Circuit module, electric control heat dissipation assembly and heating and ventilation equipment

Abstract

The invention discloses a circuit module, an electric control heat dissipation assembly and heating and ventilation equipment, and the circuit module comprises a circuit board and a heat conduction assembly. The circuit board comprises a substrate and at least one first electronic element mounted on the substrate, the substrate comprises a first board and a second board which are oppositely arranged, and the at least one first electronic element is mounted on the first board; the heat conduction assembly is arranged on the second plate surface, the heat conduction assembly is in heat conduction contact with the second plate surface and the at least one first electronic element, and the projection of the at least one first electronic element is within the projection range of the heat conduction assembly when observed in the direction perpendicular to the plate surface. According to the technical scheme, the heat dissipation problem of the circuit module can be effectively solved, and meanwhile cost is reduced.

Description

Technical Field

[0001] This application relates to the field of heating, ventilation and air conditioning (HVAC) system technology, and in particular to a circuit module, an electronically controlled heat dissipation component, and HVAC equipment. Background Technology

[0002] With the development of HVAC equipment, its application areas are becoming wider and wider, and the operating environment is becoming more and more severe. The electrical control box is used to supply power and control the operation of various electrical components in HVAC equipment, and its importance is self-evident. In order to meet a series of requirements such as insect prevention and corrosion prevention, the electrical control box usually needs to be sealed.

[0003] However, the main electronic components in the control box, such as inductors, capacitors and power modules, generate heat during operation. If the heat generated by the electronic components is not dissipated in time, it can easily lead to overheating of the electronic components, aging of the electronic components, shortening their service life and reducing their working stability, thereby affecting the operation of the whole machine.

[0004] In related technologies, most methods use a heat dissipation plate to directly contact the circuit board inside the control box for heat dissipation. This method not only increases the difficulty of heat dissipation due to the different sizes and heights of the main electronic components inside the control box, but also makes the heat dissipation design of each component more complex, greatly increasing the cost. Summary of the Invention

[0005] This application provides a circuit module, an electronically controlled heat dissipation component, and a heating and ventilation device, which can effectively solve the heat dissipation problem of the circuit module while reducing costs.

[0006] In a first aspect, embodiments of this application provide a circuit module, which includes a circuit board and a heat-conducting component; the circuit board includes a substrate and at least one first electronic component mounted on the substrate, the substrate includes a first plate surface and a second plate surface disposed opposite to each other, the at least one first electronic component is mounted on the first plate surface; the heat-conducting component is disposed on the second plate surface, the heat-conducting component makes thermal contact with the second plate surface and the at least one first electronic component, and when viewed perpendicular to the plate surface, the projection of the at least one first electronic component is within the projection range of the heat-conducting component.

[0007] In some embodiments, the thermally conductive assembly includes a first thermally conductive portion formed of a first thermally conductive material and a second thermally conductive portion formed of a second thermally conductive material. One side of the second thermally conductive portion makes thermal contact with the second plate surface and the at least one first electronic component, one side of the first thermally conductive portion makes thermal contact with the second thermally conductive portion, and the other side of the first thermally conductive portion makes thermal contact with an external cold source.

[0008] In some embodiments, the first thermally conductive material is a thermally conductive metal material, the second thermally conductive material is a thermally conductive adhesive, the first thermally conductive portion is configured as a plate, a filling space is formed between the proximal plate surface of the first thermally conductive portion and the second plate surface, at least a portion of the second thermally conductive material fills the filling space to form at least a portion of the second thermally conductive portion, and the distal plate surface of the first thermally conductive portion makes thermal contact with the external cold source.

[0009] In some embodiments, the substrate is provided with at least one through hole penetrating the first plate surface and the second plate surface, the at least one through hole communicating with the filling space, and at least a portion of the second thermally conductive material is injected into the filling space from the at least one through hole to form at least a portion of the second thermally conductive portion.

[0010] In some embodiments, the first thermally conductive material is a thermally conductive metal material, the second thermally conductive material is a thermally conductive adhesive, the first thermally conductive portion is configured as a plate, a filling space is formed between the proximal plate surface of the first thermally conductive portion and the second plate surface, at least a portion of the second thermally conductive material fills the filling space to form at least a portion of the second thermally conductive portion, and the distal plate surface of the first thermally conductive portion makes thermal contact with the external cold source.

[0011] In some embodiments, the substrate is provided with at least one through hole penetrating the first plate surface and the second plate surface, the at least one through hole communicating with the filling space, and at least a portion of the second thermally conductive material is injected into the filling space from the at least one through hole to form at least a portion of the second thermally conductive portion.

[0012] In some embodiments, a filling space is provided on the first plate surface, and the substrate is provided with at least one through hole penetrating the first plate surface and the second plate surface. The at least one through hole connects the filling space and the filling space. The at least one first electronic component is mounted in the filling space. The second thermally conductive portion has a first portion, a second portion, and an intermediate portion connecting the two. A portion of the second thermally conductive material fills the filling space and submerges the first pin of the at least one first electronic component to form the first portion. A portion of the second thermally conductive material fills the filling space to form the second portion. A portion of the second thermally conductive material fills the at least one through hole to form the intermediate portion. The proximal plate surface of the first thermally conductive portion is in thermal contact with the second portion, and the distal plate surface of the first thermally conductive portion is in thermal contact with the external cold source.

[0013] In some embodiments, a first pin of the at least one first electronic element extends from the first plate surface through the substrate and is exposed on the second plate surface, and the first pin of the at least one first electronic element makes thermal contact with the thermally conductive assembly.

[0014] In some embodiments, the heat-conducting assembly includes a cover comprising a first frame and a cover plate with a connected hollow opening, the first frame being mounted on the second plate surface, and when viewed along a direction perpendicular to the second plate surface, the projection of the at least one first electronic component is located within the projection range of the first frame. The cover plate is disposed on the opening on the side of the first frame opposite to the substrate, and cooperates with the first frame and the second plate surface to form a filling space. The cover plate is configured as a first thermally conductive part formed of a first thermally conductive material. The filling space is filled with a second thermally conductive material. The second thermally conductive material is in thermal contact with the substrate and the terminal of at least one of the first electronic components. The proximal plate surface of the cover plate is in thermal contact with the second thermally conductive material, and the distal plate surface of the cover plate is in thermal contact with an external cold source.

[0015] In some embodiments, the first frame is made of a non-conductive material, the first thermally conductive material is a thermally conductive metal material, and the second thermally conductive material is a thermally conductive adhesive.

[0016] In some embodiments, the cover plate includes a plate body and a skirt surrounding the plate body, and the inner sidewall of the first frame is provided with a mounting groove, the skirt being embedded in the mounting groove.

[0017] In some embodiments, in the thickness direction of the substrate, the side of the plate body away from the second plate surface protrudes from or is flush with the first frame.

