Display panel, preparation method of display panel and display device

Abstract

The invention discloses a display panel, a preparation method of the display panel and a display device.The display panel is provided with a display area and a non-display area, and the display panel comprises a substrate, a first electrode and a second electrode, at least part of the signal line is located in the groove, and the side wall of the signal line is provided with a concave structure; and at least part of the protection structure is filled in the concave structure. The display panel provided by the embodiment of the invention has relatively good structural reliability.

Description

Technical Field

[0001] This application belongs to the field of display technology, and in particular relates to a display panel, a method for manufacturing the display panel, and a display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) and flat panel displays based on light-emitting diodes (LEDs) are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide range of applications, becoming the mainstream of display devices.

[0003] However, the current manufacturing process of OLED display products needs improvement. Summary of the Invention

[0004] This application provides a display panel, a method for manufacturing the display panel, and a display device, aiming to improve the structural reliability of the display panel.

[0005] An embodiment of the first aspect of this application provides a display panel having a display area and a non-display area. The display panel includes: a substrate having a groove in the non-display area; signal lines, at least a portion of which are located within the groove, and the sidewalls of the signal lines having recessed structures; and a protective structure, at least a portion of which is filled within the recessed structures.

[0006] According to an embodiment of the first aspect of this application, the protective structure completely fills the recessed structure of the signal line within the groove.

[0007] According to any of the foregoing embodiments of the first aspect of this application, the protective structure has a transition surface on the side opposite to the recessed structure in the width direction of the signal line, and the transition surface is inclined toward the signal line in the direction away from the substrate.

[0008] According to any of the foregoing embodiments of the first aspect of this application, the projection of the signal line located in the groove in the thickness direction of the display panel is located within the projection of the protective structure in the thickness direction.

[0009] According to any of the foregoing embodiments of the first aspect of this application, a partial protective structure covers the side surface of the signal line facing away from the substrate.

[0010] According to any of the foregoing embodiments of the first aspect of this application, the surfaces of the signal lines located within the groove, except for the surface in contact with the substrate, are covered by a protective structure.

[0011] According to any of the foregoing embodiments of the first aspect of this application, the protection structure includes a first protection structure covering the surface of the signal line and a second protection structure covering the side of the first protection structure opposite to the signal line.

[0012] According to any of the foregoing embodiments of the first aspect of this application, the material of the first protective structure includes inorganic materials, and / or the material of the second protective structure includes organic materials.

[0013] According to any of the foregoing embodiments of the first aspect of this application, the projection of the signal line located in the groove in the thickness direction of the display panel is located within the projection of the first protective structure in the thickness direction.

[0014] According to any of the foregoing embodiments of the first aspect of this application, a portion of the second protection structure is located on the side of the signal line away from the substrate.

[0015] According to any of the foregoing embodiments of the first aspect of this application, a first protective structure covering the inner wall of the recessed structure encloses a gap space, and at least a portion of the second protective structure fills the gap space.

[0016] According to any of the foregoing embodiments of the first aspect of this application, the second protective structure completely fills the gap space.

[0017] According to any of the foregoing embodiments of the first aspect of this application, the signal line includes a first line layer, a second line layer located on the side of the first line layer facing away from the substrate, and a third line layer located on the side of the second line layer facing away from the substrate, wherein the second line layer is recessed relative to the first line layer and the third line layer to form a recessed structure.

[0018] According to any of the foregoing embodiments of the first aspect of this application, the material of the first line layer and / or the third line layer includes titanium.

[0019] According to any of the foregoing embodiments of the first aspect of this application, the material of the second line layer includes aluminum.

[0020] According to any of the foregoing embodiments of the first aspect of this application, the protective structure has a transition surface on the side opposite to the recessed structure in the width direction of the signal line, and the transition surface is inclined toward the signal line in the direction away from the substrate.

[0021] According to any of the foregoing embodiments of the first aspect of this application, the projection of the transition surface in the thickness direction of the display panel does not overlap with the projection of the third line layer in the thickness direction.

[0022] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes a light-emitting device disposed on one side of the substrate and located in the display area. The light-emitting device includes a first electrode, a light-emitting unit located on the side of the first electrode away from the substrate, and a second electrode located on the side of the light-emitting unit away from the substrate. The number of signal lines is multiple, at least some of the signal lines are electrically connected to the second electrode, and / or at least some of the signal lines are electrically connected to the first electrode.

[0023] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes an isolation structure disposed on one side of the substrate, the isolation structure enclosing an isolation opening, at least a portion of the structure of the light-emitting device being located within the isolation opening, the material of the isolation structure including a conductive material, a second electrode being connected to the isolation structure, and the isolation structure being electrically connected to at least a portion of the signal lines.

[0024] According to any of the foregoing embodiments of the first aspect of this application, the isolation structure includes a first isolation portion and a second isolation portion located on the side of the first isolation portion away from the substrate, wherein the second isolation portion protrudes out of the first isolation portion toward the isolation opening.

[0025] According to any of the foregoing embodiments of the first aspect of this application, the isolation structure further includes a conductive portion located on the side of the first isolation portion facing the substrate, the conductive portion protruding from the first isolation portion toward the isolation opening, and the second electrode being connected to the conductive portion.

[0026] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes an encapsulation layer disposed on the side of the light-emitting device away from the substrate.

[0027] According to any of the foregoing embodiments of the first aspect of this application, a portion of the encapsulation layer is located within the groove and covers the side surface of the protective structure facing away from the substrate.

[0028] According to any of the foregoing embodiments of the first aspect of this application, the encapsulation layer includes a first encapsulation layer disposed on the side of the light-emitting device away from the substrate, a second encapsulation layer disposed on the side of the first encapsulation layer away from the substrate, and a third encapsulation layer disposed on the side of the second encapsulation layer away from the substrate, wherein a portion of the second encapsulation layer is located in a groove and covers the side surface of the protective structure away from the substrate, and / or, a portion of the third encapsulation layer is located in a groove and covers the side surface of the protective structure away from the substrate.

[0029] According to any of the foregoing embodiments of the first aspect of this application, the material of the first encapsulation layer includes an inorganic material, and / or the material of the second encapsulation layer includes an organic material, and / or the material of the third encapsulation layer includes an organic material.

[0030] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes a pixel definition layer, the pixel definition layer including a pixel limiting portion and a pixel opening located in the display area enclosed by the pixel limiting portion, and at least a portion of the structure of the light-emitting device is located within the pixel opening.

[0031] According to any of the foregoing embodiments of the first aspect of this application, the pixel defining portion extends from the display area to the non-display area and is partially located in the groove, and the protective structure is at least partially connected to the pixel defining portion and disposed in the same layer and material.

[0032] According to any of the foregoing embodiments of the first aspect of this application, the protective structure includes a first protective structure covering the surface of the signal line and a second protective structure covering the side of the first protective structure away from the signal line. The first protective structure is connected to the pixel defining portion and is disposed in the same layer and with the same material.

[0033] According to any of the foregoing embodiments of the first aspect of this application, the substrate includes a substrate and a planarization layer located on one side of the substrate, the planarization layer being disposed in a manner that encloses at least a portion of a groove.

[0034] According to any of the foregoing embodiments of the first aspect of this application, the substrate further includes a dam spaced apart from the planarization layer, and a groove is formed between the dam and the planarization layer.

[0035] According to any of the foregoing embodiments of the first aspect of this application, a portion of the signal lines are located between the planarization layer and the substrate.

[0036] According to any of the foregoing embodiments of the first aspect of this application, the substrate further includes a transistor located between the planarization layer and the substrate, and a signal line located between the transistor and the planarization layer.

[0037] An embodiment of the first aspect of this application also provides a display panel having a display area and a non-display area. The display panel includes: a substrate having a groove in the non-display area; a signal line having at least a portion of it located within the groove, the sidewall of the signal line having a recessed structure; and a protective structure including a first protective structure covering the surface of the signal line and a second protective structure covering the side of the first protective structure opposite to the signal line. The first protective structure covering the inner wall of the recessed structure encloses a gap space, and at least a portion of the second protective structure fills the gap space.

[0038] According to an embodiment of the first aspect of this application, the protective structure completely fills the recessed structure of the signal line within the groove.

[0039] According to any of the foregoing embodiments of the first aspect of this application, the second protective structure completely fills the gap space.

[0040] According to any of the foregoing embodiments of the first aspect of this application, the second protective structure has a transition surface on the side away from the recessed structure in the width direction of the signal line, and the transition surface is inclined toward the signal line in the direction away from the substrate.

[0041] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes a pixel definition layer, the pixel definition layer includes a pixel limiting portion and a pixel opening located in the display area enclosed by the pixel limiting portion, the pixel limiting portion extends from the display area to the non-display area and is partially located in the groove, and the first protective structure is connected to the pixel limiting portion and is disposed in the same layer and material.

[0042] According to any of the foregoing embodiments of the first aspect of this application, the material of the first protective structure includes inorganic materials, and / or the material of the second protective structure includes organic materials.

[0043] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes a light-emitting device, which is disposed on one side of the substrate and at least a portion of its structure is located within a pixel opening. The light-emitting device includes a first electrode, a light-emitting unit located on the side of the first electrode facing away from the substrate, and a second electrode located on the side of the light-emitting unit facing away from the substrate. The number of signal lines is multiple, and at least a portion of the signal lines are electrically connected to the second electrode, and / or at least a portion of the signal lines are electrically connected to the first electrode.

[0044] An embodiment of the second aspect of this application provides a method for manufacturing a display panel, the display panel having a display area and a non-display area, the manufacturing method comprising:

[0045] A groove is formed in the substrate, at least a portion of the signal line is exposed from the groove and located in the groove, and the sidewall of the signal line has a recessed structure;

[0046] Prepare a protective structure, wherein at least part of the protective structure is filled within the recessed structure.

