Terminal module

Abstract

The purpose of the present invention is to reduce the force required to connect a terminal module and a mating terminal. The terminal module is connected with a counterpart-side terminal, and is provided with: a spring receiving part having a base part; an electrical contact member having a contact portion disposed at a distance from the base portion and movably supported by the spring receiving portion; and a shape memory coil spring interposed between the base portion and the contact portion. The contact portion is movable between an initial position and a pushed-in position closer to the base portion than the initial position, and the shape memory coil spring is formed of a shape memory alloy that performs shape memory in such a manner that a force applied by the contact portion from the pushed-in position toward the initial position is increased by an increase in temperature.

Description

Technical Field

[0001] This disclosure relates to a terminal module. Background Technology

[0002] Patent document 1 discloses a terminal module comprising a metal housing and a helical spring. The housing has a top wall, a bottom wall, a pair of side walls, and a pair of anti-detachment tabs. The top wall, the pair of side walls, and the pair of anti-detachment tabs constitute a spring receiving portion at the end of the top wall side that receives the helical spring. The bottom wall constitutes an electrical contact component that is electrically connected to the opposite side contact and is movable between an initial position and a connected position.

[0003] When the terminal module is connected to the counterpart terminal, the helical spring is compressed. With the terminal module and counterpart terminal connected, the bottom wall pushes against the counterpart terminal due to the force of the helical spring.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2020-198323 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] People hope to reduce the force required to connect the terminal module to the opposite terminal.

[0009] The purpose of this disclosure is to reduce the force required to connect the terminal module and the opposite terminal.

[0010] Solution for solving the problem

[0011] The terminal module disclosed herein is a terminal module connected to a counterpart terminal, comprising: a spring receiving portion having a base; an electrical contact member having a contact portion spaced apart from the base and movably supported by the spring receiving portion; and a shape memory helical spring located between the base and the contact portion, the contact portion being movable between an initial position and a pushed-in position closer to the base than the initial position, the shape memory helical spring being made of a shape memory alloy, the shape memory alloy performing shape memory in such a way that the force applied by the contact portion from the pushed-in position toward the initial position increases by a temperature rise.

[0012] Invention Effects

[0013] According to this disclosure, the force required to connect the terminal module and the opposite terminal can be reduced. Attached Figure Description

[0014] Figure 1This is a perspective view showing the terminal module involved in Embodiment 1.

[0015] Figure 2 This is a perspective view of the terminal module shown above.

[0016] Figure 3 This is an exploded perspective view of the terminal module shown above.

[0017] Figure 4 yes Figure 1 Sectional view along line IV-IV.

[0018] Figure 5 This is a cross-sectional view showing the terminal module housed inside the connector housing.

[0019] Figure 6 It is a cross-sectional view showing the connection status between the terminal module and the opposite terminal.

[0020] Figure 7 This is a cross-sectional view showing the terminal module involved in the modified example.

[0021] Figure 8 This is a cross-sectional view showing the terminal module involved in Embodiment 2.

[0022] Figure 9 This is a top view showing the terminal module.

[0023] Figure 10 This is a top view showing the terminal module involved in the modified example. Detailed Implementation

[0024] [Description of embodiments of this disclosure]

[0025] First, embodiments of this disclosure will be described and illustrated.

[0026] The terminal modules disclosed herein are as follows.

[0027] (1) A terminal module for connection to a counterpart terminal, comprising: a spring receiving portion having a base; an electrical contact member having a contact portion spaced apart from the base and movably supported by the spring receiving portion; and a shape memory helical spring between the base and the contact portion, the contact portion being movable between an initial position and a push-in position closer to the base than the initial position, the shape memory helical spring being made of a shape memory alloy that performs shape memory in such a way that the force applied by the contact portion from the push-in position toward the initial position increases by a temperature rise.

[0028] According to this terminal module, by performing the connection operation between the terminal module and the counterpart terminal while the shape memory coil spring is elastically deformed before the temperature rises, the force required for the connection operation can be reduced. Furthermore, since the force applied to the contact portion from the pushed-in position to the initial position increases as the temperature rises after connection, the contact pressure between the contact portion and the counterpart terminal increases, thereby achieving higher connection reliability.

[0029] (2) In the terminal module of (1), the part of the shape memory helical spring that contacts the contact portion may have a contact plane that contacts the contact portion surface.

[0030] In this situation, when the temperature of the electrical contact components rises due to Joule heating, heat is easily transferred to the shape memory coil spring. Consequently, the temperature of the shape memory coil spring easily rises, thus increasing the contact pressure.

[0031] (3) In the terminal module of (1) or (2), the spring receiving portion may have a pair of sidewalls protruding from the two sides of the base in an opposing state toward the contact portion side, and guide slits are formed on the pair of sidewalls respectively from the top of the sidewall toward the base side, and guided protrusions that can move along the guide slits are provided on the pair of sidewalls of the contact portion respectively, and the contact portion is supported to be movable between the initial position and the pushed-in position.

[0032] In this case, a pair of guided protrusions move along a pair of guide slits, thereby supporting the contact portion so that it can move between an initial position and a pushed-in position. Compared to an opening that is closed on all four sides in the middle of the sidewall, a guide slit extending from the top of the sidewall towards the base is easier to form. Therefore, the spring receiving portion is easier to machine.

