Display device

Abstract

Embodiments of the present disclosure may provide a display device including: a base substrate including a display area and a non-display area; a planarization layer disposed on the base substrate; a bank disposed on the planarization layer; a touch buffer layer disposed on a portion of the bank and a portion of the planarization layer; a touch sensing portion disposed on the touch buffer layer; and a protective layer covering the touch sensing portion on the touch buffer layer.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2024-0107434, filed on August 12, 2024, which is incorporated herein by reference for all purposes, as if fully set forth herein. Technical Field

[0003] Embodiments of this disclosure relate to a display device. Background Technology

[0004] The advent of the information age has spurred the rapid development of the field of displays that visually display electrical information signals, as well as the steady research into developing compact, lightweight, and low-power displays while improving display performance.

[0005] Representative display devices include liquid crystal displays (LCDs), field emission displays (FEDs), electrowetting displays (EWDs), and organic light-emitting displays (OLEDs).

[0006] Unlike LCDs, self-emissive organic light-emitting displays (OLEDs) do not require a separate light source and can be manufactured in a thin and lightweight form. Furthermore, OLEDs not only have advantages in power consumption due to their low-voltage operation, but also offer excellent color reproduction, response speed, viewing angle, and contrast ratio (CR), making them promising for applications in various fields. Summary of the Invention

[0007] Embodiments of this disclosure may provide a display device capable of preventing corrosion of the lines used to assess the reliability of product drive (because tetramethylammonium hydroxide (TMAH) does not remain on the surface of the embankment located in the bending region).

[0008] Embodiments of this disclosure can provide a display device in which the position of a neutral plane formed in a curved region can be easily adjusted by forming a concave curved surface pattern on the surface of a substrate located in a curved region.

[0009] Embodiments of this disclosure can provide a display device that can prevent cracks from forming in the display panel during bending by forming a metal layer and an inorganic material layer that are not disposed in the bending region.

[0010] Embodiments of this disclosure may provide a display device, comprising: a substrate including a display area and a non-display area; a planarization layer disposed on the substrate; a dam disposed on the planarization layer; a touch buffer layer disposed on a portion of the dam and a portion of the planarization layer; a touch sensing portion disposed on the touch buffer layer; and a protective layer covering the touch sensing portion on the touch buffer layer.

[0011] According to embodiments of this disclosure, a display device can be provided that can prevent corrosion of the lines used to assess the reliability of product drive (because tetramethylammonium hydroxide (TMAH) does not remain on the surface of the embankment located in the bending region).

[0012] According to embodiments of the present disclosure, a display device can be provided in which the position of a neutral plane formed in a curved region is easily adjusted by forming a concave curved surface pattern on the surface of a substrate located in a curved region.

[0013] According to embodiments of the present disclosure, a display device can be provided that can prevent cracks from forming in the display panel during bending by forming a metal layer and an inorganic material layer that are not disposed in the bending region.

[0014] According to embodiments of this disclosure, a lightweight display device can be provided by removing the metal layer and inorganic material layer disposed in the curved region. Attached Figure Description

[0015] The above and other objects, features and advantages of this disclosure will become clearer from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0016] Figure 1 This is a view illustrating the configuration of a display device according to an embodiment of the present disclosure;

[0017] Figure 2 This is a view showing a display panel according to an embodiment of the present disclosure;

[0018] Figure 3 This is a plan view showing a display panel according to an embodiment of the present disclosure;

[0019] Figure 4 It is along Figure 3 A cross-sectional view taken from line A-A';

[0020] Figure 5 It is along Figure 3 A cross-sectional view taken from line B-B';

[0021] Figure 6 It is along Figure 3 A cross-sectional view taken from line C-C';

[0022] Figures 7 to 9 This is a cross-sectional view showing a display panel according to another embodiment of the present disclosure;

[0023] Figure 10 This is a view illustrating the process steps for manufacturing a display device according to embodiments of the present disclosure; and

[0024] Figure 11This is a view illustrating the process steps for manufacturing a display device according to another embodiment of the present disclosure. Detailed Implementation

[0025] In the following, embodiments of the present disclosure are described in detail with reference to the accompanying drawings. When assigning reference numerals to components in the various drawings, the same components may be assigned the same reference numerals, even if they are shown in different drawings. Details of known techniques or functions may be omitted when they obscure the subject matter of the present disclosure. As used herein, when a component “comprises” another component, “has” another component, or “consist of” another component, other components may be added to the component unless the component “only” includes, has, or constitutes that other component. As used herein, the singular forms “a” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0026] Designations such as “first,” “second,” “A,” “B,” “(a),” and “(b)” may be used to describe components of this disclosure. These designations are provided only to distinguish one component from another, and the nature, order, or number of components is not limited by the designations.

[0027] When describing the positional relationship between components, if two or more components are described as "connected," "joined," or "linked," the two or more components may be directly "connected," "joined," or "linked," or another component may be interposed between them. Here, the other component may be included in one or more of the two or more components that are "connected," "joined," or "linked" to each other.

[0028] When terms such as “after,” “next,” “following,” and “before” are used to describe time-flow relationships related to components, operating methods, and manufacturing methods, discontinuous relationships may be included unless the terms “immediately” or “directly” are used.

[0029] When a component is specified with a value or its corresponding information (e.g., level), that value or corresponding information can be interpreted to include tolerances that may be caused by various factors (e.g., process factors, internal or external shocks or noise).

[0030] Various embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

[0031] Figure 1 This is a view showing the configuration of a display device according to an embodiment of the present disclosure. Figure 2 This is a view showing a display panel according to an embodiment of the present disclosure.

[0032] Reference Figure 1 and Figure 2The display device 100 for displaying images may include a display panel 10 and a display driving circuit for driving the display panel 10.