[0018] In some embodiments, a second frame is further included, which is disposed on the first plate surface. The second frame and the first plate surface together form a filling space. The at least one first electronic component is mounted in the filling space. The substrate is provided with at least one through hole penetrating the first plate surface and the second plate surface. The at least one through hole connects the filling space and the filling space. The second thermally conductive material fills the filling space to form a first part, the second thermally conductive material fills the filling space to form a second part, and the second thermally conductive material fills the at least one through hole to form an intermediate part. The first part has a first pin of the at least one first electronic component exposed on the first plate surface embedded therein, the second part has a first pin of the at least one first electronic component exposed on the second plate surface embedded therein, and the intermediate part is the thermal conduction path of the first part and the second part.

[0019] In some embodiments, the first enclosure, the second enclosure, and the substrate are fixedly connected by a plurality of first fasteners.

[0020] In some embodiments, the substrate is characterized by having a plurality of inspection holes, the plurality of inspection holes communicating with the filling space and being located near the edge of the substrate and / or the center of the cavity bottom wall of the filling space.

[0021] In some embodiments, a plurality of the first electronic components are soldered to a circuit board, and the first pins of the plurality of the first electronic components include solder pad first pins and needle-shaped first pins.

[0022] In some embodiments, the circuit board further includes at least one second electronic component disposed on the second board surface, the at least one second electronic component being at least one of a pad, a surface mount element, and a copper foil trace, the at least one second electronic component being embedded within the thermally conductive assembly.

[0023] Secondly, embodiments of this application provide an electronically controlled heat dissipation assembly, which includes a cold source and a circuit module as described in any of the above claims. The cold source has a cooling channel through which cooling fluid flows. The thermally conductive component is in thermal contact with the cold source to transfer heat from the substrate and the at least one first electronic component to the cold source.

[0024] In some embodiments, a thermal conductive element, which is thermal grease or a thermal pad, is also included, and the thermal conductive element makes thermal contact with the thermally conductive assembly and the cold source.

[0025] In some embodiments, the cold source includes a heat dissipation metal plate and refrigerant piping fixed to the heat dissipation metal plate, the cooling channel is the refrigerant piping, and the cooling fluid is the refrigerant in the refrigerant circulation loop; or, the cold source includes a finned radiator, the cooling channel is the space between two adjacent fins of the finned radiator, and the cooling fluid is airflow.

[0026] In some embodiments, the heat dissipation metal plate is formed of a thermally conductive metal material and is configured as the casing wall of the electronically controlled heat dissipation assembly.

[0027] Thirdly, embodiments of this application provide a heating, ventilation, and air conditioning (HVAC) device, which includes a device body and an electrically controlled heat dissipation component as described above, wherein the electrically controlled heat dissipation component is installed on the device body.

[0028] Based on the circuit module of this application embodiment, a heat-conducting component is disposed on the second board surface. The heat-conducting component makes heat-conducting contact with the second board surface and at least one first electronic component. When viewed perpendicularly to the board surface, the projection of at least one first electronic component is within the projection range of the heat-conducting component. This means that the coverage area of ​​the heat-conducting component at least matches the distribution area of ​​the first electronic components, and may even be larger. This design avoids the problem that some first electronic components cannot make good contact with the heat-conducting component due to the dispersed distribution and varying heights of the components. The heat-conducting component can achieve full coverage or contact with the terminals of the first electronic components, ensuring that the heat generated by each first electronic component during operation can be effectively captured, effectively eliminating heat dissipation blind spots, improving the heat dissipation efficiency of the entire circuit module, and the heat-conducting component does not need to completely cover the entire circuit board, which can save costs while ensuring the heat conduction effect. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0030] Figure 1 This is a cross-sectional view of an embodiment of the electronically controlled heat dissipation assembly of this application; Figure 2 A cross-sectional view of another embodiment of the electronically controlled heat dissipation assembly of this application; Figure 3 This is a schematic diagram of the structure of one embodiment of the circuit module of this application; Figure 4 for Figure 1 The enlarged view of point A shown in the image; Figure 5 for Figure 3 The diagram shows a cross-sectional view of the circuit module structure along point BB. Figure 6 for Figure 3 The diagram shows an exploded view of the circuit module. Figure 7 for Figure 5 The diagram shows the structure of the cover; Figure 8 for Figure 7 The diagram shows an exploded view of the cover.

[0031] Explanation of icon numbers: 1000, Electrically controlled heat dissipation assembly; 100, Circuit module; 10, Circuit board; 11, Substrate; 111, First board surface; 112, Second board surface; 12, First electronic component; 121, First component body; 122, First pin; 13, Second electronic component; 131, Second component body; 132, Second pin; 20, Thermal conductive assembly; 20a, Second thermal conductive part; 20b, Cover; 201, Filling space; 202, Through hole; 203 21. Inspection hole; 21. First enclosure; 211. Mounting slot; 2111. Connecting post; 22. Cover plate; 221. Plate body; 222. Skirt; 2222. Mounting hole; 30. Second enclosure; 31. Filling space; 40. First fastener; 50. Second fastener; 60. Heat-conducting component; 200. Cold source; 200a. Cooling channel; 210. Heat dissipation metal plate; 210a. Refrigerant piping; 220. Finned radiator; 220a. Fin.

[0032] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0034] Where the following description relates to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0035] In the description of this application, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances. Furthermore, in the description of this application, unless otherwise stated, "multiple" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0037] With the development of HVAC equipment, its application areas are becoming increasingly wider, and the operating environments are becoming increasingly harsh. Electrically controlled heat dissipation components are used to supply power and control the operation of various electrical components in HVAC equipment; their importance is self-evident. For example, when an air conditioner outdoor unit is installed outdoors, it is subject to heavy rain, sandstorms, metal dust, insect infestations, and various chemical substances, all of which pose a severe test to the stability of the electrically controlled heat dissipation components. To meet the requirements for insect and corrosion prevention, the electrically controlled heat dissipation components typically require sealing treatment.

[0038] However, the sealing treatment of the electronic heat dissipation component deprives it of the natural convection heat dissipation path. The main electronic components inside the electronic heat dissipation component, such as inductors, capacitors and power modules, generate heat when working. If the heat generated by the electronic components is not dissipated in time, it is easy to cause the electronic components to overheat. When the electronic components are in a high-temperature operating environment for a long time, they are prone to aging, shortening their service life and reducing their working stability, which in turn affects the operation of the whole machine.

[0039] In related technologies, most methods involve direct contact between the heat dissipation plate and the circuit board inside the electronic control heat dissipation assembly for heat dissipation. However, due to the varying sizes and heights of the main electronic components within the electronic control heat dissipation assembly, the distance between each electronic component and the heat dissipation plate varies. This not only increases the difficulty of heat dissipation but also makes the heat dissipation design for each electronic component more complex, significantly increasing costs.