[0033] (4) In the terminal module of (3), anti-detachment protrusions are formed on a pair of side edges of the contact portion, which protrude at a position away from the guided protrusion. Restricting plates are provided on the pair of side walls, which are located away from the guide slit on the extension line of the extension direction of the guide slit. The restricting plates can contact the anti-detachment protrusions from the side opposite to the base.

[0034] Therefore, by using a limiting piece positioned away from the extension line of the guide slit, the anti-detachment protrusion can be prevented from moving away from the base. This also prevents the contact portion from dislodging from its initial position towards the side opposite to the base.

[0035] (5) In any of the terminal modules in (1) to (4), the base or the contact portion may have a positioning protrusion or positioning recess for positioning the shape memory helical spring.

[0036] Therefore, the shape memory coil spring can be positioned by using the positioning protrusion or positioning recess.

[0037] (6) In any of the terminal modules in (1) to (5), it is also possible that only one shape memory helical spring is provided between the base and the contact portion.

[0038] This makes it easy to construct terminal modules.

[0039] (7) In any of the terminal modules in (1) to (5), an additional helical spring may be provided between the base and the contact portion.

[0040] Therefore, by combining shape memory coil springs and additional coil springs, it is easier to adjust the force at room temperature and the force at high temperature separately.

[0041] (8) In the terminal module of (7), the shape memory helical spring and the additional helical spring may also be configured concentrically.

[0042] This allows shape memory coil springs and additional coil springs to be configured in a compact space.

[0043] (9) In the terminal module of (8), the shape memory helical spring may also be arranged on the outer periphery of the additional helical spring.

[0044] Therefore, it is easy to make the shape memory coil spring thicker. By making the shape memory coil spring thicker, it can generate a larger force at high temperatures, thereby achieving higher connection reliability.

[0045] (10) In any of the terminal modules of (1) to (9), the shape memory helical spring may also be shaped in such a way that the applied force is increased by raising the temperature from a temperature range of 25 degrees ± 15 degrees Celsius to above 50 degrees Celsius.

[0046] In this case, the connection operation can be easily performed by connecting the terminal module and the counterpart terminal within a temperature range of 25°C ± 15°C. When the temperature of the shape memory coil spring rises to 50°C due to Joule heating, etc., the contact pressure between the electrical contact components and the counterpart terminal increases, thus achieving higher connection reliability.

[0047] (11) In any of the terminal modules in (1) to (10), the shape memory helical spring may be a Ni-Ti alloy or a Ni-Ti-Cu alloy.

[0048] Therefore, by increasing the temperature, it can recover its original shape through shape memory, and the elastic coefficient can be increased, thereby increasing the contact pressure between the electrical contact component and the opposite terminal.

[0049] (12) In any of the terminal modules (1) to (10), the shape memory helical spring may generate a force that increases the contact area of ​​the contact portion relative to the opposite terminal by the temperature rise.

[0050] In this situation, before the temperature rises, because the contact area of ​​the contact portion relative to the opposite terminal is relatively small, the contact area between the contact portion and the opposite terminal easily heats up when energized. This heating causes the shape memory coil spring to generate a larger force. As a result, the contact area of ​​the contact portion relative to the opposite terminal increases, leading to higher connection reliability.

[0051] [Details of the embodiments of this disclosure]

[0052] Specific examples of the terminal modules of this disclosure are described below with reference to the accompanying drawings. Furthermore, this disclosure is not limited to these examples, but rather, as shown by the claims, is intended to include all modifications within the equivalent meaning and scope of the claims.

[0053] [Implementation Method 1]

[0054] The following describes the terminal module involved in Implementation Method 1. Figure 1 and Figure 2 This is a perspective view of terminal module 20. Figure 3 This is an exploded perspective view of terminal module 20. Figure 4 yes Figure 1 Sectional view along line IV-IV.

[0055] Terminal module 20 is a terminal module 20 that connects to the other side terminal, and includes a spring receiving part 30, an electrical contact part 40, and a shape memory helical spring 50.

[0056] The spring receiving portion 30 has a base 32 and a pair of sidewalls 34. The base 32 is formed in the shape of a plate, specifically a square plate. The pair of sidewalls 34 protrude from a pair of opposing side edges of the base 32 toward the contact portion 42 of the electrical contact member 40. The pair of sidewalls 34 are opposite to each other in the width direction of the base 32.

[0057] The width of the base 32 is greater than the outer diameter of the shape memory coil spring 50. The spacing between the pair of sidewalls 34 is also greater than the outer diameter of the shape memory coil spring 50. Therefore, with the base end of the shape memory coil spring 50 disposed on the base 32, the shape memory coil spring 50 is disposed between the pair of sidewalls 34.

[0058] The base portion of the sidewall 34 near the base 32 is formed into a square shape. Bends 35a are formed on both sides of the base portion. A rib 35b protruding inwards towards the spring receiving portion 30 is formed in the middle of the base portion in the width direction. The bends 35a and the rib 35b reinforce the base portion, making it less prone to bending in the thickness direction.

[0059] A guide slit 35s is formed at the top end of the sidewall 34, away from the base 32. The guide slit 35s extends from the top end of the sidewall 34 toward the base 32. The electrical contact member 40 is movably supported by the guide slit 35s. Restricting plates 34p1 and 34p2 protrude from the aforementioned top end portion of the sidewall 34. The position of the electrical contact member 40 in the direction away from the base 32 is restricted by the restricting plates 34p1 and 34p2. The structure in which the position of the electrical contact member 40 is restricted and guided by the guide slit 35s and the restricting plates 34p1 and 34p2 will be further described later.

