Heat dissipation devices, heat dissipation systems and electronic equipment
By employing fins with curved sections and turbulence components in the heat dissipation device, secondary flow and turbulence are generated, breaking the boundary layer and solving the problem of low heat exchange efficiency in traditional microchannels, thus achieving higher heat dissipation efficiency and temperature uniformity.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2026-01-14
- Publication Date
- 2026-04-03
AI Technical Summary
Traditional air cooling and conventional linear smooth microchannels are difficult to further reduce junction temperature and temperature difference under the constraints of given pump power or allowable pressure drop, resulting in difficulty in improving heat exchange efficiency and prominent manufacturing and consistency issues.
The design employs fins and turbulence-inducing components. The fins have curved sections to generate centrifugal force to drive secondary flow, and the turbulence-inducing components are connected to the fins to generate turbulence and eddies, thereby disrupting the boundary layer, enhancing turbulence intensity, and improving the convective heat transfer coefficient.
The synergistic effect of fins and turbulence components enhances boundary layer disruption, improves heat dissipation efficiency, and achieves higher heat transfer performance and temperature uniformity.
Smart Images

Figure CN121531686B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of heat dissipation technology, and in particular to a heat dissipation device, heat dissipation system and electronic device. Background Technology
[0002] In recent years, the rapid development of artificial intelligence training and inference as well as high-performance computing has led to a continuous increase in the power consumption and heat flux density per unit area of electronic devices, with heat load exhibiting characteristics such as large transient fluctuations, more concentrated hot spots, and greater sensitivity to temperature differences.
[0003] While traditional air cooling and conventional linear smooth microchannels have advantages in cost and technological maturity, they are difficult to further reduce junction temperature and temperature difference under the constraints of given pump power or allowable pressure drop, which makes it difficult to improve heat exchange efficiency. Summary of the Invention
[0004] This application provides a heat dissipation device, heat dissipation system, and electronic device to at least solve the problem of low heat exchange efficiency in related technologies.
[0005] This application provides a heat dissipation device, including: a housing, multiple fins, and a flow-dispersing assembly. A receiving cavity is formed inside the housing. Multiple fins extend in a first direction and are spaced apart in the receiving cavity in a second direction orthogonal to the first direction. A flow channel is formed between adjacent fins, and one of the adjacent fins has multiple bends that curve toward or away from the other fin. The flow-dispersing assembly is connected to the two adjacent fins and disposed in the flow channel, adapted to change the flow direction of the cooling medium within the flow channel, causing turbulence and / or eddies in the cooling medium within the flow channel.
[0006] This application also provides a heat dissipation system, including: any of the above-described heat dissipation devices and a driving device. The heat dissipation device forms a heat conduction connection with an external heat-generating device. The driving device is adapted to drive the cooling medium to flow from the inlet to the outlet of the heat dissipation device, so as to remove the heat generated by the heat-generating device through the cooling medium.
[0007] This application also provides an electronic device, including any of the above-mentioned heat dissipation devices.
[0008] This application utilizes fins to guide the cooling medium through continuous deflection. The curved path formed by the fins generates centrifugal force, driving the fluid (i.e., the cooling medium) to produce a secondary flow perpendicular to the main flow direction. The lateral flow of this secondary flow can directly scour the boundary layer, tearing it apart from the side. A turbulence-inducing component is connected to two adjacent fins in the flow channel, generating turbulence and / or eddies as the fluid flows through it. This turbulence transfers energy to the surrounding fluid, increasing the overall turbulence intensity. The turbulence is filled with vortices of various sizes, and the random pulsation of these vortices continuously tears and renews the boundary layer. The synergistic effect of the fins and the turbulence-inducing component enhances the disruption of the boundary layer, allowing more fluid to directly participate in heat exchange, improving the convective heat transfer coefficient of the heat dissipation device, and thus increasing heat dissipation efficiency. Attached Figure Description
[0009] The above and other objects, features and advantages of this disclosure will become clearer from the following description of embodiments with reference to the accompanying drawings, in which:
[0010] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0011] Figure 1 A perspective view of a heat dissipation device provided in an embodiment of this application;
[0012] Figure 2 A perspective view of the interior of a heat dissipation device provided in an embodiment of this application;
[0013] Figure 3 A side view of a heat dissipation device provided in an embodiment of this application;
[0014] Figure 4 for Figure 3 A sectional perspective view of the heat dissipation device AA shown;
[0015] Figure 5 A perspective view of the fins and turbulence assembly of a heat dissipation device provided in an embodiment of this application, viewed from a first perspective;
[0016] Figure 6 A perspective view of the fins and turbulence assembly of a heat dissipation device provided in an embodiment of this application from a second perspective;
[0017] Figure 7 for Figure 6 A magnified view of a portion of region B in the middle;
[0018] Figure 8A top view of a heat dissipation device provided in an embodiment of this application;
[0019] Figure 9 for Figure 8 A magnified view of a portion of region C in the middle;
[0020] Figure 10 A partial perspective view of a heat dissipation device fins and a turbulence-disrupting component provided for an embodiment of this application;
[0021] Figure 11 A side view of the internal structure of a heat dissipation device provided in an embodiment of this application;
[0022] Figure 12 A block diagram of a heat dissipation system provided in an embodiment of this application;
[0023] Figure 13 A block diagram of an electronic device provided in an embodiment of this application.
[0024] The above figures include the following reference numerals:
[0025] 1. Shell; 11. First side plate; 12. Cover plate; 13. Second side plate; 131. Liquid inlet; 132. Liquid outlet; 2. Fin; 3. Fluid turbulence assembly; 31. Fluid turbulence column. Detailed Implementation
[0026] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.
[0027] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.
[0028] In the process of developing this application, it was discovered that the fundamental reason why linear microchannels, under the constraints of given pump power or allowable pressure drop, struggle to further reduce junction temperature and isothermal difference lies in the rapid increase of near-wall velocity and boundary layer, insufficient lateral mixing, and the tendency for flow to re-laminate in the middle and later stages, leading to a decrease in heat transfer enhancement efficiency over time. The boundary layer can be understood as the layer of fluid, such as a cooling medium, that has almost zero velocity when flowing over a solid surface due to its viscosity. Heat transfer from the hot wall to the fluid core needs to pass through this almost zero-velocity fluid film. This film and the fluid region near it where the temperature changes significantly are called the boundary layer.