[0040] Please refer to Figures 1 to 3 This application proposes an electronically controlled heat dissipation assembly 1000, which is applied to HVAC equipment and includes a housing, a circuit module 100 and a cold source 200, the cold source 200 having a cooling channel 200a through which cooling fluid flows.

[0041] The cold source 200 includes a heat dissipation metal plate 210 and refrigerant piping 210a fixed on the heat dissipation metal plate 210. The cooling channel 200a is the refrigerant piping 210a, and the cooling fluid is the refrigerant in the refrigerant circulation loop. No additional independent heat dissipation power unit, such as a cooling fan, is required, reducing additional energy consumption and saving installation space for such units. When the refrigerant circulates in the HVAC equipment, the heat can be ultimately dissipated using the equipment's own heat dissipation end, eliminating the need for a separate heat dissipation terminal design. This simplifies the system architecture and reduces the overall equipment manufacturing cost and operating energy consumption.

[0042] Furthermore, the heat dissipation metal plate 210 is formed of a thermally conductive metal material and is constructed as the box wall of the electronically controlled heat dissipation assembly 1000. That is, the heat dissipation metal plate 210 can serve as part of the side wall of the box, eliminating redundant parts such as connecting brackets and sealing gaskets required to ensure tight connections, thus making the overall structure of the electronically controlled heat dissipation assembly 1000 more compact. For example, for a rectangular box, one or more side walls can be directly integrally formed with the heat dissipation metal plate 210, eliminating the need for subsequent additional heat dissipation structures, greatly simplifying the production and assembly process, and improving production efficiency.

[0043] The heat dissipation metal plate 210 serves as the box wall, eliminating the need for additional space inside or outside the box. This effectively frees up installation space inside the box, allowing the electrically controlled heat dissipation component 1000 to better fit into the limited installation space inside the HVAC equipment, while also reducing the overall size and weight of the HVAC equipment.

[0044] Alternatively, the cold source 200 includes a finned heat sink 220, and the cooling channel 200a is the space between two adjacent fins 220a of the finned heat sink 220. The finned heat sink 220 has a compact structure and can be flexibly designed in shape according to the internal space of the electronically controlled heat dissipation component 1000, such as flat or columnar, to adapt to irregular installation layouts. The finned heat sink 220 can be integrally formed from thermally conductive metal materials such as aluminum or copper, resulting in low manufacturing costs and simple processing technology. The cooling fluid is airflow, eliminating the need for additional piping, seals, and other components, significantly reducing the overall cost of the electronically controlled heat dissipation component 1000. While meeting heat dissipation requirements, it also balances cost and performance.

[0045] The housing can be made of materials such as aluminum alloy, stainless steel, or engineering plastics, which offer high strength, low density, good hardness, good plasticity, superior explosion-proof performance, and low cost. The housing can be rectangular or other shapes, such as cylindrical or irregularly shaped. When the external structure of the electronically controlled heat dissipation component 1000 is regular, it facilitates close assembly with a flat surface, resulting in quick and stable installation. When the external structure is irregular, it enhances compatibility when installed in equipment with complex internal structures. Furthermore, when assembling the electronically controlled heat dissipation component 1000, any suitable surface can be used to fix it, including but not limited to screw connections and snap-fit ​​connections.

[0046] To resolve the above issues, please refer to [link / reference]. Figures 1 to 5 This application proposes a circuit module 100, which is disposed in a housing. In the embodiments of this application, the circuit module 100 includes a circuit board 10 and a heat-conducting component.

[0047] The circuit board 10 includes a substrate 11 and at least one first electronic component 12 mounted on the substrate 11. The first electronic component 12 may be a capacitor, a resistor, a relay, etc. The substrate 11 includes a first plate surface 111 and a second plate surface 112 disposed opposite to each other. The first electronic component 12 includes a first component body 121 and a first pin 122 connected to the first component body 121. The first component body 121 is disposed on the first plate surface 111, and the first pin 122 is exposed on the second plate surface 112.

[0048] In a configuration where multiple first electronic components 12 are included, multiple first electronic components 12 are soldered to a circuit board 10. Soldering (such as reflow soldering or wave soldering) uses molten solder to form a metallurgical bond between the first pin 122 of the first electronic component 12 and the pad of the circuit board 10, resulting in a high connection strength.

[0049] The first pins 122 of the multiple first electronic components 12 include solder pad first pins and needle-shaped first pins. The contact area between the solder pad first pin and the pad of the circuit board 10 is larger than that of ordinary pins, which can carry a larger current and avoid local heat generation caused by current concentration. At the same time, it disperses the weight of the first component body 121 and reduces the stress impact of high-power components on the circuit board 10. The large contact area of ​​the solder pad first pin allows the heat generated by the first electronic component 12 to be quickly conducted to the substrate 11 through the solder pad first pin, and then transferred to the heat conduction component 20 through the substrate 11, forming an efficient heat dissipation path. The needle-shaped first pin is relatively small and occupies less space on the circuit board 10, which can realize the dense arrangement of multiple components, meet the miniaturization design requirements of the circuit module 100, and reserve more space for the layout of the heat conduction component 20.

[0050] When the circuit module 100 is in operation, the heat generated by the first component body 121 will be conducted to the first pin 122. Compared with the solution of directly attaching a flexible heat-conducting structure to the second board surface 112 to conduct heat to the first pin 122, the first pin 122 may puncture the flexible heat-conducting structure and cause insulation failure. In addition, the thickness of the flexible heat-conducting structure cannot be designed too thin because the first pin 122 may puncture the flexible heat-conducting structure and cause insulation failure. Also, the creepage distance and other safety regulations need to be considered. This will undoubtedly increase the cost and increase the size of the circuit module 100.

[0051] The heat-conducting component 20 of this application is disposed on the second plate surface 112. The heat-conducting component 20 makes heat-conducting contact with the second plate surface 112 and at least one first electronic component 12. When viewed perpendicular to the plate surface, the projection of at least one first electronic component 12 is within the projection range of the heat-conducting component 20. This means that the coverage area of ​​the heat-conducting component 20 is at least matched with the distribution area of ​​the first electronic component 12, or even larger. This design avoids the problem that some first electronic components 12 cannot make good contact with the heat-conducting component 20 due to the dispersed distribution and varying heights of the components. Regardless of whether there is one or more first electronic components 12, whether they are in a single row, double row, or irregular distribution, and regardless of whether there are differences in the length of their first pins 122 or the size of their distribution area, the heat-conducting component 20 can achieve full coverage or contact, ensuring that the heat of each first electronic component 12 can be effectively captured, effectively eliminating heat dissipation blind spots, improving the heat dissipation efficiency of the entire circuit module 100, and the heat-conducting component 20 does not need to completely cover the entire circuit board 10, which can save costs while ensuring the heat conduction effect.

[0052] The heat generated by the first component body 121 during operation is partly transferred directly to the heat-conducting component 20 through the first pin 122, and partly diffused through the second plate surface 112 of the substrate 11 and absorbed by the heat-conducting component 20, thus preventing the heat from concentrating locally on the first electronic component 12 and being unable to be dissipated.

