Method for recovering resin component from plated resin member

Abstract

A method for recovering a resin component from a plated resin member, which separates a plating component from a plated resin member in which the surface of the resin member has been plated, and recovers the resin component, the method comprising: a treatment step (A) in which the plated resin member is heated; a treatment step B in which cooling is performed after the treatment step A; and a treatment step (C) in which crushing is performed after the treatment step (B).

Description

TECHNICAL FIELD

[0001] The present application relates to a method for recovering a resin component from a plated resin member. In detail, the present application relates to a method for efficiently separating a plated component and recovering a resin component from a plated resin member in which plating is performed on the surface of a resin member, in a simple manner. BACKGROUND

[0002] A molded article formed of an ABS resin is used in a wide range of fields such as office equipment, information / communication equipment, electronic / electrical equipment, home electric appliances, vehicles such as automobiles, and construction, because of excellent impact resistance, mechanical strength, and chemical resistance. In addition, a molded article formed of an ABS resin has the following characteristics: when a plated processed article is produced by performing plating treatment, the plated appearance is excellent, the adhesion strength of the plated film is high, and further, the cold-heat cycle characteristics are excellent. Therefore, a molded article formed of an ABS resin is also used for various purposes as a plated resin member.

[0003] In recent years, because of an increase in concern about environmental problems, for waste, non-standard articles of a plated resin member, the resin component is recovered by separating the plated component and the resin component and recycling, and various methods for performing such recycling have been proposed.

[0004] For example, in Patent Literature 1, a method is proposed in which a plastic member with a coating film formed on the surface of a plastic member is exposed to a high-temperature atmosphere of 400°C or higher and 1000°C or lower, and the coating film is subjected to a brittle treatment to be removed.

[0005] In Patent Literature 2, a method for recovering a resin component from a plated resin material by a fine pulverization process and a division process is proposed, in which, in the fine pulverization process, a coarse pulverized product obtained by roughly pulverizing a plated resin material collides with each other in a high-speed vortex to be pulverized, and in the division process, the pulverized product is divided into a plurality of pieces corresponding to the particle diameter and the plated component is separated.

[0006] PRIOR ART DOCUMENTS

[0007] PATENT LITERATURE

[0008] Patent Literature 1: Japanese Patent Application Laid-Open No. 2012-167213

[0009] Patent Literature 2: Japanese Patent Application Laid-Open No. 2001-353723 SUMMARY

[0010] PROBLEMS TO BE SOLVED BY THE INVENTION

[0011] The prior art methods have the following problems, and cannot obtain a result commensurate with the recovery cost.

[0012] (1) requires a heating treatment at an extremely high temperature (for example, Patent Literature 1), a cooling treatment at an extremely low temperature.

[0013] (2) requires special equipment for pulverization (for example, Patent Literature 2).

[0014] (3) is complicated.

[0015] (4) requires expensive equipment and a large amount of energy consumption.

[0016] In particular, in a method in which a resin member with plating is directly subjected to a pulverization treatment, sometimes the plating film is trapped in the resin member due to the pulverization, and it is difficult to peel off from the resin member, and the recovery efficiency is poor.

[0017] In addition, in the conventional methods, although a large amount of research has been conducted on the recovery of metals as plating components, almost no research has been conducted on the recovery of resin components.

[0018] An object of the present application is to provide a method for recovering a resin component from a resin member with plating, which is a method for recovering a resin component by separating a plating component from a resin member with plating in which plating has been performed on the surface of the resin member, and which has the following advantages and is highly versatile.

[0019] (1) does not require a heating treatment at an extremely high temperature, a cooling treatment at an extremely low temperature.

[0020] (2) does not require large or expensive special equipment.

[0021] (3) enables easy and efficient recovery of a resin component from all resin members with plating with a small amount of energy.

[0022] Means for solving the problem

[0023] The present inventors have found that the above problem can be solved by heating a resin member with plating and then performing pulverization.

[0024] The gist of the present application is as follows.

[0025] [1] A method for recovering a resin component from a resin member with plating, which is a method for recovering a resin component by separating a plating component from a resin member with plating in which plating has been performed on the surface of the resin member, wherein the method for recovering a resin component comprises: a treatment step A of heating the resin member with plating; a treatment step B of cooling after the treatment step A; and a treatment step C of pulverization after the treatment step B.

[0026] [2] The method for recovering a resin component from a plated resin member according to [1], wherein the heating treatment temperature in the treatment step A is 100°C to 200°C.