[0033] The display panel 10 may include a display area AA for displaying images and a non-display area NA for not displaying images. The non-display area NA may be the outer area of ​​the display area AA, or it may be a border area. All or part of the non-display area NA may be an area visible from the front surface of the display device 100, or it may be a curved area that is not visible from the front surface of the display device 100.

[0034] The display panel 10 may include a plurality of sub-pixels SP. The display panel 10 may also include various types of signal lines to drive the plurality of sub-pixels SP. For example, various types of signal lines may include multiple data lines DL that transmit data signals (also referred to as data voltages or image signals) and multiple gate lines GL that transmit gate signals (also referred to as scan signals), but embodiments of this disclosure are not limited thereto.

[0035] Multiple data lines DL and multiple gate lines GL can intersect each other. Each of the multiple data lines DL can be configured to extend in a first direction. Each of the multiple gate lines GL can be configured to extend in a second direction. The first direction can be a column direction, and the second direction can be a row direction.

[0036] The display device 100 according to embodiments of the present disclosure may be a liquid crystal display device or a self-emissive display device with a self-emissive display panel 10. When the display device 100 according to embodiments of the present disclosure is a self-emissive display device, each of the plurality of sub-pixels SP may include a light-emitting element ED and a pixel driving circuit SPC for driving the light-emitting element ED.

[0037] The pixel driving circuit SPC may include a driving transistor DRT, a scanning transistor SCT, and a storage capacitor Cst.

[0038] The driving transistor DRT controls the current flowing to the light-emitting element ED to drive it. The scanning transistor SCT transmits the data voltage Vdata to the second node N2, which serves as the gate node of the driving transistor DRT. The storage capacitor Cst can be configured to maintain the voltage for a predetermined period of time.

[0039] The light-emitting element ED may include a first electrode AE, a second electrode CE, and a light-emitting layer 170 located between the first electrode AE ​​and the second electrode CE. The first electrode AE ​​may be a pixel electrode associated with the formation of the light-emitting element ED for each sub-pixel SP. The first electrode AE ​​may be electrically connected to a first node N1 of the driving transistor DRT. The second electrode CE may be a common electrode associated with the formation of the light-emitting elements ED for all sub-pixels SP. A base voltage EVSS may be applied to the second electrode CE.

[0040] For example, the light-emitting element ED can be an organic light-emitting diode (OLED), an inorganic light-emitting diode (LED), or a quantum dot light-emitting element that is a self-emissive semiconductor crystal, but the embodiments disclosed herein are not limited thereto.

[0041] The driving transistor DRT is a transistor used to drive the light-emitting element ED, and may include a first node N1, a second node N2, and a third node N3. The first node N1 can be a source node or a drain node, and can be electrically connected to the first electrode AE ​​of the light-emitting element ED. The second node N2 is a gate node and can be electrically connected to the source node or the drain node of the scanning transistor SCT. The third node N3 can be a drain node or a source node, and can be electrically connected to the driving voltage line DVL supplying the driving voltage EVDD. For ease of description, in the examples described below, the first node N1 can be a source node and the third node N3 can be a drain node, but the embodiments of this disclosure are not limited thereto.

[0042] The scan transistor SCT can switch the connection between the data line DL and the second node N2 of the drive transistor DRT. In response to the scan signal SCAN supplied from the scan line SCL, which is one of the gate lines GL, the scan transistor SCT can control the connection between the second node N2 of the drive transistor DRT and the corresponding data line DL among the multiple data lines DL.

[0043] The storage capacitor Cst can be configured between the first node N1 and the second node N2 of the driving transistor DRT.

[0044] Figure 2 The structure of the sub-pixel SP shown is an example for description and may further include one or more transistors or one or more storage capacitors, but the embodiments of this disclosure are not limited thereto. Multiple sub-pixels SP may have the same structure, or a subset of sub-pixels in multiple sub-pixels SP may have different structures. Each of the driving transistor DRT and the scanning transistor SCT can be an n-type transistor or a p-type transistor. One of the driving transistor DRT and the scanning transistor SCT may include one of an oxide semiconductor layer, a polycrystalline silicon semiconductor layer, and a low-temperature polycrystalline silicon semiconductor layer, but the embodiments of this disclosure are not limited thereto.

[0045] The display driving circuit may include a data driving circuit 20, a gate driving circuit 30, and a display controller 40.

[0046] The data driving circuit 20 can be a circuit used to drive multiple data lines DL. The data driving circuit 20 can output data signals to the multiple data lines DL. The gate driving circuit 30 can be a circuit used to drive multiple gate lines GL. The gate driving circuit 30 can supply gate signals to the multiple gate lines GL.

[0047] The display controller 40 can be a device used to control the data driving circuit 20 and the gate driving circuit 30. The display controller 40 can control the driving timing of multiple data lines DL and the driving timing of multiple gate lines GL.

[0048] The display controller 40 can supply data drive control signals to the data drive circuit 20 to control the data drive circuit 20, and can supply gate drive control signals to the gate drive circuit 30 to control the gate drive circuit 30.

[0049] The data driving circuit 20 can supply data signals to multiple data lines DL according to the driving timing control of the display controller 40. The data driving circuit 20 can receive digital image data from the display controller 40, and can convert the received image data into analog data signals and output them to multiple data lines DL.

[0050] The gate driving circuit 30 can supply gate signals to multiple gate lines GL according to the timing control of the display controller 40. The gate driving circuit 30 can receive a first gate voltage corresponding to the on-level voltage and a second gate voltage corresponding to the off-level voltage, as well as various gate driving control signals (e.g., start signal and reset signal) to generate gate signals, and supply the generated gate signals to the multiple gate lines GL.

