Method for manufacturing bonded body

Abstract

A method for manufacturing a joined body (1) in which a first member (10) comprising a metal and a second member (20) comprising a resin are joined via an adhesive layer (30) comprising an electrodeposition coating film to form the joined body (1), the first member (10) and the second member (20) being hermetically sealed by the adhesive layer (30), the present invention is a method for manufacturing a bonded body (1), in which the airtightness between a first member (10) and a second member (20) by means of an adhesive layer (30) is such that the He leakage rate is 1 * 10-10 Pa m3 / sec or less, and the bonded body (1) comprises: an adhesive layer formation step in which a deposition film is formed on the surface of the first member (10) by electrodeposition coating, and after water washing, the deposition film is deposited on the surface of the first member (10); heating the adhesive layer (30) to a temperature lower than the curing temperature of the adhesive layer (30) to volatilize moisture to form the adhesive layer (30) in an uncured state; a bonding step for bonding the second member (20) and the first member (10) by making the adhesive layer (30) in an uncured state compatible with a part of a material for forming the second member (20) that has fluidity when heated; and a reheating step in which, after the bonding step, the adhesive layer is heated to a temperature that is not less than the heating temperature in the adhesive layer formation step but less than the curing temperature of the adhesive layer.

Description

Technical Field

[0001] This invention relates to a method for manufacturing a joint. Background Technology

[0002] Automotive parts, electrical / electronic products, and other industrial products are increasingly being developed from the perspective of lightweighting, shifting from metal raw materials to resin replacements. In recent years, the focus has shifted not only to resin replacements but also to the use of joints that effectively utilize the properties of metal materials and the characteristics of resin components to suit specific applications.

[0003] In such a joint, since it involves the bonding of dissimilar materials such as metal and resin, there is a risk that the adhesion between the two may not be sufficiently achieved. Therefore, various methods to improve adhesion have been investigated. For example, in the configuration disclosed in Patent Document 1, a laser is irradiated onto the bonding surface of the metal component and the resin component to form fine and irregular unevenness. Molten resin component forming material is then introduced into the unevenness at the bonding surface, thereby directly bonding the metal component and the resin component and improving their adhesion.

[0004] Existing technical documents Patent documents Patent Document 1: Japanese Patent Application Publication No. 10-294024. Summary of the Invention

[0005] The problem that the invention aims to solve However, in the configuration disclosed in Patent Document 1, the unevenness formed by laser irradiation is a fine and irregular shape. Therefore, sometimes the resin component does not reach the deepest part of the unevenness, resulting in a space between the metal component and the resin component. Furthermore, this space communicates with the outside, reducing the airtightness between the metal component and the resin component. Therefore, even if the adhesion between the metal component and the resin component can be ensured, it is impossible to meet the requirement for higher airtightness. Therefore, there is room for improvement in achieving a balance between high adhesion and high airtightness.

[0006] Furthermore, when joining metals to achieve electrical insulation, an insulating layer is required between them. This also results in the joining of dissimilar materials, and therefore, similarly, there is room for improvement in achieving a balance between high adhesion and high airtightness.

[0007] The present invention was made in view of the above background, and its object is to provide a method for manufacturing a joint with excellent adhesion and airtightness.

[0008] means for solving problems One aspect of the present invention lies in a method for manufacturing a joint, wherein a first component made of metal and a second component made of resin are bonded together via an adhesive layer consisting of an electrodeposited coating to form the joint. The first component and the second component are airtightly sealed by the adhesive layer. A compatibility layer is formed between the second component and the adhesive layer, in which the first resin material constituting the second component and the second resin material constituting the adhesive layer are compatible with each other. The airtightness between the first and second components based on the adhesive layer is such that the He leakage is 1×10⁻⁶. -10 Pa·m 3 Below / sec The method for manufacturing the joint comprises: In the adhesive layer formation process, an precipitated film is formed on the surface of the first component by electrodeposition and the precipitated film is washed with water. Then, the film is heated to a temperature lower than the curing temperature of the adhesive layer to evaporate the moisture and form the adhesive layer in an uncured state. A bonding process in which the second component is bonded to the first component by making the uncured adhesive layer compatible with a portion of the forming material of the second component, which has become fluid upon heating; and A reheating process, in which, after the bonding process, the temperature is raised to a temperature above the heating temperature in the adhesive layer forming process but below the curing temperature of the adhesive layer.

[0009] Another aspect of the invention lies in a method for manufacturing a joint, wherein a first metal component and a second metal component are joined together via an adhesive layer consisting of an electrodeposited coating to form the joint. The first component and the second component are airtightly sealed by the adhesive layer. The adhesive layer is formed by the compatibility of a first adhesive layer consisting of an electrodeposited coating film formed on the first component and a second adhesive layer consisting of an electrodeposited coating film formed on the second component. The airtightness between the first and second components based on the adhesive layer is such that the He leakage is 1×10⁻⁶. -10 Pa·m 3 Below / sec The method for manufacturing the joint comprises: In the adhesive layer forming process, after forming a precipitated film on the surface of the first component and the second component by electrodeposition and washing the precipitated film with water, the first adhesive layer and the second adhesive layer are heated to a temperature lower than the curing temperature of the first adhesive layer and the second adhesive layer to evaporate the moisture and form an uncured state of the first adhesive layer and the second adhesive layer. A joining process in which the first component and the second component are joined by making the uncured first adhesive layer and the second adhesive layer compatible with each other; and A reheating process, in which, after the bonding process, the temperature is raised to a temperature above the heating temperature in the adhesive layer forming process but below the curing temperature of the first adhesive layer and the second adhesive layer.