[0053] The heat-conducting component 20 is in thermal contact with the cold source 200 to transfer the heat of the substrate 11 and at least one first electronic component 12 to the cold source 200, shortening the heat transfer path. By utilizing the high thermal conductivity of the heat-conducting component 20 itself, the probability of heat dissipation during the transfer process is reduced, ensuring that the heat generated by the first electronic component 12 and the substrate 11 can be quickly transferred to the cold source 200 and dissipated by the cold source 200, thereby greatly improving the heat dissipation efficiency.

[0054] In some embodiments, the thermally conductive assembly 20 includes a first thermally conductive portion formed of a first thermally conductive material and a second thermally conductive portion 20a formed of a second thermally conductive material. One side of the second thermally conductive portion 20a makes thermal contact with the second plate surface 112 and at least one first electronic component 12, one side of the first thermally conductive portion makes thermal contact with the second thermally conductive portion 20a, and the other side of the first thermally conductive portion makes thermal contact with an external cold source 200.

[0055] The first thermally conductive material is a thermally conductive metal material, the second thermally conductive material is a thermally conductive adhesive, the first thermally conductive part is constructed as a plate, a filling space 201 is formed between the proximal plate surface of the first thermally conductive part and the second plate surface 112, at least a portion of the second thermally conductive material is filled in the filling space 201 to form at least a portion of the second thermally conductive part 20a, and the distal plate surface of the first thermally conductive part makes thermal contact with the external cold source 200.

[0056] The substrate 11 is provided with at least one through hole 202 penetrating the first plate surface 111 and the second plate surface 112. The at least one through hole 202 communicates with the filling space 201. At least a portion of the second thermally conductive material is injected into the filling space 201 through the at least one through hole 202 to form at least a portion of the second thermally conductive part 20a.

[0057] Specifically, a filling space 31 is provided on the first plate 111, and at least one through hole 202 connects the filling space 31 and the filling space 201. At least one first electronic component 12 is installed in the filling space 31. The second heat-conducting part 20a has a first part, a second part, and an intermediate part connecting the two. A portion of the second heat-conducting material fills the filling space 31 and submerges the first pin 122 of the at least one first electronic component 12 to form the first part. A portion of the second heat-conducting material fills the filling space 201 to form the second part. A portion of the second heat-conducting material fills at least one through hole 202 to form the intermediate part. The proximal plate surface of the first heat-conducting part is in heat-conducting contact with the second part, and the distal plate surface of the first heat-conducting part is in heat-conducting contact with the external cold source 200, thereby further conducting heat to the outside of the electronically controlled heat dissipation assembly 1000 through contact heat conduction, avoiding continuous heat accumulation at the first electronic component 12, effectively reducing thermal resistance, and thus improving heat dissipation efficiency.

[0058] With this configuration, when the second thermally conductive material is thermally conductive adhesive, the adhesive, serving as both a heat transfer and structural filler, can be an AB potting compound. It possesses a high thermal conductivity and can utilize its flowability during potting. The adhesive does not require increased overall thickness to accommodate the first pin 122, reducing material costs and structural complexity. The adhesive can be freely filled according to the shape and spacing of the first pin 122, ensuring a tight fit regardless of whether the first pins 122 are in a single row, double row, or irregular distribution. This ensures that the heat from each first pin 122 is effectively dissipated, preventing uneven heat dissipation. Even if some first pins 122 protrude significantly, the thermally conductive adhesive will not cause excessive compression deformation, preventing the edges or other areas of the substrate 11 from failing to adhere properly, thus avoiding uneven heat conduction and improving the heat dissipation consistency and reliability of the entire circuit module 100.

[0059] Thermally conductive adhesive is filled between the first electronic component 12 and the housing. Because the thermally conductive adhesive itself has insulating properties, after potting, it fills the gaps between the first pins 122, using its insulating properties to isolate the first pins 122 at different potentials, thus avoiding the risk of short circuits caused by direct exposure of the first pins 122. This reduces air gaps, allowing for reasonable control of electrical clearances and creepage distances between multiple first pins 122, meeting safety distance requirements and improving the reliability of the circuit module 100.

[0060] After potting with thermally conductive adhesive, a sealing effect is achieved, completely covering the first pin 122 to prevent external contaminants from entering and protecting the first pin 122 from corrosion. This is particularly suitable for scenarios where the electronically controlled heat dissipation component 1000 requires IP67-level airtightness, forming a double protection with the airtight design of the housing. Furthermore, after the above-mentioned thermal conductive treatment at the first pin 122, the heat dissipation problem of the circuit module 100 is effectively solved, thus eliminating the need for complete potting of the first component body 121. This ensures heat dissipation efficiency, further saves costs, and is more conducive to achieving the miniaturization requirements of the electronically controlled heat dissipation component 1000.

[0061] In some embodiments, please refer to Figures 1 to 4 ,as well as Figures 6 to 8 The heat-conducting component 20 includes a cover 20b, which includes a first frame 21 with a hollow opening connected to a cover plate 22. The first frame 21 is mounted on the second plate surface 112. When viewed along a direction perpendicular to the second plate surface 112, the projection of at least one first electronic component 12 is located within the projection range of the first frame 21, thereby effectively submerging the first pins 122 of the first electronic component 12 located at different positions and of different shapes within the filling space 201, ensuring heat conduction efficiency.

[0062] The first frame 21 is connected to the substrate 11. The cover plate 22 covers the opening on the side of the first frame 21 away from the substrate 11 and cooperates with the first frame 21 and the second plate surface 112 to form a filling space 201. The cover plate 22 is constructed as a first thermally conductive part formed by a first thermally conductive material. The filling space 201 is filled with a second thermally conductive material. The second thermally conductive material is in thermal contact with the substrate 11 and the terminal of at least one first electronic component 12 (that is, the first pin 122 of the first electronic component 12 located in the filling space 201). The near plate surface of the cover plate 22 is in thermal contact with the second thermally conductive material, and the far plate surface of the cover plate 22 is in thermal contact with the external cold source 200, which further dissipates heat and can effectively remove heat from the cover plate 22, prevent heat accumulation, and effectively solve the heat dissipation problem of the circuit module 100.

[0063] This makes the filling space 201 a relatively independent space, while providing a safe environment for the first pin 122 within the filling space 201, reducing the corrosion of the first pin 122 by external dust, moisture, etc. When filling with thermally conductive adhesive, the enclosed space of the filling space 201 can guide the thermally conductive adhesive to fill evenly, ensuring that the thermally conductive adhesive can fully cover each first pin 122, and preventing the thermally conductive adhesive from being lost or unevenly distributed due to open spaces.