[0029] While related technologies can improve heat transfer performance under specific conditions, the following problems still exist: First, it is difficult to balance heat exchange and pressure drop, and related technologies are prone to triggering a sharp increase in resistance; Second, temperature uniformity and hot spot suppression are insufficient, and the mixing intensity along the flow path decreases significantly in the middle and later stages, causing the temperature difference at the hot end to rise again; Third, manufacturing and consistency issues are prominent, especially the pitch / phase error, edge burrs and particle deposition caused by the separate forming of microtexture and fins, which may lead to additional pressure drop and reliability risks.
[0030] Therefore, there is an urgent need for a method that, on the one hand, forms a moderate, continuous, and non-excessive disturbance field throughout the entire channel to avoid local resistance peaks at the inlet and re-laminarization in the middle and later sections; on the other hand, it is manufacturable and reproducible under the constraints of commonly used materials (such as copper), common cooling media (such as deionized water, ethylene glycol or propylene glycol aqueous solution), and conventional processing routes (CNC micro-milling, chemical etching and surface treatment) so as to simultaneously achieve enhanced convective heat transfer and temperature homogenization under conditions of equal pressure drop or equal pump work.
[0031] It should be noted that the following heat dissipation device will be based on Figure 2 The general rectangular parallelepiped structure shown is used to illustrate the heat dissipation device, which has a first direction (X direction), a second direction (Y direction), and a third direction (Z direction). The first direction can be understood as the length direction of the heat dissipation device, the second direction as the height direction, and the third direction as the width direction. Unless otherwise specified, the first, second, and third directions of the components can be referred to... Figure 2 As shown.
[0032] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0033] Figure 1 This is a perspective view of a heat dissipation device provided in an embodiment of this application. Figure 2 This is a perspective view of the interior of a heat dissipation device provided in an embodiment of this application.
[0034] Embodiments of this application provide a heat dissipation device, such as... Figure 1 and Figure 2 As shown, the heat dissipation device includes a housing 1, multiple fins 2, and a flow-deflecting assembly 3. A receiving cavity is formed inside the housing 1. Multiple fins 2 extend in a first direction and are spaced apart in the receiving cavity in a second direction (Y direction) orthogonal to the first direction (X direction). A flow channel is formed between adjacent fins 2, and one of the adjacent fins 2 has multiple bends that curve toward or away from the other fin 2. The flow-deflecting assembly 3 is connected to the two adjacent fins 2 and disposed in the flow channel, suitable for changing the flow direction of the cooling medium within the flow channel, causing turbulence and / or eddies in the cooling medium within the flow channel.
[0035] In this implementation, the fins 2 with curved sections guide the cooling medium to continuously change direction. The curved path formed by the curved sections generates centrifugal force, driving the fluid (i.e., the cooling medium) to produce a secondary flow perpendicular to the main flow direction. The lateral flow of the secondary flow can directly scour the boundary layer, tearing it apart from the side. The turbulence-inducing component 3 is connected to two adjacent fins 2 in the flow channel, causing turbulence and / or eddies to be generated when the fluid flows through the turbulence-inducing component. The turbulence transfers energy to the surrounding fluid, increasing the turbulence intensity of the entire flow field. The turbulence is filled with eddies of various sizes, and the random pulsation of the eddies continuously tears and renews the boundary layer. The synergistic effect of the fins and the turbulence-inducing component enhances the disruption of the boundary layer, allowing more fluid to directly participate in heat exchange, improving the convective heat transfer coefficient of the heat dissipation device, and achieving improved heat dissipation efficiency.
[0036] As an example, the cooling medium may include any of the liquid cooling media such as deionized water, ethylene glycol, or an aqueous solution of propylene glycol. Alternatively, the cooling medium may also include a two-phase cooling medium such as a fluorinated liquid. Or, the cooling medium may include a gaseous cooling medium such as air.
[0037] As an example, the fin 2 includes a plurality of consecutively arranged curved portions, with adjacent curved portions bending in opposite directions; that is, one curved portion bends toward another fin adjacent to the fin 2, and the other curved portion bends away from the other fin. Thus, in a projection onto a plane formed by the first and second directions along a third direction perpendicular to both the first and second directions, the projected shape of the fin 2 can be any one or a combination of shapes such as approximately wavy, approximately zigzag, approximately trapezoidal waveform, and irregular curve.
[0038] It should be noted that a general wave shape refers to a structure exhibiting periodic or rhythmic undulations, meaning alternating peaks and troughs. However, the wave shape does not require a perfect arc; peaks can be sharp, flat, or irregular. Furthermore, the period and amplitude of each wave do not need to be consistent; variations in size and width are permissible. Correspondingly, general zigzag, zigzag, and trapezoidal waveforms can be understood in the same way as general wave shapes, and will not be elaborated upon further here.
[0039] Alternatively, the fin 2 may include alternating straight sections and curved sections along a first direction, with adjacent straight sections and curved sections smoothly connected. The straight sections extend along the first direction, and the curved sections protrude along a second direction relative to one side of the straight sections; that is, the curved sections may bend toward or away from another fin 2 adjacent to the fin 2. In a projection onto a third direction perpendicular to both the first and second directions, the projected shape of the protrusion may be any shape among approximately an arc, approximately a trapezoid, approximately a triangle, approximately a cross-section, etc., within a plane formed by the first and second directions.
[0040] According to embodiments of this application, such as Figure 1 and Figure 2 As shown, the housing 1 includes a base plate 11, a cover plate 12, and an annular portion 13. The cover plate 12 and the base plate 11 are disposed opposite to each other. The annular portion 13 is disposed between the cover plate 12 and the base plate 11 to define a receiving cavity with the base plate 11 and the cover plate 12. In the first direction, the two opposite sidewalls of the annular portion 13 respectively form a liquid inlet 131 and a liquid outlet 132. The cooling medium flows in from the liquid inlet 131, exchanges heat with the fins 2, the base plate 11, the turbulence assembly 3, and the cover plate 12 through the flow channel, and then flows out through the liquid outlet 132.
