Breaker double 485 self-healing communication and pulse fault-tolerant aggregation

Abstract

The invention discloses a circuit breaker double 485 self-healing communication and pulse fault-tolerant aggregation, and relates to the field of circuit breakers, the circuit breaker double 485 self-healing communication and pulse fault-tolerant aggregation comprises a first shell, a second shell is fixed on the first shell, a heat dissipation supporting plate is fixed in the second shell, and an efficient heat dissipation mechanism is arranged on one side, away from an arc extinguish chamber, of the heat dissipation supporting plate. An auxiliary ventilation mechanism is arranged on the side, away from the arc extinguish chamber, of the heat dissipation supporting plate. When natural heat dissipation cannot meet the heat dissipation requirement, the efficient heat dissipation mechanism on the heat dissipation supporting plate is used for conducting temperature conduction and cooling, meanwhile, the efficient heat dissipation mechanism sucks in external air and then discharges the external air, the external air is used for assisting the efficient heat dissipation mechanism, and meanwhile the efficient heat dissipation mechanism drives the auxiliary ventilation mechanism; and the auxiliary ventilation mechanism drives the filter plate to vibrate, so that on the premise of ensuring electrical safety, accurate temperature control of the most critical heating point is realized, preposed heat guarantee is provided for the communication module, and leap of the overall performance and reliability of the circuit breaker is realized.

Description

Technical Field

[0001] This application relates to the field of circuit breakers, and in particular to a circuit breaker dual 485 self-healing communication and pulse fault-tolerant aggregation. Background Technology

[0002] Circuit breakers are crucial protective devices in power systems, primarily used to automatically cut off current when overloads, short circuits, or other faults occur in the circuit, thereby protecting electrical equipment and lines. With the development of smart grids and industrial automation, circuit breakers not only need to have reliable breaking capacity but also need to integrate communication functions to achieve remote monitoring and control.

[0003] Dual RS485 self-healing communication and pulse fault-tolerant aggregation technology are key methods used in modern intelligent circuit breakers to improve communication reliability. This technology achieves redundant communication through dual RS485 communication interfaces. When the quality of the main communication link degrades or is interrupted, the system can automatically switch to the backup link to ensure uninterrupted data transmission. At the same time, the pulse fault-tolerant mechanism can deduplicate and compensate for pulse signals when communication is abnormal, effectively avoiding counting errors. However, communication modules and core heat-generating components of the circuit breaker, such as the contact system and arc-extinguishing chamber, will generate a lot of heat during long-term operation. If heat dissipation is insufficient, it will not only affect communication stability but may also shorten the equipment life and even cause failure.

[0004] Currently, common circuit breaker heat dissipation methods mostly rely on the heat dissipation grille on the casing and natural ventilation, which have limited heat dissipation efficiency, make it difficult to achieve precise temperature control of key heat-generating points, and lack pre-heat control measures to ensure the stable operation of communication modules under high-temperature conditions. Summary of the Invention

[0005] The purpose of this application is to address the problems mentioned in the background art: the common circuit breaker heat dissipation methods rely on the heat dissipation grille of the casing and natural ventilation, which have limited heat dissipation efficiency, make it difficult to achieve precise temperature control of key heat points, and lack pre-heat control measures to ensure the stable operation of the communication module under high temperature conditions. This application provides a circuit breaker with dual 485 self-healing communication and pulse fault-tolerant aggregation.

[0006] To achieve the above objectives, this application specifically adopts the following technical solution:

[0007] A circuit breaker with dual 485 self-healing communication and pulse fault-tolerant aggregation includes a first housing, a second housing fixed to the first housing, a toggle handle mounted on the first housing, a contact system installed between the first and second housings, a heat dissipation support plate fixed in the second housing, an arc-extinguishing chamber fixed on the heat dissipation support plate, a first heat dissipation grid fixed on the second housing, a second heat dissipation grid fixed at the end of the second housing away from the first heat dissipation grid, a communication system mounted on the first housing, a filter plate disposed on the second heat dissipation grid, a high-efficiency heat dissipation mechanism disposed on the side of the heat dissipation support plate away from the arc-extinguishing chamber, an auxiliary ventilation mechanism disposed on the side of the heat dissipation support plate away from the arc-extinguishing chamber, the heat dissipation support plate being located between the first and second heat dissipation grids, and a temperature sensor fixed inside the second housing.