[0010] Invention Effects According to the manufacturing method of the bond according to one of the embodiments, since the adhesive layer is formed by electrodeposited coating, it can be configured as an adhesive layer with excellent adhesion to both the first component made of metal and the second component made of resin. Furthermore, after the bonding step of bonding the first and second components via this adhesive layer, by heating to a temperature higher than the heating temperature in the adhesive layer forming step but lower than the curing temperature of the adhesive layer, the airtightness of the bond layer can be improved. As a result, the airtightness between the first and second components based on the adhesive layer can be made such that the He leakage is 1×10⁻⁶. -10 Pa·m 3 Such excellent airtightness as below / sec. Therefore, it is possible to manufacture joints with extremely excellent airtightness.

[0011] According to the manufacturing method of the other type of joint, the adhesive layer between the first metal component and the second metal component is formed by the compatibility of a first adhesive layer formed on the first component by an electrodeposited coating and a second adhesive layer formed on the second component by an electrodeposited coating. Therefore, the adhesive layer exhibits excellent adhesion to both the first and second components. Furthermore, by performing a reheating process after the bonding step of joining the first and second components via the adhesive layer, heating the adhesive layer to a temperature higher than the heating temperature in the adhesive layer formation step but lower than the curing temperature of the first and second adhesive layers, the airtightness between the first and second components based on the adhesive layer can be achieved to a He leakage rate of 1×10⁻⁶. -10 Pa·m 3 Extremely excellent airtightness of less than / sec. Therefore, it is possible to manufacture joints with extremely excellent airtightness.

[0012] As described above, according to the present invention, a method for manufacturing a joint with excellent adhesion and airtightness can be provided. Attached Figure Description

[0013] Figure 1 (a) is a top view of the assembly in Example 1. Figure 1 (b) is a cross-sectional view of the Ib-Ib line position. Figure 1 (c) is a three-dimensional view of the joint.

[0014] Figure 2 yes Figure 1 A magnified view of a portion of (b).

[0015] Figure 3 yes Figure 2 An enlarged view of the area indicated by reference numeral A in the attached figure.

[0016] Figure 4 This is a conceptual diagram illustrating the conditions for He leakage tests.

[0017] Figure 5 This is a conceptual diagram used to illustrate the manufacturing method of the joint in Example 1.

[0018] Figure 6 This is a conceptual diagram used to illustrate the manufacturing method of the joint in Modified Example 1.

[0019] Figure 7 (a) is a three-dimensional view of the joint in variation example 2. Figure 7 (b) is a three-dimensional view of the joint in variation example 3.

[0020] Figure 8 (a) is a three-dimensional view of the joint in variation example 4. Figure 8 (b) is a longitudinal sectional view of the joint.

[0021] Figure 9 (a) is a three-dimensional view of the joint in variation example 5. Figure 9 (b) is a longitudinal sectional view of the joint.

[0022] Figure 10 (a) is a longitudinal sectional view of the joint in variation example 6. Figure 10 (b) is a longitudinal sectional view of the joint in variation example 7. Figure 10 (c) is a longitudinal sectional view of the joint in variation 8.

[0023] Figure 11 This is a partially enlarged longitudinal section view of the joint in Example 2.

[0024] Figure 12 (a) is a perspective view of the assembly in Example 3. Figure 12 (b) is a longitudinal sectional view of the joint.

[0025] Figure 13 (a) is a perspective view of the sealed container in Example 4. Figure 13 (b) is a magnified view of a closed container. Figure 13 (c) is a partial longitudinal section view of the sealed container.

[0026] Figure 14 (a) is a three-dimensional view of the closed container in variation example 9. Figure 14 (b) is a magnified view of a closed container. Figure 14 (c) is a partial longitudinal section view of the sealed container.

[0027] Figure 15 (a) is a perspective view of the closed container in variation 10. Figure 15 (b) is a magnified view of a closed container. Figure 15 (c) is a partial enlarged view of the longitudinal section of the sealed container.

[0028] Figure 16 (a) is a perspective view of the sealed container in Example 5. Figure 16 (b) is a magnified view of a closed container. Figure 16 (c) is a partial enlarged view of the longitudinal section of the sealed container.

[0029] Figure 17 (a) is a perspective view of the closed container in variation 11. Figure 17 (b) is a magnified view of a closed container. Figure 17 (c) is a partial enlarged view of the longitudinal section of the sealed container.

[0030] Figure 18 This is a perspective view of the assembly in Example 6.

[0031] Figure 19 (a) is a conceptual diagram used to illustrate the manufacturing method of the joint in Example 6. Detailed Implementation

[0032] Preferably, the first resin material forming the second component is an engineering plastic or a super engineering plastic, and the second resin material forming the adhesive layer is an epoxy resin, a polyamide-imide resin, or a polyimide resin. In this case, by using an engineering plastic or a super engineering plastic as the first resin material, the insulation, heat resistance, chemical resistance, and mechanical properties of the second component can be improved. The epoxy resin, polyamide-imide resin, or polyimide resin used as the second resin material has good wettability with hot-melt engineering plastics or super engineering plastics, easily integrates with each other, and has surface properties with high affinity and compatibility compared to engineering plastics or super engineering plastics. In addition, these materials have excellent heat resistance, so thermal degradation caused by hot-melt engineering plastics or super engineering plastics is not easily generated during molding. Therefore, by using the first resin material and the second resin material as described above, sufficient adhesion can be obtained between the first component and the adhesive layer, and between the second component and the adhesive layer. Furthermore, since both the second component and the adhesive layer are resins, sufficient adhesion can be obtained between them. As a result, the airtightness between the first and second components can be further improved.

[0033] Furthermore, in this specification, engineering plastics refer to resin materials with a heat resistance temperature of 100°C or higher and superior tensile strength and modulus of elasticity compared to so-called general-purpose plastics. Additionally, super engineering plastics refer to resin materials among engineering plastics with a heat resistance temperature of 150°C or higher.

