Domain controller assembly structure, domain controller assembly method, domain controller and movable platform

Abstract

The invention discloses a domain controller assembly structure, an assembly method, a domain controller and a movable platform, the assembly structure comprises a shell, a first installation area and a second installation area which are mutually independent are arranged, the first installation area is arranged on the first side of the shell, and the second installation area is arranged on the second side of the shell. According to the domain controller assembly structure, the shell is divided into the first installation area and the second installation area which are independent of each other, and the first installation area and the second installation area are arranged on the two sides of the shell respectively, so that the two PCBA boards can be stacked to form a product, the product is highly integrated, and the assembly efficiency is improved. And meanwhile, the two mounting areas are mutually independent to form physical isolation, and are independently connected with connectors of two plates of the controller through an external wire harness, so that the conditions of signal interference and common cause failure can be effectively reduced.

Description

Technical Field

[0001] This invention relates to the field of domain controller technology, and in particular to a domain controller assembly structure, assembly method, domain controller, and mobile platform. Background Technology

[0002] A domain controller is a critical network server used to manage and control computers, users, and resources within a domain. For example, in the automotive field, a domain controller manages and controls various vehicle functions, including but not limited to powertrain, chassis control, and information processing in the smart cockpit. With technological advancements, the demands on domain controllers are increasing. For instance, Level 3 / Level 4 autonomous driving technology requires two independent domain controllers; if one domain controller fails, the other can ensure the system continues to operate normally.

[0003] Existing technologies employ a stacking design to achieve One Box Two Boards (two PCBA boards within a single housing), enabling high product integration. However, based on the functional requirements of L3 / L4 controllers, the two PCBAs not only need to avoid the effects of common-cause failures (the same factor causing both PCBAs to malfunction), but also must eliminate signal interference between PCBAs, such as EMC (Electromagnetic Compatibility) interference. This presents certain challenges for the design. Furthermore, the high integration of the product leads to more complex assembly processes, impacting production efficiency. Summary of the Invention

[0004] This invention provides a domain controller assembly structure, assembly method, domain controller, and mobile platform to solve problems such as complex installation procedures, signal interference, and common-cause failure in the prior art.

[0005] According to a first aspect of the present invention, a domain controller assembly structure is provided, comprising: The housing has a first mounting area and a second mounting area that are independent of each other. The first mounting area is located on the first side of the housing, and the second mounting area is located on the second side of the housing.

[0006] The domain controller assembly structure of the present invention divides the housing into two independent first mounting areas and second mounting areas, and arranges the first mounting areas and second mounting areas on the two sides of the housing respectively, so that two PCBA boards can be stacked to form a product, making the product highly integrated. At the same time, the two mounting areas are independent of each other, forming physical isolation, and are connected to the connectors of the two boards of the controller through external wiring harnesses, thereby effectively reducing signal interference and common cause failure.

[0007] In some implementations, it also includes: The first cover is used to be installed on the first installation area; The second cover is used to install the cover on the second installation area; The mounting structures for both the first cover and the second cover are located on the first side of the housing during installation.

[0008] Therefore, this configuration allows the mounting structures for both the first and second covers to be located on the first side of the housing during installation. This eliminates the need to flip the housing or other modules during assembly, facilitating assembly and providing good compatibility with the equipment fixtures, thus reducing the investment in fixtures. Furthermore, because they are installed on the same side of the housing, the overall domain controller product effectively improves the waterproof performance of the other side during use.

[0009] In some embodiments, a positioning structure for mounting and fixing a circuit board is provided on the inner side of the second cover, and a threaded hole for mounting screws is also provided on the inner side of the second cover, and a mounting opening corresponding to the threaded hole is provided on the second mounting area.

[0010] Therefore, this configuration allows the second cover to be installed with its inner side facing upwards during installation. The circuit board is first installed onto the second cover, and then the housing is installed onto the second cover. The second cover is installed on the first side of the housing using the mounting opening in the second mounting area and the threaded holes on the second cover. Afterward, only the other circuit board located on the first side of the housing needs to be installed along with the first cover, eliminating the need to flip the housing or other modules during assembly. Furthermore, since the threaded holes of both the second and first covers are located on the first side of the housing, the waterproof performance of the other side of the domain controller product is effectively improved during use.

[0011] In some embodiments, a first heat dissipation structure is provided on the second side of the housing at a position corresponding to the first mounting area; A second heat dissipation structure is provided on the first side of the housing at a position corresponding to the second mounting area.

[0012] Therefore, by using this configuration, the first and second heat dissipation structures can be used to dissipate heat from the chips on the circuit board mounted on the product, ensuring the product's operational stability.

[0013] In some embodiments, the first heat dissipation structure is configured as a liquid cooling structure, and the second heat dissipation structure is configured as a finned passive heat dissipation structure.

[0014] Therefore, this configuration allows for water cooling of one of the chips on the two circuit boards, ensuring its operation as the main power chip, while the other is cooled by natural passive cooling, thus reducing the overall product cost. Furthermore, since the first and second mounting areas are connected by a housing, the second mounting area can also utilize the water cooling structure on the first mounting area for accelerated cooling, enhancing the heat dissipation effect.

[0015] In some embodiments, the liquid cooling heat dissipation structure includes a liquid cooling heat dissipation channel disposed on the housing, and is provided with a cooling medium inlet and a cooling medium outlet; The first mounting area is provided with a heat exchange structure for heat exchange with at least one circuit board chip. The heat exchange structure is located at the location of the liquid cooling heat dissipation channel on the first side of the housing and extends into the liquid cooling heat dissipation channel. It includes a first heat exchange block and a second heat exchange block connected together. The second heat exchange block is located downstream of the first heat exchange block.

[0016] Therefore, by setting it up in this way, two heat spreaders cooled by liquid cooling medium can be used to dissipate heat from at least one circuit board chip, thereby ensuring the heat exchange efficiency between the overall heat spreader structure and the cooling medium. This results in a higher heat dissipation efficiency compared to traditional heat dissipation structures, which can support the high-load operation of the domain controller chip.

[0017] In some embodiments, the liquid cooling heat dissipation channel is configured in a "U" shape to form an upstream section closer to the cooling medium inlet and a downstream section closer to the cooling medium outlet; The first heat spreader is located at the upstream section of the first side of the housing, and the second heat spreader is located at the downstream section of the first side of the housing.