[0008] By adopting the above technical solution, when natural heat dissipation is insufficient, the high-efficiency heat dissipation mechanism on the heat dissipation support plate is used for temperature conduction and cooling. Outside air is drawn in from the second heat dissipation grille into the space between the heat dissipation support plate and the second outer shell, and then discharged from the first heat dissipation grille. The outside air assists the high-efficiency heat dissipation mechanism. At the same time, the high-efficiency heat dissipation mechanism drives the auxiliary ventilation mechanism, which in turn causes the filter plate to vibrate. Thus, while ensuring electrical safety, precise temperature control of the most critical heat-generating points is achieved, providing a front-end thermal guarantee for the communication module and realizing a leap in the overall performance and reliability of the circuit breaker.

[0009] Furthermore, the high-efficiency heat dissipation mechanism includes an insulating heat-conducting plate fixed on a heat dissipation support plate. The insulating heat-conducting plate corresponds to the contact system. A semiconductor heat sink is fixed on the side of the insulating heat-conducting plate away from the contact system. An auxiliary heat dissipation component is provided on the semiconductor heat sink. Both sides of the semiconductor heat sink are coated with a heat-conducting layer.

[0010] By adopting the above technical solution, the insulating heat-conducting plate is an alumina ceramic plate. One side of it is tightly attached to the stationary contact connection busbar of the contact system, and the other side is combined with the cold end of the semiconductor heat sink through the heat-conducting layer. In this way, under the premise of ensuring electrical safety, active cooling of the most critical heat-generating point is achieved, reducing the possibility of excessively high temperature of the heat-generating point and providing front-end thermal protection for the communication module.

[0011] Furthermore, the auxiliary heat dissipation component includes a heat dissipation plate fixed on a semiconductor heat sink, with uniformly distributed heat dissipation fins fixed on the heat dissipation plate, and airflow components provided on the heat dissipation support plate.

[0012] By adopting the above technical solution, using a fin structure with high heat dissipation efficiency in combination with forced air cooling, high-power heat dissipation is achieved in a limited space, ensuring the efficient operation of the semiconductor heat sink.

[0013] Furthermore, the airflow component includes a support block fixed to a heat dissipation support plate. The support block has two ventilation holes, and two symmetrical support rods are fixed inside the ventilation holes. A drive motor is fixed to one of the support rods. The drive motor is a dual-drive motor. A rotating shaft is fixed to one output end of the drive motor. Several circumferentially distributed rotating blades are fixed on the rotating shaft. A power supply battery is fixed inside the support block. The power supply battery is electrically connected to the semiconductor heat sink and the drive motor.

[0014] By adopting the above technical solution, the drive motor drives the rotating shaft one and the rotating blade to rotate, generating a cooling airflow from the heat dissipation grille two to the heat dissipation grille one, thereby ensuring efficient heat dissipation of the heat dissipation fins, reducing the possibility of heat accumulation on the heat dissipation fins, and further ensuring the stability of the semiconductor heat sink operation.

[0015] Furthermore, a long strip-shaped air guide shroud is provided between the heat dissipation fins and the support block. The cross-section of the air guide shroud is funnel-shaped, and the air guide shroud is fixedly connected to the support block.

[0016] By adopting the above technical solution, the airflow generated by the rotating blades is concentrated and blown towards the heat dissipation fins after being gathered by the air guide shroud. This further improves the airflow velocity and uniformity, allowing the cooling air to pass through the heat exchange area in a concentrated, uniform, and efficient manner, avoiding the waste of air volume and improving the overall efficiency of the heat dissipation system.

[0017] Furthermore, the auxiliary ventilation mechanism includes a support frame disposed on the side of the filter plate away from the second heat dissipation grille. The support frame is fixedly connected to the second outer shell. Two symmetrical spring plates are fixed on both sides of the filter plate. The spring plates are fixedly connected to the corresponding support frame and the second heat dissipation grille. A reciprocating rod is disposed on the second heat dissipation grille. The reciprocating rod passes through the second heat dissipation grille. A reciprocating ring is slidably connected to the reciprocating rod. The reciprocating ring is fixedly connected to the second heat dissipation grille. A reciprocating assembly is disposed on the reciprocating rod. A transmission assembly is disposed on one of the drive motors.

[0018] By adopting the above technical solution, the drive motor drives the transmission component, which in turn drives the reciprocating component, causing the filter plate to vibrate under the support of the spring plates. This achieves the self-cleaning of the filter plate simultaneously during the heat dissipation process, fundamentally solving the problem of reduced heat dissipation performance caused by dust blockage.

