Method and system for improving high and low temperature environment stability of flash memory storage device

Abstract

The invention provides a method and a system for improving the stability of flash memory storage equipment in high and low temperature environments. The system comprises a plug-in module, a main flash memory module, a temperature measurement module and a standby flash memory module. The plug-in module, the main flash memory module, the temperature measuring module, the cooling module, the temperature rising module and the standby flash memory module are arranged in a matched manner, so that the temperature can be measured by controlling the cooling module in the flash memory process, if the temperature is too high, the main flash memory module is cooled when the cooling module works, and if the temperature is too low, the standby flash memory module is not cooled. The main flash memory module is heated by controlling the heating module, and constant-temperature calculation is performed by embedding a PID control algorithm in a constant-temperature process, so that the purpose of keeping constant temperature in the flash memory process is facilitated.

Description

Technical Field

[0001] This invention belongs to the field of data storage technology, and in particular relates to a method and system for improving the stability of flash memory storage devices in high and low temperature environments. Background Technology

[0002] Flash memory storage devices use flash memory as the storage medium. Flash memory is a non-volatile memory based on semiconductor technology that can be electrically erased and read / written. It allows for multiple erasures and reprogramming during operation. Its basic storage unit is a floating-gate transistor, which uses the amount of charge stored in the floating gate to represent data. Due to its advantages such as small size, light weight, fast read / write speed, and good shock resistance, this technology is widely used for general data storage, as well as data storage and exchange between digital devices such as computers, digital cameras, smartphones, and solid-state drives, as well as products like memory cards and USB flash drives. However, in practical applications, the stability of existing flash memory during data reading, writing, and storage is easily affected by temperature changes, which limits its reliability in broader or more demanding scenarios. Summary of the Invention

[0003] To address the aforementioned technical problems, this invention provides a method and system for improving the stability of flash memory storage devices in high and low temperature environments. By improving the flash memory device during use and controlling its operating temperature, the stability of the flash memory device during use is improved.

[0004] A system for improving the stability of flash memory storage devices in high and low temperature environments includes a plug-in module, a main flash memory module, a temperature sensing module, and a backup flash memory module. The plug-in module is electrically connected to the flash memory module; the flash memory module is electrically connected to the temperature sensing module; and the temperature sensing module is electrically connected to the backup flash memory module.

[0005] Preferably, the temperature measuring module includes a cooling module and a heating module; the temperature measuring module is electrically connected to the cooling module; the temperature measuring module is electrically connected to the heating module.

[0006] Preferably, the proportional, integral, and derivative adjustments of the temperature measurement module are components of a PID algorithm. A bidirectional PID with a dead zone (the dead zone refers to the actuator stopping when the temperature is very close to the set value to avoid frequent operation near the switching point, protect the actuator, and improve stability) is used. The absolute value of the PID algorithm output is the power of the actuator, and the positive or negative sign of the PID algorithm output determines the cooling or heating action.

[0007] Preferably, the temperature measurement module uses a temperature sensor.

[0008] Preferably, the cooling module and the heating module respectively use cooling or heating devices (such as semiconductor cooling chips) to directly or indirectly contact the flash memory chip, and control the temperature of the flash memory chip through heat conduction.

[0009] Preferably, the temperature measurement module outputs the actual temperature of the flash memory chip.

[0010] Preferably, the set value input to the main flash memory module is the ideal operating temperature of the flash memory, and the set value minus the temperature measured by the measuring element will be used as the input to the PID algorithm.

[0011] Preferably, the main flash memory module is electrically connected to the backup flash memory module.

[0012] One method to improve the stability of flash memory storage devices in high and low temperature environments is as follows:

[0013] Step 1: Docking. Move the flash memory device to a suitable position and connect it to the operating device.

[0014] Step 2: Flash memory, performing flash memory operations using an operating device;

[0015] Step 3: Temperature measurement. During the flash memory process, temperature is measured using a temperature detection mechanism.

[0016] In step three, the first step is cooling. During temperature measurement, if the temperature is too high, the cooling mechanism is activated to cool the flash memory mechanism.

[0017] The second step is to stop the cooling process if the temperature is too low using a PID control algorithm.

[0018] The third step is heating. If the temperature is too low during temperature measurement, the heating mechanism is activated to heat the flash memory mechanism.

[0019] The fourth step is to stop the heating process when the temperature is too high by using a PID control algorithm.

