit component described above;
[0024] A light-combining component includes a light-emitting surface, a first light-incident surface, a second light-incident surface, and a third light-incident surface. The first color micro-display unit, the second color micro-display unit, and the third color micro-display unit of the multicolor micro-display unit component are respectively disposed corresponding to the first light-incident surface, the second light-incident surface, and the third light-incident surface; and...
[0025] The lens assembly is configured to correspond to the light-emitting surface.
[0026] Compared with the prior art, the present invention has the following beneficial effects: According to at least one embodiment of the present invention, the multicolor microdisplay unit assembly includes a circuit board and a first color microdisplay unit, a second color microdisplay unit, a third color microdisplay unit, and a connector, all connected to the circuit board. The circuit board is at least partially flexible, so that the relative position and angle of the first color microdisplay unit, the second color microdisplay unit, and the third color microdisplay unit are adjustable. In this way, the multicolor microdisplay unit assembly can be easily assembled with the light combining component. Moreover, the multicolor microdisplay unit assembly only needs to be provided with one connector to connect to the external circuit, without the need for each microdisplay unit to be provided with an independent connector. The structure is more simplified, and the size of the multicolor microdisplay unit assembly can be made smaller, thereby reducing the installation space required. Attached Figure Description
[0027] Figure 1 This is a three-dimensional schematic diagram of a multicolor micro-display unit component in some embodiments of the present invention.
[0028] Figure 2 yes Figure 1 A three-dimensional schematic diagram of the structure shown from another viewpoint.
[0029] Figure 3 yes Figure 1 A top view of the structure shown.
[0030] Figure 4 yes Figure 1 The diagram shown illustrates the structure when connected to the light combining assembly and the lens.
[0031] Figure 5 yes Figure 4 A three-dimensional schematic diagram of the structure shown.
[0032] Figure 6 yes Figure 1 A schematic diagram showing the change in position of the fourth part of the structure shown.
[0033] Figure 7 yes Figure 1 The diagram shown illustrates the structure with a reinforcing plate.
[0034] Figure 8 yes Figure 2 The diagram shown illustrates the structure with a reinforcing plate.
[0035] Figure 9 yes Figure 4 A cross-sectional schematic diagram of the structure shown.
[0036] Figure 10 This is a three-dimensional schematic diagram of a multicolor micro-display unit component in some embodiments of the present invention.
[0037] Figure 11 yes Figure 10 A three-dimensional schematic diagram of the structure shown from another viewpoint.
[0038] Figure 12 yes Figure 10 A top view of the structure shown.
[0039] Figure 13 yes Figure 10 The diagram shows a three-dimensional representation of the structure connected to the light combining component and the lens.
[0040] Figure 14 This is a three-dimensional schematic diagram of the micro-display unit in some embodiments of the present invention.
[0041] Figure 15 yes Figure 14 A three-dimensional schematic diagram of the structure shown from another viewpoint.
[0042] Figure 16 This is a three-dimensional schematic diagram of a circuit board according to some embodiments of the present invention.
[0043] Figure 17 This is a schematic diagram showing the bonding pads of the light-emitting chip and the substrate connected by bonding wires in some embodiments of the present invention.
[0044] Figure 18 This is a partial cross-sectional schematic diagram of a micro-display unit in some embodiments of the present invention. Detailed Implementation
[0045] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, it should be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings, not the entire structure. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.
[0046] The terms “comprising” and “having”, and any variations thereof, used in this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the steps or units listed, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to such process, method, product, or apparatus.
[0047] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.
[0048] This invention proposes a multi-color micro-display unit component, such as... Figures 1 to 13 As shown, it includes a circuit board 1, connectors 5 all connected to the circuit board 1, and multiple monochrome micro-display units.
[0049] Figures 1 to 13 In the illustrated embodiment, the multicolor microdisplay unit assembly includes three microdisplay units, namely a first color microdisplay unit 2, a second color microdisplay unit 3, and a third color microdisplay unit 4. The three microdisplay units emit light of different colors, for example, the first color microdisplay unit 2, the second color microdisplay unit 3, and the third color microdisplay unit 4 emit green light, red light, and blue light, respectively.