[0019] Furthermore, the reciprocating assembly includes a second rotating shaft mounted on the reciprocating rod. A rotating head is fixed to one end of the second rotating shaft near the reciprocating rod. A reciprocating groove is formed on the side of the rotating head. The reciprocating groove is wavy. A reciprocating block is slidably connected in the reciprocating groove of the rotating head. The reciprocating block is fixedly connected to the reciprocating rod.

[0020] By adopting the above technical solution, the reciprocating block can only move up and down under the constraints of the reciprocating rod and the reciprocating groove, thus providing a stable and reliable mechanical drive for cleaning the filter screen. The structure is simple and the service life is long.

[0021] Furthermore, the transmission assembly includes a transmission wheel one mounted on a support block, the output end of the drive motor passing through the support rod and rotatably connected to the transmission wheel one, a transmission wheel two rotatably connected to the middle of the support block near the end of the transmission wheel one, a transmission belt drivingly connecting the transmission wheel one and the transmission wheel two, and a rotating shaft two fixedly connected to the transmission wheel two.

[0022] By adopting the above technical solution, the first transmission wheel transmits power to the second transmission wheel via a transmission belt. The second transmission wheel drives the second rotating shaft to rotate. At the same time, the second transmission wheel is placed in the middle, thereby driving the second transmission shaft to rotate. This also allows the reciprocating rod and reciprocating ring to be placed in the middle of the filter plate, reducing the possibility of excessive wear caused by the filter plate shifting during vibration. It also greatly simplifies the structure and saves cost and space.

[0023] In summary, this application includes at least one of the following beneficial effects;

[0024] 1. This application achieves this by having one side of an insulating heat-conducting plate tightly attached to the stationary contact busbar of the contact system, and the other side connected to the cold end of a semiconductor heat sink via a heat-conducting layer. Similarly, the hot end of the semiconductor heat sink is connected to the heat sink via a heat-conducting layer. Power is supplied to the semiconductor heat sink by a battery. The heat generated during contact system operation is conducted through the insulating heat-conducting plate to the cold end of the semiconductor heat sink, which then actively cools it, reducing the possibility of abnormally high temperatures in the contact system. The heat generated at the hot end of the semiconductor heat sink is dissipated from the grid by auxiliary heat dissipation components, reducing the accumulation of heat generated by the semiconductor heat sink. This achieves active cooling of the most critical heat-generating points while ensuring electrical safety, reducing the possibility of excessively high temperatures, providing pre-emptive thermal protection for the communication module, and improving the service life of the circuit breaker.

[0025] 2. This application uses a support frame to limit the filter plate, preventing it from detaching from the area of ​​the heat dissipation grille. Spring plates support the filter plate. When the drive motor operates, it drives the transmission assembly, which in turn drives the reciprocating assembly, which in turn drives the reciprocating rod. The reciprocating rod, constrained by the reciprocating ring, moves the filter plate, causing it to vibrate under the support of the spring plates. This achieves the goal of drawing outside air into the heat dissipation fins and simultaneously cleaning the filter plate during the heat dissipation process. This fundamentally solves the problem of decreased heat dissipation performance caused by dust blockage, reduces the possibility of large amounts of dust being drawn into the circuit breaker, affecting its normal operation, and further improves the stability of heat dissipation.

[0026] 3. In this application, by having the small opening of the air guide shroud face the heat dissipation fins and the large opening align with the ventilation holes of the support block, the airflow generated by the rotating blades is concentrated by the air guide shroud and blown towards the heat dissipation fins, further increasing the airflow velocity. At the same time, the airflow is evenly diffused onto the heat dissipation fins, achieving the goal of making the cooling air concentrated, uniform, and efficient through the heat exchange area, avoiding the waste of air volume, and improving the overall efficiency of the heat dissipation system. Attached Figure Description

[0027] Figure 1 This is a first three-dimensional structural schematic diagram of the circuit breaker in this application;

[0028] Figure 2 This is a three-dimensional structural diagram of the circuit breaker in this application;

[0029] Figure 3 This is a schematic diagram of the first part of the high-efficiency heat dissipation mechanism in this application;

[0030] Figure 4 This is a schematic diagram of the second part of the high-efficiency heat dissipation mechanism in this application;

[0031] Figure 5 This is a schematic diagram of the first part of the auxiliary ventilation mechanism in this application;

[0032] Figure 6 This is a schematic diagram of the second part of the auxiliary ventilation mechanism in this application.