[0041] It is understandable that the direction from the inlet 131 to the outlet 132 is the approximate flow direction of the cooling medium, which is the first direction. It is also understandable that, due to the guiding effect of the fins 2, the flow direction of the cooling medium is not strictly a straight line. The flow direction of the cooling medium referred to here is the overall flow direction of the cooling medium, that is, from the inlet 131 to the outlet 132, not the flow direction of a specific area of the cooling medium. Therefore, the inlet 131 and the outlet 132 are located on the side plate extending along the second direction of the annular portion 13.
[0042] In some alternative embodiments, the inlet 131 and the outlet 132 may also be provided on two sidewalls facing each other in the second direction of the annular portion 13.
[0043] In some other illustrative embodiments, the inlet 131 and the outlet 132 may be formed on the cover plate and located at opposite ends of the receiving cavity. It is understood that the embodiments of this application are not limited thereto; the arrangement of the inlet 131 and the outlet 132 is sufficient to allow the cooling medium to flow into the receiving cavity from the inlet 131 and flow out from the outlet 132 after being guided by the fins.
[0044] In this embodiment, an independent receiving cavity is formed by the base plate 11, the cover plate 12 and the annular portion 13, ensuring that the cooling medium is confined within the preset flow channel. The liquid inlet and liquid outlet are set on the opposite side walls of the annular portion, forming a through flow path, which helps to push the cooling medium to flow more evenly through the flow channels between all fins, reduces flow dead zones, ensures that heat can be continuously and effectively removed, and improves the temperature distribution uniformity of the entire heat dissipation device.
[0045] According to an embodiment of this application, the cross-sectional area of the inlet 131 is configured to be larger than the cross-sectional area of the outlet 132. The larger inlet 131 allows the cooling medium to flow into the receiving cavity more smoothly and evenly, reducing the impact and turbulence when the cooling medium flows into the receiving cavity, and reducing the local resistance loss of the cooling medium at the inlet 131, allowing the cooling medium to enter the flow channel more smoothly. The smaller outlet 132 can increase the flow rate of the cooling medium exiting the outlet 132, thereby allowing the cooled medium to carry away heat more quickly after heat exchange, improving the heat dissipation efficiency of the heat dissipation device.
[0046] As an example, the material of the housing 1 may include materials with good thermal conductivity, such as copper or aluminum alloy.
[0047] As an example, the sidewalls of the inlet 131 and outlet 132 are spaced apart from the fins 2. The cooling medium flows into the space from the inlet 131, undergoes pressure balancing and flow pre-distribution within the space formed by the space, and then flows evenly into each independent flow channel formed by the fins 2. This avoids the problem of uneven flow distribution caused by the inlet being directly aligned with a flow channel, ensuring that even the outermost flow channels receive sufficient cooling medium, thereby eliminating heat exchange dead zones and allowing every part of the radiator to function effectively.
[0048] As an example, the cross-section of the front end of the fin 2 along the flow direction of the cooling medium can be an arc-shaped structure, which can guide the cooling medium to flow smoothly into the flow channel and reduce the pressure loss at the inlet of the flow channel.
[0049] Figure 3 This is a side view of a heat dissipation device provided in an embodiment of this application. Figure 4 for Figure 3 The diagram shows a sectional perspective view of the heat dissipation device AA.
[0050] In some embodiments of this application, such as Figure 3 and Figure 4 As shown, the inlet 131 and outlet 132 can be configured as rectangular openings extending along the second direction, with semi-circular rounded corners at both ends to reduce stress concentration. Both the inlet 131 and outlet 132 are located at the center of the second direction to avoid uneven distribution of the cooling medium in the second direction.
[0051] In some embodiments of this application, the cover plate 12 and the bottom plate 11 are disposed opposite to each other, and the annular portion 13 is disposed at the edge of the cover plate 12 and the bottom plate 11 and is connected with the cover plate 12 and the bottom plate 11 to form the housing 1. The shape of the cover plate 12, the bottom plate 11 and the annular portion 13 can be configured as a rectangle with rounded corners, thereby forming rounded corners at the connection of the side plates of the annular portion 13 in different directions to reduce stress concentration.
[0052] In the process of developing this application, it was discovered that the cooling medium, passing through a flow channel, forms a laminar flow within the channel. Laminar flow can be understood as a flow state in which fluid particles move along clear, smooth streamlines, parallel to each other without mixing. The fluid exhibits stratified sliding characteristics, with heat exchange between layers occurring solely through the thermal motion of molecules. Therefore, laminar flow has low heat transfer efficiency. Furthermore, as the cooling medium flows along the flow channel, a boundary layer is generated and thickens. The boundary layer can be understood as the layer of fluid, such as the cooling medium, adhering almost to a solid surface, having a near-zero velocity due to the fluid's viscosity. Heat transfer from the hot wall to the fluid core must pass through this near-zero velocity fluid film. This film and the fluid region near it where the temperature changes significantly are called the boundary layer. It is understandable that the presence of the boundary layer hinders heat transfer, and as the cooling medium flows along the flow channel, the boundary layer gradually thickens, thus causing the heat transfer efficiency to gradually decrease as the cooling medium flows along the flow channel.
[0053] According to an embodiment of this application, two adjacent fins 2 are parallel and configured to guide the cooling medium to generate periodic flow direction deflection in at least a portion of the path of the flow channel.
[0054] In this embodiment, two adjacent fins 2 are parallel, forming a curved, equidistant flow channel between them. The curved fins 2 guide the cooling medium along the curved path, thereby causing periodic flow direction deflection. Whenever the fluid flows along the fin 2 wall through a trough or crest, its flow direction is changed by the fins 2. Due to centrifugal force, the higher-velocity main fluid is thrown to the outside of the channel, spontaneously generating one or more pairs of rotating vortices within the channel cross-section, which can be called secondary flow vortices. Since the direction of the secondary flow vortices is perpendicular to the main flow direction, it can provide lateral mixing force to disrupt the originally ordered laminar structure of the cooling medium, enhancing heat exchange between different velocity layers within the fluid. Furthermore, since the curved fins 2 extend from the inlet 131 to the outlet 132, they can provide continuous guiding force, thereby periodically generating secondary flow vortices and preventing subsequent re-lamination. The vortex continuously draws the cooler cooling medium from the center of the flow channel towards the hotter fin surface, disrupting the boundary layer and preventing its thickening. This mitigates the gradual decline in heat transfer efficiency along the flow channel. The vortex also mixes the hotter and colder cooling media, improving heat exchange efficiency and making the temperature of the cooling medium more uniform throughout the flow channel, preventing uneven temperature distribution and localized overheating. Therefore, the curved fin design 2 improves the heat transfer coefficient, reduces the gradual decline in heat transfer efficiency along the flow channel, and prevents localized overheating within the flow channel.