[0060] Spring stop plates 38 extend from two different front and rear edges, one from the periphery of the base 32 and the other from the side edges extending from the pair of sidewalls 34. The front-to-back length of the base 32 is greater than the outer diameter of the shape memory coil spring 50, and the spacing between the front and rear spring stop plates 38 is also greater than the outer diameter of the shape memory coil spring 50. With the base end of the shape memory coil spring 50 positioned on the base 32, the shape memory coil spring 50 is positioned between the pair of sidewalls 34 and the front and rear spring stop plates 38. Thus, the base end of the shape memory coil spring 50 is held in place and will not detach from the base 32.

[0061] The protruding lengths of the front and rear spring stop plates 38 are set to be less than the protruding lengths of the pair of sidewalls 34, for example, to the extent that they do not reach the aforementioned guide slit 35s. When the electrical contact member 40 is close to the base 32, interference between the contact portion 42 and the spring stop plates 38 can be suppressed.

[0062] The electrical contact component 40 is formed of a conductive material. The electrical contact component 40 is formed, for example, by stamping a sheet of metal such as copper or a copper alloy. The electrical contact component 40 has a contact portion 42 and an extension connecting piece 46. The contact portion 42 is plate-shaped, here square plate-shaped. The extension connecting piece 46 is plate-shaped, here square plate-shaped. The extension connecting piece 46 extends from a straight edge around the contact portion 42 toward one side in the thickness direction of the contact portion 42. The electrical contact component 40 is generally L-shaped. The plate thickness of the electrical contact component 40 is set according to the current capacity required by the terminal module 20. Furthermore, the electrical contact component 40 has rigidity that prevents deformation under the force of the shape memory coil spring 50.

[0063] The width and front-to-back length of the contact portion 42 are set to be greater than the outer diameter of the shape memory coil spring 50. When the top of the shape memory coil spring 50 is in contact with the contact portion 42 on one side in the thickness direction, the inner side of the periphery of the shape memory coil spring 50 is disposed within the contact portion 42 when viewed from above.

[0064] The electrical contact component 40 is movably supported by the spring receiving portion 30. In this supported state, the contact portion 42 is configured to be spaced apart from the base portion 32.

[0065] More specifically, a guided protrusion 42q is provided on each of a pair of side edges of the contact portion 42. The width of the guided protrusion 42q is smaller than the width of the guide slit 35s, and it can move along the guide slit 35s.

[0066] The guide slit 35s includes a portion extending in an inclined direction relative to a direction orthogonal to the base 32. In this embodiment, the guide slit 35s is surrounded by one slit edge 35s1, another slit edge 35s2, and an inner slit edge 35s3 located inside the slit edges 35s1 and 35s2. The side of the guide slit 35s opposite to the inner slit edge 35s3, that is, the side opposite to the base 32, is open.

[0067] The inner edge of the slit 35s3 extends parallel to the base 32. The slit edge 35s1 extends obliquely relative to the inner edge of the slit 35s3. The basal portion of the slit edge 35s2 is perpendicular to the inner edge of the slit 35s3, and the apical portion of the slit edge 35s2 is inclined to the same side as the inner edge of the slit 35s1 relative to the inner edge of the slit 35s3.

[0068] The contact portion 42 is guided by the guided protrusion 42q moving along the guide slit 35s, moving in a manner that moves closer to and further away from the base 32. The contact portion 42 is movably supported between an initial position P1 and a pushed-in position P2 by the guided protrusion 42q of each of its pair of side edges moving along a pair of guide slits 35s. Here, the initial position P1 is the position of the contact portion 42 before the terminal module 20 and the opposite terminal 10 are connected (see reference). Figure 1 , Figure 2 , Figure 4 and Figure 5 The push-in position P2 is closer to the base 32 than the initial position P1.

[0069] As the guided protrusion 42q approaches the base 32, the guided protrusion 42q is pressed against the slit edge 35s1. As a result, the guided protrusion 42q is displaced in the front-rear direction in the width direction that serves as the sidewall 34, in accordance with the inclination of the slit edge 35s1.

[0070] Furthermore, anti-detachment protrusions 42p are formed on each of the pair of side edges of the contact portion 42. The anti-detachment protrusions 42p and the guided protrusions 42q protrude at separated positions along the direction of the side edges of the contact portion 42. That is, because the guided protrusions 42q move along the guide slit 35s, the anti-detachment protrusions 42p protrude at intervals corresponding to the portions forming the guide slit 35s in the sidewall 34. In this embodiment, the anti-detachment protrusions 42p are located on the side opposite to the extended connecting piece 46 relative to the guided protrusions 42q.

[0071] In addition, an anti-detachment protrusion 46p is also provided on one side edge of the extension connecting piece 46.