[0047] According to an embodiment of the second aspect of this application, the protective structure includes a first protective structure covering the surface of the signal line and a second protective structure covering the side of the first protective structure opposite to the signal line. The step of preparing the protective structure includes:

[0048] A pixel definition material layer is prepared on one side of the substrate. The pixel definition material layer extends from the display area to the non-display area and is partially located in the groove. The pixel definition material layer located in the groove and covering the surface of the signal line forms a first protective structure.

[0049] A second protective structure is prepared on the first protective structure.

[0050] According to any of the foregoing embodiments of the second aspect of this application, a first protective structure covering the inner wall of the recessed structure encloses a gap space, and at least a portion of the second protective structure fills the gap space.

[0051] According to any of the foregoing embodiments of the second aspect of this application, after the step of preparing the second protective structure on the first protective structure, the following is included:

[0052] The pixel definition material layer is patterned to form a pixel definition layer, which includes a pixel defining portion and a pixel opening located in the display area enclosed by the pixel defining portion.

[0053] According to any of the foregoing embodiments of the second aspect of this application, the step of preparing the protective structure further includes:

[0054] A light-emitting device and a first encapsulation layer located on the side of the light-emitting device away from the substrate are prepared.

[0055] According to any of the foregoing embodiments of the second aspect of this application, the step of preparing the light-emitting device and the first encapsulation layer located on the side of the light-emitting device facing away from the substrate includes:

[0056] An isolation structure is prepared on one side of the substrate, the isolation structure encloses and forms an isolation opening, the isolation opening including a first opening;

[0057] The first device material layer and the first encapsulation material layer are prepared sequentially on the entire surface, and the first device material layer is continuous in the protective structure;

[0058] Remove the first device material layer and the first encapsulation material layer outside the first opening to form a first light-emitting device and a first encapsulation unit corresponding to the first opening.

[0059] According to any of the foregoing embodiments of the second aspect of this application, the isolation opening further includes a second opening, and after the step of forming the first light-emitting device and the first packaging unit corresponding to the first opening, the following is further included:

[0060] The second device material layer and the second encapsulation material layer are prepared sequentially on the entire surface, and the second device material layer is continuous in the protective structure;

[0061] Remove the second device material layer and the second encapsulation material layer outside the second opening to form a second light-emitting device and a second encapsulation unit corresponding to the second opening.

[0062] According to any of the foregoing embodiments of the second aspect of this application, the isolation opening further includes a third opening, and after the step of forming the second light-emitting device and the second packaging unit corresponding to the second opening, the following is further included:

[0063] The third device material layer and the third encapsulation material layer are prepared sequentially on the entire surface, and the third device material layer is continuous in the protective structure;

[0064] Remove the third device material layer and the third encapsulation material layer outside the third opening to form a third light-emitting device and a third encapsulation unit corresponding to the third opening.

[0065] According to any of the foregoing embodiments of the second aspect of this application, after the step of forming the light-emitting device and the first encapsulation layer located on the side of the light-emitting device facing away from the substrate, the following is included:

[0066] A second encapsulation layer is formed on the first encapsulation layer, with a portion of the second encapsulation layer located within a groove and covering the side surface of the protective structure facing away from the substrate.

[0067] According to any of the foregoing embodiments of the second aspect of this application, the step of forming the second encapsulation layer on the first encapsulation layer includes:

[0068] A third encapsulation layer is formed on the second encapsulation layer, with a portion of the third encapsulation layer located within the groove and covering the side of the protective structure facing away from the substrate.

[0069] According to any of the foregoing embodiments of the second aspect of this application, the protective structure includes a first protective structure covering the surface of the signal line and a second protective structure covering the side of the first protective structure opposite to the signal line, and includes the following after the step of forming the light-emitting device and the first encapsulation layer located on the side of the light-emitting device opposite to the substrate:

[0070] Remove the second protective structure.

[0071] An embodiment of the third aspect of this application provides a display device, including a display panel of any of the above embodiments, or including a display panel prepared using the preparation method of any of the above embodiments. Attached Figure Description

[0072] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0073] Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of this application;

[0074] Figure 2 This is a partial cross-sectional view of a display panel within a display area provided in an embodiment of this application;

[0075] Figure 3 This is a partial cross-sectional view of a display panel provided in an embodiment of this application;

[0076] Figure 4This is a partial cross-sectional view of a signal line and protection structure provided in an embodiment of this application;

[0077] Figure 5 This is a partial cross-sectional view of a signal line and protection structure provided in another embodiment of this application;

[0078] Figure 6 This is a partial cross-sectional view of a display panel within a display area provided in another embodiment of this application;

[0079] Figure 7 This is a partial cross-sectional view of a display panel provided in another embodiment of this application;

[0080] Figure 8 This is a schematic diagram of a method for manufacturing a display panel according to an embodiment of this application;

[0081] Figures 9 to 22 This is a schematic diagram illustrating the fabrication process of a display panel fabrication method provided in this application embodiment.

[0082] Explanation of reference numerals in the attached figures:

[0083] 10. Display panel;

[0084] 100, Substrate; 100a, Groove; 110, Substrate; 120, First insulating layer; 130, Second insulating layer; 140, Third insulating layer; 150, Driving circuit; 151, Transistor; 151a, Gate; 151b, Source / drain; 152, Storage capacitor; 152a, First electrode; 152b, Second electrode; 160, Planarization layer; 170, Dam;

[0085] 200, Pixel definition layer; 210, Pixel limiting section; 220, Pixel opening;

[0086] 300, Isolation structure; 300a, Isolation opening; 300aa, First opening; 300ab, Second opening; 300ac, Third opening; 310, First isolation section; 320, Second isolation section; 330, Conductive section;

[0087] 400, Light-emitting device; 401, First light-emitting device; 402, Second light-emitting device; 403, Third light-emitting device; 410, First electrode; 420, Second electrode; 430, Light-emitting unit;

[0088] 500, Encapsulation layer; 510, First encapsulation layer; 511, First encapsulation unit; 512, Second encapsulation unit; 513, Third encapsulation unit; 520, Second encapsulation layer; 530, Third encapsulation layer;

[0089] P, protective structure; Pa, transition surface; Pb, top surface; P1, first protective structure; P11, gap space; P2, second protective structure;

[0090] SL, signal line; SLa, recessed structure; SL1, first line layer; SL2, second line layer; SL3, third line layer;

[0091] E1, First device material layer; E11, First light-emitting material layer; E12, First conductive material layer;

[0092] E2, second device material layer; E21, second light-emitting material layer; E22, second conductive material layer;

[0093] E3, third device material layer; E31, third light-emitting material layer; E32, third conductive material layer;

[0094] C1, First encapsulation material layer;

[0095] C2, Second encapsulation material layer;

[0096] C3, the third packaging material layer;

[0097] D. Pixel-defined material layer;

[0098] AA, Display area; NA, Non-display area;

[0099] X, thickness direction. Detailed Implementation

[0100] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.

[0101] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0102] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.

[0103] This application provides a display panel, a method for manufacturing the display panel, and a display device. The following description, in conjunction with the accompanying drawings, will illustrate various embodiments of the display panel, the method for manufacturing the display panel, and the display device.

[0104] Figure 1 This is a schematic diagram of the structure of a display panel 10 provided in an embodiment of this application. Figure 2 This is a partial cross-sectional view of a display panel 10 within a display area AA provided in an embodiment of this application. Figure 3 This is a partial cross-sectional view of a display panel 10 provided in an embodiment of this application. Figure 4 This is a partial cross-sectional view of a signal line SL and a protective structure P provided in an embodiment of this application. In the figure, the X direction is the thickness direction of the display panel 10.

[0105] Optionally, in the accompanying drawings provided in this application, the relative positional relationship between the signal line SL and other devices is only an example, and this application does not specifically limit the relative positional relationship between the signal line SL and other devices.

[0106] like Figures 1 to 4As shown, an embodiment of the first aspect of this application provides a display panel 10, which has a display area AA and a non-display area NA. The display panel 10 includes: a substrate 100, in which a groove 100a is formed in the non-display area NA; a signal line SL, at least a portion of which is located in the groove 100a, and the sidewall of the signal line SL has a recessed structure SLa; and a protective structure P, at least a portion of which is filled in the recessed structure SLa.

[0107] In a display panel 10 provided in this application embodiment, the display panel 10 has a display area AA and a non-display area NA. The display panel 10 includes a substrate 100, signal lines SL, and a protective structure P. The substrate 100 has a groove 100a in the non-display area NA, and at least a portion of the signal lines SL are located in the groove 100a. The signal lines SL can be used to transmit signals in the display panel 10.

[0108] The signal line SL has a recessed structure SLa on its sidewall. By providing at least a partial protective structure P to fill the recessed structure SLa, the protective structure P can play a good planarization role. This allows the material of the subsequent structure to have good continuity within the groove 100a under the planarization effect of the protective structure P during the subsequent fabrication of the display panel 10. That is, the material of the subsequent structure is less likely to break at the recessed structure SLa. As a result, when the material of the subsequent structure is patterned, the etching material is less likely to come into direct contact with the protective structure P or the signal line SL under the shielding of the relatively continuous subsequent structure material. This allows the protective structure P and the signal line SL to have good structural reliability, thereby improving the structural reliability of the display panel 10. Furthermore, due to the planarization effect of the protective structure P, the etching material is less likely to come into direct contact with the protective structure P or the signal line SL. This makes it less likely for moisture to penetrate the signal line SL during the fabrication of the display panel 10, resulting in a better display effect for the display panel 10. For example, the display panel 10 is less likely to produce problems such as poor display, black spots, or bright lines.