[0051] The gate driving circuit 30 can be connected to the display panel 10 via the TAB method, or to the bonding pads of the display panel 10 via the COG or COP method, or it can be connected to the display panel 10 via the COF method. Alternatively, the gate driving circuit 30 can be formed in the non-display area NA of the display panel 10 as a gate in panel (GIP) type.

[0052] The gate drive circuit 30 may be disposed on or connected to the substrate, but the embodiments disclosed herein are not limited thereto. For example, a GIP-type gate drive circuit 30 may be disposed in the non-display area NA of the substrate. A chip-on-glass (COG) type or chip-on-film (COF) type gate drive circuit 30 may be connected to the substrate.

[0053] At least one of the data driving circuit 20 and the gate driving circuit 30 may be disposed in the display area AA of the display panel 10. For example, at least one of the data driving circuit 20 and the gate driving circuit 30 may be configured not to overlap with the sub-pixel SP or to overlap with all or part of the sub-pixel SP, but the embodiments of this disclosure are not limited thereto.

[0054] The data driving circuit 20 can be connected to one side of the display panel 10 (e.g., the top or bottom side). Depending on the driving scheme or panel design, the data driving circuit 20 can be connected to two or more of the four sides of the display panel 10 (e.g., the top and bottom sides), but the embodiments of this disclosure are not limited thereto.

[0055] The gate driving circuit 30 can be connected to one side of the display panel 10 (e.g., the left or right side). Depending on the driving scheme or panel design, the gate driving circuit 30 can be connected to two or more of the four sides of the display panel 10 (e.g., the left and right sides), but the embodiments of this disclosure are not limited thereto.

[0056] The display controller 40 may be implemented as a component separate from the data driving circuit 20, or the display controller 140 and the data driving circuit 20 may be integrated into an integrated circuit (IC), but the embodiments of this disclosure are not limited thereto.

[0057] The display controller 40 may be a timing display controller used in typical display technologies, a controller capable of performing other control functions and the functions of a timing display controller, or a controller other than a timing controller, or it may be a circuit within a controller. The display controller 40 may be implemented as various circuits or electronic components, such as integrated circuits (ICs), field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), or processors, but the embodiments disclosed herein are not limited thereto.

[0058] The display controller 40 can be mounted on a printed circuit board or flexible printed circuit and can be electrically connected to the data drive circuit 20 and the gate drive circuit 30 via the printed circuit board or flexible printed circuit.

[0059] The display controller 40 can send / receive signals to / from the data drive circuit 20 according to one or more predetermined interfaces. The interfaces may include, for example, a low-voltage differential signaling (LVDS) interface, an EPI interface, and a serial peripheral (SP) interface, but embodiments of this disclosure are not limited thereto.

[0060] To provide touch sensing and image display functions, the display device 100 according to embodiments of the present disclosure may include a touch panel TP and a touch sensing circuit 50. The touch sensing circuit 50 senses the touch panel TP to detect whether a touch object (e.g., a finger or a pen) is touching, or the location of the touch. The touch panel TP may be a touch portion, but embodiments of the present disclosure are not limited thereto.

[0061] The touch panel TP may include multiple touch electrodes TE as touch sensors. The touch panel TP may be located outside or inside the display panel 10. When the touch panel TP is located outside the display panel 10, it is referred to as an external type. When the touch panel TP is external, the touch panel TP and the display panel 10 may be manufactured separately or combined during the assembly process. When the touch panel TP is located inside the display panel 10, it is referred to as an internal type. When the touch panel TP is internal, it may be formed within the display panel 10 during the manufacturing process of the display panel 10. For example, the touch panel TP may be disposed on the encapsulation layer ENCAP within the display panel 10.

[0062] The touch sensing circuit 50 may include a touch driving circuit 60 and a touch controller 70. The touch driving circuit 60 drives and senses the touch panel TP and generates and outputs touch sensing data. The touch controller 70 can use the touch sensing data to detect the occurrence of a touch or the location of the touch.

[0063] The touch driving circuit 60 can supply a touch driving signal to at least one of the plurality of touch electrodes TE, and can sense at least one of the plurality of touch electrodes TE to generate touch sensing data.

[0064] The touch sensing circuit 50 can perform touch sensing using either a self-capacitance sensing scheme or a mutual capacitance sensing scheme.

[0065] When the touch sensing circuit 50 performs touch sensing using a self-capacitance sensing scheme, the touch sensing circuit 50 can perform touch sensing based on the capacitance between each touch electrode and the touch object (e.g., a finger or a pen).

[0066] According to the self-capacitance sensing scheme, each of the plurality of touch electrodes can be used both as a driving touch electrode and as a sensing touch electrode. The touch driving circuit 60 can drive all or some of the plurality of touch electrodes and sense all or some of the plurality of touch electrodes.

[0067] When the touch sensing circuit 50 performs touch sensing using a mutual capacitance sensing scheme, the touch sensing circuit 50 can perform touch sensing based on the capacitance between the touch electrodes.

[0068] According to the mutual capacitance sensing scheme, the multiple touch electrodes may include driving touch electrodes and sensing touch electrodes. The touch driving circuit 60 can drive the driving touch electrode and sense the sensing touch electrode.

[0069] The touch driver circuit 60 and touch controller 70 included in the touch sensing circuit 50 can be implemented as separate devices or as a single device. The touch driver circuit 60 and data driver circuit 20 can be implemented as separate devices or as a single device.

[0070] Figure 3 This is a plan view showing a display panel according to an embodiment of the present disclosure.

[0071] Reference Figure 3 The display panel 10 may include a non-display area NA disposed outside the display area AA, and the non-display area NA may include a curved area BA disposed on one side of the display area AA. The curved area BA may be an area of ​​the substrate 110 that can be bent.