[0033] Explanation of reference numerals in the attached figures:

[0034] 1. Outer shell one; 2. Outer shell two; 3. Actuating handle; 4. Contact system; 5. Arc-extinguishing chamber; 6. Heat dissipation grille one; 7. Heat dissipation grille two; 8. High-efficiency heat dissipation mechanism; 81. Semiconductor heat sink; 82. Insulating heat-conducting plate; 83. Heat-conducting layer; 84. Auxiliary heat dissipation components; 841. Heat sink; 842. Heat dissipation fins; 843. Airflow component; 8431. Support block; 8432. Ventilation hole; 8433. Support rod; 8434. Drive motor; 8435. Rotation Shaft 1; 8436, Rotating blade; 844, Air guide shroud; 9, Auxiliary ventilation mechanism; 91, Support frame; 92, Spring plate; 93, Reciprocating rod; 94, Reciprocating ring; 95, Reciprocating assembly; 951, Rotating shaft 2; 952, Rotating head; 953, Reciprocating groove; 954, Reciprocating block; 96, Transmission assembly; 961, Transmission wheel 1; 962, Transmission wheel 2; 963, Transmission belt; 10, Filter plate; 11, Heat dissipation support plate; 12, Communication system; 13, Temperature sensor. Detailed Implementation

[0035] The following is in conjunction with the appendix Figure 1-6 This application will be described in further detail.

[0036] This application discloses a circuit breaker dual 485 self-healing communication and pulse fault-tolerant aggregation.

[0037] Reference Figure 1 , Figure 2 and Figure 3 A circuit breaker with dual 485 self-healing communication and pulse fault-tolerant aggregation includes a first housing 1, a second housing 2 fixed on the first housing 1, a toggle handle 3 installed on the first housing 1, a contact system 4 installed between the first housing 1 and the second housing 2, a heat dissipation support plate 11 fixed in the second housing 2, an arc-extinguishing chamber 5 fixed on the heat dissipation support plate 11, a heat dissipation grid 6 fixed on the second housing 2, a heat dissipation grid 7 fixed at the end of the second housing 2 away from the heat dissipation grid 6, a communication system 12 installed on the first housing 1, a filter plate 10 provided on the heat dissipation grid 7, a high-efficiency heat dissipation mechanism 8 provided on the side of the heat dissipation support plate 11 away from the arc-extinguishing chamber 5, an auxiliary ventilation mechanism 9 provided on the side of the heat dissipation support plate 11 away from the arc-extinguishing chamber 5, the heat dissipation support plate 11 being located between the heat dissipation grid 6 and the heat dissipation grid 7, and a temperature sensor 13 fixed inside the second housing 2.

[0038] The core hardware of the communication system 12 is a PCB board, which integrates a dual-channel RS485 isolated transceiver chip, a pulse shaping circuit, an MCU, and related storage and clock circuits. Through software algorithms, it achieves link health monitoring, self-healing switching, and pulse fault-tolerant aggregation. Upon startup, the communication system 12 establishes a connection with the host computer via dual-channel RS485, transmitting data and pulses normally. When the main link communication quality deteriorates, it automatically and seamlessly switches to the backup link. When the link switches or is interrupted, the pulse processing logic initiates deduplication and compensation mechanisms to ensure accurate counting. When the contact system 4 is closed using the toggle handle 3, the arc-extinguishing chamber 5 extinguishes the arc generated by the closed contact system 4. The arc-extinguishing chamber 5 and the contact system 4 may generate a large amount of heat. The heat dissipation grilles 6 and 7 fixed on the outer casing 2 allow for natural air cooling of the heat generated inside the outer casing 1 and outer casing 2. The temperature sensor 13 monitors the temperature of the outer casing 1 and outer casing 2. When natural cooling is insufficient, a heat dissipation support is used. The high-efficiency heat dissipation mechanism 8 on plate 11 conducts heat to reduce temperature. At the same time, the high-efficiency heat dissipation mechanism 8 draws outside air from the heat dissipation grille 7 into the space between the heat dissipation support plate 11 and the outer casing 2, and then discharges it from the heat dissipation grille 6. The filter plate 10 has evenly distributed filter holes to block dust in the air. The filter plate 10 uses outside air to assist the high-efficiency heat dissipation mechanism 8 and provide stability for its heat dissipation. When outside air enters, the filter plate 10 filters the dust in the air to reduce the entry of dust. At the same time, the high-efficiency heat dissipation mechanism 8 drives the auxiliary ventilation mechanism 9, which causes the filter plate 10 to vibrate, ensuring the air intake of the filter plate 10 during long-term use. By setting the heat dissipation support plate 11 inside the outer casing 2, the high-efficiency heat dissipation mechanism 8 on the heat dissipation support plate 11 actively cools the heat-generating points. Thus, while ensuring electrical safety, precise temperature control of the most critical heat-generating points is achieved, providing a front-end thermal protection for the communication module and improving the service life of the circuit breaker.