[0109] Optionally, the sidewalls of the signal line SL can refer to the two surfaces of the signal line SL that are opposite to each other in its width direction. The width direction of the signal line SL may intersect the thickness direction X of the display panel 10, and the width direction of the signal line SL may intersect the extension direction of the signal line SL. For example, the width direction of the signal line SL may be perpendicular to the thickness direction X of the display panel 10, and the width direction of the signal line SL may be perpendicular to the extension direction of the signal line SL.

[0110] In some optional embodiments of this application, the substrate 100 can be disposed in various ways. For example, the substrate 100 may include a substrate 110 and a planarization layer 160 located on one side of the substrate 110. The planarization layer 160 may surround at least a portion of the groove 100a, that is, at least a portion of the groove 100a may be surrounded and formed by the planarization layer 160.

[0111] Optionally, some signal lines SL may be located between the planarization layer 160 and the substrate. The signal lines SL located below the planarization layer 160 can be well protected by the planarization layer 160 and are not easily etched and damaged during subsequent fabrication of the display panel 10. Optionally, the signal lines SL located below the planarization layer 160 may not have a protective structure P.

[0112] Optionally, the substrate 100 further includes a dam 170 spaced apart from the planarization layer 160, and a groove 100a may be formed between the dam 170 and the planarization layer 160. The dam 170 is located in the non-display area NA, and at least a portion of the structure in the dam 170 may be disposed in the same layer and with the same material as the planarization layer 160, so that at least a portion of the structure in the dam 170 can be fabricated together with the planarization layer 160, thereby improving the fabrication efficiency of the display panel 10. For example, the materials of the planarization layer 160 and the dam 170 may include organic materials.

[0113] Optionally, the recess 100a can be set around the display area AA.

[0114] In these alternative embodiments, the groove 100a can be used to restrict moisture from penetrating into the display area AA along a portion of the film structure in the substrate 100. For example, it makes it difficult for moisture to penetrate into the display area AA along the planarization layer 160 and the dam 170. Furthermore, the groove 100a can also facilitate the restriction of excessive overflow of some material in the display area AA into the non-display area NA during the fabrication of the display panel 10. That is, during the fabrication of the display panel 10, when some material in the display area AA flows into the non-display area NA, this material can fall into the groove 100a and be blocked by the dam 170, preventing further overflow into other non-display areas NA.

[0115] Optionally, the substrate 100 may further include a driving circuit 150 located between the planarization layer 160 and the substrate 110. Optionally, the substrate 100 includes a first insulating layer 120, a second insulating layer 130, and a third insulating layer 140 stacked together. Exemplarily, the driving circuit 150 may include a transistor 151 located between the planarization layer 160 and the substrate 110. The transistor 151 may include a semiconductor, a gate 151a, and source / drain electrodes 151b.

[0116] For example, the driving circuit 150 may also include a storage capacitor 152 and signal connection lines for connecting various devices. The storage capacitor 152 includes a first plate 152a and a second plate 152b.

[0117] As an example, the gate 151a and the first electrode 152a may be located on the side of the first insulating layer 120 facing the substrate 110, the second electrode 152b may be located between the first insulating layer 120 and the second insulating layer 130, and the source and drain electrodes 151b may be located between the second insulating layer 130 and the third insulating layer 140.

[0118] Optionally, the signal line SL may be located between the transistor 151 and the planarization layer 160. For example, the signal line SL may be located between the third insulating layer 140 and the planarization layer 160.

[0119] In some optional embodiments, the signal line SL includes a first line layer SL1, a second line layer SL2 located on the side of the first line layer SL1 away from the substrate 100, and a third line layer SL3 located on the side of the second line layer SL2 away from the substrate 100. The second line layer SL2 is recessed relative to the first line layer SL1 and the third line layer SL3 to form a recessed structure SLa.

[0120] Optionally, the material of the first line layer SL1 and / or the third line layer SL3 may include titanium.

[0121] Optionally, the material of the second line layer SL2 includes aluminum.

[0122] In these alternative embodiments, the second line layer SL2, made of aluminum, can have better conductivity, which is beneficial for reducing the resistance of the signal line SL. The first line layer SL1 and the third line layer SL3 can be used to protect the second line layer SL2, making it less susceptible to oxidation. When fabricating the signal line SL, for example, during the patterning process of the signal line SL material, since the materials of the second line layer SL2 are different from those of the first line layer SL1 and the third line layer SL3, and since the materials of the first line layer SL1 and the third line layer SL3 include titanium while the material of the second line layer SL2 includes aluminum, the etching rate of the etching material on the second line layer SL2 is greater than the etching rate of the etching material on the first line layer SL1 and the third line layer SL3. This makes the fabricated second line layer SL2 more prone to developing depressions compared to the first line layer SL1 and the third line layer SL3, forming a recessed structure SLa.

[0123] In some optional embodiments, the display panel 10 may further include a light-emitting device 400 disposed on one side of the substrate 100 and located in the display area AA. The light-emitting device 400 includes a first electrode 410, a light-emitting unit 430 located on the side of the first electrode 410 away from the substrate 100, and a second electrode 420 located on the side of the light-emitting unit 430 away from the substrate 100.

[0124] Optionally, the light-emitting unit 430 may include a hole injection layer (HIL), a hole transport layer (HTL), a light-emitting structure, an electron injection layer (EIL), and an electron transport layer (ETL).

[0125] Optionally, the first electrode 410 and the second electrode 420 can serve as pixel electrodes of the display panel 10. One of the first electrode 410 and the second electrode 420 can serve as an anode, and the other can serve as a cathode to drive the light-emitting unit 430 to emit light. In this embodiment, the first electrode 410 is used as the anode of the display panel 10, and the second electrode 420 is used as the cathode of the display panel 10 for illustrative purposes.

[0126] In some embodiments of this application, there are multiple signal lines SL, and the signal lines SL can transmit various signal types. Optionally, the multiple signal lines SL can be spaced apart and arranged side by side. For example, at least some of the signal lines SL can be spaced apart and arranged side by side in the non-display area NA.

[0127] In some alternative embodiments, at least a portion of the signal line SL may be used to transmit a first power supply voltage signal; for example, at least a portion of the signal line SL may be used to transmit an ELVDD signal.

[0128] Optionally, at least a portion of the signal lines SL can serve as ELVDD traces in the display panel 10 and be used to transmit signals in the first electrode 410. For example, at least a portion of the signal lines SL can be connected to the first electrode 410. Exemplarily, at least a portion of the signal lines SL can be electrically connected to the first electrode 410 via a driving circuit 150 in the substrate 100.

[0129] In some alternative embodiments, at least a portion of the signal line SL may be used to transmit a second power supply voltage signal; for example, at least a portion of the signal line SL may be used to transmit an ELVSS signal.

[0130] Optionally, at least a portion of the signal lines SL may serve as ELVSS traces in the display panel 10 and be used to transmit signals in the second electrode 420. For example, at least a portion of the signal lines SL may be electrically connected to the second electrode 420.

[0131] For ease of description, the following embodiments will be illustrated by the example of at least a portion of the signal lines SL being used to transmit the second power supply voltage signal. For instance, the following embodiments will be illustrated by the example of at least a portion of the signal lines SL being ELVSS traces located in the non-display area NA of the display panel 10.

[0132] like Figure 2 As shown, in some optional embodiments, the display panel 10 further includes an isolation structure 300 disposed on one side of the substrate 100. The isolation structure 300 encloses and forms an isolation opening 300a. At least a portion of the structure of the light-emitting device 400 is located within the isolation opening 300a. The isolation structure 300 can be used to divide the sub-pixels of the display panel 10.

[0133] Optionally, the isolation structure 300 includes a first isolation portion 310 and a second isolation portion 320 located on the side of the first isolation portion 310 away from the substrate 100, the second isolation portion 320 being disposed protruding from the first isolation portion 310 toward the isolation opening 300a.

[0134] Optionally, the light-emitting device 400 may include a first light-emitting device 401, a second light-emitting device 402, and a third light-emitting device 403 disposed within different isolation openings 300a. Optionally, the first light-emitting device 401, the second light-emitting device 402, and the third light-emitting device 403 emit different colors; for example, the first light-emitting device 401 may emit red light, the second light-emitting device 402 may emit green light, and the third light-emitting device 403 may emit blue light.

[0135] Optionally, the isolation opening 300a may include a first opening 300aa, a second opening 300ab, and a third opening 300ac. The first light-emitting device 401 may be set corresponding to the first opening 300aa, the second light-emitting device 402 may be set corresponding to the second opening 300ab, and the third light-emitting device 403 may be set corresponding to the third opening 300ac.

[0136] In these optional embodiments, by providing the second isolation portion 320 protruding from the first isolation portion 310 toward the isolation opening 300a, the materials of the light-emitting units 430 and the second electrodes 420 of each light-emitting device 400 in the display panel 10 can be directly vapor-deposited over the entire surface. The second isolation portion 320 can block at least part of the materials of the light-emitting units 430 and the second electrodes 420 to isolate the materials of the light-emitting units 430 and the second electrodes 420 between adjacent light-emitting devices 400, so as to form multiple light-emitting units 430 and the second electrodes 420 spaced apart and located in different isolation openings 300a. This eliminates the need to use a high-precision mask when preparing the light-emitting units 430 and the second electrodes 420. For example, it eliminates the need to use a high-precision fine metal mask (FMM) when vapor-depositing the materials of the light-emitting units 430 and the second electrodes 420, thereby significantly reducing the manufacturing cost of the display panel 10.