[0055] According to an embodiment of this application, at least a portion of the projection of the fin 2 in a third direction perpendicular to the first and second directions may include a general sine curve.
[0056] It should be noted that a general sine curve refers to at least a portion of fin 2 exhibiting periodic or rhythmic undulations, i.e., alternating peaks and troughs. However, the shape of the curve is not required to be a perfect sine curve. Peaks can be sharp, flat, or irregular. Nor is it required that all periods and amplitudes of the curve be completely consistent. Variations in size and width are allowed.
[0057] In this embodiment, the sine curve is a smooth curve with continuously varying curvature and no sharp angles. As the cooling medium flows along the guide of fin 2, the change in the direction of the cooling medium is gradual and gentle. Compared to a polygonal or other waveforms with abrupt angles, the sine waveform can achieve the same degree of fluid diversion and mixing with less pressure loss (i.e., lower flow resistance), resulting in higher heat transfer efficiency while lower pump energy consumption, thus maximizing the energy efficiency ratio.
[0058] Furthermore, the sinusoidally curved flow channel generates a highly regular secondary flow. This vortex structure is stable and predictable, enabling continuous and effective transport of the low-temperature fluid from the main flow center to the surface of fin 2, while simultaneously carrying away the high-temperature fluid near the wall. This ordered convection mixing results in less energy loss and better heat transfer compared to random, chaotic turbulence.
[0059] Figure 5 A perspective view of the fins and airflow turbulence assembly of a heat dissipation device provided in an embodiment of this application, viewed from a first perspective. Figure 6 A perspective view from a second angle of a heat dissipation device fins and a turbulence-disrupting assembly provided in an embodiment of this application. Figure 7 for Figure 6 A magnified view of a portion of region B in the middle.
[0060] According to embodiments of this application, such as Figures 5-7 As shown, the projection of the turbulence component 3 in the third direction is periodically arranged, and the crests and / or troughs of the turbulence component 3 are misaligned with the crests and / or troughs of the fin 2.
[0061] In this embodiment, with the base plate 11 as the projection surface and a third direction as the projection direction, the projections of the turbulence-disrupting components 3 are arranged periodically. This allows the turbulence-disrupting components 3 to generate turbulence and / or eddies within the flow channel. These turbulence and / or eddies further disrupt the laminar flow state and boundary layer of the original cooling medium. Therefore, the periodic arrangement of the turbulence-disrupting components 3 can generate periodic turbulence and / or eddies, which can prevent the re-lamination of the cooling medium and the thickening of the boundary layer. The re-lamination of the cooling medium can be understood as the disruption of laminar flow and the generation of turbulence after passing through the crests or troughs of the fins 2. As the fluid continues to flow, the turbulence consumes energy and decays, gradually returning to a laminar state. At this time, the turbulence and / or eddies generated by the turbulence-disrupting components 3, which are misaligned with the crests and / or troughs of the fins 2, disturb the cooling medium, thereby disrupting the re-lamination. Similarly, after passing through the crests or troughs of fin 2, the boundary layer also thickens with the flow of the cooling medium. At this time, the turbulence and / or eddies generated by the turbulence component 3, which is misaligned with the crests and / or troughs of fin 2, disturb the cooling medium, thereby disrupting the thickening of the boundary layer.
[0062] Understandably, the staggered arrangement of the crests and / or troughs of the turbulence-inducing component 3 with those of the fins 2 allows the turbulence and / or vortices generated by the turbulence-inducing component 3 to coordinate with the secondary flow vortices generated by the fins 2. The fins 2 can disrupt laminar flow and the boundary layer at their crests or troughs. Between crests and troughs, the re-lamination of the cooling medium and the thickening of the boundary layer are significant. Placing the turbulence-inducing component 3 at this location, which generates turbulence and / or vortices, prevents re-lamination and boundary layer thickening. The two work together to periodically disrupt laminar flow and the boundary layer, mitigating the decline in heat transfer efficiency with distance to some extent. Furthermore, the turbulence and / or vortices generated by the turbulence-inducing component 3 also mix the higher and lower temperature cooling media together, improving heat exchange efficiency and making the temperature of the cooling medium more uniform throughout the flow channel.
[0063] Figure 8 This is a top view of a heat dissipation device provided in an embodiment of this application. Figure 9 for Figure 8 A magnified view of a portion of region C in the middle. Figure 10 This is a partial perspective view of a heat dissipation device fin and a turbulence-disrupting component provided in an embodiment of this application.
[0064] According to embodiments of this application, such as Figures 2 to 10 As shown, the turbulence assembly 3 includes multiple turbulence columns 31. One end of each turbulence column 31 is connected to one of the two adjacent fins 2, and the other end extends obliquely to the other of the two adjacent fins 2. The connection position of the turbulence column 31 to the fin 2 is offset from the crest and / or trough of the fin 2.
[0065] The extension direction of the turbulence column can form a first angle θ with the second direction.
[0066] In equidistant channels, fluid flow characteristics evolve periodically: at crests and troughs, due to strong centrifugal force and adverse pressure gradient effects, turbulence generation and boundary layer separation reach their peak, and the fluid is in a highly disturbed, high-energy state. However, as the fluid enters the subsequent gentle transition zone, the curvature effect diminishes, and the kinetic energy of the previously generated turbulent vortices decreases sharply due to viscous dissipation, causing the fluid to exhibit a relamination tendency. Simultaneously, the boundary layer thickens rapidly due to the stabilizing flow, forming a bottleneck region for heat transfer efficiency. By misaligning the connection point of the turbulence column with the crest or trough and placing it within this bottleneck region, secondary disturbances are introduced precisely at the critical juncture of turbulence intensity decay and boundary layer regeneration. This actively excites fluid flow and inhibits boundary layer recovery and thickening, thereby achieving continuous and periodic enhancement of the convective heat transfer coefficient with minimal additional pressure loss.
[0067] In some embodiments of this application, it can be understood that the first included angle θ can be an acute angle.