[0027] [3] The method for recovering a resin component from a plated resin member according to [1] or [2], wherein the cooling treatment temperature in the treatment step B is 0°C or lower.

[0028] [4] The method for recovering a resin component from a plated resin member according to any one of [1] to [3], wherein the treatment step C is performed under a temperature condition of 0°C or lower immediately after the treatment step B.

[0029] [5] The method for recovering a resin component from a plated resin member according to any one of [1] to [4], comprising a treatment step E in which a plated component remaining on the surface of the resin member after the treatment step C is dissolved and removed.

[0030] [6] The method for recovering a resin component from a plated resin member according to [5], comprising a treatment step D between the treatment step C and the treatment step E, in which a plated component peeled from the resin member by crushing in the treatment step C is separated.

[0031] [7] The method for recovering a resin component from a plated resin member according to any one of [1] to [6], wherein the resin component comprises a styrene resin.

[0032] [8] The method for recovering a resin component from a plated resin member according to [7], wherein the resin component is a styrene resin.

[0033] [9] The method for recovering a resin component from a plated resin member according to [7] or [8], wherein the styrene resin is an ABS resin.

[0034]

[10] The method for recovering a resin component from a plated resin member according to any one of [1] to [9], wherein the plated resin member is a vehicle component or a waste thereof.

[0035] Inventive Effects

[0036] The method for recovering a resin component from a plated resin member according to the present invention does not require a super-high temperature heating treatment, an extremely low temperature cooling treatment, a large or high-priced and special equipment, and can easily and efficiently recover a resin component from all plated resin members with a small amount of energy.

[0037] The resin component recovered by the present application can be recycled without greatly impairing the properties required of the resin product, by itself or by mixing with a new resin.

[0038] In addition, according to the present application, the plated metal component can also be separated and recovered from the resin component, and recycled as a valuable metal. DETAILED DESCRIPTION

[0039] The embodiments of the present application will be described in detail below.

[0040] The method for recovering a resin component from a plated resin member of the present application is a method for recovering a resin component by separating a plated component from a plated resin member on which plating has been performed on the surface of the resin member, and sequentially performing the following treatment steps A to C.

[0041] The method for recovering a resin component from a plated resin member of the present application preferably includes the following treatment step E after the treatment step C.

[0042] The method for recovering a resin component from a plated resin member of the present application can include the following treatment step D between the treatment step C and the treatment step E.

[0043] The method for recovering a resin component from a plated resin member of the present application can include the following treatment step F after the treatment step E.

[0044] The method for recovering a resin component from a plated resin member of the present application can further include the following treatment step G and treatment step H.

[0045] Treatment step A: treatment step of heating the plated resin member

[0046] Treatment step B: treatment step of cooling the plated resin member subjected to the treatment step A

[0047] Treatment step C: treatment step of crushing the plated resin member subjected to the treatment step B

[0048] Treatment step D: treatment step of separating the plated component peeled from the resin member by crushing in the treatment step C

[0049] Treatment step E: treatment step of dissolving and removing the plated component remaining on the surface of the resin member after the treatment step C or the treatment step D

[0050] Treatment step F: treatment step of water washing and drying the resin member subjected to the treatment step E

[0051] Treatment step G: treatment step of separating by grinding the crushed product of the resin member obtained in the treatment step C or the treatment step D

[0052] Treatment Step H: Treatment Step of pelletizing the resin component obtained by the Treatment Step C, the Treatment Step D or the Treatment Step G

[0053] In the present application, the Treatment Steps A to C or the Treatment Steps A to D are carried out in the order of the Treatment Step A → the Treatment Step B → the Treatment Step C or the Treatment Step A → the Treatment Step B → the Treatment Step C → the Treatment Step D.

[0054] As for the Treatment Step E, the Treatment Step F, the Treatment Step G and the Treatment Step H, the order and the combination are not particularly limited, and the necessary Treatment Step can be selected depending on the processing situation, and carried out in any combination at any stage.

[0055] Therefore, in the process of the Treatment Steps A to C or the Treatment Steps A to D, or in the process thereafter, the necessary Treatment Step can be selected from among these Treatment Steps E to H on the basis of observation of the separation state of the plated component or the like, and carried out by determining the order thereof.

[0056] Hereinafter, the plated resin member as a processing object in the present application and the operation method, the processing conditions and the like of each of the Treatment Steps will be described.