[0137] Optionally, different colored light-emitting devices 400 can be prepared separately through the isolation structure 300, that is, the first light-emitting device 401, the second light-emitting device 402 and the third light-emitting device 403 can be prepared separately through the isolation structure 300.

[0138] Specifically, the fabrication of the first electrode 410 in the first light-emitting device 401, the second light-emitting device 402, and the third light-emitting device 403 can be completed simultaneously. Then, the materials of the light-emitting unit 430 and the second electrode 420 in the first light-emitting device 401 are fabricated over a single surface. Next, the materials of the light-emitting unit 430 and the second electrode 420 in the first light-emitting device 401 outside the first opening 300aa are etched away to form the first light-emitting device 401 located within the first opening 300aa. Then, the materials of the light-emitting unit 430 and the second electrode 420 in the second light-emitting device 402 are fabricated over a single surface. Next, the materials of the light-emitting unit 430 and the second electrode 420 in the second light-emitting device 402 outside the second opening 300ab are etched away to form the second light-emitting device 402 located within the second opening 300ab. Finally, the materials of the light-emitting unit 430 and the second electrode 420 in the third light-emitting device 403 are prepared on the whole surface. Then, the materials of the light-emitting unit 430 and the second electrode 420 in the third light-emitting device 403 outside the third opening 300ac are etched and removed to form the third light-emitting device 403 located in the third opening 300ac.

[0139] In the display panel 10 provided in this application embodiment, by providing at least a partial protective structure P to fill the recessed structure SLa, the materials of the light-emitting unit 430 and the first electrode 410 in each light-emitting device 400 can more easily have good continuity within the groove 100a under the planarization effect of the protective structure P during the subsequent fabrication of the light-emitting device 400. That is, the materials of the light-emitting unit 430 and the first electrode 410 in the light-emitting device 400 are less likely to break at the recessed structure SLa. This makes it easier to pattern the materials of the light-emitting device 400, for example, when patterning the light-emitting unit 430 and the second electrode in the first light-emitting device 401 outside the first opening 300aa. When the material of 420 is etched and removed, when the material of the light-emitting unit 430 and the second electrode 420 in the second light-emitting device 402 outside the second opening 300ab is etched and removed, and when the material of the light-emitting unit 430 and the second electrode 420 in the third light-emitting device 403 outside the third opening 300ac is etched and removed, under the material shielding of the light-emitting unit 430 and the first electrode 410 in the relatively continuous light-emitting devices 400, the etched material is not likely to directly contact the protective structure P or the signal line SL, so that the protective structure P and the signal line SL can have better structural reliability, thereby improving the structural reliability of the display panel 10.

[0140] In some alternative embodiments, the material of the isolation structure 300 includes a conductive material, and the second electrode 420 can be connected to the isolation structure 300 so that the second electrodes 420 of adjacent light-emitting devices 400 can be electrically connected through the isolation structure 300 to facilitate control of the second electrodes 420 in the display panel 10.

[0141] Optionally, the material of the first isolation portion 310 may include a conductive material, and the second electrode 420 may be connected to the first isolation portion 310.

[0142] Optionally, the isolation structure 300 further includes a conductive portion 330 located on the side of the first isolation portion 310 facing the substrate 100. The conductive portion 330 protrudes from the first isolation portion 310 toward the isolation opening 300a, and the second electrode 420 is connected to the conductive portion 330. The conductive portion 330 protruding from the first isolation portion 310 toward the isolation opening 300a can increase the connection area between the second electrode 420 and the isolation structure 300, thereby effectively reducing the resistance of the display panel 10.

[0143] Optionally, the isolation structure 300 may be connected to at least a portion of the signal lines SL (not shown in the figure). For example, the isolation structure 300 may be connected to at least a portion of the signal lines SL via a via, so that at least a portion of the signal lines SL can be electrically connected to the second electrode 420 through the isolation structure 300.

[0144] In some alternative embodiments, the protective structure P completely fills the recessed structure SLa of the signal line SL within the groove 100a.

[0145] Optionally, the dimension of the protective structure P in the width direction of the signal line SL can be greater than or equal to the dimension of the recessed structure SLa in the width direction of the signal line SL, and the dimension of the protective structure P in the thickness direction X of the display panel 10 can be greater than or equal to the dimension of the recessed structure SLa in the width direction of the signal line SL, so as to make the protective structure P completely fill the recessed structure SLa of the signal line SL within the groove 100a.

[0146] In these optional embodiments, by setting the protective structure P to completely fill the recessed structure SLa of the signal line SL within the groove 100a, the protective structure P can further play a better planarization role. This makes it less likely that the material of the subsequent structure will break at the recessed structure SLa during the subsequent fabrication process of the display panel 10. As a result, when the material of the subsequent structure is patterned, the etching material is less likely to come into direct contact with the protective structure P or the signal line SL under the cover of the relatively continuous subsequent structure material. This allows the protective structure P and the signal line SL to have better structural reliability, thereby improving the structural reliability of the display panel 10.

[0147] In some alternative embodiments, the protective structure P has a transition surface Pa on the side of the recessed structure SLa that is away from the width direction of the signal line SL, and the transition surface Pa is inclined toward the signal line SL in a direction away from the substrate 100.

[0148] Optionally, in the direction away from the substrate 100, the transition surface Pa is inclined toward the signal line SL. Specifically, in the direction from the first line layer SL1 to the third line layer SL3, the transition surface Pa can be gradually inclined toward the signal line SL.

[0149] Optionally, the protective structure P may also have a top surface Pb on the side away from the substrate 100. Specifically, the protective structure P located on the third line layer SL3 may have a top surface Pb on the side away from the substrate 100, and the transition surface Pa may be disposed on both sides of the top surface Pb in the width direction of the signal line SL.

[0150] Optionally, the projection of the transition surface Pa onto the thickness direction X of the display panel 10 does not overlap with the projection of the third line layer SL3 onto the thickness direction X.

[0151] In these optional embodiments, by setting the transition surface Pa in a direction away from the substrate 100 and tilting it toward the signal line SL, the material of the subsequent structure can have good continuity on the transition surface Pa of the protective structure P during the subsequent fabrication process of the display panel 10. This makes it less likely for the material of the subsequent structure to break on the surface of the protective structure P. As a result, when the material of the subsequent structure is patterned, the etching material is less likely to come into direct contact with the protective structure P or the signal line SL under the cover of the relatively continuous material of the subsequent structure. This allows the protective structure P and the signal line SL to have better structural reliability, thereby improving the structural reliability of the display panel 10.

[0152] Furthermore, by setting the projection of the transition surface Pa on the thickness direction X of the display panel 10 to not overlap with the projection of the third line layer SL3 on the thickness direction X, the transition surface Pa can be located below the third line layer SL3, that is, the transition surface Pa can be located within the recessed structure SLa, so that the recessed structure SLa of the signal line SL located in the groove 100a can be better filled by the protective structure P.

[0153] In some alternative embodiments, the projection of the signal line SL located in the groove 100a onto the thickness direction X of the display panel 10 lies within the projection of the protective structure P onto the thickness direction X.

[0154] Optionally, a partial protective structure P covers the side of the signal line SL facing away from the substrate 100.

[0155] Optionally, the surface of the signal line SL located in the groove 100a, except for the surface that contacts the substrate 100, is covered by the protective structure P.

[0156] Optionally, the surface of the signal line SL located in the groove 100a that is not in contact with the substrate 100 is covered by the protective structure P. This can mean that the surface of the signal line SL located in the groove 100a that is not in contact with the substrate 100 is covered by the protective structure P.

[0157] Specifically, the inner wall surface of the recessed structure SLa on the signal line SL, the two side surfaces of the signal line SL in the width direction, and the surface of the signal line SL facing away from the substrate 100 can all be covered by the protective structure P.

[0158] In these optional embodiments, by reasonably setting the size and position of the protective structure P, the protective structure P can fully cover the surface of the signal line SL within the groove 100a. This allows the protective structure P to better limit the contact between the etching material and the signal line SL during the subsequent fabrication process of the display panel 10, thus better protecting the signal line SL. This makes the signal line SL less susceptible to being etched and damaged by the etching material, giving the signal line SL better structural reliability, and thereby improving the structural reliability of the display panel 10.

[0159] In some alternative embodiments, the protection structure P includes a first protection structure P1 covering the surface of the signal line SL and a second protection structure P2 covering the side of the first protection structure P1 opposite to the signal line SL.

[0160] Optionally, the material of the first protective structure P1 includes inorganic materials, and / or the material of the second protective structure P2 includes organic materials.

[0161] Optionally, the projection of the signal line SL located in the groove 100a onto the thickness direction X of the display panel 10 is located within the projection of the first protective structure P1 onto the thickness direction X, and the first protective structure P1 can adequately cover the surface of the signal line SL in the groove 100a.

[0162] Optionally, the first protective structure P1 may cover the side surface of the first line layer SL1 that extends from the second line layer SL2 and faces away from the substrate 100, as well as both sides of the first line layer SL1 in the width direction. Optionally, the first protective structure P1 may cover both sides of the second line layer SL2 in the width direction. Optionally, the first protective structure P1 may cover the side surface of the third line layer SL3 that extends from the second line layer SL2 and faces away from the substrate 100, the side surface of the third line layer SL3 that extends from the second line layer SL2 and faces the substrate 100, and both sides of the third line layer SL3 in the width direction.

[0163] Optionally, the transition surface Pa may be partially located on the second protective structure P2. Specifically, the second protective structure P2 has a transition surface Pa on the side away from the recessed structure SLa in the width direction of the signal line SL, and the transition surface Pa is inclined toward the signal line SL in the direction away from the substrate 100.