[0072] On each of the pair of sidewalls 34, limiting plates 34p1 and 34p2 are provided at positions extending away from the extension line of the guide slit 35s. Limiting plates 34p1 and 34p2 extend from the top of the sidewall 34 to opposite sides. Limiting plate 34p1 extends to the side opposite to the side of the contact portion 42 connected to the extension connecting piece 46, while limiting plate 34p2 extends towards the extension connecting piece 46. In a side view, a recess is formed in the portion of the sidewall 34 closer to the base 32 than limiting plate 34p1, allowing for the placement of an anti-detachment protrusion 42p; and a recess is formed in the portion of the sidewall 34 closer to the base 32 than limiting plate 34p2, allowing for the placement of an anti-detachment protrusion 46p.

[0073] With the guided protrusion 42q positioned within the guide slit 35s, the anti-detachment protrusion 42p is positioned in the recess on the side closer to the base 32 than the limiting piece 34p1, and the anti-detachment protrusion 46p is positioned in the recess on the side closer to the base 32 than the limiting piece 34p2.

[0074] When the guided protrusion 42q moves away from the base 32 toward the opening side of the guide slit 35s, the limiting plates 34p1 and 34p2 contact the anti-detachment protrusions 42p and 46p from the side opposite to the base 32. Thus, the guided protrusion 42q is restrained and will not dislodge from the opening side of the guide slit 35s. The position where the limiting plates 34p1 and 34p2 contact the anti-detachment protrusions 42p and 46p is the initial position P1 of the contact portion 42.

[0075] When the guided protrusion 42q moves inward toward the guide slit 35s, the guided protrusion 42q contacts the inner edge 35s3 of the guide slit 35s, and the anti-detachment protrusion 42p contacts the limiting edge 34p3 on the base 32 side relative to the limiting piece 34p1. Thus, the limiting contact portion 42 is positioned close to the base 32. This position is the push-in position P2 of the contact portion 42.

[0076] The extension connecting piece 46 is formed by bending at a right angle relative to the rear edge of the contact portion 42. The rear surface of the extension connecting piece 46 (the side opposite to the shape memory coil spring 50) is the connecting surface 46f for connecting the braided wire 48.

[0077] The braided wire 48 is made of bare metal wire such as copper that has conductivity. One end of the braided wire 48 is welded to the connecting surface 46f of the extension connecting piece 46 by resistance welding or the like. The other end of the braided wire 48 is connected to the external connecting part 49 by resistance welding or the like.

[0078] The external connecting component 49 is formed by stamping a metal sheet such as copper alloy into a flat plate shape. The external connecting component 49 is disposed outside the spring receiving portion 30 and extends along the extension line of the extension connecting piece 46 in the same direction as the extension direction of the extension connecting piece 46. A braided wire 48 is connected to one end of the external connecting component 49, and external wiring is connected to the other end.

[0079] The extension connector 46 and the external connector 49 are configured separately. The middle portion of the braided wire 48 is positioned between the extension connector 46 and the external connector 49 with excess length. When the electrical contact member 40 and the external connector 49 move relative to each other, the middle portion of the braided wire 48 deforms accordingly. Thus, the electrical contact member 40 can be displaced when the external connector 49 is positioned in a predetermined position.

[0080] Furthermore, the connection between the braided wire 48 and the extension connecting piece 46, or the connection structure between the braided wire 48 and the external connecting member 49, is not limited to the examples described above. This connection can also be formed, for example, by crimping, soldering, or screwing. Additionally, the extending direction of the external connecting member 49 is not limited to the examples described above. The external connecting member can extend obliquely relative to the extension connecting piece.

[0081] A shape memory helical spring 50 is located between the base 32 and the contact portion 42. The spring length of the shape memory helical spring 50 is set to be greater than the interval between the base 32 and the contact portion 42 in the initial position P1. Therefore, the shape memory helical spring 50 always applies a force to the base 32 and the contact portion 42 in the separation direction.

[0082] In this embodiment, only one shape memory helical spring 50 is provided between the base 32 and the contact portion 42. That is, the terminal module 20, as a component that applies force to the base 32 and the contact portion 42 in the separation direction, only has one shape memory helical spring 50.

[0083] The shape memory helical spring 50 is made of a shape memory alloy, which performs shape memory in such a way that the force applied to the contact portion 42 from the pushed-in position toward the initial position is increased by the increase in temperature.

[0084] The temperature before the force is increased is, for example, the temperature at which the terminal module 20 and the opposite terminal 10 are connected, such as room temperature. Room temperature is, for example, 25 degrees Celsius ± 15 degrees Celsius. Hereafter, temperatures are expressed in Celsius.

[0085] The temperature at which the applied force increases is higher than the temperature at which the terminal module 20 and the counterpart terminal 10 are connected. For example, the temperature at which the applied force increases can be a temperature higher than room temperature. For example, the temperature at which the applied force increases can be the ambient temperature of the terminal module 20 plus the temperature affected by heating such as Joule heating. For example, the temperature at which the applied force increases can be a temperature of 50 degrees Celsius or higher.

[0086] In other words, the shape memory helical spring 50 can perform shape memory in the following way: by increasing the contact pressure by raising the temperature from a temperature range of 25 degrees ± 15 degrees Celsius to above 50 degrees Celsius.

[0087] Shape memory can be achieved by changing the shape or the numerical value of a material property through an increase in temperature, thereby increasing the force. For example, a shape memory helical spring 50 can achieve shape memory by increasing the elastic coefficient, an example of a material property value, as the temperature rises, thereby increasing the spring load.