[0057] <Plated Resin Member>

[0058] The plated resin member as a processing object in the present application is a member in which plating is carried out on the surface of a resin member.

[0059] As the resin constituting the resin member, there is no particular limitation, and various thermoplastic resins or thermosetting resins can be cited. Specifically, engineering plastics or super engineering plastics such as nylon, polyacetal, modified polyphenylene ether, polycarbonate, polyethylene terephthalate, polybutylene terephthalate, polyphenylene sulfide, polyamide, polyether sulfone, liquid crystal polymer, etc.; polyolefin resin classes such as polyethylene, polypropylene, polyvinyl chloride, polystyrene, acrylonitrile butadiene styrene copolymer resin (ABS resin), acrylonitrile styrene copolymer resin, methyl methacrylate butadiene styrene copolymer resin (MBS resin); polymer alloy or polymer blend of these resins, etc. can be cited.

[0060] Among them, from the aspect of excellent plating adaptability, the resin constituting the resin member preferably contains a styrene-based resin. As the resin constituting the resin member, more preferable resins can be cited rubber-containing styrene-based resins such as rubber-reinforced polystyrene (HI resin), ABS resin, MBS resin, and ABS resin is particularly preferable.

[0061] As the plated resin member to be processed in the present application, there can be mentioned waste or items other than standards of various products such as office equipment, information / communication equipment, electronic / electrical equipment, household appliances, vehicles such as automobiles, building components, and the like. As the plated resin member to be processed in the present application, there can be particularly mentioned vehicle components such as automobiles or waste thereof, for example, a front grille, a headlamp housing, a door handle, a wheel cover, a badge, and the like of an automobile.

[0062] On the surface of these plated resin members, metal plating is generally performed at a thickness of about 0.1 μm to 200 μm.

[0063] Here, as the plating component, there can be mentioned, for example, copper, nickel, chromium, tin, lead, ruthenium, aluminum, indium, and the like, particularly metals such as copper, nickel, chromium, or two or more kinds of metals thereof.

[0064] These plated resin members can also be cut into smaller items before the heating treatment of the disposal step A in the case where the size is too large. However, if a crusher, a pulverizer, or the like is used as the cutting unit, the plating (metal portion) of the plated resin member can be trapped in the resin member, and it is difficult to peel off and remove even in the subsequent processing. Therefore, from the viewpoint of processing efficiency, it is preferable to supply the plated resin member to the processing of the present application in a state taken out from a product or the like, or even in the case where cutting is performed, to supply to the heating treatment of the disposal step A in a state cut by a saw, a cutting knife, or the like to about 1 / 2 to 1 / 4. Further, as needed, it can also be divided to about 10 cm square.

[0065] <Disposal Step A: Heating Treatment>

[0066] The device used in the heating treatment is not particularly limited as long as it has a heating unit, can be heated to the appropriate heating treatment temperature described later, and can house or load the plated resin member in a heating container, a heating tank, or a heating furnace, or the like. For example, a hot air dryer that blows hot air to heat the plated resin member is simple, the device cost is relatively inexpensive, and it can be easily obtained and used, and thus is preferable.

[0067] In addition, a device that continuously combines a hot air dryer and continuously performs heating treatment by placing the plated resin member on a conveyor or the like can continuously be put in, taken out, and the like, and thus is efficient, and is preferable in industry.

[0068] If the heating treatment temperature in the treatment step A is 300°C or higher, for example, 400°C, the possibility of decomposition and deterioration of the resin of the plated resin member becomes high. Therefore, the heating treatment temperature is lower than 300°C, and for example, it is preferably 100°C to 200°C. If in this temperature range, peeling and separation of the plated component of the plated resin member can be effectively performed while suppressing decomposition and deterioration of the resin component.

[0069] In addition, in the case where the heat resistance temperature (ISO: 75) of the resin member of the plated resin member is known, the heating treatment temperature is preferably the heat resistance temperature + 50°C to 100°C. When the heating treatment temperature is lower than the heat resistance temperature + 50°C, the plated portion of the plated resin member sometimes peels but is not sufficient. When the heating treatment temperature exceeds the heat resistance temperature + 100°C, the resin can possibly decompose and deteriorate.

[0070] The heating treatment time in the treatment step A is not particularly limited. For example, if the temperature in the device is maintained at 100°C to 200°C, there is no problem even if the plated resin member stays in the device for a long time, including decomposition of the resin and the like. However, from the viewpoints of peeling efficiency of the plated component and processing efficiency, the heating treatment time is preferably 15 minutes to 30 minutes.