[0164] In these optional embodiments, by setting the protective structure P to include a first protective structure P1 and a second protective structure P2, the effects of covering the signal line SL and filling the recessed structure SLa can be effectively achieved, respectively. Specifically, the first protective structure P1 can be used to better cover the surface of the signal line SL, so that during the subsequent fabrication process of the display panel 10, the first protective structure P1 can better limit the contact between the etching material and the signal line SL, thereby better protecting the signal line SL. When the material of the first protective structure P1 includes inorganic materials, the first protective structure P1 is not easily invaded by moisture, making it less likely for moisture to affect the working stability of the signal line SL. The second protective structure P2 can be used to better fill the recessed structure SLa. By setting the material of the second protective structure P2 to include organic materials, the material of the second protective structure P2 can have good fluidity during its fabrication, allowing the material of the second protective structure P2 to flow well into the recessed structure SLa and better fill the recessed structure SLa.

[0165] In some alternative embodiments, a first protective structure P1 covering the inner wall of the recessed structure SLa encloses a gap space P11, and at least a portion of the second protective structure P2 fills the gap space P11.

[0166] Optionally, the second protective structure P2 completely fills the gap space P11.

[0167] Optionally, the dimension of the second protective structure P2 in the width direction of the signal line SL can be greater than or equal to the dimension of the gap space P11 in the width direction of the signal line SL, and the dimension of the second protective structure P2 in the thickness direction X of the display panel 10 can be greater than or equal to the dimension of the gap space P11 in the width direction of the signal line SL, so as to enable the second protective structure P2 to completely fill the gap space P11.

[0168] In these optional embodiments, the morphology of the first protective structure P1, which preferably covers the surface of the signal line SL, is easily affected by the morphology of the signal line SL. Specifically, under the influence of the recessed structure SLa of the signal line SL, the first protective structure P1 covering the inner wall of the recessed structure SLa is likely to form a gap space P11 at the recessed structure SLa. By filling at least part of the second protective structure P2 into the gap space P11, the second protective structure P2 can play a better planarization role. This allows the material of the subsequent structure to have better continuity in the groove 100a under the planarization effect of the second protective structure P2 during the subsequent fabrication process of the display panel 10. That is, the material of the subsequent structure is not likely to break at the gap space P11. As a result, when the material of the subsequent structure is patterned, under the shielding of the relatively continuous subsequent structure material, the etching material is not likely to directly contact the protective structure P or the signal line SL. This allows the protective structure P and the signal line SL to have better structural reliability, thereby improving the structural reliability of the display panel 10.

[0169] In some optional embodiments, the display panel 10 further includes a pixel definition layer 200, which includes a pixel defining portion 210 and a pixel opening 220 formed by the pixel defining portion 210 in the display area AA. At least a portion of the structure of the light-emitting device 400 is located within the pixel opening 220. The pixel definition layer 200 can also be used to divide the display panel 10 into sub-pixels.

[0170] Optionally, the isolation structure 300 may be disposed on the side of the pixel limiting portion 210 facing away from the substrate 100. Optionally, the pixel opening 220 may communicate with the isolation opening 300a.

[0171] Optionally, the pixel definition layer 200 may be made of inorganic materials, which enables the pixel definition layer 200 to have poor water absorption properties. This makes the pixel definition layer 200 less susceptible to expansion due to the influence of etching materials when the material of the isolation structure 300 is patterned to form the isolation structure 300, thus exhibiting better structural reliability.

[0172] In some alternative embodiments, the pixel defining portion 210 may extend from the display area AA to the non-display area NA and be partially located within the groove 100a, and the protective structure P is at least partially connected to the pixel defining portion 210 and disposed in the same layer and material.

[0173] Optionally, the first protective structure P1 can be connected to the pixel limiting part 210 and disposed on the same layer and with the same material.

[0174] Optionally, the first protective structure P1 may not have a clear interface with the pixel limiting part 210, that is, the first protective structure P1 may be integrally formed with the pixel limiting part 210.

[0175] Optionally, a pixel limiting part 210 may be connected between the two first protection structures P1 covering adjacent signal lines SL.

[0176] In these alternative embodiments, the pixel limiting portion 210 located in the non-display area NA can be used to limit the intrusion of moisture in the non-display area NA. By providing at least a portion of the pixel limiting portion 210 extending into the groove 100a, for example, the pixel limiting portion 210 can cover the sidewall of the groove 100a, so that moisture in the groove 100a is not easily intruded into the substrate 100 through the sidewall of the groove 100a, which can improve the structural reliability of the display panel 10.

[0177] By setting the protective structure P to be at least partially connected to the pixel defining portion 210 and made of the same layer and material, for example, by setting the first protective structure P1 to be connected to the pixel defining portion 210 and made of the same layer and material, the first protective structure P1 can be prepared using the same or similar preparation equipment as the pixel defining layer 200, and the first protective structure P1 can be prepared in the same preparation process step as the pixel defining layer 200, thereby improving the preparation efficiency of the display panel 10.

[0178] In the embodiments of this application, there are various ways to set the size of the second protective structure P2.

[0179] like Figure 4 As shown, in some optional embodiments, the second protection structure P2 may not be located on the side of the signal line SL away from the substrate 100. For example, the second protection structure P2 may be located only on both sides of the signal line SL in the width direction of the signal line SL.

[0180] Optionally, in the thickness direction X of the display panel 10, one edge of the transition surface Pa on the second protective structure P2 can be connected to the first protective structure P1 covering the first line layer SL1, and the other edge of the transition surface Pa on the second protective structure P2 can be connected to the first protective structure P1 covering the third line layer SL3. This makes it less likely for the material of the subsequent structure to break on the surface of the protective structure P. As a result, when the material of the subsequent structure is patterned, under the shielding of the relatively continuous material of the subsequent structure, the etching material is less likely to directly contact the protective structure P or the signal line SL. This allows the protective structure P and the signal line SL to have better structural reliability, thereby improving the structural reliability of the display panel 10.

[0181] In these optional embodiments, by setting the second protective structure P2 part to be located on the side of the signal line SL away from the substrate 100, the protective structure P is not easily too thick. When the material of the second protective structure P2 includes organic material, the size of the second protective structure P2 in the groove 100a can be effectively reduced, thereby reducing the amount of organic material in the groove 100a and making it difficult for moisture to diffuse in the groove 100a, thereby improving the structural reliability of the display panel 10.

[0182] Figure 5 This is a partial cross-sectional view of a signal line SL and a protection structure P provided in another embodiment of this application.

[0183] In some alternative embodiments, a portion of the second protection structure P2 is located on the side of the signal line SL away from the substrate 100.

[0184] Optionally, at least a portion of the second protective structure P2 may be located on the side of the first protective structure P1 that is opposite to the substrate 100 and covers the third line layer SL3, and preferably encapsulates the first protective structure P1.

[0185] In these alternative embodiments, by setting a portion of the second protective structure P2 on the side of the signal line SL away from the substrate 100, the second protective structure P2 can better cover the outside of the first protective structure P1, so that in the subsequent manufacturing process of the display panel 10, the material of the subsequent structure can more easily have better continuity in the groove 100a under the planarization effect of the second protective structure P2.

[0186] Figure 6 This is a partial cross-sectional view of a display panel 10 within a display area AA, provided in another embodiment of this application. Figure 7 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application.

[0187] like Figure 6 and Figure 7 As shown, in some optional embodiments, the display panel 10 further includes an encapsulation layer 500 disposed on the side of the light-emitting device 400 away from the substrate 100, the encapsulation layer 500 being used to encapsulate the light-emitting device 400.

[0188] Optionally, the encapsulation layer 500 includes a first encapsulation layer 510 disposed on the side of the light-emitting device 400 away from the substrate 100, and the first encapsulation layer 510 can be used to encapsulate the light-emitting device 400.

[0189] Optionally, the material of the first encapsulation layer 510 may include inorganic materials. Optionally, the first encapsulation layer 510 may be prepared by chemical vapor deposition (CVD).

[0190] Optionally, the first encapsulation layer 510 may include a first encapsulation unit 511 corresponding to the first opening 300aa, a second encapsulation unit 512 corresponding to the second opening 300ab, and a third encapsulation unit 513 corresponding to the third opening 300ac. The first encapsulation unit 511 may be at least partially located within the first opening 300aa and used to encapsulate the first light-emitting device 401. The second encapsulation unit 512 may be at least partially located within the second opening 300ab and used to encapsulate the second light-emitting device 402. The third encapsulation unit 513 may be at least partially located within the third opening 300ac and used to encapsulate the third light-emitting device 403.

[0191] Optionally, the first packaging unit 511, the second packaging unit 512, and the third packaging unit 513 can be arranged in pairs at intervals, so that the first packaging unit 511, the second packaging unit 512, and the third packaging unit 513 can encapsulate each light-emitting device 400 relatively independently.

[0192] Optionally, the encapsulation layer 500 may also include a second encapsulation layer 520 disposed on the side of the first encapsulation layer 510 facing away from the substrate 100, to further encapsulate the display panel 10.

[0193] Optionally, the material of the second encapsulation layer 520 may include organic materials. Optionally, the second encapsulation layer 520 may be prepared using inkjet printing (IJP) technology.

[0194] Optionally, the second encapsulation layer 520 may extend from the display area AA to the non-display area NA. Optionally, during the fabrication of the second encapsulation layer 520, the material of the second encapsulation layer 520 may not easily overflow in the non-display area NA due to the shielding effect of the groove 100a and the dam 170.

[0195] Optionally, the second encapsulation layer 520 may have better flatness on the side of the substrate 100, which facilitates the subsequent formation of a film or device on the second encapsulation layer 520.