[0072] The touch panel TP may include a first touch electrode TE1 and a second touch electrode TE2. The presence and location of a touch can be sensed in the display area AA through the first touch electrode TE1 and the second touch electrode TE2.

[0073] The touch panel TP may also include multiple touch traces TL for electrically connecting multiple touch electrodes TE, touch driver pads TDP, and touch sensing pads TSP. In this embodiment, the touch traces TL may include sensing traces SRL, driving traces DRL, touch sensing lines TSL, and touch driver lines TDL. For example, the touch sensing lines TSL and touch driver lines TDL may be configured to cross each other on the touch buffer layer 140.

[0074] The touch sensing line TSL may include a plurality of first touch electrodes TE1 and a first bridging electrode BE1 electrically connecting the plurality of first touch electrodes TE1. The plurality of first touch electrodes TE1 may be spaced apart from each other at regular intervals along one direction on the touch buffer layer 140. Each of the plurality of first touch electrodes TE1 may be electrically connected to an adjacent first touch electrode TE1 through the first bridging electrode BE1.

[0075] The first bridging electrode BE1 can be formed on the touch buffer layer 140. For example, the first bridging electrode BE1 can be exposed through a touch contact hole TCH that penetrates the insulating layer located between the first touch electrode TE1 and the first bridging electrode BE1 to be electrically connected to the first touch electrode TE1.

[0076] The touch driving line TDL may include a plurality of second touch electrodes TE2 and a second bridging electrode BE2 electrically connecting the plurality of second touch electrodes TE2. The plurality of second touch electrodes TE2 may be spaced apart from each other at regular intervals along a direction intersecting the touch sensing line TSL. For example, each of the plurality of second touch electrodes TE2 may be electrically connected to an adjacent second touch electrode TE2 via the second bridging electrode BE2.

[0077] The second bridging electrode BE2 can be disposed on the same plane as the second touch electrode TE2 to be electrically connected to the second touch electrode TE2 without a separate contact hole.

[0078] The touch driver line TDL can be electrically connected to the touch driver circuit 60 via the driver wiring DRL and the touch driver pad TDP. Additionally, the touch sensing line TSL can be electrically connected to the touch driver circuit 60 via the sensing wiring SRL and the touch sensing pad TSP.

[0079] The drive wiring DRL can be electrically connected to the second touch electrode TE2 through the first wiring contact hole LH1, or it can be directly connected to the second touch electrode TE2. The drive wiring DRL can transmit the touch drive pulses supplied through the touch drive pad TDP to the touch drive line TDL. The sensing wiring SRL can be electrically connected to the first touch electrode TE1 through the second wiring contact hole LH2, or it can be directly connected to the first touch electrode TE1. The sensing wiring SRL can transmit the touch signal detected from the touch sensing line TSL to the touch sensing pad TSP.

[0080] The first touch electrode TE1 and the second touch electrode TE2, as well as the drive wiring DRL and the sensing wiring SRL, can be formed as a single layer or multiple layers of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or an alloy of the aforementioned metals.

[0081] Figure 4 It is along Figure 3 A cross-sectional view taken from line A-A'. Figure 5 It is along Figure 3 The cross-sectional view taken by line B-B'.

[0082] Figure 4 This is a view showing the portion of the non-display area NA where touch wiring TL is located. Figure 5 This is a view showing the portion of the non-display area NA where touch wiring TL is not set.

[0083] Reference Figures 4 to 5The non-display area NA of the display device 100 may include a substrate 110, a planarization layer 120, a dam 130, a touch buffer layer 140, a touch sensing unit 150, and a protective layer 160.

[0084] The substrate 110 is used to support various components of the display device 100 and can be formed of an insulating material such as a glass substrate or a plastic substrate. Although the substrate 110 is shown as a single layer in this embodiment, the substrate 110 can be formed of multiple layers.

[0085] The substrate 110 may have a concave curved surface pattern formed on one surface facing the planarization layer 120. For example, the concave curved surface pattern may be formed in the region overlapping with the curved region BA, and the concave hemispherical patterns may be arranged adjacent to each other.

[0086] As described above, when a concave curved surface pattern is formed on the substrate 110, the position of the neutral plane formed in the bending region BA can be easily adjusted. Therefore, when the neutral plane is set in the bending region BA where no metal layer and inorganic material layer are provided, cracks can be prevented from forming in the display panel 10 during bending.

[0087] Multiple buffer layers 111 for blocking moisture and oxygen introduced therein can be disposed on the substrate 110. For example, the buffer layers 111 may include a first buffer layer 11, a second buffer layer 12, a third buffer layer 13, and a fourth buffer layer 14. The buffer layers 111 may be made of materials such as silicon nitride (SiN). x ), silicon oxide (SiO) x Inorganic materials such as silicon nitride oxide (SiON) and aluminum oxide (Al2O3) are formed, but the embodiments disclosed herein are not limited thereto.

[0088] The buffer layer 111 may not overlap with the curved region BA. In other words, the buffer layer 111 may not be provided in the curved region BA. In one embodiment, the buffer layer 111 in the curved region BA may be removed to form a concave curved surface pattern. This is because including an inorganic material buffer layer 111 in the curved region BA makes bending the display device 100 challenging and poses a risk of crack formation in the buffer layer 111.

[0089] The planarization layer 120 is used to planarize the upper portion of the substrate 110 and can be disposed on the buffer layer 111 and the substrate 110. For example, the planarization layer 120 can be formed of an organic material such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin. In one embodiment, the planarization layer 120 can fill a concave curved surface pattern formed in the buffer layer 111.

[0090] The planarization layer 120 may include multiple layers. For example, the planarization layer 120 may include a first planarization layer 121 and a second planarization layer 122 disposed on the first planarization layer 121. A connecting line 170 may be disposed between the first planarization layer 121 and the second planarization layer 122, which will be described in detail below.