[0020] Step 4: Temperature control. If the temperature is too high, the flash memory mechanism will be cooled down. If the temperature is too low, the flash memory mechanism will be heated up.

[0021] Step 5: Backup. If extreme temperatures occur during flash memory operation, the data in the flash memory is moved to a backup storage unit to prevent data loss, thus completing the flash memory operation.

[0022] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0023] In this invention, the cooperative arrangement of the plug-in module, main flash memory module, temperature measurement module, cooling module, heating module, and backup flash memory module facilitates temperature measurement during flash memory operation by controlling the cooling module. If the temperature is too high, the cooling module cools the main flash memory module; if the temperature is too low, the heating module heats the main flash memory module. Furthermore, during the temperature control process, an embedded PID control algorithm is used for temperature calculation, facilitating temperature control during flash memory operation. Attached Figure Description

[0024] Figure 1 This is a system schematic diagram of the present invention.

[0025] Figure 2 This is a flowchart of the method of the present invention.

[0026] Figure 3 This is a flowchart of the temperature measurement process of the present invention.

[0027] Figure 4 This is a schematic diagram of the PID control block diagram of the present invention.

[0028] In the picture:

[0029] 1. Connector module; 2. Main flash memory module; 3. Temperature measurement module; 31. Cooling module; 32. Heating module; 4. Backup flash memory module. Detailed Implementation

[0030] The present invention will now be described in detail with reference to the accompanying drawings, as shown below. Figure 1 and attached Figure 2 As shown, a system for improving the stability of flash memory storage devices in high and low temperature environments includes a plug-in module 1, a main flash memory module 2, a temperature measuring module 3, and a backup flash memory module 4. The plug-in module 1 is electrically connected to the flash memory module 2; the flash memory module 2 is electrically connected to the temperature measuring module 3; and the temperature measuring module 3 is electrically connected to the backup flash memory module 4.

[0031] Preferably, the temperature measuring module 3 includes a cooling module 31 and a heating module 32; the temperature measuring module 3 is electrically connected to the cooling module 31; the temperature measuring module 3 is electrically connected to the heating module 32.

[0032] Preferably, the main flash memory module 2 is electrically connected to the backup flash memory module 4.

[0033] Preferably, the proportional, integral, and derivative adjustments of the temperature measurement module 3 are components of a PID algorithm. A bidirectional PID with a dead zone (the dead zone refers to the actuator stopping when the temperature is very close to the set value to avoid frequent operation near the switching point, protect the actuator, and improve stability) is used. The absolute value of the PID algorithm output is the power of the actuator, and the positive or negative sign of the PID algorithm output determines the cooling or heating action.

[0034] Preferably, the temperature measurement module 3 uses a temperature sensor.

[0035] Preferably, the cooling module 31 and the heating module 32 respectively use cooling or heating devices (such as semiconductor cooling chips) to directly or indirectly contact the flash memory chip, and control the temperature of the flash memory chip through heat conduction.

[0036] Preferably, the output of the temperature measuring module 3 is the actual temperature of the flash memory chip.

[0037] Preferably, the set value input to the main flash memory module 2 is the ideal operating temperature of the flash memory, and the set value minus the temperature measured by the measuring element will be used as the input to the PID algorithm.

[0038] One method to improve the stability of flash memory storage devices in high and low temperature environments is as follows:

[0039] Step 1: Docking. Move the flash memory device to a suitable position and connect it to the operating device.

[0040] Step 2: Flash memory, performing flash memory operations using an operating device;

[0041] Step 3: Temperature measurement. During the flash memory process, temperature is measured using a temperature detection mechanism.

[0042] In step three, the first step is cooling. During temperature measurement, if the temperature is too high, the cooling mechanism is activated to cool the flash memory mechanism.

[0043] The second step is to stop the cooling process if the temperature is too low using a PID control algorithm.

[0044] The third step is heating. If the temperature is too low during temperature measurement, the heating mechanism is activated to heat the flash memory mechanism.

[0045] The fourth step is to stop the heating process when the temperature is too high by using a PID control algorithm.

[0046] Step 4: Temperature control. If the temperature is too high, the flash memory mechanism will be cooled down. If the temperature is too low, the flash memory mechanism will be heated up.

[0047] Step 5: Backup. If extreme temperatures occur during flash memory operation, the data in the flash memory is moved to a backup storage unit to prevent data loss, thus completing the flash memory operation.