[0034] The second resin material is preferably an electrolytically active electrodeposited coating. In this case, the curing of the adhesive layer becomes an electrolytically active curing system, thus achieving a balance between the curability and stability of the adhesive layer, and further improving the adhesion and airtightness between the first and second components.

[0035] The portion of the first component covered by the electrodeposited coating film forming the adhesive layer preferably includes an area with a surface roughness Ra of 5.0 μm or less. In this case, the portion of the first component covered by the electrodeposited coating film becomes a relatively smooth surface, thus the forming material of the electrodeposited coating film forming the adhesive layer in the first component easily adheres. Therefore, air can be prevented from entering between the adhesive layer and the surface of the first component, further improving the airtightness between the first and second components.

[0036] Preferably, the first member has a protrusion or groove, and the second member enters the protrusion or groove. In this case, the second member entering the protrusion or groove becomes an anchor relative to the first member, and the area of ​​the joint between the two can be increased, thus improving the joint strength between the first member and the second member.

[0037] Preferably, the protrusion or groove is formed on the portion covered by the electrodeposited coating film forming the adhesive layer, and the opening width of the protrusion or groove is 100 μm or more. In this case, even if the adhesive layer forming material is a resin material with low wettability, it can easily enter the protrusion or groove, thus further improving the airtightness between the first component and the second component.

[0038] Preferably, the first component has a through hole, into which the second component enters. In this case, the second component entering the through hole becomes an anchor relative to the first component, thus improving the bonding strength between the first and second components.

[0039] The diameter of the through hole is preferably greater than or equal to the thickness of the first component. In this case, it is easier for the forming material of the second component to enter the through hole, thereby improving the bonding strength between the first and second components.

[0040] The thickness of the compatibility layer is preferably in the range of 1.0 to 25 μm. In this case, the compatibility layer is formed to a thickness sufficient to maintain the adhesion and airtightness between the resin component and the adhesive layer.

[0041] Example (Example 1) The following uses Figures 1-3 An embodiment of the aforementioned joint will be described.

[0042] In this embodiment 1, the joint 1 is formed by bonding a first component 10 and a second component 20 via an adhesive layer 30 formed by electrodeposition coating. Furthermore, the first component 10 and the second component 20 are hermetically sealed through the adhesive layer 30. Further, the hermetically tightness between the first component 10 and the second component 20 based on the adhesive layer 30 is such that the He leakage is 1 × 10⁻⁶. -10 Pa·m 3 / sec or less.

[0043] The assembly 1 of Embodiment 1 will be described in detail below.

[0044] In Example 1, a first component 10 made of metal and a second component 20 made of resin are used. Furthermore, as... Figure 1 As shown in (a) to (c), the first member 10, made of metal, extends through the second member 20, made of resin. In Embodiment 1, the second member 20 is a plate of predetermined thickness, but as... Figure 1As shown in (c), the shape is not specific. Furthermore, in this embodiment 1, the transverse direction, which is one of the surface directions of the second member 20, is designated as X, the longitudinal direction, which is one of the surface directions of the second member 20 and orthogonal to the transverse direction X, is designated as Y, and the height direction, which is the thickness direction of the second member 20 and orthogonal to the transverse direction X and the longitudinal direction Y, is designated as Z.

[0045] 1. First component 10 The first component 10 is made of metal, such as copper or aluminum alloy; in this example, it is made of copper. Furthermore, in this example, the first component 10 is cylindrical, but it is not limited to this shape. Figure 1 As shown in (b), on the outer surface of the first member 10, the central region in the height direction Z, including the portion located within the through hole 21 of the second member 20, becomes the bonding surface 11 of the adhesive layer 30 described later.

[0046] A portion or the entire area of ​​the mating surface 11 includes an airtight region 12 that ensures airtightness between the adhesive layer 30 and the mating surface 11. The airtight region 12 is formed as a surface with high smoothness. Preferably, the surface roughness Ra of the airtight region 12 is set to a predetermined value or lower, for example, it can be set to 5.0 μm or lower, more preferably to 3.0 μm or lower. In this example, the entire area of ​​the mating surface 11 is used as the airtight region 12.

[0047] 2. Adhesive layer 30 Next, the adhesive layer 30 will be described in detail. For example... Figure 1 As shown in (a) to (c), the adhesive layer 30 is disposed in the first member 10 at the mating surface 11, which includes the airtight region 12. The adhesive layer 30 is a resin film formed by electrodeposition coating. The adhesive layer 30 uses a material with higher adhesion to the first member 10 compared to the resin material constituting the second member 20, which will be described later. For example, as the forming material of the adhesive layer 30, thermosetting epoxy resin, polyamide-imide resin, or polyimide resin, which are cationic electrodeposition coatings, can be used. In this example, an electrolytically active electrodeposition coating is used as the thermosetting epoxy resin. Thus, in the airtight region 12, the adhesive layer 30 airtightly seals the second member 20 and the first member 10, preventing the passage of gas. Details regarding the airtightness of the adhesive layer 30 will be described later.

[0048] like Figure 2 As shown, the average thickness T0 of the adhesive layer 30 can be set within the range of 10~80μm, preferably within the range of 20~50μm. In this example, the average thickness is set to 30μm. If the average thickness of the adhesive layer 30 is less than 10μm, uneven coating and coating residue will occur, which is not preferred. Furthermore, if the average thickness of the adhesive layer 30 is greater than 80μm, there is a risk that layer formation will take excessive time, which is impractical.

[0049] 3. Second component 20 Next, the second component 20 will be described in detail. In this embodiment 1, the second component is made of resin. The shape of the second component 20 is not limited, but in this embodiment 1, as shown... Figure 1 As shown in (b), it is plate-shaped. As the resin material constituting the second component 20, a thermoplastic resin material is preferred to enable insert molding as described later. Considering the exposure to high temperatures during insert molding, a heat resistance temperature of 150°C or higher is preferred. Furthermore, from the viewpoint of ensuring the compatibility and adhesion between the resin material of the second component 20 and the forming material of the adhesive layer 30, it is preferable that their solubility parameters (SP values) are close to each other. For example, considering the use of epoxy resin with an SP value of approximately 11, polyamide-imide resin with an SP value of approximately 13.6, or polyimide resin as the forming material of the adhesive layer 30, a resin material with a solubility parameter (SP value) in the range of 9.5 to 15 can be used as the resin material of the second component 20.