[0091] The dam 130 is used to separate pixels and can be disposed on the planarization layer 120. The dam 130 may include a plurality of openings 131 in the non-display area NA. For example, the openings 131 in the non-display area NA may be configured not to overlap with the curved area BA. Specifically, the openings 131 may be disposed on opposite sides if the curved area BA is located therebetween.

[0092] Touch buffer layer 140 may be disposed on a portion of embankment 130 and a portion of planarization layer 120. For example, touch buffer layer 140 may be configured not to overlap with bending region BA, and may be made of material such as silicon nitride (SiN). x ), silicon oxide (SiO) x Inorganic materials such as silicon nitride oxide (SiON) or aluminum oxide (Al2O3) are formed.

[0093] The touch sensing unit 150 may be disposed on the touch buffer layer 140. For example, the touch sensing unit 150 may include a touch electrode TE disposed on the touch buffer layer 140 and a touch wiring TL disposed on the touch buffer layer 140 and electrically connected to the touch electrode TE.

[0094] The width of the touch sensing portion 150 can be formed to be smaller than the width of the touch buffer layer 140, thereby exposing a portion of the outer edge of the touch buffer layer 140. This is because when the width of the touch sensing portion 150 is formed to be larger than the width of the touch buffer layer 140, the end of the touch sensing portion 150 protrudes into the bending region BA, which can cause cracks or moisture to seep into the interior when bending is performed.

[0095] Simultaneously, since the touch buffer layer 140 is configured not to overlap with the curved region BA, the touch sensing unit 150 can also not overlap with the curved region BA. In other words, the touch sensing unit 150 may not be provided in the curved region BA. As described above, since the touch sensing unit 150 is disconnected in the curved region BA, a connecting line 170 may be needed for electrically connecting the disconnected portion. For example, the connecting line 170 may be provided in the non-display area NA and may be inserted between the first planarization layer 121 and the second planarization layer 122. In this case, in order to make the touch sensing unit 150 and the connecting line 170 contact each other, the planarization layer 120 and the touch buffer layer 140 may include contact holes located in the portion that does not overlap with the curved region BA.

[0096] The portion of the connecting line 170 located outside the curved region BA (i.e., in the region adjacent to the touch drive pad TDP) is recessed towards the first planarization layer 121 to form a step 171, and the second planarization layer 122 may cover a portion of the step 171. Furthermore, the touch sensing portion 150 may extend from the embankment 130 to the step 171, and its lower surface may contact the connecting line 170. In other words, a portion of the second planarization layer 122 may protrude along the direction in which the first planarization layer 121 is located and be disposed between the outer surface of the touch sensing portion 150 and the step 171 of the connecting line 170.

[0097] Therefore, when a portion of the connecting line 170 is recessed towards the first planarization layer 121 to form a step 171, the area of ​​the touch sensing portion 150 disposed in the step 171 can be increased to enhance touch sensitivity. Furthermore, since the second planarization layer 122 is disposed between the outer surface of the touch sensing portion 150 and the step 171 of the connecting line 170, it can block moisture that may be introduced into the connecting line 170 to enhance moisture resistance.

[0098] The touch buffer layer 140 may not overlap with the curved region BA. In other words, the touch buffer layer 140 may not be disposed in the curved region BA. This is because disposing of the inorganic touch buffer layer 140 in the curved region BA makes bending the display device 100 challenging and carries the risk of cracking in the inorganic touch buffer layer 140.

[0099] The protective layer 160 can cover the touch sensing part 150 on the touch buffer layer 140 to protect the underlying touch sensing part 150 from moisture, oxygen and impact. As described above, since the protective layer 160 is disposed on the touch buffer layer 140, the protective layer 160 can also be like the touch buffer layer 140 and not overlap with the bending area BA.

[0100] The protective layer 160 can be formed from organic materials such as acrylic resin, epoxy resin, phenolic resin, polyamide resin and polyimide resin.

[0101] The end of the protective layer 160 can be configured not to extend beyond the end of the touch buffer layer 140. For example, if the end of the protective layer 160, formed of an organic material, extends beyond the end of the touch buffer layer 140, the protective layer 160 may overlap with the bending region BA, thereby thickening the display panel 10 in the bending region BA and making bending difficult. Therefore, in this embodiment, the end of the protective layer 160 does not extend beyond the end of the touch buffer layer 140, thereby facilitating the bending of the display panel 10. For example, the lower end of the protective layer 160 can be arranged parallel to the upper end of the touch buffer layer 140. The arrangement of the protective layer 160 is not limited to this example; the width of the protective layer 160 can be formed to be smaller than the width of the touch buffer layer 140, thereby exposing a portion of the edge of the touch buffer layer 140. In this case, the width of the protective layer 160 can be greater than the width of the touch sensing portion 150 and smaller than the width of the touch buffer layer 140.

[0102] Figure 6 It is along Figure 3 The cross-sectional view taken from line C-C'.

[0103] Figure 6 The portion of the non-display area NA where the touch sensor 150 is not located is shown, and reference is made to... Figure 6 The non-display area NA of the display device 100 may include a substrate 110, a planarization layer 120, a dam 130, a touch buffer layer 140, a touch sensing unit 150, and a protective layer 160.

[0104] The substrate 110 may have a concave curved surface pattern formed on one surface facing the planarization layer 120. For example, the concave curved surface pattern may be formed in the region overlapping with the curved region BA, and the concave hemispherical patterns may be arranged adjacent to each other.

[0105] Multiple buffer layers 111 for blocking moisture and oxygen introduced therein can be disposed on the substrate 110. For example, the buffer layers 111 may include a first buffer layer 11, a second buffer layer 12, a third buffer layer 13, and a fourth buffer layer 14. The buffer layers 111 may be made of materials such as silicon nitride (SiN). x ), silicon oxide (SiO) x Inorganic materials such as silicon nitride oxide (SiON) and aluminum oxide (Al2O3) are formed, but the embodiments disclosed herein are not limited thereto.

