Manufacturing method of packaged circuit board and packaged circuit board

Abstract

The invention discloses a manufacturing method of a packaging circuit board and the packaging circuit board. The manufacturing method comprises the following steps: step a, printing metal slurry at a preset position of a first packaging substrate; b, arranging an insulating plate with a hole on the first packaging substrate, and enabling the hole to correspond to a preset position so as to enable the metal slurry to be exposed at the hole; c, stacking a second packaging substrate on the insulating plate to form a pretreatment piece; step d, sintering the pretreated piece to enable the metal slurry to form a metal phase; and step e, pressing the sintered pretreatment piece, and electrically connecting and / or radiating the first packaging substrate and the second packaging substrate through a metal phase to obtain the packaging circuit board. The metal phase is formed by printing the metal slurry and sintering the metal slurry, so that the size of the metal phase can be designed according to requirements, and interlayer electric connection and heat dissipation capability of the packaged circuit board are effectively improved.

Description

Technical Field

[0001] This application relates to the field of circuit board packaging technology, and in particular to a method for manufacturing a packaged circuit board and the packaged circuit board itself. Background Technology

[0002] With the development of electronic technology, electronic devices are evolving towards thinner, lighter, higher-performance, and higher-density designs. Circuit boards, by embedding electronic components into a substrate, achieve a high degree of system integration, and their performance directly affects the reliability, stability, and power capacity of the entire electronic device.

[0003] In existing technologies, electrical connections and heat transfer between adjacent layers of a packaged circuit board are primarily achieved through buried vias, with metal deposited on the via walls via electroplating. However, the limitations of traditional electroplating processes restrict the diameter of the vias, resulting in a limited effective cross-sectional area of ​​the metal conductors within the vias. This, in turn, restricts current transmission capacity and heat conduction efficiency. Therefore, in high-power applications, traditional electroplated via technology struggles to meet the demands of transmitting high-power currents and handling large amounts of heat. Summary of the Invention

[0004] The purpose of this application is to provide a method for manufacturing a packaged circuit board and a packaged circuit board, so as to solve the problem in the prior art that the metal channel formed by the limitations of the electroplating process has a small cross-sectional area, poor electrical and thermal conductivity, and cannot meet the requirements of high current carrying and heat dissipation.

[0005] To solve the above-mentioned technical problems, this application adopts the following technical solution:

[0006] In a first aspect, this application provides a method for manufacturing a packaged circuit board, comprising:

[0007] Step a: Print metal paste at predetermined positions on the first packaging substrate;

[0008] Step b: Place an insulating plate with holes on the first packaging substrate and align the holes with predetermined positions so that the metal paste is exposed at the holes;

[0009] Step c: Stack the second packaging substrate on the insulating board to form a pre-processed part;

[0010] Step d: Sinter the pretreated part to form a metallic phase from the metal slurry;

[0011] Step e: Press the sintered pre-treated parts together, and electrically connect and / or dissipate heat between the first and second packaging substrates through the metal phase to obtain the packaged circuit board.

[0012] Compared with existing technologies, the technical effects achieved by this solution are as follows: by printing metal paste and sintering to form a metal phase, the size of the metal phase can be designed according to requirements, effectively improving the interlayer electrical connection and heat dissipation capabilities of the packaged circuit board. Specifically, this application prints metal paste on a first packaged substrate, and after sintering, forms a metal phase connecting the first and second packaged substrates. The cross-sectional area of ​​this metal phase can be designed according to the specific requirements of the circuit. For example, when high current transmission or heat dissipation is required, the coverage area of ​​the metal paste is increased during the printing step, and a metal phase with a larger cross-sectional area is formed after sintering. This metal phase can carry higher current and effectively conduct heat, thereby increasing the electrical performance and heat dissipation efficiency of the packaged circuit board in high-power application environments.

[0013] Furthermore, printing metal paste specifically includes: printing metal paste using screen printing technology.

[0014] Furthermore, the metal paste includes copper paste, silver paste, or aluminum paste.

[0015] Furthermore, after step c, steps a, b, and c are executed multiple times to obtain a multilayer preprocessed component; steps d and e are then executed on the multilayer preprocessed component to form a multilayer packaged circuit board.

[0016] Secondly, this application also provides a packaged circuit board, comprising:

[0017] At least two encapsulation substrates are stacked together, and the at least two encapsulation substrates include a first encapsulation substrate and a second encapsulation substrate disposed adjacent to each other.

[0018] A metal phase is disposed between a first packaging substrate and a second packaging substrate. The metal phase is formed by sintering metal paste. The first packaging substrate and the second packaging substrate are electrically connected and / or dissipated through the metal phase.

[0019] An insulating plate is disposed between a first encapsulation substrate and a second encapsulation substrate. The insulating plate has holes in which a metallic phase is disposed.