[0050] For example, the resin material used to form the second component 20 can be engineering plastics such as nylon resin and polycarbonate resin, or super engineering plastics such as polyphenylene sulfide (PPS) resin, polysulfone (PSF) resin, polyethersulfone (PES) resin, and polyamide-imide (PAI) resin. In this example, PPS resin is used as the resin material to form the second component 20. Alternatively, the second component 20 can be a carbon fiber reinforced plastic composed of carbon fiber material and resin material, or it can be a prepreg used to form the carbon fiber reinforced plastic. It can also be a material formed by stacking multiple sheets of carbon fiber reinforced plastic or its prepreg.

[0051] like Figure 3 As shown, a compatibility layer 40 is formed between the second member 20 and the adhesive layer 30, where the resin components of both are compatible with each other. Furthermore, in practice, the boundaries between the compatibility layer 40 and the second member 20 and the adhesive layer 30 become indistinct. However, in this embodiment, the boundary 41 between the compatibility layer 40 and the second member 20 is defined as the portion of the second member 20 where deterioration is observed, which is closer to the adhesive layer 30 in the transverse X direction. The boundary 42 between the compatibility layer 40 and the adhesive layer 30 is defined as the portion of the adhesive layer 30 where deterioration is observed, which is closer to the second member 20 in the transverse X direction. Figure 3 In the middle, each boundary 41 and boundary 42 is represented by dashed lines based on the above definition.

[0052] like Figure 3As shown, the thickness T1 of the compatibility layer 40 is defined as the maximum width of the boundaries 41 and 42 in the transverse direction X. The thickness T1 of the compatibility layer 40 is preferably in the range of 1.0 to 25 μm. If the thickness T1 of the compatibility layer 40 is thinner than the minimum value in the above range, there is a risk of reduced adhesion between the second component 20 and the adhesive layer 30. Furthermore, if the thickness T1 of the compatibility layer 40 is greater than the maximum value in the above range, there is a risk of increased time spent forming the compatibility layer 40 and reduced productivity.

[0053] 4. Evaluation Test The airtightness of the joint 1 in this example based on the adhesive layer 30 will be described in detail below. As mentioned above, the airtightness based on the adhesive layer 30 is evaluated by a He leakage test. The He leakage test is performed by an internal vacuum method (blowing method). That is, as Figure 4 As shown, after placing the test specimen W of Example 1 or the comparative example in the He leakage test fixture 100, He gas stored in the He gas cylinder 102 is blown out using a He spray gun 103. A He leakage detector 101 (manufactured by ULVAC, model HELIOT 904) equipped with a monitor 101a is used to evacuate the system as indicated by arrow 104, and the leakage amount of He passing through the test specimen W is detected. Furthermore, the acceptable standard for the He leakage amount is 1.0 × 10⁻⁶. -10 Pa·m 3 / sec or less.

[0054] In the airtightness test of this example, the joint 1 of this embodiment 1 was used as the sample, and the joint 20 of the second member 20 was used as the comparative example by melting and bonding the outer peripheral surface of the first member 10 without using the adhesive layer 30.

[0055] In addition, the adhesiveness based on the adhesive layer 30 was evaluated by the following tensile strength test. The tensile strength test was conducted using an electronic tensile testing machine (manufactured by Yonekura Manufacturing Co., Ltd., model CATY-1005Z). The first member 10 and the second member 20 were clamped in the joint 1 and the joint of the comparative example described above, respectively. The first member 10 was stretched along the axial direction Y at a tensile speed of 25.4 mm / min until fracture, and the peak load was measured. The results of the He leakage test and the tensile strength test are shown in Table 1 below.

[0056]

[0057] As shown in Table 1, the He leakage in the conjugate of the comparative example was 2.0 × 10⁻⁶. -7 Pa·m 3 The leakage rate is approximately 1.0 × 10⁻⁶ sec, but the He leakage in the joint 1 of this embodiment is 1.0 × 10⁻⁶ sec. --10 Pa·m 3 / sec or less. Therefore, it can be confirmed that the joint 1 of this embodiment 1 exhibits extremely high airtightness. Furthermore, compared to the tensile strength of the joint in the comparative example, the tensile strength of the joint 1 of this embodiment 1 is a sufficiently high value, confirming that the joint 1 of this embodiment 1 exhibits high adhesion.

[0058] 5. Manufacturing method The manufacturing method of the joint 1 in this example will be described below.

[0059] like Figure 5 As shown in (a), a first component 10 is prepared, and an adhesive layer forming step S1 is performed. In the adhesive layer forming step S1, an adhesive layer 30 is formed on the bonding surface 11 of the first component 10, which includes an airtight region 12. In the adhesive layer forming step S1 of this example, a water-soluble thermosetting epoxy resin is adhered to the first component 10 by electrodeposition coating, and the epoxy resin is heated at a temperature lower than its curing temperature to evaporate the moisture and dry it, forming a semi-cured adhesive layer 30. Furthermore, by masking the two ends of the outer surface of the first component 10 other than the bonding surface 11, the adhesive layer 30 is formed only on the bonding surface 11.