[0050] It is understandable that the micro-display unit is electrically connected to the connector 5 via a line on the circuit board 1. The connector 5 is used to connect to an external circuit to achieve power supply and signal transmission, so that each micro-display unit emits light under the control signal.
[0051] The circuit board 1 is at least partially flexible, allowing it to be bent to adjust the relative positions and angles of the micro-display units. This enables the multi-color micro-display unit assembly to be easily assembled with the light-combining assembly 6. The circuit board 1 is a single piece, for example, it can be a flexible circuit board that allows for easy bending; it can also be a rigid-flex board, with its flexible portion easily bendable.
[0052] In some embodiments, by bending the circuit board, the multicolor microdisplay unit assembly can be deformed to at least the following orientation: the second color microdisplay unit 3 and the third color microdisplay unit 4 are arranged opposite each other, the first color microdisplay unit 2 is located between the second color microdisplay unit 3 and the third color microdisplay unit 4, an internal space 100 is formed between the three microdisplay units, each microdisplay unit has a display area 210 capable of emitting light, and the display area 210 of each microdisplay unit faces the internal space 100. For ease of description, this orientation of the microdisplay unit will be referred to as the working orientation below.
[0053] The illustrated embodiments (e.g., reference) Figure 3The second color micro-display unit 3 and the third color micro-display unit 4 are arranged opposite each other and spaced apart along the first direction. The first color micro-display unit 2 is located between the second color micro-display unit 3 and the third color micro-display unit 4, and is located at the same end of the second color micro-display unit 3 and the third color micro-display unit 4 in the second direction. The first direction and the second direction are perpendicular to each other, or in other words, the second color micro-display unit 3 and the third color micro-display unit 4 are both located on the side of the first color micro-display unit 2 where the display area 210 is provided. The second color micro-display unit 3 and the third color micro-display unit 4 are both perpendicular to the first color micro-display unit 2, and the three micro-display units form an internal space 100. It can be understood that the internal space 100 is in a semi-enclosed posture, and the three micro-display units are located on the three sides of the internal space 100 respectively. The internal space 100 does not have to be strictly semi-enclosed; for example, there can be a gap or space between two adjacent micro-display units.
[0054] Because the multi-color micro-display unit assembly can be bent to a working position, each micro-display unit can reliably cooperate with the light combining assembly 6. Specifically, for example... Figure 4 and Figure 5 As shown, the light combining component 6 is at least partially located within the internal space 100. Three micro-display units emit light towards the light-incident surface corresponding to the light combining component 6. The light combining component 6 can mix the light emitted by the three micro-display units to achieve color display. It is understood that the three micro-display units of the multi-color micro-display unit assembly only need to be adjusted so that their display areas 210 are relatively aligned with the light-incident surface corresponding to the light combining component 6. It is not necessary for the second color micro-display unit 3 and the third color micro-display unit 4 to be perpendicular to the first color micro-display unit 2. The angle between the three micro-display units should be adapted to the angle between the light-incident surfaces of the light combining component 6.
[0055] Understandably, since each micro-display unit is integrated on the same circuit board 1, there is no need to assemble individual micro-display units together, simplifying the assembly process, reducing the risk of assembly defects, and solving the assembly problem of traditional three micro-display units. Moreover, the multi-color micro-display unit assembly only needs to set one connector 5 to connect to the external circuit, eliminating the need for each micro-display unit to have an independent connector, further simplifying the structure and allowing the multi-color micro-display unit assembly to be smaller. For example, since only one connector 5 is needed, the width W of the part where the connector 5 is installed (i.e., the fourth part 13 mentioned below) can be smaller. Even when the volume of the light combining component 6 is reduced, it will not exceed the width of the light combining component 6, which helps to reduce the overall volume and the installation space required. In addition, since the position and angle of each micro-display unit can be adjusted, its connection with the light combining component 6 is also very convenient.