[0196] Optionally, the encapsulation layer 500 may also include a third encapsulation layer 530 disposed on the side of the second encapsulation layer 520 away from the substrate 100, the third encapsulation layer 530 being able to further improve the encapsulation effect of the display panel 10.

[0197] Optionally, the material of the third encapsulation layer 530 may include inorganic materials. Optionally, the third encapsulation layer 530 may also be prepared by a chemical vapor deposition process.

[0198] Optionally, the third encapsulation layer 530 may extend from the display area AA to the non-display area NA to encapsulate the film structure of the non-display area NA as well, restricting moisture from entering the substrate 100 of the non-display area NA or the display area AA.

[0199] In some alternative embodiments, a portion of the encapsulation layer 500 is located within the recess 100a and covers the side surface of the protective structure P facing away from the substrate 100.

[0200] Optionally, a portion of the second encapsulation layer 520 is located within the recess 100a and covers the side surface of the protective structure P facing away from the substrate 100. For example, the protective structure P located within the recess 100a between the dam 170 and the display area AA may be covered by the second encapsulation layer 520.

[0201] Optionally, a portion of the third encapsulation layer 530 is located within the recess 100a and covers the side surface of the protective structure P facing away from the substrate 100. For example, the protective structure P located within the recess 100a on the side of the dam 170 facing away from the display area AA may be covered by the third encapsulation layer 530.

[0202] In these alternative embodiments, by setting a portion of the encapsulation layer 500 within the groove 100a and covering the side surface of the protective structure P facing away from the substrate 100, the encapsulation layer 500 can protect the protective structure P and the signal line SL located within the groove 100a, thereby further improving the structural reliability of the display panel 10.

[0203] Please see Figures 1 to 7 An embodiment of the first aspect of this application also provides a display panel 10, which has a display area AA and a non-display area NA. The display panel 10 includes: a substrate 100, in which a groove 100a is formed in the non-display area NA; a signal line SL, at least a portion of which is located within the groove 100a, and the sidewall of the signal line SL has a recessed structure SLa; and a protective structure P, including a first protective structure P1 covering the surface of the signal line SL and a second protective structure P2 covering the side of the first protective structure P1 away from the signal line SL. The first protective structure P1 covering the inner wall of the recessed structure SLa forms a gap space P11, and at least a portion of the second protective structure P2 fills the gap space P11.

[0204] In a display panel 10 provided in this application embodiment, the display panel 10 has a display area AA and a non-display area NA. The display panel 10 includes a substrate 100, signal lines SL, and a protective structure P. The substrate 100 has a groove 100a in the non-display area NA, and at least a portion of the signal lines SL are located in the groove 100a. The sidewalls of the signal lines SL have recessed structures SLa. The signal lines SL can be used to transmit signals in the display panel 10.

[0205] The protective structure P includes a first protective structure P1 covering the surface of the signal line SL and a second protective structure P2 covering the side of the first protective structure P1 opposite to the signal line SL. These structures effectively cover the signal line SL and fill the recessed structure SLa, respectively. Specifically, the first protective structure P1 effectively covers the surface of the signal line SL, ensuring that during subsequent fabrication of the display panel 10, it effectively limits contact between the etching material and the signal line SL, thus better protecting the signal line SL.

[0206] Meanwhile, the morphology of the first protective structure P1, which is better covered on the surface of the signal line SL, is easily affected by the morphology of the signal line SL. For example, under the influence of the recessed structure SLa of the signal line SL, the first protective structure P1 covering the inner wall of the recessed structure SLa is likely to form a gap space P11 at the recessed structure SLa. By filling at least part of the second protective structure P2 into the gap space P11, the second protective structure P2 can play a better planarization role. In the subsequent manufacturing process of the display panel 10, the material of the subsequent structure can more easily have good continuity in the groove 100a under the planarization effect of the second protective structure P2. That is, the material of the subsequent structure is not easy to break at the gap space P11. Thus, when the material of the subsequent structure is patterned, under the shielding of the relatively continuous material of the subsequent structure, the etching material is not easy to directly contact the protective structure P or the signal line SL. This makes the protective structure P and the signal line SL have good structural reliability, thereby improving the structural reliability of the display panel 10.

[0207] Optionally, the display panel 10 provided in the first aspect of this application may be the display panel 10 in any of the foregoing embodiments. Therefore, the display panel 10 provided in the embodiments of this application may have the structure and beneficial effects of the display panel 10 in any of the foregoing embodiments, and this application will not elaborate on it further.

[0208] For example, substrate 100 may be substrate 100 in any of the foregoing embodiments. For example, signal line SL may be signal line SL in any of the foregoing embodiments, and signal line SL may include the first line layer SL1, the second line layer SL2, and the third line layer SL3 in any of the foregoing embodiments. For example, protective structure P may be protective structure P in any of the foregoing embodiments, and the size and arrangement position of protective structure P may be set with reference to the size and arrangement position of protective structure P in any of the foregoing embodiments.

[0209] Optionally, an embodiment of the first aspect of this application also provides a display panel 10 that may include the light-emitting device 400, pixel definition layer 200, isolation structure 300 and encapsulation layer 500 described in any of the foregoing embodiments, so as to obtain the beneficial effects that can be obtained in any of the foregoing embodiments.

[0210] Figure 8 This is a schematic flowchart of a method for manufacturing a display panel 10 according to an embodiment of this application. Figures 9 to 22 This is a schematic diagram of the preparation process of a method for preparing a display panel 10 provided in an embodiment of this application.

[0211] The second aspect of this application provides a method for manufacturing a display panel 10, the display panel 10 having a display area AA and a non-display area NA. Please refer to... Figure 8 And see Figures 9 to 22 The preparation methods include:

[0212] Step S10: As Figure 9 As shown, a groove 100a is formed in the substrate 100, and at least a portion of the signal line SL is exposed from the groove 100a and located within the groove 100a. The sidewall of the signal line SL has a recessed structure SLa.

[0213] Optionally, after step S10, a plurality of spaced first electrodes 410 may be prepared on one side of the substrate 100.

[0214] Step S20: As Figure 10 and Figure 11 As shown, a protective structure P is prepared, and at least part of the protective structure P is filled in the recessed structure SLa.

[0215] In the method for manufacturing the display panel 10 provided in this application embodiment, by setting at least a portion of the protective structure P to fill the recessed structure SLa, the protective structure P can play a good planarization role. This allows the material of the subsequent structure to have good continuity within the groove 100a under the planarization effect of the protective structure P during the subsequent manufacturing process of the display panel 10. That is, the material of the subsequent structure is less likely to break at the recessed structure SLa. As a result, when the material of the subsequent structure is patterned, the etching material is less likely to directly contact the protective structure P or the signal line SL under the shielding of the relatively continuous subsequent structure material. This allows the protective structure P and the signal line SL to have good structural reliability, thereby improving the structural reliability of the display panel 10.

[0216] Optionally, the display panel 10 prepared by the preparation method provided in this application can be any of the display panels 10 provided in the first aspect of the above-mentioned embodiments. Therefore, the display panel 10 prepared by the preparation method provided in this application can have the structure and beneficial effects of the display panel 10 in any of the aforementioned embodiments, and this application will not elaborate further on it.

[0217] Optionally, the protection structure P includes a first protection structure P1 covering the surface of the signal line SL and a second protection structure P2 covering the side of the first protection structure P1 opposite to the signal line SL. The first protection structure P1 can be any of the first protection structures described in the first aspect embodiment above, and the second protection structure P2 can be any of the second protection structures described in the first aspect embodiment above.

[0218] In some optional embodiments, step S20 includes:

[0219] Step S21: As Figure 10 As shown, a pixel definition material layer D is prepared on one side of the substrate 100. The pixel definition material layer D extends from the display area AA to the non-display area NA and is partially located in the groove 100a. The pixel definition material layer D located in the groove 100a and covering the surface of the signal line SL forms a first protective structure P1.

[0220] Step S22: As Figure 11 As shown, a second protective structure P2 is prepared on the first protective structure P1.

[0221] Optionally, the first protective structure P1 covering the inner wall of the recessed structure SLa encloses and forms a gap space P11, and at least part of the second protective structure P2 fills the gap space P11.

[0222] Among them, the morphology of the first protective structure P1 that is better covered on the surface of the signal line SL is easily affected by the morphology of the signal line SL. Specifically, under the influence of the recessed structure SLa of the signal line SL, the first protective structure P1 covering the inner wall of the recessed structure SLa is prone to forming a gap space P11 at the recessed structure SLa.

[0223] In these optional embodiments, the pixel definition material layer D can be used to form the pixel definition layer 200 in subsequent fabrication processes. By setting the pixel definition material layer D located in the groove 100a and covering the surface of the signal line SL in step S21 to form the first protective structure P1, the fabrication efficiency of the display panel 10 can be improved.

[0224] In some alternative embodiments, step S22 may include: such as Figure 12As shown, the pixel definition material layer D is patterned to form a pixel definition layer 200. The pixel definition layer 200 includes a pixel limiting portion 210 and a pixel opening 220 located in the display area AA, which is enclosed by the pixel limiting portion 210.

[0225] Optionally, the pixel definition layer 200 may be the pixel definition layer 200 described in any of the foregoing embodiments.

[0226] Optionally, a pixel defining portion 210 may be connected between the two first protective structures P1 covering adjacent signal lines SL. For example, in the step of patterning the pixel defining material layer D to form the pixel defining layer 200, the pixel defining material layer D in the non-display area NA may not be etched, so that a pixel defining portion 210 may be connected between the two first protective structures P1 covering adjacent signal lines SL.