[0018] Therefore, by using this configuration, the distance between the upstream and downstream sections can be shortened by utilizing the "U"-shaped liquid cooling heat dissipation channel, thereby reducing the distance between the first and second heat exchange blocks. This allows the second heat exchange block to better distribute the heat of the first heat exchange block. At the same time, the "U"-shaped cooling heat dissipation channel can lengthen the liquid cooling heat dissipation channel, allowing the shell to further exchange heat and lower the temperature of the cooling medium. This results in a lower temperature of the cooling medium undergoing secondary heat exchange with the second heat exchange block, leading to higher heat dissipation efficiency for the second heat exchange block. Thus, the overall heat dissipation of the domain controller is optimized from multiple dimensions.

[0019] In some embodiments, the gap between the upstream segment and the downstream segment is configured to be formed using a partition.

[0020] Therefore, by setting it up in this way, the distance between the first heat exchanger and the second heat exchanger can be further reduced.

[0021] In some embodiments, the first heat exchange block and / or the second heat exchange block are configured as heat dissipation fin structures, with the bottoms of the first heat exchange block and the second heat exchange block connected together, and the heat dissipation fin structures extending into the liquid cooling heat dissipation channel.

[0022] Therefore, by using this configuration, the contact area between the heat dissipation fin structure and the cooling medium can be increased to improve heat dissipation efficiency.

[0023] In some implementations, the bottom of the first heat exchanger block is used to contact the circuit board chip for heat exchange.

[0024] Therefore, with this configuration, there will be more heat exchange between the first heat exchange block and the circuit board chip, allowing the first heat exchange block to exchange heat with the cooling medium first, so as to ensure the rapid cooling of the circuit board chip. The second heat exchange block is connected to the bottom of the first heat exchange block, thereby optimizing the heat distribution of the overall heat block structure and using the cooling medium on the downstream side for secondary heat exchange, forming auxiliary heat dissipation for the circuit board chip and avoiding single-point overheating.

[0025] In some embodiments, a first heat exchange structure for heat exchange with the circuit board chip is provided on the first mounting area, and a second heat exchange structure for heat exchange with the circuit board chip is provided on the second mounting area.

[0026] Therefore, this configuration enhances the heat exchange of the circuit board chips through the first and second heat exchange structures, thereby ensuring the operational stability of the product.

[0027] In some embodiments, the first heat exchange structure and / or the second heat exchange structure includes a heat spreader plate, one side of which is connected to the housing by an elastic element, and heat dissipation adhesive is provided on both sides of the heat spreader plate.

[0028] Therefore, by using this configuration, the heat spreader can be pressed against the circuit board chip using an elastic element to improve the heat exchange rate of the circuit board chip. At the same time, the heat spreader is further connected to the housing for heat transfer. Both sides of the heat spreader can be coated with thermal adhesive to further improve the heat transfer efficiency, thereby further improving the overall heat exchange efficiency.

[0029] In some embodiments, a waterproof groove is provided on the first mounting area and / or the second mounting area.

[0030] Therefore, this design prevents water stains from accumulating and coming into contact with the circuit board, ensuring that the overall waterproof performance of the product meets the required standards.

[0031] In some embodiments, EMC protective ribs are provided on the first installation area and / or the second installation area.

[0032] Therefore, by using this setup, EMC protection ribs can be used to isolate signal interference between the circuit boards installed in the first and second mounting areas.

[0033] In some embodiments, the EMC protective ribs are made of metal plates or die-cast alloy parts.

[0034] Therefore, by setting it up in this way, EMC protection ribs made of metal plates or die-cast alloy parts can be used to further isolate signal interference.

[0035] In some embodiments, the first mounting area and / or the second mounting area are provided with an interface groove communicating with the outside of the housing, and the housing is provided with a brim for covering the interface groove.

[0036] Therefore, this design allows for connection to external devices via the interface slot, while the brim design effectively enhances the product's waterproof and drop-proof capabilities.

[0037] In some embodiments, the first cover and / or the second cover are provided with protrusions that abut against the housing.

[0038] Therefore, by using this configuration, the protrusion can be connected to the housing for grounding, thereby achieving EMC protection.

[0039] In some embodiments, the first mounting area and the second mounting area are at least partially overlapping.

[0040] Therefore, this design effectively reduces the overall size of the product, making it suitable for a wider range of assembly scenarios.

[0041] In some implementations, a reinforcing structure for mounting to the back side of the circuit board is also included.

[0042] Therefore, by using this setup, the structural stability of the circuit board can be ensured through the reinforcement structure.

[0043] According to a second aspect of the present invention, a domain controller assembly method is provided, applicable to the domain controller assembly structure described in the first aspect above, and the controller assembly structure further includes: a first cover for mounting on a first mounting area and a second cover for mounting on a second mounting area, wherein the mounting structures of the first cover and the second cover are both disposed on a first side of the housing during installation, and the overall method includes: Insert the second cover into the clamp; Install the second circuit board onto the second cover; The first side of the housing should face upwards; Apply adhesive to the second circuit board and the first mounting area; The second cover is installed into the second installation area using the installation structure; Install the first circuit board into the first mounting area; The first cover is installed into the first installation area using the mounting structure.

[0044] The domain controller assembly method of the present invention enables the overall domain controller to be assembled without flipping the housing or other modules, which facilitates assembly. The equipment fixtures are universal and compatible, thereby reducing the investment in equipment fixtures.

[0045] According to a third aspect of the present invention, a domain controller is provided, having the domain controller assembly structure described in the first aspect above, and further comprising a first circuit board disposed in a first mounting area.

[0046] The domain controller of the present invention, by adopting the aforementioned domain controller assembly structure, can effectively improve assembly efficiency, while ensuring the waterproof performance of the product and effectively mitigating the impact of signal interference between circuit boards.

[0047] In some embodiments, a second circuit board is also included, which is disposed in the second mounting area; the projection of the second circuit board onto the first circuit board in a first direction at least partially overlaps; wherein the first direction is parallel to the plane in which the first circuit board is located.

[0048] Therefore, by setting it up in this way, the second circuit board and the first circuit board are arranged with at least partial overlap, which can effectively reduce the overall size of the domain controller product.

[0049] In some embodiments, a grounding spring is provided on the first circuit board and / or the second circuit board, the grounding spring abutting against the housing; and / or, The first circuit board and / or the second circuit board are provided with solder points for abutting against the housing.

[0050] Therefore, by setting it up in this way, the circuit board can be connected to the housing and grounded using solder points or grounding springs to achieve EMC protection.