[0068] As an example, the first included angle θ can be any value among 20°, 25°, 30°, 35°, 45°, 50°, 55°, 60°, 65°, and 70°.
[0069] The spoiler can be a rod-shaped or columnar structure. The cross-section of the spoiler can be any of the following: circular, polygonal, etc.
[0070] Figure 11 This is a side view of the internal structure of a heat dissipation device provided in an embodiment of this application.
[0071] According to embodiments of this application, such as Figure 11 As shown, the extension direction of the turbulence column 31 forms a second angle α with the plane formed by the first direction and the second direction.
[0072] According to an embodiment of this application, the second included angle α is an acute angle. As an example, the angle range of the second included angle α can be greater than or equal to 25° and less than or equal to 75°. That is, 75° ≥ α ≥ 25°. For example, the second included angle α can be any value among 25°, 30°, 35°, 45°, 50°, 55°, 60°, 65°, 70°, and 75°.
[0073] In this embodiment, the turbulence column 31 generates disturbances not only in the second and first directions but also in a third direction, thereby causing flow and mixing in the third direction and forming a three-dimensional, spiral-shaped complex turbulence. This spiral motion generates a powerful longitudinal vortex. Unlike the transverse wake vortex, the axis of the longitudinal vortex is roughly along the mainstream direction, drawing down the low-temperature core fluid above the flow channel and directly scouring the high-temperature base plate and fin surface. At the same time, it lifts up the heated fluid near the fins and throws it into the mainstream region, making it almost impossible for the boundary layer to adhere and thicken stably, thus reducing thermal resistance.
[0074] In such an embodiment, the turbulence column 31 is tilted relative to the first direction, the second direction and the third direction.
[0075] According to embodiments of this application, adjacent turbulence columns in a set of winding assemblies may be connected or may not be connected.
[0076] According to embodiments of this application, such as Figure 10 and Figure 11 As shown, multiple sets of flow-disrupting components 3 are arranged sequentially along the third direction in each flow channel, and the flow-disrupting columns 31 of adjacent sets of flow-disrupting components 3 are connected to each other.
[0077] The longitudinal vortex generated by a single turbulence column may gradually decay due to viscous dissipation as it develops downstream. By connecting the turbulence columns 31 of two adjacent sets of turbulence components 3, the vortex generated by the previous turbulence column can be immediately re-excited and replenished by the next connected turbulence column before the vortex has completely decayed. This forms a continuous turbulence-generating ridge or vortex-enhancing chain, enabling the entire helical flow field structure to exist stably with greater intensity and over a longer distance.
[0078] According to embodiments of this application, such as Figure 10 and Figure 11 As shown, the projections of multiple sets of turbulence-inducing components 3 in the third direction are periodically arranged. This allows for continuous guidance and disturbance through the turbulence columns, preventing the cooling medium from reverting to a laminar flow state and continuously disrupting the boundary layer, thus avoiding its thickening and addressing to some extent the problem of heat transfer efficiency decreasing with the flow of the cooling medium. Furthermore, this regular arrangement of the turbulence-inducing components 3, compared to disordered components, results in more uniform and gentle disturbance and guidance of the cooling medium. This avoids the problem of excessive energy consumption and pressure drop in one area due to excessive guidance and disturbance in another area, leading to low local heat transfer efficiency and uneven temperature distribution, which can occur with disordered components. Therefore, orderly guidance and disturbance of the cooling medium in all directions are achieved, ensuring that the overall cooling medium maintains a uniform and high heat transfer efficiency.
[0079] In some embodiments of this application, such as Figure 8 As shown, the projections of multiple flow-dispersing components 3 along a third direction onto the plane of the base plate form a roughly rhomboid mesh arrangement. At this time, the guidance and disturbances generated by each flow-dispersing column 31 are closer together, making the guidance and disturbances received by each local area more consistent, thereby improving the overall uniformity of heat dissipation of the cooling medium.
[0080] In some embodiments of this application, when the cooling medium comes into contact with the turbulence column 31, the base plate 11, the cover plate 12, and the fins 2, especially at the junction of the turbulence column 31, the base plate 11, the cover plate 12, and the fins 2, turbulence, eddies, horseshoe vortices, and other vortices are generated. These vortices are generated in different directions and at different locations, preventing the cooling medium from returning to a laminar flow state, and continuously disrupting the generation and thickening of the boundary layer, promoting internal mixing of the cooling medium, improving heat transfer efficiency, avoiding heat transfer efficiency decay over distance, and improving the uniformity of heat dissipation by the cooling medium.
[0081] According to embodiments of this application, such as Figure 9 As shown, the period of the turbulence component 3 is equal to the period λ of the fin 2.
[0082] According to the embodiments of this application, four adjacent spoiler columns in the spoiler assembly can form a cycle, two adjacent spoiler columns form half a cycle P, and the cycle of the spoiler assembly 3 is equal to the cycle λ of the fin 2, that is, λ=2P.
[0083] As an example, the period length of the spoiler component 3 and the period λ of the fin 2 can both be configured to be greater than or equal to 3.9 mm and less than or equal to 4.1 mm. That is, 3.9 mm ≤ λ ≤ 4.1 mm.
[0084] For example, the period λ of fin 2 can be configured to any value among 3.9mm, 3.95mm, 4.0mm, 4.05mm or 4.1mm.
[0085] In this implementation, the perturbation component 3 can apply an effective perturbation once within one waveform cycle of each hydrodynamic unit, i.e., the fin 2. This avoids excessive perturbation in some areas and insufficient perturbation in others, achieving globally optimized synergistic heat transfer enhancement.
[0086] In other illustrative embodiments, the period of the aerodynamic component 3 is not equal to the period λ of the fin 2. For example, the period λ of the fin 2 can be twice the period of the aerodynamic component 3, i.e., λ = 4P. It should be understood that the embodiments of this disclosure are not limited thereto. For example, the period λ of the fin 2 can be half the period of the aerodynamic component 3, i.e., λ = P.
[0087] According to embodiments of this application, such as Figure 9 As shown, the amplitude A of the sine curve formed by the fins can be configured to be greater than or equal to 0.45 mm and less than or equal to 0.55 mm. That is, 0.45 mm ≤ A ≤ 0.55 mm.