[0056] Understandable Figure 3In the middle, connector 5 can be installed horizontally, vertically, or at other angles. The dimensions of part 13 are for illustrative purposes only and can be made smaller.
[0057] Multicolor microdisplay unit components can achieve a working state through various circuit board structural designs.
[0058] In some embodiments, such as Figures 1 to 3 As shown, the circuit board 1 includes a first part 10 and a second part 11, a third part 12, and a fourth part 13, all flexibly connected to the first part 10. The second part 11 and the third part 12 are respectively connected to both ends of the first part 10 in a first direction, and the fourth part 13 is connected to one end of the first part 10 in a third direction. The first direction, the second direction, and the third direction are perpendicular to each other. A first color micro-display unit 2 is connected to the first part 10, a second color micro-display unit 3 is connected to the second part 11, a third color micro-display unit 4 is connected to the third part 12, and a connector 5 is connected to the fourth part 13. The first part 10 is connected to the second part 11, the third part 12, and the fourth part 13 through flexible connecting parts 16, so that the second part 11, the third part 12, and the fourth part 13 can be bent at an angle relative to the first part 10, thereby deforming to a working posture. The flexible connecting parts 16 can be flexible circuit boards.
[0059] like Figure 3 As shown, the circuit board 1 has a first surface 1a and a second surface 1b located at both ends in its thickness direction. The first color micro-display unit 2, the second color micro-display unit 3, and the third color micro-display unit 4 are located on the first surface 1a of the circuit board 1. Thus, with the circuit board 1 in a flattened position, bending the second color micro-display unit 3 and the third color micro-display unit 4 90° towards the side containing the first surface 1a achieves the working posture, which is more convenient, and the required length of the flexible connection portion 16 is also relatively short. The connector 5 is disposed on either the first surface 1a or the second surface 1b of the circuit board 1. When it is disposed on the first surface 1a, as... Figure 3 As shown, the fourth part 13 can be bent 180° to be positioned opposite the first part 10, and the connector 5 is located on the surface of the fourth part 13 facing away from the first part 10, thereby reducing the overall space occupied. Of course, the connector 5 can also be positioned on the second surface 1b as needed.
[0060] Understandably, since connector 5 is located in the fourth part 13, and the relative position and angle of the fourth part 13 with other parts are also adjustable, the position and angle of connector 5 can be easily adjusted, making it easier to connect to external circuits and providing better adaptability to the internal space of the installation area. For example, the position of connector 5 can be changed to... Figure 6The posture shown indicates that it is not located on the side of the first part 10 away from the internal space 100, but rather at the third-direction end of the first part 10.
[0061] In some embodiments, such as Figures 10 to 13 As shown, the circuit board 1 also includes a first part 10 and a second part 11, a third part 12 and a fourth part 13, all of which are flexibly connected to the first part 10. The difference from the previous embodiment is that in this embodiment, the connector 5 is connected to the first part 10 and the first color micro display unit 2 is connected to the fourth part 13. At this time, the second part 11 and the third part 12 can be bent to be perpendicular to the first part 10, so that the display areas 210 of the second color micro display unit 3 and the third color micro display unit 4 are arranged opposite to each other. In addition, the fourth part 13 can be bent to be arranged opposite to the first part 10, and the first color micro display unit 2 is located on the side of the fourth part 13 facing away from the first part 10, thereby achieving the working posture.
[0062] like Figure 12 As shown, the second color micro-display unit 3 and the third color micro-display unit 4 are located on the first surface 1a of the circuit board 1. With the circuit board 1 in a flat position, bending the second color micro-display unit 3 and the third color micro-display unit 4 90 degrees toward the side where the first surface 1a is located will make them perpendicular to the first part 10. The connector 5 and the first color micro-display unit 2 are both located on the second surface 1b. At this time, the connector 5 is set outward, which makes it easier to connect to external circuits. With the circuit board 1 in a flat position, the fourth part 13 can be set opposite to the first part 10 by bending 180 degrees.