[0227] By fabricating the second protective structure P2 and then patterning the pixel definition material layer D to form the pixel definition layer 200, the protective structure P can provide better protection for the signal line SL when the pixel definition material layer D is patterned, making it less likely for the etching material to damage the signal line SL.

[0228] In some optional embodiments, the method further includes the following after step S20:

[0229] Step S30: As Figures 13 to 19 As shown, a light-emitting device 400 and a first encapsulation layer 510 located on the side of the light-emitting device 400 away from the substrate 100 are fabricated.

[0230] Optionally, in step S30, the light-emitting device 400 and the first encapsulation layer 510 described in any of the foregoing embodiments may be formed.

[0231] In the method for fabricating the display panel 10 provided in this application embodiment, by setting at least a portion of the protective structure P to fill the recessed structure SLa, the materials of the light-emitting unit 430 and the first electrode 410 in each light-emitting device 400 can more easily have good continuity in the groove 100a under the planarization effect of the protective structure P during the subsequent fabrication of the light-emitting device 400. That is, the materials of the light-emitting unit 430 and the first electrode 410 in the light-emitting device 400 are less likely to be broken at the recessed structure SLa. As a result, when the material of the light-emitting device 400 is patterned, under the shielding of the relatively continuous materials of the light-emitting unit 430 and the first electrode 410 in each light-emitting device 400, the etching material is less likely to directly contact the protective structure P or the signal line SL. This makes the protective structure P and the signal line SL have better structural reliability, thereby improving the structural reliability of the display panel 10.

[0232] In some alternative embodiments, step S30 may include:

[0233] Step S31: As Figure 13 As shown, an isolation structure 300 is prepared on one side of the substrate 100. The isolation structure 300 encloses and forms an isolation opening 300a, which includes a first opening 300aa.

[0234] Optionally, in step S31, the isolation structure 300 described in any of the foregoing embodiments may be prepared.

[0235] Step S32: As Figure 14 As shown, the first device material layer E1 and the first encapsulation material layer C1 are sequentially prepared on the entire surface, and the first device material layer E1 is continuous on the protective structure P.

[0236] Optionally, the first device material layer E1 may include a first light-emitting material layer E11 and a first conductive material layer E12 located on the side of the first light-emitting material layer E11 facing away from the substrate 100. The first light-emitting material layer E11 may be used to form the light-emitting unit 430 of the first light-emitting device 401, and the first conductive material layer E12 may be used to form the second electrode 420 of the first light-emitting device 401.

[0237] Step S33: As Figure 15 As shown, the first device material layer E1 and the first encapsulation material layer C1 outside the first opening 300aa are removed to form the first light-emitting device 401 and the first encapsulation unit 511 corresponding to the first opening 300aa.

[0238] In these optional embodiments, in step S32, due to the planarization effect of the protective structure P, a relatively continuous first device material layer E1 can be formed on the signal line SL and the protective structure P. This makes it possible for the first device material layer E1 and the first encapsulation material layer C1 outside the first opening 300aa to be etched and removed in step S33. Under the shielding effect of the relatively continuous first device material layer E1, the etching material is less likely to directly contact the protective structure P or the signal line SL. This allows the protective structure P and the signal line SL to have better structural reliability, thereby improving the structural reliability of the display panel 10.

[0239] In some optional embodiments, the isolation opening 300a further includes a second opening 300ab, and the process further includes the following after step S33:

[0240] Step S34: As Figure 16 As shown, the second device material layer E2 and the second encapsulation material layer C2 are sequentially prepared on the entire surface, and the second device material layer E2 is continuous on the protective structure P.

[0241] Optionally, the second device material layer E2 may include a second light-emitting material layer E21 and a second conductive material layer E22 located on the side of the second light-emitting material layer E21 facing away from the substrate 100. The second light-emitting material layer E21 may be used to form the light-emitting unit 430 of the second light-emitting device 402, and the second conductive material layer E22 may be used to form the second electrode 420 of the second light-emitting device 402.

[0242] Step S35: As Figure 17 As shown, the second device material layer E2 and the second encapsulation material layer C2 outside the second opening 300ab are removed to form the second light-emitting device 402 and the second encapsulation unit 512 corresponding to the second opening 300ab.

[0243] In this optional embodiment, in step S34, due to the planarization effect of the protective structure P, a relatively continuous second device material layer E2 can be formed on the signal line SL and the protective structure P. This makes it possible for the second device material layer E2 and the second encapsulation material layer C2 outside the second opening 300ab to be etched and removed in step S35. Under the shielding effect of the relatively continuous second device material layer E2, the etching material is less likely to directly contact the protective structure P or the signal line SL. This allows the protective structure P and the signal line SL to have better structural reliability, thereby improving the structural reliability of the display panel 10.

[0244] In some optional embodiments, the isolation opening 300a further includes a third opening 300ac, and the method further includes the following after step S35:

[0245] Step S36: As Figure 18 As shown, the third device material layer E3 and the third encapsulation material layer C3 are sequentially prepared on the entire surface, and the third device material layer E3 is continuous on the protective structure P.

[0246] Optionally, the third device material layer E3 may include a third light-emitting material layer E31 and a third conductive material layer E32 located on the side of the third light-emitting material layer E31 facing away from the substrate 100. The third light-emitting material layer E31 may be used to form the light-emitting unit 430 of the third light-emitting device 403, and the third conductive material layer E32 may be used to form the second electrode 420 of the third light-emitting device 403.

[0247] Step S37: As Figure 19 As shown, the third device material layer E3 and the third encapsulation material layer C3 outside the third opening 300ac are removed to form a third light-emitting device 403 and a third encapsulation unit 513 corresponding to the third opening 300ac.

[0248] In this optional embodiment, in step S36, due to the planarization effect of the protective structure P, a relatively continuous third device material layer E3 can be formed on the signal line SL and the protective structure P. This makes it possible for the third device material layer E3 and the third encapsulation material layer C3 outside the third opening 300ac to be etched and removed in step S37. Under the shielding effect of the relatively continuous third device material layer E3, the etching material is less likely to directly contact the protective structure P or the signal line SL. This allows the protective structure P and the signal line SL to have better structural reliability, thereby improving the structural reliability of the display panel 10.

[0249] In some optional embodiments, step S30 is followed by:

[0250] Step S40: As Figure 20 As shown, a second encapsulation layer 520 is formed on the first encapsulation layer 510, and a portion of the second encapsulation layer 520 is located within the groove 100a and covers the side surface of the protective structure P facing away from the substrate 100.

[0251] Optionally, step S40 may further include:

[0252] Step S50: As Figure 21 As shown, a third encapsulation layer 530 is formed on the second encapsulation layer 520, and a portion of the third encapsulation layer 530 is located in the groove 100a and covers the side surface of the protective structure P opposite to the substrate 100.

[0253] In these optional embodiments, the second encapsulation layer 520 and the third encapsulation layer 530 may be the second encapsulation layer 520 and the third encapsulation layer 530 in any of the foregoing embodiments, and thus have the same or similar beneficial effects as the second encapsulation layer 520 and the third encapsulation layer 530 in any of the foregoing embodiments. This application will not elaborate further.

[0254] In some optional embodiments, unlike the display panel 10 provided in the first aspect embodiment described above, the display panel 10 prepared by the preparation method provided in this application embodiment may not have a complete protective structure P. For example, the display panel 10 prepared by the preparation method provided in this application embodiment may not have a second protective structure P2, but only a first protective structure P1.

[0255] Optionally, after step S30, the following may be included: Figure 22 As shown, the second protective structure P2 is removed.

[0256] In these alternative embodiments, by removing the second protective structure P2 after the light-emitting device 400 and the first encapsulation layer 510 are completed, the size of the second protective structure P2 in the groove 100a can be effectively reduced, thereby reducing the amount of organic material in the groove 100a and making it difficult for moisture to diffuse in the groove 100a, thus improving the structural reliability of the display panel 10.

[0257] An embodiment of the third aspect of this application provides a display device, which includes a display panel 10 of any of the above embodiments, or a display panel 10 prepared using the preparation method of any of the above embodiments. Since the display device provided by the third aspect of this application includes the display panel 10 of any of the first aspects, or includes a display panel 10 prepared using the preparation method of any of the second aspects, the display device provided by the second aspect of this application has the beneficial effects of the display panel 10 of any of the first aspects or the display panel 10 prepared using the preparation method of any of the second aspects, which will not be elaborated further here.

[0258] The display devices in this application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0259] The embodiments described above are not exhaustive and do not limit the invention to specific examples. Clearly, many modifications and variations can be made based on the above description. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of this application, thereby enabling those skilled in the art to effectively utilize this application and its modifications. This application is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized by, The display panel has a display area and a non-display area, and comprises: a substrate, which is provided with a groove in the non-display area; a signal line, at least part of which is located in the groove, and a side wall of the signal line has a recessed structure; a protection structure, at least part of which is filled in the recessed structure.

2. The display panel of claim 1, wherein, The protection structure completely fills the recessed structure of the signal line in the groove.

3. The display panel of claim 1, wherein, The protection structure has a transition surface on a side thereof away from the recessed structure in a width direction of the signal line, and the transition surface is arranged to be inclined toward the signal line in a direction away from the substrate.

4. The display panel of claim 1, wherein, A projection of the signal line in the groove in a thickness direction of the display panel is located in a projection of the protection structure in the thickness direction. Preferably, part of the protection structure covers a side surface of the signal line away from the substrate. Preferably, a surface of the signal line in the groove, except a surface thereof in contact with the substrate, is covered by the protection structure.