[0039] Reference Figure 2 , Figure 3 and Figure 4 The high-efficiency heat dissipation mechanism 8 includes an insulating heat-conducting plate 82 fixed on the heat dissipation support plate 11. The insulating heat-conducting plate 82 corresponds to the contact system 4. A semiconductor heat sink 81 is fixed on the side of the insulating heat-conducting plate 82 away from the contact system 4. An auxiliary heat dissipation component 84 is provided on the semiconductor heat sink 81. Both sides of the semiconductor heat sink 81 are coated with a heat-conducting layer 83.

[0040] The insulating heat-conducting plate 82 is an alumina ceramic plate. One side is tightly attached to the stationary contact busbar of the contact system 4, and the other side is connected to the cold end of the semiconductor heat sink 81 through the heat-conducting layer 83. The heat-conducting layer 83 is thermal grease. The hot end of the semiconductor heat sink 81 is also connected to the auxiliary heat dissipation component 84 through the heat-conducting layer 83. Power is supplied to the semiconductor heat sink 81 from the power supply battery through wires. The heat generated by the contact system 4 during operation is conducted to the cold end of the semiconductor heat sink 81 through the insulating heat-conducting plate 82. The semiconductor heat sink 81 actively cools it, reducing the possibility of abnormal high temperature in the contact system 4. The heat generated by the hot end of the semiconductor heat sink 81 is dissipated from the grid row by the auxiliary heat dissipation component 84, reducing the accumulation of heat generated by the semiconductor heat sink 81 during operation. By using insulating materials to directly conduct core heat and actively cool it, active cooling of the most critical heat-generating point is achieved while ensuring electrical safety, reducing the possibility of excessively high temperature at the heat-generating point and providing front-end thermal protection for the communication module.

[0041] Reference Figure 2 , Figure 3 and Figure 4 The auxiliary heat dissipation component 84 includes a heat dissipation plate 841 fixed on a semiconductor heat sink 81, heat dissipation fins 842 evenly distributed on the heat dissipation plate 841, and air flow components 843 provided on the heat dissipation support plate 11.

[0042] The heat sink 841 is made of aluminum, and the heat sink fins 842 are made of copper to increase the heat dissipation area. The airflow generated by the airflow component 843 flows over the surface of the heat sink fins 842 and carries away the heat. By adopting a fin structure with high heat dissipation efficiency and forced air cooling, high-power heat dissipation is achieved in a limited space, which ensures the efficient operation of the semiconductor heat sink 81.

[0043] Reference Figure 2 , Figure 3 and Figure 4 The airflow component 843 includes a support block 8431 fixed on the heat dissipation support plate 11. The support block 8431 has two ventilation holes 8432. Two symmetrical support rods 8433 are fixed in the ventilation holes 8432. A drive motor 8434 is fixed on one of the support rods 8433. The drive motor 8434 is a dual-drive motor. A rotating shaft 8435 is fixed on one output end of the drive motor 8434. Several circumferentially distributed rotating blades 8436 are fixed on the rotating shaft 8435. A power supply battery is fixed in the support block 8431. The power supply battery is electrically connected to the semiconductor heat sink 81 and the drive motor 8434.

[0044] The support block 8431 is made of engineering plastic. The ventilation hole 8432 is aligned with the heat dissipation grille 6 and the heat dissipation grille 7 to form an air duct. The power supply battery is a rechargeable lithium-ion battery, which is connected to the semiconductor heat sink 81 and the drive motor 8434 through cables. The temperature sensor 13 is electrically connected to the drive motor 8434. When the temperature sensor 13 detects that the temperature is too high, the power supply battery supplies power to the drive motor 8434. The drive motor 8434 drives the rotating shaft 8435 and the rotating blade 8436 to rotate, generating a cooling airflow from the heat dissipation grille 7 to the heat dissipation grille 6. By using the drive motor 8434 to drive the rotating shaft 8435 and the rotating blade 8436 to generate a cooling airflow from the heat dissipation grille 7 to the heat dissipation grille 6, the efficient heat dissipation of the heat dissipation fins 842 is ensured, the possibility of heat accumulation on the heat dissipation fins 842 is reduced, and the stability of the semiconductor heat sink 81 is further ensured.