[0063] Obviously, the above embodiments exemplarily describe the structure of a multicolor microdisplay unit component that can change to a working posture. In order to achieve the working posture, the multicolor microdisplay unit component can also have more structures.
[0064] In some embodiments, the circuit board 1 is a rigid-flex board. For example, the first part 10, the second part 11, the third part 12 and the fourth part 13 can be set as rigid circuit boards, and the connecting parts (flexible connecting parts 16) between the parts can be set as flexible circuit boards to facilitate the installation of the connector 5 and each micro display unit.
[0065] In other embodiments, except for the portion of the circuit board 1 used to mount the connector 5, which is a rigid circuit board, the rest is a flexible circuit board. This reduces the structural complexity of the circuit board 1, lowers production costs, and improves structural reliability. Furthermore, since the flexible circuit board is thinner than the rigid circuit board, it is advantageous to further reduce the overall thickness and weight. To improve the strength of the portion of the circuit board 1 connected to the micro-display unit, a reinforcing plate 15 is provided on the back of the portion of the circuit board 1 where the micro-display unit is located, ensuring the reliability of the connection. Figure 7 and Figure 8 It shows Figure 1 and Figure 2 The diagram shown illustrates the structure with reinforcing plate 15. Figures 10 to 12 A schematic diagram of another circuit board structure with a reinforcing plate 15 is shown.
[0066] In other embodiments, the circuit board 1 can be a flexible circuit board as a whole, which has a simpler structure. Reinforcing plates 15 can be provided on the back of both the portion of the circuit board 1 where the micro-display unit is located and the portion where the connector 5 is located, to ensure the reliability of the connection between each device and the circuit board 1.
[0067] In some embodiments, the first-color microdisplay unit 2, the second-color microdisplay unit 3, and the third-color microdisplay unit 4 are packaging units of the light-emitting chip 21, which are soldered to the circuit board 1. That is, the microdisplay unit is a packaged structure of the light-emitting chip 21, which has pads for soldering to the circuit board 1. The light-emitting chip 21 is, for example, a Micro LED chip, which has a display area 210. The pads and display area of the microdisplay unit are located on two surfaces in its thickness direction, respectively.
[0068] In some embodiments, such as Figure 14 and Figure 15 As shown, the first color microdisplay unit 2, the second color microdisplay unit 3, and the third color microdisplay unit 4 each include a substrate 20, a light-emitting chip 21 connected to the substrate 20, and a plurality of first pads 22 electrically connected to the light-emitting chip 21. The first pads 22 and the light-emitting chip 21 are located on opposite sides of the substrate 20, as shown. Figure 16 As shown, the circuit board 1 is provided with a plurality of second pads 14 corresponding to the first pad 22, and each micro display unit is soldered to the second pad 14 through its first pad 22.
[0069] Understandably, since each microdisplay unit is an independent unit, it can undergo performance testing, such as burn-in, demura, AOI, and brightness testing. This allows qualified microdisplay units to be mounted onto circuit board 1, significantly improving the yield of the multi-color microdisplay unit assembly, bringing it close to 100%. Furthermore, during soldering, circuit board 1 can be unfolded into a flat position and connected to each microdisplay unit via methods such as SMT, making connection more convenient. Especially when all microdisplay units are located on the same surface of circuit board 1, they can be soldered simultaneously, further improving soldering efficiency.
[0070] like Figure 17 and Figure 18As shown, the light-emitting chip 21 and the first pad 22 can be connected via the internal circuitry 23 of the substrate 20. In some embodiments, the light-emitting chip 21 has a display area 210 and a soldering area 211 located outside the display area 210. Figure 17 The area 210, shown in dashed lines, is capable of displaying visual information such as images and animations. The soldering area 211 has multiple chip pads 2110, such as... Figure 18 As shown, the third surface 20a of the substrate 20 is provided with a plurality of bonding pads 200 made of conductive material. The bonding pads 200 and the first pad 22 are electrically connected by a line 23 provided in the substrate 20. The chip pad 2110 of the light-emitting chip 21 and the bonding pads 200 are connected by a bonding wire 40 to realize the electrical connection between the first pad 22 and the light-emitting chip 21.