[0088] For example, the amplitude A can be configured to any value among 0.45mm, 0.46mm, 0.47mm, 0.48mm, 0.49mm, 0.50mm, 0.51mm, 0.52mm, 0.53mm, 0.54mm, and 0.55mm.
[0089] In this way, the fins can have high heat transfer efficiency while ensuring that the fins have sufficient rigidity and durability. This avoids excessive local impact due to excessive amplitude and insufficient thrust on the fluid due to insufficient amplitude, which may prevent the formation of an effective three-dimensional spiral flow and reduce the heat transfer effect. This achieves a balance between heat transfer intensity, flow resistance and structural reliability.
[0090] According to embodiments of this application, such as Figure 9As shown, the spacing W between two adjacent fins 2 is configured to be greater than or equal to 1.57 mm and less than or equal to 1.63 mm. That is, 1.57 mm ≤ W ≤ 1.63 mm.
[0091] For example, the spacing W between two adjacent fins 2 can be configured to any value among 1.57mm, 1.58mm, 1.59mm, 1.60mm, 1.61mm, 1.62mm and 1.63mm.
[0092] In this way, sufficient heat exchange intensity can be guaranteed while the pressure drop is controlled within an acceptable range. This avoids the fluid velocity from decreasing due to an excessively wide flow channel (i.e., excessively large spacing W) and the convective heat transfer coefficient from decreasing due to an excessively narrow flow channel (i.e., excessively small spacing W). This avoids the fluid velocity from increasing dramatically due to an excessively narrow flow channel (i.e., excessively small spacing W). Although heat exchange is enhanced, the flow resistance (pressure drop) will increase exponentially or even higher, leading to a sharp increase in pump power and a deterioration in energy efficiency ratio.
[0093] According to embodiments of this application, such as Figure 9 As shown, the thickness t of each fin 2 is configured to be greater than or equal to 0.37 mm and less than or equal to 0.43 mm. That is, 0.37 mm ≤ t ≤ 0.43 mm.
[0094] For example, the thickness t of each fin 2 can be configured to any value among 0.37mm, 0.38mm, 0.39mm, 0.40mm, 0.41mm, 0.42mm and 0.43mm.
[0095] In this way, it can be ensured that the fins themselves have high thermal conductivity without taking up too much space in the flow channel. This avoids the thermal resistance of the fins being too thin, which would increase the temperature difference between the root and top of the fins and reduce the material utilization rate. It also avoids the fins being too thick, which would increase the weight and material cost of the heat dissipation device.
[0096] According to embodiments of this application, such as Figure 10 As shown, the height H of each fin 2 is configured to be greater than or equal to 1.85 mm and less than or equal to 1.95 mm. 1.85 mm ≤ H ≤ 1.95 mm.
[0097] For example, the height H of each fin 2 can be configured to any value among 1.85mm, 1.86mm, 1.87mm, 1.88mm, 1.89mm, 1.90mm, 1.91mm, 1.92mm, 1.93mm, 1.94mm, and 1.95mm.
[0098] Within a given volume, increasing the fin height is the most direct way to increase the heat dissipation area. However, higher is not always better. Excessive height can lead to a decrease in heat transfer efficiency at the fin tip due to the thickening of the boundary layer, and may also cause structural strength and vibration problems. Limiting the fin height to between 1.85mm and 1.95mm can ensure that the fins have good structural rigidity and a better effective heat transfer area.
[0099] As an example, the connection between the fin 2 and the base plate 11 is formed with a fillet, the diameter of which is configured to be greater than or equal to 0.15 mm and less than or equal to 0.25 mm to reduce fluid retention. Furthermore, the connection between the fin 2 and the cover plate 12 can also be formed with a fillet to further reduce fluid retention.
[0100] As an example, the diameter of the transition fillet can be configured to any value among 0.15mm, 0.2mm, and 0.25mm.
[0101] In related technologies, as the cooling medium flows along the flow channel, it exchanges heat with structures such as the base plate 11 and fins 2. It is understood that the heat exchange efficiency is related to the temperature difference between the two heat exchange entities. As the flow rate increases, the overall temperature of the cooling medium rises. However, as the temperature of the cooling medium rises, the temperature difference gradually decreases, resulting in a gradual decrease in heat exchange efficiency.
[0102] According to an embodiment of this application, along the flow direction of the cooling medium, the fin 2 includes an inlet section and a heat dissipation section arranged sequentially, wherein the amplitude of the inlet section is smaller than the amplitude of the heat dissipation section.
[0103] According to embodiments of this disclosure, the inlet segment and the heat dissipation segment are smoothly connected. The projection of the inlet segment in a third direction may include a sine curve, and the projection of the heat dissipation segment in a third direction may also include a sine curve.
[0104] When the cooling medium first enters the flow channel, its flow state is unstable. If it immediately encounters a large-amplitude, severe bend, it will generate huge local resistance losses (i.e., impact losses), forming an inlet effect bottleneck. A small-amplitude inlet section can smoothly guide the fluid with less energy loss and gradually adapt it to the bend of the flow channel, reducing the initial pressure drop of the entire heat dissipation device and playing a role in flow rectification. This makes the fluid velocity distribution more uniform as it enters the subsequent core heat dissipation section, creating ideal prerequisites for the subsequent turbulence components and fins 2 to achieve maximum efficiency.
[0105] After the fluid is sufficiently accelerated and guided by the inlet section, it enters the heat dissipation section with a larger amplitude. At this point, the fluid has enough kinetic energy to overcome the stronger resistance caused by the more severe bending. The large amplitude design generates the strongest centrifugal force and secondary flow here, inducing the most powerful longitudinal vortex, thereby pushing the heat transfer efficiency to its peak.
[0106] According to an embodiment of this application, the period of the inlet section is greater than the period of the heat dissipation section.
[0107] A longer period implies a longer wavelength and a gentler curvature change. The fluid encounters fewer turns at the inlet, resulting in smoother flow changes, which helps suppress flow separation and violent turbulent pulsations, thus minimizing energy loss caused by abrupt flow adjustments. The gentler inlet section guides the fluid gently, allowing it to accelerate gradually with minimal pressure loss. As the fluid leaves the inlet section, it not only has a more uniform velocity distribution but also retains more kinetic energy, ensuring sufficient energy preparation for the high-intensity heat transfer in the next stage (the heat dissipation section).