[0071] For the plated resin member subjected to the heating treatment in the treatment step A, the plated film is peeled from the resin member and floats up due to the difference in thermal expansion of the resin and the plated metal caused by heating. Therefore, the plated portion is peeled from the resin member at the stage of taking out the plated resin member subjected to the heating treatment in the treatment step A from the heating treatment device, and can be easily removed.

[0072] As described above, the plated component of the plated resin member subjected to the heating treatment in the treatment step A is removed by peeling, and is also called a "resin member". However, in the present application, for the convenience of explanation, the member subjected to the treatment step A to the treatment step C is always called a "plated resin member".

[0073] < Treatment Step B: Cooling Treatment >

[0074] The plated resin member subjected to the heating treatment in the treatment step A is then subjected to the cooling treatment of the treatment step B. The cooling treatment of the treatment step B can be performed immediately after the heating treatment, or can be performed with an interval. For example, the plated portion can be removed from the plated resin member after the heating treatment, or the cooling treatment process of the treatment step B can be entered after the temperature of the resin member is lowered to room temperature.

[0075] The purpose of the cooling treatment of the disposal step B is not to more efficiently perform the peeling of the plated portion caused by the heating treatment of the disposal step A, but to perform efficient breaking in the breaking treatment of the subsequent disposal step C, and can be said to include the element of a pretreatment.

[0076] That is, the resin member of the plated resin member is soft on the surface, and if it is directly put into a crusher or the like after the heating treatment of the disposal step A, a large amount of resin powder is generated, and in the case of recycling the resin member, problems often occur. Therefore, in the present application, before the breaking treatment of the disposal step C, the cooling treatment of the disposal step B is performed to harden the resin member of the plated resin member, and the generation of resin powder is suppressed when breaking is performed using a crusher, and recycling of the recovered resin becomes easy.

[0077] The device used for the cooling treatment can be any device as long as it has a cooling unit and can cool to the appropriate cooling treatment temperature described later, and can house or load the plated resin member in a cooling container, a cooling tank or the like of the device, and is not particularly limited. For example, a low-temperature constant-temperature tank or the like is simple, the device cost is also relatively inexpensive, and can be easily obtained and used, and is therefore preferred.

[0078] In addition, a continuous device in which the plated resin member is placed on a conveyor or the like and moved, and the entire device including the conveyor is covered with a cooling device, can continuously perform the input and output of the plated resin member to the device, and is therefore efficient and is preferred in industry.

[0079] The cooling treatment temperature in the disposal step B is a temperature at which the resin member is hardened by cooling and easily broken. Therefore, depending on the type of resin or the like, the cooling treatment temperature is usually 0°C or lower, preferably -10°C or lower, and more preferably -30°C or lower. If the cooling treatment temperature is too low, the energy cost for cooling increases, and in addition, a special device is required as the cooling device, but the degree of solidification of the resin hardly changes. Therefore, the lower limit value of the cooling treatment temperature is preferably -50°C or higher, and particularly preferably -30°C or higher.

[0080] The cooling treatment time of the disposal step B also depends on the shape, wall thickness, cooling treatment temperature or the like of the plated resin member, but as long as the resin portion of the plated resin member is hardened by the cooling treatment, from the viewpoint of treatment efficiency, it is preferably about 10 minutes to 30 minutes. Even if the cooling is continued for longer than that, it is not a problem, but is inefficient.

[0081] <Disposal Step C: Breaking Treatment>

[0082] In the present application, the resin portion of the plated resin member is hardened by the cooling treatment of the disposal step B, and the generation of resin powder during the disposal step C is suppressed. Therefore, the disposal step C is preferably performed immediately after the cooling treatment of the disposal step B.

[0083] Here, "immediately" means that the resin member taken out from the cooling device of the disposal step B is supplied to the disposal step C immediately, i.e., the resin member taken out from the cooling device is immediately put into the disposal device. In this way, by supplying the resin member to the disposal step C immediately after the cooling treatment, the disposal step C can be performed at a low temperature approximately equal to the temperature of the cooling treatment.