[0048] Working principle

[0049] In this invention, during use, the main flash memory module 2 is connected to the operating device via the plug-in module 1, and then the flash memory operation is performed via the operating device. During the flash memory operation, the temperature measurement module 3 measures the temperature. If the temperature is too high during the flash memory operation, the cooling module 31 is activated to cool the main flash memory module 2. If the temperature is too low, the heating module 32 is activated to heat the main flash memory module 2. During the constant temperature process, a PID control algorithm is embedded to calculate the constant temperature, which facilitates temperature range control during the flash memory operation. If the temperature exceeds the limit, the data is moved to the backup flash memory module 4 to prevent data loss, thereby completing the flash memory constant temperature operation.

[0050] Any technical solution that achieves the above-mentioned technical effects by utilizing the technical solutions described in this invention, or by designing similar technical solutions by those skilled in the art under the inspiration of the technical solutions described in this invention, falls within the protection scope of this invention.

Claims

1. A method and system for improving the stability of flash memory storage devices in high and low temperature environments, characterized in that, The system for improving the stability of flash memory storage devices in high and low temperature environments includes a plug-in module (1), a main flash memory module (2), a temperature measuring module (3), and a backup flash memory module (4). The plug-in module (1) is electrically connected to the flash memory module (2); the flash memory module (2) is electrically connected to the temperature measuring module (3); and the temperature measuring module (3) is electrically connected to the backup flash memory module (4).

2. The system for improving the stability of flash memory storage devices in high and low temperature environments as described in claim 1, characterized in that, The temperature measuring module (3) includes a cooling module (31) and a heating module (32); the temperature measuring module (3) is electrically connected to the cooling module (31); the temperature measuring module (3) is electrically connected to the heating module (32).

3. The system for improving the stability of flash memory storage devices in high and low temperature environments as described in claim 1, characterized in that, The main flash module (2) is electrically connected to the backup flash module (4).

4. The system for improving the stability of flash memory storage devices in high and low temperature environments as described in claim 1, characterized in that, The proportional, integral, and derivative adjustments of the temperature measurement module (3) are components of the PID algorithm. A bidirectional PID with a dead zone (the dead zone refers to the actuator stopping when the temperature is very close to the set value to avoid frequent operation near the switching point, protect the actuator and improve stability) is used. The absolute value of the output of the PID algorithm is the power of the actuator, and the positive or negative value of the output of the PID algorithm determines the cooling or heating action.

5. The system for improving the stability of flash memory storage devices in high and low temperature environments as described in claim 1, characterized in that, The temperature measurement module (3) uses a temperature sensor.

6. The system for improving the stability of flash memory storage devices in high and low temperature environments as described in claim 1, characterized in that, The cooling module (31) and heating module (32) respectively use cooling or heating devices (such as semiconductor cooling chips) to directly or indirectly contact the flash memory chip and control the temperature of the flash memory chip through heat conduction.

7. The system for improving the stability of flash memory storage devices in high and low temperature environments as described in claim 1, characterized in that, The output of the temperature measurement module (3) is the actual temperature of the flash memory chip.

8. The system for improving the stability of flash memory storage devices in high and low temperature environments as described in claim 1, characterized in that, The set value input to the main flash module (2) is the ideal operating temperature of the flash memory. The set value minus the temperature measured by the measuring element will be used as the input of the PID algorithm.

9. The method and system for improving the stability of flash memory storage devices in high and low temperature environments as described in claim 1, characterized in that, The method for improving the stability of flash memory storage devices in high and low temperature environments is as follows: Step 1: Docking. Move the flash memory device to a suitable position and connect it to the operating device. Step 2: Flash memory, performing flash memory operations using an operating device; Step 3: Temperature measurement. During the flash memory process, temperature is measured using a temperature detection mechanism. In step three, the first step is cooling. During temperature measurement, if the temperature is too high, the cooling mechanism is activated to cool the flash memory mechanism. The second step is to stop the cooling process if the temperature is too low using a PID control algorithm. The third step is heating. If the temperature is too low during temperature measurement, the heating mechanism is activated to heat the flash memory mechanism. The fourth step is to stop the heating process when the temperature is too high by using a PID control algorithm. Step 4: Temperature control. If the temperature is too high, the flash memory mechanism will be cooled down. If the temperature is too low, the flash memory mechanism will be heated up. Step 5; Backup: In the event of extreme temperature conditions during flash memory operation, data is moved from the flash memory to a backup storage unit to prevent data loss and thus complete the flash memory operation.

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