[0045] Reference Figure 2 and Figure 4 A long strip-shaped air guide shroud 844 is provided between the heat dissipation fins 842 and the support block 8431. The air guide shroud 844 has a funnel-shaped cross-section and is fixedly connected to the support block 8431. The air guide shroud 844 is injection molded from plastic. Its small opening faces the heat dissipation fins 842, and its large opening is aligned with the ventilation holes 8432 of the support block 8431. The airflow generated by the rotating blades 8436 is concentrated by the air guide shroud 844 and blown towards the heat dissipation fins 842, further increasing the airflow velocity and evenly dispersing the airflow onto the heat dissipation fins 842. By using the air guide shroud 844 to optimize the airflow path, the cooling air is concentrated, even, and efficient through the heat exchange area, avoiding airflow waste and improving the overall efficiency of the heat dissipation system.

[0046] Reference Figure 2 , Figure 5 and Figure 6 The auxiliary ventilation mechanism 9 includes a support frame 91 disposed on the side of the filter plate 10 away from the heat dissipation grille 7. The support frame 91 is fixedly connected to the outer shell 2. Two symmetrical spring plates 92 are fixed on both sides of the filter plate 10. The spring plates 92 are fixedly connected to the corresponding support frame 91 and the heat dissipation grille 7. A reciprocating rod 93 is disposed on the heat dissipation grille 7. The reciprocating rod 93 passes through the heat dissipation grille 7. A reciprocating ring 94 is slidably connected to the reciprocating rod 93. The reciprocating ring 94 is fixedly connected to the heat dissipation grille 7. A reciprocating component 95 is disposed on the reciprocating rod 93. A transmission component 96 is disposed on one of the drive motors 8434.

[0047] The support frame 91 is used to limit the filter plate 10 to prevent it from falling out of the heat dissipation grille 7. The spring plate 92 supports the filter plate 10. When the drive motor 8434 is working, the drive motor 8434 drives the transmission component 96, the transmission component 96 drives the reciprocating component 95, and the reciprocating component 95 drives the reciprocating rod 93. The reciprocating rod 93 drives the filter plate 10 under the restriction of the reciprocating ring 94, so that the filter plate 10 vibrates under the support of the spring plate 92. By using the vibration to clean the filter plate 10 that blocks external dust during the heat dissipation process, the self-cleaning of the filter plate 10 is achieved simultaneously during the heat dissipation process, which fundamentally solves the problem of reduced heat dissipation performance caused by dust blockage.

[0048] Reference Figure 2 , Figure 5 and Figure 6 The reciprocating assembly 95 includes a second rotating shaft 951 disposed on the reciprocating rod 93. A rotating head 952 is fixed to one end of the rotating shaft 951 near the reciprocating rod 93. A reciprocating groove 953 is provided on the side of the rotating head 952. The reciprocating groove 953 is wavy. A reciprocating block 954 is slidably connected in the reciprocating groove 953 of the rotating head 952. The reciprocating block 954 is fixedly connected to the reciprocating rod 93.

[0049] The rotating shaft 951 is driven to rotate at a constant speed by the transmission assembly 96, which in turn drives the rotating head 952 to rotate. The reciprocating block 954 is embedded in the wave-shaped reciprocating groove 953. The reciprocating block 954 is fixedly connected to the reciprocating rod 93. Under the restriction of the reciprocating rod 93 and the reciprocating groove 953, the reciprocating block 954 can only move up and down, thereby converting the rotational motion of the rotating head 952 into the linear reciprocating motion of the reciprocating rod 93. The motion conversion is achieved by adopting a cam groove structure, thus providing a stable and reliable mechanical drive for cleaning the filter screen. The structure is simple and has a long service life.

[0050] Reference Figure 4 , Figure 5 and Figure 6 The transmission assembly 96 includes a transmission wheel 961 mounted on a support block 8431. The output end of the drive motor 8434 passes through the support rod 8433 and is rotatably connected to the transmission wheel 961. A transmission wheel 962 is rotatably connected to the middle of the support block 8431 near the end of the transmission wheel 961. A transmission belt 963 is drivingly connected to the transmission wheel 961 and the transmission wheel 962. A rotating shaft 951 is fixedly connected to the transmission wheel 962.