[0051] According to a fourth aspect of the present invention, a mobile platform is provided, which is provided with the domain controller described in the third aspect above. Attached Figure Description

[0052] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0053] Figure 1 This is a schematic diagram of the overall structure of the domain controller assembly structure according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the second side of the domain controller assembly structure according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the first side of the domain controller assembly structure according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the second cover of a domain controller assembly structure according to an embodiment of the present invention. Figure 5 This is a schematic diagram of the structure of the first cover of the domain controller assembly structure according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the second circuit board of a domain controller assembly structure according to an embodiment of the present invention. Figure 7 This is a schematic diagram of the water-cooled heat dissipation structure of a domain controller assembly structure according to an embodiment of the present invention; Figure 8 for Figure 7 A front view of the water-cooled heat dissipation structure of the domain controller assembly structure shown in the embodiment. Figure 9 for Figure 8A schematic cross-sectional view of the water-cooled heat dissipation structure at point AA of the domain controller assembly structure shown in the embodiment. Figure 10 This is an exploded view of the structure of a domain controller according to an embodiment of the present invention; Figure 11 This is a flowchart of a domain controller assembly method according to an embodiment of the present invention; Figure 12 This is a flowchart of a domain controller assembly method according to another embodiment of the present invention.

[0054] Explanation of reference numerals in the attached drawings: 1. Housing; 11. First side; 12. Second side; 21. First mounting area; 22. Second mounting area; 31. First cover; 32. Second cover; 321. Positioning structure; 322. Threaded hole; 323. Mounting port; 41. First heat dissipation structure; 411. Cooling medium inlet; 412. Cooling medium outlet; 413. Liquid cooling flow channel; 4131. Upstream section; 4132. Downstream section; 414. Baffle; 415. Baffle plate; 416. Guide rib; 417. Top cover; 418. Opening; 42. Second heat dissipation structure Structure; 43. Heat dissipation structure; 4301. First heat dissipation structure; 4302. Second heat dissipation structure; 431. First heat dissipation block; 432. Second heat dissipation block; 433. Thermal conductive adhesive; 434. Heat dissipation part; 435. Bottom; 51. Heat dissipation plate; 52. Elastic element; 53. Thermal adhesive; 54. Heat dissipation boss; 61. Protrusion; 62. Solder point; 63. Grounding spring; 71. Interface groove; 72. Interface; 73. Cap edge; 81. EMC protection rib; 82. Waterproof groove; 83. Reinforcing structure; 91. First circuit board; 92. Second circuit board. Detailed Implementation

[0055] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0056] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0057] In the description of this application, it should be understood that the use of terms such as "center," "middle," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential" to indicate orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings is solely for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Features defined with "first" and "second" are used to distinguish feature names and do not have special meanings. Furthermore, features defined with "first" and "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "multiple" means two or more.

[0058] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0059] It should also be noted that, in this document, the terms "comprising" or "including" include not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element. The terminology used herein is generally that commonly used by those skilled in the art; in case of any discrepancy with commonly used terminology, the terminology used herein shall prevail.

[0060] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0061] The present invention will now be described in further detail with reference to the accompanying drawings.

[0062] Figures 1 to 3The overall configuration of a domain controller assembly structure according to an embodiment of the present invention is illustrated schematically. (Refer to...) Figures 1 to 3 As shown, the domain controller assembly structure of the present invention includes a housing 1. The housing 1 has a first mounting area 21 and a second mounting area 22, which are independent of each other. The first mounting area 21 is located on a first side 11 of the housing 1, and the second mounting area 22 is located on a second side 12 of the housing 1. Both the first mounting area 21 and the second mounting area 22 are areas for mounting circuit boards, and their shapes are adapted to the circuit boards. For example, the first mounting area 21 and the second mounting area 22 are generally rectangular. Interface slots 71 are provided on both sides of the first mounting area 21 and the second mounting area 22 for mounting interfaces 72 on the circuit boards, so that after the circuit boards are mounted on the housing 1, the interfaces 72 on the circuit boards can be placed in the interface slots 71 to achieve connection with external devices. Furthermore, a sealing assembly consisting of a sealing ring or sealant can be provided between the interface 72 and the interface slot 71 to achieve a sealed connection, thereby improving the sealing effect with the domain controller. Since the first mounting area 21 and the second mounting area 22 are completely independent of each other, the circuit boards installed in the two mounting areas can be physically isolated and connected to the connectors of the two circuit boards of the domain controller through external wiring harnesses, thereby effectively reducing signal interference and common cause failure between the circuit boards.

[0063] Specifically, refer to Figure 2 and Figure 3 As shown, in Figure 2 and Figure 3In the illustrated embodiment, the first mounting area 21 can be disposed on the first side 11 of the housing 1, and the overall size of the first mounting area 21 is consistent with the size of the housing 1, so as to accommodate the mainboard of the domain controller. The second mounting area 22 is used to accommodate the slave board of the domain controller, and can be disposed on one side of the second side 12 of the housing 1, so that the second mounting area 22 and the first mounting area 21 overlap at least partially (i.e., the projected areas of the two mounting areas partially overlap), so that the projections of the two mounted circuit boards can at least partially overlap, thereby reducing the overall length of the domain controller product and making it more suitable for deployment in various application scenarios. Meanwhile, a first heat exchange structure for heat exchange with the circuit board chip can be provided on the first mounting area 21, so that the relevant circuit components (such as the circuit board chip) are facing the first mounting area 21 when the circuit board is installed. A second heat exchange structure for heat exchange with the circuit board chip can be provided on the second mounting area 22, so that the relevant circuit components (such as the circuit board chip) are facing the second mounting area 22 when the circuit board is installed. This makes the relevant circuit components on the two circuit boards face each other when the two circuit boards are installed. By staggering the taller components on the circuit boards, the overall height of the domain controller product can be reduced, thereby further reducing the size of the overall domain controller product.

[0064] For the first and second heat exchange structures, their structures can be identical, or different structures can be designed to optimize heat exchange performance for the motherboard and slave board, respectively. For example, such as... Figure 9 or Figure 10 As shown, the first heat exchange structure and the second heat exchange structure can be configured as thermal adhesive 53 at corresponding positions on the circuit board chip on the housing 1. The thermal adhesive 53 has good thermal conductivity, and by enhancing the contact between the housing 1 and the circuit board chip through the thermal adhesive 53, the heat dissipation efficiency of the circuit board chip can be effectively improved.