[0060] In this example, the electrodeposition coating in the adhesive layer formation process S1 is performed as follows. First, the surface of the first component 10 is cleaned and degreased. Then, a cationic epoxy resin-based electrolytically active electrodeposition coating (manufactured by Nippon Paint Co., Ltd., Japan, model INSULEED 3030) with a solids content of 20% is adjusted to a solids content of 20% and filled into the electrodeposition coating bath. Then, the cleaned and degreased first component 10 is immersed in the bath and energized with a voltage of 200V for 3 minutes. Afterward, the first component 10 is removed from the bath and washed with water, and then dried in a drying oven at 130°C, below the curing temperature of the electrolytically active electrodeposition coating, for 20 minutes. As a result, the moisture is evaporated, forming an adhesive layer 30 consisting of a semi-cured epoxy resin film (precipitation film) with an average thickness of 50 μm.

[0061] After that, Figure 5 (b) and Figure 5 In the joining process S2 shown in (c), insert forming is performed. In the insert forming in the joining process S2, firstly, as... Figure 5 As shown in (b), a mold is prepared to be divided into an upper mold 51 and a lower mold 52. The upper mold 51 has a recess 52a along the outline of the upper portion of the first member 10, and the lower mold 52 has a recess 52a along the lower portion of the first member 10 and the outline of the second member 20. Then, as... Figure 5As shown in (c), a first component 10, with an adhesive layer 30 composed of a semi-cured epoxy resin film, is disposed between the upper mold 51 and the lower mold 52. Then, heated and fluidized PPS resin is flowed between the upper mold 51 and the lower mold 52 to form a second component 20. In this example, the resin is heated to 330°C to melt and become fluid. Thus, the first component 10 and the second component 20 are bonded together via the adhesive layer 30 between them, forming... Figure 1 The shown assembly 1.

[0062] In this embodiment, Figure 1 After the bonding body 1 shown is formed, it is reheated (reheating process). The target temperature for this reheating can be set, for example, above the drying temperature described above in the adhesive layer forming process S1 and below the curing temperature of the adhesive layer 30. The heating time can be set, for example, in the range of 90 to 250 minutes.

[0063] 6. Effects Next, the effects of the manufacturing method of the joint 1 in this example will be described in detail.

[0064] According to the manufacturing method of the joint 1 in this example, since the adhesive layer 30 is composed of an electrodeposited coating, it can exhibit excellent adhesion to both the first component 10 and the second component 20. Furthermore, after the bonding process in which the first component 10 and the second component 20 are bonded via the adhesive layer 30, heating to a temperature above the heating temperature in the adhesive layer formation process but below the curing temperature of the adhesive layer improves the airtightness of the joint layer. As a result, the airtightness between the first component 10 and the second component 20 based on the adhesive layer 30 can be achieved with a He leakage rate of 1 × 10⁻⁶. -10 Pa·m 3 Such excellent airtightness as below / sec. Therefore, it is possible to manufacture a joint 1 with extremely excellent airtightness.

[0065] Furthermore, the portion of the first component 10 covered by the electrodeposited coating film forming the adhesive layer 30, i.e., the bonding surface 11, includes an airtight region 12 with a surface roughness Ra of 5.0 μm or less. Thus, the bonding surface 11 becomes a relatively smooth surface, making it easier for the adhesive layer 30 to adhere tightly to the bonding surface 11. Therefore, preventing air from entering between the adhesive layer 30 and the bonding surface 11 of the first component 10 further improves the airtightness between the first component 10 and the second component 20.

[0066] Furthermore, in this example, a compatibility layer 40 is formed between the second component 20 and the adhesive layer 30, where the first resin material constituting the second component 20 and the second resin material constituting the adhesive layer 30 are compatible with each other. This further improves the adhesion and airtightness between the second component 20 and the adhesive layer 30.

[0067] Furthermore, in this example, the thickness T1 of the compatibility layer 40 is in the range of 1.0~25μm. Thus, the compatibility layer 40 is formed to a thickness sufficient to maintain the adhesion and airtightness between the second member 20 and the adhesive layer 30.

[0068] Furthermore, in this example, the first resin material forming the second component 20 is an engineering plastic or a super engineering plastic, and the second resin material forming the adhesive layer 30 is an epoxy resin, a polyamide-imide resin, or a polyimide resin. Moreover, by using an engineering plastic or a super engineering plastic as the first resin material, the insulation, heat resistance, chemical resistance, and mechanical properties of the second component 20 can be improved. The epoxy resin, polyamide-imide resin, or polyimide resin used as the second resin material has good wettability with hot-melt engineering plastics or super engineering plastics, easily integrates with each other, and has surface properties with high affinity and compatibility compared to engineering plastics or super engineering plastics. In addition, these materials have excellent heat resistance, so thermal degradation caused by hot-melt engineering plastics or super engineering plastics is less likely to occur during molding. Therefore, by using the first resin material and the second resin material as described above, sufficient adhesion is achieved between the first component 10 and the adhesive layer 30, and between the second component 20 and the adhesive layer 30. Furthermore, since both the second component 20 and the adhesive layer 30 are made of resin, they can achieve sufficient adhesion to each other. As a result, the airtightness between the first component 10 and the second component 20 can be further improved.

[0069] Furthermore, in this example, the second resin material forming the adhesive layer 30 is an electrolytically active electrodeposited coating. Therefore, the curing of the adhesive layer 30 is an electrolytically active curing system, thus achieving a balance between the curability and stability of the adhesive layer 30, and further improving the adhesion and airtightness between the first component 10 and the second component 20.

[0070] Furthermore, according to the manufacturing method of the joint 1 in this example, by making the semi-cured adhesive layer 30 compatible with a portion of the second member 20, the second member 20 can be joined to the first member 10. As described above, by using the adhesive layer 30 to create an airtight seal between the two, a He leakage rate of 1×10⁻⁶ can be achieved. -10 Pa·m 3 Such extremely high airtightness as below / sec.

[0071] Furthermore, in the manufacturing method of the joint 1 in this example, in the adhesive layer forming step S1, after the uncured adhesive layer 30 is formed, it is reheated. This further improves the adhesion between the adhesive layer 30 and the second member 20.