[0108] In the heat dissipation section, the high-frequency bending leaves the fluid with almost no chance to return to a stable state, and the boundary layer is repeatedly torn and thinned under the centrifugal force of each turn. This high-frequency, uninterrupted impact ensures that the heat transfer intensity remains at a high level throughout the entire heat dissipation section.
[0109] In this implementation, the amplitude of the heat dissipation section is larger and / or the period is smaller, which makes the heat dissipation section have a stronger guiding and disturbance effect on the cooling medium, and further improves the heat dissipation efficiency of the heat dissipation section.
[0110] In some embodiments of this application, the fins 2 can be sequentially divided into multiple heat dissipation sections along the flow direction of the cooling medium. Along the flow direction of the cooling medium, the amplitude of the multiple heat dissipation sections gradually increases, and / or the period gradually decreases. Therefore, the amplitude of the fins 2 gradually increases and / or the period gradually decreases as the cooling medium flows within the channel, resulting in a more uniform and stable heat exchange efficiency.
[0111] Accordingly, the period of the turbulence component 3 is gradually reduced as the cooling medium flows in the channel, which further improves the stability of heat exchange efficiency with the flow path, and makes the period of the turbulence component 3 more compatible with the period of the fins 2, so as to synergistically adjust the heat exchange efficiency of the cooling medium.
[0112] In some illustrative embodiments, the fin 2 further includes an outlet section along the flow direction of the cooling medium. The outlet section is located on the side of the heat dissipation section opposite to the inlet end. The amplitude of the outlet section is smaller than the amplitude of the heat dissipation section. And / or, the period of the outlet section is greater than the period of the heat dissipation section.
[0113] Thus, after the fluid passes through the high-intensity disturbance of the heat dissipation section, although the heat is effectively removed, the flow state becomes extremely complex, filled with numerous vortices and turbulent pulsations—this part represents the disordered portion of kinetic energy. If discharged directly, this disordered kinetic energy would be completely dissipated, resulting in a huge outlet pressure loss. The outlet section, by reducing the amplitude and / or increasing the period, essentially provides a smooth deceleration bump for the fluid, guiding it from violent spiral motion to a relatively flat state. This converts some of the disordered turbulent kinetic energy back into ordered pressure energy, reducing the total pressure drop at the outlet and allowing the cooling medium to flow out in a more gentle manner.
[0114] According to an embodiment of this application, at least one surface of the fin 2 facing the flow channel is provided with a plurality of protrusions (not shown in the figure), and the plurality of protrusions are arranged in a scale-like manner along the flow direction of the cooling medium.
[0115] In this embodiment, the protrusions on the surface of the fin 2 facing the flow channel make the surface of the fin 2 facing the flow channel uneven, thereby guiding the cooling medium on the surface of the fin 2 facing the flow channel toward the middle of the flow channel, thereby reducing the thickness of the boundary layer and improving the heat exchange efficiency.
[0116] In some embodiments of this application, the protrusions on the fins 2 can be located at positions other than the connection between the turbulence column 31 and the fins 2. It is understood that the boundary layer is thinner at the connection between the fins 2 and the turbulence column 31, and the refluxing tendency is not obvious, while the boundary layer is thicker at other locations, and the refluxing tendency is obvious. Protrusions located at other locations with thicker boundary layers and obvious refluxing tendencies can prevent the thickening of the boundary layer of the cooling medium and the refluxing tendency at other locations, resulting in smaller differences in heat transfer efficiency and more uniform heat transfer across different locations.
[0117] According to an embodiment of this application, the extension direction of the protrusion forms a third angle with the second direction (not shown in the figure). Along the flow direction, two adjacent protrusions overlap, which can be referenced as fish scales, to form a continuous curved surface on the surface of the fin 2 that guides the smooth flow of the cooling medium.
[0118] The third included angle can be a small acute angle, for example, the third included angle can be greater than or equal to 5° and less than or equal to 30°. For example, the third included angle can be any value among 5°, 10°, 15°, 20°, 25° and 30°.
[0119] In this implementation, the side of the protrusion facing the cooling medium has a certain included angle, further enhancing the guiding effect on the cooling medium and preventing the cooling medium from directly impacting the protrusion, thus avoiding unnecessary energy loss and pressure drop. Along the flow direction, two adjacent protrusions overlap to form a continuous curved surface on the surface of the fin 2 that guides the smooth flow of the cooling medium. This allows the cooling medium to flow along a smooth, continuous curved surface, suppressing the boundary layer while reducing the flow resistance of the cooling medium, thereby avoiding pressure drop caused by energy dissipation.
[0120] In some embodiments of this application, each protrusion is generally rectangular in shape, with its front end fixed to the surface of fin 2 and its rear end suspended. Adjacent protrusions partially overlap in the flow direction, forming a fish-scale-like covering structure. This structure can effectively guide the cooling medium to flow smoothly, reduce flow separation and eddy current generation, thereby reducing flow resistance while increasing the heat exchange area.
[0121] According to embodiments of this application, the length of the protrusion is configured to be greater than or equal to 0.02 mm and less than or equal to 0.1 mm. For example, the length of the protrusion can be any value among 0.02 mm, 0.03 mm, 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, or 0.1 mm.
[0122] As an example, rounded corners can be used to create a continuous curved surface for the protrusion. The diameter of the rounded corner can be configured to be greater than or equal to 0.01 mm and less than or equal to 0.05 mm. For example, the diameter of the rounded corner can be any value among 0.01 mm, 0.02 mm, 0.03 mm, 0.04 mm, and 0.05 mm.
[0123] Understandably, such a size setting can meet the standard capabilities of computer numerical control (CNC) micromilling or chemical etching techniques.
[0124] This application also provides a method for manufacturing any of the above-mentioned heat dissipation devices, the method comprising: manufacturing a base plate 11; and machining the fins 2 and the airflow deflector 3 and / or protrusions on the base plate 11.
[0125] Among them, the pitch and tolerance of fin 2 and spoiler assembly 3 are controlled within ±0.05mm, and the positioning error of node and segment boundary is controlled within ±0.10mm.