[0051] The second output end of the drive motor 8434 drives the first transmission wheel 961 to rotate. The first transmission wheel 961 drives the second transmission wheel 962 to rotate via the transmission belt 963. The second transmission wheel 962 is located in the middle of the support block 8431. The second transmission wheel 962 drives the second rotating shaft 951 to rotate. The power is transmitted to the second transmission wheel 962 through the transmission belt 963. The second transmission wheel 962 drives the second rotating shaft 951 to rotate. At the same time, the second transmission wheel 962 is placed in the middle, thereby driving the second transmission shaft to rotate. This also allows the reciprocating rod 93 and the reciprocating ring 94 to be placed in the middle of the filter plate 10, reducing the possibility of excessive wear caused by the filter plate 10 shifting during vibration. At the same time, it greatly simplifies the structure and saves cost and space.

[0052] Working principle: After the device is started, the communication system 12 first establishes a communication connection with the host computer through the dual RS485 isolated transceiver chip integrated on the PCB board, and transmits data and pulse signals normally. The MCU continuously runs the link health monitoring algorithm to evaluate the communication quality of the main link in real time. Once the main link communication is detected to be deteriorated, the system immediately and seamlessly transfers the communication task to the backup link through the self-healing switching algorithm to ensure that the data transmission is uninterrupted. When the link is switched or a brief interruption occurs, the pulse processing logic synchronously starts the deduplication and compensation mechanism to effectively avoid pulse counting errors and ensure the accuracy of the system counting.

[0053] During circuit breaker operation, an electric arc is generated when the contact system 4 is closed by using the toggle handle 3. The arc extinguishing chamber 5 quickly extinguishes the arc. However, the contact system 4 and the arc extinguishing chamber 5 will generate a lot of heat during operation. The heat dissipation grilles 1 and 2 on the outer shell first rely on natural air convection for heat dissipation. At the same time, the internal temperature sensor 13 continuously monitors the internal temperature. When natural heat dissipation is insufficient, the high-efficiency heat dissipation mechanism 8 is activated. The insulating heat-conducting plate 82 is closely attached to the heating busbar of the contact system 4, and conducts heat to the cold end of the semiconductor heat sink 81. After the semiconductor heat sink 81 is energized, it actively cools the key heat points. The heat generated at its hot end is transferred to the heat sink 841 with heat dissipation fins 842. At the same time, the drive motor 8434 drives the rotating shaft 1 8435 and the rotating blade 8436 to rotate, which concentrates and blows the external air from the heat dissipation grille 2 7 through the air guide shroud 844 to the heat dissipation fins 842 at high speed. The forced convection carries away the heat and is discharged from the heat dissipation grille 1 6, forming an effective active air cooling heat dissipation cycle.

[0054] During the operation of the heat dissipation duct, the filter plate 10 filters dust from the incoming air. To further maintain the air permeability of the filter plate 10, the other output end of the drive motor 8434 drives the rotating shaft 951 to rotate through the transmission wheel 961, transmission belt 963 and transmission wheel 962. The rotating head 952 at the front end of the rotating shaft 951 drives the reciprocating block 954 and reciprocating rod 93 to make linear reciprocating motion through its wave-shaped reciprocating groove 953, so that the filter plate 10 continuously vibrates under the support of the spring plate 92, shaking off the accumulated dust, thereby achieving self-cleaning without stopping the machine, ensuring the long-term stable and efficient operation of the heat dissipation system. Through the synergistic work of the above-mentioned communication self-healing and precise temperature control, this device can still maintain reliable communication and thermal safety under complex working conditions, significantly improving the overall performance and service life of the circuit breaker.

[0055] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A circuit breaker with dual 485 self-healing communication and pulse fault-tolerant aggregation, comprising a housing (1), characterized in that: A second outer shell (2) is fixed on the first outer shell (1). A toggle handle (3) is installed on the first outer shell (1). A contact system (4) is installed between the first outer shell (1) and the second outer shell (2). A heat dissipation support plate (11) is fixed in the second outer shell (2). An arc-extinguishing chamber (5) is fixed on the heat dissipation support plate (11). A heat dissipation grid (6) is fixed on the second outer shell (2). A heat dissipation grid (7) is fixed at the end of the second outer shell (2) away from the heat dissipation grid (6). A communication system (12) is installed on the first outer shell (1). A filter plate (10) is provided on the heat dissipation grid (7). A high-efficiency heat dissipation mechanism (8) is provided on the side of the heat dissipation support plate (11) away from the arc-extinguishing chamber (5). An auxiliary ventilation mechanism (9) is provided on the side of the heat dissipation support plate (11) away from the arc-extinguishing chamber (5). The heat dissipation support plate (11) is located between the heat dissipation grid (6) and the heat dissipation grid (7). A temperature sensor (13) is fixed inside the second outer shell (2).