[0065] In some possible implementations, such as Figure 10As shown, the first heat exchange structure and / or the second heat exchange structure may further include a heat exchange plate 51. One side of the heat exchange plate 51 is connected to the housing 1 via an elastic member 52, thereby allowing the elastic member 52 to push the heat exchange plate 51 towards the circuit board chip, ensuring that the heat exchange plate 51 and the circuit board chip are in close contact as much as possible, thus ensuring heat exchange efficiency. Simultaneously, thermal adhesive 53 may be provided on both sides of the heat exchange plate 51, thereby enhancing the contact between the heat exchange plate 51 and the circuit board chip, and also enhancing the contact between the heat exchange plate 51 and the housing 1, further improving the heat dissipation efficiency of the circuit board chip. The heat exchange structure of this embodiment can be disposed on the first heat exchange structure corresponding to the first mounting area 21 to ensure the heat dissipation efficiency of the motherboard's circuit board chip. Of course, the heat exchange structure of this embodiment can also be disposed on the second heat exchange structure corresponding to the second mounting area 22; this embodiment does not impose any limitations on this.

[0066] For example, refer to Figure 10 As shown, in Figure 10 In the illustrated embodiment, the first mounting area 21 is used to mount the motherboard, and the second mounting area 22 is used to mount the slave board. (Combined with...) Figure 2 and Figure 3 As shown, both the first mounting area 21 and the second mounting area 22 are provided with heat dissipation protrusions 54 for contacting the circuit board chip. The first heat exchange structure of the first mounting area 21 includes a heat spreader 51, which is connected to the housing 1 via an elastic element 52. The elastic element 52 is a spring (or a spring sheet or other commonly used structure in the prior art). Exemplarily, the spring can abut against the housing 1 on the outer periphery of the heat dissipation protrusion 54, so that after the circuit board is installed, the heat dissipation protrusion 54 abuts against the heat spreader 51, and the spring force makes the heat spreader 51 abut against the circuit board chip, ensuring the contact area between the heat spreader 51 and the circuit board chip and improving the heat dissipation effect. Further, thermal adhesive 53 is provided on both sides of the heat spreader 51 to enhance the contact between the heat spreader 51 and the circuit board chip and the housing 1, and the spring pushes the heat spreader 51 towards the circuit board chip to ensure the contact between the heat spreader 51 and the circuit board chip and ensure heat dissipation efficiency. The heat dissipation requirements of the chips installed in the second mounting area 22 are lower than those of the motherboard installed in the first mounting area 21. Therefore, the second heat exchange structure in the second mounting area 22 can be provided with only thermal adhesive 53 to exchange heat with the circuit board chips through the thermal adhesive 53, which can meet the heat dissipation requirements and save costs.

[0067] To ensure isolation between the motherboard and slave board, the overall housing 1 can be made of a metal plate or a die-cast alloy. When there is no strong isolation requirement between the motherboard and slave board, the overall housing 1 can also be formed using injection molding. Furthermore, a first cover 31 can be provided on the first mounting area 21, and a second cover 32 can be provided on the second mounting area 22 to further secure the circuit board and further isolate it from the outside environment, reducing signal interference and common-cause failure. Correspondingly, the first cover 31 and the second cover 32 can also be made of a metal plate or a die-cast alloy, or formed using injection molding, etc., and the present invention does not impose any limitations on this.

[0068] To further reduce signal interference and common-cause failures between the motherboard and slave board, in some possible implementations, EMC protection ribs 81 may also be provided on the first mounting area 21 and the second mounting area 22. The EMC protection ribs 81 may be made of metal plates or die-cast alloy parts to ensure their isolation performance. (Refer to...) Figure 2 and Figure 3 As shown, the EMC protection rib 81 is specifically disposed on the outer periphery of the circuit board components on the first mounting area 21 and the second mounting area 22, and on the outermost periphery of the circuit board on the first mounting area 21 and the second mounting area 22. The EMC protection rib 81 is formed as a rib structure to surround the corresponding area, thereby contacting the periphery of the circuit board chip and the grounding components (such as grounding springs or solder points) on the periphery of the circuit board, to isolate the circuit board chip from other components on the circuit board and to isolate the circuit board components from components outside the circuit board, thus avoiding mutual signal interference. The height of the EMC protection rib 81 can be set as high as possible, for example, after the circuit board is mounted on the corresponding mounting area, the EMC protection rib 81 abuts against the circuit board, which can maximize the isolation performance of the EMC protection rib 81.

[0069] For example, refer to Figure 6 As shown, solder points 62 can be provided on the circuit board for mounting to the housing 1, and solder points 62 can specifically be formed as semi-circular bumps. Because in Figure 6 In the illustrated embodiment, the solder point 62 is disposed on the side of the circuit board used for mounting circuit components. This allows the solder point 62 to connect with the EMC protection rib 81 disposed on the housing 1, achieving grounding and improving the electromagnetic shielding effect. Additionally, refer to... Figure 10As shown, the grounding spring 63 can be disposed on the outer periphery of the circuit board chip on the circuit board for mounting to the housing 1, so as to connect with the EMC protection rib 81, thereby ensuring the electromagnetic shielding effect and also relieving stress problems during circuit board installation. It is understood that the placement positions of the solder point 62 and the grounding spring 63 can be interchanged, both of which can improve the electromagnetic shielding function.

[0070] Additionally, in some possible embodiments, the first cover 31 and / or the second cover 32 are further provided with a protrusion 61, which abuts against the housing 1. Specifically, refer to... Figure 5 As shown, a protrusion 61 extends from the outer periphery of the first cover 31 toward the interior of the housing 1, and is provided around the circumference of the cover. Specifically, the protrusion 61 is a structure with a circular protrusion forming in the center of the cover. The protrusion 61 abuts against the housing 1, thereby forming a grounding point to achieve better electromagnetic shielding.

[0071] In some possible implementations, the mounting structures of the first cover 31 and the second cover 32 on the housing 1 can be configured to be both located on the first side 11 of the housing 1 during installation. These mounting structures can be snap-fit ​​structures, screw structures, etc. By setting the mounting structures of the first cover 31 and the second cover 32 on the first side 11 of the housing 1 during installation, it is possible to avoid flipping the housing 1 or other modules during assembly, which facilitates assembly, provides good compatibility of equipment fixtures, and reduces the investment in equipment fixtures. Furthermore, since they are installed on the same side of the housing 1, the waterproof performance of the other side of the overall domain controller product can be effectively improved during use. For example, refer to Figure 2 , Figure 3 and Figure 10 As shown, in Figure 2 , Figure 3 and Figure 10 In the illustrated embodiment, both the first cover 31 and the second cover 32 are screw-mounted. The second cover 32 has a threaded post for mounting screws, with a threaded hole 322. The threaded post serves as a positioning structure 321 for mounting and fixing the circuit board. Correspondingly, the second mounting area 22 on the housing 1 has a mounting opening 323 corresponding to the threaded hole 322, allowing the circuit board and housing 1 to be mounted and fixed to the second cover 32 using screws passing through the mounting opening 323 on the first side 11 of the housing 1. Since the first cover 31 is located on the first side 11 of the housing 1, the installation of the entire domain controller can be completed simply by sequentially mounting the circuit board and the first cover 31 onto the housing 1 and fixing them with screws.