[0064] The filling space 201 is connected to the through hole 202 on the substrate 11. When the second thermal conductive material is thermally conductive adhesive, the thermally conductive adhesive can smoothly enter the filling space 201 through the through hole 202. The closed space formed by the first frame 21 and the cover plate 22 allows the thermally conductive adhesive to be subjected to a certain pressure during the filling process, thereby better penetrating into the gap between the first pins 122, achieving full coverage of the first pins 122, ensuring that heat can be efficiently transferred from the first pins 122 to the thermally conductive adhesive, and then transferred out through the cover plate 22.

[0065] It should be noted that the first frame 21 is made of a non-conductive material, such as plastic or ceramic, which avoids electrical connection between the cover plate 22 and the substrate 11, ensuring circuit safety and not affecting the insulation performance of the thermally conductive adhesive. The cover plate 22 is made of a thermally conductive metal material, such as aluminum or iron, which has a high thermal conductivity. After the thermally conductive adhesive is filled, the cover plate 22 can make close contact with the thermally conductive adhesive and quickly absorb the heat transferred by the thermally conductive adhesive. The non-conductive material of the first frame 21 and the metal material of the cover plate 22 complement each other. The combination of the insulation of the non-conductive material and the high strength and high thermal conductivity of the thermally conductive metal material allows the cover 20b to better resist external impacts and vibrations, protecting the internal first pin 122 and thermally conductive adhesive from deformation and damage, and ensuring the stable operation of the circuit module 100 in harsh environments.

[0066] Understandably, increasing the thickness of the edge of the first frame 21 can increase the creepage distance. As the first frame 21 is made of a non-conductive material (such as plastic), its edge is a critical path for current to discharge along the surface. Increasing the edge thickness of the first frame 21 effectively lengthens the path of current flow along its surface, naturally increasing the creepage distance. Simultaneously, increasing the edge thickness of the first frame 21 does not affect its fit with the substrate 11 or the cover plate 22. While maintaining assembly accuracy, the thickened edge enhances its structural strength, reducing deformation caused by long-term use or vibration, thereby maintaining the stability of the creepage distance. Compared to improving safety performance by changing the insulation level of materials, this structural adjustment is more direct, lower in cost, and synergistic with the sealing design of the filling space 201, strengthening electrical safety protection from both physical isolation and path extension perspectives.

[0067] Furthermore, by increasing the thickness of the edge of the first frame 21, the creepage distance is increased, which meets the creepage safety distance requirements. At the same time, since the thickness of the edge of the first frame 21 is increased while the area of ​​the second plate 112 remains unchanged, the thickening of the edge of the first frame 21 is inward, thereby reducing the volume of the filling space 201. This reduces the amount of thermal conductive adhesive used, thus meeting safety requirements and ensuring thermal conductivity. The reduction in the amount of thermal conductive adhesive used can further save costs.

[0068] The first frame 21 and the cover plate 22 can be integrally molded by injection molding, which greatly improves the structural strength and simplifies the manufacturing process, thereby increasing production efficiency. In the circuit module 100, the creepage distance refers to the shortest path length between two conductive parts or between a conductive part and the protective interface of the equipment on the surface of the insulating material. Its main function is to prevent current leakage or discharge through the insulating surface, and to avoid electrical breakdown or short circuit caused by the accumulation of contaminants, humid environment, or electric field distortion. It is an important indicator for ensuring electrical safety. If there is a gap between the first frame 21 and the cover plate 22, current may discharge along the surface of the gap, causing safety hazards. However, after the first frame 21 and the cover plate 22 are integrally molded, they form a continuous and smooth transition structure, making it difficult for current to leak through the gap, effectively meeting the creepage distance requirements at the edge, thereby improving the electrical safety of the circuit module 100. Of course, the connection between the first frame 21 and the cover plate 22 can also be a screw connection, adhesive connection, etc., and this application does not limit this.

[0069] Please refer to Figures 4 to 8 The cover plate 22 includes a plate body 221 and a skirt 222 surrounding the plate body 221. The inner sidewall of the first frame 21 is provided with a mounting groove 211, and the skirt 222 is snapped into the mounting groove 211. The skirt 222 may also have a plurality of spaced mounting holes 2222. When the first frame 21 and the cover plate 22 are integrally formed, plastic material can be filled into the plurality of mounting holes 2222 through the injection molding process. After the plastic material is cured, it forms the first frame 21. A plurality of connecting posts 2111 are formed on the groove wall of the mounting groove 211. The plurality of connecting posts 2111 pass through the plurality of mounting holes 2222, and the skirt 222 is embedded in the mounting groove 211, thereby firmly combining the cover plate 22 and the first frame 21 together.

[0070] This integrated design of the first frame 21 and the cover plate 22 not only enhances the connection strength between them but also effectively prevents relative sliding or separation between the cover plate 22 and the first frame 21. The spaced mounting holes 2222 ensure uniform distribution of the connection force, further improving the overall structural stability. The filling space 201 formed by the cover plate 22, the first frame 21, and the second plate surface 112 has a more regular shape and higher dimensional accuracy. This allows the thermally conductive adhesive to cover the first pin 122 with a thinner, more even thickness during filling, eliminating the need to increase the amount of adhesive to compensate for insufficient filling due to assembly gaps. The thinner adhesive thickness not only reduces the amount of thermally conductive adhesive used and lowers material costs but, more importantly, shortens the path of heat transfer from the first pin 122 to the cover plate 22. According to the laws of heat conduction, under the same thermal conductivity, a shorter heat conduction path results in higher heat transfer efficiency, thus dissipating heat from the first pin 122 more quickly and effectively reducing temperature rise.

[0071] It is understandable that the first frame 21 and the cover plate 22 can also be connected by a detachable connection method such as snap-fit, allowing the cover plate 22 to be separated from the first frame 21. If the second heat-conducting part has problems such as aging, cracking or heat conduction performance degradation, the cover plate 22 can be removed separately and glue can be applied directly from that side without removing the cover 20b as a whole, which greatly shortens the maintenance time.

[0072] Furthermore, in the thickness direction of the substrate 11, the side of the plate body 221 away from the second plate surface 112 protrudes out or is flush with the first frame 21. The plate body 221 can directly and fully contact the near-side plate surface (i.e. the first heat-conducting part) of the cover plate 22, avoiding the structure of the first frame 21 from hindering the heat conduction contact between the two. This allows the cover plate 22 to have a tighter heat conduction contact with the near-side plate surface of the cover plate 22, greatly improving the contact tightness between the two, reducing the heat conduction gap, ensuring the heat conduction contact area, and thus achieving higher heat conduction efficiency.

[0073] In some embodiments, please refer again Figures 1 to 6 The circuit module 100 also includes a second frame 30, which is disposed on the first plate surface 111. The second frame 30 and the first plate surface 111 together form a filling space 31. At least one first electronic component 12 is installed in the filling space 31. The substrate 11 is provided with at least one through hole 202 penetrating the first plate surface 111 and the second plate surface 112. The at least one through hole 202 connects the filling space 31 and the filling space 201.