[0106] The first gate line 181 can be disposed on the first buffer layer 11, and the first gate line 181 can be covered by the second buffer layer 12. The second gate line 182 can be disposed on the second buffer layer 12, and the second gate line 182 can be covered by the third buffer layer 13. The third gate line 183 can be disposed on the third buffer layer 13, and the third gate line 183 can be covered by the fourth buffer layer 14. Here, the first gate line 181 to the third gate line 183 can be electrically connected to signal lines respectively.

[0107] The source-drain line 184 for supplying power can be disposed on the fourth buffer layer 14. In this case, in order to electrically connect the source-drain line 184 to the first gate line 181 to the third gate line 183, contact holes can be formed in the second buffer layer 12, the third buffer layer 13 and the fourth buffer layer 14.

[0108] The planarization layer 120 is used to planarize the upper part of the substrate 110 and can be disposed on the substrate 110, the fourth buffer layer 14 and the first gate line 181. For example, the planarization layer 120 can be formed of organic materials such as acrylic resin, epoxy resin, phenolic resin, polyamide resin and polyimide resin.

[0109] The planarization layer 120 may include a first planarization layer 121 and a second planarization layer 122 disposed on the first planarization layer 121. A connection line 170 may be disposed between the first planarization layer 121 and the second planarization layer 122, and the connection line 170 may be electrically connected to the source-drain line 184 through a contact hole formed in the first planarization layer 121.

[0110] The embankment 130 is used to separate pixels and can be set on the planarization layer 120.

[0111] The touch buffer layer 140 may be disposed on a portion of the embankment 130. For example, the touch buffer layer 140 may be configured not to overlap with the bending region BA, and may be made of materials such as silicon nitride (SiN). x ), silicon oxide (SiO) x Inorganic materials consisting of silicon nitride oxide (SiON) and aluminum oxide (Al2O3) are formed.

[0112] The touch sensing unit 150 may be disposed on the touch buffer layer 140. For example, the touch sensing unit 150 may include a touch electrode TE disposed on the touch buffer layer 140 and a touch wiring TL disposed on the touch buffer layer 140 and electrically connected to the touch electrode TE.

[0113] The protective layer 160 can cover the touch sensing part 150 on the touch buffer layer 140 to protect the underlying touch sensing part 150 from moisture, oxygen and impact. As described above, since the protective layer 160 is disposed on the touch buffer layer 140, the protective layer 160 can also be like the touch buffer layer 140 and not overlap with the bending area BA.

[0114] Figures 7 to 9 This is a cross-sectional view showing a display device according to another embodiment.

[0115] Figure 7 This is a view showing the portion of the non-display area NA where touch wiring TL is located. Figure 8 This is a view showing the portion of the non-display area NA where touch wiring TL is not configured. Figure 9 This is a view showing the portion of the non-display area NA where the touch sensor 150 is not located. In this embodiment, the description focuses primarily on the differences from the embodiments described above.

[0116] Reference Figures 7 to 9 The non-display area NA of the display device may include a substrate 110, a planarization layer 120, a dam 130, a touch buffer layer 140, a touch sensing unit 150, and a protective layer 160.

[0117] The substrate 110 may have a concave curved surface pattern formed on one surface facing the planarization layer 120. For example, the concave curved surface pattern may be formed in the region overlapping with the curved region BA, and the concave hemispherical patterns may be arranged adjacent to each other.

[0118] Multiple buffer layers 111 for blocking moisture and oxygen introduced therein can be disposed on the substrate 110. For example, the buffer layers 111 may include a first buffer layer 11, a second buffer layer 12, a third buffer layer 13, a fourth buffer layer 14, and a fifth buffer layer 15. The buffer layers 111 may be made of materials such as silicon nitride (SiN). x ), silicon oxide (SiO) x Inorganic materials such as silicon nitride oxide (SiON) and aluminum oxide (Al2O3) are formed, but the embodiments disclosed herein are not limited thereto.

[0119] The first gate line 181 can be disposed on the first buffer layer 11, and the first gate line 181 can be covered by the second buffer layer 12. The second gate line 182 can be disposed on the second buffer layer 12, and the second gate line 182 can be covered by the third buffer layer 13. The third gate line 183 can be disposed on the third buffer layer 13, and the third gate line 183 can be covered by the fourth buffer layer 14. Here, the first gate line 181 to the third gate line 183 can be electrically connected to signal lines respectively.

[0120] The source-drain line 184 for supplying power can be disposed on the fourth buffer layer 14. In this case, in order to electrically connect the source-drain line 184 to the first gate line 181 to the third gate line 183, contact holes can be formed in the second buffer layer 12, the third buffer layer 13, and the fourth buffer layer 14. Furthermore, the source-drain line 184 can be covered by the fifth buffer layer 15.

[0121] With the above Figures 4 to 6 Compared to the previous embodiment, this embodiment may further include a fifth buffer layer 15 covering the source-drain line 184. As described above, by further including the fifth buffer layer 15, moisture that may be introduced into the source-drain line 184 can be blocked, thereby enhancing moisture resistance.

[0122] The planarization layer 120 is used to planarize the upper part of the substrate 110 and can be disposed on the substrate 110 and the fifth buffer layer 15. For example, the planarization layer 120 can be formed of organic materials such as acrylic resin, epoxy resin, phenolic resin, polyamide resin and polyimide resin.

[0123] The planarization layer 120 may include a first planarization layer 121 and a second planarization layer 122 disposed on the first planarization layer 121. A connection line 170 may be disposed between the first planarization layer 121 and the second planarization layer 122, and the connection line 170 may be electrically connected to the source-drain line 184 through contact holes formed in the first planarization layer 121 and the fifth buffer layer 15.