[0072] In addition, to further enhance the overall waterproof performance of the product, a cap edge 73 can be provided at the interface groove 71 position on the housing 1. For details, refer to... Figures 1 to 3 As shown, the brim 73 extends outward from the interface groove 71 on the housing 1. It can be formed on only one side of the interface groove 71 or on both sides. Since the mounting structures of the first cover 31 and the second cover 32 are both located on the first side 11, the waterproof performance of the second side 12 of the overall product is better. Therefore, the brim 73 is only located on the second side 12 of the housing 1 to further optimize the waterproof performance of the overall product and meet the IP52 protection requirement. Simultaneously, the brim 73 also protects the interfaces 72 on the circuit board and the overall domain controller product, thereby improving the overall product's drop and impact resistance. Specifically, refer to... Figure 1 As shown, the brim 73 provided in the first mounting area 21 is provided on the housing 1, while the brim 73 provided in the second mounting area 22 is provided on the second cover 32.

[0073] Additionally, waterproof grooves 82 can be provided in the first installation area 21 and the second installation area 22 to further optimize the waterproof performance of the product. (Refer to...) Figure 1 As shown, the waterproof groove 82 is specifically disposed between the second mounting area 22 on the second side 12 of the housing 1 and other parts, forming a recessed groove that extends to both sides of the housing 1 to divert water to the outside of the housing 1. By providing the waterproof groove 82, water on the second side 12 of the housing 1 can be diverted from the waterproof groove 82 to the outside of the housing 1, preventing water from entering the second mounting area 22, enhancing the waterproof performance of the first side 11 on the housing 1, and improving the waterproof function of the domain controller product.

[0074] For the overall domain controller assembly structure, heat dissipation structures can be further provided at the first mounting area 21 and the second mounting area 22. Specifically, a first heat dissipation structure 41 can be provided on the second side 12 of the housing 1 at the position corresponding to the first mounting area 21, and a second heat dissipation structure 42 can be provided on the first side 11 of the housing 1 at the position corresponding to the second mounting area 22. Since the first mounting area 21 is mainly used to install the motherboard and the second mounting area 22 is mainly used to install the slave board, the design of the first heat dissipation structure 41 corresponding to the first mounting area 21 can be optimized to ensure the stability of the motherboard and support the high-load operation of the domain controller chip. Specifically, the first heat dissipation structure 41 can be set as a liquid cooling structure, and the second heat dissipation structure 42 can be set as a finned passive cooling structure. With this setting, the operation of the motherboard can be ensured by liquid cooling, while the slave board is cooled by passive cooling. Since the liquid cooling structure is set on the housing 1, and the circuit board chips of the motherboard and slave board are also cooled through the structure of the housing 1, the liquid cooling structure can also exchange the excess heat of the finned passive cooling structure when it is in operation, so as to ensure the operation of the overall domain controller.

[0075] For example, refer to Figure 2 and Figure 3 As shown, in Figure 2 and Figure 3In the illustrated embodiment, the first heat dissipation structure 41 is designed as a liquid-cooled heat dissipation structure, while the second heat dissipation structure 42 is designed as a finned passive heat dissipation structure. The liquid-cooled heat dissipation structure includes a liquid-cooled heat dissipation channel 413 disposed on the housing 1. The liquid-cooled heat dissipation channel 413 is U-shaped, with a cooling medium inlet 411 and a cooling medium outlet 412 disposed on one side of the housing 1. The U-shaped channel layout increases the coverage area of ​​the cooling medium and improves heat exchange efficiency. The liquid-cooled heat dissipation channel 413 has inclined surfaces near the cooling medium inlet 411 and the cooling medium outlet 412, allowing the cooling medium to flow more effectively from the cooling medium inlet 411 into the liquid-cooled heat dissipation channel 413 and to flow more effectively from the cooling medium outlet 412. A guide rib 416 is also disposed within the liquid-cooled heat dissipation channel 413 near the cooling medium inlet 411 to divert the cooling medium, ensuring uniform contact between the cooling medium and the liquid-cooled heat dissipation channel 413. Several turbulence columns 414 are arranged inside and / or on the sidewalls of the liquid cooling heat dissipation channel 413. Since the turbulence columns 414 are in contact with the housing 1, heat transfer is achieved, allowing for better heat exchange with the cooling medium. Simultaneously, the turbulence columns 414 effectively slow down the flow rate of the cooling medium, enabling more thorough heat exchange between the cooling medium and the turbulence columns 414, thereby improving heat dissipation efficiency. The passive fin heat dissipation structure is configured as fin structures on the first side 11 of the housing 1 corresponding to the second mounting area 22. The cooling medium can specifically be water or ethylene glycol, or other commonly used cooling media in the prior art; this embodiment does not impose any limitations on this.

[0076] To ensure the stability of the connection between the liquid cooling heat dissipation channel 413 and the housing 1, the liquid cooling heat dissipation channel 413 can be manufactured together with the integral housing 1 by die casting. Due to process requirements, refer to Figure 1 and Figure 2 As shown, an opening 418 with a shape consistent with the liquid cooling channel 413 is provided at the location of the liquid cooling channel 413 on the second side 12 of the housing 1. In this embodiment, a top cover 417 can be provided at the opening 418, and the top cover 417 is sealed to the housing 1 to ensure the sealing performance and operational stability of the liquid cooling channel 413. Exemplarily, the top cover 417 and the housing 1 can be sealed by friction stir welding. Friction stir welding can effectively reduce the residual stress or deformation of the structure after welding, thereby ensuring the structural stability of the liquid cooling channel 413.