[0074] The second thermally conductive material fills the filling space 31 to form a first part, the second thermally conductive material fills the filling space 201 to form a second part, and the second thermally conductive material fills at least one through hole 202 to form an intermediate part. The first part has a first pin 122 of at least one first electronic component 12 exposed on the first plate surface 111 embedded in it, and the second part has a first pin 122 of at least one first electronic component 12 exposed on the second plate surface 112 embedded in it. The intermediate part is the thermal conductive path of the first part and the second part.

[0075] During the potting operation, when the second part of the second thermally conductive material fills the filling space 201 and the middle part fills the through hole 202, the second thermally conductive material can naturally overflow from the through hole 202 into the filling space 31 to form the first part, thereby conducting heat to the first component body 121. The first component body 121 is the source of heat generation. Although its heat will be transferred to the second thermally conductive material in the filling space 201 through the first pin 122, some of the second thermally conductive material overflows into the filling space 31 and covers the first component body 121, which is equivalent to adding a direct heat dissipation path to the first component body 121.

[0076] The second thermally conductive material is in close contact with the first element body 121, and can directly absorb the heat generated by the first element body 121. Through the connection between the filling space 31 and the through hole 202, the heat is transferred to the second thermally conductive material in the filling space 201, and then to the near side plate of the cover 20b and the cover plate 22, which significantly improves the overall heat dissipation efficiency. Especially for the first element body 121 with relatively large heat generation, this direct heat conduction method can conduct heat out more quickly and avoid local overheating.

[0077] During the potting process, the second thermally conductive material is ensured to completely fill the filling space 201 without creating voids due to errors in the potting amount. When the second thermally conductive material in the filling space 201 reaches saturation and begins to overflow from the through-hole 202, the filling space 31 can contain the overflowing material, ensuring that it flows only within the filling space 31 and does not spread to other areas of the substrate 11. This prevents the second thermally conductive material from contaminating other circuits or components on the substrate 11, ensuring the cleanliness of the substrate 11 and the normal operation of the circuits. Simultaneously, this design reduces waste of the second thermally conductive material, as the overflowing material continues to provide thermal conductivity within the filling space 31, achieving efficient material utilization.

[0078] In addition, the second thermally conductive material within the filling space 31 can also provide a certain degree of fixation and protection for the first component body 121. After the second thermally conductive material is cured, it will bond the first component body 121 more tightly to the substrate 11, enhance the vibration and impact resistance of the first component body 121, reduce component loosening or damage caused by external environmental influences, and further improve the structural stability and reliability of the circuit module 100.

[0079] The first frame 21, the second frame 30, and the substrate 11 are fixedly connected by multiple first fasteners 40, enabling rapid assembly and reducing production costs. This connection method allows the three components to form a tight, integrated structure. The multiple first fasteners 40 are evenly distributed at the connection points, ensuring that the force is evenly transmitted to the three components. This effectively avoids structural deformation or loosening caused by excessive local stress, guarantees the relative positional accuracy of the first frame 21 and the second frame 30 on the substrate 11, and ensures precise communication between the filling space 201 and the filling space 31 through the through hole 202. This creates favorable conditions for subsequent filling of the second thermally conductive material and improves the structural stability of the circuit module 100 under complex environments such as vibration and impact.

[0080] Of course, the first frame 21 and the second frame 30 can also be fixedly connected to the substrate 11 respectively. That is, the first frame 21 and the second frame 30 do not share holes or fasteners. This arrangement allows for the selection of different specifications of fasteners based on the stress characteristics of the first frame 21 and the second frame 30. The first frame 21, because it needs to withstand the internal pressure during potting, may require higher strength fasteners (such as M3 bolts); while the second frame 30 mainly serves as a enclosure and is subjected to less stress, so lightweight fasteners (such as self-tapping screws) can be used. If fasteners are shared, only uniform selection according to higher standards can be made, which will increase unnecessary costs and weight. Independent selection achieves the economy of "configuration on demand".

[0081] Regarding the tolerance of the assembly process, the independent connection method significantly reduces the cascading impact of operational errors. If a fastener is not tightened during the installation of the first frame 21, only that position needs to be tightened individually, without affecting the installation accuracy of the second frame 30; conversely, assembly deviations of the second frame 30 will not affect the sealing performance between the first frame 21 and the substrate 11, thereby greatly improving the assembly pass rate of the production line. Furthermore, the second frame 30, the near-side panel of the cover plate 22, and the cover 20b are fixedly connected by multiple second fasteners 50, improving the integrity of the electronically controlled heat dissipation assembly 1000 structure. The distribution of multiple second fasteners 50 can evenly and tightly connect the second frame 30, the near-side panel of the cover plate 22, and the cover 20b together. Since the three components have different functions and different stress conditions, the setting of multiple fasteners can ensure that each connection point can withstand the corresponding force, avoiding loosening or deformation caused by uneven local stress. For example, the near-side panel of the cover plate 22 may vibrate during operation due to the flow of refrigerant. The second fasteners 50 can transmit this vibration to the second frame 30 and the cover 20b, which is offset by the rigidity of the overall structure, ensuring the stability of the entire module.

[0082] Furthermore, this connection method ensures a tight fit between the near-side surface of the cover plate 22 and the cover 20b. As mentioned earlier, the plate body 221 of the cover 20b protrudes from the first frame 21, designed to make full contact with the near-side surface of the cover plate 22 to improve heat conduction efficiency. The fastening effect of the second fastener 50 further eliminates any gaps that may exist between the two, making the contact between the near-side surface of the cover plate 22 and the cover 20b even tighter, reducing contact thermal resistance, and allowing heat to be transferred more smoothly from the cover 20b to the near-side surface of the cover plate 22, and then carried away by the coolant channels within the near-side surface of the cover plate 22, thereby maximizing the heat dissipation effect.

[0083] In some embodiments, the circuit module 100 further includes at least one second electronic component 13 disposed on the second board surface 112. The at least one second electronic component 13 is embedded within the thermally conductive assembly 20, wherein the at least one second electronic component 13 is at least one of a pad, a surface mount device (SMD), and a copper trace. The pad is used to solder the first pin 122 of the first electronic component 12, providing a fixed and electrically connected area for the first pin 122. The pad is typically made of copper and has good conductivity to ensure the reliability of the electrical connection. A surface mount device (SMD) is a component used in surface mount technology (SMT). Unlike through-hole components, surface mount devices are directly mounted on the surface of the substrate 11 and fixed to the substrate 11 by soldering. Surface mount devices can include surface mount resistors, surface mount chips, etc. Surface mount devices are typically small in size and relatively lightweight, making them suitable for high-density circuit designs. Copper traces are conductive channels formed by etching copper layers, which can serve as carriers of current and signals.