[0088] Shape memory alloys can be, for example, Ni-Ti alloys or Ni-Ti-Cu alloys. In the case of Ni-Ti alloys or Ni-Ti-Cu alloys, shape memory can be achieved by varying the temperature from a range of 25 degrees ± 15 degrees to over 50 degrees, causing a change in shape and increasing the elastic modulus. Therefore, as the temperature rises, the force exerted by the shape memory helical spring 50 on the contact portion 42 at the initial position P1 increases.

[0089] Furthermore, shape memory alloys can also be alloys other than Ni-Ti alloys or Ni-Ti-Cu alloys.

[0090] The portion of the shape memory helical spring 50 that contacts the contact portion 42 can also be formed as a contact plane 50f. This contact plane 50f is a surface capable of making surface contact with the back side of the contact portion 42. The contact plane 50f can be formed by machining, etc. If the helical spring is a component machined from round bar wire, it can be considered that the helical spring has an arc-shaped line contact with the contact portion. If the end of the shape memory helical spring 50 on the contact portion 42 side is machined into a contact plane 50f, the contact area with respect to the contact portion 42 can be increased compared to the unmachined case. As a result, heat can be easily transferred from the electrical contact component 40 to the shape memory helical spring 50.

[0091] like Figure 5 As shown, the terminal module 20 of this embodiment is housed inside the connector housing 80 provided in the frame 70 of the electrical equipment.

[0092] The connector housing 80 is formed of an insulating material such as resin. The connector housing 80 has a housing portion 82 for housing the assembly of the spring receiving portion 30 and the electrical contact portion 40, and a lead-out housing portion 84 for housing the braided wire 48 and the external connecting portion 49 extending from the assembly.

[0093] Within the receiving portion 82, the spring receiving portion 30 is supported in a predetermined position. The receiving portion 82 has an opening 82a on the side opposite to the lead-out receiving portion 84. The electrical contact member 40, movably supported by the spring receiving portion 30, protrudes outward through this opening 82a. When located within the receiving portion 82, the electrical contact member 40 is movable between an initial position P1 and a pushed-in position P2 inside the opening 82a.

[0094] Within the lead-out storage section 84, a space is formed that allows the braided thread 48 to deform to a certain extent. An external connecting member 49 is led out from the top end of the lead-out storage section 84. The external connecting member 49 is supported at a predetermined position at the top end of the lead-out storage section 84.

[0095] With the terminal module 20 installed inside the connector housing 80, the contact portion 42 faces the outside of the frame 70 through the opening 82a.

[0096] The counterpart terminal 10 is supported by the counterpart connector housing 92. The counterpart terminal 10 is formed of a conductive metal and is L-shaped by bending the end of a plate-like member extending in the vertical direction. The portion of the counterpart terminal 10 opposite to the electrical contact member 40 is formed as a plate-like contact portion 12 capable of contacting in an attitude parallel to the contact portion 42. This contact portion 12 has a partially protruding contact portion, here an elongated protruding contact portion 12a.

[0097] The counterpart terminal 10 is held in the counterpart connector housing 92 by an inset molding. The counterpart connector housing 92 has a mating protrusion 93 that can enter the opening 82a. The contact portion 12 of the counterpart terminal 10 protrudes towards the top of the mating protrusion 93. As it enters the opening 82a through the mating protrusion 93, the contact portion 12 is pressed against the contact portion 42.

[0098] With the other side terminal 10 connected to the terminal module 20, the other side connector housing 92 is fixed to the frame 70 by screws such as screws S.

[0099] When the opposite terminal 10 is brought close to the terminal module 20, the contact portion 12, together with the engaging protrusion 93, enters the opening 82a, and the contact portion 12 is pressed against the contact portion 42. As a result, the electrical contact member 40 is displaced from the initial position P1 to the pushed-in position P2.

[0100] As the electrical contact member 40 moves from the initial position P1 to the pushed-in position P2, it also moves in the front-back direction corresponding to the inclined portion of the guide slit 35s. At this time, since the contact portion 12a slides against the contact portion 42, foreign matter can be removed from the apex of the contact portion 12a. Furthermore, the apex of the contact portion 12a is shaved off, thereby forming a smooth surface where a sulfide film or oxide film has been removed. Therefore, the smooth surface of the apex of the contact portion 12a is pressed against the contact portion 42 in a state where foreign matter has been removed.

[0101] Subsequently, while keeping the shape memory helical spring 50 in a compressed and deformed state, the opposite connector housing 92 is fixed to the frame 70 of the device with screws.

[0102] During the connection operation described above, the force from the shape memory coil spring 50 acts on the electrical contact component 40. Therefore, the opposite terminal 10 is pressed in while resisting this force. Furthermore, the screw fixing operation is performed while maintaining the pressed-in state under the applied force of resistance.

[0103] Through the above, such as Figure 6 As shown, the terminal module 20 and the counterpart terminal 10 are connected. In this state, the contact portion 42 can be located in the pushed-in position P2 or in a position closer to the initial position P1 than the pushed-in position P2.

[0104] According to this embodiment, during the connection operation, the force from the shape memory helical spring 50 is less than the force after the temperature rises. Therefore, the force required to connect the terminal module 20 and the opposite terminal 10 can be reduced, making the connection operation easier to perform.

[0105] Furthermore, when the connection between the terminal module 20 and the opposite terminal 10 has been completed, at room temperature, the contact portion 42 is subjected to force on the opposite terminal 10 by the force from the shape memory helical spring 50.