[0072] Alternatively, before the adhesive layer formation step S1, the bonding surface 11 can be laser-processed or etched to form multiple recesses with a depth and opening width of 100 μm or more and 500 μm or less, thereby creating an airtight region 12. For example, as Figure 6 As shown in Modification 1, the aforementioned recess can be formed by laser processing of the mating surface 11 by irradiating the mating surface 11 with a laser using the laser irradiation device 50. The recess forming the airtight region 12 is formed to a suitable size where the forming material of the adhesive layer 30 can easily spread, thus preventing air from entering between the adhesive layer 30 and the mating surface 11 of the first member 10, further improving the airtightness between the first member 10 and the second member 20. Furthermore, the recess provides an anchoring effect for the second member 20, further improving the adhesion between the first member 10 and the second member 20.

[0073] Furthermore, in this embodiment 1, the first component 10 is cylindrical in shape, but it is not limited to this and can also be other shapes. For example, it can also be as follows: Figure 7 As shown in variation example 2 (a), it can be plate-shaped, or as... Figure 7 As shown in (b) of Modified Example 3, it is a quadrangular prism. It also has the same effect as Example 1 in Modified Examples 2 and 3.

[0074] Alternatively, it can be like Figure 8 (a) and Figure 8 As shown in Modification 4 (b), the cylindrical first member 10 in this embodiment 1 is provided with a disc-shaped flange portion 15, which is also bonded to the upper surface of the second member 20 via an adhesive layer 30. In this Modification 4, the lower surface of the flange portion 15, i.e., the surface of the flange portion 15 opposite to the second member 20, is also etched by laser irradiation to form an airtight region 12. Modification 4 achieves the same effect as in Embodiment 1, and the flange portion 15 increases the joint between the first member 10 and the second member 20, thus improving the joint strength and airtightness. Furthermore, it is also possible to... Figure 9 (a) and Figure 9 As shown in variation 5 of (b), the shape of the first member 10 is set to be similar to... Figure 8 (a) and Figure 8 Compared to the flange portion 15 of the first member 10 shown in (b) of Modification 4, the upper part of the flange portion 15 has been removed. In this Modification 5, it also has the same effect as in Modification 4.

[0075] In addition, in this embodiment 1, the first component 10 is inserted through the through hole 21 of the second component 20, but it is not limited to this, and it can also be done as follows: Figure 10 As shown in variation 6 of (a), the plate-shaped first member 10 and the plate-shaped second member 20 are arranged in parallel and joined together via an adhesive layer 30 in the region where they overlap in the thickness direction (height direction Z).

[0076] Furthermore, it can also be like Figure 10 As shown in variation 7 (b), the first member 10 has a protrusion 13, and the second member 20 enters the protrusion 13. In this case, the second member 20 entering the protrusion 13 is formed as an anchor relative to the first member 10, and the area of ​​the joint between the two can be increased, thus improving the joint strength between the first member 10 and the second member 20. Furthermore, the protrusion 13 can be formed by stamping or machining. Alternatively, the protrusion 13 can also be formed as a groove.

[0077] exist Figure 10 In the modified example 7 shown in (b), the opening width W1 of the groove 13 is 100 μm or more. As a result, even if the adhesive layer 30 is formed of a resin material with low wettability, it can easily enter the groove 13, thereby further improving the airtightness between the first member 10 and the second member 20.

[0078] Furthermore, it can also be like Figure 10 As shown in variation 8 (c), the first member 10 has a through hole 14, and the second member 20 enters the through hole 14. In this case, the second member 20 entering the through hole 14 is formed as an anchor relative to the first member 10, and the area of ​​the joint between the two can be increased, thereby improving the joint strength between the first member 10 and the second member 20.

[0079] exist Figure 10 In the modified example 8 shown in (c), the diameter D of the through hole 14 is greater than or equal to the thickness T3 of the first member 10. As a result, the forming material of the second member 20 can easily enter into the through hole 14, thereby improving the bonding strength between the first member 10 and the second member 20.

[0080] As described above, according to this embodiment 1 and variations 2 to 7, a joint 1 with excellent adhesion and airtightness can be provided.

[0081] (Example 2) In the above-described embodiment 1, an airtight region 12 is formed over the entire area of ​​the mating surface 11 of the first component 10. However, in this embodiment 2, instead, as shown below... Figure 11As shown, the mating surface 11 of the first component 10 includes a highly smooth, airtight region 12 and a rough surface region 16 that has undergone roughening treatment and has a larger surface roughness than the airtight region 12. Other configurations are the same as in Embodiment 1, therefore the same reference numerals are used as in Embodiment 1 and their descriptions are omitted.

[0082] In this second embodiment, as described above, the mating surface 11 of the first component 10 includes an airtight region 12 and a rough surface region 16. This improves the airtightness between the second component 20 and the first component 10 in the smooth, airtight region 12, and improves the adhesion between the second component 20 and the first component 10 in the rough surface region 16. Thus, both improved adhesion and improved airtightness can be achieved. Furthermore, this second embodiment also achieves the same effect as in the first embodiment.

[0083] (Example 3) In the assembly 1 of Example 3, as Figure 12 (a) and Figure 12 As shown in (b), the second member 20 is plate-shaped and has a through hole 21, and the first member 10 is plate-shaped and overlaps the second member 20 in a manner that covers the through hole 21. Furthermore, at the overlapping portion of the first member 10 and the second member 20, the second member 20 and the first member 10 are joined via an adhesive layer 30, which prevents gas from passing between the second member 20 and the first member 10 through the through hole 21. Other configurations are the same as in Embodiment 1, therefore, the same reference numerals are used as in Embodiment 1, and their descriptions are omitted.