[0077] In some possible implementations, the liquid cooling structure may further include a heat exchange structure 43 disposed on the first mounting area 21 for heat exchange with at least one circuit board chip. This heat exchange structure 43 is disposed at the location of the liquid cooling channel 413 on the second side 12 of the housing 1 and extends into the liquid cooling channel 413. It includes a first heat exchange block 431 and a second heat exchange block 432 connected together, with the second heat exchange block 432 disposed downstream of the first heat exchange block 431. Specifically, the first heat exchange block 431 and the second heat exchange block 432 include a heat dissipation portion 434 and a bottom 435. The bottom 435 is used for direct / indirect heat exchange with the circuit board chip, and the heat dissipation portion 434 is used for heat exchange with an external medium (such as air, coolant, etc.) to achieve heat dissipation and cooling of the circuit board chip. The heat dissipation portion 434 of the first heat exchange block 431 and the second heat exchange block 432 can be configured as a heat dissipation fin structure or a heat dissipation guide pillar structure, or other structures commonly used in the prior art. When the heat dissipation part 434 is configured as a heat dissipation fin structure, the length direction of the heat dissipation fin structure needs to be non-perpendicular to the flow direction of the cooling medium in the liquid cooling heat dissipation channel 413, so that each fin in the heat dissipation fin structure can contact the cooling medium to achieve heat exchange and ensure heat dissipation efficiency. Optionally, since the thermal conductivity of copper (401 W / m·K) is nearly twice that of aluminum (237 W / m·K), the overall heat dissipation structure 43 can be made of pure copper or various copper alloys, or aluminum alloys or other metal alloy materials with high thermal conductivity. The present invention does not limit this.

[0078] The bottoms 435 of the first heat spreader 431 and the second heat spreader 432 are connected, enabling simultaneous heat dissipation of the circuit board chip using both heat spreaders. Specifically, the circuit board chip can directly or indirectly contact at least one of the first heat spreader 431 and the second heat spreader 432, thereby transferring heat from the circuit board chip to both heat spreaders. In some possible embodiments, the circuit board chip can be disposed at the bottom 435 of the first heat spreader 431. Since the first heat spreader 431 is located upstream of the second heat spreader 432, the cooling medium, upon contacting the heat spreader structure 43, will first contact and exchange heat with the heat dissipation portion 434 on the first heat spreader 431. Therefore, by disposing of the circuit board chip at the bottom 435 of the first heat spreader 431, most of the heat from the circuit board chip can be transferred to the first heat spreader 431, allowing direct heat dissipation using the cooling medium without heat exchange. The remaining small portion of the heat from the circuit board chip is transferred to the second heat spreader 432 through the bottom 435 of the first heat spreader 431 and the bottom 435 of the second heat spreader 432. The second heat spreader 432 then uses the cooling medium that has exchanged heat with the first heat spreader 431 to dissipate heat, thus achieving auxiliary secondary heat dissipation. For example, refer to... Figure 7 As shown, in Figure 7In the embodiment shown, the bottom 435 of the first heat exchange block 431 is connected to the bottom 435 of the second heat exchange block 432. The bottom 435 of the first heat exchange block 431 is raised at the position where it contacts the circuit board chip for heat exchange, and is provided with thermally conductive adhesive 433 for contacting the circuit board chip for heat exchange, thereby improving the heat transfer efficiency between the circuit board chip and the first heat exchange block 431.

[0079] Because the liquid cooling heat dissipation channel 413 is designed in a "U" shape, it can be divided into an upstream section 4131 closer to the cooling medium inlet 411 and a downstream section 4132 closer to the cooling medium outlet 412. In this case, for the heat exchange structure 43, the first heat exchange block 431 can be located at the upstream section 4131 of the first side 11 of the housing 1, and the second heat exchange block 432 can be located at the downstream section 4132 of the first side 11 of the housing 1. Since the overall liquid cooling heat dissipation channel 413 is designed in a "U" shape, by arranging the first heat exchange block 431 and the second heat exchange block 432 in this way, the distance between the upstream section 4131 and the downstream section 4132 can be shortened using the "U"-shaped liquid cooling heat dissipation channel 413, thereby reducing the distance between the first heat exchange block 431 and the second heat exchange block 432, allowing the second heat exchange block 432 to better distribute the heat from the first heat exchange block 431. Meanwhile, the U-shaped cooling channel elongates the liquid cooling channel 413, allowing the housing 1 to further exchange heat with the cooling medium, resulting in a lower temperature for the cooling medium undergoing secondary heat exchange with the second heat exchange block 432. This enhances the heat dissipation efficiency of the second heat exchange block 432, thereby optimizing the overall domain controller's heat dissipation from multiple dimensions. Furthermore, to further reduce the distance between the first heat exchange block 431 and the second heat exchange block 432, the gap between the upstream section 4131 and the downstream section 4132 can be formed using a partition 415. Simultaneously, the length of the liquid cooling channel 413 is aligned with the length of the housing 1, further optimizing heat exchange between the housing 1 and the cooling medium. This again lowers the temperature of the cooling medium undergoing secondary heat exchange with the second heat exchange block 432, further enhancing the heat dissipation efficiency of the second heat exchange block 432.

[0080] For example, refer to Figure 8 and Figure 9 As shown, in Figure 8 and Figure 9 In the embodiment shown, the overall liquid cooling heat dissipation channel 413 is U-shaped, with a partition 415 forming the middle section. The first heat dissipation block 431 is located at the upstream section 4131, and the second heat dissipation block 432 is located at the downstream section 4132, thereby effectively shortening the distance between the first heat dissipation block 431 and the second heat dissipation block 432 and optimizing the overall heat dissipation effect.

[0081] In some other embodiments, for circuit boards with multiple circuit board chips, the housing 1 may also be provided with a corresponding number of heat dissipation structures 43. For example, referring to... Figure 7 and Figure 8 As shown, two circuit board chips are mounted on the circuit board, and two sets of heat dissipation structures 43 are arranged side by side. (Refer to...) Figure 7 and Figure 8 As shown, the first heat-spreading structure 4301 is closer to the cooling medium inlet 411 and cooling medium outlet 412 on the liquid cooling heat dissipation channel 413, while the second heat-spreading structure 4302 is disposed on one side of the first heat-spreading structure 4301. Specifically, the first heat-spreading block 431 of the second heat-spreading structure 4302 is disposed downstream of the first heat-spreading block 431 of the first heat-spreading structure 4301 in the upstream section 4131 of the first side 11 of the housing 1, and the second heat-spreading block 432 of the second heat-spreading structure 4302 is disposed upstream of the second heat-spreading block 432 of the first heat-spreading structure 4301 in the downstream section 4132 of the first side 11 of the housing 1. Exemplarily, the first heat-spreading structure 4301 contacts one circuit board chip, and the second heat-spreading structure 4302 contacts another circuit board chip, so as to achieve simultaneous heat dissipation treatment for two circuit board chips on the circuit board. In other embodiments, for a circuit board with multiple circuit board chips, the housing 1 may also have only one heat dissipation structure 43 that contacts multiple circuit board chips at the same time to dissipate heat for multiple circuit board chips.