[0071] The substrate 20 can be single-layer or multi-layer. When the substrate 20 has multiple layers, the routing of the internal circuit 23 is more flexible, and the position of the first pad 22 has a higher degree of freedom.
[0072] It is understandable that a protective adhesive 41 can be applied to the outside of the bonding wire 40 to protect the bonding wire 40.
[0073] It is understood that welding areas 211 can be provided on one or more sides of the display area 210. For example, welding areas 211 can be provided around the display area 210, so that the welding areas 211 surround the display area 210.
[0074] like Figure 4 , Figure 5 , Figure 9 and Figure 13 As shown, the present invention also proposes a micro-display optical engine, including a multi-color micro-display unit assembly, a light combining assembly 6, and a lens assembly 7.
[0075] The multicolor microdisplay unit component can be any of the multicolor microdisplay unit components described in the above embodiments.
[0076] The light-combining component 6 is at least partially located within the internal space 100 enclosed by the first color micro-display unit 2, the second color micro-display unit 3, and the third color micro-display unit 4, to mix the light emitted by each micro-display unit and achieve color emission. Specifically, as shown... Figure 8 and Figure 9As shown, the light combining component 6 includes a light emitting surface 60, a first light incident surface 61, a second light incident surface 62, and a third light incident surface 63. The second light incident surface 62 and the third light incident surface 63 are arranged opposite to each other. The first light incident surface 61 and the light emitting surface 60 are both located between the second light incident surface 62 and the third light incident surface 63, and are perpendicular to the second light incident surface 62 and the third light incident surface 63. The light emitting surface 60 is arranged opposite to the first light incident surface 61. The display area 210 of the first color microdisplay unit 2 is arranged corresponding to the first light incident surface 61, the display area 210 of the second color microdisplay unit 3 is arranged corresponding to the second light incident surface 62, the display area 210 of the third color microdisplay unit 4 is arranged corresponding to the third light incident surface 63, and the lens assembly 7 is arranged corresponding to the light emitting surface 60, so as to emit light emitted by the light combining component 6.
[0077] This invention proposes an electronic device comprising the multicolor microdisplay unit assembly or microdisplay optical engine described above. The electronic device may, for example, be a near-eye display device.
[0078] It should be noted that, in the absence of conflict, the various embodiments described herein can be combined with each other to obtain more implementation schemes.
[0079] The above are merely specific embodiments of the present invention, and any improvements made based on the concept of the present invention shall be considered within the scope of protection of the present invention.
Claims
1. A multi-color micro-display unit component, characterized in that, Includes a circuit board (1) and a first color microdisplay unit (2), a second color microdisplay unit (3), a third color microdisplay unit (4) and a connector (5) all connected to the circuit board (1). The circuit board (1) is at least partially flexible to adjust the relative position and angle between the first color microdisplay unit (2), the second color microdisplay unit (3) and the third color microdisplay unit (4).
2. The multicolor micro-display unit assembly as described in claim 1, characterized in that, The multicolor microdisplay unit assembly can be bent into the following orientation by bending the circuit board (1): The second color micro display unit (3) and the third color micro display unit (4) are arranged opposite to each other. The first color micro display unit (2) is located between the second color micro display unit (3) and the third color micro display unit (4), and the display area (210) of the first color micro display unit (2), the second color micro display unit (3) and the third color micro display unit (4) faces the internal space (100) formed between the three micro display units.
3. The multicolor micro-display unit assembly as described in claim 2, characterized in that, The circuit board (1) includes a first part (10) and a second part (11), a third part (12) and a fourth part (13) that are flexibly connected to the first part (10). The second part (11) and the third part (12) are respectively connected to the two ends of the first part (10) in a first direction. The fourth part (13) is connected to the end of the first part (10) in a third direction. The first direction is perpendicular to the third direction. The first color micro display unit (2) is connected to the first part (10), the second color micro display unit (3) is connected to the second part (11), the third color micro display unit (4) is connected to the third part (12), and the connector (5) is connected to the fourth part (13).