[0084] Note that "immediately" and "instantly" in the above description do not mean that there is no interval at all. For example, even if the resin member taken out from the cooling device of the disposal step B cannot be put into the disposal device of the disposal step C "immediately" due to some circumstances, as long as the resin member can be kept in a state below the cooling temperature of the disposal step B, for example, 0°C or lower, it can be put into the disposal device of the disposal step C without any problem.

[0085] As the disposal device of the disposal step C, a general-purpose crusher, a pulverizer, or the like can be used.

[0086] In the disposal step C, the plated resin member is preferably crushed to about 1 cm or less by the breaking treatment, and the resin pieces are recovered. For the post-recovery treatment, the resin pieces are preferably 1 cm or less, for example, about 5 mm or so in size.

[0087] <Disposal Step D: Separation Treatment of Plating Components>

[0088] The disposal step D of separating the plating components peeled from the resin member in the disposal step C is not necessarily required to be performed. However, by performing the disposal step D, the plating components can be recovered, and recycling of the plated metal can be performed.

[0089] In the disposal step D, the metal of the plating components can be recovered by magnetic separation or the like, for example.

[0090] <Disposal Step E: Dissolution Treatment>

[0091] The dissolution treatment can be performed as needed in the case where the peeling of the plated portion in the heating, cooling, and breaking treatment of the disposal steps A to C is insufficient, and the purity of the recovered resin is improved by avoiding the mixing of the plated metal components into the recovered resin pieces as much as possible.

[0092] The dissolving treatment of the disposal step E is a treatment using a general chemical solution which dissolves the plated portion from the plated member. As the chemical solution, there is no particular limitation as long as it is a chemical solution which can dissolve the plated film, and it can be used in accordance with the plated metal.

[0093] As described above, the plated metal is mainly copper, nickel, chromium or an alloy thereof. Therefore, it is preferable to select a chemical solution which can dissolve the copper, nickel, chromium plated film.

[0094] As the preferable chemical solution, in order to avoid the influence on the recovered resin as much as possible, nitric acid solution, hydrogen peroxide aqueous solution, ammonium persulfate solution and the like can be given.

[0095] The concentration of the chemical solution is usually around 10 to 20 mass %.

[0096] The dissolving treatment of the disposal step E can be performed by bringing the resin sheet which has passed through the disposal step C or the disposal step D into contact with the above chemical solution.

[0097] The temperature and the treatment time in the dissolving treatment are not particularly limited. In general, the higher the temperature, the higher the dissolving efficiency. The dissolving treatment is preferably performed at 40 to 60°C for around 0.5 to 2 hours.

[0098] The resin sheet after the dissolving treatment is separated from the chemical solution by filtration or the like, and is subjected to the water washing / drying treatment of the next disposal step F as necessary.

[0099] <Disposal Step F: Washing / Drying Treatment>

[0100] The washing / drying treatment of the disposal step F is not necessarily required. However, by performing the washing / drying treatment after the dissolving treatment of the disposal step E, the chemical solution is washed and dried, and a high-purity resin component suitable for recycling can be recovered.

[0101] The drying after the water washing can be generally performed at a temperature of around 80 to 90°C.

[0102] <Disposal Step G: Grinding Treatment>

[0103] The grinding treatment of the disposal step G is a treatment step which is additionally performed in the case where the separation of the plated layer from the resin member in the process up to the disposal step C or the disposal step D is insufficient.

[0104] As the grinding treatment, the following process (step G-1) can be given, in which the broken pieces of the resin member obtained in the process up to the disposal step C or the disposal step D are put into a container or the like containing water, and stirring is performed, thereby separating the plated component remaining in the resin member.

[0105] In this process, the resin members collide with each other in the stirring container and are ground, as a result of which the plated component is peeled off.

[0106] Here, by enhancing the stirring, the resin members collide with each other and are ground, and the plated components can be more effectively peeled and separated. Therefore, as the stirring device, a mixer for resin is preferable. Furthermore, a screw-equipped mixer for resin, a blender, or the like can continuously flow the resin members with the plating and water, and is therefore effective and efficient, and is particularly preferable.

[0107] After peeling the plated components by the mixer or the like, in order to separate the plated components from the resin components, it is preferable to perform a cleaning process (Step G-2).

[0108] As the cleaning method, there are air spraying (air cleaning), water washing, and the like. This cleaning process is performed after the disposal step C or the disposal step D, and is therefore a process in a state in which the plated components are almost removed, and the plated components are recovered in the form of ground powder in the above Step G-1, and it is therefore preferable to perform the cleaning using water washing.