[0082] It is understandable that, in the above Figures 7 to 9 In the embodiment shown, when the heat exchange structure 43 exchanges heat with the circuit board chip, the aforementioned first heat dissipation structure 41 can also be used for heat exchange, thereby further optimizing the heat dissipation performance of the overall domain controller assembly structure.

[0083] In some possible implementations, the domain controller assembly structure of the present invention may further include a reinforcing structure 83 for mounting on the back side of the circuit board. The reinforcing structure 83 may specifically be a steel frame structure, which can be installed on the back side of the circuit board by means of screws or adhesive, etc., to support the circuit board, partially offset the bending of the circuit board caused by heat generated by the circuit board chips, and prevent the circuit board from cracking. (See reference...) Figure 10 As shown, the reinforcing structure 83 can be installed and fixed through the mounting structure of the first cover 31, so that when the first cover 31 is installed, the reinforcing structure 83 can be installed on the back side of the circuit board, thereby improving the structural stability of the circuit board.

[0084] The domain controller assembly structure of this invention divides the housing 1 into two independent first mounting areas 21 and second mounting areas 22, and arranges the first mounting areas 21 and second mounting areas 22 on opposite sides of the housing 1. This allows two PCBA boards to be stacked to form a single product, resulting in high product integration. The two mounting areas are physically isolated from each other, connected separately to the connectors of the two controller boards via external wiring harnesses. Furthermore, the addition of EMC protection ribs 81 and grounding springs 63 further enhances electromagnetic shielding performance, effectively reducing signal interference and common-cause failures. Additionally, the domain controller assembly structure of this invention simultaneously places the first cover 31 and the second cover 32 on the first side 11 of the housing 1 during installation. This eliminates the need for flipping the housing 1 or other modules during assembly, facilitating assembly and providing good compatibility with the equipment fixtures, thus reducing the investment in equipment fixtures. Moreover, because the installation is done on the same side of the housing 1, the overall domain controller product effectively improves the waterproof performance of the other side during use. The overall domain controller assembly structure, by incorporating a liquid cooling system for the first mounting area 21 and a finned passive cooling system for the second mounting area 22, ensures high-load operation of the circuit board chips serving as the main power source and reduces the overall product cost. Furthermore, since the first and second mounting areas 21 are connected by the housing 1, the second mounting area 22 can also utilize the water cooling system on the first mounting area 21 for accelerated cooling, enhancing the heat dissipation effect.

[0085] The present invention also provides a domain controller assembly method applicable to the aforementioned domain controller assembly structure, wherein the domain controller assembly structure has a first cover 31 and a second cover 32, and the mounting structures of the first cover 31 and the second cover 32 are both disposed on the first side 11 of the housing 1 during installation. Figure 11 The flowchart of a domain controller assembly method according to an embodiment of the present invention is illustrated schematically. (Refer to...) Figure 11 As shown, the domain controller assembly method of the present invention includes the following steps: Step S11: Insert the second cover 32 into the fixture; Step S12: Install the second circuit board 92 onto the second cover 32; Step S13: Position the first side 11 of the housing 1 facing upwards; Step S14: Apply adhesive to the second circuit board 92 and the first mounting area 21; Step S15: Install the second cover 32 into the second installation area 22 using the installation structure; Step S16: Install the first circuit board 91 into the first mounting area 21; Step S17: Install the first cover 31 into the first installation area 21 using the installation structure.

[0086] Specifically, firstly, step S21 is executed to install the second cover 32 into the fixture to fix the second cover 32. At this time, the inner side of the second cover 32 faces upward. Then, step S12 is executed to install the second circuit board 92 onto the second cover 32. Next, step S13 is executed to set the first side 11 of the housing 1 facing upward. Furthermore, the second cover 32 can be placed on the first side 11 of the housing 1 at the position corresponding to the second mounting area 22. At this time, the circuit board chip on the second circuit board 92 is also facing upward, and the first mounting area 21 is also facing upward at the same time, so that the circuit board chip on the second circuit board 92 and the first mounting area 21 can be glued by the dispensing station. After the glue is applied, step S15 is executed to install the housing 1 into the fixture and place the housing 1 onto the second cover 32. The second cover 32 is then installed onto the second mounting area 22 on the first side 11 of the housing 1 through the mounting structure. Finally, steps S16 and S17 are executed sequentially to install the first circuit board 91 into the first installation area 21, and then the first cover 31 is installed into the first installation area 21 through the installation structure to complete the installation of the overall domain controller.

[0087] Reference Figure 12 As shown, Figure 12 schematically shown Figure 10 The flowchart illustrates the overall assembly method of the domain controller assembly structure of the present invention. (Refer to...) Figure 12 As shown, first, the second cover 32 is installed into the fixture, then the slave plate is installed onto the second cover 32, and the first side 11 of the housing 1 is installed into the fixture with the first side 11 facing upwards. TIM2 adhesive is applied to the slave plate and the first mounting area 21 using an adhesive dispensing station. Then, the housing 1 is placed above the second cover 32 and the slave plate. The second cover 32 and the slave plate are installed onto the housing 1 using screws or other methods, locking the second cover 32 onto the housing 1. Next, the heat spreader 51 is installed onto the first mounting area 21 of the housing 1 for the spring and conductive foam device, and TIM1.5 adhesive is applied to the heat spreader 51 using an adhesive dispensing station. Then, the main board is installed onto the housing 1, and the reinforcing structure 83 is locked to the back of the main board using screws. Finally, the first cover 31 is installed onto the first mounting area 21, and the screws are tightened, locking the first cover 31 onto the housing 1. The above assembly process eliminates the need to flip the shell or cover, simplifying the assembly process, reducing equipment steps, improving production efficiency, and lowering production costs.

[0088] The present invention also provides a domain controller having the aforementioned domain controller assembly structure. Figure 10 The overall composition of the domain controller of the present invention and its embodiments is illustrated schematically. (Refer to...) Figure 10 As shown, the domain controller of the present invention includes a first circuit board 91, which is mounted in a first mounting area 21. It also includes a second circuit board 92, which is mounted in a second mounting area 22. Since the first mounting area 21 and the second mounting area 22 partially overlap, the projections of the first circuit board 91 and the second circuit board 92 in a first direction parallel to the plane containing the first circuit board 91 at least partially overlap. The two circuit boards can be placed face-to-face with their connectors, and their staggered placement avoids interference, thereby effectively reducing the overall size of the domain controller, achieving product miniaturization, and facilitating application to various mobile platform products such as vehicles. In some possible embodiments, the domain controller may only have the first circuit board 91. In some embodiments, the first circuit board 91 may be a single large board, or it may be split into two parallel circuit boards arranged in the first mounting area 21.