[0084] According to the assembly 1 of Embodiment 3, by using a second member 20 (not shown) to close the through hole 21 and enclose it with the first member 10 as the lid of the storage container, the first member 10 is prevented from reducing the airtightness of the storage container, thus providing a storage container with excellent airtightness. Furthermore, in this Embodiment 3, the same effect is achieved as in Embodiment 1.

[0085] (Example 4) The joint 1 in Example 4 is as follows Figure 13 (a) ~ Figure 13As shown in (c), the second member 20 is part of the sealed container 60 and has a cylindrical resin tubular portion 25 forming the opening 61 of the sealed container 60. The first member 10 is cylindrical and is coaxially disposed inside the resin tubular portion 25. Moreover, an airtight region 12 is provided on the outer peripheral surface 10a of the first member 10, and it is bonded to the inner peripheral surface 25a of the resin tubular portion 25 via an adhesive layer 30, which prevents gas from passing between the inner peripheral surface 25a of the resin tubular portion 25 and the outer peripheral surface 10a of the first member 10. Other configurations are the same as in Embodiment 1 and Modification 4, therefore, the same reference numerals are used as in these cases and their descriptions are omitted.

[0086] According to the connector 1 of Embodiment 4, the strength of the opening 61 of the sealed container 60 can be improved, and the airtightness of the sealed container 60 can be reduced due to the joint surface 11 between the first member 10 and the second member 20, thus providing a sealed container 60 with excellent airtightness. Furthermore, this sealed container 60 can be used as a gas storage cylinder capable of storing gases with small molecular weights such as hydrogen and helium. In this Embodiment 4, the same effects are achieved as in Embodiment 1 and Modified Embodiment 4.

[0087] Alternatively, the first component 10 in embodiment 4 can be used as follows: Figure 14 (a) ~ Figure 14 As shown in variation example 9 (c), it is assumed to have no Figure 13 (a) ~ Figure 13 The shape of the flange portion 15 shown in (c) is also possible. Alternatively, it can be as follows: Figure 15 (a) ~ Figure 15 As shown in Modification 10 (c), the disc-shaped first member 10 with a through hole is bonded to the upper end face of the cylindrical second member 20 via an adhesive layer 30. In Modification 10, an airtight region 12 is formed on the lower surface 10c of the first member 10 opposite to the upper end face of the second member 20. In these Modifications 6 and 6, the same effect as in Embodiment 4 is achieved.

[0088] (Example 5) The joint 1 in Example 5 is as follows Figure 16 (a) ~ Figure 16As shown in (c), the second member 20 has a resin cylindrical portion 26 that forms part of the sealed container 60 and is cylindrical in shape, forming the opening 61 of the sealed container 60. A cylindrical first member 10 is coaxially arranged with the resin cylindrical portion 26 on the outside of the resin cylindrical portion 26. Furthermore, the outer peripheral surface 26a of the resin cylindrical portion 26 is bonded to the inner peripheral surface 10b of the first member 10 via an adhesive layer 30. The adhesive layer 30 prevents gas from passing between the outer peripheral surface 26a of the resin cylindrical portion 26 and the inner peripheral surface 10b of the first member 10. In Embodiment 5, an airtight region 12 is formed on the inner peripheral surface 10b of the first member 10. Other configurations are the same as in Embodiment 1; therefore, the same reference numerals are used as in Embodiment 1, and their descriptions are omitted.

[0089] According to the joint 1 of Embodiment 5, the strength of the opening 61 of the sealed container 60 can also be improved, and the situation where the joint surface 11 of the first member 10 and the second member 20 reduces the airtightness of the sealed container can be prevented, thus providing a sealed container 60 with excellent airtightness.

[0090] Furthermore, the first component 10 in this embodiment 5 can also be as follows: Figure 17 (a) ~ Figure 17 As shown in Modification 11 (c), the first member 10 covers the upper end of the resin cylindrical portion 26. In this Modification 11, it also achieves the same effect as in Embodiment 5.

[0091] (Example 6) Figure 18 The illustrated embodiment 6 is a joint 1 formed by joining a second metal component 20 and a first metal component 10 via an adhesive layer 30. In this embodiment 6, as... Figure 19 As shown in (a), the first member 10 has a cylindrical shaft portion 17 and a disc-shaped flange portion 18 located at the center of the shaft portion 17. A first adhesive layer 31 is provided on the mating surface 11, which is the back side of the flange portion 18. The first adhesive layer 31 has the same structure as the adhesive layer 30 in Embodiment 1 described above.

[0092] like Figure 19 As shown in (a), the second member 20 is plate-shaped with a through hole 21. As indicated by arrow P, the shaft portion 17 of the first member 10 is inserted through the through hole 21. A second adhesive layer 32 is provided in the area of ​​the second member 20 surrounding the through hole 21, which is opposite to the flange portion 18 and is located on the inner wall of the through hole 21. The second adhesive layer 32 has the same configuration as the adhesive layer 30 of Embodiment 1 described above. Figure 19 (b) and Figure 19As shown in (c), in the second component 20, the portion covered by the electrodeposited coating film forming the second adhesive layer 32, namely the bonding surface 22, has the same configuration as the bonding surface 11 of the above embodiment 1, and the bonding surface 22 includes an airtight region 23 having the same configuration as the airtight region 12 of the above embodiment 1.

[0093] The assembly 1 in this embodiment 6 is manufactured as follows. First, in... Figure 19 In the adhesive layer forming process S1 shown in (a), after forming a precipitated film on the surfaces of the first component 10 and the second component 20 by electrodeposition and washing the precipitated film with water, the film is heated to a temperature lower than the curing temperature of the first adhesive layer 31 and the second adhesive layer 32 to evaporate the moisture, forming the first adhesive layer 31 and the second adhesive layer 32 in an uncured state. The electrodeposition process in the adhesive layer forming process S1 is performed in the same manner as in Example 1 above. In addition, as in Example 1, after forming the first adhesive layer 31 and the second adhesive layer 32 in a semi-cured state, reheating is performed. Then, as indicated by arrow P, the shaft portion 17 of the first component 10 is inserted into the through hole 21 of the second component 20.