[0084] The second electronic component 13 is disposed on the second plate surface 112, including a second component body 131 and a second pin 132 connected to the second component body 131. The second component body 131 is disposed on the second plate surface 112 and is located within the filling space 201. The second pin 132 is exposed on the first plate surface 111. A cover 20b surrounds the second electronic component 13. A second thermally conductive material is coated on the second electronic component 13 to form a continuous and dense insulating layer. After curing, it can effectively block abnormal current flow paths between the first electronic component 12 and the second electronic component 13, strictly control electrical clearances and creepage distances, and meet relevant safety regulations. Both components can achieve efficient heat conduction through the second thermally conductive material, improving the overall heat dissipation uniformity and reliability of the circuit module 100. At the same time, the coating of the second electronic component 13 by the second thermally conductive material also enhances the structural stability of these components, reduces the impact of external factors such as vibration and impact, and further ensures the normal operation of the circuit module 100.

[0085] Furthermore, the substrate 11 is also provided with a plurality of inspection holes 203, which are connected to the filling space 201 and are located near the edge of the substrate 11 or the center of the bottom wall of the filling space 201. Of course, the plurality of inspection holes 203 can also be distributed at the edge of the substrate 11 and the center of the bottom wall of the filling space 201.

[0086] The inspection hole 203 allows for inspection of the potting condition within the filling space 201. The inspection hole 203, located near the edge of the substrate 11, facilitates observation of the filling condition at the edge of the filling space 201 during the potting process. The edges of the filling space 201 are often prone to air bubbles and insufficient filling. These defects can affect the coverage of the first pin 122 and the second electronic component 13 by the second thermally conductive material, thereby reducing heat dissipation efficiency and electrical safety. Through the inspection hole 203 at the edge, operators can directly observe whether the second thermally conductive material fills the edge gaps and whether there are any unfilled voids, allowing for timely detection and resolution of problems to ensure that the second thermally conductive material completely fills the filling space 201.

[0087] The inspection hole 203, located at the center of the bottom wall of the filling space 201, allows for targeted inspection of the potting status in the core area of ​​the filling space 201. The center of the bottom wall is the main area where the second thermally conductive material accumulates and is a critical node for heat transfer. If air bubbles or insufficient filling are present here, it will directly affect the heat transfer path from the first pin 122 to the second thermally conductive material and then to the cover 20b. The central inspection hole 203 allows operators to determine whether the second thermally conductive material in the core area is evenly distributed and whether it completely covers the first pin 122 at the center, ensuring the potting quality in the core area.

[0088] The shape of the inspection hole 203 includes, but is not limited to, round holes, square holes or diamond-shaped holes. The arrangement position and number of inspection holes 203 can be reasonably planned according to the potting effect of the second thermal conductive material and the layout density of the first electronic component 12 and the second electronic component 13. This application does not limit the number of inspection holes 203.

[0089] In some embodiments, the electronically controlled heat dissipation assembly 1000 further includes a heat-conducting element 60, which is thermal grease or a thermal pad. The heat-conducting element 60 is disposed between the near-side plate of the cover plate 22 and the cover 20b, further optimizing the path of heat transfer from the cover 20b to the near-side plate of the cover plate 22, and effectively improving heat dissipation efficiency.

[0090] Thermal grease possesses excellent flowability and filling properties. When applied between the proximal surface of cover plate 22 and cover 20b, it effectively fills the minute gaps and unevenness between their contact surfaces. Even though the plate body 221 of cover plate 22 protrudes to better contact the proximal surface of cover plate 22, minor unevenness inevitably exists between the proximal surfaces of cover plate 22 and cover plate 22. These gaps form air layers, and since air has extremely low thermal conductivity, it severely hinders heat transfer. Thermal grease can penetrate into these gaps, expelling air and forming a continuous thermal channel, significantly reducing contact thermal resistance and allowing heat from cover 20b to be transferred more smoothly to the proximal surface of cover plate 22.

[0091] The thermal pad possesses a certain degree of elasticity and deformation capability, allowing it to adapt well to the contact surface between the near-side surface of the cover plate 22 and the cover 20b. After being placed between the near-side surface of the cover plate 22 and the cover 20b, the thermal pad deforms due to structural compression, fitting tightly between the two surfaces and eliminating gaps. For slightly larger gaps caused by processing errors or assembly, the deformation capability of the thermal pad can better compensate, ensuring unimpeded heat transfer. Furthermore, the thermal pad is easy to install, eliminating the need for application like thermal grease, thus improving assembly efficiency. Its insulation properties also ensure electrical isolation between the near-side surface of the cover plate 22 and the cover 20b, preventing short-circuit risks.

[0092] Since the cover 20b and the substrate 11 are fixed together after assembly, and the thermally conductive adhesive in the filling space 201 has been poured and cured, this feature greatly facilitates maintenance and effectively ensures the reliability of the circuit module 100. When repair or replacement is required, the entire circuit module 100 is integrally formed with the cured filling space 201. Only the thermally conductive component 60 between the near-side surface of the cover plate 22 and the cover 20b needs maintenance or replacement. This is easy to replace and the process is relatively simple, greatly reducing the difficulty and cost of maintenance operations. This simple operation process reduces operational errors caused by differences in the technical skills of maintenance personnel and ensures the effectiveness of thermal contact between the near-side surface of the cover plate 22 and the cover 20b.

[0093] This means that the internal structure of the filling space 201, including the first pin 122 of the first electronic component 12, the covering state of the second electronic component 13 and the thermally conductive adhesive, maintains its stable state at the time of manufacture and will not be affected by the replacement process. These internal structures are crucial for ensuring normal heat conduction and electrical safety. Therefore, key performance parameters such as the sealing performance of the filling space 201 and the sealing performance of electrical clearances are preserved, thereby ensuring that the electronically controlled heat dissipation assembly 1000 can quickly return to a stable working state after maintenance, effectively guaranteeing the reliability of the electronically controlled heat dissipation assembly 1000.

[0094] This application also proposes a heating, ventilation and air conditioning (HVAC) device, which includes a device body and an electrically controlled heat dissipation component 1000. The electrically controlled heat dissipation component 1000 is installed on the device body. The specific structure of the electrically controlled heat dissipation component 1000 is as described in the above embodiments. Since the electrically controlled heat dissipation component 1000 adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0095] It should be noted that HVAC equipment includes, but is not limited to, air conditioners, multi-split systems, heat pumps, water heaters, and other similar equipment. This HVAC equipment incorporates the electrically controlled heat dissipation component 1000 as described in the above embodiment. The electrically controlled heat dissipation component 1000 has a sealed structure, which simultaneously ensures heat dissipation, preventing overheating of the internal circuit module 100 during operation, reducing the risk of fire, and thus improving the overall safety of the HVAC equipment.

[0096] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "upper," "lower," "left," "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this application. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0097] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A circuit module, characterized in that, include: A circuit board includes a substrate and at least one first electronic component mounted on the substrate. The substrate includes a first plate surface and a second plate surface disposed opposite to each other, and the at least one first electronic component is mounted on the first plate surface. as well as A heat-conducting component is disposed on the second plate surface, the heat-conducting component makes heat-conducting contact with the second plate surface and the at least one first electronic component, and when viewed perpendicularly to the plate surface, the projection of the at least one first electronic component is within the projection range of the heat-conducting component.