[0106] When the terminal module 20 and the opposite terminal 10 are used as relay connection points in an electrical circuit, such as Figure 6 As shown, the power supply 100 can be considered as being electrically connected to one side of the electrical contact 40 and the opposite terminal 10, and the load 102 is electrically connected to the other side. Therefore, current flows through the electrical contact 40 and the opposite terminal 10.

[0107] When current flows through the electrical contact 40 and the opposite terminal 10, the temperature of the electrical contact 40 and the opposite terminal 10 rises due to Joule heating. It can also be considered that the temperature at the contact point between the electrical contact 40 and the opposite terminal 10 easily rises due to Joule heating. The heat from the electrical contact 40 and the opposite terminal 10 is transferred to the shape memory spring 50, causing the shape memory spring 50 to also heat up. As a result, the shape memory spring 50 deforms into the remembered shape, or the material properties of the shape memory spring 50, such as the elastic modulus, change, increasing the spring load from the shape memory spring 50. Consequently, the force from the shape memory spring 50 becomes greater than the force at room temperature. Therefore, the contact pressure between the contact 42 and the opposite terminal 10 also increases. Thus, even under vibration conditions, the electrical contact 40 and the opposite terminal 10 can maintain a stable contact state. Furthermore, the resistance between the electrical contact 40 and the opposite terminal 10 decreases, suppressing excessive heating at the contact point.

[0108] For example, when this terminal module 20 is applied to a power supply circuit or a circuit where a high voltage is applied, heat generation due to Joule heating can be expected. High voltage is, for example, 60V or higher, more preferably 90V or higher.

[0109] Of course, this terminal module 20 can also be used in signal circuits or circuits where low voltage is applied.

[0110] The temperature rise of the shape memory helical spring 50 can also be caused by heat other than Joule heating in the electrical contact component 40 and the opposite terminal 10. For example, the temperature rise of the shape memory helical spring 50 can also be caused by heat from control equipment, drive circuit, internal combustion engine or battery around the shape memory helical spring 50.

[0111] According to the terminal module 20 with the above structure, since a shape memory helical spring 50 is provided between the base 32 and the contact portion 42, and the shape memory helical spring 50 is made of a shape memory alloy, the shape memory alloy performs shape memory in such a way that the force applied to the contact portion 42 from the push-in position P2 toward the initial position P1 increases as the temperature rises. Therefore, in the state before the temperature rises, by performing the connection operation between the terminal module 20 and the counterpart terminal 10 while elastically deforming the shape memory helical spring 50, the force required for the connection operation can be reduced. In addition, during connection, the force applied between the contact portion 42 and the counterpart terminal 10 can be reduced, thereby suppressing plating wear on the contact portion 42 or the counterpart terminal 10. Furthermore, by reducing the force from the shape memory helical spring 50 beforehand at room temperature, the load applied to surrounding parts can be reduced. Furthermore, since the force applied to the contact portion 42 from the push-in position P2 toward the initial position P1 increases as the temperature rises after connection, the contact pressure between the contact portion 42 and the counterpart terminal 10 increases, thereby achieving higher connection reliability.

[0112] Furthermore, since the portion of the shape memory coil spring 50 that contacts the contact portion 42 has a contact plane 50f that contacts the surface of the contact portion 42, heat is easily transferred to the shape memory coil spring 50 when the temperature of the electrical contact component 40 rises due to Joule heating. As a result, the temperature of the shape memory coil spring 50 easily rises, and the contact pressure is easily increased.

[0113] Furthermore, guide slits 35s are formed on each of the pair of sidewalls 34, and the guided protrusions 42q of the contact portion 42 move along the guide slits 35s, with the contact portion 42 being movably supported between the initial position P1 and the push-in position P2.

[0114] The aforementioned guide slit 35s is easier to form than an opening that is closed in the middle of the sidewall. Therefore, the spring receiving part 30 is easier to process.

[0115] Furthermore, by using the limiting piece 34p1 located away from the extension line of the guide slit 35s, the anti-detachment protrusion 42p of the contact portion 42 can be restricted, preventing it from moving away from the base 32. This prevents the contact portion 42 from detaching from its initial position P1 to the side opposite to the base 32. Additionally, by employing the structure with the limiting piece 34p1, the direction and range of movement of the contact portion 42 can be restricted through the guide slit 35s, which is not a completely closed opening.

[0116] Furthermore, since only one shape memory helical spring 50 is provided between the base 32 and the contact portion 42, the terminal module 20 can have a simple structure compared to the case where multiple force-applying components are required to apply force to the electrical contact components.

[0117] Furthermore, by configuring the shape memory helical spring 50 to perform shape memory in such a way that the force is increased by raising the temperature from a range of 25°C ± 15°C to 50°C or higher, the connection operation between the terminal module 20 and the counterpart terminal 10 can be easily performed within a temperature range of 25°C ± 15°C. Additionally, when the shape memory helical spring 50 reaches 50°C due to Joule heating, the contact pressure between the terminal module 20 and the counterpart terminal 10 increases, thus achieving higher connection reliability.

[0118] In addition, by forming a shape memory helical spring 50 from Ni-Ti alloy or Ni-Ti-Cu alloy, it can recover its original shape through shape memory when the temperature rises, and the elastic coefficient can be increased to improve the contact pressure between the contact portion 42 and the opposite terminal 10.