[0126] This implementation method ensures the repeatability and accuracy of the turbulence structure, thereby guaranteeing heat exchange efficiency. Through the above design and processing methods, the cold plate liquid cooling system of this embodiment can efficiently reduce equipment temperature and provide stable heat dissipation performance, making it particularly suitable for high-heat-load applications such as high-performance computing and data centers.
[0127] As an example, heat dissipation devices can be manufactured using additive manufacturing technologies (AM), also known as 3D printing (3DP).
[0128] Figure 12 A block diagram of a heat dissipation system provided in an embodiment of this application.
[0129] This application also provides a heat dissipation system, such as Figure 12 As shown, the heat dissipation system includes any of the above-mentioned heat dissipation devices and a driving device. The heat dissipation device forms a heat conduction connection with the external heat-generating device. The driving device is suitable for driving the cooling medium to flow from the inlet to the outlet of the heat dissipation device (e.g., ...). Figure 12 (As indicated by the middle arrow), so that the heat generated by electrons can be removed through the cooling medium.
[0130] As an example, a heat-generating device may include electronic components, which may be components with high power consumption and large heat generation that require special heat dissipation measures to maintain normal operation, such as at least one of a central processing unit (CPU), a graphics processing unit (GPU), a memory module (RAM), and other heat-generating devices.
[0131] The heating surface of the heating element can be directly and tightly fitted to the contact surface of the heat dissipation element. For example, pressure can be applied using screws, clips, or other fasteners to make the heating element fit against the heat dissipation element.
[0132] Thermal grease, thermal pads, etc. can also be placed between the contact surfaces of the external heating device and the heat dissipation device (e.g., the surface of the base plate facing away from the receiving cavity) to increase the actual contact area between the heating device and the heat dissipation device and reduce thermal resistance.
[0133] The drive unit may include a circulating pump.
[0134] Other features of this implementation have become apparent in the above embodiments and will not be repeated here.
[0135] Figure 13 A block diagram of an electronic device provided in an embodiment of this application.
[0136] This application also provides an electronic device, such as Figure 13 As shown, the electronic device includes any of the above-described heat dissipation devices. Other features of this embodiment have become apparent in the above embodiments and will not be repeated here.
[0137] The above provides a detailed description of a heat dissipation device, heat dissipation system, and electronic device provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.
Claims
1. A heat dissipation device, characterized in that, include: The shell has an internal cavity for receiving the contents; Multiple fins extend in a first direction and are spaced apart in the receiving cavity in a second direction orthogonal to the first direction. A flow channel is formed between two adjacent fins among the multiple fins. One of the two adjacent fins has multiple curved portions that bend toward or away from the other fin. A flow-disrupting component, connected to two adjacent fins and disposed in the flow channel, is used to change the flow direction of the cooling medium within the flow channel, causing turbulence and / or eddies in the cooling medium within the flow channel; the flow-disrupting component includes: Multiple baffles, one end of each baffle is connected to one of two adjacent fins, and the other end extends to the other of the two adjacent fins in a direction forming a first angle with the second direction. The extension direction of the baffle forms a second angle with the plane formed by the first direction and the second direction. The connection position of the baffle to the fin is offset from the crest and / or trough of the fin. Multiple sets of the flow-disrupting components are arranged sequentially along the third direction within each flow channel, and the flow-disrupting columns of adjacent sets of the flow-disrupting components are connected to each other.
2. The heat dissipation device according to claim 1, characterized in that, The two adjacent fins are parallel and configured to guide the cooling medium to produce a periodic flow deflection.
3. The heat dissipation device according to claim 2, characterized in that, At least a portion of the projection of the fin in a third direction perpendicular to the first and second directions is a sine curve, the amplitude of which is configured to be greater than or equal to 0.45 mm and less than or equal to 0.55 mm.
4. The heat dissipation device according to claim 3, characterized in that, The projection of the turbulence components in the third direction is periodically arranged, and the crests and / or troughs of the turbulence components are misaligned with the crests and / or troughs of the fins.
5. The heat dissipation device according to claim 1, characterized in that, The projections of the multiple sets of the aforementioned turbulence components in the third direction are arranged periodically.
6. The heat dissipation device according to claim 4, characterized in that, The period of the aerodynamic component is equal to the period of the fin, and the length of the period of the aerodynamic component is configured to be between 3.9 mm and 4.1 mm.
7. The heat dissipation device according to claim 6, characterized in that, Along the flow direction of the cooling medium, the fins include an inlet section and a heat dissipation section arranged sequentially, wherein the amplitude of the inlet section is smaller than the amplitude of the heat dissipation section, and / or the period of the inlet section is greater than the period of the heat dissipation section.
8. The heat dissipation device according to any one of claims 1 to 7, characterized in that, The spacing between two adjacent fins is configured to be greater than or equal to 1.57 mm and less than or equal to 1.63 mm; And / or, the thickness of each fin is configured to be greater than or equal to 0.37 mm and less than or equal to 0.43 mm; And / or, the height of each fin is configured to be greater than or equal to 1.85 mm and less than or equal to 1.95 mm.
9. The heat dissipation device according to any one of claims 1 to 7, characterized in that, The fins have at least one surface facing the flow channel with a plurality of protrusions arranged in a scale-like pattern along the flow direction of the cooling medium.
10. The heat dissipation device according to claim 9, characterized in that, The extension direction of the protrusion forms a third angle with the second direction. Along the flow direction, two adjacent protrusions overlap to form a continuous curved surface on the fin surface that guides the smooth flow of the cooling medium.
11. The heat dissipation device according to any one of claims 1 to 7, characterized in that, The housing includes: Base plate; A cover plate is disposed opposite to the base plate; An annular portion is disposed between the cover plate and the bottom plate to define the receiving cavity with the bottom plate and the cover plate; In the first direction, the two opposite sidewalls of the annular portion form an inlet and an outlet, respectively. The cooling medium flows in from the inlet, exchanges heat with the fins through the flow channel, and then flows out through the outlet.
12. A heat dissipation system, characterized in that, include: The heat dissipation device as described in any one of claims 1-11, wherein the heat dissipation device forms a heat conduction connection with an external heat-generating device; A driving device is suitable for driving the cooling medium to flow from the inlet to the outlet of the heat dissipation device, so as to remove the heat generated by the heat-generating device through the cooling medium.
13. An electronic device, characterized in that, include: The heat dissipation device as described in any one of claims 1-11.
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