[0124] The embankment 130 is used to separate pixels and can be set on the planarization layer 120.

[0125] The touch buffer layer 140 may be disposed on a portion of the embankment 130. For example, the touch buffer layer 140 may be configured not to overlap with the bending region BA, and may be made of materials such as silicon nitride (SiN). x ), silicon oxide (SiO) x Inorganic materials consisting of silicon nitride oxide (SiON) and aluminum oxide (Al2O3) are formed.

[0126] The touch sensing unit 150 may be disposed on the touch buffer layer 140. For example, the touch sensing unit 150 may include a touch electrode TE disposed on the touch buffer layer 140 and a touch wiring TL disposed on the touch buffer layer 140 and electrically connected to the touch electrode TE.

[0127] The touch sensing unit 150 can contact and be electrically connected to the connection line 170 disposed below it through a contact hole formed in the second planarization layer 122. The touch sensing unit 150 may not be formed outside the curved region BA (i.e., in the region where the touch drive pad TDP is disposed).

[0128] The protective layer 160 can cover the touch sensing part 150 on the touch buffer layer 140 to protect the underlying touch sensing part 150 from moisture, oxygen and impact. As described above, since the protective layer 160 is disposed on the touch buffer layer 140, the protective layer 160 can also be like the touch buffer layer 140 and not overlap with the bending area BA.

[0129] Figure 10 This is a view illustrating the process steps for manufacturing a display device according to an embodiment of the present disclosure. (Refer to...) Figure 7 The manufacturing process of the display device is illustrated below.

[0130] Reference Figure 10 A planarization layer 120, a touch buffer layer 140, and a touch sensing unit 150 are sequentially stacked on a substrate 110. Then, an etching process is performed to pattern the touch sensing unit 150.

[0131] After patterning the touch sensing unit 150, a protective layer 160 is deposited on the touch sensing unit 150 using a deposition mask. The protective layer 160 formed as described above can be disposed in the non-display area NA, excluding the curved area BA.

[0132] Subsequently, the touch buffer layer 140 located in the curved region BA is removed by dry etching or wet etching. Then, the lower end of the protective layer 160 can be disposed parallel to the upper end of the touch buffer layer 140.

[0133] As described above, since the touch buffer layer 140 located in the curved region BA is removed in the final step, tetramethylammonium hydroxide (TMAH) will not remain on the surface of the embankment 130 exposed to the curved region BA.

[0134] In other words, when the embankment 130 is prematurely exposed by first patterning the touch buffer layer 140, tetramethylammonium hydroxide (TMAH), a residual component of the developer used in the process of forming the protective layer 160 formed of organic matter, may remain on the embankment 130. In this case, when the remaining TMAH reacts with water (H2O), TMAH can dissociate to generate cationic TMA. + (i.e., N(CH3)4) + Then, when voltage is applied to multiple lines arranged in the bend region BA to evaluate the reliability of the product drive, an electric field is generated between the high-voltage and low-voltage lines in a structure where the high-voltage and low-voltage lines are arranged adjacent to each other, thereby reducing the electric field between signals of the same potential level when signal lines included in the multiple lines are arranged. In this case, the TMA remaining on the bend region BA +Cations are attracted to multiple lines by the generated electric field. For example, when driven at 1 Hz, as the time a particular line among the multiple lines maintains a low voltage increases, the TMA... + Cations are easily attracted to low-voltage lines in multiple lines, leading to corrosion of multiple lines.

[0135] To address this issue, since the display device 100 in this embodiment removes the touch buffer layer 140 located in the curved region BA in the final step, it can remove any TMAH that may remain on the embankment 130.

[0136] Figure 11 This is a view illustrating process steps for manufacturing a display device according to another embodiment of the present disclosure. In this embodiment, the description focuses primarily on the differences from the embodiments described above.

[0137] Reference Figure 11 A planarization layer 120, a touch buffer layer 140, and a touch sensing unit 150 are sequentially stacked on a substrate 110. Then, an etching process is performed to pattern the touch sensing unit 150.

[0138] After patterning the touch sensing unit 150, a protective layer 160 is deposited on the touch sensing unit 150 using a deposition mask. The protective layer 160 formed as described above can be disposed in the non-display area NA, excluding the curved area BA.

[0139] Subsequently, the touch buffer layer 140 located in the curved region BA is removed by dry etching or wet etching. In this case, the width of the protective layer 160 is formed to be smaller than the width of the touch buffer layer 140, so that the portion of the edge of the touch buffer layer 140 adjacent to the curved region BA can be exposed to the outside.

[0140] As described above, since the touch buffer layer 140 located in the curved region BA is removed in the final step, tetramethylammonium hydroxide (TMAH) will not remain on the surface of the embankment 130 exposed to the curved region BA.

[0141] The embodiments disclosed above are briefly described below.

[0142] Embodiments of this disclosure may provide a display device, comprising: a substrate including a display area and a non-display area; a planarization layer disposed on the substrate; a dam disposed on the planarization layer; a touch buffer layer disposed on a portion of the dam and a portion of the planarization layer; a touch sensing portion disposed on the touch buffer layer; and a protective layer covering the touch sensing portion on the touch buffer layer.

[0143] According to embodiments of this disclosure, the non-display area may include a curved region disposed on one side of the display area. The touch buffer layer may be configured not to overlap with the curved region.

[0144] According to embodiments of this disclosure, the touch sensing portion can be configured not to overlap with the curved area.

[0145] According to embodiments of this disclosure, the touch sensing unit can be electrically connected via a connection line disposed in a non-display area.