[0119] Figure 7 This is a cross-sectional view of the terminal module 20B involved in a variation of Embodiment 1.

[0120] As shown in the figure, the base 32B corresponding to the base 32 or the contact 42B corresponding to the contact 42 can be formed with a positioning protrusion 32Bp or a positioning recess 42Bg for positioning the shape memory helical spring 50.

[0121] In this modified example, a positioning protrusion 32Bp is formed in the base 32B, which is embedded in the end of the shape memory coil spring 50. The positioning protrusion 32Bp is a circular protrusion protruding toward the contact portion 42B, and its outer diameter is smaller than the inner diameter of the shape memory coil spring 50. Therefore, by embedding the positioning protrusion 32Bp into the end of the shape memory coil spring 50, the shape memory coil spring 50 can be positioned so that its end does not deviate from the base 32.

[0122] The positioning protrusion can also be configured on the outer periphery of the end of the shape memory helical spring 50 to position the end of the shape memory helical spring 50.

[0123] Furthermore, a positioning recess 42Bg is formed in the contact portion 42B for the end of the shape memory coil spring 50 to be inserted. The positioning recess 42Bg is an annular recess formed in the contact portion 42 on the surface facing the base portion 32. The positioning recess 42Bg is formed in an annular shape that is equivalent to the center diameter of the shape memory coil spring 50. By inserting the end of the shape memory coil spring 50 into the positioning recess 42Bg, the shape memory coil spring 50 can be positioned so that its end does not deviate from the contact portion 42B.

[0124] According to this modified example, the shape memory helical spring 50 can be positioned by the positioning protrusion 32Bp or the positioning recess 42Bg.

[0125] [Implementation Method 2]

[0126] The terminal module 120 involved in Embodiment 2 is described. Figure 8 This is a cross-sectional view showing the terminal module 120. Figure 9 This is a top view showing the terminal module 120. Figure 9 The electrical contact component 40 is indicated by a dashed line. Furthermore, in the description of this embodiment, elements with the same structure as those described in Embodiment 1 are marked with the same symbols and their descriptions are omitted.

[0127] The terminal module 120 also includes an additional helical spring 156 located between the base 32 and the contact portion 42.

[0128] In other words, a shape memory helical spring 150 and an additional helical spring 156 are provided between the base 32 and the contact portion.

[0129] The shape memory helical spring 150 and the additional helical spring 156 can be configured in any way. The shape memory helical spring 150 and the additional helical spring 156 can be configured concentrically or arranged side-by-side in different positions. In this embodiment, an example of the shape memory helical spring 150 and the additional helical spring 156 being configured concentrically will be described.

[0130] The number of shape memory coil springs 150 and additional coil springs 156 is arbitrary. In this embodiment, an example is described where one shape memory coil spring 150 and one additional coil spring 156 are configured concentrically.

[0131] One of the shape memory coil spring 150 and the additional coil spring 156 can be disposed on the outer peripheral side. In this embodiment, an example of disposing of the shape memory coil spring 150 on the outer peripheral side of the additional coil spring 156 is described. If the shape memory coil spring 150 is disposed on the outer peripheral side of the additional coil spring 156, the outer diameter of the shape memory coil spring 150 can be larger than the outer diameter of the additional coil spring 156. Therefore, it is easy to set the wire diameter of the spring material of the shape memory coil spring 150 to be larger than that of the spring material of the additional coil spring 156. By increasing the wire diameter of the spring material of the shape memory coil spring 150, it is easy to set a larger force from the shape memory coil spring 150. Alternatively, the shape memory coil spring can also be disposed on the inner peripheral side of the additional coil spring.

[0132] According to the terminal module 120 involved in this embodiment 2, apart from the fact that there is only one shape memory helical spring 50, it can play the same role and effect as the terminal module 20 in embodiment 1.

[0133] Furthermore, the combination of the shape memory coil spring 150 and the additional coil spring 156 can generate a force on the contact portion 42. This allows for easy adjustment of the force at room temperature and the force at high temperatures.

[0134] Furthermore, by arranging the shape memory coil spring 150 and the additional coil spring 156 concentrically, the shape memory coil spring 150 and the additional coil spring 156 can be arranged in a compact space.

[0135] Furthermore, by positioning the shape memory helical spring 150 on the outer periphery, it is easy to set a larger wire diameter for the spring material of the shape memory helical spring 150. By thickening the spring material of the shape memory helical spring 150, a larger force can be generated at high temperatures, thereby achieving higher connection reliability.

[0136] [Variation Example]

[0137] like Figure 10In the modified example shown, the terminal module 220, including the shape memory coil spring 50, can also generate a force that increases the contact area of ​​the contact portion 42 relative to the opposite terminal 10 due to temperature rise. In this case, before the temperature rises, for example at room temperature, the force of the shape memory coil spring 50 is small, resulting in a smaller force pushing the contact portion 42 against the opposite terminal 10. Therefore, it is conceivable that the contact surface of the contact portion 42 is inclined relative to the opposite terminal 10, and the contact portion 42 and the opposite terminal 10 are in point or line contact. In this state, the contact resistance between the contact portion 42 and the opposite terminal 10 is relatively large. When energized in this state, the contact area between the contact portion 42 and the opposite terminal 10 easily heats up. This heating causes the shape memory coil spring 50 to generate a larger force. Thus, the contact portion 42 is pressed against the opposite terminal 10 with a larger force. Therefore, the contact portion 42 is displaced along the contact surface of the counterpart terminal 10, making surface contact with the contact surface of the counterpart terminal 10, or increasing the contact area by pressing the top of the contact of the counterpart terminal 10 with greater force, or being pressed against multiple contacts of the counterpart terminal 10 simultaneously. The contact portion 42 can change its posture as a whole as the electrical contact component 40, or its posture can be changed by changing the bending angle relative to the extension connecting piece 46. As a result, a high connection reliability can be obtained between the contact portion 42 and the counterpart terminal 10.