[0094] After that, as Figure 19 As shown in (b), in the joining process S2, heating is performed while the shaft portion 17 of the first component 10 is inserted through the through hole 21 of the second component 20, causing the uncured first adhesive layer 31 and the second adhesive layer 32 to become compatible with each other, thereby joining the first component 10 and the second component 20. As a result, a compatible layer 33 is formed in the adhesive layer 30, forming... Figure 18 The joint 1 shown. Then, after forming the joint 1, a reheating process is performed in the same manner as in Example 1.

[0095] According to the manufacturing method of the joint 1 in Embodiment 6, the adhesive layer 30 between the first metal component 10 and the second metal component 20 is formed by the compatibility of a first adhesive layer 31 formed on the first component 10 by an electrodeposited coating film and a second adhesive layer 32 formed on the second component 20 by an electrodeposited coating film. Therefore, the adhesive layer 30 can exhibit excellent adhesion to both the first component 10 and the second component 20. Then, after the joining process of joining the first component 10 and the second component 20 via the adhesive layer 30, a reheating process is performed, heating the material to a temperature higher than the heating temperature in the adhesive layer forming process but lower than the curing temperature of the first adhesive layer 31 and the second adhesive layer 32. This allows the airtightness between the first component 10 and the second component 20 based on the adhesive layer 30 to achieve a He leakage rate of 1×10⁻⁶. - 10 Pa·m 3Such excellent airtightness as below / sec. Therefore, it is possible to manufacture a joint 1 with extremely excellent airtightness.

[0096] Furthermore, in the joint 1 of this embodiment 6, the first component 10 and the second component 20 are joined by an adhesive layer 30 made of an electrodeposited coating film made of resin, thus being electrically insulated from each other, and similarly to the case of embodiment 1, a balance between high adhesion and high airtightness is achieved between the first component 10 and the second component 20.

[0097] The present invention is not limited to the above embodiments and variations, and can be applied to various implementation methods without departing from its spirit.

Claims

1. A method for manufacturing a joint, wherein, The joint is formed by bonding a first metal component and a second resin component via an adhesive layer consisting of an electrodeposited coating. The first component and the second component are airtightly sealed by the adhesive layer. A compatibility layer is formed between the second component and the adhesive layer, in which the first resin material constituting the second component and the second resin material constituting the adhesive layer are compatible with each other. The airtightness between the first and second components based on the adhesive layer is such that the He leakage is 1×10⁻⁶. - 10 Pa·m 3 Below / sec The method for manufacturing the joint comprises: In the adhesive layer formation process, an precipitated film is formed on the surface of the first component by electrodeposition and the precipitated film is washed with water. Then, the film is heated to a temperature lower than the curing temperature of the adhesive layer to evaporate the moisture and form the adhesive layer in an uncured state. A bonding process in which the second component is bonded to the first component by making the uncured adhesive layer compatible with a portion of the forming material of the second component, which has become fluid when heated. as well as A reheating process, in which, after the bonding process, the temperature is raised to a temperature above the heating temperature in the adhesive layer forming process but below the curing temperature of the adhesive layer.

2. The method for manufacturing the joint according to claim 1, wherein, The first resin material forming the second component is an engineering plastic or a super engineering plastic. The second resin material forming the adhesive layer is epoxy resin, polyamide-imide resin, or polyimide resin.

3. The method for manufacturing the joint according to claim 2, wherein, The second resin material is an electrolytically active electrodeposition coating.

4. A method for manufacturing a joint, wherein, The joint is formed by bonding a first metal component and a second metal component via an adhesive layer consisting of an electrodeposited coating. The first component and the second component are airtightly sealed by the adhesive layer. The adhesive layer is formed by the compatibility of a first adhesive layer consisting of an electrodeposited coating film formed on the first component and a second adhesive layer consisting of an electrodeposited coating film formed on the second component. The airtightness between the first and second components based on the adhesive layer is such that the He leakage is 1×10⁻⁶. - 10 Pa·m 3 Below / sec The method for manufacturing the joint comprises: In the adhesive layer forming process, after forming a precipitated film on the surface of the first component and the second component by electrodeposition and washing the precipitated film with water, the first adhesive layer and the second adhesive layer are heated to a temperature lower than the curing temperature of the first adhesive layer and the second adhesive layer to evaporate the moisture and form an uncured state of the first adhesive layer and the second adhesive layer. A joining process in which the first component and the second component are joined by making the uncured first adhesive layer and the second adhesive layer compatible with each other. as well as A reheating process, in which, after the bonding process, the temperature is raised to a temperature above the heating temperature in the adhesive layer forming process but below the curing temperature of the first adhesive layer and the second adhesive layer.

5. The method for manufacturing the joint according to any one of claims 1 to 4, wherein, The portion of the first component covered by the electrodeposited coating that forms the adhesive layer includes an area with a surface roughness Ra of less than 5.0 μm.

6. The method for manufacturing the joint according to any one of claims 1 to 4, wherein, The first component has a concave or convex portion or a groove, and the second component enters the concave or convex portion or the groove.

7. The method for manufacturing the joint according to claim 6, wherein, The uneven portion or the groove is formed on the portion covered by the electrodeposited coating film that forms the adhesive layer, and the opening width of the uneven portion or the groove is 100 μm or more.

8. The method for manufacturing the joint according to any one of claims 1 to 4, wherein, The first component has a through hole, and the second component enters the through hole.

9. The method for manufacturing the joint according to claim 8, wherein, The diameter of the through hole is greater than or equal to the thickness of the first component.

10. A method for manufacturing a joint according to any one of claims 1 to 3, wherein, The thickness of the compatibility layer is in the range of 1.0~25μm.

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