2. The circuit module as described in claim 1, characterized in that, The thermally conductive assembly includes a first thermally conductive portion formed of a first thermally conductive material and a second thermally conductive portion formed of a second thermally conductive material. One side of the second thermally conductive portion makes thermal contact with the second plate surface and the at least one first electronic component. One side of the first thermally conductive portion makes thermal contact with the second thermally conductive portion, and the other side of the first thermally conductive portion makes thermal contact with an external cold source.

3. The circuit module as described in claim 2, characterized in that, The first thermally conductive material is a thermally conductive metal material, the second thermally conductive material is a thermally conductive adhesive, the first thermally conductive part is constructed as a plate, a filling space is formed between the proximal plate surface of the first thermally conductive part and the second plate surface, at least a portion of the second thermally conductive material is filled in the filling space to form at least a portion of the second thermally conductive part, and the distal plate surface of the first thermally conductive part makes thermal contact with the external cold source.

4. The circuit module as described in claim 3, characterized in that, The substrate is provided with at least one through hole penetrating the first plate surface and the second plate surface, the at least one through hole communicating with the filling space, and at least a portion of the second thermally conductive material is injected into the filling space through the at least one through hole to form at least a portion of the second thermally conductive part.

5. The circuit module as described in claim 3, characterized in that, A filling space is provided on the first plate surface. The substrate is provided with at least one through hole penetrating the first plate surface and the second plate surface. The at least one through hole connects the filling space and the filling space. The at least one first electronic component is installed in the filling space. The second thermally conductive part has a first part, a second part, and an intermediate part connecting the two. A portion of the second thermally conductive material fills the filling space and submerges the first pin of the at least one first electronic component to form the first part. A portion of the second thermally conductive material fills the filling space to form the second part. A portion of the second thermally conductive material fills the at least one through hole to form the intermediate part. The proximal plate surface of the first thermally conductive part is in thermal contact with the second part, and the distal plate surface of the first thermally conductive part is in thermal contact with the external cold source.

6. The circuit module as described in claim 5, characterized in that, The first pin of the at least one first electronic component extends from the first plate surface through the substrate and is exposed on the second plate surface, and the first pin of the at least one first electronic component makes thermal contact with the thermally conductive component.

7. The circuit module as described in claim 1, characterized in that, The heat-conducting component includes a cover, which includes a first frame and a cover plate connected to each other with a hollow opening. The first frame is mounted on the second plate surface. When viewed along a direction perpendicular to the second plate surface, the projection of the at least one first electronic component is located within the projection range of the first frame. The cover plate is disposed on the opening on the side of the first frame away from the substrate, and cooperates with the first frame and the second plate surface to form a filling space. The cover plate is configured as a first thermally conductive part formed of a first thermally conductive material. The filling space is filled with a second thermally conductive material. The second thermally conductive material is in thermal contact with the substrate and the terminals of the at least one first electronic component. The proximal plate surface of the cover plate is in thermal contact with the second thermally conductive material, and the distal plate surface of the cover plate is in thermal contact with an external cold source.

8. The circuit module as described in claim 7, characterized in that, The first frame is made of a non-conductive material, the first thermally conductive material is a thermally conductive metal material, and the second thermally conductive material is a thermally conductive adhesive.

9. The circuit module as described in claim 7, characterized in that, The cover plate includes a plate body and a skirt surrounding the plate body. The inner sidewall of the first frame is provided with a mounting groove, and the skirt is embedded in the mounting groove.

10. The circuit module as described in claim 9, characterized in that, In the thickness direction of the substrate, the side of the plate body away from the second plate surface protrudes out of or is flush with the first frame.

11. The circuit module according to any one of claims 6 to 10, characterized in that, It also includes a second frame, which is disposed on the first plate surface. The second frame and the first plate surface together form a filling space. The at least one first electronic component is installed in the filling space. The substrate is provided with at least one through hole penetrating the first plate surface and the second plate surface. The at least one through hole connects the filling space and the filling space. The second thermally conductive material fills the filling space to form a first part, the second thermally conductive material fills the filling space to form a second part, and the second thermally conductive material fills the at least one through hole to form an intermediate part. The first part has a first pin of the at least one first electronic component exposed on the first plate surface embedded therein, the second part has a first pin of the at least one first electronic component exposed on the second plate surface embedded therein, and the intermediate part is the thermal conduction path of the first part and the second part.

12. The circuit module as described in claim 11, characterized in that, The first frame, the second frame, and the substrate are fixedly connected by a plurality of first fasteners.

13. The circuit module according to any one of claims 7 to 12, characterized in that, The substrate has a plurality of inspection holes, which are connected to the filling space and are located near the edge of the substrate and / or the center of the bottom wall of the filling space.

14. The circuit module according to any one of claims 5 to 12, characterized in that, Multiple first electronic components are soldered to a circuit board, and the first pins of the multiple first electronic components include solder pad first pins and needle-shaped first pins.

15. The circuit module according to any one of claims 1 to 12, characterized in that, The circuit board further includes at least one second electronic component disposed on the second board surface. The at least one second electronic component is at least one of a pad, a surface mount component, and a copper foil trace. The at least one second electronic component is embedded in the heat-conducting assembly.

16. An electronically controlled heat dissipation assembly, characterized in that, include: A cold source having a cooling channel through which cooling fluid flows; as well as The circuit module as described in any one of claims 1 to 15, wherein the thermally conductive component is in thermal contact with the cold source to transfer heat from the substrate and the at least one first electronic component to the cold source.

17. The electronically controlled heat dissipation assembly as described in claim 16, characterized in that, It also includes a thermally conductive component, which is thermal grease or a thermal pad, and the thermally conductive component makes thermal contact with the thermally conductive assembly and the cold source.

18. The electronically controlled heat dissipation assembly as described in claim 16, characterized in that, The cold source includes a heat dissipation metal plate and refrigerant piping fixed to the heat dissipation metal plate. The cooling channel is the refrigerant piping, and the cooling fluid is the refrigerant in the refrigerant circulation loop. Alternatively, the cold source includes a finned radiator, the cooling channel is the space between two adjacent fins of the finned radiator, and the cooling fluid is airflow.

19. The electronically controlled heat dissipation assembly as described in claim 18, characterized in that, The heat dissipation metal plate is formed of a thermally conductive metal material and is configured as the box wall of the electronically controlled heat dissipation assembly.

20. A heating, ventilation, and air conditioning (HVAC) device, characterized in that, include: Equipment body; as well as The electronically controlled heat dissipation assembly as described in any one of claims 16 to 19, wherein the electronically controlled heat dissipation assembly is installed on the main body of the device.

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