[0138] In other words, the shape memory coil spring can heat up relatively early after power is applied. Furthermore, after the temperature rises, the contact area can be expected to increase by the displacement of the contact portion 42 along the contact surface of the opposite terminal 10, thereby further improving the connection reliability.

[0139] Furthermore, the structures described in the above embodiments and variations can be appropriately combined without contradicting each other.

[0140] Explanation of reference numerals in the attached figures

[0141] 10. Counterside terminals

[0142] 12 Contact Department

[0143] 12a Contact section

[0144] 20, 20B, 120, 220 terminal modules

[0145] 30 Spring receiving part

[0146] 32, 32B base

[0147] 32Bp positioning protrusion

[0148] 34 Sidewalls

[0149] 34p1, 34p2 restricted films

[0150] 34p3 limiting edge

[0151] 35a Bend

[0152] 35b Rib

[0153] 35s guide slit

[0154] 35s1, 35s2 slit edges

[0155] 35s3 Slit inner edge

[0156] 38 Spring stop plate

[0157] 40 Electrical contact components

[0158] 42, 42B Contact Section

[0159] 42Bg positioning recess

[0160] 42p, 46p anti-slip protrusions

[0161] 42q Guided protrusion

[0162] 46 Extension Connector

[0163] 46f connection surface

[0164] 48 braided yarn

[0165] 49 External connecting components

[0166] 50 and 150 shape memory coil springs

[0167] 50f contact plane

[0168] 70 Frame

[0169] 80 Connector Housing

[0170] 82 Storage Department

[0171] 82a Opening

[0172] 84. Lead-out storage section

[0173] 92. Connector housing on the opposite side

[0174] 93 Fitting protrusion

[0175] 100 power supply

[0176] 102 load

[0177] 156 Additional coil spring

[0178] P1 Initial position

[0179] P2 Push-in position

[0180] S-shaped screw.

Claims

1. A terminal module, connected to a terminal on the other side, comprising: The spring receiving part has a base; An electrical contact component having a contact portion spaced apart from the base and movably supported by the spring receiving portion; and A shape memory helical spring, located between the base and the contact portion. The contact portion can move between an initial position and a push-in position closer to the base than the initial position. The shape memory helical spring is made of a shape memory alloy, which performs shape memory in such a way that the force applied to the contact portion from the pushed-in position toward the initial position is increased by a rise in temperature.

2. The terminal module according to claim 1, wherein, The portion of the shape memory helical spring that contacts the contact part has a contact plane that contacts the surface of the contact part.

3. The terminal module according to claim 1 or claim 2, wherein, The spring receiving portion has a pair of sidewalls that protrude toward the contact portion from the two opposite edges of the base. Guide slits are formed on each of the pair of sidewalls, extending from the top of the sidewall toward the base side. A pair of side edges of the contact portion are respectively provided with guided protrusions that can move along the guide slit. The contact portion is supported so that it can move between the initial position and the pushed-in position by the respective guided protrusions of the respective side edges of the contact portion along the respective guide slits of the respective sidewalls.

4. The terminal module according to claim 3, wherein, Anti-detachment protrusions are formed on a pair of side edges of the contact portion, protruding at positions away from the guided protrusion. A limiting tab is provided on each of the pair of sidewalls. The limiting tab is located away from the guide slit on the extension line of the guide slit. The limiting tab can contact the anti-detachment protrusion from the side opposite to the base.

5. The terminal module according to claim 1 or claim 2, wherein, The base or the contact portion has a positioning protrusion or a positioning recess for positioning the shape memory helical spring.

6. The terminal module according to claim 1 or claim 2, wherein, Only one shape memory helical spring is provided between the base and the contact portion.

7. The terminal module according to claim 1 or claim 2, wherein, It further includes an additional helical spring located between the base and the contact portion.

8. The terminal module according to claim 7, wherein, The shape memory helical spring and the additional helical spring are configured concentrically.

9. The terminal module according to claim 8, wherein, The shape memory helical spring is disposed on the outer periphery of the additional helical spring.

10. The terminal module according to claim 1 or claim 2, wherein, The shape memory helical spring performs shape memory in the following manner: by increasing the applied force by raising the temperature from a temperature range of 25 degrees ± 15 degrees Celsius to above 50 degrees Celsius.

11. The terminal module according to claim 1 or claim 2, wherein, The shape memory helical spring is made of Ni-Ti alloy or Ni-Ti-Cu alloy.

12. The terminal module according to claim 1 or claim 2, wherein, The shape memory helical spring generates a force that increases the contact area of ​​the contact portion relative to the opposite terminal when the temperature rises.

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