2. The circuit breaker dual 485 self-healing communication and pulse fault-tolerant aggregation according to claim 1, characterized in that: The high-efficiency heat dissipation mechanism (8) includes an insulating heat-conducting plate (82) fixed on a heat dissipation support plate (11). The insulating heat-conducting plate (82) corresponds to the contact system (4). A semiconductor heat sink (81) is fixed on the side of the insulating heat-conducting plate (82) away from the contact system (4). An auxiliary heat dissipation component (84) is provided on the semiconductor heat sink (81). Both sides of the semiconductor heat sink (81) are coated with a heat-conducting layer (83).

3. The circuit breaker dual 485 self-healing communication and pulse fault-tolerant aggregation according to claim 2, characterized in that: The auxiliary heat dissipation component (84) includes a heat dissipation plate (841) fixed on a semiconductor heat sink (81), a heat dissipation fin (842) evenly distributed on the heat dissipation plate (841), and an airflow component (843) provided on the heat dissipation support plate (11).

4. The circuit breaker dual 485 self-healing communication and pulse fault-tolerant aggregation according to claim 3, characterized in that: The airflow component (843) includes a support block (8431) fixed on a heat dissipation support plate (11). The support block (8431) has two ventilation holes (8432). Two symmetrical support rods (8433) are fixed in the ventilation holes (8432). A drive motor (8434) is fixed on one of the support rods (8433). The drive motor (8434) is a dual-drive motor. A rotating shaft (8435) is fixed on one output end of the drive motor (8434). Several circumferentially distributed rotating blades (8436) are fixed on the rotating shaft (8435). A power supply battery is fixed in the support block (8431). The power supply battery is electrically connected to the semiconductor heat sink (81) and the drive motor (8434).

5. The circuit breaker dual 485 self-healing communication and pulse fault-tolerant aggregation according to claim 4, characterized in that: A long strip-shaped air guide shroud (844) is provided between the heat dissipation fins (842) and the support block (8431). The cross-section of the air guide shroud (844) is funnel-shaped, and the air guide shroud (844) is fixedly connected to the support block (8431).

6. The circuit breaker dual 485 self-healing communication and pulse fault-tolerant aggregation according to claim 4, characterized in that: The auxiliary ventilation mechanism (9) includes a support frame (91) disposed on the side of the filter plate (10) away from the heat dissipation grille (7). The support frame (91) is fixedly connected to the outer shell (2). Two symmetrical spring plates (92) are fixed on both sides of the filter plate (10). The spring plates (92) are fixedly connected to the corresponding support frame (91) and the heat dissipation grille (7). A reciprocating rod (93) is disposed on the heat dissipation grille (7). The reciprocating rod (93) passes through the heat dissipation grille (7). A reciprocating ring (94) is slidably connected on the reciprocating rod (93). The reciprocating ring (94) is fixedly connected to the heat dissipation grille (7). A reciprocating component (95) is disposed on the reciprocating rod (93). A transmission component (96) is disposed on one of the drive motors (8434).

7. The circuit breaker dual 485 self-healing communication and pulse fault-tolerant aggregation according to claim 6, characterized in that: The reciprocating assembly (95) includes a second rotating shaft (951) disposed on the reciprocating rod (93). A rotating head (952) is fixed at one end of the second rotating shaft (951) near the reciprocating rod (93). A reciprocating groove (953) is provided on the side of the rotating head (952). The reciprocating groove (953) is wavy. A reciprocating block (954) is slidably connected in the reciprocating groove (953) of the rotating head (952). The reciprocating block (954) is fixedly connected to the reciprocating rod (93).

8. The circuit breaker dual 485 self-healing communication and pulse fault-tolerant aggregation according to claim 7, characterized in that: The transmission assembly (96) includes a transmission wheel (961) mounted on a support block (8431), the output end of the drive motor (8434) passes through the support rod (8433) and is rotatably connected to the transmission wheel (961), a transmission wheel (962) is rotatably connected to the middle of the support block (8431) near the end of the transmission wheel (961), the transmission wheel (961) and the transmission wheel (962) are connected by a transmission belt (963), and the rotating shaft (951) is fixedly connected to the transmission wheel (962).

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