5. The display panel of claim 1, wherein, The protection structure comprises a first protection structure covering a surface of the signal line and a second protection structure covering a side of the first protection structure away from the signal line. Preferably, a material of the first protection structure comprises an inorganic material, and / or a material of the second protection structure comprises an organic material. Preferably, a projection of the signal line in the groove in a thickness direction of the display panel is located in a projection of the first protection structure in the thickness direction. Preferably, part of the second protection structure is located on a side of the signal line away from the substrate.

6. The display panel of claim 5, wherein, The first protection structure covering an inner wall surface of the recessed structure encloses a gap space, and at least part of the second protection structure is filled in the gap space. Preferably, the second protection structure completely fills the gap space.

7. The display panel of any one of claims 1 to 6, wherein, The signal line comprises a first line layer, a second line layer on a side of the first line layer away from the substrate, and a third line layer on a side of the second line layer away from the substrate, and the second line layer is recessed relative to the first line layer and the third line layer to form the recessed structure. Preferably, a material of the first line layer and / or the third line layer comprises titanium. Preferably, a material of the second line layer comprises aluminum. Preferably, the protection structure has a transition surface on a side thereof away from the recessed structure in a width direction of the signal line, and the transition surface is arranged to be inclined toward the signal line in a direction away from the substrate. Preferably, a projection of the transition surface in a thickness direction of the display panel does not overlap a projection of the third line layer in the thickness direction.

8. The display panel of any one of claims 1 to 6, wherein, The display panel further comprises a light-emitting device arranged on a side of the substrate and located in the display area, the light-emitting device comprising a first electrode, a light-emitting unit on a side of the first electrode away from the substrate, and a second electrode on a side of the light-emitting unit away from the substrate, the number of the signal lines is multiple, at least part of the signal lines are electrically connected with the second electrode, and / or at least part of the signal lines are electrically connected with the first electrode. Preferably, the display panel further comprises an isolation structure disposed on one side of the substrate, the isolation structure encloses an isolation opening, the light emitting device is at least partially disposed in the isolation opening, the isolation structure comprises a conductive material, the second electrode is connected with the isolation structure, and the isolation structure is electrically connected with at least part of the signal lines; Preferably, the isolation structure comprises a first isolation portion and a second isolation portion disposed on the side of the first isolation portion away from the substrate, the second isolation portion is protruded from the first isolation portion and faces the isolation opening; Preferably, the isolation structure further comprises a conductive portion disposed on the side of the first isolation portion facing the substrate, the conductive portion is protruded from the first isolation portion and faces the isolation opening, and the second electrode is connected with the conductive portion; Preferably, the display panel further comprises an encapsulation layer disposed on the side of the light emitting device away from the substrate; Preferably, part of the encapsulation layer is disposed in the groove and covers the side surface of the protection structure away from the substrate; Preferably, the encapsulation layer comprises a first encapsulation layer disposed on the side of the light emitting device away from the substrate, a second encapsulation layer disposed on the side of the first encapsulation layer away from the substrate, and a third encapsulation layer disposed on the side of the second encapsulation layer away from the substrate, part of the second encapsulation layer is disposed in the groove and covers the side surface of the protection structure away from the substrate, and / or part of the third encapsulation layer is disposed in the groove and covers the side surface of the protection structure away from the substrate; Preferably, the material of the first encapsulation layer comprises an inorganic material, the material of the second encapsulation layer comprises an organic material, and / or the material of the third encapsulation layer comprises an organic material.

9. The display panel of claim 8, wherein, The display panel further comprises a pixel definition layer, the pixel definition layer comprises a pixel limiting portion and a pixel opening in the display area enclosed by the pixel limiting portion, and the light emitting device is at least partially disposed in the pixel opening; Preferably, the pixel limiting portion extends from the display area to the non-display area and is partially disposed in the groove, and the protection structure is at least partially connected with the pixel limiting portion and is disposed in the same layer and with the same material; Preferably, the protection structure comprises a first protection structure covering the surface of the signal line and a second protection structure covering the side of the first protection structure away from the signal line, and the first protection structure is connected with the pixel limiting portion and is disposed in the same layer and with the same material.

10. The display panel of any one of claims 1 to 6, wherein, The substrate comprises a substrate and a planarization layer disposed on one side of the substrate, and the planarization layer encloses at least part of the groove; Preferably, the substrate further comprises a dam disposed apart from the planarization layer, and the groove is formed between the dam and the planarization layer; Preferably, part of the signal lines is located between the planarization layer and the substrate; Preferably, the substrate further comprises a transistor between the planarization layer and the substrate, and the signal lines are located between the transistor and the planarization layer.

11. A display panel, characterized by, The display panel has a display area and a non-display area, and the display panel comprises: A substrate has a recess in the non-display region; A signal line is at least partially located in the recess, and a side wall of the signal line has a recessed structure; A protection structure includes a first protection structure covering a surface of the signal line and a second protection structure covering a side of the first protection structure away from the signal line, and the first protection structure covering an inner wall of the recessed structure encloses a gap space, and at least part of the second protection structure is filled in the gap space.

12. The display panel of claim 11, wherein, The protection structure completely fills the recessed structure of the signal line in the recess; Preferably, the second protection structure completely fills the gap space; Preferably, the second protection structure has a transition surface on a side of the signal line away from the recessed structure in a width direction of the signal line, and the transition surface is arranged to be inclined toward the signal line in a direction away from the substrate.

13. The display panel of any one of claims 11 or 12, wherein, The display panel further includes a pixel definition layer including a pixel limiting portion and a pixel opening in the display region enclosed by the pixel limiting portion, the pixel limiting portion extends from the display region to the non-display region and is partially located in the recess, the first protection structure is connected with the pixel limiting portion and is arranged to be of the same layer and material; Preferably, the material of the first protection structure includes an inorganic material, and / or the material of the second protection structure includes an organic material; Preferably, the display panel further includes a light emitting device arranged on a side of the substrate and at least partially located in the pixel opening, the light emitting device includes a first electrode, a light emitting unit on a side of the first electrode away from the substrate, and a second electrode on a side of the light emitting unit away from the substrate, the number of the signal lines is multiple, at least part of the signal lines are electrically connected with the second electrode, and / or at least part of the signal lines are electrically connected with the first electrode.

14. A method for manufacturing a display panel, characterized by, The display panel has a display region and a non-display region, and the preparation method includes: A recess is formed in a substrate, and at least part of a signal line is exposed from the recess and located in the recess, and a side wall of the signal line has a recessed structure; A protection structure is prepared, and at least part of the protection structure is filled in the recessed structure.

15. The preparation method according to claim 14, characterized in that, The protection structure includes a first protection structure covering a surface of the signal line and a second protection structure covering a side of the first protection structure away from the signal line, and in the step of preparing the protection structure, it includes: A pixel definition material layer is prepared on a side of the substrate, the pixel definition material layer extends from the display region to the non-display region and is partially located in the recess, and the pixel definition material layer located in the recess and covering the surface of the signal line forms the first protection structure; The second protection structure is prepared on the first protection structure; Preferably, the first protection structure covering the inner wall of the recessed structure encloses a gap space, and at least part of the second protection structure is filled in the gap space; Preferably, after the step of preparing the second protection structure on the first protection structure, it includes: The material layer is patterned to form a pixel definition layer, the pixel definition layer comprises a pixel definition part and a pixel opening in the display area enclosed by the pixel definition part.

16. The method of making according to any one of claims 14 or 15, wherein, After the step of preparing the protection structure, further comprising: Preparation of a light emitting device and a first encapsulation layer on the side of the light emitting device away from the substrate.

17. The method of claim 16, wherein, In the step of preparing a light emitting device and a first encapsulation layer on the side of the light emitting device away from the substrate, comprising: Preparation of an isolation structure on one side of the substrate, the isolation structure enclosing an isolation opening, the isolation opening comprising a first opening; Sequentially preparing a first device material layer and a first encapsulation material layer on the whole surface, the first device material layer being continuous on the protection structure; Removing the first device material layer and the first encapsulation material layer outside the first opening to form a first light emitting device and a first encapsulation unit corresponding to the first opening; Preferably, the isolation opening further comprises a second opening, and after the step of forming a first light emitting device and a first encapsulation unit corresponding to the first opening, further comprising: Sequentially preparing a second device material layer and a second encapsulation material layer on the whole surface, the second device material layer being continuous on the protection structure; Removing the second device material layer and the second encapsulation material layer outside the second opening to form a second light emitting device and a second encapsulation unit corresponding to the second opening; Preferably, the isolation opening further comprises a third opening, and after the step of forming a second light emitting device and a second encapsulation unit corresponding to the second opening, further comprising: Sequentially preparing a third device material layer and a third encapsulation material layer on the whole surface, the third device material layer being continuous on the protection structure; Removing the third device material layer and the third encapsulation material layer outside the third opening to form a third light emitting device and a third encapsulation unit corresponding to the third opening.

18. The method of claim 16, wherein, After the step of preparing a light emitting device and a first encapsulation layer on the side of the light emitting device away from the substrate, further comprising: Forming a second encapsulation layer on the first encapsulation layer, part of the second encapsulation layer being located in the groove and covering the surface of the side of the protection structure away from the substrate; Preferably, after the step of forming a second encapsulation layer on the first encapsulation layer, further comprising: Forming a third encapsulation layer on the second encapsulation layer, part of the third encapsulation layer being located in the groove and covering the surface of the side of the protection structure away from the substrate.

19. The method of claim 18, wherein, The protection structure comprises a first protection structure covering the surface of the signal line and a second protection structure covering the side of the first protection structure away from the signal line, and after the step of preparing a light emitting device and a first encapsulation layer on the side of the light emitting device away from the substrate, further comprising: Removing the second protection structure.

20. A display device comprising: A display panel as claimed in any one of claims 1 to 13, or a display panel prepared using the preparation method of any one of claims 14 to 19.

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