[0089] The domain controller of the present invention, by having the aforementioned domain controller assembly structure, can thus have the relevant functional effects of the domain controller assembly structure, such as good electromagnetic shielding performance, waterproof performance, heat dissipation performance, etc. At the same time, the installation structure for installing the first cover 31 and the second cover 32 can be set on the first side 11 to simplify the installation process and reduce the production cost of the product.

[0090] The present invention also provides a portable platform, wherein the portable platform is provided with a domain controller according to any of the above embodiments, so as to ensure that the domain controller can meet the functional requirements of L3 / L4, and can also effectively solve the problems of signal interference and common cause failure between two circuit boards in the product, and has good waterproof, drop and impact resistance and heat dissipation performance to adapt to the working environment of various portable platforms.

[0091] It should be noted that the mobile platform described in the embodiments of the present invention can be, for example, a mobile robot, a model aircraft, a drone, a robotic arm, a car, a ship, etc. It should also be pointed out that the structure of the mobile platform is not limited to this; this embodiment is merely illustrative.

[0092] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A domain controller assembly structure, characterized in that, include: The housing (1) is provided with a first mounting area (21) and a second mounting area (22) that are independent of each other. The first mounting area (21) is located on the first side (11) of the housing (1), and the second mounting area (22) is located on the second side (12) of the housing (1).

2. The domain controller assembly structure according to claim 1, characterized in that, Also includes: The first cover (31) is used to install the cover on the first installation area (21); The second cover (32) is used to install the cover on the second installation area (22); The mounting structures of the first cover (31) and the second cover (32) are both set on the first side (11) of the shell (1) during installation.

3. The domain controller assembly structure according to claim 2, characterized in that, The second cover (32) has a positioning structure (321) for mounting and fixing the circuit board on its inner side, and the second cover (32) also has a threaded hole (322) for mounting screws on its inner side. The second mounting area (22) has a mounting opening (323) corresponding to the threaded hole (322).

4. The domain controller assembly structure according to claim 1, characterized in that, A first heat dissipation structure (41) is provided on the second side (12) of the housing (1) at a position corresponding to the first mounting area (21); A second heat dissipation structure (42) is provided on the first side (11) of the housing (1) at a position corresponding to the second mounting area (22).

5. The domain controller assembly structure according to claim 4, characterized in that, The first heat dissipation structure (41) is configured as a liquid cooling heat dissipation structure, and the second heat dissipation structure (42) is configured as a finned passive heat dissipation structure.

6. The domain controller assembly structure according to claim 5, characterized in that, The liquid cooling heat dissipation structure includes a liquid cooling heat dissipation channel (413) disposed on the housing (1), and is provided with a cooling medium inlet (411) and a cooling medium outlet (412); The first mounting area (21) is provided with a heat exchange structure (43) for heat exchange with at least one circuit board chip. The heat exchange structure (43) is located at the location of the liquid cooling heat dissipation channel (413) on the first side (11) of the housing (1) and extends into the liquid cooling heat dissipation channel (413). It includes a first heat exchange block (431) and a second heat exchange block (432) connected together. The second heat exchange block (432) is located downstream of the first heat exchange block (431).

7. The domain controller assembly structure according to claim 6, characterized in that, The first heat exchange block (431) and / or the second heat exchange block (432) are configured as heat dissipation fin structures, the bottoms (435) of the first heat exchange block (431) and the second heat exchange block (432) are connected, and the heat dissipation fin structure extends into the liquid cooling heat dissipation channel (413).

8. The domain controller assembly structure according to claim 1, characterized in that, The first mounting area (21) is provided with a first heat exchange structure for heat exchange with the circuit board chip, and the second mounting area (22) is provided with a second heat exchange structure for heat exchange with the circuit board chip.

9. The domain controller assembly structure according to claim 8, characterized in that, The first heat exchange structure and / or the second heat exchange structure include a heat exchange plate (51), one side of which is connected to the housing (1) by an elastic element (52), and heat dissipation adhesive (53) is provided on both sides of the heat exchange plate (51).

10. The domain controller assembly structure according to any one of claims 1 to 9, characterized in that, A waterproof groove (82) is provided on the first mounting area (21) and / or the second mounting area (22); and / or, EMC protective ribs (81) are provided on the first installation area (21) and / or the second installation area (22).

11. The domain controller assembly structure according to any one of claims 1 to 9, characterized in that, The first mounting area (21) and / or the second mounting area (22) are provided with an interface groove (71) communicating with the outside of the housing (1), and the housing (1) is provided with a brim (73) for covering the interface groove (71).

12. The domain controller assembly structure according to claim 2, characterized in that, The first cover (31) and / or the second cover (32) are provided with protrusions (61), which abut against the housing (1); and / or, The first mounting area (21) and the second mounting area (22) are at least partially overlapped; and / or, The assembly structure also includes a reinforcing structure (83) for mounting to the back side of the circuit board.

13. A domain controller assembly method, applicable to the domain controller assembly structure according to any one of claims 1 to 12, wherein the domain controller assembly structure further includes: A first cover (31) for mounting on the first mounting area (21) and a second cover (32) for mounting on the second mounting area (22), wherein the mounting structures of the first cover (31) and the second cover (32) are both provided on the first side (11) of the housing (1) during installation, characterized in that it includes: Insert the second cover (32) into the clamp; The second circuit board (92) is mounted onto the second cover (32); The first side (11) of the housing (1) is positioned facing upwards; Apply adhesive to the second circuit board (92) and the first mounting area (21); The second cover (32) is installed into the second installation area (22) via the installation structure; The first circuit board (91) is installed into the first mounting area (21); The first cover (31) is installed to the first installation area (21) via the installation structure.

14. A domain controller, characterized in that, The domain controller assembly structure according to any one of claims 1 to 12 further includes a first circuit board (91) and a second circuit board (92), wherein the first circuit board (91) is disposed in a first mounting area (21) and the second circuit board (92) is disposed in a second mounting area (22); the projection of the second circuit board (92) and the first circuit board (91) in a first direction at least partially overlaps; wherein the first direction is parallel to the plane in which the first circuit board (91) is located.

15. The domain controller according to claim 14, characterized in that, A grounding spring (63) is provided on the first circuit board (91) and / or the second circuit board (92), and the grounding spring (63) abuts against the housing (1); and / or, The first circuit board (91) and / or the second circuit board (92) are provided with solder points (62) for abutting against the housing (1).

16. A mobile platform, characterized in that, The domain controller described in claim 14 or 15 is provided.

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