[0109] In the case in which the cleaning is performed using water washing, it is necessary to remove the moisture, and it is preferable to perform the moisture removal using a drier, a dehydrator, or the like (Step G-3).

[0110] In this case, it is efficient to continuously perform the water washing and the moisture removal. Therefore, it is preferable to separate the resin members from the others (the plated components or resin pieces, powder, or the like) by putting the processing target into a machine or the like for cleaning and dehydration. Here, as the device for cleaning and dehydration, a centrifugal separator, a dehydrator, or the like can be cited. Among them, a pellet dehydrator for resin or the like can continuously perform the processing, and is therefore preferable.

[0111] Furthermore, in order to effectively separate the plated components from the resin members, and in order to more effectively perform the processing of Step G-1, as a pre-process of Step G-1, it is preferable to put the resin members with the plating into a water washer or a wet-type pulverizer or the like, thereby removing the plated components attached to the resin members in the processing before the present processing process, or to grind using the pulverizer. Here, in the case in which the grinding process based on the pulverizer is performed, it is preferable to further remove the moisture by cleaning and dehydration or the like.

[0112] <Disposal Step H: Pelletizing Process>

[0113] In order to recover the resin components from the resin members, it is also possible to directly use the resin components obtained in the disposal step C, the disposal step D, or the disposal step G. However, by temporarily putting the resin components into an extruder to pelletize, the mixing with other resins, the transportation, or the like is utilized, and the use is expanded, and it is therefore preferable.

[0114] In the case in which the pelletization is performed using the extruder, it is possible to determine the extrusion conditions and the like in consideration of the properties of the recovered resin components.

[0115] <Recycling of the recovered resin>

[0116] The resin component recovered by the method of recovering a resin component from a plated resin member of the present application can be recycled as a molding raw material for various products, either as it is or by mixing the recovered resin in a proportion of about 10 to 50 mass% relative to the resin of a new product.

[0117] Example

[0118] The present application will be described more specifically by the following examples. The present application is not limited to the following examples as long as it does not depart from the gist thereof.

[0119] [Example 1]

[0120] The following treatment steps A, B, C were performed to recover a resin component from a plated resin member.

[0121] < Treatment Step A: Heating Treatment>

[0122] A plated resin member (front grille of an automobile: approximate size 1 m x 40 cm, surface plated with chromium, ABS resin engraved on the back of the member) was put in a hot air drier set at 120°C, and taken out after 15 minutes.

[0123] < Treatment Step B: Cooling Treatment>

[0124] The plated resin member subjected to the heating treatment was put in a thermostat set at 0°C, and taken out after 20 minutes.

[0125] < Treatment Step C: Crushing Treatment>

[0126] The plated resin member taken out from the cooling treatment (thermostat) was immediately put in a crusher and crushed to 1 cm or less, and a resin sheet was recovered.

[0127] The crushing treatment was performed immediately after the cooling treatment of treatment step B, and therefore the plated resin member could be subjected to the crushing treatment under temperature conditions approximately the same as the cooling treatment temperature in treatment step B.

[0128] [Examples 2 to 4]

[0129] The heating treatment temperature of treatment step A and / or the cooling treatment temperature of treatment step B were changed as in Table 1, and otherwise, the same as in Example 1 was performed.

[0130] [Example 5]

[0131] In Example 1, the following dissolution treatment of treatment step E and water washing / drying treatment of treatment step F were performed after the crushing treatment of treatment step C, and otherwise, the same as in Example 1 was performed.

[0132] <Disposal Step E: Dissolution Treatment>

[0133] The broken resin pieces were put into a 15 L beaker containing a 10 mass% aqueous ammonium persulfate solution, heated to 50°C, and stirred for 1 hour. Then, the resin pieces were recovered by filtration using a metal filter.

[0134] <Disposal Step F: Water Washing / Drying Treatment>

[0135] The recovered resin pieces were water washed and then dried in a hot air drier set to 80°C for 2 hours to obtain the qualified resin broken pieces.

[0136] [Examples 6 to 8]

[0137] The heating treatment temperature of Disposal Step A and / or the cooling treatment temperature of Disposal Step B were changed as in Table 1, and otherwise, the same as in Example 5 was performed.

[0138] [Example 9]

[0139] In Example 8, Disposal Step D for separating the plated component peeled from the resin member due to the breaking in Disposal Step C was performed between the breaking treatment of Disposal Step C and the dissolution treatment of Disposal Step E, and otherwise, the same as in Example 8 was performed.