[0146] According to embodiments of this disclosure, the planarization layer and the touch buffer layer may include contact holes in portions that do not overlap with the curved area, so that the touch sensing part and the connecting line can contact each other.

[0147] According to embodiments of this disclosure, the planarization layer may include a first planarization layer and a second planarization layer disposed on the first planarization layer. Connecting wires may be inserted between the first planarization layer and the second planarization layer.

[0148] According to an embodiment of this disclosure, a portion of the connecting line may be recessed toward the first planarization layer to form a step. A second planarization layer covers a portion of the step.

[0149] According to an embodiment of this disclosure, the touch sensing part can extend from the embankment to the step.

[0150] According to embodiments of the present disclosure, the substrate may have a concave curved surface pattern on one surface facing the planarization layer.

[0151] According to embodiments of this disclosure, a concave curved surface pattern can be formed in an area that overlaps with the curved region.

[0152] According to embodiments of this disclosure, tetramethylammonium hydroxide (TMAH) may not remain in the portion of the surface of the embankment that overlaps with the curved area.

[0153] According to embodiments of this disclosure, the protective layer can be configured not to overlap with the curved area.

[0154] According to embodiments of this disclosure, the end of the protective layer can be configured not to extend beyond the end of the touch buffer layer.

[0155] According to an embodiment of this disclosure, the lower end of the protective layer may be disposed parallel to the upper end of the touch buffer layer.

[0156] According to embodiments of this disclosure, the width of the touch sensing portion can be smaller than the width of the touch buffer layer, thereby exposing a portion of the outer edge of the touch buffer layer.

[0157] According to embodiments of this disclosure, the width of the protective layer may be smaller than the width of the touch buffer layer, thereby exposing a portion of the touch buffer layer.

[0158] According to embodiments of this disclosure, the width of the protective layer can be greater than the width of the touch sensing portion and less than the width of the touch buffer layer.

[0159] According to embodiments of the present disclosure, the touch sensing unit may include touch electrodes disposed on a touch buffer layer, and touch wiring disposed on the touch buffer layer and electrically connected to the touch electrodes.

[0160] According to embodiments of this disclosure, the embankment may have multiple openings formed in a non-display area.

[0161] The above embodiments are merely examples, and those skilled in the art will understand that various changes can be made thereto without departing from the scope of this disclosure. Therefore, the embodiments set forth herein are provided for illustrative purposes and not for limiting the scope of this disclosure, and it should be understood that the scope of this disclosure is not limited by the embodiments.

Claims

1. A display device, comprising: The substrate includes a display area and a non-display area; A planarization layer is disposed on the substrate. The embankment is constructed on the leveling layer; A touch buffer layer is disposed on a portion of the embankment and a portion of the planarization layer; A touch sensor is disposed on the touch buffer layer; as well as A protective layer covers the touch sensing element on the touch buffer layer.

2. The display device according to claim 1, wherein, The non-display area includes a curved region disposed on one side of the display area, and The touch buffer layer is configured not to overlap with the curved area.

3. The display device according to claim 2, wherein, The touch sensor is configured not to overlap with the curved area.

4. The display device according to claim 3, wherein, The touch sensor is electrically connected via a connection line located in the non-display area.

5. The display device according to claim 4, wherein, The planarization layer and the touch buffer layer include contact holes in portions that do not overlap with the curved area, so that the touch sensing part and the connecting line can contact each other.

6. The display device according to claim 4, wherein, The planarization layer includes a first planarization layer and a second planarization layer disposed on the first planarization layer, and The connecting line is inserted between the first planarization layer and the second planarization layer.

7. The display device according to claim 6, wherein, A portion of the connecting line is recessed towards the first planarization layer to form a step, and The second planarization layer covers a portion of the step.

8. The display device according to claim 7, wherein, The touch sensor extends from the embankment to the step.

9. The display device according to claim 2, wherein, The substrate has a concave curved surface pattern on one surface facing the planarization layer.

10. The display device according to claim 9, wherein, The concave curved surface pattern is formed in the region that overlaps with the curved region.

11. The display device according to claim 2, wherein, No tetramethylammonium hydroxide (TMAH) remains on the surface of the embankment in the portion that overlaps with the curved area.

12. The display device according to claim 2, wherein, The protective layer is configured not to overlap with the curved area.

13. The display device according to claim 1, wherein, The ends of the protective layer are configured not to extend beyond the ends of the touch buffer layer.

14. The display device according to claim 1, wherein, The lower end of the protective layer is positioned parallel to the upper end of the touch buffer layer.

15. The display device according to claim 1, wherein, The width of the touch sensor is smaller than the width of the touch buffer layer, thereby exposing a portion of the outer edge of the touch buffer layer.

16. The display device according to claim 1, wherein, The width of the protective layer is smaller than the width of the touch buffer layer, thereby exposing a portion of the touch buffer layer.

17. The display device according to claim 1, wherein, The width of the protective layer is greater than the width of the touch sensor and less than the width of the touch buffer layer.

18. The display device according to claim 1, wherein, The touch sensing unit includes: Touch electrodes are disposed on the touch buffer layer; and Touch wiring is disposed on the touch buffer layer and electrically connected to the touch electrode.

19. The display device according to claim 1, wherein, The embankment has multiple openings in the non-display area.

20. A display device, comprising: The substrate includes a display area and a non-display area; Multiple buffer layers are disposed on the substrate. A planarization layer is disposed on the plurality of buffer layers; as well as The embankment is constructed on the leveling layer. The non-display area includes a bendable region of the substrate, and In this process, the plurality of buffer layers in the curved region are removed to form a concave curved surface pattern.

21. The display device according to claim 20, wherein, The planarization layer comprises at least one of acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

22. The display device according to claim 21, wherein, The planarization layer fills the concave surface pattern formed in the plurality of buffer layers.

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