[0020] Furthermore, the first packaging substrate and the second packaging substrate each include: an inner copper foil facing the insulating plate and an outer copper foil facing away from the insulating plate; a through hole for connecting the inner copper foil and the outer copper foil; wherein, the two ends of the metal phase are electrically connected to and / or heat-exchanged with the inner copper foil of the first packaging substrate and the second packaging substrate, respectively.

[0021] Furthermore, at least one electronic device is packaged within the first packaging substrate and / or the second packaging substrate; the electronic device is electrically connected to the inner copper foil or the outer copper foil through the through-hole of the packaging substrate.

[0022] Furthermore, a lead frame is provided in the first packaging substrate and / or the second packaging substrate on which the electronic device is disposed. One end of the lead frame abuts against the electronic device, and the other end is connected to the inner copper foil through a through hole to transfer the heat of the electronic device to the metal phase.

[0023] Furthermore, the packaging substrate is a multilayer board.

[0024] Compared with the prior art, the beneficial effects achieved by this application are as follows:

[0025] 1. By printing metal paste and sintering to form a metal phase, the size of the metal phase can be designed according to requirements, effectively improving the interlayer electrical connection and heat dissipation capability of the packaged circuit board. Specifically, this application prints metal paste on a first packaged substrate, and after sintering, forms a metal phase connecting the first and second packaged substrates. The cross-sectional area of ​​this metal phase can be designed according to the specific requirements of the circuit. For example, when high current transmission or heat dissipation is required, the coverage area of ​​the metal paste is increased during the printing step, and a metal phase with a larger cross-sectional area is formed after sintering. This metal phase can carry higher current and effectively conduct heat, thereby increasing the electrical performance and heat dissipation efficiency of the packaged circuit board in high-power application environments.

[0026] 2. By repeatedly performing the steps of printing metal paste, setting up insulating plates, and stacking packaging substrates, a multi-layer packaging circuit board was constructed, thereby improving the packaging density and three-dimensional integration capability of the packaging circuit board and meeting the requirements for miniaturization and high performance of the packaging circuit board. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a cross-sectional view of the first packaging substrate of a packaging circuit board provided in this application.

[0029] Figure 2 This is a cross-sectional view of the first packaging substrate and the metal phase of a packaged circuit board provided in this application.

[0030] Figure 3 This is a cross-sectional view of the first packaging substrate, metal phase, and insulating plate of a packaging circuit board provided in this application.

[0031] Figure 4 This is a cross-sectional view of a packaged circuit board provided in this application.

[0032] Explanation of reference numerals in the attached figures:

[0033] 1. First packaging substrate; 11. Core layer; 2. Second packaging substrate; 3. Metal phase; 4. Insulating plate; 51. Device 1; 52. Device 2; 53. Device 3; 54. Device 4; 6. Lead frame; 7. Through hole; 8. Conductive hole. Detailed Implementation

[0034] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit this application or its application or use.

[0035] Example 1:

[0036] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, Figure 1 This is a cross-sectional view of the first packaging substrate 1. Figure 2 This is a cross-sectional view of the metal paste printing step performed on the first packaging substrate 1. Figure 3 To set up a cross-sectional view of insulating board 4, Figure 4 This is a cross-sectional view of the stacked packaging substrates.

[0037] This embodiment provides a method for manufacturing a packaged circuit board, including the following steps:

[0038] Step a: Print metal paste at a predetermined position on the first packaging substrate.

[0039] like Figure 1 and Figure 2 As shown, Figure 1 This is a cross-sectional view of the first packaging substrate 1. Figure 2 A cross-sectional view of the first packaging substrate 1 after metal paste has been printed on it.

[0040] Specifically, copper foil is disposed on both the upper and lower sides of the first packaging substrate 1, and predetermined circuits are etched on the copper foil. Pads are disposed at predetermined positions on the first packaging substrate 1. The pads are electrically connected to the circuits on the copper foil and are connected to the metal phase 3 formed after the metal paste is sintered, thereby achieving electrical connection or heat transfer between the circuits and the metal phase 3. It should be noted that the predetermined positions are planned and determined in advance according to the overall design requirements of the packaging circuit board.

[0041] Specifically, the first packaging substrate 1 contains electronic devices. In this embodiment, the electronic devices are bare chips pre-embedded in the packaging substrate. The bare chips are electrically connected to the copper foil on the surface of the packaging substrate through the inner layer circuitry and vias 8 inside the packaging substrate.

[0042] Preferably, the first packaging substrate 1 can be a multilayer board structure. In this embodiment, the first packaging substrate 1 is a three-layer board, but those skilled in the art can make adjustments according to actual needs.