[0140] Here, Disposal Step D was performed by putting the resin member broken in Disposal Step C into a magnetic sifter (manufactured by Nippon Magnetics) to separate the plated component from the resin part and recover the plated component.

[0141] [Evaluation]

[0142] The following evaluations were performed on the resin pieces recovered in Examples 1 to 9. The results are shown in Table 1.

[0143] <Peeling State>

[0144] After the breaking treatment of Disposal Step C, the peeling state (residual state) of the plated layer part of the resin pieces was visually observed.

[0145] <Recovery Rate>

[0146] The mixed state of the plated component in the finally recovered resin pieces was visually observed and evaluated according to the following criteria.

[0147] : The plated component was not observed at all.

[0148] (TGA measurement was performed on the recovered resin pieces, and as a result, the metal component contained in the ash was below the detection limit.

[0149] O: Little plating component is observed.

[0150] (1 resin sheet with plating component adhered and remaining out of 100 recycled resin sheets)

[0151] Δ: A small amount of plating component is observed.

[0152] (2 or more to 4 or less resin sheets with plating component adhered and remaining out of 100 recycled resin sheets)

[0153] X: A large amount of plating component is observed.

[0154] (5 or more resin sheets with plating component adhered and remaining out of 100 recycled resin sheets)

[0155] <Impact resistance (Charpy impact test)>

[0156] To evaluate the performance of the finally recycled resin component, 30 mass% of the recycled resin sheet was mixed in a new resin (ABS resin / manufactured by Techno UMG), a test piece was produced using an injection molding machine, and a Charpy impact test (notched) was performed at 23°C according to ISO 179 standards to measure the Charpy impact strength (kJ / m2). Note that a Charpy impact test was also measured for a test piece of only a new resin, and the result was 25 kJ / m2. 2 .

[0157]

[0158] As shown in Table 1, according to the present application, the plating component can be separated from the resin member with plating using a general processing device without performing excessive high-temperature heating processing or excessive low-temperature cooling processing, and the resin component can be effectively recycled. In addition, it is known that the resin component recycled by the present application can be recycled without greatly damaging the properties.

[0159] In addition, it is known that the effect of the present application can be more effectively exerted by performing the dissolving processing of the disposal step E.

[0160] In the above-described embodiment, the separated processing of the plating component peeled from the resin member of the disposal step D was not performed. However, by performing the separated recycling of the peeled plating component using a magnetic force sieve or the like between the crushing processing of the disposal step C and the dissolving processing of the disposal step E, the recycled metal can be recycled.

[0161] Although the present application has been described using specific modes, it is obvious for those skilled in the art that various modifications can be made without departing from the intent and scope of the present application.

[0162] This application is based on Japanese Patent Application No. 2023-198433, filed November 22, 2023, the entire contents of which are incorporated herein by reference.

Claims

1. A method for recovering resin components from a coated resin component, comprising recovering resin components by separating the coating components from the coated resin component on which the coating has been applied to the surface of the resin component, wherein, The method includes: Step A involves heating the coated resin component. A cooling process follows process A; and The crushing process C is carried out after the processing step B.

2. The method for recovering resin components from a coated resin component according to claim 1, wherein, The heating temperature in step A is 100℃~200℃.

3. The method for recovering resin components from a coated resin component according to claim 1, wherein, The cooling temperature in step B is below 0°C.

4. The method for recovering resin components from a coated resin component according to claim 1, wherein, Immediately following step B, step C is performed at a temperature below 0°C.

5. The method for recovering resin components from a coated resin component according to claim 1, comprising a treatment step E, wherein, The plating components remaining on the surface of the resin component after treatment step C are dissolved and removed.

6. The method for recovering resin components from a coated resin component according to claim 5, wherein, Between treatment step C and treatment step E is treatment step D, in which the plating components that were peeled off from the resin component by the crushing in treatment step C are separated.

7. The method for recovering resin components from a coated resin component according to claim 1, wherein, The resin composition includes styrene-based resins.

8. The method for recovering resin components from a coated resin component according to claim 7, wherein, The resin is a styrene-based resin.

9. The method for recovering resin components from a coated resin component according to claim 7, wherein, The styrene-based resin is ABS resin.

10. The method for recovering resin components from a coated resin component according to any one of claims 1 to 9, wherein, The coated resin component is a vehicle part or its waste.

Images