4. The multicolor microdisplay unit assembly as described in claim 3, characterized in that, The circuit board (1) has a first surface (1a) and a second surface (1b) located at both ends in its thickness direction. The first color micro display unit (2), the second color micro display unit (3) and the third color micro display unit (4) are located on the first surface (1a) of the circuit board (1). The connector (5) is disposed on the first surface (1a) or the second surface (1b) of the circuit board (1).
5. The multicolor microdisplay unit assembly as described in claim 2, characterized in that, The circuit board (1) includes a first part (10) and a second part (11), a third part (12) and a fourth part (13) that are flexibly connected to the first part (10). The second part (11) and the third part (12) are respectively connected to the two ends of the first part (10) in a first direction. The fourth part (13) is connected to the end of the first part (10) in a third direction. The first direction is perpendicular to the third direction. The connector (5) is connected to the first part (10). The second color micro display unit (3) is connected to the second part (11). The third color micro display unit (4) is connected to the third part (12). The first color micro display unit (2) is connected to the fourth part (13).
6. The multicolor microdisplay unit assembly as described in claim 5, characterized in that, The circuit board (1) has a first surface (1a) and a second surface (1b) located at both ends in its thickness direction. The second color micro display unit (3) and the third color micro display unit (4) are located on the first surface (1a) of the circuit board (1), and the connector (5) and the first color micro display unit (2) are located on the second surface (1b).
7. The multicolor microdisplay unit assembly as described in any one of claims 1 to 6, characterized in that, The first color micro display unit (2), the second color micro display unit (3) and the third color micro display unit (4) are packaging units of the light-emitting chip (21), which are soldered to the circuit board (1). The light-emitting chip (21) is provided with a display area (210).
8. The multicolor microdisplay unit assembly as described in any one of claims 1 to 6, characterized in that, The first color microdisplay unit (2), the second color microdisplay unit (3), and the third color microdisplay unit (4) each include a substrate (20), a light-emitting chip (21) connected to the substrate (20), and a plurality of first pads (22) electrically connected to the light-emitting chip (21). The first pads (22) and the light-emitting chip (21) are located on opposite sides of the substrate (20). The circuit board (1) is provided with a plurality of second pads (14) corresponding to the first pads (22). The first color microdisplay unit (2), the second color microdisplay unit (3), and the third color microdisplay unit (4) are all soldered to the second pads (14) through their first pads (22).
9. The multicolor microdisplay unit assembly as described in any one of claims 3 to 6, characterized in that, The first part (10) is connected to the second part (11), the third part (12) and the fourth part (13) by a flexible connection part (16).
10. The multicolor microdisplay unit assembly as described in any one of claims 3 to 6, characterized in that, A reinforcing plate (15) is provided on the back of the portion of the circuit board (1) where the first color micro display unit (2), the second color micro display unit (3) and the third color micro display unit (4) are located.
11. The multicolor microdisplay unit assembly as described in any one of claims 1 to 6, characterized in that, The circuit board (1) is a flexible circuit board as a whole; or, The circuit board (1) is a rigid-flex board. Except for the part of the circuit board (1) used to install the connector (5) which is a rigid circuit board, the rest of the circuit board (1) is a flexible circuit board.
12. A microdisplay optical engine, characterized in that, include: The multicolor microdisplay unit assembly as described in any one of claims 1 to 11; The light combining component (6) includes a light emitting surface (60), a first light incident surface (61), a second light incident surface (62), and a third light incident surface (63). The first color micro-display unit (2), the second color micro-display unit (3), and the third color micro-display unit (4) of the multi-color micro-display unit component are respectively disposed corresponding to the first light incident surface (61), the second light incident surface (62), and the third light incident surface (63); and... The lens assembly (7) is configured to correspond to the light-emitting surface (60).