[0043] Specifically, metal paste is brushed onto predetermined positions on the first packaging substrate 1, forming a paste layer with a certain thickness and shape, such as... Figure 2 As shown, the shape of the paste layer can be elliptical cylinder, circular or square, and its cross-sectional area is designed according to the transmission requirements. For example, when it is necessary to transmit a large current or dissipate heat, the coverage area of ​​the metal paste is increased in the printing step, and a metal phase with a larger cross-sectional area is formed after sintering.

[0044] Step b: Place an insulating plate with holes on the first packaging substrate and align the holes with predetermined positions so that the metal paste is exposed at the holes.

[0045] Specifically, the insulating plate 4 is a semi-cured resin layer with holes, and its dimensions are the same as those of the encapsulation substrate. The insulating plate 4 has one or more holes, the shape, size, and position of which correspond to the positions of the metal paste.

[0046] Step c: Stack the second packaging substrate on the insulating board to form a pre-processed part.

[0047] Specifically, the second packaging substrate 2 has the same configuration as the first packaging substrate 1, with copper foil on both its upper and lower sides, and predetermined circuits etched on the copper foil. Furthermore, the side of the second packaging substrate 2 facing the insulating plate 4 has pads, the positions of which correspond to the holes on the insulating plate 4 and the positions of the metal paste on the first packaging substrate 1, ensuring that the metal paste exposed through the holes contacts the pads of the packaging substrate.

[0048] Specifically, after stacking, the first packaging substrate 1, the metal paste, the insulating plate 4, and the second packaging substrate 2 constitute a pre-processed component.

[0049] Preferably, the second packaging substrate 2 can be a multilayer board structure. In this embodiment, the second packaging substrate 2 is a three-layer board, but those skilled in the art can make adjustments according to actual needs.

[0050] Step d: Sinter the pretreated part to form a metallic phase from the metal slurry.

[0051] Step e: Press the sintered pre-treated parts together, and electrically connect and / or dissipate heat between the first and second packaging substrates through the metal phase to obtain the packaged circuit board.

[0052] Furthermore, the steps of printing the metal paste specifically include: printing the metal paste using a screen printing process.

[0053] Furthermore, the metal paste includes copper paste, silver paste, or aluminum paste.

[0054] Furthermore, after step c, steps a, b, and c are executed multiple times to obtain a multilayer preprocessed component; steps d and e are then executed on the multilayer preprocessed component to form a multilayer packaged circuit board.

[0055] Preferably, after completing the steps of printing metal paste, setting the insulating plate 4, and stacking the encapsulation substrate, a pre-processed part is obtained. The steps of printing metal paste, setting the insulating plate 4, and stacking the encapsulation substrate can be repeated on the pre-processed part. Each time the steps of printing metal paste, setting the insulating plate 4, and stacking the encapsulation substrate are repeated, a layer of metal paste, a layer of insulating plate 4, and a new encapsulation substrate will be stacked on the pre-processed part, ultimately resulting in a multi-layer pre-processed part. Then, the multi-layer pre-processed part is subjected to sintering and lamination steps in sequence to form a multi-layer encapsulation circuit board.

[0056] Example 2:

[0057] This embodiment provides a packaged circuit board, such as Figure 4 As shown, the packaged circuit board includes:

[0058] At least two encapsulation substrates are stacked together, and the at least two encapsulation substrates include a first encapsulation substrate 1 and a second encapsulation substrate 2 disposed adjacent to each other.

[0059] Metal phase 3 is disposed between the first packaging substrate 1 and the second packaging substrate 2. Metal phase 3 is formed by sintering metal paste. The first packaging substrate 1 and the second packaging substrate 2 are electrically connected and / or dissipated through the metal phase.

[0060] An insulating plate 4 is disposed between the first encapsulation substrate 1 and the second encapsulation substrate 2. The insulating plate 4 has holes, and the metal phase 3 is disposed in the holes.

[0061] Specifically, the packaged circuit board is composed of at least two packaged substrates stacked together. Of the at least two packaged substrates, each pair of adjacent packaged substrates is a first packaged substrate 1 and a second packaged substrate 2. In this embodiment, the number of packaged substrates is two; those skilled in the art can adjust the number of packaged substrates according to actual needs.

[0062] Furthermore, the first packaging substrate 1 and the second packaging substrate 2 each include:

[0063] The inner copper foil facing the insulating plate 4, and the outer copper foil facing away from the insulating plate 4;

[0064] Through hole 7 is used to connect the inner copper foil and the outer copper foil;

[0065] The two ends of the metal phase 3 are electrically connected to and / or heat-exchanged with the inner copper foil of the first packaging substrate 1 and the second packaging substrate 2, respectively.

[0066] Specifically, the packaging substrate consists of an inner copper foil, a core layer 11, and an outer copper foil. The two ends of the metal phase 3 along the vertical direction are electrically connected and / or heat-exchanged with the inner copper foil of the first packaging substrate 1 and the inner copper foil of the second packaging substrate 2, respectively.

[0067] Furthermore, at least one electronic device is packaged within the first packaging substrate 1 and / or the second packaging substrate 2; the electronic device is electrically connected to the inner copper foil or the outer copper foil through the through-hole 8 of the packaging substrate.

[0068] Specifically, such as Figure 1 As shown, the first packaging substrate 1 is provided with pre-embedded electronic devices, including device 1 51, device 2 52, device 3 53 and device 4 54. Device 1 51, device 2 52, device 3 53 and device 4 54 are all bare chips. The bare chips are electrically connected to the inner copper foil or the outer copper foil through the through holes 8 provided on the surface of the packaging substrate.

[0069] Furthermore, a lead frame 6 is provided in the first packaging substrate 1 and / or the second packaging substrate 2 where the electronic device is disposed. One end of the lead frame 6 abuts against the electronic device, and the other end is connected to the inner copper foil through the through hole 8 to transfer the heat of the electronic device to the metal phase 3.

[0070] Specifically, the lead frame 6 is made of copper, with one end abutting against the electronic device to absorb the heat generated by the device during operation, and the other end connected to the metal phase 3 through a via 8. The heat generated by the electronic device is transferred to the metal phase 3 via the lead frame 6, the via 8, and the inner copper foil, and is finally dissipated through the heat sink connected to the outside of the packaged circuit board, thus completing the heat dissipation of the inside of the packaged circuit board.

[0071] Furthermore, the packaging substrate is a multilayer board.

[0072] Preferably, the packaging substrate has a multilayer board structure. In this embodiment, the packaging substrate is a three-layer board. Those skilled in the art can select the number of layers of the packaging substrate according to actual needs.

[0073] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0074] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0075] The above description is only a preferred embodiment of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A method for manufacturing a packaged circuit board, characterized in that, include: Step a: Print metal paste at predetermined positions on the first packaging substrate; Step b: Place an insulating plate with holes on the first encapsulation substrate, and align the holes with the predetermined positions so that the metal paste is exposed at the holes; Step c: Stack the second encapsulation substrate on the insulating plate to form a pre-processed part; Step d: Sinter the pretreated part to form a metallic phase in the metal slurry; Step e: Press the sintered pre-treated part together, and the first packaging substrate and the second packaging substrate are electrically connected and / or heat dissipated through the metal phase to obtain the packaged circuit board.

2. The method for manufacturing a packaged circuit board according to claim 1, characterized in that, The printed metal paste specifically includes: The metal paste is printed using a screen printing process.

3. The method for manufacturing a packaged circuit board according to claim 1, characterized in that, The metal paste includes copper paste, silver paste, or aluminum paste.

4. The method for manufacturing a packaged circuit board according to claim 1, characterized in that, After step c, steps a, b, and c are executed multiple times to obtain a multi-layer pre-processed component; Steps d and e are performed on the multilayer pre-processed component in sequence to form a multilayer packaged circuit board.

5. A packaged circuit board, characterized in that, include: At least two encapsulation substrates are stacked together, and the at least two encapsulation substrates include a first encapsulation substrate and a second encapsulation substrate disposed adjacent to each other. A metal phase is disposed between the first packaging substrate and the second packaging substrate. The metal phase is formed by sintering metal paste. The first packaging substrate and the second packaging substrate are electrically connected and / or dissipated through the metal phase. An insulating plate is disposed between a first encapsulation substrate and a second encapsulation substrate, the insulating plate having holes in which the metal phase is disposed.

6. The packaged circuit board according to claim 5, characterized in that, The first packaging substrate and the second packaging substrate each include: The inner copper foil facing the insulating plate, and the outer copper foil facing away from the insulating plate; Through holes for connecting the inner copper foil and the outer copper foil; The two ends of the metal phase are electrically connected to and / or heat-exchanged with the inner copper foil of the first packaging substrate and the second packaging substrate, respectively.

7. The packaged circuit board according to claim 6, characterized in that, At least one electronic device is packaged within the first packaging substrate and / or the second packaging substrate; The electronic device is electrically connected to the inner copper foil or the outer copper foil through the through-hole of the packaging substrate.

8. The packaged circuit board according to claim 7, characterized in that, A lead frame is provided in the first packaging substrate and / or the second packaging substrate on which the electronic device is disposed. One end of the lead frame abuts against the electronic device, and the other end is connected to the inner copper foil through the through hole to transfer the heat of the electronic device to the metal phase.

9. The packaged circuit board according to claim 5, characterized in that, The packaging substrate is a multilayer board.

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